A method for increasing the power supply area of a circuit board

Abstract

The present invention discloses a method for increasing the power supply area of a circuit board. The method includes the steps of: drilling holes for anti-pads on the copper foil and simultaneously drilling positioning holes; pasting ABF glue on the rough surface of the copper foil; coating anti-high-temperature glue liquid on the four sides of the upper surface of the copper foil with the ABF glue pasted, and covering an aluminum sheet on the surface of the copper foil after coating; laminating the copper foil with a prepreg to form a copper-clad laminate, and removing the aluminum sheet after lamination; etching the copper-clad laminate according to the exposure and development of the positioning holes, and simultaneously manufacturing other inner layer patterns; browning the copper-clad laminate and laminating it with a prepreg to form a circuit board. The present invention uses a drilling method to drill holes for anti-pads on the copper foil, and the side cut surface of the drilling is vertical. The drilling method can avoid the problem of side etching, increase the power supply area, and the single-layer current can be increased by 24%.

Description

Technical Field

[0001] The present invention relates to a method for increasing the power supply area of a circuit board, belonging to the technical field of PCB vias. Background Art

[0002] At present, due to the side etching problem, the actual power supply area of the circuit board is about 1 / 3 less than the designed power supply area for the anti-pad on the power layer. There will be a difference in current between the actual and the designed values, and this difference needs to be compensated by increasing the copper foil thickness, while the increase in copper foil thickness means an increase in cost. Summary of the Invention

[0003] The purpose of the present invention is to provide a method for increasing the power supply area of a circuit board to solve the defect that in the prior art, due to the side etching problem, the actual power supply area of the circuit board is about 1 / 3 less than the designed power supply area, resulting in a difference in current between the actual and the designed values.

[0004] A method for increasing the power supply area of a circuit board, the method comprising the steps of:

[0005] Drill holes for the anti-pad on the copper foil, and at the same time drill positioning holes;

[0006] Attach ABF adhesive on the rough surface of the copper foil;

[0007] Coat the four sides of the upper surface of the copper foil with the ABF adhesive-attached copper foil with a high-temperature resistant adhesive liquid. After coating, cover the copper foil surface with an aluminum sheet;

[0008] Press the copper foil and the prepreg into a copper-clad laminate, and remove the aluminum sheet after pressing;

[0009] The copper-clad laminate is etched according to the exposure and development of the positioning holes, and other inner layer patterns are made simultaneously;

[0010] Brown the copper-clad laminate and press it with the prepreg into a circuit board.

[0011] Further, the method of attaching ABF adhesive on the rough surface of the copper foil includes: first etching the copper foil, and then attaching ABF adhesive on the rough surface of the copper foil.

[0012] Further, the thickness of the ABF adhesive is 2 - 5um.

[0013] Further, the ABF adhesive is attached in a roll-to-roll manner.

[0014] Further, the drilling is performed by the CCD method.

[0015] Further, the coating thickness of the high-temperature resistant adhesive liquid is 0.5mm.

[0016] Compared with the prior art, the beneficial effects achieved by the present invention are as follows: The present invention uses a drilling method to drill anti-pads on the copper foil. The side cut surface of the drilling is perpendicular. The drilling method can avoid the problem of side etching, increase the power supply area, and the single-layer current can be increased by 24%. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of drilling the anti-pad position on the copper foil of the present invention;

[0018] Figure 2 It is a schematic diagram of pasting ABF glue of the present invention;

[0019] Figure 3 It is a schematic diagram of coating high-temperature resistant glue liquid of the present invention;

[0020] Figure 4 It is a schematic diagram of the copper clad laminate of the present invention;

[0021] Figure 5 It is a schematic diagram of exposure, development and etching of the copper clad laminate of the present invention;

[0022] Figure 6 It is a schematic diagram of exposure, development and etching of the inner layer pattern of the present invention;

[0023] Figure 7 It is a schematic diagram of the circuit board of the present invention;

[0024] Figure 8 It is a schematic diagram of the anti-pad of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0025] In order to make the technical means, creative features, achieved purposes and effects of the present invention easy to understand, the present invention will be further described below in conjunction with specific embodiments.

