Heat dissipation method and device

Abstract

The present application provides a heat dissipation method, comprising: determining a heat dissipation strategy for the electronic device based on device information of the electronic device; wherein the device information at least includes information for detecting whether the electronic device has a guarantee device that matches the heat dissipation system; the present application also provides a heat dissipation device. The heat dissipation method and device provided in the present application can reduce the cost of hardware development and simplify system configuration.

Description

Technical Field

[0001] The present application relates to the field of computer technology, and in particular to a heat dissipation method and device. Background Art

[0002] In related technologies, the system cooling environments of electronic devices are becoming increasingly diverse. Conventional air cooling is no longer sufficient to meet the requirements of high-density, high-power systems. Consequently, water-cooled plates and immersion cooling (immersion liquid cooling) have emerged and are increasingly being used in electronic device cooling systems. However, different cooling systems require completely different cooling control strategies for the baseboard management controller (BMC). If the same product is required to be used in different cooling systems, developing dedicated BMC hardware to support each cooling system would increase hardware development costs and complicate system configuration. Summary of the Invention

[0003] The present application provides a heat dissipation method and device to at least solve the above technical problems existing in the prior art.

[0004] On one hand, the present application provides a heat dissipation method, comprising:

[0005] Determining a heat dissipation strategy for the electronic device based on device information of the electronic device;

[0006] The device information at least includes information on a device for detecting whether the electronic device has a support device capable of matching the heat dissipation system.

[0007] In the above solution, determining a heat dissipation strategy for the electronic device based on the device information of the electronic device includes:

[0008] Detecting power supply information of a system corresponding to the electronic device;

[0009] In response to the power supply device information being power supply device information corresponding to an immersion system, it is determined that the heat dissipation strategy of the electronic device is a heat dissipation strategy corresponding to an immersion heat dissipation system.

[0010] In the above solution, determining a heat dissipation strategy for the electronic device based on the device information of the electronic device includes:

[0011] detecting whether the electronic device includes a liquid leakage detection line;

[0012] In response to the electronic device including the liquid leakage detection line, it is determined that the heat dissipation strategy of the electronic device is a heat dissipation strategy corresponding to a water cooling plate system.

[0013] In the above solution, determining a heat dissipation strategy for the electronic device based on the device information of the electronic device includes:

[0014] In response to the power supply device information of the system corresponding to the electronic device not being the power supply device information corresponding to the immersion system, and the electronic device not including a liquid leakage detection line, detecting whether the electronic device includes a fan;

[0015] In response to the electronic device including a fan, it is determined that the heat dissipation strategy of the electronic device is a heat dissipation strategy corresponding to an air cooling system.

[0016] In the above solution, determining a heat dissipation strategy for the electronic device based on the device information of the electronic device includes:

[0017] In response to the power supply device information not including the power supply device information corresponding to the immersion system, determining whether information of the liquid leakage detection sensor can be read;

[0018] In response to being able to read the information of the liquid leakage detection sensor, it is determined that the heat dissipation strategy of the electronic device is a heat dissipation strategy corresponding to a water cooling plate system.

[0019] In the above solution, determining a heat dissipation strategy for the electronic device based on the device information of the electronic device includes:

[0020] In response to the inability to read the information of the liquid leakage detection sensor, it is determined that the heat dissipation strategy of the electronic device is a heat dissipation strategy corresponding to an air cooling system.

[0021] In the above solution, determining a heat dissipation strategy for the electronic device based on the device information of the electronic device includes:

[0022] detecting whether the electronic device includes a fan;

[0023] In response to the electronic device not including a fan, it is determined that the heat dissipation strategy of the electronic device is a heat dissipation strategy corresponding to an immersion system.

[0024] In the above solution, determining a heat dissipation strategy for the electronic device based on the device information of the electronic device includes:

[0025] In response to the electronic device including a fan, determining whether the electronic device includes a liquid leakage detection line and / or a liquid leakage detection sensor;

[0026] In response to the electronic device including the liquid leakage detection line and / or the liquid leakage detection sensor, it is determined that the heat dissipation strategy of the electronic device is a heat dissipation strategy corresponding to a water cooling plate system.

[0027] In the above solution, determining a heat dissipation strategy for the electronic device based on the device information of the electronic device includes:

[0028] In response to the electronic device not including the liquid leakage detection line and / or the liquid leakage detection sensor, it is determined that the heat dissipation strategy of the electronic device is a heat dissipation strategy corresponding to an air cooling system.

[0029] Another aspect of the present application provides a heat dissipation device, comprising:

[0030] a determining unit, configured to determine a heat dissipation strategy for the electronic device based on device information of the electronic device;

[0031] The device information at least includes information on a device for detecting whether the electronic device has a support device capable of matching the heat dissipation system.

[0032] The heat dissipation method provided herein determines a heat dissipation strategy for an electronic device based on its device information. The device information includes at least information about whether the electronic device has a compatible device compatible with the heat dissipation system. A BMC can be used to monitor the heat dissipation environment and determine the appropriate heat dissipation strategy, reducing hardware development costs and simplifying system configuration. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 A first optional flow chart of the heat dissipation method provided in an embodiment of the present application is shown;

[0034] Figure 2 A second optional flow chart of the heat dissipation method provided by an embodiment of the present disclosure is shown;

[0035] Figure 3 A third optional flow chart of the heat dissipation method provided in an embodiment of the present application is shown;

[0036] Figure 4 A fourth optional flow chart of the heat dissipation method provided in an embodiment of the present application is shown;

[0037] Figure 5 A fifth optional flow chart of the heat dissipation method provided in an embodiment of the present application is shown;

[0038] Figure 6 An optional structural diagram of a heat dissipation device provided in an embodiment of the present application is shown;

[0039] Figure 7 This is a schematic diagram of the hardware composition structure of the heat dissipation device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0040] In order to make the purpose, features, and advantages of this application more obvious and easy to understand, the technical solutions in the embodiments of this application will be clearly and completely described below in conjunction with the drawings in the embodiments of this application. Obviously, the described embodiments are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without making creative efforts shall fall within the scope of protection of this application.

