Antenna and electronic device including the same

Abstract

In an embodiment, an electronic device may include: a housing having an internal space; a first printed circuit board including a wireless communication circuit; an antenna structure connected to the wireless communication circuit via a first electrical path; and a tunable circuit having a first resistance value and arranged on a second electrical path. The electronic device may also include a low resistance circuit, which is arranged on a third electrical path branched from the second electrical path and includes a resistor and an inductor, the resistor having a second resistance value determined based on the first resistance value, and the inductor having a constant inductance value and arranged between the resistor and ground. The electronic device may also include at least one processor configured to control the tunable circuit.

Description

Technical Field

[0001] Certain embodiments of the present invention generally relate to antennas and electronic devices including the same. Background Art

[0002] One of the current trends in developing electronic devices to meet customer needs is to provide a slim device body, i.e., to reduce the thickness of the electronic device. In addition, such electronic devices are being developed to increase their rigidity, strengthen their design aspects, and differentiate their functional features from those of competitors. In addition, electronic devices are being developed to improve the radiation performance of one or more antennas arranged in the device, which is essential for communication. Improved radiation performance can be achieved by designing various structural aspects of the antenna. Summary of the invention

[0003] [Technical issues]

[0004] The volume and quantity of the antenna structure installed in the electronic device can be determined by the frequency, bandwidth and type of each wireless service deployed in the electronic device. For example, regions around the world mainly use low frequency bands of about 700MHz to 900MHz, mid-frequency bands of about 1700MHz to 2100MHz, high frequency bands of about 2300MHz to 2700MHz, and ultra-high frequency bands of about 3GHz to 100GHz as communication bands. In addition, various wireless communication services such as Bluetooth (BT), global positioning system (GPS) and wireless fidelity (WIFI) can be used. Electronic devices require multiple antennas to support the above-mentioned communication bands. However, the streamlined electronic device may have limited antenna installation space, i.e., space for installing antennas. In order to overcome this limitation, electronic devices can be designed to have antennas grouped according to services with similar frequency bands.

[0005] Typically, an antenna for voice / data communication (GPRS, WCDMA or LTE), which is the main communication mode of an electronic device, can be arranged at the bottom of the electronic device, which has fewer metal parts that impair antenna performance. For example, for products used in Europe, the frequency bands to be implemented may be 24 bands, namely 2G (GSM850, EGSM, DCS, PCS), WCDMA (B1, B2, B5, B8) and LTE (B1, B2, B3, B4, B5, B7, B8, B12, B17, B18, B19, B20, B26, B38, B39, B40, B41). However, when all frequency bands are implemented in one antenna, it is difficult to meet the operator's specifications, meet the specific absorption rate (SAR) standards and minimize human influence. Therefore, the antenna can be combined by at least two services with similar frequency bands. For example, one can design an antenna that can be used for 2G (GSM850, EGSM, DCS, PCS), WCDMA (B1, B2, B5, B8) and LTE (B1, B2, B3, B4, B5, B8, B12, B17, B18, B19, B20, B26, B39) and another antenna that can be used for LTE (B7, B38, B40, B41).

[0006] In some cases, the antenna can be implemented by electrically connecting an antenna structure (e.g., a conductive structure or a conductive pattern) arranged in an electronic device to a communication module. The antenna can be used as a multi-band antenna operating in at least two different frequency bands. In this case, the antenna structure can be designed to be optimized for carrier aggregation (CA) (e.g., 2CA, 3CA, 4CA, etc.) or multiple input multiple output (MIMO).

[0007] When frequency shifting is required for each operator or region, the multi-band antenna can shift its operating band from a first band to a second band by using a tuner or a tunable IC (e.g., a frequency shifting circuit) arranged on an electrical path connecting the antenna structure and the wireless communication circuit.

[0008] The switch of the tunable IC may include a field effect transistor (FET) module and may also include an element having a specific internal resistance value (Ron). Generally, an element with a low internal resistance value should be used to facilitate frequency shifting. However, in this case, frequency shifting may be difficult because the parasitic capacitance value (Coff) within the switch may be large. Therefore, it is inevitable to use an element with a specific internal resistance value or higher. Unfortunately, due to this element, the gain of the antenna including the tunable IC may be reduced, and the radiation performance of the antenna may also be negatively affected.

[0009] [Solution to the problem]

[0010] Certain embodiments of the present invention may provide an electronic device including an antenna.

[0011] Certain embodiments of the present invention may provide an electronic device including an antenna whose radiation performance is improved by a change in its circuit structure.

[0012] Certain embodiments of the present invention may provide an electronic device including an antenna that allows easy frequency shifting without degrading performance.

[0013] According to an embodiment of the present invention, an electronic device may include: a shell having an internal space; a first printed circuit board (PCB) arranged in the internal space of the shell and including a wireless communication circuit; an antenna structure connected to the wireless communication circuit through a first electrical path; a tunable circuit having a first resistance value and arranged on a second electrical path branched from the first electrical path and connected to ground; a low-resistance circuit arranged on a third electrical path branched from the second electrical path and connected to ground, and including a resistor and an inductor, the resistor having a second resistance value determined based on the first resistance value, and the inductor having a constant inductance value and arranged between the resistor and the ground; and at least one processor configured to control the tunable circuit so that the wireless communication circuit can use the antenna structure to send and / or receive wireless signals through a second frequency band offset from the first frequency band.

