Interface control module and circuit
By providing an interface control module including a main chip, pluggable connector and adjustable power submodule, the problem of limited IO port in electronic product research and development is solved, flexible control and voltage regulation of IO interface are realized, and R&D efficiency and economy are improved.
Patent Information
- Application Number
- CN202111660077.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2021-12-30
- Publication Date
- 2025-04-15
- Estimated Expiration
- 2041-12-30
AI Technical Summary
During the research and development of existing electronic products, the IO port is limited and cannot meet the needs, which leads to the need to redesign the motherboard, which consumes a lot of manpower, material resources and time, and is inefficient.
An interface control module is provided, including a main chip, a pluggable connector and a power submodule with adjustable power supply level, which can control the on-state of the IO interface in the target circuit board and can adjust the IO interface voltage level as required.
It realizes high flexibility, reusability, separation and flexible adjustment of voltage levels of IO interfaces, greatly facilitating the R&D and use process, and improving efficiency and economy.
Smart Images
Figure CN114296377B_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the field of industrial electronic equipment detection, and in particular to an interface control module and a circuit. Background Art
[0002] With the continuous advancement of science and technology, electronic products will tend to be diversified, integrated and intelligent in the future. Electronic products are updated faster and faster, with more and more functions and higher and higher design complexity, requiring shorter R&D cycles and smaller sizes to facilitate carrying and installation.
[0003] At present, the circuit design of circuit boards is complex and high-density. In order to better reduce costs and shorten the R&D cycle, modularization of circuits greatly facilitates R&D and application, so the idea of modular application is proposed. The IO ports on the development boards or test boards purchased on the market are often limited, and with the continuous deepening of R&D, the functional test boards developed by individuals and teams need to carry more and more equipment, which makes it easy for the IO ports to fail to meet the needs. In this case, if the motherboard is redesigned to control the IO ports, it often takes a lot of manpower, material resources and time, which reduces efficiency and is not economical. Summary of the invention
[0004] An embodiment of the present application provides an interface control module and circuit, which can control the conduction state of the IO interface in the target circuit board, and has the advantages of high flexibility, reusability, detachability, and the ability to adjust the voltage level of the IO interface in the target circuit board as needed, greatly facilitating the research and development and use process.
[0005] In a first aspect, the present invention provides the following technical solution through an embodiment of the present invention:
[0006] An interface control module is provided, the interface control module is used to connect with the control interface of a target circuit board, the control interface is connected with the input and output interface of the target circuit board, the interface control module comprises: a main chip, a pluggable connector and a power supply submodule with adjustable power supply level; the power supply submodule is connected with the power input terminal of the main chip, and is used to provide a target level of voltage to the input and output interface of the main chip; the input and output interface of the main chip is connected with the control interface through the pluggable connector, and the main chip is used to control the on and off state of the input and output interface in the target circuit board based on a control signal sent by the target circuit board, and provide the target level of voltage to the input and output interface in the on state of the target circuit board.
[0007] Preferably, the module also includes: a conversion switch, the conversion switch includes a first gear and a second gear, the first port of the conversion switch is connected to the power output end of the power submodule, the second port of the conversion switch is connected to the power output end of the target circuit board, and the third port of the conversion switch is connected to the power input end of the main chip; when the first port and the third port are connected, the conversion switch is in the first gear, and when the second port and the third port are connected, the conversion switch is in the second gear.
[0008] Preferably, the module further comprises: a pin header connected to the main chip and used to control the address pin of the main chip to be high level valid or low level valid, so as to control the on / off state of the input / output interface in the target circuit board.
[0009] Preferably, the power submodule includes: a first power chip, a second power chip, a first dip switch and a second dip switch; the first dip switch is connected to the first power chip, and is used to adjust the output voltage of the first power chip to a first target voltage, the second dip switch is connected to the second power chip, and is used to adjust the output voltage of the second power chip to a second target voltage, and the output ends of the first power chip and the second power chip are both connected to the power input end of the main chip.