[0041] The cooling environments of current electronic devices (such as personal terminals and servers) are becoming increasingly diverse. Conventional air cooling is no longer sufficient to meet the requirements of high-density, high-power systems. Consequently, liquid-cooled plates, immersion cooling, and other cooling technologies are increasingly being used in electronic device cooling systems. However, different cooling systems require completely different cooling control strategies from the Baseboard Management (BMC). Developing separate BMC hardware to support each cooling system for the same product increases hardware development costs, complicates system configuration, and increases ongoing maintenance costs.

[0042] Therefore, in response to the defects in the heat dissipation methods of electronic devices in the relevant technology, the present application provides a heat dissipation method that identifies the hardware designs unique to different heat dissipation systems, uses the same set of BMC hardware to detect the heat dissipation environment, and automatically matches the corresponding heat dissipation strategy to overcome some or all of the shortcomings of the existing technology.

[0043] Figure 1 A first optional flow chart of the heat dissipation method provided in an embodiment of the present application is shown, and will be explained according to each step.

[0044] Step S101: determining a heat dissipation strategy for the electronic device based on device information of the electronic device.

[0045] In some embodiments, a heat dissipation device (hereinafter referred to as the device) determines a heat dissipation strategy for the electronic device based on device information of the electronic device. The device information includes at least information for detecting whether the electronic device has a device that supports operation with the heat dissipation system; for example, at least one of power supply device information, information on whether a leak detection line is included, information on whether a leak detection sensor is included, and information on whether a fan is included.

[0046] In specific implementation, the device can determine the heat dissipation strategy of the electronic device based on at least one of the power device information of the electronic device, information on whether a leakage detection line is included, information on whether a leakage detection sensor is included, and information on whether a fan is included.

[0047] Alternatively, during specific implementation, the apparatus may further determine a heat dissipation system of the electronic device based on the device information of the electronic device; and determine a heat dissipation strategy for the electronic device based on the heat dissipation system of the electronic device.

[0048] In some optional embodiments, the heat dissipation strategy for the electronic device may include: a heat dissipation strategy corresponding to an immersion system, a heat dissipation strategy corresponding to a water-cooled plate system, and a heat dissipation strategy corresponding to an air-cooled system.

[0049] In some optional embodiments, after determining the heat dissipation strategy, the apparatus may further operate a heat dissipation element corresponding to the heat dissipation strategy to dissipate heat for the electronic device.

[0050] In some embodiments, the above step S101 can be implemented based on a set of BMC hardware; that is, the hardware detects the device information of the electronic device based on step S101 and automatically matches the corresponding cooling strategy, without the need to develop corresponding BMC hardware for different cooling systems.

[0051] In this way, through the heat dissipation method provided in the embodiment of the present application, a heat dissipation strategy for the electronic device is determined based on the device information of the electronic device; it is applicable to electronic devices of all heat dissipation systems, and there is no need to design different solutions for electronic devices of different heat dissipation systems to determine the corresponding heat dissipation strategy; further, in hardware implementation, it is only based on a set of BMCs to detect the device information of the electronic device and automatically match the corresponding heat dissipation strategy, which can reduce hardware development costs, reduce system configuration, and thus reduce system costs. In addition, determining the corresponding heat dissipation strategy based on the device information of the electronic device can avoid the risks brought by human intervention and reduce maintenance costs.

[0052] Figure 2 A second optional flow chart of the heat dissipation method provided in an embodiment of the present disclosure is shown, and will be explained according to each step.

[0053] Step S201: determining a heat dissipation system of the electronic device based on device information of the electronic device.

[0054] In some embodiments, the heat dissipation device determines the heat dissipation system of the electronic device based on device information of the electronic device. The device information includes at least information for detecting whether the electronic device has a supporting device compatible with the heat dissipation system; for example, at least one of power supply device information, information on whether a leakage detection line is included, information on whether a leakage detection sensor is included, and information on whether a fan is included.

[0055] In some embodiments, the apparatus determines the cooling system of the electronic device based on at least one of the power supply device information, information about whether a liquid leakage detection line is included, information about whether a liquid leakage detection sensor is included, and information about whether a fan is included. The cooling system of the electronic device includes an air cooling system, a water cooling plate system, or an immersion system.

[0056] Step S202: determining a heat dissipation strategy for the electronic device based on the heat dissipation system of the electronic device.

[0057] In some embodiments, the apparatus determines a heat dissipation strategy for the electronic device based on a heat dissipation system of the electronic device.

[0058] During specific implementation, the device responds to the cooling system of the electronic device being the immersion cooling system, and determines that the cooling strategy of the electronic device is the cooling strategy corresponding to the immersion cooling system; or, responds to the cooling system of the electronic device being the water cooling plate system, and determines that the cooling strategy of the electronic device is the cooling strategy corresponding to the water cooling plate system; or, responds to the cooling system of the electronic device being the air cooling system, and determines that the cooling strategy of the electronic device is the cooling strategy corresponding to the air cooling system.

[0059] Step S203 : running the heat dissipation element corresponding to the heat dissipation strategy to dissipate heat for the electronic device.

[0060] In some embodiments, in response to the electronic device's heat dissipation strategy being a heat dissipation strategy corresponding to an immersion system, the device can adjust the temperature and flow rate of the coolant by adjusting the size of the liquid outlet, the size of the liquid inlet, and the operating frequency of the water pump; and / or, operate a heat dissipation element that adjusts the fan speed to adjust the coolant temperature through the fan to achieve heat dissipation for the electronic device. Alternatively, the device can achieve heat dissipation for the electronic device based on the heat dissipation strategy of an immersion system in the related art.

[0061] In other embodiments, the device, in response to the electronic device's heat dissipation strategy being a heat dissipation strategy corresponding to a water-cooled plate system, can operate the water-cooled plate, circulating liquid pump pipeline, and heat exchanger to adjust the temperature and flow rate of the coolant; and / or operate a heat dissipation element that adjusts the fan speed so that the fan speed is greater than a first threshold or less than a second threshold to achieve heat dissipation for the electronic device. Alternatively, the device can achieve heat dissipation for the electronic device based on the heat dissipation strategy of a water-cooled plate system in the related art.

