A method for degumming and cleaning AL products before coating

Abstract

The present invention discloses a method for degumming and cleaning AL products before coating, comprising the following steps: Step 1, preparing a semiconductor chip product with residual glue liquid and transferring the product to a basket; Step 2, preparing a quartz cylinder and introducing an organic solvent into the quartz cylinder; Step 3, transferring the basket containing the residual glue chips to an organic cleaning solvent for degumming and cleaning; Step 4, transferring the basket containing the chips after degumming to the next tank body through a fixture for cleaning the upper residual liquid; Step 5, transferring the basket to deionized water through a fixture for circulating flushing to clean the upper residual liquid and particles. The present invention improves the traditional method of protecting the front metal with a film, and when degumming and cleaning are required before evaporation and the front metal needs to be protected, a method of cleaning the chip before coating is added. The chips cleaned by this method meet customer requirements and are low in cost, with excellent comprehensive application.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor chips, and particularly relates to a method for degumming and cleaning AL products before coating. Background Art

[0002] In the process of semiconductor manufacturing, the coating process is a very important link in the manufacturing process of silicon integrated circuits. However, after different processes of processing the silicon wafer before coating, its surface has been seriously contaminated, which will seriously affect the bonding force between the metal and the silicon during coating, thus destroying the normal performance of semiconductor devices. Therefore, a chip cleaning process is added before coating.

[0003] Generally speaking, different cleaning methods are used for different pollution situations; generally, there are the following three types of contamination on the surface of silicon wafers: A. Organic contamination, which can be removed by the dissolution operation of organic solvents combined with ultrasonic cleaning technology; B. Particle contamination: Physical methods can be used to remove particles with a diameter ≥ 0.4 microns by ultrasonic cleaning technology; megasonic waves can be used to remove particles ≥ 0.2 microns; C. Metal ion contamination: One type is that contaminated ions or atoms are adsorbed and dispersed on the surface of the silicon wafer, and the other type is that positively charged metal ions attach to the surface of the silicon wafer after obtaining electrons. The purpose of chemical cleaning of silicon wafers is to remove this kind of contamination.

[0004] Figure 1 The cleaning method adopted in the prior art is as follows: Provide a semiconductor chip to be cleaned, and the back silver layer of the semiconductor chip contains a silver compound to be removed; perform the first flip film on the semiconductor chip, and tear off the protective film on the back of the semiconductor chip to expose the back silver layer of the semiconductor chip; immerse the semiconductor chip to be cleaned in a cleaning solution for cleaning to remove the silver compound to be removed; rinse the semiconductor chip after being cleaned by the cleaning solution; perform a drying treatment on the rinsed semiconductor chip; it is necessary to deposit metal on the electrodes above and below the silicon wafer. However, due to performance reasons, some products need to deposit the front metal first and then continue with other processes, and then return to the back coating process, which requires a high level of protection for the front metal that has been deposited in the early stage; currently, the commonly used method for protecting the front metal is to apply a film on the front for protection, but this method cannot be used for products with residual glue on the front; and the existing manual operation method is used for cleaning work. Summary of the Invention

[0005] The object of the present invention is to solve the problems in the above background art, and propose a method for degumming and cleaning AL products before coating; perform two trichloroethylene cleanings, two ethanol cleanings, and one deionized water cleaning on the semiconductor chip, which can clean and remove the residual glue on the chip completely; at the same time, cooperate with the semiconductor cleaning equipment to realize the automated and process-based cleaning of the semiconductor chip, and improve the overall efficiency of semiconductor chip cleaning.

[0006] The object of the present invention can be achieved by the following technical solutions:

[0007] A method for degumming and cleaning AL products before coating, comprising the following steps:

[0008] Step 1: Place the semiconductor chips to be washed into an organic tank filled with trichloroethylene for cleaning; then, transfer them to the next organic tank filled with trichloroethylene for cleaning;

[0009] Step 2: Transfer the semiconductor chips after trichloroethylene cleaning to an organic tank filled with ethanol for cleaning, and then transfer them to the next organic tank filled with ethanol for cleaning;

[0010] Step 3: Place the semiconductor chips into an ion water tank for cleaning.