[0010] Preferably, the first target voltage is 1.8V, 2.5V, 3.3V or 5V.
[0011] Preferably, the second target voltage is 1.8V, 2.5V, 3.3V or 5V.
[0012] Preferably, the power enable terminals of the first power chip and the second power chip are connected to the target circuit board through the pluggable connector, so as to receive an enable signal sent by the target circuit board.
[0013] Preferably, the power submodule also includes: a power switch, a first pull-up resistor and a second pull-up resistor, one end of the power switch is connected to an external power adapter; the other end of the power switch is connected to the power enable end of the first power chip through the first pull-up resistor, and is connected to the power enable end of the second power chip through the second pull-up resistor.
[0014] Preferably, the adapted power supply voltage of the external power adapter is 5V.
[0015] In the second aspect, in the first aspect, the present invention provides the following technical solution through an embodiment of the present invention:
[0016] A circuit comprises: a target circuit board and the interface control module described in any one of the first aspects above, wherein the target circuit board and the interface control module are pluggable and connected.
[0017] One or more technical solutions provided in the embodiments of the present application have at least the following technical effects or advantages:
[0018] An embodiment of the present invention provides an interface control module and circuit, wherein the interface control module is used to connect to a control interface of a target circuit board, and the control interface is connected to an input / output interface of the target circuit board, and the interface control module includes: a main chip, a pluggable connector, and a power submodule with an adjustable power supply level. In the present application, the main chip of the control interface module is connected to the control interface of the target circuit board through a pluggable connector, and the target circuit board can configure the values of different registers in the main chip through an integrated circuit bus to control the on / off state of the control interface between the pluggable connector and the target circuit board, thereby controlling the on / off state of the input / output interface of the target circuit board connected to the control interface, and providing the input / output interface of the target circuit board to the outside. Among them, the interface control module is connected to the target circuit board by adopting a pluggable connector, which can realize the free separation of the IO interface control module and has the characteristics of high flexibility. The target circuit board controls multiple parallel IOs through the communication method of the integrated circuit bus, and adopts a power sub-module with adjustable level to supply power to the main chip, so that the IO interface provided by the interface control module has the advantage that the IO level can be adjusted as needed. Therefore, the interface control module provided by the present application has the advantages of high flexibility, reusability, detachability, and IO voltage level can be adjusted as needed. It can effectively improve the utilization efficiency, has high economy and convenience, and greatly facilitates the research and development process and the use process. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.
[0020] Figure 1 A schematic diagram of the structure of an interface control module provided by an embodiment of the present invention;
[0021] Figure 2 A schematic diagram of the connection between the target circuit board and the interface control module provided by an embodiment of the present invention;
[0022] Figure 3 A schematic diagram of the specific structure of the interface control module provided in an embodiment of the present invention;
[0023] Figure 4 A schematic diagram of an exemplary dip switch provided for an embodiment of the present invention;
[0024] Figure 5 A schematic diagram of the relationship between the output current and output voltage of the IO interface provided in an embodiment of the present invention;
[0025] Figure 6 An example diagram of the use of an interface on a target circuit board connected to an interface control module provided by an embodiment of the present invention;
[0026] Figure 7 A schematic diagram of the structure of a circuit provided by an embodiment of the present invention. DETAILED DESCRIPTION
[0027] The embodiment of the present application provides an interface control module and circuit, which can control the conduction state of the IO interface in the target circuit board, and has the advantages of high flexibility, reusability, detachability, and the ability to adjust the voltage level of the IO interface in the target circuit board as required, which greatly facilitates the research and development and use process.
[0028] The technical solution of the embodiment of the present application is to solve the above technical problems, and the overall idea is as follows:
[0029] An interface control module is provided, the interface control module is used to connect with the control interface of a target circuit board, the control interface is connected with the input and output interface of the target circuit board, the interface control module comprises: a main chip, a pluggable connector and a power supply submodule with adjustable power supply level; the power supply submodule is connected with the power input terminal of the main chip, and is used to provide a target level of voltage to the input and output interface of the main chip; the input and output interface of the main chip is connected with the control interface through the pluggable connector, and the main chip is used to control the on and off state of the input and output interface in the target circuit board based on a control signal sent by the target circuit board, and provide the target level of voltage to the input and output interface in the on state of the target circuit board.
