Chip buffer

Abstract

A wafer bumper for use in a wafer carrier includes a resilient beam including: a first arm extending from a frame of the wafer bumper in a first direction; and a second arm extending from the first arm in a second direction; and a wafer contact located at an end of the second arm opposite to where the second arm is joined to the first arm. During normal conditions, the wafer bumper may contact a substrate within the wafer carrier only at the wafer contact. The substrate may also contact a secondary contact point on the second arm when an impact event occurs. The wafer contact may be a v-groove wafer contact. The wafer contact may include a contact surface having a convex surface, the contact surface being configured to contact the substrate at the convex surface.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to and the benefit of U.S. Provisional Application No. 62 / 876,234, filed on July 19, 2019, the entire contents of which are incorporated herein by reference for all purposes. Technical Field

[0003] The present disclosure relates to wafer carriers, for example, wafer buffers used in wafer carriers used in semiconductor processing, such as front opening pods ("FOUPs"). Background Art

[0004] Wafer carriers may be handled or transported manually or automatically. Such transport and handling may cause physical impact to the carrier. For example, such impact events include sudden acceleration or deceleration of the carrier, for example due to falling, mishandling, braking of the transport vehicle, and other such movement of the wafer carrier, or a speed of greater than about 2 m / s. 2 Wafer bumpers are used in wafer carriers to limit the movement of wafers (e.g., semiconductor substrates) within the carrier, for example, to prevent the wafers from hitting one side of the carrier when a physical impact occurs.

[0005] The wafer bumper typically includes arms that extend from the frame to the centerline of the door and terminate at contact points where the wafer contacts the wafer bumper. The contact at these contact points prevents the wafer from hitting other wafers or parts inside the wafer carrier, thereby reducing the chance of damage when the wafer carrier experiences an impact event.

[0006] The wafer buffer must provide force to the wafer contained within the wafer carrier to provide retention and maintain the retention force within a predetermined range to prevent damage to the wafer or generation of particles that could adversely affect semiconductor processing and manufacturing. Summary of the invention

[0007] The present disclosure relates to wafer carriers, for example, wafer buffers used in wafer carriers (eg, FOUPs) used in semiconductor processing.

[0008] By using a v-shaped spring, the moment arm between the contact with the wafer and the frame of the wafer buffer is reduced. Shortening this moment arm can reduce the torsional force on the wafer buffer, reduce the non-uniformity of deflection and reduce the imbalance of the holding force of the wafer buffer.

[0009] In an embodiment, a wafer buffer includes a frame and a plurality of elastic beams. Each of the plurality of elastic beams includes: a first arm coupled to the frame and extending to a first arm end in a first direction; a second arm coupled to the first arm at the first arm end and extending to a second arm end in a second direction different from the first direction; and a wafer contact coupled to the second arm at the second arm end.

[0010] In an embodiment, the plurality of spring beams are configured such that when a wafer is supported by both of the plurality of spring beams, the wafer contacts the wafer contact only at the ends of the second arms of both of the plurality of spring beams.

[0011] In an embodiment, the wafer contact is a V-groove wafer contact. In an embodiment, the wafer contact is a paddle-shaped wafer contact.

[0012] In an embodiment, a surface of the wafer contact configured to contact a wafer has a convex surface.

[0013] In an embodiment, the first arm is coupled to the frame at a periphery of the frame and the first direction is towards a centerline of the frame.

[0014] In an embodiment, each of the spring beams includes a secondary contact point on the second arm, the secondary contact point being positioned where the second arm joins to the first arm, and wherein the secondary wafer contact is configured to contact the wafer only when an impact event occurs.

[0015] In an embodiment, a wafer carrier includes a wafer buffer, and the wafer buffer includes a frame and a plurality of elastic beams. Each of the plurality of elastic beams includes: a first arm coupled to the frame and extending to a first arm end in a first direction; a second arm coupled to the first arm at the first arm end and extending to a second arm end in a second direction different from the first direction; and a wafer contact coupled to the second arm at the second arm end.

[0016] In an embodiment, the wafer buffer is mounted on a door of the wafer carrier.

[0017] In an embodiment, the wafer carrier is a front-opening pod.

[0018] In an embodiment, a method of supporting a substrate includes contacting the substrate at two chip contacts, wherein each of the two chip contacts is coupled to a separate spring beam, each of the spring beams includes a first arm extending in a first direction and a second arm coupled to the first arm and extending in a second direction different from the first direction, and the chip contact is located at an end of the second arm opposite to where the second arm is coupled to the first arm.