[0062] In some further embodiments, in response to the heat dissipation strategy of the electronic device being a heat dissipation strategy corresponding to an air cooling system, the device may operate a heat dissipation element that adjusts the fan speed so that the fan speed is greater than a first threshold or less than a second threshold, thereby achieving heat dissipation for the electronic device. Alternatively, the device may achieve heat dissipation for the electronic device based on a heat dissipation strategy for an air cooling system in related art.

[0063] In this way, through the heat dissipation method provided in the embodiment of the present application, the heat dissipation system of the electronic device is determined based on the device information of the electronic device; the heat dissipation strategy for the electronic device is determined based on the heat dissipation system of the electronic device; the heat dissipation element corresponding to the heat dissipation strategy is run to dissipate heat for the electronic device; it is applicable to electronic devices with all heat dissipation systems, and there is no need to design different solutions for electronic devices with different heat dissipation systems to determine the corresponding heat dissipation strategy; further, in hardware implementation, it is only based on a set of BMCs to detect the device information of the electronic device and automatically match the corresponding heat dissipation strategy, which can reduce hardware development costs, reduce system configuration, and thus reduce system costs. In addition, determining the corresponding heat dissipation strategy based on the device information of the electronic device can avoid the risks brought by human intervention and reduce maintenance costs.

[0064] In addition, this application uses the same BMC hardware to detect the cooling environment and automatically match the corresponding cooling strategy by identifying the unique hardware designs of different cooling systems. The following example illustrates this design solution using the currently common air cooling, water cooling plate cooling, and immersion liquid cooling, all sharing the same BMC hardware:

[0065] First, identify the hardware designs unique to the three cooling solutions as BMC detection conditions:

[0066] 1. Air cooling systems must be equipped with system fans, but some water cooling plate systems also have system fans. Therefore, the presence of system fans cannot be used as a basis for judging whether the system is air cooling or water cooling plate system;

[0067] 2. Due to the risk of leakage in the water-cooled plate system, a leakage detection sensor will be added to the system. This can be used as a basis for judging the water-cooled plate system and distinguishing it from the air-cooled system;

[0068] 3. The immersion liquid cooling system uses a dedicated immersion liquid cooling power supply unit (PSU), which can be used as a basis for distinguishing between air cooling systems and water cooling plate systems.

[0069] Based on the above analysis, a BMC detection process can be developed to automatically match the corresponding cooling strategy after distinguishing different cooling systems. Specifically, this process may include steps S301 to S305, steps S401 to S405, and steps S501 to S505. Optionally, steps S301 to S305, steps S401 to S405, and steps S501 to S505 can be implemented based on a set of BMC hardware. That is, the hardware detects the device information of the electronic device based on steps S301 to S305, steps S401 to S405, and steps S501 to S505, and automatically matches the corresponding cooling strategy. This eliminates the need to develop corresponding BMC hardware for different cooling systems.

[0070] Figure 3 A third optional flow chart of the heat dissipation method provided in an embodiment of the present application is shown, and will be explained according to each step.

[0071] Step S301 : determining whether the power supply device information is power supply device information corresponding to the immersive system.

[0072] In some embodiments, the heat dissipation device detects power supply device information of the system corresponding to the electronic device and determines whether the power supply device information is power supply device information corresponding to an immersive system. Since the immersive system is configured with a dedicated immersive liquid cooling PSU, if the power supply device information is detected to be power supply device information corresponding to an immersive system, it can be directly determined that the heat dissipation system of the electronic device is an immersive system, and / or the heat dissipation strategy for the electronic device is determined to be a strategy corresponding to an immersive system; if the power supply device information is detected not to be power supply device information corresponding to an immersive system, it is necessary to further determine the heat dissipation system and / or heat dissipation strategy of the electronic device based on other device information of the electronic device.

[0073] In specific implementation, if the apparatus confirms that the power supply device information is the power supply device information corresponding to the immersive system, step S302 is executed; or if the apparatus confirms that the power supply device information is not the power supply device information corresponding to the immersive system, step S303 is executed.

[0074] Step S302 : determining that the heat dissipation strategy of the electronic device is a heat dissipation strategy corresponding to an immersion heat dissipation system.

[0075] In some embodiments, the apparatus determines that the heat dissipation strategy of the electronic device is a heat dissipation strategy corresponding to an immersion heat dissipation system in response to the power supply device information being power supply device information corresponding to an immersion system.

[0076] Furthermore, the device can run the heat dissipation element corresponding to the heat dissipation strategy corresponding to the immersive system to dissipate heat for the electronic device; optionally, the device can send heat dissipation information to the electronic device so that other components of the electronic device can run the heat dissipation element corresponding to the heat dissipation strategy corresponding to the immersive system to dissipate heat for the electronic device.

[0077] Step S303: Detect whether the electronic device includes a liquid leakage detection device.

[0078] In some embodiments, the device detects whether the electronic device includes a liquid leakage detection device, and determines whether the heat dissipation system of the electronic device is a water-cooled plate system. Since the water-cooled plate system has the risk of leakage, a liquid leakage detection device is added to the system, and the immersion system and the air-cooled system do not involve a liquid leakage detection device, so it can be determined whether the heat dissipation system of the electronic device is a water-cooled plate system by detecting the liquid leakage detection device; in the case where it is detected that the electronic device includes a liquid leakage detection device, it can be directly determined that the heat dissipation system of the electronic device is a water-cooled plate system, and / or, the heat dissipation strategy for the electronic device is determined to be the strategy corresponding to the water-cooled plate system; in the case where it is detected that the electronic device does not include a liquid leakage detection device, it is necessary to further determine the heat dissipation system and / or heat dissipation strategy of the electronic device based on other device information of the electronic device.

[0079] The liquid leakage detection device may include a liquid leakage detection line and / or a liquid leakage detection sensor. The device may determine whether the electronic device includes a liquid leakage detection sensor by detecting whether information from the liquid leakage detection sensor can be read.