[0030] In order to better understand the above technical solution, the above technical solution will be described in detail below in conjunction with the accompanying drawings and specific implementation methods.
[0031] An interface control module provided by an embodiment of the present invention, specifically, Figure 1 As shown, the interface control module 100 is used to connect to the control interface of the target circuit board 200, and the control interface is connected to the input and output interface of the target circuit board 100. The interface control module 100 may include a main chip 101, a pluggable connector 102 and a power submodule 300 with adjustable power supply level.
[0032] Among them, the power submodule is connected to the power input terminal of the main chip, and is used to provide multiple target levels of voltage to the input and output interface of the main chip. The input and output interface of the main chip can be connected to the control interface through a pluggable connector to control the on and off state of the input and output interface in the target circuit board, and provide the target level of voltage to the input and output interface in the on state in the target circuit board. For example: the main chip here can be a TCA9534 chip.
[0033] Specifically, when the target circuit board receives the connection signal from the main chip, the target circuit board can configure the values of different registers in the main chip to control the on / off status of multiple input / output interfaces between the pluggable connector and the main chip. In addition, the present application connects the pluggable connector in the interface control membrane block to the target circuit board, so as to realize the plug-and-play of the interface control module, which is highly convenient.
[0034] In a specific embodiment, a printed circuit board (PCB) that needs to control the IO port is used as a target circuit board, and the target circuit board and the interface control module provided by the present application are connected together through a pluggable male and female matching connector. Figure 2 shown.
[0035] Specifically, the connector on the target circuit board is a female socket J1, and the connector on the interface control module is a male socket J2, and the PIN definition of the female socket J1 corresponds to the PIN definition of the male socket J2, so that the target circuit board and the interface control module can communicate and connect. For example, the pluggable connector can be a double-row pin header with a pitch of 2.54mm. By reserving a double-row female socket with a pitch of 2.54mm on the target circuit board, the target circuit board and the pluggable connector can be installed.
[0036] It should be noted that the input and output interface of the target circuit board in the present application can be a separate row of female sockets connected to the control interface, and the input and output interfaces of the female sockets correspond one-to-one with the definition of the control interface. The input and output interface of the target circuit board can also be a female socket integrated with the control interface, that is, the control interface can be a female socket that can be connected to multiple parties. In actual use, the female socket that can be connected to multiple parties is connected to the pluggable connector, and a female socket with a one-to-one correspondence of interface definitions can be provided to the outside.
[0037] In the specific implementation process, for the situation where the IO interface needs to be controlled, the present application controls an interface control module with 8 IO interfaces through a set of integrated circuit buses (Inter-Integrated Circuit, IIC). The target circuit board controls the opening and closing of the 8 IO interfaces through the IIC, as well as as input or output, as a high level or a low level.
[0038] Specifically, the target circuit board is connected to the main chip through the pluggable connector through IIC communication, and different values of different registers inside the main chip are configured through IIC to control IO0 to IO7 to be high or low. That is, the present application controls the 8 input and output ports between the main chip and the pluggable connector through the target circuit board to control the on and off states of multiple input and output interfaces between the pluggable connector and the target circuit board.
[0039] Furthermore, considering the compatibility of use, the power supply mode of the interface control module is enriched, such as Figure 3 As shown, the interface control module may also include: a conversion switch 400, the conversion switch includes a first gear and a second gear, the first port of the conversion switch is connected to the power output end of the power submodule, the second port of the conversion switch is connected to the power output end of the target circuit board, and the third port of the conversion switch is connected to the power input end of the main chip; when the first port and the third port are connected, the conversion switch is in the first gear, and when the second port and the third port are connected, the conversion switch is in the second gear.