[0014] According to an embodiment of the present invention, an electronic device may include: a shell having an internal space; a printed circuit board (PCB) arranged in the internal space of the shell and including a wireless communication circuit; an antenna structure electrically connected to the wireless communication circuit; at least one intermediate circuit having a first resistance value, connected to the antenna structure in parallel with the wireless communication circuit, and grounded; and at least one low resistance circuit, connected in parallel with the at least one intermediate circuit, and grounded, and including a resistor and an inductor, the resistor having a second resistance value determined based on the first resistance value, and the inductor having a constant inductance value and arranged between the resistor and the ground.

[0015] Additional aspects will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the presented embodiments.

[0016] [Advantageous Effects of the Invention]

[0017] According to some embodiments of the present invention, a low resistance circuit connected in parallel with at least one internal resistance element included in an intermediate circuit (e.g., a tunable circuit or tuner) arranged for frequency shifting of an antenna can reduce the total resistance value. This increases the antenna gain and also improves the radiation performance of the antenna. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The above and other aspects, features and advantages of certain embodiments of the present invention will become more apparent from the following detailed description in conjunction with the accompanying drawings.

[0019] Figure 1 is a block diagram illustrating an electronic device in a network environment according to an embodiment of the present invention.

[0020] Figure 2A is a perspective view showing a front surface of an electronic device according to an embodiment of the present invention.

[0021] Figure 2B is a perspective view showing a rear surface of an electronic device according to an embodiment of the present invention.

[0022] Figure 3 is an exploded perspective view showing an electronic device according to an embodiment of the present invention.

[0023] Figure 4 is a plan view showing an internal configuration of an electronic device including an antenna structure according to an embodiment of the present invention.

[0024] Figure 5 is a block diagram showing an electronic device including an antenna structure according to an embodiment of the present invention.

[0025] Fig. 6A It is shown Figure 5 A schematic diagram of the tunable circuit configuration is shown.

[0026] Figure 6B It is shown Figure 5 Equivalent circuit diagram of area B.

[0027] Fig. 7A and 7B is a graph showing the radiation efficiency of the antenna structure according to the embodiment of the present invention depending on the presence or absence of a low resistance circuit. DETAILED DESCRIPTION

[0028] The following description with reference to the accompanying drawings is helpful for a comprehensive understanding of the various embodiments of the present invention as defined by the claims and their equivalents. It includes various specific details to assist understanding, but these are to be regarded as examples only. Therefore, it will be appreciated by those of ordinary skill in the art that various changes and modifications may be made to the various embodiments described herein without departing from the scope and spirit of the present invention. In addition, descriptions of known functions and structures have been omitted for clarity and brevity.

[0029] The terms and words used in the following description and claims are not limited to the meaning of the references, but are used by the inventor only to enable a clear and consistent understanding of the present invention. Therefore, it should be clear to those skilled in the art that the following description of various embodiments of the present invention is for illustrative purposes only and is not intended to limit the present invention as defined by the attached claims and their equivalents.

[0030] It should be understood that the singular forms "a," "an," and "the" include plural referents unless the context clearly dictates otherwise. Thus, for example, reference to "a component surface" includes reference to one or more of such surfaces.

[0031] Figure 1 is a block diagram illustrating an electronic device 101 in a network environment 100 according to various embodiments.

[0032] Reference Figure 1 , the electronic device 101 in the network environment 100 may communicate with the electronic device 102 via the first network 198 (e.g., a short-range wireless communication network), or communicate with the electronic device 104 or the server 108 via the second network 199 (e.g., a long-range wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 via the server 108. According to an embodiment, the electronic device 101 may include a processor 120, a memory 130, an input device 150, a sound output device 155, a display device 160, an audio module 170, a sensor module 176, an interface 177, a haptic module 179, a camera module 180, a power management module 188, a battery 189, a communication module 190, a user identification module (SIM) 196, or an antenna module 197. In some embodiments, at least one of the components (e.g., the display device 160 or the camera module 180) may be omitted from the electronic device 101, or one or more other components may be added to the electronic device 101. In some embodiments, some of the components may be implemented as a single integrated circuit. For example, the sensor module 176 (eg, a fingerprint sensor, an iris sensor, or an illumination sensor) may be implemented to be embedded in the display device 160 (eg, a display).

[0033] The processor 120 may run, for example, software (e.g., program 140) to control at least one other component (e.g., hardware component or software component) of the electronic device 101 connected to the processor 120, and may perform various data processing or calculations. According to an embodiment, as at least part of the data processing or calculation, the processor 120 may load a command or data received from another component (e.g., sensor module 176 or communication module 190) into the volatile memory 132, process the command or data stored in the volatile memory 132, and store the result data in the non-volatile memory 134. According to an embodiment, the processor 120 may include a main processor 121 (e.g., a central processing unit (CPU) or an application processor (AP)) and an auxiliary processor 123 (e.g., a graphics processing unit (GPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is independent of or combined with the main processor 121 in operation. Additionally or alternatively, the auxiliary processor 123 may be adapted to consume less power than the main processor 121, or adapted to be specifically used for a specified function. The auxiliary processor 123 may be implemented separately from the main processor 121 , or as part of the main processor 121 .

