Substrate processing system

Abstract

A substrate processing system according to one embodiment can include: a front end module; a first process line including a first polishing line and a first cleaning line; a second process line including a second polishing line and a second cleaning line, and the first process line is configured in parallel with the second process line; a first stage located between the first cleaning line and the second cleaning line; a first transfer robot configured to transfer a substrate from the front end module to the first stage; a second stage located between the first polishing line and the second polishing line; and a second transfer robot configured to transfer the substrate between at least any two of the first cleaning line, the second cleaning line, the first stage, and the second stage.

Description

Technical Field

[0001] The following embodiments relate to a substrate processing system. Background Technology

[0002] The manufacture of semiconductor devices requires CMP (chemical mechanical polishing) operations, which include grinding, polishing, and cleaning. Semiconductor devices have a multilayer structure, with transistor elements having diffusion regions formed on a substrate layer. On the substrate layer, interconnecting metal lines are patterned and electrically connected to the transistor elements that form the functional components. As is known, the patterned conductive layers are insulated from other conductive layers by an insulating material such as silicon dioxide. Because more metal layers and associated insulating layers are formed, the need to flatten the insulating material increases. Without flattening, the increased variation in surface morphology makes further fabrication of the metal layers substantially more difficult. Furthermore, the metal line patterns are formed from insulating materials, and the metal CMP operation removes excess metal.

[0003] To increase the production efficiency of CMP processes, the waiting time between processes or transfers can be shortened, and various processes or transfers can be performed in parallel. For example, shortening the substrate transfer path and handling multiple substrates simultaneously during transfer and polishing can increase the production efficiency of CMP processes.

[0004] The aforementioned background technology is technology that the inventor possessed or mastered in the process of deriving the disclosure of this application, and is not necessarily publicly known technology that was disclosed to the general public before this application. Summary of the Invention

[0005] One embodiment aims to provide a substrate processing system that can simultaneously transfer and polish multiple substrates in parallel.

[0006] One embodiment aims to provide a substrate processing system that can shorten the substrate transfer path and increase transfer efficiency.

[0007] A substrate processing system according to one embodiment may include: a front-end module; a first process line including a first polishing line and a first cleaning line; a second process line including a second polishing line and a second cleaning line, arranged in parallel with the first process line; a first worktable located between the first cleaning line and the second cleaning line; a first transport robot that transfers the substrate from the front-end module to the first worktable; a second worktable located between the first polishing line and the second polishing line; and a second transport robot that transports the substrate between at least two locations among the first cleaning line, the second cleaning line, the first worktable, and the second worktable.

[0008] It may also include: a third transport robot that transports the substrate between at least two locations of the second workbench, the first grinding line and the second grinding line.

[0009] The first polishing line and the second polishing line may each include: a first rotating part that rotates to form a first transfer track in a circle and transfers the substrate between a first transfer position, a second transfer position, and a third transfer position; a second rotating part that rotates to form a second transfer track in a circle and transfers the substrate between a second transfer position and a first polishing position; a third rotating part that rotates to form a third transfer track in a circle and transfers the substrate between a third transfer position and a second polishing position; a first polishing pad that rotates at least a portion at a position overlapping with the first polishing position; and a second polishing pad that rotates at least a portion at a position overlapping with the second polishing position.

[0010] The second transport robot can transfer the substrate from the first worktable to the second worktable before grinding.

[0011] The third transport robot can transfer the substrate from the second workbench to any one of the first transfer positions in the first grinding line and the second grinding line before grinding.

[0012] The first rotating part may include at least one third worktable located sequentially at the first transfer position, the second transfer position, and the third transfer position.

[0013] The second rotating part may include at least one first carrier head that is alternately located at the second transfer position and the first grinding position, and the third rotating part may include at least one second carrier head that is alternately located at the third transfer position and the second grinding position.

[0014] The first grinding line and the second grinding line may each further include: a first loading section, which loads the substrate onto or unloads the substrate from the first carrier head at a second transfer position; and a second loading section, which loads the substrate onto or unloads the substrate from the second carrier head at a third transfer position.

[0015] The first loading section and the second loading section may each include a cleaning nozzle, which cleans the first carrier head or the second carrier head located at the second transfer position or the third transfer position.

[0016] The second handling robot can transfer the polished substrate from either the first polishing line or the second polishing line to either the first cleaning line or the second cleaning line.

[0017] The first handling robot can transfer the cleaned substrate from either the first cleaning line or the second cleaning line to the front-end module.

[0018] The first cleaning line and the second cleaning line may each include: a chamber section, which includes at least a portion of a plurality of cleaning chambers stacked in a vertical direction; and a fourth transport robot, which transfers the substrate from at least one of the plurality of cleaning chambers to another cleaning chamber.

[0019] The chamber section includes: a first chamber section, which includes at least one cleaning chamber; a second chamber section, which includes at least one cleaning chamber, and is configured horizontally spaced from the first chamber section; and a fourth handling robot may be located between the first chamber section and the second chamber section.

[0020] The second transport robot can transfer the polished substrate from either the first polishing line or the second polishing line to the first chamber of either the first cleaning line or the second cleaning line.

[0021] The first handling robot can transfer the cleaned substrate from the second chamber of either the first or second cleaning line to the front-end module.

[0022] According to one embodiment, a substrate processing system includes: a front-end module disposed in a first direction; a first process line including a first polishing line and a first cleaning line disposed in a second direction perpendicular to the first direction; a second process line including a second polishing line and a second cleaning line disposed in a third direction perpendicular to the first direction and parallel to the second direction; and a second worktable disposed between the first process line and the second process line, wherein a substrate can be transferred from the first polishing line or the second polishing line to the first cleaning line or the second cleaning line via the second worktable, or transferred from the first cleaning line or the second cleaning line to the first polishing line or the second polishing line.

[0023] The first polishing line and the second polishing line may each include: a first rotating part that rotates to form a first transfer track in a circle and transfers the substrate between a first transfer position, a second transfer position, and a third transfer position; a second rotating part that rotates to form a second transfer track in a circle and transfers the substrate between a second transfer position and a first polishing position; a third rotating part that rotates to form a third transfer track in a circle and transfers the substrate between a third transfer position and a second polishing position; a first polishing pad that rotates at least a portion at a position overlapping with the first polishing position; and a second polishing pad that rotates at least a portion at a position overlapping with the second polishing position.

[0024] The first rotating part may include at least one third worktable located sequentially at the first transfer position, the second transfer position, and the third transfer position.

[0025] The second rotating part may include at least one first carrier head that is alternately located at the second transfer position and the first grinding position, and the third rotating part may include at least one second carrier head that is alternately located at the third transfer position and the second grinding position.