[0080] In a specific implementation, if the device detects that the electronic device includes a liquid leakage detection device, step S304 is executed; or if the device detects that the electronic device does not include a liquid leakage detection device, step S301 is executed.

[0081] It should be noted that step S301 and step S303 can be executed in any order or simultaneously. If it is confirmed that the power supply device information of the electronic device is not the power supply device information corresponding to the immersion system and the electronic device does not include a liquid leakage detection device, step S305 is executed.

[0082] Step S304 : determining that the heat dissipation strategy of the electronic device is a heat dissipation strategy corresponding to the water cooling plate system.

[0083] In some embodiments, in response to the electronic device including a liquid leakage detection device, the device determines that the heat dissipation strategy of the electronic device is a heat dissipation strategy corresponding to a water-cooled plate heat dissipation system.

[0084] Furthermore, the device can run the heat dissipation element corresponding to the heat dissipation strategy corresponding to the water cooling plate system to dissipate heat for the electronic device; optionally, the device can send heat dissipation information to the electronic device so that other components of the electronic device can run the heat dissipation element corresponding to the heat dissipation strategy corresponding to the water cooling plate system to dissipate heat for the electronic device.

[0085] Step S305 : determining that the heat dissipation strategy of the electronic device is a heat dissipation strategy corresponding to an air cooling system.

[0086] In some embodiments, the device determines that the power supply device information of the electronic device is not the power supply device information corresponding to the immersion system, and the electronic device does not include a liquid leakage detection device, then the cooling system of the electronic device is excluded from being an immersion system and a water-cooled plate system; further, the device can directly determine that the cooling strategy of the electronic device is the cooling strategy corresponding to the air cooling system, and can also determine whether the cooling strategy of the electronic device is the cooling strategy corresponding to the air cooling system by detecting whether the electronic device includes a fan.

[0087] In a specific implementation, the device determines that the heat dissipation system of the electronic device is an air cooling system in response to the electronic device including a fan, and / or confirms that the heat dissipation strategy for the electronic device is a heat dissipation strategy corresponding to the air cooling system.

[0088] Furthermore, the device can run the heat dissipation element corresponding to the heat dissipation strategy corresponding to the air cooling system to dissipate heat for the electronic device; optionally, the device can send heat dissipation information to the electronic device so that other components of the electronic device can run the heat dissipation element corresponding to the heat dissipation strategy corresponding to the air cooling system to dissipate heat for the electronic device.

[0089] In this way, through the heat dissipation method provided in the embodiment of the present application, based on the device information of the electronic device, the heat dissipation strategy corresponding to the electronic device (such as the heat dissipation strategy corresponding to the immersion system or the heat dissipation strategy corresponding to the water-cooled plate system) can be directly determined; the heat dissipation strategy corresponding to the electronic device (such as the heat dissipation strategy corresponding to the air-cooled system) can also be indirectly determined based on the elimination method; it is applicable to electronic devices of all heat dissipation systems, and there is no need to design different solutions for electronic devices of different heat dissipation systems to determine the corresponding heat dissipation strategy; further, in hardware implementation, it is only based on a set of BMCs to detect the device information of the electronic device and automatically match the corresponding heat dissipation strategy, which can reduce hardware development costs, reduce system configuration, and thus reduce system costs. In addition, determining the corresponding heat dissipation strategy based on the device information of the electronic device can avoid the risks brought by human intervention and reduce maintenance costs.

[0090] Figure 4A fourth optional flow chart of the heat dissipation method provided in an embodiment of the present application is shown, and will be explained according to each step.

[0091] Step S401: Detecting power supply information of a system corresponding to the electronic device.

[0092] In some embodiments, the heat dissipation device detects power supply device information of the system corresponding to the electronic device and determines whether the power supply device information is power supply device information corresponding to an immersive system. Since the immersive system is configured with a dedicated immersive liquid cooling PSU, if the power supply device information is detected to be power supply device information corresponding to an immersive system, it can be directly determined that the heat dissipation system of the electronic device is an immersive system, and / or the heat dissipation strategy for the electronic device is determined to be a strategy corresponding to an immersive system; if the power supply device information is detected not to be power supply device information corresponding to an immersive system, it is necessary to further determine the heat dissipation system and / or heat dissipation strategy of the electronic device based on other device information of the electronic device.

[0093] In specific implementation, if the apparatus confirms that the power supply device information is the power supply device information corresponding to the immersive system, step S402 is executed; or if the apparatus confirms that the power supply device information is not the power supply device information corresponding to the immersive system, step S403 is executed.

[0094] Step S402 : determining that the heat dissipation strategy of the electronic device is a heat dissipation strategy corresponding to an immersion heat dissipation system.

[0095] In some embodiments, the apparatus determines that the heat dissipation strategy of the electronic device is a heat dissipation strategy corresponding to an immersion heat dissipation system in response to the power supply device information being power supply device information corresponding to an immersion system.

[0096] Furthermore, the device can run the heat dissipation element corresponding to the heat dissipation strategy corresponding to the immersive system to dissipate heat for the electronic device; optionally, the device can send heat dissipation information to the electronic device so that other components of the electronic device can run the heat dissipation element corresponding to the heat dissipation strategy corresponding to the immersive system to dissipate heat for the electronic device.

[0097] Step S403: Determine whether a liquid leakage detection device is included.

[0098] In some embodiments, the device detects whether the electronic device includes a liquid leakage detection device, and determines whether the heat dissipation system of the electronic device is a water-cooled plate system. Since the water-cooled plate system has the risk of leakage, a liquid leakage detection device is added to the system, and the immersion system and the air-cooled system do not involve a liquid leakage detection device, so it can be determined whether the heat dissipation system of the electronic device is a water-cooled plate system by detecting the liquid leakage detection device; in the case where it is detected that the electronic device includes a liquid leakage detection device, it can be directly determined that the heat dissipation system of the electronic device is a water-cooled plate system, and / or, the heat dissipation strategy for the electronic device is determined to be the strategy corresponding to the water-cooled plate system; in the case where it is detected that the electronic device does not include a liquid leakage detection device, it is necessary to further determine the heat dissipation system and / or heat dissipation strategy of the electronic device based on other device information of the electronic device.