[0034] When the main processor 121 is in an inactive (e.g., sleep) state, the auxiliary processor 123 may control at least some of the functions or states related to at least one component (e.g., display device 160, sensor module 176, or communication module 190) among the components of the electronic device 101 (not the main processor 121), or when the main processor 121 is in an active state (e.g., running an application), the auxiliary processor 123 may control at least some of the functions or states related to at least one component (e.g., display device 160, sensor module 176, or communication module 190) among the components of the electronic device 101 together with the main processor 121. According to an embodiment, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., camera module 180 or communication module 190) that is functionally related to the auxiliary processor 123.

[0035] The memory 130 may store various data used by at least one component of the electronic device 101 (e.g., the processor 120 or the sensor module 176). The various data may include, for example, software (e.g., the program 140) and input data or output data for commands related thereto. The memory 130 may include a volatile memory 132 or a non-volatile memory 134.

[0036] The program 140 may be stored as software in the memory 130 , and may include, for example, an operating system (OS) 142 , middleware 144 , or applications 146 .

[0037] The input device 150 may receive commands or data from outside the electronic device 101 (eg, a user) to be used by other components of the electronic device 101 (eg, the processor 120). The input device 150 may include, for example, a microphone, a mouse, or a keyboard.

[0038] The sound output device 155 can output a sound signal to the outside of the electronic device 101. The sound output device 155 may include, for example, a speaker or a receiver. The speaker may be used for general purposes such as playing multimedia or playing records, and the receiver may be used for incoming calls. Depending on the embodiment, the receiver may be implemented as being separated from the speaker, or as part of the speaker.

[0039] The display device 160 may visually provide information to the outside of the electronic device 101 (e.g., a user). The display device 160 may include, for example, a display, a holographic device, or a projector, and a control circuit for controlling a corresponding one of the display, the holographic device, and the projector. According to an embodiment, the display device 160 may include a touch circuit adapted to detect a touch or a sensor circuit (e.g., a pressure sensor) adapted to measure the strength of a force caused by a touch.

[0040] The audio module 170 may convert sound into an electrical signal, or vice versa. According to an embodiment, the audio module 170 may obtain sound via the input device 150, or output sound via the sound output device 155 or an earphone of an external electronic device (e.g., electronic device 102) directly (e.g., wired) or wirelessly connected to the electronic device 101.

[0041] The sensor module 176 may detect an operating state (e.g., power or temperature) of the electronic device 101 or an environmental state (e.g., a user's state) outside the electronic device 101, and then generate an electrical signal or data value corresponding to the detected state. According to an embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor.

[0042] The interface 177 may support one or more specific protocols to be used to connect the electronic device 101 directly (e.g., wired) or wirelessly to an external electronic device (e.g., the electronic device 102). According to an embodiment, the interface 177 may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface.

[0043] The connection end 178 may include a connector, wherein the electronic device 101 may be physically connected to an external electronic device (e.g., the electronic device 102) via the connector. According to an embodiment, the connection end 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0044] The haptic module 179 may convert the electrical signal into mechanical stimulation (eg, vibration or motion) or electrical stimulation recognizable by the user via his tactile or kinesthetic sensation. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0045] The camera module 180 may capture still images or moving images. According to an embodiment, the camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0046] The power management module 188 may manage power supply to the electronic device 101. According to an embodiment, the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0047] The battery 189 may power at least one component of the electronic device 101. According to an embodiment, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0048] The communication module 190 may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. The communication module 190 may include one or more communication processors capable of operating independently from the processor 120 (e.g., an application processor (AP)) and supporting direct (e.g., wired) communication or wireless communication. According to an embodiment, the communication module 190 may include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules can communicate with an external electronic device via a first network 198 (e.g., a short-range communication network such as Bluetooth, Wireless Fidelity (Wi-Fi) Direct, or Infrared Data Association (IrDA)) or a second network 199 (e.g., a long-range communication network such as a cellular network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN))). These various types of communication modules can be implemented as a single component (e.g., a single chip), or these various types of communication modules can be implemented as multiple components separated from each other (e.g., multiple chips). The wireless communication module 192 can identify and authenticate the electronic device 101 in a communication network (such as the first network 198 or the second network 199) using user information (e.g., an International Mobile Subscriber Identity (IMSI)) stored in the user identification module 196.

[0049] The antenna module 197 may transmit or receive a signal or power to or from the outside of the electronic device 101 (e.g., an external electronic device). According to an embodiment, the antenna module 197 may include one or more antennas, and thus, at least one antenna suitable for a communication scheme used in a communication network (such as the first network 198 or the second network 199) may be selected by, for example, the communication module 190 (e.g., the wireless communication module 192). Signals or power may then be transmitted or received between the communication module 190 and the external electronic device via the selected at least one antenna.