[0026] The first grinding line and the second grinding line may each further include: a first loading section, which loads the substrate onto or unloads the substrate from the first carrier head at a second transfer position; and a second loading section, which loads the substrate onto or unloads the substrate from the second carrier head at a third transfer position.

[0027] According to one embodiment of the substrate processing system, grinding processes can be performed continuously and in parallel on multiple substrates, thereby improving production efficiency.

[0028] According to one embodiment, a substrate processing system is configured to load / unload a second substrate during the grinding of a first substrate, thereby improving production efficiency.

[0029] According to one embodiment of the substrate process system, the substrate transfer path can be shortened and the transfer efficiency increased.

[0030] The effects of the substrate process system according to one embodiment are not limited to those mentioned above, and other effects not mentioned can be clearly understood by those skilled in the art from the following description. Attached Figure Description

[0031] Figure 1 This is a schematic plan view of a substrate process system according to one embodiment.

[0032] Figure 2 This is a schematic plan view of the first grinding line according to one embodiment.

[0033] Figure 3 This is a schematic side view of the first rotating portion and the first loading portion on the first grinding line according to one embodiment.

[0034] Figure 4 This is a schematic perspective view of a first cleaning line according to one embodiment.

[0035] Figure 5 This is a schematic side view of a first cleaning line in a cleaning process for a display substrate according to one embodiment.

[0036] Figure 6 This is a schematic perspective view of the first chamber portion according to one embodiment.

[0037] Label Explanation

[0038] 1: Substrate Processing System

[0039] 11: Front-end module

[0040] 12a: First process line

[0041] 12b: Second process line

[0042] 121a: First grinding line

[0043] 121b: Second grinding line

[0044] 122a: First cleaning line

[0045] 122b: Second cleaning line

[0046] 13: First Workbench

[0047] 14: The First Transport Robot

[0048] 15: Second workbench

[0049] 16: Second transport robot

[0050] 17: The Third Handling Robot Detailed Implementation

[0051] Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. However, since various modifications can be made to the embodiments, the scope of the patent application is not limited or restricted by these embodiments. Rather, it should be understood that all modifications, equivalents, and even substitutions made to the embodiments are included within the scope of the claims.

[0052] The terminology used in the embodiments is for illustrative purposes only and should not be construed as intended to be limiting. Singular expressions include plural expressions unless the context clearly distinguishes them. In this specification, terms such as "comprising" or "having" should be understood to specify the presence of features, numbers, steps, actions, constituent elements, components, or combinations thereof described in the specification, without excluding the presence or additional possibilities of one or more other features or numbers, steps, actions, constituent elements, components, or combinations thereof.

[0053] Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which the embodiments pertain. Terms as defined in commonly used dictionaries should be interpreted as having the same meaning as they have in the context of the relevant art, and should not be construed as having an ideal or overly formal meaning unless expressly defined herein.

[0054] Furthermore, when describing the embodiments with reference to the accompanying drawings, regardless of the reference numerals, the same reference numerals are assigned to the same constituent elements, and repeated descriptions are omitted. When describing embodiments, detailed descriptions of related well-known technologies are omitted if it is determined that such detailed descriptions may unnecessarily obscure the essence of the embodiments.

[0055] Furthermore, when describing the constituent elements of the embodiments, terms such as first, second, A, B, (a), and (b) may be used. These terms are merely for distinguishing the constituent element from other constituent elements and do not limit the nature, order, or steps of the relevant constituent elements. When a constituent element is described as "connected," "combined," or "accessed" to other constituent elements, it should be understood that although the constituent element can be directly connected to or accessed to other constituent elements, there may also be other constituent elements that are "connected," "combined," or "accessed" between the constituent elements.

[0056] For a given embodiment, the constituent elements and constituent elements that share a common function are described using the same names in another embodiment. Unless otherwise stated, the descriptions described in any embodiment are also applicable to other embodiments, and specific details are omitted to the extent necessary for repetition.

[0057] Figure 1 This is a schematic plan view of a substrate process system according to one embodiment.

[0058] Reference Figure 1 According to one embodiment, the substrate processing system 1 can be a system for processing the surface of a substrate. For example, the substrate processing system 1 can perform grinding and cleaning processes on the substrate. The substrate processed by the substrate processing system 1 can be a silicon wafer for semiconductor device manufacturing. However, the type of substrate is not limited to this. For example, the substrate may include glass for LCD (liquid crystal display), PDP (plasma display device), and FDP (flat panel display).

[0059] According to one embodiment, the substrate process system 1 may include: a front-end module 11, a process line 12, a first workbench 13, a first handling robot 14, a second workbench 15, a second handling robot 16, and a third handling robot 17.

[0060] In one embodiment, the front-end module 11 may be located on one side of the substrate process system 1 (e.g., the +x direction side). The front-end module 11 may be configured in the first direction L1. For example, the front-end module 11 is positioned as follows: Figure 1The reference can be configured in a length direction with the y-axis. For example, the front-end module 11 can be an EFEM (equipment front end module). A cassette or FOUP (Front Opening Unified Pod) can be configured in the front-end module 11. The cassette or FOUP can hold the substrate to be processed and / or the processed wafer. A first handling robot 14 can be configured in the front-end module 11. The first handling robot 14 will be described later.

[0061] In one embodiment, process line 12 can be a line for performing processes on a substrate. Process line 12 can perform grinding and cleaning processes on the substrate. At least one process line 12 can be provided. For example, process line 12 can include a first process line 12a and a second process line 12b. The first process line 12a and the second process line 12b can be arranged side-by-side. For example, the first process line 12a can be arranged in a second direction L2 perpendicular to the first direction L1. The second process line 12b can be arranged in a third direction L3 perpendicular to the first direction L1 and parallel to the second direction L2. For example, the first process line 12a can be arranged with a length direction parallel to the x-axis, and the second process line 12b can also be arranged parallel to the first process line 12a, i.e., with a length direction parallel to the x-axis. In other words, the first process line 12a and the second process line 12b can be arranged parallel to each other. The first process line 12a and the second process line 12b can also be arranged spaced apart from each other, forming a space in between. For example, a first workbench 13, a second transport robot 16, and a third transport robot 17, described later, can be configured between the first process line 12a and the second process line 12b.

[0062] In one embodiment, the first process line 12a may include a first grinding line 121a and a first cleaning line 122a. The second process line 12b may include a second grinding line 121b and a second cleaning line 122b.

[0063] In one embodiment, the first polishing line 121a and the second polishing line 121b can perform a polishing process on the substrate. For example, the first polishing line 121a and the second polishing line 121b can perform a chemical mechanical polishing (CMP) process on the surface of the substrate. The first polishing line 121a and the second polishing line 121b can be located opposite the front-end module 11. For example, the first polishing line 121a and the second polishing line 121b can be located on the other side of the substrate process system 1 (e.g., the -x direction side).