[0019] In an embodiment, the method further comprises contacting the substrate at two secondary contact points on a second arm of the v-spring on which the wafer contact is positioned when a shock event occurs.

[0020] In an embodiment, the substrate contacts the spring beams only at the two wafer contacts.

[0021] In an embodiment, the wafer contact has a convex surface, the wafer contact being configured to contact the substrate at the convex surface. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] A more complete understanding of the present disclosure may be obtained from the following description of various illustrative embodiments considered in conjunction with the accompanying drawings.

[0023] Figure 1 A perspective view showing a wafer buffer according to an embodiment.

[0024] Figure 2 A cross-sectional view of a wafer buffer according to an embodiment is shown.

[0025] Figure 3 A cross-sectional view showing a portion of a wafer buffer when a substrate comes into contact with the wafer buffer according to an embodiment.

[0026] Figure 4A A perspective view is shown of a wafer contact according to an embodiment.

[0027] Figure 4B Display of the achievements along Route 4A-4A Figure 4A Cross-sectional view of a wafer contact.

[0028] Figure 5 A plan view of a wafer contact according to an embodiment is shown.

[0029] Figure 6 A FOUP according to an embodiment is shown.

[0030] Although the present disclosure may have various modifications and alternative forms, the details thereof have been shown in the drawings by way of example and will be described in detail. However, it should be understood that the aspects of the present disclosure are not intended to be limited to the specific illustrative embodiments described. On the contrary, it is intended to cover all modifications, equivalents, and alternatives that fall within the spirit and scope of the present disclosure. DETAILED DESCRIPTION

[0031] As used in this specification and the appended claims, the singular form "a, and" includes plural referents unless the content clearly dictates otherwise. As used in this specification and the appended claims, the term "or" is generally employed in its sense including "and / or" unless the content clearly dictates otherwise.

[0032] The term "about" generally refers to a range of numbers that are considered equivalent to the stated value (eg, having the same function or result). In many cases, the term "about" may include numbers that are rounded to the nearest significant figure.

[0033] The use of numerical ranges using endpoints includes all numbers subsumed within that range (eg, 1 to 5 includes 1, 1.5, 2, 2.75, 3, 3.80, 4, and 5).

[0034] The following detailed description should be read with reference to the drawings, wherein similar elements in different drawings are numbered identically. The detailed description and the drawings, which are not necessarily to scale, depict illustrative embodiments and are not intended to limit the scope of the invention. The illustrative embodiments depicted are intended to be exemplary only. Unless expressly stated to the contrary, selected features of any illustrative embodiment may be incorporated into additional embodiments.

[0035] Figure 1 A perspective view of a wafer buffer 100 according to an embodiment is shown. The wafer buffer 100 is a component that can be incorporated into a wafer carrier (not shown), for example, bonded to a portion of the wafer carrier that faces the interior space of the wafer carrier, such as, for example, the inside of a door of the wafer carrier. The wafer buffer 100 may include features (not shown) that allow for bonding to a wafer carrier, such as, by way of non-limiting example, one or more mechanical engagement features, such as snaps, flanges, tabs or grooves, adhesive bonding, or other such features to bond the wafer buffer 100 to a wafer carrier or a portion of a wafer carrier, such as a door of the wafer carrier. The wafer buffer 100 may mechanically retain a substrate within the wafer carrier by, for example, contacting the substrate at a wafer contact 110. The wafer buffer 100 may use a spring force to limit movement of the substrate, such that significant displacement of the substrate or contact of the substrate with a wall of the interior space of the wafer carrier is prevented.

[0036] The wafer buffer 100 includes a frame 102. A plurality of elastic beams 104 are coupled to the frame 102. Each of the elastic beams 104 includes a first arm 106 coupled to the frame 102 and extending in a first direction, and a second arm 108 coupled to the first arm 106 at an end of the first arm 106 opposite to where the first arm 106 is coupled to the frame 102. The second arm 108 extends from where it is coupled to the first arm 106 in a second direction different from the first direction in which the first arm 106 extends from the frame 102. Each of the elastic beams 104 includes a wafer contact 110 located at an end of the second arm 108 opposite to where the second arm 108 is coupled to the first arm 106.