[0050] At least some of the above components may be connected to each other via an inter-peripheral communication scheme (e.g., a bus, a general purpose input output (GPIO), a serial peripheral interface (SPI), or a mobile industry processor interface (MIPI)) and communicatively transmit signals (e.g., commands or data) therebetween.

[0051] According to an embodiment, a command or data may be sent or received between the electronic device 101 and the external electronic device 104 via the server 108 connected to the second network 199. Each of the electronic device 102 and the electronic device 104 may be a device of the same type as the electronic device 101, or a device of a different type from the electronic device 101. According to an embodiment, all or some operations to be run on the electronic device 101 may be run on one or more of the external electronic device 102, the external electronic device 104, or the server 108. For example, if the electronic device 101 should automatically perform a function or service or should perform a function or service in response to a request from a user or another device, the electronic device 101 may request the one or more external electronic devices to perform at least part of the function or service instead of running the function or service, or the electronic device 101 may request the one or more external electronic devices to perform at least part of the function or service in addition to running the function or service. The one or more external electronic devices that receive the request may perform the requested at least part of the function or service, or perform another function or another service related to the request, and transmit the result of the execution to the electronic device 101. The electronic device 101 may provide the result as at least a partial reply to the request with or without further processing the result. To this end, cloud computing technology, distributed computing technology or client-server computing technology may be used, for example.

[0052] The electronic device according to various embodiments may be one of various types of electronic devices. The electronic device may include, for example, a portable communication device (e.g., a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a household appliance. According to an embodiment of the present disclosure, the electronic device is not limited to those electronic devices described above.

[0053] It should be understood that the various embodiments of the present disclosure and the terms used therein are not intended to limit the technical features set forth herein to specific embodiments, but rather include various changes, equivalents, or replacements for the corresponding embodiments.

[0054] With respect to the description of the drawings, like reference numerals may be used to designate like or related elements.

[0055] It will be understood that a noun in the singular form corresponding to a term may include one or more things unless the relevant context clearly indicates otherwise. As used herein, each of phrases such as "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C", and "at least one of A, B or C" may include all possible combinations of the items listed together with the corresponding one of the plurality of phrases.

[0056] As used herein, terms such as "1st" and "2nd" or "first" and "second" may be used to simply distinguish a corresponding component from another component and do not limit the components in other aspects (e.g., importance or order). It will be understood that if an element (e.g., a first element) is referred to as "combined with another element (e.g., a second element)", "combined to another element (e.g., a second element)", "connected to another element (e.g., a second element)" or "connected to another element (e.g., a second element)" when the terms "operably" or "communicatively" are used or when the terms "operably" or "communicatively" are not used, it means that the element may be directly (e.g., wired) connected to the other element, wirelessly connected to the other element, or connected to the other element via a third element.

[0057] As used herein, the term "module" may include units implemented in hardware, software, or firmware, and may be used interchangeably with other terms (e.g., "logic," "logic block," "portion," or "circuit"). A module may be a single integrated component adapted to perform one or more functions or a minimum unit or portion of the single integrated component. For example, according to an embodiment, a module may be implemented in the form of an application specific integrated circuit (ASIC).

[0058] The various embodiments described herein may be implemented as software (e.g., program 140) including one or more instructions stored in a storage medium (e.g., internal memory 136 or external memory 138) that can be read by a machine (e.g., electronic device 101). For example, under the control of a processor, a processor (e.g., processor 120) of the machine (e.g., electronic device 101) may call at least one of the one or more instructions stored in the storage medium and execute the at least one instruction with or without the use of one or more other components. This enables the machine to operate to perform at least one function according to the at least one instruction called. The one or more instructions may include code generated by a compiler or code that can be run by an interpreter. A machine-readable storage medium may be provided in the form of a non-transitory storage medium. Among them, the term "non-transitory" only means that the storage medium is a tangible device and does not include signals (e.g., electromagnetic waves), but the term does not distinguish between data being semi-permanently stored in the storage medium and data being temporarily stored in the storage medium.

[0059] According to an embodiment, the method according to various embodiments of the present disclosure may be included and provided in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be released in the form of a machine-readable storage medium (e.g., a compact disk read-only memory (CD-ROM)), or may be downloaded via an application store (e.g., Play Store TM ) The computer program product may be published (e.g., downloaded or uploaded) online, or the computer program product may be distributed (e.g., downloaded or uploaded) directly between two user devices (e.g., smart phones). If published online, at least part of the computer program product may be temporarily generated, or at least part of the computer program product may be at least temporarily stored in a machine-readable storage medium (such as a memory of a manufacturer's server, an application store's server, or a forwarding server).