[0040] Specifically, the third port of the conversion switch is connected to the power input terminal of the main chip, and the power supply mode of the main chip is controlled by the conversion switch, including: when the conversion switch is in the first gear, the power output terminal of the power submodule is connected to the conversion switch, so that the power submodule supplies power to the main chip; when the conversion switch is in the second gear, the power output terminal of the target circuit board is connected to the conversion switch, so that the target circuit board supplies power to the main chip. For example, the conversion switch can be a single-pole double-gate switch. Therefore, through the above connection mode, when the conversion switch is in different gears, the main chip is powered by different power supplies.
[0041] In a specific embodiment, Figure 3 As shown, the power submodule 300 may specifically include: a first power chip 301, a second power chip 302, a first dip switch 303, and a second dip switch 304. The first dip switch is connected to the first power chip, and is used to adjust the output voltage of the first power chip to a first target voltage, the second dip switch is connected to the second power chip, and is used to adjust the output voltage of the second power chip to a second target voltage, and the output terminals of the first power chip and the second power chip are connected to the power input terminal of the main chip.
[0042] Optionally, the first target voltage may be 1.8 V, 2.5 V, 3.3 V or 5 V, and the second target voltage may be 1.8 V, 2.5 V, 3.3 V or 5 V. In actual use, the first target voltage value and the second target voltage value may be arbitrarily adjusted according to actual needs.
[0043] Specifically, if Figure 3As shown, the output voltages VIN1 and VIN2 of the first power chip and the second power chip can be controlled by the first dip switch and the second dip switch. The dip switches are set to 1.8V, 2.5V, 3.3V, and 5V by default, and can be adjusted by toggling the first dip switch and the second dip switch to different positions. Figure 4 As shown, it is a schematic diagram of the first dip switch and the second dip switch, wherein R8, R9, R10 and R11 correspond to different resistance values respectively. When different switches in SW1 are turned on, the output voltage of the power chip can be controlled to change.
[0044] like Figure 5 As shown, it is a relationship curve between the output current and output voltage of the main chip IO interface provided by the present application, and the diagram reflects the relationship curve between the voltage and current of the IO interface corresponding to different levels of output voltage.
[0045] Of course, as an optional embodiment, the power submodule may include only one dip switch for adjusting the output voltage of the first power chip or the second power chip to 1.8 V, 2.5 V, 3.3 V or 5 V. In addition, the adjustable voltage of the dip switch may also include more voltages, for example, 2.8 V, 3 V, etc.
[0046] In a specific embodiment, Figure 3 As shown, the specific structure of the interface control module provided by the present application may include: the voltage output interfaces VIN1 and VIN2 of the first power chip and the second power chip as the aforementioned first port, and the power interfaces VIN1 and VIN2 of the pluggable connector connected to the power output end of the target circuit board as the second port. When the conversion switch is in the first gear, the power output end of the power submodule is connected to the conversion switch, and the main chip is powered by the power submodule; when the conversion switch is in the second gear, the power output end of the target circuit board is connected to the conversion switch, and the main chip is powered by the target circuit board.
[0047] Optionally, the control end of the conversion switch can be controlled by the target circuit board, and the target circuit board controls the gear position of the conversion switch. Of course, in the present application, the gear position of the conversion switch can also be selected by manual toggle.
[0048] Therefore, the present application improves the compatibility of the interface control module by connecting the power input terminal of the main chip not only to the power submodule with adjustable power supply level, but also to the power input terminal of the target circuit board. When the main chip is connected to the power submodule, multiple levels of voltage can be provided to the main chip according to user needs, so that the interface control module can provide IO interfaces of multiple different voltage levels to the target circuit board.
[0049] As an optional embodiment, the power enable terminals of the first power chip and the second power chip are connected to the target circuit board through a pluggable connector to receive an enable signal sent by the target circuit board. Figure 3 As shown, the power enables EN1 and EN2 of the first power chip and the second power chip are connected to the target circuit board through a pluggable connector and are controlled by the target circuit board.