[0037] The frame 102 provides support and positioning for the spring beams 104, which include wafer contact points 110. In an embodiment, the frame 102 is rectangular in shape, with a centerline 112 extending along a primary direction of the frame 102. In an embodiment, the frame 102 includes an outer portion forming the perimeter of the rectangle and a rib extending from one end of the frame 102 to the other end along the centerline 112. In an embodiment, the frame 102 is configured to fit within a recess on a door of a wafer carrier (not shown). In an embodiment, features of the wafer buffer 100 configured to couple the wafer buffer 100 to a wafer carrier or a portion thereof may be positioned on the frame 102. The frame 102 may have other shapes such that the wafer carrier 100 may be accommodated within the interior space of the wafer carrier and such that the spring beams 104 may be coupled thereto such that the spring beams 104 provide wafer contacts 110 such that the wafer contacts 110 may engage a substrate within the wafer carrier.

[0038] Each of the spring beams 104 is coupled to the frame 102. Each of the spring beams 104 includes a wafer contact 110. As non-limiting examples, the spring beams 104 may be spring plates, cantilever linear bending springs, or v-shaped springs. The spring beams 104 may be arranged in pairs, wherein each pair is configured to contact a substrate via the wafer contacts 110 of the pair of spring beams 104 when the substrate is placed inside the wafer carrier. The spring beams 104 may all be arranged so that when the wafer buffer 100 is mounted into the wafer carrier, the spring beams 104 present the wafer contacts 110 on the same side of the frame 102 relative to the interior space of the wafer carrier, for example, extending into the exterior space of the wafer carrier. Relative to the frame 102, the spring beams 104 may be aligned with each other relative to the centerline 112 of the frame 102, so that when a substrate is placed in the wafer carrier to which the wafer buffer 100 is mounted, the spring beams 104 together provide two wafer contacts 110 positioned to contact the substrate.

[0039] The first arm 106 is coupled to the frame 102 at a first end and coupled to the second arm 108 at a second end opposite the first end. In an embodiment, the first arm 106 extends inwardly relative to the frame 102 from a perimeter of the frame 102 toward a centerline 112 of the frame 102. In an embodiment, the first arm 106 tapers as it extends from the frame 102 to the centerline 112 of the frame 102.

[0040] The second arm 108 is coupled to the first arm 106. The second arm 108 may be coupled to the first arm 106 at an end of the first arm 106 opposite to where the first arm 106 is coupled to the frame 102. The second arm 108 may extend in a second direction different from the first direction in which the first arm 106 extends. The second arm 108 may extend in a direction opposite to the direction in which the first arm 106 extends relative to the perimeter of the frame 102 and the centerline 112 of the frame 102. For example, in an embodiment where the first arm 106 extends inward from the perimeter of the frame 102 toward the centerline 112, the second arm 108 may extend in an opposite direction away from the centerline 112.

[0041] The second arm 108 may be coupled to the first arm 106 such that an angle is formed between the first arm 106 and the second arm 108. In an embodiment, the angle between the first arm 106 and the frame 102 is in a range from 0° to 40°. In an embodiment, the angle between the first arm 106 and the second arm 108 is in a range from 5° to 40°. In an embodiment, the ratio of the length of the second arm 108 to the length of the first arm 106 may be in a range from 2:1 to 1:3. In an embodiment, the second arm 108 may have a length of at least half the length of the first arm 106. In an embodiment where the wafer buffer 100 is configured for a 300 mm FOUP, the first arm 106 may have a length in a range from 15 mm to 45 mm. In an embodiment where the wafer buffer 100 is positioned in a recess within a wafer carrier, the lengths and angles of the first arm 106 and the second arm 108 may be such that the wafer contact 110 is positioned within the recess in the wafer carrier.

[0042] The wafer contact 110 is positioned at an end of the second arm 108 opposite to where the second arm 108 is joined to the first arm 106. The wafer contact 110 is a feature configured to engage the substrate when the substrate is within a wafer container. The wafer contact 110 may include a surface configured to contact an edge of the substrate. In an embodiment, the surface configured to contact the edge of the substrate may be curved, having a convex shape. The convex shape may provide a rolling interface between the wafer contact 110 and the substrate, and may limit the generation of particles by contact between the substrate and an edge or point along the surface. In an embodiment, the wafer contact 110 is a v-groove wafer contact, which includes ears extending away from each other, wherein a surface is configured to contact the edge of the substrate at or near the apex of the V-shape formed by the ears as they extend away from each other. This wafer contact is Figure 4A1 and described below. In an embodiment, the wafer contact 110 is a paddle-type wafer contact having a widened portion and two ears extending from the widened portion and parallel to each other. When the wafer contact 110 is a paddle-type wafer contact, the surface is configured to contact a substrate positioned between the ears. Figure 5 In an embodiment, the wafer contact 110 is the only feature configured to contact a substrate contained in the wafer buffer 100. In an embodiment, other than the wafer contact 110 positioned at the end of the second arm 108 opposite to where the second arm 108 joins to the first arm 106, no other wafer contacts are provided.