[0011] As a further solution of the present invention: In Steps 1, 2 and 3, during the cleaning process of the semiconductor chips, a flower basket is used as a carrier, and the flower basket is made of Teflon.

[0012] As a further solution of the present invention: In Steps 1 and 2, the cleaning time of the semiconductor in the organic tank is 10 minutes. When taking out, place the flower basket 7 containing the semiconductor above the organic tank and park for 5S.

[0013] As a further solution of the present invention: Before Step 1, prepare an organic cleaning solution: First, rinse the utensils with deionized water, soak them for one day and then dry them; then pour the organic solvent into the organic tank, and pour the organic solvent into the quartz cylinder as required.

[0014] As a further solution of the present invention: The cleaning method in Steps 1 and 2: Control the first drive motor to work, drive the rotating shaft to rotate, through the four bevel gears of the rotating shaft, make the four connecting shafts rotate simultaneously, drive the four flower baskets to rotate simultaneously, and rotate and clean the semiconductor chips.

[0015] As a further solution of the present invention: While the rotating shaft is rotating, drive the screw rod to rotate through the bevel gear located in the middle, make the moving block move upward along the fixed cylinder, and make the flower basket connected to the connecting frame move downward into the corresponding cleaning cylinder for cleaning.

[0016] As a further solution of the present invention: When the moving block moves from the bottom of the fixed cylinder to the top of the fixed cylinder, and then makes the moving block move from the top of the fixed cylinder to the bottom of the fixed cylinder, it is to complete the cleaning cycle in the corresponding organic tank.

[0017] As a further solution of the present invention: when a cleaning cycle is completed, the moving disk is controlled to move and the next organic tank is moved to the bottom of the flower basket for rotational cleaning, thereby completing two trichloroethylene cleanings, two ethanol cleanings and one deionized water cleaning of the semiconductor chip in sequence.

[0018] Beneficial effects of the present invention:

[0019] (1) The present invention improves the traditional film protection of the front metal. Before the evaporation, the glue removal cleaning is required and the front metal must be protected. Trichloroethylene can be used to clean and remove the residual glue on the chip. However, due to the limited cleaning ability of organic solvents, two trichloroethylene treatments are required to remove the glue completely. At the same time, the front metal will not be affected by the organic solvent. After the trichloroethylene cleaning, although the glue is completely removed, organic solvents that cannot be removed by deionized water will remain on both sides. In order to remove the trichloroethylene solvent, methanol solvent is used to continue to rinse the residual trichloroethylene. After rinsing, deionized water is used to remove particles and residual solvent.

[0020] (2) The present invention uses the semiconductor cleaning equipment to perform cleaning, loads semiconductor chips into a basket, and then mounts the basket containing the semiconductor chips onto a connecting shaft. At the same time, a cleaning solvent is added to the corresponding cleaning tank. Then, all the chips are controlled to fall into the cleaning tanks containing different solvents in sequence, and the semiconductor chips are cleaned twice with trichloroethylene, twice with ethanol, and once with deionized water, thereby achieving automated and streamlined cleaning of the semiconductor chips and improving the overall efficiency of semiconductor chip cleaning.

[0021] (3) The rotating mechanism of the present invention realizes the rotary cleaning of the semiconductor chips in the four flower baskets, so that the semiconductor core can be fully contacted with the cleaning solvent, reducing the time in each step of cleaning, thereby shortening the overall time of the semiconductor chip cleaning, and the semiconductor chips will be cleaned more cleanly and more fully through rotary cleaning; the lifting component enables the flower basket to perform lifting and lowering movements, so that the flower basket can be automatically immersed and cleaned, and transferred to other tanks after cleaning. Therefore, during the cleaning process, the mutual cooperation and linkage of the rotating mechanism and the lifting component will realize the full and orderly cleaning of the semiconductor chips. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The present invention will be further described below with reference to the accompanying drawings.