[0064] In one embodiment, the first cleaning line 122a and the second cleaning line 122b can perform a cleaning process on the substrate. The cleaning process can be a concept that includes both cleaning and drying the substrate. For example, the first cleaning line 122a and the second cleaning line 122b can perform a cleaning process on a substrate that has undergone polishing, and can also perform a drying process on the cleaned substrate. The first cleaning line 122a and the second cleaning line 122b can each be arranged with a length direction parallel to the x-axis. For example, the first cleaning line 122a and the second cleaning line 122b can be arranged to be spaced apart from each other, forming a space in the middle. The first cleaning line 122a and the second cleaning line 122b can be respectively arranged between the first polishing line 122a and the front-end module 11, and between the second polishing line 122b and the front-end module 11.

[0065] In one embodiment, the first worktable 13 may be configured between the first process line 12a and the second process line 12b. For example, the first worktable 13 may be located between the first cleaning line 122a and the second cleaning line 122b. For example, the first worktable 13 may be located between the front-end module 11 and the first polishing line 121a and the second polishing line 121b. The first worktable 13 may be configured adjacent to the front-end end 11. The substrate to be processed (e.g., the substrate before polishing) may be placed on the first worktable 13.

[0066] In one embodiment, the first handling robot 14 can move along the length direction (e.g., the y-axis direction) of the front-end module 11. For example, the first handling robot 14 can move along a track 141 configured in the y-axis direction. For example, the first handling robot 14 can move between a first receiving position RP1 and a second receiving position RP2. The first receiving position RP1 may be a position adjacent to the first cleaning line 122a. The second receiving position RP2 may be a position adjacent to the second cleaning line 122b. For example, the first receiving position RP1 may be located at one end of the track 141 (e.g., the +y direction end), and the second receiving position RP2 may be located at the other end of the track 141 (e.g., the -y direction end). The first handling robot 14 can transfer the cleaned substrate from either the first cleaning line 122a or the second cleaning line 122a to the front-end module 11. For example, the first handling robot 14 can transfer the cleaned substrate from the second chamber portion (e.g., the second chamber portion) of either the first cleaning line 122a or the second cleaning line 122a. Figure 5The second chamber 1220b) is transferred to the front-end module 11. For example, the first handling robot 14 can obtain the cleaned substrate transferred from the first cleaning line 122a at the first receiving position RP1. The first handling robot 14 can obtain the cleaned substrate transferred from the second cleaning line 122b at the second receiving position RP2. The first handling robot 14 can store the transferred cleaned substrate in a box or wafer transfer box.

[0067] In one embodiment, the supply position SP can be located between the first receiving position RP1 and the second receiving position RP2. For example, the supply position SP can be located at an intermediate point between the first receiving position RP1 and the second receiving position RP2. The first handling robot 14 can transfer the substrate from the front-end module 11 to the first worktable 13 at the supply position SP. For example, the first handling robot 14 can transfer the substrate to be processed from the box or wafer transfer box of the front-end module 11 to the first worktable 13 at the supply position SP. After the substrate to be processed is placed on the first worktable 13, it can wait for the next transfer.

[0068] In one embodiment, the second worktable 15 may be located between the first process line 12a and the second process line 12b. For example, the second worktable 15 may be located between the first grinding line 121a and the second grinding line 121b. The second worktable 15 may be arranged adjacent to the second transport robot 16, which will be described later. A pre-grinding substrate or a post-grinding substrate may be placed on the second worktable 15. For example, the substrate may be transferred from the first grinding line 121a or the second grinding line 121b to the first cleaning line 122a or the second cleaning line 122b, or vice versa, via the second worktable 15. For example, such transfer may be performed by at least the second transport robot 16 and / or the third transport robot 17, which will be described later.

[0069] In one embodiment, the second transport robot 16 can transfer the substrate between at least two locations among the first cleaning line 122a, the second cleaning line 122b, the first worktable 13, and the second worktable 15. The second transport robot 16 can be located between the first process line 12a and the second process line 12b. For example, the second transport robot 16 can be located between the first cleaning line 122a and the second cleaning line 122b. For example, the second transport robot 16 can be located between the front-end module 11 and the first polishing line 121a and the second polishing line 121b. For example, the second transport robot 16... Figure 1The reference point can be located to the left of the first worktable 13 (e.g., the -x direction side). The second handling robot 16 is configured to be rotatable and may include an extendable arm. The second handling robot 16 can freely approach in the circumferential direction.

[0070] In one embodiment, the third transport robot 17 can transport a substrate between at least two locations of the second worktable 15, the first polishing line 121a, and the second polishing line 121b. The third transport robot 17 can be located between the first process line 12a and the second process line 12b. For example, the third transport robot 17 can be located between the first polishing line 121a and the second polishing line 121b. The third transport robot 17 can be arranged adjacent to the second worktable 15. For example, the third transport robot 17 can be arranged adjacent to the second worktable 15. Figure 1 The reference point can be located to the left of the second workbench 15 (e.g., the -x direction side). The third handling robot 17 is configured to be rotatable and may include an extendable arm. The third handling robot 17 can freely approach in the circumferential direction.

[0071] In one embodiment, if the first handling robot 14 transfers the substrate to be processed (e.g., the substrate before grinding) to the first worktable 13, the second handling robot 16 can transfer the substrate before grinding placed on the first worktable 13 to the second worktable 15. If the substrate before grinding is placed on the second worktable 15, the third handling robot 17 can transfer the substrate before grinding from the second worktable 15 to either the first grinding line 121a or the second grinding line 121b. For example, the third handling robot 17 can transfer the substrate before grinding placed on the second worktable 15 to a first transfer position on the first grinding line 121a (e.g., ...). Figure 2 The first transfer position TP1 or the first transfer position TP1 of the second grinding line 121b.

[0072] In one embodiment, the third transport robot 17 can transfer the polished substrate from either the first polishing line 121a or the second polishing line 121b to the second worktable 15. If the polished substrate is placed on the second worktable 15, the second transport robot 16 can transfer the polished substrate from the second worktable 15 to either the first cleaning line 122a or the second cleaning line 122b. With this structure, even if either the first cleaning line 122a or the second cleaning line 122b fails, the polished substrate can be transferred to the other cleaning line that is not malfunctioning, thus increasing process flexibility.

[0073] Figure 2 This is a schematic plan view of the first grinding line according to one embodiment. Figure 3This is a schematic side view of the first rotating part and the first loading part in the first grinding line according to one embodiment.