[0043] In an embodiment, each of the frame 102, the spring beam 104, and the wafer contact 110 may each be made of one or more polymers, such as injection moldable polymers. In an embodiment, the one or more polymers include one or more polyolefins. In an embodiment, the one or more polymers include polycarbonate. In an embodiment, a carbon filler is included in the one or more polymers. In an embodiment, the one or more polymers are thermoplastic polymers. In an embodiment, the one or more polymers are selected based on the material removed at one or more of the interfaces between the wafer buffer 100 and the wafer carrier or the interface between the wafer buffer 100 and the substrate. In an embodiment, the wafer buffer 100 is formed as a single piece, for example, by a method such as injection molding as a non-limiting example. In an embodiment, the entire wafer buffer 100 is formed of the same material or combination of materials.

[0044] Figure 2 A cross-sectional view of a wafer buffer 200 according to an embodiment is shown. The frame 202 includes a groove 204 for receiving a protrusion from a wafer carrier. The spring beam 206 includes a first arm 208 extending from the frame 202 in a first direction to an end where the first arm 208 is joined to a second arm 210. The second arm 210 extends from where it is joined to a wafer contact 212 in a second direction.

[0045] The frame 202 includes an outer portion 214 that defines a perimeter of the frame 202. Vertical protrusions 216 may be included within the frame 202, for example, to increase rigidity of the frame 202, assist in alignment of the frame 202 within a wafer carrier, interface with features of a wafer carrier, or perform other functions within the wafer carrier.

[0046] The groove 204 can receive one or more retaining features of a wafer carrier (not shown) into which the wafer buffer 200 is mounted to align with the frame within the wafer carrier. In a non-limiting embodiment, the retaining features of the wafer carrier can include flanges (not shown) that can snap into openings (not shown) through the frame 202 along the groove 204 to provide a snap fit between the frame 202 and the wafer carrier.

[0047] exist Figure 2 In the embodiment shown in FIG. 2 , the spring beams 206 are positioned on each side of the frame 202, coupled to the outer portion 214. The first arm 208 extends inwardly from the outer portion 214 of the frame 202 toward the centerline of the frame 202.

[0048] The second arm 210 is coupled to the first arm 208 at an end of the first arm 208 opposite to where it is coupled to the frame 202. The second arm 210 extends from where it is coupled to the first arm 208 in a second direction different from the direction in which the first arm 208 extends. The second direction may be opposite to the first direction relative to the perimeter and the centerline of the frame 202. In an embodiment, the second arm 210 may be coupled to the first arm 208 such that an angle is formed between the first arm 208 and the second arm 210. The second arm 210 may be coupled to the first arm 208 such that an angle is formed between the first arm 208 and the second arm 210. In an embodiment, the angle between the first arm 208 and the frame 202 is in a range from 0° to 40°. In an embodiment, the angle between the first arm 208 and the second arm 210 is in a range from 5° to 40°. In an embodiment, the ratio of the length of the second arm 210 to the length of the first arm 208 may be in a range from 2:1 to 1:3. In an embodiment, the second arm 210 may have a length of at least half the length of the first arm 208. In embodiments where the wafer buffer 200 is configured for use in a 300 mm FOUP, the first arm 208 may have a length in the range from 25 mm to 45 mm. In embodiments where the wafer buffer 200 is positioned in a recess within a wafer carrier, the lengths and angles of the first and second arms 208, 210 may be such that the wafer contact 220 is positioned within the recess in the wafer carrier.

[0049] like Figure 2, the second arm 210 may be curved as it extends from the first arm 208 to the wafer contact 212. The second arm 210 curves away from the first arm 208 in an upward direction to the wafer contact 212. The curvature of the second arm 210 may be such that when the substrate contacts the wafer contact 212, the portion of the wafer contact 212 that is closest to the substrate is the secondary contact point 218 located at or near where the second arm 210 joins the first arm 208. The secondary contact point 218 may contact the wafer under certain conditions such as an impact event. As non-limiting examples, such impact events may include sudden acceleration or deceleration of the carrier, for example due to a fall, mishandling, braking of a transport vehicle, and other such movement of the wafer carrier to supplement the holding force. In an embodiment, the secondary contact point 218 may also contact the wafer when the wafer is oversized for the wafer carrier, for example, when a 301 mm or larger wafer is placed in a 300 mm FOUP.