[0023] Figure 1 It is a flowchart of the semiconductor cleaning process of the prior art of the present invention;

[0024] Figure 2 It is a flow chart of the adhesive removal and cleaning method of the present invention;

[0025] Figure 3It is a schematic structural diagram of the semiconductor chip cleaning equipment of the present invention;

[0026] Figure 4 It is a schematic structural diagram of the connection relationship between the base and the moving disk of the present invention;

[0027] Figure 5 It is a schematic structural diagram of the receiving belt of the present invention;

[0028] Figure 6 It is a schematic structural diagram of the elastic support member of the present invention;

[0029] Figure 7 It is a schematic structural diagram of the connection relationship between the lifting assembly and the elastic support member of the present invention.

[0030] In the figure: 1. Base; 2. Bracket; 3. Moving disk; 4. Placing cylinder; 5. Cleaning tank group; 6. Receiving belt; 7. Flower basket; 8. Connecting frame; 9. First driving motor; 10. Connecting shaft; 11. Lifting assembly; 12. Elastic support member; 13. Card slot; 14. Arc plate; 15. Arc groove; 16. Rubber sleeve; 17. Installation groove; 18. Lead screw; 19. Slide block; 20. Second driving motor; 21. Cleaning cylinder; 22. Support cylinder; 23. Spring; 24. Piston plate; 25. Support column; 26. Rotating shaft; 27. Active bevel gear; 28. Driven bevel gear; 29. Screw; 30. Fixed cylinder; 31. Moving block; 32. Lifting column. Detailed implementation manners

[0031] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0032] Please refer to Figure 2 As shown, the present invention is a method for removing glue and cleaning AL products before coating, including the following steps:

[0033] Step 1, Semiconductor chip extraction: Prepare semiconductor chip products with residual glue from the previous process, and transfer the semiconductor chips to the cleaning Teflon flower basket 7;

[0034] Among them, the transfer of semiconductor chips can be completed by using tweezers, suction pens to pick up or a wafer inverter to invert the wafers;

[0035] Step 2, Prepare organic cleaning liquid: Prepare utensils for holding organic liquid. First, rinse the utensils with deionized water, soak them for one day and then dry them; then pour the organic solvent into the utensils, and pour the organic solvent into the quartz cylinder as required;

[0036] Among them, the cleaning tank 21 of the vessel is made of quartz stone; the utensils are cleaned to ensure the cleanliness of the utensils and avoid impurities or dust carried by the utensils themselves from affecting the quality of semiconductor chip cleaning;

[0037] Step 3: After placing the basket 7 containing the semiconductor chips to be washed into the trichloroethylene organic tank, shake it up and down 5 times, press the start button to start timing, and the cleaning time is 10 minutes; use the handle to take out the product placed in the organic tank and place it in the organic tank, then shake each basket up and down 5 times, press the start button to start timing, and the cleaning time is 10 minutes;

[0038] Step 4: After placing the semiconductor chips into the methanol organic tank, shake each basket up and down 5 times, press the start button to start timing, and the cleaning time is 10 minutes; when the time is up, lift the basket 7 up and then place it into the next methanol organic tank, then shake each basket 7 up and down 5 times, press the start button to start timing, and the cleaning time is 10 minutes;

[0039] Among them, in Step 3 and Step 4, when lifting the basket 7 out of each tank, the basket 7 needs to be placed at the top of the organic tank and parked for 5S to drain the solvent on the basket 7, so as to avoid directly transferring the cleaned semiconductor chips to the next tank and causing the solvent to spill on the workbench;

[0040] Step 5: Use the handle to take out the basket 7 and place it into the deionized water tank for circulating rinsing to further remove the residual organic liquid and particles on the front and back sides, ensuring better evaporation coating of the chips;

[0041] Among them, the deionized water needs to shake the basket 7 up and down during the rinsing process and rinse the chips by spraying;

[0042] Since trichloroethylene and ethanol are volatile solvents, during the above-mentioned degumming cleaning process, it is necessary to ensure smooth exhaust in the surrounding environment and maintain a good ventilation environment;