[0099] The liquid leakage detection device may include a liquid leakage detection line and / or a liquid leakage detection sensor. The device may determine whether the electronic device includes a liquid leakage detection sensor by detecting whether information from the liquid leakage detection sensor can be read.

[0100] In a specific implementation, if the device detects that the electronic device includes a liquid leakage detection device, step S404 is executed; or if the device detects that the electronic device does not include a liquid leakage detection device, step S405 is executed.

[0101] Step S404: determining that the heat dissipation strategy of the electronic device is a heat dissipation strategy corresponding to a water-cooling plate system.

[0102] In some embodiments, in response to the electronic device including a liquid leakage detection device, the device determines that the heat dissipation strategy of the electronic device is a heat dissipation strategy corresponding to a water-cooled plate heat dissipation system.

[0103] Furthermore, the device can run the heat dissipation element corresponding to the heat dissipation strategy corresponding to the water cooling plate system to dissipate heat for the electronic device; optionally, the device can send heat dissipation information to the electronic device so that other components of the electronic device can run the heat dissipation element corresponding to the heat dissipation strategy corresponding to the water cooling plate system to dissipate heat for the electronic device.

[0104] Step S405 : determining that the heat dissipation strategy of the electronic device is a heat dissipation strategy corresponding to an air cooling system.

[0105] In some embodiments, the device determines that the power supply device information of the electronic device is not the power supply device information corresponding to the immersion system, and the electronic device does not include a liquid leakage detection device, then the cooling system of the electronic device is excluded from being an immersion system and a water-cooled plate system; further, the device can directly determine that the cooling strategy of the electronic device is the cooling strategy corresponding to the air cooling system, and can also determine whether the cooling strategy of the electronic device is the cooling strategy corresponding to the air cooling system by detecting whether the electronic device includes a fan.

[0106] In a specific implementation, the device determines that the heat dissipation system of the electronic device is an air cooling system in response to the electronic device including a fan, and / or confirms that the heat dissipation strategy for the electronic device is a heat dissipation strategy corresponding to the air cooling system.

[0107] Furthermore, the device can run the heat dissipation element corresponding to the heat dissipation strategy corresponding to the air cooling system to dissipate heat for the electronic device; optionally, the device can send heat dissipation information to the electronic device so that other components of the electronic device can run the heat dissipation element corresponding to the heat dissipation strategy corresponding to the air cooling system to dissipate heat for the electronic device.

[0108] In this way, through the heat dissipation method provided in the embodiment of the present application, based on the device information of the electronic device, the heat dissipation strategy corresponding to the electronic device (such as the heat dissipation strategy corresponding to the immersion system or the heat dissipation strategy corresponding to the water-cooled plate system) can be directly determined; the heat dissipation strategy corresponding to the electronic device (such as the heat dissipation strategy corresponding to the air-cooled system) can also be indirectly determined based on the elimination method; it is applicable to electronic devices of all heat dissipation systems, and there is no need to design different solutions for electronic devices of different heat dissipation systems to determine the corresponding heat dissipation strategy; further, in hardware implementation, it is only based on a set of BMCs to detect the device information of the electronic device and automatically match the corresponding heat dissipation strategy, which can reduce hardware development costs, reduce system configuration, and thus reduce system costs. In addition, determining the corresponding heat dissipation strategy based on the device information of the electronic device can avoid the risks brought by human intervention and reduce maintenance costs.

[0109] Figure 5 A fifth optional flow chart of the heat dissipation method provided in an embodiment of the present application is shown and will be explained according to each step.

[0110] Step S501: Detect whether the electronic device includes a fan.

[0111] In some embodiments, a heat dissipation device detects whether the electronic device includes a fan, and in response to the electronic device not including a fan, determines that the heat dissipation strategy of the electronic device is a heat dissipation strategy corresponding to an immersion system or a water-cooled plate system. Because both air-cooled systems and water-cooled plate systems include fans, while immersion systems do not, if the device detects that the electronic device does not include a fan, the electronic device is likely an immersion system. The device can directly determine that the electronic device is an immersion system, or it can further determine the power supply device information of the electronic device to determine whether the electronic device is an immersion system.

[0112] In some embodiments, in response to the device detecting that the electronic device includes a fan, step S501 is executed; or in response to the detection device detecting that the electronic device does not include a fan, step S505 is executed.

[0113] Step S502: Determine whether the electronic device includes a liquid leakage detection device.

[0114] In some embodiments, the device detects whether the electronic device includes a liquid leakage detection device to determine whether the heat dissipation system of the electronic device is a water-cooled plate system. Since the water-cooled plate system has the risk of leakage, a liquid leakage detection device is added to the system. However, neither the immersion system nor the air-cooled system involves a liquid leakage detection device. Therefore, it is possible to determine whether the heat dissipation system of the electronic device is a water-cooled plate system by detecting the liquid leakage detection device. In the case where it is detected that the electronic device includes a liquid leakage detection device, it is possible to directly determine that the heat dissipation system of the electronic device is a water-cooled plate system, and / or determine that the heat dissipation strategy for the electronic device is a strategy corresponding to the water-cooled plate system.

[0115] The liquid leakage detection device may include a liquid leakage detection line and / or a liquid leakage detection sensor. The device may determine whether the electronic device includes a liquid leakage detection sensor by detecting whether information from the liquid leakage detection sensor can be read.

[0116] In a specific implementation, if the device detects that the electronic device includes a liquid leakage detection device, step S503 is executed; or if the device detects that the electronic device does not include a liquid leakage detection device, step S504 is executed.

[0117] Step S503: determining that the heat dissipation strategy of the electronic device is a heat dissipation strategy corresponding to a water-cooled plate system.

[0118] In some embodiments, the device determines, in response to the electronic device including a liquid leakage detection device, that the electronic device's heat dissipation strategy is a heat dissipation strategy corresponding to a water-cooled plate heat dissipation system. Specifically, upon detecting that the electronic device includes a fan and a liquid leakage detection device, the device determines that the electronic device's heat dissipation strategy is a heat dissipation strategy corresponding to a water-cooled plate system.