[0050] The wafer contact 212 is coupled to the second arm 210 at an end of the second arm 210 opposite to where the second arm 210 is coupled to the first arm 208. The wafer contact 212 is a feature configured to engage the substrate when the substrate is within a wafer container. The wafer contact 212 may include a surface configured to contact an edge of the substrate. In an embodiment, the surface configured to contact the edge of the substrate may be curved, having a convex shape. The convex shape may provide a rolling interface between the wafer contact 212 and the substrate. The rolling interface may reduce particle generation through contact between the substrate and an edge or point along the surface. In an embodiment, the wafer contact 212 is a v-groove wafer contact, which includes ears extending away from each other, wherein the surface is configured to contact the edge of the substrate at or near the apex of the V-shape formed by the ears as they extend away from each other. This wafer contact is Figure 4A 2 and described below. In an embodiment, the wafer contact 212 is a paddle-type wafer contact having a widened portion and two ears extending from the widened portion and parallel to each other. When the wafer contact 212 is a paddle-type wafer contact, the surface is configured to contact the substrate between the ears. Figure 5 are shown in and described below.

[0051] Figure 3 A cross-sectional view of a spring beam 300 is shown when a substrate 302 contacts a wafer bumper including the spring beam 300 according to an embodiment. The spring beam 300 includes a first arm 304, a second arm 306, and a wafer contact 308.

[0052] As a non-limiting example, substrate 302 is a substrate used in semiconductor manufacturing. Substrate 302 may be placed in a wafer carrier including a wafer buffer for transport or handling, such as during semiconductor manufacturing using the substrate.

[0053] The first arm 304 is coupled to a frame such as the frame 102 or the frame 202, or is integrally formed with or directly coupled to a portion of a wafer carrier such as a FOUP. The first arm 304 extends in a first direction from where it is coupled to a frame or surface of the wafer carrier to a first arm end 304 where it is coupled to a second arm 306.

[0054] The second arm 306 extends from the first arm 304 to the wafer contact 308. Figure 3 304, the second arm 306 bends as it extends from the end where it is joined to the first arm 304 to the end that includes the wafer contact 308. This bending may result in a secondary contact point 310 being located at or near where the second arm 306 is joined to the first arm 304, i.e., the point on the second arm 306 that is closest to the substrate 302. The secondary contact point 310 may contact the wafer under certain conditions, such as an impact event. As non-limiting examples, such impact events may include sudden acceleration or deceleration of the carrier, such as due to a fall, mishandling, braking of a transport vehicle, and other such movement of the wafer carrier. When the secondary contact point 310 and the wafer contact 308 contact the substrate 302, the spring beam 300 provides additional holding force to the substrate 302.

[0055] The wafer contact 308 is where the spring beam 300 contacts the substrate 302. For example, Figure 3 As shown in , the wafer contact 308 may include a v-groove wafer contact, wherein the substrate 302 is held between two ears forming a V-shape. Figure 3 , one of the ears (ear 312) is visible, partially obscured by the substrate 302 in contact with the ear 312. The surface of the wafer contact 308 that contacts the substrate 302 may have a convex surface that curves and bends outward toward the substrate 302. The convex surface may allow the contact with the substrate 302 to be a rolling type contact and reduce points that increase stress or particle generation caused by the contact between the substrate 302 and the wafer contact 308.

[0056] like Figure 3, the substrate 302 contacts only the wafer contact 308 of the spring beam in normal conditions. For example, during a shock event, when the acceleration of the substrate relative to the wafer carrier exceeds a threshold, the displacement of the substrate 302 and the deflection of the second arm of the spring beam during the shock event may allow the substrate 302 to contact the secondary contact point 310 of the spring beam 300. Shock events may be defined according to the specific application and handling process of the wafer carrier. In a non-limiting embodiment, a shock event may be caused by an acceleration of the wafer carrier greater than about 2 m / s. 2 In some embodiments, the spring beam 300 may be configured so that only the wafer contact 308 contacts the substrate 302 under all conditions, including shock events as well as normal handling of the wafer carrier. In embodiments, for example, when the substrate 302 is oversized relative to the wafer carrier, for example, when the substrate 302 is a 301 mm or larger wafer and the wafer carrier including the spring beam 300 is a 300 mm FOUP, the secondary contact point 310 may also be contacted.