[0074] Reference Figure 2 and Figure 3 In one embodiment, the first polishing line 121a may include a first rotating part 1211, a second rotating part 1212, a third rotating part 1213, a first loading part 1214 and a second loading part 1215, a first polishing pad 1216 and a second polishing pad 1217.

[0075] In one embodiment, the first rotating part 1211 rotates about a first axis A1 perpendicular to the ground, and can transfer the substrate along a circular first transfer track TO1. The first rotating part 1211 can be transported by a third handling robot (e.g., a third handling robot). Figure 1 The third transport robot 17 acquires the substrate in its pre-grinding state. The first rotating unit 1211 can transfer the acquired substrate to the second rotating unit 1212 or the third rotating unit 1213. Furthermore, the first rotating unit 1211 can acquire the substrate in its post-grinding state transferred from the second rotating unit 1212 or the third rotating unit 1213, and can transfer it to a post-grinding process (e.g., a cleaning process) via the third transport robot 17. The first rotating unit 1211 can move the substrate along a circular track. The first rotating unit 1211 can move multiple substrates simultaneously. For example, the transfer of substrates in their pre-grinding state and the transfer of substrates in their post-grinding state can be performed simultaneously.

[0076] In one embodiment, the first rotating part 1211 can rotate about a first axis A1 perpendicular to the ground. The first rotating part 1211 can rotate in one or two directions. The first rotating part 1211 may include a third worktable 12111.

[0077] In one embodiment, the third worktable 12111 can be connected to the first rotating part 1211 and rotate integrally with the first rotating part 122. The third worktable 12111 can support the underside of the substrate. The third worktable 12111 forms a first transfer track TO1 as the first rotating part 1211 rotates and can rotate about a first axis A1. The first transfer track TO1 can be formed as a circle. The third worktable 12111 rotates about the first axis A1 with the substrate placed on it, thereby transferring the substrate to a position on the first transfer track TO1 (e.g., first transfer position TP1, second transfer position TP2, or third transfer position TP3).

[0078] In one embodiment, at least one third worktable 12111 may be provided. For example, multiple third worktables 12111 may be provided. For example, three third worktables 12111 may be provided. Multiple third worktables 12111 may be configured at specified intervals centered on the first axis A1. For example, multiple third worktables 12111 may be configured at the same angle centered on the first axis A. Additionally, Figure 1 and Figure 2 The number of third worktables 12111 shown is illustrative and not limited. The specific details of the transfer of substrates by the third worktables 12111 will be described later.

[0079] In one embodiment, the second rotating part 1212 can rotate about a second axis A2 perpendicular to the ground, and can transfer the substrate along a circular second transfer track TO2. The second rotating part 1212 can rotate in one or both directions. The second rotating part 1212 may include a first carrier head 12121.

[0080] In one embodiment, the second rotating part 1212 supports the first carrier head 12121 from above and can move the carrier head 12121 along the second transfer track TO2 with the second axis A2 as the center. The substrate can be transferred via the second rotating part 1212 while it is clamped by the first carrier head 12121. The first carrier head 12121 can clamp the substrate using an adsorption method via a membrane (not shown). The transfer of the substrate between the third worktable 12111 and the first carrier head 12121 can be performed via the first loading part 1214.

[0081] In one embodiment, the first carrier head 12121 performs a polishing process by contacting and rubbing the first polishing pad 1216 with the polishing surface of the substrate. The first carrier head 12121 and the first polishing pad 1216 can polish the substrate at least through relative rotational motion. For example, the first carrier head 12121 can rotate and / or oscillate for polishing the substrate. Furthermore, the first carrier head 12121 can be driven to move vertically for loading / unloading the substrate or polishing the substrate.

[0082] In one embodiment, multiple first carrier heads 12121 can be provided. For example, two first carrier heads 12121 can be provided. When multiple first carrier heads 12121 are connected to the second rotating part 1212, the multiple first carrier heads 12121 can be arranged at specified intervals with the second axis A2 as the center. For example, the multiple first carrier heads 12121 can be arranged at the same angle with the second axis A2 as the center. However, this is an example, and the number of first carrier heads 12121 is not limited thereto.

[0083] In one embodiment, the first loading unit 1214 can load a substrate in its pre-grinding state from the third worktable 12111 onto the first carrier head 12121. The first loading unit 1214 can also unload a substrate in its post-grinding state from the first carrier head 12121 onto the third worktable 12111. The first loading unit 1214 can load or unload the substrate via a vertical lifting motion. During the loading or unloading process of the first loading unit 1214, the first rotating unit 1211 (e.g., the third worktable 12111) can move vertically upwards and downwards. Alternatively, the first loading unit 1214 can be integrally formed with the first rotating unit 1211. In other words, the first rotating unit 1211 (e.g., the third worktable 12111) can also load the substrate onto or unload it from the carrier head 12121 itself via vertical lifting motion without a separate loading unit.

[0084] In one embodiment, the third rotating part 1213 can rotate around a third axis A3 perpendicular to the ground, and can transfer the substrate along a circular third transfer track TO3. The third rotating part 1213 can rotate in one or two directions. The third rotating part 1213 may include a second carrier head 12131.

[0085] In one embodiment, the third rotating part 1213 supports the second carrier head 12131 on its upper side and can move the carrier head 12121 along the second transfer track TO2 with the third axis A3 as the center. The substrate can be transferred via the third rotating part 1213 while it is clamped by the second carrier head 12131. The second carrier head 12131 can clamp the substrate by adsorption using a membrane (not shown). The transfer of the substrate between the third worktable 12111 and the second carrier head 12131 can be performed via the second loading part 1215.

[0086] In one embodiment, the second carrier head 12131 performs a polishing process by contacting and rubbing the second polishing pad 1217 against the polishing surface of the substrate. The second carrier head 12131 and the second polishing pad 1217 can polish the substrate at least through relative rotational motion. For example, the second carrier head 12131 can rotate and / or oscillate for polishing the substrate. Furthermore, the second carrier head 12131 can be driven vertically for loading / unloading the substrate or polishing the substrate.

[0087] In one embodiment, multiple second carrier heads 12131 may be provided. For example, two second carrier heads 12131 may be provided. When multiple second carrier heads 12131 are connected to the third rotating part 1213, the multiple second carrier heads 12131 may be arranged at specified intervals with the third axis A3 as the center. For example, the multiple second carrier heads 12131 may be arranged at the same angle with the third axis A3 as the center. However, this is an example, and the number of second carrier heads 12131 is not limited thereto.