[0050] It should be noted that due to the inherent delay characteristics of the connection between the circuit board and the interface control module, when the target circuit board sends an enable signal to the first power chip and the second power chip in the interface control module, the power enables EN1 and EN2 will obtain the enable signal after a certain delay.
[0051] In a specific embodiment, Figure 3 As shown, the power submodule 300 may also include: a power switch 305, a first pull-up resistor R1 and a second pull-up resistor R2, one end of the power switch is connected to the external power adapter; the other end of the power switch is connected to the power enable end of the first power chip through the first pull-up resistor, and is connected to the power enable end of the second power chip through the second pull-up resistor. Wherein, the adapted power voltage of the external power adapter may be 5V, and the resistance values of the first pull-up resistor R1 and the second pull-up resistor R2 may both be 4.7k ohms.
[0052] Of course, in other embodiments, the adaptive power supply voltage of the external power adapter, the first pull-up resistor R1 and the second pull-up resistor R2 may also be other values. For example, the adaptive power supply voltage is 7.5V, the resistance values of the first pull-up resistor R1 and the second pull-up resistor R2 may both be 10k ohms, etc.
[0053] Specifically, one end of the power switch can be connected to an external power adapter through a DC socket. When the target circuit board does not need to control EN1 and EN2, the power enables EN1 and EN2 can be left floating. EN1 and EN2 are connected to a 5V power supply through a first pull-up resistor and a second pull-up resistor in the interface control module, thereby enabling the first power chip and the second power chip.
[0054] Among them, the power switch can control the connection between the DC socket and the first power chip and the second power chip. When the power switch is disconnected, the power supply of the first power chip and the second power chip is disconnected. When the power switch is closed, the first power chip and the second power chip are powered by an external power adapter.
[0055] Furthermore, if Figure 3As shown, the module may also include a pin header 500, which is connected to the main chip and is used to control the address pin of the main chip to be high level effective or low level effective. The target circuit board will control the on-off state of the input and output interface of the main chip through IIC according to the influence of the pin header on the address pin of the main chip, so as to control the on-off state of the input and output interface of the target circuit board. Specifically, when the address pin of the main chip is high level effective, the input and output interface of the main chip is turned on when it is at a high level; when the address pin of the main chip is low level effective, the input and output interface of the main chip is turned on when it is at a low level. Among them, the pin header 500 can be a connector with a 2.54mm pitch 3PIN pin header.
[0056] In a specific embodiment, the pin header is used to control the address pin of the main chip to prevent IIC address conflicts, so that when the target circuit board is connected to multiple interface control modules, multiple interface control modules can be used simultaneously. Specifically, the address of the main chip can be controlled by connecting the 2PIN jumper cap to the pin header in different ways, that is, the address ADDR is pulled to a high level or a low level through the jumper cap to achieve address conversion. When the jumper cap is buckled between ADDR and GND, the jumper cap pulls the address ADDR to a low level, and when the jumper cap is buckled between ADDR and VCC, the jumper cap pulls the address ADDR to a high level.
[0057] For example, when the target circuit board is connected to two interface control modules, the first interface control module includes a first row of pins, and the second interface control module includes a second row of pins. In order to prevent the IIC address conflict between the first interface control module and the second interface control module, the address of the interface control module can be adjusted through the pin row so that the IIC addresses of the two are different.
[0058] It should be noted that when the circuit board is connected to multiple interface control modules at the same time, a corresponding plurality of double-row female sockets are also reserved on the target circuit board.
[0059] like Figure 6 As shown, when the interface control module provided in the present application is pluggable and connected to the target circuit board, an application example of the input and output interface connected to the interface control module on the target circuit board is shown in the figure. One of the interfaces on the target circuit board corresponding to the interface control module can be connected to a buzzer, and when the interface is at a high level, it is used to output a sound signal. The other interface can be connected to an LED, and when the interface is at a high level, it is used to output a light signal.