[0043] Through the above cleaning method, the traditional method of protecting the front metal by laminating and performing degumming cleaning before evaporation coating while protecting the front metal is improved. Trichloroethylene can clean and remove the residual glue on the chips. However, due to the limited cleaning ability of organic solvents, the glue can be removed cleanly after two treatments with trichloroethylene, and at the same time, the front metal will not be affected in the organic solvent; after cleaning with trichloroethylene, although the residual glue will be removed cleanly, there will be organic solvents that cannot be removed by deionized water remaining on both the front and back sides. To remove the trichloroethylene solvent, methanol solvent is used to continue rinsing the residual trichloroethylene, and then deionized water is used for cleaning to remove particles and residual solvents.

[0044] Example 2

[0045] In the process of removing the glue and cleaning the semiconductor chip, the cleaning of the semiconductor chips in the carrier 7 is carried out by manually holding and shaking, manually holding for static cleaning, and manually holding for transfer; it can be seen that the cleaning efficiency of the semiconductor chips is relatively low, the degree of automation is not high enough, and being in an environment where trichloroethylene and ethanol are volatile will also affect the health of the staff. Therefore, a semiconductor chip cleaning device is proposed;

[0046] Please refer to Figure 3 , the semiconductor cleaning device includes a base 1, a cleaning tank group 5, a conveyor belt 6, a carrier 7, and a connecting frame 8;

[0047] A bracket 2 is installed on the top surface of the base 1, and an intermittently driven moving disk 3 is arranged on the top surface of the base 1. Four cleaning tank groups 5 are arranged side by side on the top surface of the moving disk 3;

[0048] A vertically liftable connecting frame 8 is arranged on the top surface of the bracket 2. A connecting shaft 10 is intermittently arranged on the connecting frame 8. The bottom end of the connecting shaft 10 penetrates through the bracket 2 and is connected to the bracket 2. The bottom of the connecting shaft 10 is installed with a carrier 7 in a detachable manner. The detachable manner facilitates the installation and disassembly of the carrier 7, and is convenient for loading the semiconductor chips into the carrier 7 or taking them out of the carrier 7; the bottom of the connecting shaft 10 can install multiple carriers 7 according to the volume of the cleaning cylinder 21 in the cleaning tank group 5;

[0049] Among them, the number of the cleaning tank groups 5 is the same as the number of the carriers 7, and each carrier 7 is correspondingly located above the cleaning tank group 5; the cleaning tank group 5 is correspondingly marked with 1#, 2#, 3#, 4#. By setting the markings, it plays a role in identifying and marking the cleaning cylinder 21; each cleaning tank group 5 includes five cleaning cylinders 21, and the five cleaning cylinders 21 are arranged at equal intervals. The five cleaning cylinders 21 are successively filled with trichloroethylene solvent, trichloroethylene solvent, ethanol solvent, ethanol solvent, and deionized water along the driving direction of the moving disk 3; so that the semiconductor chips in the carrier 7 can successively pass through the five cleaning cylinders 21 to complete the corresponding cleaning work; and four cleaning tank groups 5 are arranged side by side, which increases the cleaning efficiency of the semiconductor chips by 4 times. Therefore, in cooperation with the fact that multiple carriers 7 can be installed at the bottom of each connecting shaft 10, the number of semiconductor chips cleaned each time will be greatly increased;

[0050] In order to make it quick and convenient to install the cleaning cylinder 21 on the moving disk 3, a placement cylinder 4 adapted to the size of the cleaning cylinder 21 is arranged on the moving disk 3. During use, the cleaning cylinder 21 can be directly placed into the placement cylinder 4;

[0051] The specific usage steps of this semiconductor cleaning equipment are as follows: Load the semiconductor chip into the carrier 7, and then install the carrier 7 containing the semiconductor chip onto the connecting shaft 10. At the same time, add cleaning solvent to the corresponding cleaning tank 21. Then, control all to sequentially fall into the cleaning tanks 21 containing different solvents, and perform two trichloroethylene cleanings, two ethanol cleanings, and one deionized water cleaning on the semiconductor chip, thereby realizing automated and process-based cleaning of the semiconductor chip and improving the overall efficiency of semiconductor chip cleaning.