[0088] In one embodiment, the second loading unit 1215 can load a substrate in its pre-grinding state from the third worktable 12111 onto the second carrier head 12131. The second loading unit 1215 can also unload a substrate in its post-grinding state from the second carrier head 12131 onto the third worktable 12111. The second loading unit 1215 can load or unload the substrate via a vertical lifting motion. During the loading or unloading process of the second loading unit 1215, the first rotating unit 1211 (e.g., the third worktable 12111) can move vertically upwards and downwards. Alternatively, the second loading unit 1215 can be integrally formed with the first rotating unit 1211. In other words, the first rotating unit 1211 (e.g., the third worktable 12111) can also load the substrate onto or unload it from the carrier head 12121 itself via vertical lifting motion without a separate loading unit.

[0089] The following reference Figures 1 to 3 The first transfer track TO1 of the first rotating part 1211 will be described in detail.

[0090] In one embodiment, firstly, the second transport robot 16 can transfer the pre-grinding substrate from the first worktable 13 to the second worktable 15. The third transport robot 17 can then transfer the pre-grinding substrate from the second worktable 15 to the third worktable 12111 located at the first transfer position TP1. In other words, the first rotating part 1211 can obtain the substrate transferred by the third transport robot 17 at the first transfer position TP1 on the first transfer track TO1. The transferred substrate can be placed on the third worktable 12111 located at the first transfer position TP1. Furthermore, the first rotating part 1211 can transfer the post-grinding substrate from the first transfer position TP1 to the second worktable 15 via the third transport robot 17. For example, the third transport robot 17 can transfer the post-grinding substrate from the third worktable 12111 located at the first transfer position TP1 of the first rotating part 1211 to the second worktable 15. If the post-grinding substrate is transferred to the second worktable 15, the second transport robot 16 can then transfer the post-grinding substrate from the second worktable 15 to the next process (e.g., a cleaning process). For example, the second handling robot 16 can transfer the polished substrate from the second workbench 15 to the cleaning process (first cleaning line 1212a or second cleaning line 1212b).

[0091] In one embodiment, the first transfer track TO1 and the second transfer track TO2 may overlap at the second transfer position TP2. At the second transfer position TP2, the substrate can move from the first rotating part 1211 to the second rotating part 1212. For example, the first rotating part 1211 can transfer (load) the substrate in its pre-grinding state from the second transfer position TP2 to the second rotating part 1212. At the second transfer position TP2, the substrate can move from the second rotating part 1212 to the first rotating part 1211. For example, the second rotating part 1212 can transfer (unload) the substrate in its post-grinding state from the second transfer position TP2 to the first rotating part 1211. The substrate can be transferred from the second transfer position TP2 to the area between the first rotating part 1211 and the second rotating part 1212 via the loading part 1213. For this purpose, the loading part 1213 may be disposed at the second transfer position TP2. The loading unit 1213 can load the substrate in its pre-grinding state from the third worktable 12111 located at the second transfer position TP2 to the carrier head 12121 located at the second transfer position TP2. The loading unit 1213 can unload the substrate in its post-grinding state from the carrier head 12121 located at the second transfer position TP2 to the third worktable 12111 located at the second transfer position TP2.

[0092] In one embodiment, the third worktable 12111 of the first rotating part 1211 can be located sequentially at the first transfer position TP1, the second transfer position TP2, and the third transfer position TP3 while rotating along the first transfer track TO1. For example, when one third worktable 12111 is located at the first transfer position TP1, another third worktable 12111 can be located at the second transfer position TP2, and yet another third worktable 12111 can be located at the third transfer position TP3. As the first rotating part 1211 rotates, if one third worktable 12111 moves from the first transfer position TP1 to the second transfer position TP2, then another third worktable 12111 can move from the second transfer position TP2 to the third transfer position TP3, and yet another third worktable 12111 can move from the third transfer position TP3 back to the first transfer position TP1. In other words, while the first rotating unit 1211 moves the first substrate from the first transfer position TP1 to the second transfer position TP2, and the second substrate from the second transfer position TP2 to the third transfer position TP3, it can also move the third substrate from the third transfer position TP3 to the first transfer position TP1. Alternatively, this is an example; the first rotating unit 1211 can also rotate in the opposite direction, and the third worktable 12111 can also move directly from the first transfer position TP1, through the second transfer position TP2, to the third transfer position TP3.

[0093] Below, refer to Figure 2 and Figure 3 The second transfer track TO2 of the second rotating part 1212 will be described in detail.

[0094] In one embodiment, the first carrier head 12121 of the second rotating part 1212 can acquire the substrate in its pre-grinding state, transferred (loaded) from the first rotating part 1211, at the second transfer position TP2. Once the substrate loading is complete, the first carrier head 12121 can move towards the first grinding position PP1 by rotating the second rotating part 1212. The first grinding position PP1 can be the location where the second transfer track TO2 and the first grinding pad 1216 overlap. In other words, at least a portion of the first grinding pad 1216 can overlap with the first grinding position PP1. The substrate can be ground at the first grinding position PP1. In other words, the first carrier head 12121 can grind the substrate in its pre-grinding state at the first grinding position PP1. Once the substrate grinding is complete, the first carrier head 12121 can move back to the second transfer position TP2 with the rotation of the second rotating part 1212. The first carrier head 12121 can then transfer (unload) the substrate in its post-grinding state from the second transfer position TP2 to the first rotating part 1211.

[0095] In one embodiment, during the grinding of a substrate at the first grinding position PP1, another substrate can be moved (loaded) from the first rotating part 1211 to the second rotating part 1212 or moved (unloaded) from the second rotating part 1212 to the first rotating part 1211 at the second transfer position TP2. In other words, during the grinding of a substrate at one first carrier head 12121, another substrate can be loaded or unloaded at another first carrier head 12121.

[0096] In one embodiment, the first carrier head 12121 of the second rotating part 1212 can alternately be located at the second transfer position TP1 and the first polishing position PP1 while rotating along the second transfer track TO2. For example, when one first carrier head 12121 is located at the second transfer position TP2, the other first carrier head 12121 can be located at the first polishing position PP1. As the second rotating part 1212 rotates, if one first carrier head 12121 moves from the second transfer position TP2 to the first polishing position PP1, the other first carrier head 12121 can move from the first polishing position PP1 to the second transfer position TP2. In other words, the second rotating part 1212 can transfer another substrate from the second transfer position TP2 to the first polishing position PP1 while transferring one substrate from the first polishing position PP1 to the second transfer position TP2.

[0097] The following reference Figure 2 and Figure 3 The third transfer track TO3 of the third rotating part 1213 will be described in detail.