[0060] To sum up, an interface control module provided by an embodiment of the present invention can be optimized for situations where IO ports on a target circuit board do not correspond and IO levels do not match. The interface control module provided by the present application can control the conduction state of the IO interface in the target circuit board. The interface control module has the advantages of high flexibility, reusability, detachability, and the ability to adjust the voltage level of the IO interface in the target circuit board as needed, which greatly facilitates the research and development and use process.
[0061] On the second aspect, based on the same inventive concept, Figure 7 As shown, the present application provides a circuit 500, comprising: a target circuit board 200 and the interface control module 100 as described in any one of the first aspects above, wherein the target circuit board and the interface control module are pluggable connected.
[0062] Those skilled in the art will readily appreciate other embodiments of the invention after considering the specification and practicing the invention disclosed herein. The present invention is intended to cover any variations, uses or adaptations of the present invention that follow the general principles of the present invention and include common knowledge or customary techniques in the art that are not disclosed in this disclosure. The description and examples are to be considered exemplary only, and the true scope and spirit of the present invention are indicated by the following claims.
[0063] Although the preferred embodiments of the present invention have been described, those skilled in the art may make other changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the present invention.
[0064] Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include these modifications and variations.
Claims
1. An interface control module, characterized in that: The interface control module is used to connect with the control interface of the target circuit board, and the control interface is connected with the input and output interface of the target circuit board. The interface control module includes: a main chip, a pluggable connector and a power submodule with adjustable power supply level; The power submodule is connected to the power input terminal of the main chip, and is used to provide a target level of voltage to the input and output interface of the main chip; The input / output interface of the master chip is connected to the control interface through the pluggable connector, and the master chip is used to control the on / off state of the input / output interface in the target circuit board based on the control signal sent by the target circuit board, and provide the target level voltage to the input / output interface in the target circuit board that is in the on state, so as to adjust the voltage level of the input / output interface in the target circuit board; The interface control module also includes: a conversion switch, the conversion switch includes a first gear and a second gear; the first port of the conversion switch is connected to the power output end of the power submodule, the second port of the conversion switch is connected to the power output end of the target circuit board, and the third port of the conversion switch is connected to the power input end of the main chip; when the first port and the third port are connected, the conversion switch is in the first gear, and when the second port and the third port are connected, the conversion switch is in the second gear.
2. The interface control module according to claim 1, characterized in that: Also includes: A pin header is connected to the main chip and is used to control the address pins of the main chip to be high level effective or low level effective, so as to control the on / off state of the input / output interface in the target circuit board.
3. The interface control module according to claim 1, characterized in that: The power submodule includes: a first power chip, a second power chip, a first dip switch and a second dip switch; The first dip switch is connected to the first power chip and is used to adjust the output voltage of the first power chip to a first target voltage. The second dip switch is connected to the second power chip and is used to adjust the output voltage of the second power chip to a second target voltage. The output ends of the first power chip and the second power chip are both connected to the power input end of the main chip.
4. The interface control module according to claim 3, characterized in that: The first target voltage is 1.8V, 2.5V, 3.3V or 5V.
5. The interface control module according to claim 3, characterized in that: The second target voltage is 1.8V, 2.5V, 3.3V or 5V.
6. The interface control module according to claim 3, characterized in that: The power enable ends of the first power chip and the second power chip are connected to the target circuit board through the pluggable connector, and are used to receive an enable signal sent by the target circuit board.
7. The interface control module according to claim 3, characterized in that: The power submodule further includes: a power switch, a first pull-up resistor and a second pull-up resistor; One end of the power switch is connected to an external power adapter, and the other end of the power switch is connected to a power enable end of the first power chip through the first pull-up resistor, and is connected to a power enable end of the second power chip through the second pull-up resistor.
8. The interface control module according to claim 7, characterized in that: The adapted power supply voltage of the external power adapter is 5V.
9. A circuit, characterized in that: include: A target circuit board and an interface control module as claimed in any one of claims 1 to 8, wherein the target circuit board and the interface control module are pluggable connected.
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