[0052] Please refer to Figure 5 , between the cleaning tanks 21 of each cleaning tank group 5 are interconnected by a receiving belt 6. The receiving belt 6 includes a card slot 13, an arc plate 14, an arc groove 15, and a rubber sleeve 16. The length of the arc plate 14 is adapted to the distance between two cleaning tanks 21, the width of the arc plate 14 is adapted to the width of the carrier 7, and an arc groove 15 is provided on the arc plate 14.

[0053] Among them, on both sides of the bottom surface of the arc plate 14 are respectively provided with rubber sleeves 16. The rubber sleeves 16 are provided with U-shaped card slots 13, and the card slots 13 are adapted to the side walls of the cleaning tank 21, so that the arc plate 14 can be directly installed on the cleaning tank 21 through the card slots 13 of the rubber sleeves 16, which has the advantage of being convenient for disassembly and installation.

[0054] When the receiving belt 6 is in use: The adapted width enables the solvent adhered to the carrier 7 to directly drip into the arc plate 14 during the transfer of the carrier 7. Then, under the action of gravity, the solvent flows back into the cleaning tank 21 along the arc groove 15 on the arc plate 14. The setting of the arc plate 14 not only omits the time required for the carrier 7 to be placed above the cleaning tank 21 to drain after cleaning, but also can prevent the residual solvent on the carrier 7 from dripping and spilling on the workbench surface during the transfer process, and can continue to flow back into the cleaning tank 21 through the arc groove 15 for use.

[0055] Please refer to Figure 4 , the intermittent transmission of the moving disk 3 is achieved by providing a rectangular installation groove 17 on the base 1. The lead screw 18 is located in the installation groove 17 and rotates. One end of the lead screw 18 is connected to the output end of the second drive motor 20. The second drive motor 20 is installed on the side wall of the base 1. A slider 19 is threadedly sleeved on the lead screw 18. The slider 19 moves along the installation groove 17, and the slider 19 is connected to the moving disk 3 to complete the operation.

[0056] During operation, by controlling the second drive motor 20 to work, the screw rod 18 is driven to rotate, so that the slider 19 moves along the mounting groove 17, thereby driving the movable plate 3 to move horizontally along the base 1, and moving the corresponding cleaning cylinder 21 to the position directly below the flower basket 7; by controlling the movement of the movable plate 3, all the cleaning cylinders 21 on the movable plate 3 are driven to move, so that the semiconductor chips are transferred to different cleaning cylinders 21 by moving the cleaning cylinders 21;

[0057] Please refer to Figure 6 and Figure 7 , a rotating mechanism for simultaneously controlling the rotation of the four connecting shafts 10 is provided on the connecting frame 8; the rotating mechanism includes a first drive motor 9, a connecting shaft 10, a lifting assembly 11, an elastic support member 12, a rotating shaft 26, a driving bevel gear 27 and a driven bevel gear 28;

[0058] The connecting frame 8 is a hollow structure. A first drive motor 9 is provided on one side of the connecting frame 8. The output end of the first drive motor 9 is connected to the rotating shaft 26. The rotating shaft 26 is located in the inner cavity of the connecting frame 8 and is rotatably connected to the connecting frame 8. Four driving bevel gears 27 are sleeved on the rotating shaft 26. The driving bevel gears 27 are meshed and connected with the driven bevel gears 28. The driven bevel gears 28 are connected to the top of the connecting shaft 10. The connecting shaft 10 is rotatably connected to the bottom surface of the connecting frame 8.

[0059] During operation, the first drive motor 9 is controlled to operate, driving the rotating shaft 26 to rotate, causing the four active bevel gears 27 on the rotating shaft 26 to rotate simultaneously. Through the meshing action of the active bevel gear 27 and the driven bevel gear 28, the four connecting shafts 10 are rotated simultaneously, driving the four flower baskets 7 to rotate simultaneously, thereby achieving rotary cleaning of the semiconductor chips in the four flower baskets 7, so that the semiconductor cores can be fully contacted with the cleaning solvent, reducing the time for each cleaning step, thereby shortening the cleaning time of the entire semiconductor chip as a whole, and the rotary cleaning will also clean the semiconductor chips more thoroughly and thoroughly.