[0119] Furthermore, the device can run the heat dissipation element corresponding to the heat dissipation strategy corresponding to the water cooling plate system to dissipate heat for the electronic device; optionally, the device can send heat dissipation information to the electronic device so that other components of the electronic device can run the heat dissipation element corresponding to the heat dissipation strategy corresponding to the water cooling plate system to dissipate heat for the electronic device.

[0120] Step S504 : determining that the heat dissipation strategy of the electronic device is a heat dissipation strategy corresponding to an air cooling system.

[0121] In some embodiments, in response to the electronic device including a fan but not including a liquid leakage detection device, the device determines that the heat dissipation strategy of the electronic device is a heat dissipation strategy corresponding to an air cooling system.

[0122] Furthermore, the device can run the heat dissipation element corresponding to the heat dissipation strategy corresponding to the air cooling system to dissipate heat for the electronic device; optionally, the device can send heat dissipation information to the electronic device so that other components of the electronic device can run the heat dissipation element corresponding to the heat dissipation strategy corresponding to the air cooling system to dissipate heat for the electronic device.

[0123] Step S505 : determining that the heat dissipation strategy of the electronic device is a heat dissipation strategy corresponding to an immersion system.

[0124] In some embodiments, the device can directly determine that the heat dissipation strategy of the electronic device is the heat dissipation strategy corresponding to the immersion system based on the fact that the electronic device does not include a fan; or, the device can also detect the power supply device information of the system corresponding to the electronic device, and in response to the power supply device information being the power supply device information corresponding to the immersion system, determine that the heat dissipation strategy of the electronic device is the heat dissipation strategy corresponding to the immersion heat dissipation system.

[0125] Furthermore, the device can run the heat dissipation element corresponding to the heat dissipation strategy corresponding to the immersive system to dissipate heat for the electronic device; optionally, the device can send heat dissipation information to the electronic device so that other components of the electronic device can run the heat dissipation element corresponding to the heat dissipation strategy corresponding to the immersive system to dissipate heat for the electronic device.

[0126] In this way, through the heat dissipation method provided in the embodiment of the present application, based on the device information of the electronic device, the heat dissipation strategy corresponding to the electronic device (such as the heat dissipation strategy corresponding to the immersion system or the heat dissipation strategy corresponding to the water-cooled plate system) can be directly determined; the heat dissipation strategy corresponding to the electronic device (such as the heat dissipation strategy corresponding to the air-cooled system) can also be indirectly determined based on the elimination method; it is applicable to electronic devices of all heat dissipation systems, and there is no need to design different solutions for electronic devices of different heat dissipation systems to determine the corresponding heat dissipation strategy; further, in hardware implementation, it is only based on a set of BMCs to detect the device information of the electronic device and automatically match the corresponding heat dissipation strategy, which can reduce hardware development costs, reduce system configuration, and thus reduce system costs. In addition, determining the corresponding heat dissipation strategy based on the device information of the electronic device can avoid the risks brought by human intervention and reduce maintenance costs.

[0127] Figure 6 An optional structural schematic diagram of the heat dissipation device provided in an embodiment of the present application is shown and will be described according to each part.

[0128] In some embodiments, the heat dissipation system 600 includes a determining unit 601 .

[0129] The determining unit 601 is configured to determine a heat dissipation strategy for the electronic device based on device information of the electronic device;

[0130] The device information at least includes information on a device for detecting whether the electronic device has a support device capable of matching the heat dissipation system.

[0131] The determining unit 601 is specifically configured to detect power supply device information of the system corresponding to the electronic device; in response to the power supply device information being power supply device information corresponding to the immersion system, determine that the heat dissipation strategy of the electronic device is the heat dissipation strategy corresponding to the immersion heat dissipation system.

[0132] The determining unit 601 is specifically configured to detect whether the electronic device includes a liquid leakage detection line; in response to the electronic device including the liquid leakage detection line, determine that the heat dissipation strategy of the electronic device is a heat dissipation strategy corresponding to a water cooling plate system.

[0133] The determining unit 601 is specifically configured to detect whether the electronic device includes a fan in response to the power supply device information of the system corresponding to the electronic device not being the power supply device information corresponding to the immersive system and the electronic device not including a liquid leakage detection line;

[0134] In response to the electronic device including a fan, it is determined that the heat dissipation strategy of the electronic device is a heat dissipation strategy corresponding to an air cooling system.

[0135] The determining unit 601 is specifically configured to determine whether the information of the liquid leakage detection sensor can be read in response to the power supply device information not including the power supply device information corresponding to the immersion system;

[0136] In response to being able to read the information of the liquid leakage detection sensor, it is determined that the heat dissipation strategy of the electronic device is a heat dissipation strategy corresponding to a water cooling plate system.

[0137] The determining unit 601 is specifically configured to determine, in response to failure to read the information of the liquid leakage detection sensor, that the heat dissipation strategy of the electronic device is a heat dissipation strategy corresponding to an air cooling system.

[0138] The determining unit 601 is specifically configured to detect whether the electronic device includes a fan;

[0139] In response to the electronic device not including a fan, it is determined that the heat dissipation strategy of the electronic device is a heat dissipation strategy corresponding to an immersion system.

[0140] The determining unit 601 is specifically configured to determine whether the electronic device includes a liquid leakage detection line and / or a liquid leakage detection sensor in response to the electronic device including a fan;

[0141] In response to the electronic device including the liquid leakage detection line and / or the liquid leakage detection sensor, it is determined that the heat dissipation strategy of the electronic device is a heat dissipation strategy corresponding to a water cooling plate system.

[0142] The determining unit 601 is specifically configured to determine that the heat dissipation strategy of the electronic device is a heat dissipation strategy corresponding to an air cooling system in response to the electronic device not including the liquid leakage detection line and / or the liquid leakage detection sensor.

[0143] In some optional embodiments, the heat dissipation system 600 may further include a heat dissipation unit 602 .