[0098] In one embodiment, the second carrier head 12131 of the third rotating part 1213 can acquire the substrate in its pre-grinding state, transferred (loaded) from the first rotating part 1211, at the third transfer position TP3. Once the substrate loading is complete, the second carrier head 12131 can move to the second grinding position PP2 by means of the rotation of the third rotating part 1213. The second grinding position PP2 can be the location where the third transfer track TP3 overlaps with the second grinding pad 1217. In other words, at least a portion of the second grinding pad 1217 can overlap with the second grinding position PP2. Grinding of the substrate can be performed at the second grinding position PP2. In other words, the second carrier head 12131 can grind the substrate in its pre-grinding state at the second grinding position PP2. Once the substrate grinding is complete, the second carrier head 12131 can move back to the third transfer position TP3 by means of the rotation of the third rotating part 1213. The second carrier head 12131 can then transfer (unload) the substrate in its post-grinding state from the third transfer position TP3 to the first rotating part 1211.

[0099] In one embodiment, while a substrate is being ground at the second grinding position PP2, another substrate can be moved (loaded) from the first rotating part 1211 to the third rotating part 1213, or moved (unloaded) from the third rotating part 1213 to the first rotating part 1211 at the third transfer position TP3. In other words, while a substrate is being ground at one second carrier head 12131, another substrate can be loaded or unloaded at another second carrier head 12131.

[0100] In one embodiment, while the second carrier head 12131 of the third rotating part 1213 rotates along the third transfer track TO3, it can alternately be located at the third transfer position TP3 and the second polishing position PP2. For example, when one second carrier head 12131 is located at the third transfer position TP3, the other second carrier head 12131 can be located at the second polishing position PP2. As the third rotating part 1213 rotates, if one second carrier head 12131 moves from the third transfer position TP3 to the second polishing position PP2, the other second carrier head 12131 can move from the second polishing position PP2 to the third transfer position TP3. In other words, the third rotating part 1213 can transfer one substrate from the second polishing position PP2 to the third transfer position TP3 while simultaneously transferring another substrate from the third transfer position TP3 to the second polishing position PP2.

[0101] In one embodiment, grinding is performed once on the first grinding pad 1216 and a second grinding on the second grinding pad 1217. For example, either the first grinding pad 1216 or the second grinding pad 1217 can be a polishing pad. Alternatively, in one embodiment, after grinding on either the first grinding pad 1216 or the second grinding pad 1217, the material may not be transferred to the other grinding pad, but instead transferred to the second worktable 15 and directly subjected to the cleaning process.

[0102] The following reference Figure 2 and Figure 3 The first loading section 1214 will be described.

[0103] In one embodiment, the first loading unit 1214 may be located at the second transfer position TP2. The first loading unit 1214 may load the substrate from the third worktable 12111 to the first carrier head 12121 at the second transfer position TP2, or unload the substrate from the first carrier head 12121 to the third worktable 12111. For this purpose, the first loading unit 1214 may be configured to be able to move up and down in the vertical direction.

[0104] In one embodiment, the first loading unit 1214 may further include a cleaning nozzle 12141. The cleaning nozzle 12141 can spray cleaning fluid and clean the first carrier head 12121 located at the second transfer position TP2. For example, when the first loading unit 1214 is in the state of surrounding the first carrier head 12121 at the second transfer position TP2, cleaning fluid can be sprayed from the cleaning nozzle 12141 to clean the first carrier head 12121. At this time, the substrate may not be clamped by the first carrier head 12121. The film (not shown) of the first carrier head 12121 can be cleaned by the cleaning fluid sprayed from the cleaning nozzle 12141. Therefore, the phenomenon of abrasive particles adhering to the film can be prevented. Furthermore, when the first carrier head 12121 is in the state of the second transfer position TP2, space can be saved by cleaning the first carrier head 12121 by means of the operation of the first loading unit 1214. Furthermore, while one first carrier head 12121 is grinding the substrate at the first grinding position PP1, the other first carrier head 12121 can be cleaned at the second transfer position TP2, thus saving time.

[0105] In one embodiment, the second loading unit 1215 may be located at the third transfer position TP3. The second loading unit 1215 can load the substrate from the third worktable 12111 to the second carrier head 12131 at the third transfer position TP3, or it can unload the substrate from the second carrier head 12131 to the third worktable 12111. For this purpose, the second loading unit 1215 may be configured to be vertically movable. Furthermore, like the first loading unit 1214, the second loading unit 1215 may include a cleaning nozzle (not shown). The second loading unit 1215 may be configured to clean the second carrier head 12131 using the cleaning nozzle. The cleaning nozzle of the second loading unit 1215 is substantially the same as the cleaning nozzle 12141 of the first loading unit 1214; therefore, reference is made to the description of the cleaning nozzle 12141 of the first loading unit 1214.

[0106] In one embodiment, an additional spray nozzle (not shown) may be provided at the first transfer position TP1. When the substrate is placed on the third worktable 12111 at the first transfer position TP1, the spray nozzle may spray pure water or the like to prevent the substrate from drying while waiting.

[0107] Furthermore, the second polishing line 121b, as a configuration corresponding to the first polishing line 121a, can be understood as substantially the same as, through... Figure 2 and Figure 3 The first polishing line 121a is the same as described. Therefore, the description of the second polishing line 121b refers to the description of the first polishing line 121a.

[0108] Figure 4This is a schematic perspective view of a first cleaning line according to one embodiment.

[0109] Reference Figure 4 According to one embodiment, the first cleaning line 122a can perform a cleaning process to clean the polished substrate. The first cleaning line 122a may include a chamber section 1220 and a third handling robot 1221.

[0110] In one embodiment, the chamber portion 1220 can provide space for performing a cleaning process on the substrate. In one embodiment, the chamber portion 1220 can be formed in multiple ways. For example, the chamber portion 1220 may include a first chamber portion 1220a and a second chamber portion 1220b disposed horizontally spaced from the first chamber portion 1220a. However, this is an example, and the number of chamber portions 1220 is not limited thereto.

[0111] In one embodiment, the chamber portion 1220 may include a cleaning chamber for cleaning a substrate. The cleaning chamber may be provided with nozzles for supplying cleaning fluid to the substrate. In one embodiment, multiple cleaning chambers may be formed. For example, the chamber portion 1220 may include first to fifth cleaning chambers 12201, 12202, 12203, 12204, and 12205. Furthermore, the first to fifth cleaning chambers 12201, 12202, 12203, 12204, and 12205 may each be provided with nozzles for supplying different types of cleaning fluid. At least a portion of the first to fifth cleaning chambers 12201, 12202, 12203, 12204, and 12205 may be chambers for performing the substrate cleaning process, while other portions may be chambers for performing the drying of the cleaning fluid.

[0112] In one embodiment, the first chamber portion 1220a may include first to third cleaning chambers 12201, 12202, and 12203, and the second chamber portion 1220b may include a fourth cleaning chamber 12204 and a fifth cleaning chamber 12205. However, this is merely an example, and the number and arrangement of chambers are not limited thereto.