[0060] A lifting assembly 11 and an elastic support member 12 are provided between the connecting frame 8 and the bracket 2. The lifting assembly 11 is located in the middle of the bracket 2, and the elastic support member 12 is located on both sides of the lifting assembly 11.

[0061] Among them, the lifting assembly 11 includes a screw 29, a fixed cylinder 30, a moving block 31, and a lifting column 32; the fixed cylinder 30 is installed on the middle part of the bottom surface of the connecting frame 8, and a screw 29 is provided in the fixed cylinder 30. The top of the screw 29 extends to the inner cavity of the connecting frame 8 and is transmission-connected to the rotating shaft 26 through the driving bevel gear 27 and the driven bevel gear 28; rectangular slides are provided on both sides of the fixed cylinder 30, and a moving block 31 is sleeved on the screw 29. The two sides of the moving block 31 pass through the rectangular slides and are slidably connected to the fixed cylinder 30. A lifting column 32 is vertically provided on the moving block 31;

[0062] During use, the rotating shaft 26 drives the screw rod 29 to rotate through the driving bevel gear 27 and the driven bevel gear 28, causing the moving block 31 to move up and down along the fixed cylinder 30. The moving block 31 acts on the top surface of the support 2 through the lifting column 32, thereby causing the connecting frame 8 to move up and down. The flower basket 7 connected thereto will also achieve up and down movement. Through this lifting assembly 11, the flower basket 7 performs up and down movement, enabling the flower basket 7 to achieve automatic immersion cleaning and be transferred to other tanks after cleaning;

[0063] Among them, the elastic support member 12 includes a support cylinder 22, a spring 23, a piston plate 24, and a support column 25; the support cylinder 22 is installed on the support 2. A spring 23 is arranged inside the support cylinder 22. The top of the spring 23 is connected to a piston plate 24. The piston plate 24 is slidably connected to the inner wall of the support cylinder 22. A support column 25 is vertically arranged on the top surface of the piston plate 24. The support column 25 passes through the support cylinder 22 and is connected to the connecting frame 8;

[0064] During use, the elastic support member 12 plays a role in elastic expansion and contraction and supporting the connecting frame 8. During the cleaning process, it also deforms along with the lifting assembly 11 and cooperates with the rotating mechanism on the support 2 to complete the cleaning work of the semiconductor chip.

[0065] The working principle of the present invention: The cleaning method of the present invention improves the traditional method of protecting the front metal by laminating film, which requires degumming cleaning before evaporation coating and protecting the front metal. Trichloroethylene can clean the residual glue on the chip cleanly, and the glue can be removed cleanly after two treatments with trichloroethylene. At the same time, the front metal will not be affected in the organic solvent; after cleaning with trichloroethylene, although the residual glue will be removed cleanly, there will be organic solvents that cannot be removed by deionized water remaining on both the front and back sides. To remove the trichloroethylene solvent, methanol solvent is used to continue rinsing the residual trichloroethylene, and after rinsing, deionized water is used to clean and remove particles and residual solvents;

[0066] The working principle of the semiconductor cleaning equipment is: The semiconductor chip to be cleaned is loaded into the flower basket 7, and at the same time, the corresponding cleaning solvent is poured into the cleaning tank 21;

[0067] Control the first driving motor 9 to work, drive the rotating shaft 26 to rotate, so that the four driving bevel gears 27 on the rotating shaft 26 rotate simultaneously. Through the meshing action of the driving bevel gear 27 and the driven bevel gear 28, the four connecting shafts 10 rotate simultaneously, driving the four flower baskets 7 to rotate simultaneously. At the same time, the rotating shaft 26 drives the screw rod 29 to rotate through the driving bevel gear 27 and the driven bevel gear 28, causing the moving block 31 to move upward along the fixed cylinder 30, causing the connecting frame 8 to move downward, and the flower basket 7 connected thereto will also move into the corresponding cleaning tank 21, cooperating with the rotating cleaning tank 21 to perform rotary cleaning on the semiconductor chip;