[0057] Figure 4A is a perspective view of a wafer contact 400 according to an embodiment. Figure 4B yes Figure 4A A cross-sectional view of the wafer contact 400 is shown in FIG. Figure 4A and 4B In the embodiment shown in FIG. 4 , the wafer contact 400 is a V-groove wafer contact. The wafer contact 400 may be positioned at the end of an arm of a spring beam, such as described above and Figure 1 The second arm 108 of the elastic beam 104 shown in FIG. 1 or the ... Figure 2 4. The second arm 210 of the spring beam 206 is shown in FIG. The wafer contact 400 is a V-groove wafer contact that includes a first ear 402A and a second ear 402B. The contact surface 404 is located where the first ear 402A joins the second ear 402B. Figure 4A 402A and 402B. As can be seen in FIG. 404 , the contact surface 404 can have a convex shape. The second ear can be a mirror image of the first ear 402. The first ear 402A and the second ear 402B diverge as they extend away from the contact surface 404, forming a V-shape with the contact surface 404 as the apex. When the wafer contact is contacting the substrate, the substrate can contact the contact surface and portions of the first ear 402A and the second ear 402B. The specific contact point can vary depending on the specific geometry of the wafer being contacted by the wafer contact 400.

[0058] Figure 5 A plan view of a wafer contact 450 is shown according to an embodiment. Figure 5In the embodiment shown in FIG. 4 , the wafer contact 450 is a paddle-shaped wafer contact. The wafer contact 450 may be positioned at the end of an arm of a spring beam, such as described above and Figure 1 The second arm 108 of the elastic beam 104 shown in FIG. 1 or the ... Figure 2 4. The wafer contact 450 may include a second arm 210 of the spring beam 206 shown in FIG. The wafer contact 450 may include a widened portion 452 having a width greater than the width of the arm of the spring beam to which the wafer contact 450 is attached. Two ears 454 may extend from the widened portion 452. In an embodiment, the two ears 454 extend parallel to each other and perpendicular to a contact surface 456. The contact surface 456 may be located between the ears 454 on the widened portion 452 of the wafer contact 450. The contact surface 456 may be convex and include a curvature that bulges outwardly in the direction in which the ears 454 extend. The specific contact point may vary depending on the specific geometry of the wafer contacted by the wafer contact 400.

[0059] Figure 6 A FOUP 500 is shown according to an embodiment. The FOUP 500 includes a plurality of spring beams 502 extending from a door 504. Each of the spring beams 502 includes a first arm 506 and a second arm 508 with a wafer contact 510 at the end of the second arm 508.

[0060] In an embodiment, the plurality of elastic beams 502 are integrated with the door 504 of the FOUP 500 .

[0061] In an embodiment, the plurality of spring beams 502 are attached to a frame, such as described above and Figure 1 , which is separate from the door 504 of the FOUP 500. The frame can be joined to the door 504 by, for example, one or more joining methods, where non-limiting examples include adhesives, snap-fit ​​features, flanges, and tabs.

[0062] Each of the spring beams 502 includes a wafer contact 510. The spring beams 502 may be v-shaped springs. The spring beams 502 may be arranged in pairs, wherein each pair is configured to contact one substrate via the wafer contacts 510 of the pair of spring beams 502 when the substrate is placed inside the wafer carrier. The spring beams 502 may be aligned so that the spring beams 502 together provide two wafer contacts 510 positioned to contact one substrate when the substrate is placed inside the FOUP 500.

[0063] The elastic beams 502 each include a first arm 506 and a second arm 508. The second arm 508 is coupled to the first arm 506. The first arm 506 may extend in a first direction. The second arm 508 may extend in a second direction different from the first direction in which the first arm 506 extends. In an embodiment, the second arm 508 may extend in a direction opposite to the direction in which the first arm 506 extends. The second arm 508 may be coupled to the first arm 506 so that an angle is formed between the first arm 506 and the second arm 508. The second arm 508 may be coupled to the first arm 506 so that an angle is formed between the first arm 506 and the second arm 508. In an embodiment, the angle between the first arm 506 and the frame 502 is in a range from 0° to 40°. In an embodiment, the angle between the first arm 506 and the second arm 508 is in a range from 5° to 40°. In an embodiment, the ratio of the length of the second arm 508 to the length of the first arm 506 may be in a range from 2:1 to 1:3. In an embodiment, the second arm 508 may have a length that is at least half the length of the first arm 506. In an embodiment where the FOUP 500 is a 300 mm FOUP, the first arm 506 may have a length in the range from 55 mm to 45 mm.