[0113] In one embodiment, multiple cleaning chambers can be stacked vertically. For example, the first to third cleaning chambers 12201, 12202, and 12203 of the first chamber section 1220a can be stacked sequentially from bottom to top (e.g., in the +z-axis direction) with the ground as a reference. Furthermore, the fourth cleaning chamber 12204 and the fifth cleaning chamber 12205 of the second chamber section 1220b can be stacked sequentially from top to bottom (e.g., in the -z-axis direction) with the ground as a reference.

[0114] In one embodiment, the third handling robot 1221 can move, remove, or transfer substrates into multiple cleaning chambers. In one embodiment, the third handling robot 1221 can support the underside of the substrate. For example, the third handling robot 1221 may include a clamping part for clamping the substrate and stably transferring it. In one embodiment, the third handling robot 1221 may be configured between the first chamber portion 1220a and the second chamber portion 1220b. For example, the first chamber portion 1220a, the third handling robot 1221, and the second chamber portion 1220b may be configured along a straight line in the x-axis direction. However, this is an example, and the configuration of the chamber portions 1220 and the third handling robot 1221 is not limited thereto. For example, if there are multiple chamber portions 1220, the multiple chamber portions 1220 may be spaced apart along the circumferential direction of the third handling robot 1221.

[0115] In one embodiment, the third handling robot 1221 can move in both vertical and horizontal directions and can rotate about an axis perpendicular to the ground. Therefore, the third handling robot 1221 can freely access the plurality of cleaning chambers stacked vertically and freely access the first chamber portion 1220a and the second chamber portion 1220b arranged horizontally spaced apart.

[0116] Figure 5 This is a schematic side view illustrating a first cleaning line in a cleaning process for a substrate according to one embodiment.

[0117] Reference Figure 5 According to one embodiment, the first cleaning line 122a can use a third handling robot 1221 to clean substrates from multiple chamber sections 1220.

[0118] In one embodiment, the cleaning chamber has an entrance / exit (not shown) in at least one direction to allow the substrate to enter and exit. In one embodiment, the third handling robot 1221 can move the substrate into any one of the first to fifth cleaning chambers 12201, 12202, 12203, 12204, and 12205. Furthermore, the third handling robot 1221 can wait while cleaning the substrate within the cleaning chamber. And, when the cleaning of the substrate is completed within the cleaning chamber, the third handling robot 1221 can remove the substrate and transfer it to another location among the first to fifth cleaning chambers 12201, 12202, 12203, 12204, and 12205. For example, as... Figure 5 As shown in (a), the third handling robot 1221 can transfer the substrate in the order of the first cleaning chamber 12201, the second cleaning chamber 12202, the third cleaning chamber 12203, the fourth cleaning chamber 12204, and the fifth cleaning chamber 12205. Furthermore, as... Figure 5As shown in (b), the first handling robot 1221 can transfer the substrate in the order of the first cleaning chamber 12201, the third cleaning chamber 12203, the second cleaning chamber 12202, the fourth cleaning chamber 12204, and the fifth cleaning chamber 12205. Therefore, by changing the order in which the cleaning solution is exposed to the substrate according to the cleaning process, the cleaning process can be performed by changing the path of the substrate transfer without changing the position of the cleaning chambers or the cleaning solution, thus increasing the degree of process flexibility. However, Figure 5 The embodiments in (a) and (b) are merely illustrative and not intended to be limiting. For example, the third handling robot 1221 can pass through multiple cleaning chambers in various sequences. Furthermore, the positions of the cleaning chambers at the start and end of the cleaning process can be fixed. For example, the cleaning process can begin in the first cleaning chamber 12201 and end in the fifth cleaning chamber 12205. For example, the substrate cleaned in the fifth cleaning chamber 12205 can be received using a device located at the first receiving position (e.g., ...). Figure 1 The first receiving position RP1) of the first transport robot (e.g.: Figure 1 The first handling robot 14) transfers the wafer to the box or wafer transfer box located in the front-end module 11.

[0119] Figure 6 This is a schematic perspective view of the first chamber portion according to one embodiment.

[0120] Reference Figure 6 According to one embodiment, the first chamber portion 1220a can be transferred by the second handling robot 16 after grinding.

[0121] In one embodiment, the second handling robot 16 can transfer the polished substrate from the first polishing line 121a or the second polishing line 121b to any one of the multiple cleaning chambers of the first cleaning line 122a or the second cleaning line 122b. For example, the second handling robot 16 can transfer the substrate placed on the second workbench (e.g.: Figure 2 The polished substrate from the second worktable 12111 is transferred to any one of the multiple cleaning chambers of the first cleaning line 122a or the second cleaning line 122b, wherein the second worktable is located at the first transfer position (e.g.: Figure 2 The first transfer position TP1). For example, the second handling robot 16 can transfer the polished substrate from either the first polishing line 121a or the second polishing line 121b to the first chamber portion 1220a of either the first cleaning line 122a or the second cleaning line 122b.

[0122] In one embodiment, such as Figure 6As shown in (a), the second transport robot 16 can transfer the polished substrate from the first transfer position TP1 to the first cleaning chamber 12201 of the first chamber section 1220a. However, Figure 6 (a) This is merely an example for ease of understanding, and the location where the substrate is obtained from the second handling robot 16 is not limited to the first cleaning chamber 12201. For example, the second handling robot 16 may also transfer the substrate to the second cleaning chamber 12202 or the third cleaning chamber 12203.

[0123] In one embodiment, the first cleaning line 122a may further include a transfer table 1222. A second handling robot 16 can transfer the polished substrate from the first transfer position TP1 to the transfer table 1222. The transfer table 1222 may be arranged adjacent to a cleaning chamber. Furthermore, the transfer table 1222 may be located between two adjacent cleaning chambers in a plurality of cleaning chambers. For example, in... Figure 6 In (b), the transfer worktable 1222 can be located between the first cleaning chamber 12201 and the second cleaning chamber 12202. However, Figure 6 (b) This is merely an illustrative example and is not limited to the transfer stage 1222 being located between the first cleaning chamber 12201 and the second cleaning chamber 12202. For example, the transfer stage 1222 may also be located below the first cleaning chamber 12201 or between the second cleaning chamber 12202 and the third cleaning chamber 12203. If the second handling robot 16 transfers the polished substrate to the transfer stage 1222, then the third handling robot 1221 may transfer the substrate transferred to the transfer stage 1222 to any one of the multiple cleaning chambers.

[0124] Furthermore, the second cleaning line 122b, as a configuration corresponding to the first cleaning line 122a, can be understood as being connected to the first cleaning line 122a. Figures 4 to 6 The description of the first cleaning line 122a is substantially the same. Therefore, the description of the second cleaning line 122b refers to the description of the first cleaning line 122a.