[0026] Embodiment 1

[0027] As Figures 1-7 shown, a method for increasing the power supply area of a circuit board is disclosed. The method includes the following steps:

[0028] Step 1, as Figure 1 shown, use the CCD method to drill the anti-pad position on the copper foil by mechanical drilling, and drill positioning holes at the same time;

[0029] Step 2, as Figure 2 shown, after etching, paste ABF glue on the rough surface of the copper foil in a roll-to-roll manner and cut it into sheets of the designed size, wherein the thickness of the ABF glue is 2-5 um;

[0030] Step 3, as Figure 3As shown, apply a high-temperature resistant adhesive liquid to the four sides of the upper surface of the copper foil with the ABF adhesive pasted, with a span of 0.5 mm. After application, cover the copper foil surface with an aluminum sheet.

[0031] Step Four, as Figure 4 shown, press the copper foil in Step 3 and the prepreg required by the design to form a copper-clad laminate. After pressing, remove the aluminum sheet.

[0032] Step Five, etch the copper-clad laminate in Step 4 according to the exposure, development, and etching of the positioning holes, but expose all positions of the antipad and do not etch.

[0033] Step Six, fabricate other inner layer patterns simultaneously with Step Five.

[0034] Step Seven, brown the copper-clad laminates in Step 5 and Step 6 and then press them with prepregs to form a printed circuit board.

[0035] Other steps are the same as the PCB processing flow. Drill holes, perform PTH electroplating on holes, process outer layer patterns, print green solder mask, etc.

[0036] Embodiment 2

[0037] Disclosed is a method for increasing the power area of a printed circuit board. The method includes the following steps:

[0038] Step One, as Figure 5 shown, drill holes at the positions of the anti-pads on the copper foil by means of mechanical drilling in the CCD manner, and drill positioning holes at the same time.

[0039] Step Two, as Figure 6 shown, after etching, paste ABF adhesive on the rough surface of the copper foil in a roll-to-roll manner and cut it into sheet bodies of the designed size.

[0040] Step Three, as Figure 7 shown, paste the copper foil in Step 2 on the bare board of the copper-clad laminate without copper foil.

[0041] Step Four, paste dry film on the copper-clad laminate in Step Three according to the positions of the positioning holes, expose, develop, and etch, but expose all positions of the anti-pads and do not etch.

[0042] Step Five, fabricate other inner layer patterns simultaneously with Step Four.

[0043] Step Six, brown the copper-clad laminates in Step Four and Step Five and then press them with prepregs to form a printed circuit board.

[0044] The above are only the preferred embodiments of the present invention. It should be noted that for those of ordinary skill in the art, without departing from the technical principle of the present invention, several improvements and modifications can be made, and these improvements and modifications should also be regarded as the protection scope of the present invention.

Claims

1. A method for increasing the power supply area of a circuit board, characterized in that, The method includes the steps of: Drill holes for anti-pads on the copper foil, with the side cut surface of the holes being vertical, and at the same time drill positioning holes; Attach ABF glue to the rough surface of the copper foil; Coat the four sides of the upper surface of the copper foil with the ABF glue attached with high-temperature resistant glue liquid, and cover the copper foil surface with an aluminum sheet after coating; Press the copper foil and the prepreg to form a copper clad laminate, and remove the aluminum sheet after pressing; The copper clad laminate is etched according to the exposure and development of the positioning holes, and other inner layer patterns are made simultaneously; Brown the copper clad laminate and press it with the prepreg to form a circuit board.

2. The method for increasing the power supply area of a circuit board according to claim 1, characterized in that, The method of attaching ABF glue to the rough surface of the copper foil includes: first etching the copper foil, and then attaching ABF glue to the rough surface of the copper foil.

3. The method for increasing the power supply area of a circuit board according to claim 2, characterized in that, The thickness of the ABF glue is 2 - 5um.

4. The method for increasing the power supply area of a circuit board according to claim 2, characterized in that, The ABF glue is attached in a roll-to-roll manner.

5. The method for increasing the power supply area of a circuit board according to claim 4, characterized in that, The holes are drilled by the CCD method.

6. The method for increasing the power supply area of a circuit board according to claim 1, characterized in that, The coating thickness of the high-temperature resistant glue liquid is 0.5mm.

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