[0060] According to various embodiments, each of the above-mentioned components (e.g., a module or a program) may include a single entity or multiple entities. According to various embodiments, one or more of the above-mentioned components may be omitted, or one or more other components may be added. Alternatively or additionally, multiple components (e.g., a module or a program) may be integrated into a single component. In this case, according to various embodiments, the integrated component may still perform the one or more functions of each of the multiple components in the same or similar manner as a corresponding one of the multiple components performing one or more functions before integration. According to various embodiments, the operations performed by a module, a program or another component may be performed sequentially, in parallel, repeatedly or in a heuristic manner, or one or more of the operations may be run or omitted in a different order, or one or more other operations may be added.

[0061] Figure 2A 200 shows a perspective view showing a front surface of a mobile electronic device 200 according to an embodiment, Figure 2B Shows Shows Figure 2A 2 is a perspective view of the rear surface of the mobile electronic device 200 shown in FIG.

[0062] Reference Figure 2A and Figure 2B , the mobile electronic device 200 may include a housing 210, wherein the housing 210 includes a first surface (or front surface) 210A, a second surface (or rear surface) 210B, and a side surface 210C surrounding a space between the first surface 210A and the second surface 210B. The housing 210 may refer to a structure forming a portion of the first surface 210A, the second surface 210B, and the side surface 210C. The first surface 210A may be formed by a front plate 202 (e.g., a glass plate or a polymer plate coated with various coatings) at least partially being substantially transparent. The second surface 210B may be formed by a substantially opaque rear plate 211. The rear plate 211 may be formed by, for example, coated glass or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or any combination of the above items. The side surface 210C may be formed by a side frame structure (or "side member") 218 ​​that is combined with the front plate 202 and the rear plate 211 and includes metal and / or polymer. The rear panel 211 and the side frame structure 218 may be integrally formed and may be the same material (eg, a metal material such as aluminum).

[0063] The front plate 202 may include two first regions 210D that are respectively arranged at their long edges and are seamlessly bent and extended from the first surface 210A toward the back plate 211. Similarly, the back plate 211 may include two second regions 210E that are respectively arranged at their long edges and are seamlessly bent and extended from the second surface 210B toward the front plate 202. The front plate 202 (or the back plate 211) may include only one of the first regions 210D (or the second regions 210E). The first region 210D or the second region 210E may be partially omitted. When viewed from the side of the mobile electronic device 200, the side frame structure 218 may have a first thickness (or width) on the side that does not include the first region 210D or the second region 210E, and may have a second thickness that is less than the first thickness on the other side that includes the first region 210D or the second region 210E.

[0064] The mobile electronic device 200 may include at least one of the following items: a display 201, audio modules 203, 207, and 214, sensor modules 204 and 219, camera modules 205, 212, and 213, a key input device 217, a light emitting device, and connector holes 208 and 209. The mobile electronic device 200 may omit at least one of the above components (e.g., the key input device 217 or the light emitting device), or may further include other components.

[0065] For example, the display 201 may be exposed through most of the front plate 202. At least a portion of the display 201 may be exposed through the front plate 202 forming the first surface 210A and the first area 210D of the side surface 210C. The outline (i.e., the edge and the corner) of the display 201 may have substantially the same shape as the outline of the front plate 202. The spacing between the outline of the display 201 and the outline of the front plate 202 may be substantially unchanged so as to expand the exposed area of ​​the display 201.

[0066] A recess or opening may be formed in a portion of the display area of ​​the display 201 to accommodate at least one of the audio module 214, the sensor module 204, the camera module 205, and the light emitting device. At least one of the audio module 214, the sensor module 204, the camera module 205, the fingerprint sensor 216, and the light emitting element may be arranged on the back of the display area of ​​the display 201. The display 201 may be combined with or adjacent to a touch sensing circuit, a pressure sensor capable of measuring touch strength (pressure), and / or a digitizer for detecting a stylus. At least a portion of the sensor modules 204 and 219 and / or at least a portion of the key input device 217 may be arranged in the first area 210D and / or the second area 210E.

[0067] The audio modules 203, 207, and 214 may correspond to the microphone hole 203 and the speaker holes 207 and 214, respectively. The microphone hole 203 may contain a microphone for acquiring external sound, and in this case, may contain a plurality of microphones for sensing the direction of the sound. The speaker holes 207 and 214 may be classified as an external speaker hole 207 and a call receiver hole 214. The microphone hole 203 and the speaker holes 207 and 214 may be implemented as a single hole, or a speaker (e.g., a piezoelectric speaker) may be provided without the speaker holes 207 and 214.

[0068] The sensor modules 204 and 219 may generate electrical signals or data corresponding to the internal operating state of the mobile electronic device 200 or to the external environmental conditions. The sensor modules 204 and 219 may include a first sensor module 204 (e.g., a proximity sensor) and / or a second sensor module (e.g., a fingerprint sensor) arranged on the first surface 210A of the housing 210, and / or a third sensor module 219 (e.g., a heart rate monitor (HRM) sensor) and / or a fourth sensor module 216 (e.g., a fingerprint sensor) arranged on the second surface 210B of the housing 210. The fingerprint sensor may be arranged on the second surface 210B of the housing 210 as well as the first surface 210A (e.g., the display 201). The electronic device 200 may further include at least one of the following sensors: a gesture sensor, a gyroscope sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor.