[0068] When the moving block 31 moves from the bottom of the fixed cylinder 30 to the top of the fixed cylinder 30, and then by controlling the reverse rotation of the first driving motor 9, the moving block 31 moves from the top of the fixed cylinder 30 to the bottom of the fixed cylinder 30, the cleaning stage in a certain cleaning cylinder 21 is completed;

[0069] Wherein, during the process of lifting the solvent by the flower basket 7, the rotating mechanism drives the flower basket 7 to rotate, and the flower basket 7 can be quickly dried;

[0070] When a cleaning cycle is completed, the first driving motor 9 is turned off, and the second driving motor 20 is started to work, driving the lead screw 18 to rotate, so that the slider 19 moves along the installation groove 17, thereby driving the moving disk 3 to move horizontally along the base 1, moving the next cleaning cylinder 21 to directly below the flower basket 7, and repeating the work of ascending and cleaning, so as to sequentially complete two trichloroethylene cleanings, two ethanol cleanings and one deionized water cleaning of the semiconductor chip.

[0071] The above has described an embodiment of the present invention in detail, but the content described is only the preferred embodiment of the present invention and cannot be considered as used to limit the scope of implementation of the present invention. All equivalent changes and improvements made according to the scope of the application of the present invention should still fall within the scope covered by the patent of the present invention.

Claims

1. A method for degumming and cleaning Al products before coating, characterized in that, Including the following steps: Step 1: Place the semiconductor chip to be washed into an organic tank filled with trichloroethylene for cleaning; then, transfer it to the next organic tank filled with trichloroethylene for cleaning; Step 2: Transfer the semiconductor chip after trichloroethylene cleaning to an organic tank filled with ethanol for cleaning, and then transfer it to the next organic tank filled with ethanol for cleaning; Step 3: Place the semiconductor chip into an ion water tank for cleaning; The cleaning methods in Step 1 and Step 2 are as follows: Control the first drive motor (9) to work, drive the rotating shaft (26) to rotate, through the four bevel gears of the rotating shaft (26), make the four connecting shafts (10) rotate simultaneously, drive the four flower baskets (7) to rotate simultaneously, and perform rotary cleaning on the semiconductor chip; While the rotating shaft (26) is rotating, drive the screw rod (29) to rotate through the bevel gear located in the middle, make the moving block (31) move upward along the fixed cylinder (30), and make the flower basket (7) connected to the connecting frame (8) move downward into the corresponding cleaning cylinder (21) for cleaning; When the moving block (31) moves from the bottom of the fixed cylinder (30) to the top of the fixed cylinder (30), and then makes the moving block (31) move from the top of the fixed cylinder (30) to the bottom of the fixed cylinder (30), it is a cleaning cycle in the corresponding organic tank; When a cleaning cycle is completed, control the moving disk (3) to move, move the next organic tank to directly below the flower basket (7) for rotary cleaning, and sequentially complete two trichloroethylene cleanings, two ethanol cleanings, and one deionized water cleaning of the semiconductor chip.

2. The method for degumming and cleaning Al products before coating according to claim 1, characterized in that, In Step 1, Step 2, and Step 3, during the cleaning process of the semiconductor chip, use the flower basket (7) as a carrier, and the flower basket (7) is made of Teflon.

3. A method for degumming and cleaning Al products before coating according to claim 2, characterized in that In Step 1 and Step 2, the cleaning time of the semiconductor in the organic tank is 10 minutes. When taking it out, place the flower basket (7) containing the semiconductor above the organic tank and park it for 5S.

4. A method for degumming and cleaning Al products before coating according to claim 1, characterized in that, Before Step 1, prepare the organic cleaning solution: First, rinse the utensils with deionized water, soak them for one day and then dry them; then pour the organic solvent into the organic tank.

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