[0144] The heat dissipation unit 602 is specifically used for one of the following:

[0145] In response to the heat dissipation strategy of the electronic device being a heat dissipation strategy corresponding to an air cooling system, the heat dissipation unit may operate a heat dissipation element corresponding to the heat dissipation strategy corresponding to the air cooling system to dissipate heat for the electronic device; optionally, the heat dissipation unit may send heat dissipation information to the electronic device so as to enable other components of the electronic device to operate a heat dissipation element corresponding to the heat dissipation strategy corresponding to the air cooling system to dissipate heat for the electronic device;

[0146] In response to the heat dissipation strategy of the electronic device being the heat dissipation strategy corresponding to the water-cooling plate system, the heat dissipation unit may operate the heat dissipation element corresponding to the heat dissipation strategy corresponding to the water-cooling plate system to dissipate heat for the electronic device; optionally, the heat dissipation unit may send heat dissipation information to the electronic device so that other components of the electronic device operate the heat dissipation element corresponding to the heat dissipation strategy corresponding to the water-cooling plate system to dissipate heat for the electronic device;

[0147] In response to the heat dissipation strategy of the electronic device being the heat dissipation strategy corresponding to the immersive system, the heat dissipation unit can operate the heat dissipation element corresponding to the heat dissipation strategy corresponding to the immersive system to dissipate heat for the electronic device; optionally, the heat dissipation unit can send heat dissipation information to the electronic device so that other components of the electronic device operate the heat dissipation element corresponding to the heat dissipation strategy corresponding to the immersive system to dissipate heat for the electronic device.

[0148] Figure 7 This is a schematic diagram of the hardware composition structure of the heat dissipation device provided in an embodiment of the present application. The heat dissipation device 700 includes at least one processor; and a memory communicatively connected to the at least one processor; wherein the memory stores instructions that can be executed by the at least one processor, and the instructions are executed by the at least one processor to enable the at least one processor to implement the heat dissipation method described above.

[0149] The heat dissipation device 700 includes: at least one processor 701, a memory 702 and at least one network unit 704. The various components in the heat dissipation device 700 are coupled together via a bus system 705. It is understood that the bus system 705 is used to achieve connection and communication between these components. In addition to the data bus, the bus system 705 also includes a power bus, a control bus and a status signal bus. However, for the sake of clarity, the bus system 705 is not described in detail. Figure 7 Various buses are labeled as bus system 705.

[0150] It is understood that the memory 702 can be a volatile memory or a non-volatile memory, or can include both volatile and non-volatile memories. Among them, the non-volatile memory can be ROM, programmable read-only memory (PROM), erasable programmable read-only memory (EPROM), electrically erasable programmable read-only memory (EEPROM), magnetic random access memory (FRAM), flash memory, magnetic surface memory, optical disk, or compact disc read-only memory (CD-ROM); the magnetic surface memory can be a magnetic disk or a magnetic tape. The volatile memory can be random access memory (RAM), which is used as an external cache. By way of example and not limitation, many forms of RAM are available, such as static random access memory (SRAM), synchronous static random access memory (SSRAM), dynamic random access memory (DRAM), synchronous dynamic random access memory (SDRAM), double data rate synchronous dynamic random access memory (DDRSDRAM), enhanced synchronous dynamic random access memory (ESDRAM), synchronous link dynamic random access memory (SLDRAM), and direct rambus random access memory (DRRAM). The memory 702 described in the embodiments of the present application is intended to include, but is not limited to, these and any other suitable types of memory.

[0151] The memory 702 in the embodiment of the present application is used to store various types of data to support the operation of the heat dissipation device 700. Examples of such data include any computer program for operating on the heat dissipation device 700, such as the application program 722. The program for implementing the method of the embodiment of the present application may be included in the application program 722.

[0152] The method disclosed in the embodiment of the present application can be applied to the processor 701 or implemented by the processor 701. The processor 701 may be an integrated circuit chip with signal processing capabilities. During implementation, each step of the method can be completed by an integrated logic circuit of the hardware in the processor 701 or by instructions in the form of software. The processor 701 may be a general-purpose processor, a digital signal processor (DSP), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. The processor 701 can implement or execute the various methods, steps, and logic block diagrams disclosed in the embodiments of the present application. The general-purpose processor may be a microprocessor or any conventional processor, etc. The steps of the method disclosed in the embodiment of the present application can be directly embodied as being executed by a hardware decoding processor, or can be executed by a combination of hardware and software modules in the decoding processor. The software module can be located in a storage medium, which is located in the memory 702. The processor 701 reads the information in the memory 702 and completes the steps of the aforementioned method in combination with its hardware.

[0153] In an exemplary embodiment, the heat dissipation device 700 can be implemented by one or more application-specific integrated circuits (ASICs), DSPs, programmable logic devices (PLDs), complex programmable logic devices (CPLDs), FPGAs, general-purpose processors, controllers, MCUs, MPUs, or other electronic components to perform the aforementioned method.

[0154] In addition to the above-mentioned methods and devices, an embodiment of the present application may also be a computer program product, which includes computer program instructions, which, when executed by a processor, enable the processor to execute the steps of the method according to various embodiments of the present application described in the above-mentioned "Exemplary Method" section of this specification.

[0155] The computer program product may be written in any combination of one or more programming languages to implement the program code for performing the operations of the embodiments of the present application, including object-oriented programming languages such as Java, C++, and conventional procedural programming languages such as "C" or similar programming languages. The program code may be executed entirely on the user's computing device, partially on the user's computing device, as a standalone software package, partially on the user's computing device and partially on a remote computing device, or entirely on a remote computing device or server.

[0156] In addition, an embodiment of the present application may also be a computer-readable storage medium having computer program instructions stored thereon, which, when executed by a processor, enable the processor to execute the steps of the method according to various embodiments of the present application described in the above "Exemplary Method" section of this specification.

[0157] The computer-readable storage medium can adopt any combination of one or more readable media. The readable medium can be a readable signal medium or a readable storage medium. The readable storage medium can, for example, include but is not limited to a system, device or component of electricity, magnetism, light, electromagnetic, infrared, or semiconductor, or any combination thereof. More specific examples (non-exhaustive list) of readable storage media include: an electrical connection with one or more wires, a portable disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination thereof.