[0069] The camera modules 205, 212 and 213 may include a first camera device 205 arranged on a first surface 210A of the electronic device 200, and a second camera device 212 and / or a flash 213 arranged on a second surface 210B. The camera module 205 or the camera module 212 may include one or more lenses, an image sensor, and / or an image signal processor. The flash 213 may include, for example, a light emitting diode or a xenon lamp. Two or more lenses (infrared camera, wide angle and telephoto lens) and an image sensor may be arranged on one side of the electronic device 200.

[0070] The key input device 217 may be arranged on the side surface 210C of the housing 210. The mobile electronic device 200 may not include some or all of the above-mentioned key input devices 217, and the key input device 217 not included may be implemented in another form such as a soft key on the display 201. The key input device 217 may include a sensor module 216 arranged on the second surface 210B of the housing 210.

[0071] The light emitting device may be arranged on the first surface 210A of the housing 210. For example, the light emitting device may provide status information of the electronic device 200 in an optical form. The light emitting device may provide a light source associated with the operation of the camera module 205. The light emitting device may include, for example, a light emitting diode (LED), an IR LED, or a xenon lamp.

[0072] The connector holes 208 and 209 may include a first connector hole 208 and / or a second connector hole 209, wherein the first connector hole 208 is suitable for a connector (e.g., a USB connector) for sending power and / or data to an external electronic device and receiving power and / or data from an external electronic device, and the second connector hole 209 is suitable for a connector (e.g., a headphone jack) for sending audio signals to an external electronic device and receiving audio signals from an external electronic device.

[0073] Some sensor modules 205 of the camera modules 205 and 212, some sensor modules 204 of the sensor modules 204 and 219, or indicators may be arranged to be exposed through the display 201. For example, the camera module 205, the sensor module 204, or the indicator may be arranged in the internal space of the electronic device 200 so as to contact the external environment through the opening of the display 201 that is perforated to the front plate 202. In another embodiment, some sensor modules 204 may be arranged to perform their functions in the internal space of the electronic device without being visually exposed through the front plate 202. For example, in this case, the area of ​​the display 201 facing the sensor module may not require a perforated opening.

[0074] Figure 3 Shows Shows Figure 1 An exploded perspective view of the mobile electronic device 100 is shown in FIG.

[0075] Reference Figure 3 , the mobile electronic device 300 may include a side frame structure 310, a first support member 311 (e.g., a bracket), a front plate 320, a display 400, an electromagnetic induction panel, a PCB 340, a battery 350, a second support member 360 (e.g., a rear case), an antenna 370, and a rear plate 380. The mobile electronic device 300 may omit at least one of the above components (e.g., the first support member 311 or the second support member 360), or may further include another component. Some components of the electronic device 300 may be different from those of the mobile electronic device 300. Figure 1 The components of the mobile electronic device 100 shown in FIG. 2 are the same or similar, and therefore, a description thereof is omitted below.

[0076] The first support member 311 is arranged inside the mobile electronic device 300 and can be connected to the side frame structure 310 or integrated with the side frame structure 310. The first support member 311 can be formed of, for example, a metal material and / or a non-metallic (e.g., polymer) material. The first support member 311 can be combined with the display 400 on one side thereof, and can also be combined with the PCB 340 on the other side thereof. On the PCB 340, a processor, a memory, and / or an interface can be installed. The processor can include, for example, one or more of a CPU, an AP, a GPU, an ISP, a sensor hub processor, or a CP.

[0077] The memory may include, for example, volatile memory or non-volatile memory.

[0078] The interface may include, for example, a high-definition multimedia interface (HDMI), a USB interface, a secure digital (SD) card interface, and / or an audio interface. The interface may electrically or physically connect the mobile electronic device 300 to an external electronic device, and may include a USB connector, an SD card / multimedia card (MMC) connector, or an audio connector.

[0079] The battery 350 is a device for supplying power to at least one component of the mobile electronic device 300, and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery 350 may be arranged on substantially the same plane as the PCB 340. The battery 350 may be integrally arranged within the mobile electronic device 300, and may be detachably arranged from the mobile electronic device 300.

[0080] The antenna 370 may be arranged between the back plate 280 and the battery 350. The antenna 370 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna 370 may perform short-range communication with an external device, or transmit and receive power required for wireless charging. The antenna structure may be formed by a portion of the side frame structure 310 and / or the first support member 311, or a combination of the side frame structure 310 and the first support member 311.

[0081] Figure 4 is a plan view showing an internal configuration of an electronic device 400 including an antenna structure 500 according to an embodiment of the present invention. Figure 4 The rear cover is shown removed therefrom (eg, Figure 2B The internal configuration of the electronic device 400 having the rear panel 211 in the figure.

[0082] Figure 4 The electronic device 400 shown may be at least partially similar to Figure 1 The electronic device 101 shown, Figure 2A The electronic device 200 or Figure 3 The electronic device 300 shown may, or may include, other embodiments of electronic devices.