[0125] As described above, although embodiments have been illustrated with limited figures, those skilled in the art can apply various technical modifications and variations based on the above. For example, appropriate results can be obtained even if the described techniques are performed in a different order than those described, and / or the described system, structure, device, circuit, and other constituent elements are combined or integrated in a different form than those described, or replaced or substituted with other constituent elements or equivalents.

[0126] Therefore, other embodiments, other implementations, and contents equivalent to those in the patent claims also fall within the scope of the claims.

Claims

1. A substrate processing system, characterized in that, include: Front-end module; The first process line includes a first grinding line and a first cleaning line; The second process line, which includes a second grinding line and a second cleaning line, is arranged in parallel with the first process line; The first workbench is located between the first cleaning line and the second cleaning line; The first transport robot moves the substrate from the front-end module to the first worktable; The second worktable is located between the first grinding line and the second grinding line; The second handling robot transfers the substrate between at least two locations among the first cleaning line, the second cleaning line, the first workbench, and the second workbench. The first rotating part forms a first transfer track in a circle according to rotation, and transfers the substrate between the first transfer position, the second transfer position and the third transfer position; The second rotating part forms a second transfer track in a circle according to rotation, and transfers the substrate between the second transfer position and the first grinding position; The third rotating part forms a third transfer track in a circle according to rotation, and transfers the substrate between the third transfer position and the second grinding position; The second rotating part has two first carrier heads. While one first carrier head is grinding a substrate, the other first carrier head is loading or unloading another substrate. The third rotating part has two second carrier heads. While one second carrier head is grinding a substrate, the other second carrier head is loading or unloading another substrate.

2. The substrate processing system according to claim 1, characterized in that, Also includes: The third transport robot transfers the substrate between at least two locations on the second workbench, the first grinding line, and the second grinding line.

3. The substrate processing system according to claim 2, characterized in that, The first grinding line and the second grinding line further include: A first abrasive pad, at least a portion of which rotates at a position overlapping with a first abrasive position; and The second abrasive pad rotates at least a portion of its position overlapping with the second abrasive position.

4. The substrate processing system according to claim 3, characterized in that, The second transport robot moves the substrate from the first worktable to the second worktable before grinding.

5. The substrate processing system according to claim 4, characterized in that, The third transport robot moves the substrate from the second workbench to any one of the first transfer positions on the first and second grinding lines.

6. The substrate processing system according to claim 5, characterized in that, The first rotating part includes at least one third worktable located sequentially at the first transfer position, the second transfer position, and the third transfer position.

7. The substrate processing system according to claim 6, characterized in that, The second rotating part includes a first carrier head that alternately moves between a second conveying position and a first grinding position. The third rotating part includes a second carrier head that alternately moves between the third transfer position and the second grinding position.

8. The substrate processing system according to claim 7, characterized in that, The first and second grinding lines also include: A first loading unit, which loads a substrate onto or unloads a substrate from a first carrier head at a second transfer position; and The second loading unit loads the substrate onto the second carrier head or unloads the substrate from the second carrier head at the third transfer position.

9. The substrate processing system according to claim 8, characterized in that, The first loading section and the second loading section respectively include: The cleaning nozzle cleans the first or second carrier head located at the second or third transfer position.

10. The substrate processing system according to claim 1, characterized in that, The second transport robot will transfer the polished substrate from either the first polishing line or the second polishing line to either the first cleaning line or the second cleaning line.

11. The substrate processing system according to claim 10, characterized in that, The first handling robot will transfer the cleaned substrate from either the first cleaning line or the second cleaning line to the front-end module.

12. The substrate processing system according to claim 1, characterized in that, The first cleaning line and the second cleaning line each include: The chamber section includes at least a portion of multiple cleaning chambers stacked in a vertical direction; The fourth transport robot moves the substrate from at least one of the multiple cleaning chambers to another cleaning chamber.

13. The substrate processing system according to claim 12, characterized in that, The chamber section includes: The first chamber section includes at least one cleaning chamber; The second chamber section includes at least one cleaning chamber, which is horizontally spaced from the first chamber section. The fourth transport robot is located between the first chamber and the second chamber.

14. The substrate processing system according to claim 13, characterized in that, The second transport robot will transfer the polished substrate from either the first polishing line or the second polishing line to the first chamber of either the first cleaning line or the second cleaning line.

15. The substrate processing system according to claim 14, characterized in that, The first transport robot transfers the cleaned substrate from the second chamber of either the first or second cleaning line to the front-end module.

16. A substrate processing system, characterized in that, include: The front-end module configured in the first direction; The first process line includes a first grinding line and a first cleaning line, which are arranged in a second direction perpendicular to the first direction. The second process line includes a second grinding line and a second cleaning line, which are arranged in a third direction that is perpendicular to the first direction and parallel to the second direction. The second workbench is located between the first process line and the second process line. The substrate is transferred from the first polishing line or the second polishing line to the first cleaning line or the second cleaning line via the second worktable; or it is transferred from the first cleaning line or the second cleaning line to the first polishing line or the second polishing line. The first rotating part forms a first transfer track in a circle according to rotation, and transfers the substrate between the first transfer position, the second transfer position and the third transfer position; The second rotating part forms a second transfer track in a circle according to rotation, and transfers the substrate between the second transfer position and the first grinding position; The third rotating part forms a third transfer track in a circle according to rotation, and transfers the substrate between the third transfer position and the second grinding position; The second rotating part has two first carrier heads. While one first carrier head is grinding a substrate, the other first carrier head is loading or unloading another substrate. The third rotating part has two second carrier heads. While one second carrier head is grinding a substrate, the other second carrier head is loading or unloading another substrate.

17. The substrate processing system according to claim 16, characterized in that, The first grinding line and the second grinding line further include: A first abrasive pad, at least a portion of which rotates at a position overlapping with a first abrasive position; and The second abrasive pad rotates at least a portion of its position overlapping with the second abrasive position.

18. The substrate processing system according to claim 17, characterized in that, The first rotating part includes at least one third worktable located sequentially at the first transfer position, the second transfer position, and the third transfer position.

19. The substrate processing system according to claim 18, characterized in that, The second rotating part includes a first carrier head that alternately moves between a second conveying position and a first grinding position. The third rotating part includes a second carrier head that alternately moves between the third transfer position and the second grinding position.

20. The substrate processing system according to claim 19, characterized in that, The first and second grinding lines also include: A first loading unit, which loads a substrate onto or unloads a substrate from a first carrier head at a second transfer position; and The second loading unit loads the substrate onto the second carrier head or unloads the substrate from the second carrier head at the third transfer position.

Images