[0064] The wafer contact 510 is positioned at an end of the second arm 508 opposite to where the second arm 508 is joined to the first arm 506. The wafer contact 510 is a feature configured to engage the substrate when the substrate is within the wafer container. The wafer contact 510 may include a surface configured to contact an edge of the substrate. In an embodiment, the surface configured to contact the edge of the substrate may be curved, having a convex shape. The convex shape may provide a rolling interface between the wafer contact 510 and the substrate, and may limit the generation of particles by contact between the substrate and an edge or point along the surface. In an embodiment, the wafer contact 510 is a v-groove wafer contact, which includes ears extending away from each other, wherein a surface is configured to contact the edge of the substrate at or near the apex of the V-shape formed by the ears as they extend away from each other. This wafer contact is Figure 4A , and described above. In an embodiment, the wafer contact 510 is a paddle-type wafer contact having a widened portion and two ears extending from the widened portion parallel to each other. When the wafer contact 510 is a paddle-type wafer contact, the surface is configured to contact a substrate positioned between the ears. This wafer contact is Figure 5 In an embodiment, other than the wafer contact 510 located at the end of the second arm 508 opposite to where the second arm 508 joins to the first arm 506, no other wafer contacts are provided on the spring beam 502.

[0065] A plurality of spring beams 502 are positioned such that they provide wafer contacts 510 in an interior space 512 of a FOUP. In an embodiment, the spring beams 502 protrude from a door of the FOUP into the interior space 512 of the FOUP. The FOUP may further include a wafer support 516 along a sidewall 514 of the FOUP that supports a substrate 518 when the substrate 518 is in the FOUP.

[0066] aspect:

[0067] It should be appreciated that any of aspects 1 to 7 may be combined with any of aspects 8 to 16 or aspects 17 to 20. It should be appreciated that any of aspects 8 to 16 may be combined with any of aspects 17 to 20.

[0068] Aspect 1. A chip buffer comprises: a frame; and a plurality of elastic beams, wherein each of the plurality of elastic beams includes: a first arm, which is coupled to the frame and extends to a first arm end along a first direction; a second arm, which is coupled to the first arm at the first arm end and extends to a second arm end along a second direction different from the first direction; and a chip contact member, which is coupled to the second arm at the second arm end.

[0069] Aspect 2. A wafer buffer according to Aspect 1, wherein the plurality of elastic beams are configured such that when a wafer is supported by two of the plurality of elastic beams, the wafer contacts the wafer contact only at the ends of the second arms of the two of the plurality of elastic beams.

[0070] Aspect 3. The wafer buffer according to any one of aspects 1 to 2, wherein the wafer contact is a V-groove wafer contact or a paddle-shaped wafer contact.

[0071] Aspect 4. The wafer buffer according to any one of aspects 1 to 3, wherein a surface of the wafer contact configured to contact a wafer has a convex surface.

[0072] Aspect 5. The wafer buffer according to any one of aspects 1 to 4, wherein the first arm is coupled to the frame at a periphery of the frame, and the first direction is toward a centerline of the frame.

[0073] Aspect 6. A chip buffer according to any one of Aspects 1 to 5, wherein each of the spring beams includes a secondary contact point on the second arm, the secondary contact point is positioned where the second arm is joined to the first arm, and wherein the secondary chip contact is configured to contact the chip only when an impact event occurs.

[0074] Aspect 7. A chip carrier, comprising a chip buffer, wherein the chip buffer includes: a frame; and a plurality of elastic beams, wherein each of the elastic beams includes: a first arm, which is coupled to the frame and extends to a first arm end along a first direction; a second arm, which is coupled to the first arm at the first arm end and extends to a second arm end along a second direction different from the first direction; and a chip contact, which is coupled to the second arm at the second arm end.

[0075] Aspect 8. The wafer buffer according to aspect 7, wherein the wafer buffer is mounted on a door of the wafer carrier.

[0076] Aspect 9. A wafer buffer according to any one of aspects 7 to 8, wherein the wafer carrier is a front-opening wafer pod.

[0077] Aspect 10. A chip buffer according to any one of Aspects 7 to 9, wherein the plurality of elastic beams are configured so that when a chip is supported by two of the plurality of elastic beams, the chip contacts the chip contact member at the ends of the second arms of the two of the plurality of elastic beams only when the chip carrier is stationary.

[0078] Aspect 11. The wafer buffer according to any one of aspects 7 to 10, wherein each of the wafer contacts is a V-groove wafer contact or a paddle-shaped wafer contact.

[0079] Aspect 12. The wafer buffer according to any one of aspects 7 to 11, wherein a surface of the wafer contact configured to contact a wafer has a convex surface.

[0080] Aspect 13. A wafer buffer according to any one of aspects 7 to 12, wherein the first arm is coupled to the frame at a periphery of the frame, and the first direction is toward a centerline of the frame.