[0083] refer to Figure 4 , the electronic device 400 may include a housing structure 410, which includes a front cover (eg, Figure 2A The front plate 202 in the middle), the rear cover facing the opposite direction of the front cover (for example, Figure 2B The rear plate 211 in the front cover and the rear cover, and the side member 420 surrounding the inner space 4001 between the front cover and the rear cover. According to an embodiment, the side member 420 may at least partially include a conductive member.

[0084] According to an embodiment, the side member 420 may include a first side surface 411 having a first length, a second side surface 412 extending perpendicularly from the first side surface 411 and having a second length greater than the first length, a third side surface 413 extending from the second side surface parallel to the first side surface 411 and having the first length, and a fourth side surface 414 extending from the third side surface 413 parallel to the second side surface 412 and having the second length.

[0085] According to an embodiment, the electronic device 400 may include a first printed circuit board (PCB) 431 (also referred to as a main substrate) arranged in the internal space 4001 and a second PCB 432 (also referred to as a sub-substrate) arranged in the internal space 4001 and separated from the first PCB 431. According to an embodiment, the first PCB 431 may include at least one wireless communication circuit (e.g., Figure 1 According to an embodiment, the first PCB 431 may be arranged in an area (e.g., near the third side surface 413) where electronic components (e.g., at least one camera module, at least one sensor module, and / or a speaker module) of the electronic device 400 are arranged. According to an embodiment, the second PCB 432 may include an antenna structure 500. According to an embodiment, the antenna structure 500 may be connected to the first PCB 431 by an electrical connection member 440 and arranged in an area adjacent to the first side surface 411, which is separated from an area where the first PCB 431 is arranged. Therefore, the specific absorption rate (SAR) caused by the user's head during a voice call can be reduced, and the reduction in radiation performance caused by the human body can be reduced.

[0086] According to an embodiment, the antenna structure 500 may include a conductive pattern formed on the second PCB 432. In another embodiment, the antenna structure 500 may include a conductive metal or a flexible PCB (FPCB) connected to the second PCB 432. In another embodiment, the antenna structure 500 may include a laser direct structure (LDS) pattern formed on a dielectric carrier arranged near the second PCB 432 in the internal space 4001 of the electronic device 400. In yet another embodiment, the antenna structure 500 may include an additional member arranged on the second PCB 432 and electrically connected (e.g., directly connected or indirectly connected by coupling) to the above-mentioned LDS pattern, conductive metal, or FPCB.

[0087] According to an embodiment, the electronic device 400 may include a battery 450 disposed between the first PCB 431 and the second PCB 432. According to an embodiment, the battery 450 may be disposed so as not to overlap with the first PCB 431 and / or the second PCB 432. In another embodiment, the battery 450 may be disposed so as to at least partially overlap with the first PCB 431 and / or the second PCB 432.

[0088] According to an embodiment, the antenna structure 500 may be replaced by at least a portion of the side member 420, which is a conductive member electrically connected to the second PCB 432. For example, the electronic device 400 may include at least one antenna structure 500, which is implemented by the first side surface 411 of the side member 420. According to an embodiment, the antenna structure 500 may include a conductive portion 4111 of the first side surface 411, which is inserted between the non-conductive portions 4112 and 4113 of the first side surface 411. The non-conductive portions 4112 and 4113 of the first side surface 411 may be spaced apart from each other, so that the conductive portion 4111 is electrically isolated by the non-conductive portions 4112 and 4113. According to an embodiment, the antenna structure 500 may be electrically connected to a wireless communication circuit (e.g., a wireless communication circuit) mounted on the first PCB 431 through the second PCB 432. Figure 1 In another embodiment, the antenna structure 500 may be directly electrically connected to a wireless communication circuit (eg, Figure 1 The wireless communication module 192 in FIG.

[0089] According to an embodiment, in addition to the antenna structure 500 mounted on the second PCB 432 or arranged near the second PCB 432, the electronic device 400 may further include an additional antenna structure. For example, the additional antenna structure may be arranged at an upper portion A1 of the second side surface 412, an angle A2 between the second side surface 412 and the third side surface 413, and / or an angle A3 between the third side surface 413 and the fourth side surface 414 in the internal space 4001 of the electronic device 400. In another embodiment, the additional antenna structure may be implemented using at least a portion of the second side surface 412, the third side surface 413, and / or the fourth side surface 414, each of the second side surface 412, the third side surface 413, and / or the fourth side surface 414 including a conductive member. In this case, such an antenna structure may be electrically connected to a wireless communication circuit (e.g., Figure 1 The wireless communication module 192 in the wireless communication module 192 is also designed to operate in different frequency bands or in specific environments such as carrier aggregation (CA), multiple input multiple output (MIMO) or diversity.

[0090] According to an embodiment, the antenna structure 500 and the wireless communication circuit (eg, Figure 1 In the case where the wireless communication module 192 in the first PCB 431 is separated, the electronic device 400 may include an electrical connection member 440, which is arranged to electrically connect the first PCB 431 and the second PCB 432. According to an embodiment, the electrical connection member 440 may include a radio frequency (RF) coaxial cable or an FPCB type RF cable (FRC).