[0158] The basic principles of the present application have been described above in conjunction with specific embodiments. However, it should be noted that the advantages, strengths, and effects mentioned in this application are merely illustrative and not restrictive, and it should not be assumed that these advantages, strengths, and effects are required of each embodiment of this application. In addition, the specific details disclosed above are merely illustrative and facilitating understanding, and are not restrictive. The above details do not limit this application to necessarily being implemented using the above specific details.

[0159] The block diagrams of the devices, devices, equipment, and systems involved in this application are merely illustrative examples and are not intended to require or imply that they must be connected, arranged, or configured in the manner shown in the block diagrams. As will be appreciated by those skilled in the art, these devices, devices, equipment, and systems can be connected, arranged, or configured in any manner. Words such as "include," "comprise," "have," and the like are open-ended words, meaning "including but not limited to," and can be used interchangeably therewith. The words "or" and "and" used herein refer to the words "and / or" and can be used interchangeably therewith, unless the context clearly indicates otherwise. The word "such as" used herein refers to the phrase "such as but not limited to," and can be used interchangeably therewith.

[0160] It should also be noted that in the apparatus, device, and method of the present application, each component or each step can be decomposed and / or recombined, and such decomposition and / or recombination should be regarded as equivalent solutions of the present application.

[0161] The above description of the disclosed aspects is provided to enable any person skilled in the art to make or use the present application. Various modifications to these aspects will be readily apparent to those skilled in the art, and the general principles defined herein may be applied to other aspects without departing from the scope of the present application. Therefore, the present application is not intended to be limited to the aspects shown herein, but rather to be accorded the widest scope consistent with the principles and novel features disclosed herein.

[0162] The above description has been provided for the purpose of illustration and description. Furthermore, this description is not intended to limit the embodiments of the present application to the forms disclosed herein. Although a number of example aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, alterations, additions, and sub-combinations thereof.

Claims

1. A heat dissipation method, comprising: Determining a heat dissipation strategy for the electronic device based on device information of the electronic device; The device information at least includes information on a device for detecting whether the electronic device has a device that matches the cooling system; The determining of a heat dissipation strategy for the electronic device based on the device information of the electronic device includes: Detecting power supply information of a system corresponding to the electronic device; In response to the power supply device information being power supply device information corresponding to an immersion system, determining that the heat dissipation strategy of the electronic device is a heat dissipation strategy corresponding to an immersion heat dissipation system; In response to the power supply device information not being the power supply device information corresponding to the immersive system, detecting whether the electronic device includes a liquid leakage detection line; In response to the electronic device including the liquid leakage detection line, determining that a heat dissipation strategy of the electronic device is a heat dissipation strategy corresponding to a water cooling plate system; In response to the power supply device information of the system corresponding to the electronic device not being the power supply device information corresponding to the immersion system, and the electronic device not including a liquid leakage detection line, detecting whether the electronic device includes a fan; In response to the electronic device including a fan, it is determined that the heat dissipation strategy of the electronic device is a heat dissipation strategy corresponding to an air cooling system.

2. The method according to claim 1, wherein determining a heat dissipation strategy for the electronic device based on the device information of the electronic device comprises: In response to the power supply device information not including the power supply device information corresponding to the immersion system, determining whether information of the liquid leakage detection sensor can be read; In response to being able to read the information of the liquid leakage detection sensor, it is determined that the heat dissipation strategy of the electronic device is a heat dissipation strategy corresponding to a water cooling plate system.

3. The method according to claim 2, wherein determining a heat dissipation strategy for the electronic device based on the device information of the electronic device comprises: In response to the inability to read the information of the liquid leakage detection sensor, it is determined that the heat dissipation strategy of the electronic device is a heat dissipation strategy corresponding to an air cooling system.

4. The method according to claim 1, wherein determining a heat dissipation strategy for the electronic device based on the device information of the electronic device comprises: detecting whether the electronic device includes a fan; In response to the electronic device not including a fan, it is determined that the heat dissipation strategy of the electronic device is a heat dissipation strategy corresponding to an immersion system.

5. The method according to claim 4, wherein determining a heat dissipation strategy for the electronic device based on the device information of the electronic device comprises: In response to the electronic device including a fan, determining whether the electronic device includes a liquid leakage detection line and / or a liquid leakage detection sensor; In response to the electronic device including the liquid leakage detection line and / or the liquid leakage detection sensor, it is determined that the heat dissipation strategy of the electronic device is a heat dissipation strategy corresponding to a water cooling plate system.

6. The method according to claim 5, wherein determining a heat dissipation strategy for the electronic device based on the device information of the electronic device comprises: In response to the electronic device not including the liquid leakage detection line and / or the liquid leakage detection sensor, it is determined that the heat dissipation strategy of the electronic device is a heat dissipation strategy corresponding to an air cooling system.

7. A heat dissipation device comprising: a determining unit, configured to determine a heat dissipation strategy for the electronic device based on device information of the electronic device; The device information at least includes information on a device for detecting whether the electronic device has a device that matches the cooling system; The determining unit is specifically configured to detect power supply device information of a system corresponding to the electronic device; in response to the power supply device information being power supply device information corresponding to an immersive system, determine that the heat dissipation strategy of the electronic device is a heat dissipation strategy corresponding to the immersive heat dissipation system; It is further specifically configured to detect, in response to the power supply device information not being power supply device information corresponding to an immersion system, whether the electronic device includes a liquid leakage detection line; and, in response to the electronic device including the liquid leakage detection line, determine that the heat dissipation strategy of the electronic device is a heat dissipation strategy corresponding to a water-cooled plate system; It is also specifically used to detect whether the electronic device includes a fan in response to the power supply device information of the system corresponding to the electronic device being not the power supply device information corresponding to the immersion system, and the electronic device not including a liquid leakage detection line; and in response to the electronic device including a fan, determine that the heat dissipation strategy of the electronic device is the heat dissipation strategy corresponding to the air cooling system.

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