[0081] Aspect 14. A chip buffer according to any one of Aspects 7 to 13, wherein each of the spring beams includes a secondary contact point on the second arm, the secondary contact point is positioned where the second arm is joined to the first arm, and wherein the secondary chip contact is configured to contact the chip only when an impact event occurs.

[0082] Aspect 15. A method for supporting a chip, comprising: contacting the substrate at two chip contacts, wherein each of the two chip contacts is coupled to a separate elastic beam, each of the elastic beams includes a first arm extending in a first direction, and a second arm coupled to the first arm and extending in a second direction different from the first direction, and the chip contact is located at an end of the second arm opposite to where the second arm is coupled to the first arm.

[0083] Aspect 16. The method of aspect 15, further comprising contacting the substrate at two secondary contact points on the second arm of the v-spring on which the wafer contact is positioned when a shock event occurs.

[0084] Aspect 17. The method according to aspect 15, wherein the substrate contacts the spring beam only at the two wafer contacts.

[0085] Aspect 18. The method according to any one of aspects 15 to 17, wherein the wafer contact has a convex surface, the wafer contact being configured to contact the substrate at the convex surface.

[0086] Thus, having described several illustrative embodiments of the present disclosure, it will be readily apparent to those skilled in the art that still other embodiments may be made and used within the scope of the appended claims of the present disclosure. Many advantages of the present disclosure covered by this document have been set forth in the full description. However, it should be understood that the present disclosure is in many respects merely illustrative. Changes may be made to the details, particularly in matters of shape, size, and arrangement of parts, without exceeding the scope of the present disclosure. Of course, the scope of the present disclosure is defined by the language in which the appended claims are expressed.

Claims

1. A chip buffer, include: frame; and A plurality of elastic beams, wherein each of the plurality of elastic beams comprises: a first arm coupled to the frame and extending away from the frame in a first direction to a first arm end; a second arm coupled to the first arm at the first arm end and extending to the second arm end in a second direction different from the first direction, and wherein the second arm is bent toward the first arm; and a wafer contact member coupled to the second arm at the second arm end, wherein the wafer contact member has a width greater than a width of a portion of the second arm, and the first arm extends away from the second arm where it is coupled to the frame, Each of the spring beams includes a secondary wafer contact point on the second arm, the secondary wafer contact point being located where the second arm joins to the first arm, and wherein the secondary wafer contact point is configured to contact the back side of the wafer only when an impact event occurs.

2. The wafer buffer of claim 1 , wherein the plurality of spring beams are configured such that when a wafer is supported by two of the plurality of spring beams, the wafer contacts the wafer contact only at the ends of the second arms of the two of the plurality of spring beams. 3 . The wafer buffer of claim 1 , wherein the wafer contact is a V-groove wafer contact or a paddle-shaped wafer contact. 4 . The wafer buffer of claim 1 , wherein a surface of the wafer contact configured to contact a wafer has a convex surface.

5. The wafer buffer of claim 1, wherein the first arm is coupled to the frame at a periphery of the frame and the first direction is toward a centerline of the frame.

6. A wafer carrier comprising a wafer buffer, wherein the wafer buffer comprises: framework; and A plurality of elastic beams, wherein each of the elastic beams comprises: a first arm coupled to the frame and extending away from the frame in a first direction to a first arm end; a second arm coupled to the first arm at the first arm end and extending to the second arm end in a second direction different from the first direction, and wherein the second arm is bent toward the first arm; and a wafer contact member coupled to the second arm at the second arm end, wherein the wafer contact member has a width greater than a width of a portion of the second arm, and the first arm extends away from the second arm where it is coupled to the frame, Each of the spring beams includes a secondary wafer contact point on the second arm, the secondary wafer contact point being located where the second arm joins to the first arm, and wherein the secondary wafer contact point is configured to contact the back side of the wafer only when an impact event occurs.

7. The wafer carrier of claim 6, wherein the wafer buffer is mounted on a door of the wafer carrier.

8. The wafer carrier of claim 6, wherein the wafer carrier is a front-opening pod.

9. The wafer carrier of claim 6 , wherein the plurality of spring beams are configured such that when a wafer is supported by two of the plurality of spring beams, the wafer contacts the wafer contacts only at the ends of the second arms of the two of the plurality of spring beams when the wafer carrier is stationary.

10. The wafer carrier of claim 6, wherein each of the wafer contacts is a V-groove wafer contact or a paddle-shaped wafer contact.

11. The wafer carrier of claim 6, wherein a surface of the wafer contact configured to contact a wafer has a convex surface.

12. The wafer carrier of claim 6, wherein the first arm is coupled to the frame at a periphery of the frame and the first direction is toward a centerline of the frame.

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