[0091] According to an embodiment of the present invention, the electronic device 400 may include at least one intermediate circuit, which is arranged in a manner connected to a wireless communication circuit (eg, Figure 1 The wireless communication module 192 or Figure 5 The intermediate circuit may include a tuner, a tunable integrated circuit (tunable IC), or a matching circuit, each of which shifts the operating frequency band by impedance matching of the antenna. According to an embodiment, the electronic device 400 may include a low resistance circuit (e.g., Figure 5 The low resistance circuit 700 in the antenna is used to reduce the total resistance value and improve the gain of the antenna.

[0092] Hereinafter, the configuration of the low resistance circuit will be described in detail.

[0093] Figure 5 is a block diagram illustrating an electronic device 400 including an antenna structure 500 according to an embodiment of the present invention.

[0094] refer to Figure 5 , the electronic device 400 may include a processor 460 (eg, Figure 1 processor 120 in the embodiment of the present invention), a communication unit 470 (e.g., Figure 1 ), the wireless communication module 192 or wireless communication circuit in the antenna structure 500, the tunable circuit 600 and / or at least one low resistance circuit 700. According to an embodiment, the processor 460 may perform overall control operations of the electronic device 400, such as controlling wireless transmission / reception. According to an embodiment, the processor 460 may control the tunable circuit 600 to establish an electrical path to achieve communication in at least one frequency band through the antenna structure 500, which is selected from a plurality of frequency bands for wireless transmission / reception. The processor 460 may include a microprocessor or any suitable type of processing circuit, such as one or more general-purpose processors (e.g., ARM-based processors), digital signal processors (DSPs), programmable logic devices (PLDs), application-specific integrated circuits (ASICs), field programmable gate arrays (FPGAs), graphics processing units (GPUs), video card controllers, etc. In addition, it can be recognized that when a general-purpose computer accesses the code for implementing the processing shown herein, the execution of the code converts the general-purpose computer into a special-purpose computer for performing the processing shown herein. Certain functions and steps provided in the figure may be implemented in hardware, software, or a combination of both, and may be executed in whole or in part in the programming instructions of the computer. No claim element in this Agreement shall be construed under 35 USC § 112(f) unless the element is expressly qualified by the term "means." Furthermore, persons skilled in the art understand and appreciate that a "processor" or "microprocessor" may be the hardware disclosed in the claims. The appended claims are statutory subject matter consistent with 35 USC § 101, pursuant to the broadest reasonable interpretation.

[0095] According to an embodiment, the communication unit 470 may send and receive communication signals (e.g., radio frequency signals). According to an embodiment, the communication unit 470 may include a transceiver 471, a power amplifier module (PAM) 472, and / or a front end module (FEM) 473. According to an embodiment, the communication unit 470 may also include at least one matching circuit 480 or a tuner, which is arranged on a first electrical path 4701 connected to the antenna structure 500. According to an embodiment, the matching circuit 480 may include one or more passive elements connected in parallel or in series with each other. According to an embodiment, such passive elements may include an inductor (L) and / or a capacitor (C). According to an embodiment, the transceiver 471 may modulate the RF signal to be transmitted, or demodulate the received RF signal. According to an embodiment, the PAM 472 may amplify the modulated signal or the demodulated signal. According to an embodiment, the FEM 473 may separate and filter the amplified transmit / receive signals, transmit the transmit signal from the transceiver 471 to the antenna structure 500, and transmit the receive signal from the antenna structure 500 to the transceiver 471. Although not shown, the electronic device 400 may include a memory connected to the processor. According to an embodiment, the memory may store switching information for switching the tunable circuit 600 connected to the antenna structure 500 based on the communication environment of the electronic device 400. For example, the memory may store instructions that control the change of the operating frequency band from the first frequency band to the second frequency band according to changes in the communication environment, such as changes in the service provider of the electronic device 400, changes in the service area of ​​the electronic device 400, and / or the gripping state of the electronic device 400 (e.g., a hand is placed on the electronic device 400).

[0096] According to an embodiment, the electronic device 400 may include a first electrical path 4701 electrically connecting the communication unit 470 and the antenna structure 500. According to an embodiment, the electronic device 400 may include at least one matching circuit 480 included in the communication unit 470 and arranged on the first electrical path 4701. In another embodiment, at least one matching circuit 480 may be arranged on the first electrical path 4701 and / or the second electrical path 4702. According to an embodiment, the electronic device 400 may include a tunable circuit 600 (e.g., a tunable IC) connected in parallel to the first electrical path 4701 and arranged on the second electrical path 4702 electrically connected to the ground (G). According to an embodiment, the second electrical path 4702 may branch from the first electrical path 4701 at a point between the matching circuit 480 and the antenna structure 500. In another embodiment, the second electrical path 4702 may branch at a point on the first electrical path 4701 between the communication unit 470 and the matching circuit 480.

[0097] According to an embodiment, the electronic device 400 may include a low resistance circuit 700 connected in parallel to the second electrical path 4702 and arranged on a third electrical path 4703 electrically connected to the ground (G). According to an embodiment, the third electrical path 4703 may branch from the second electrical path 4702 at a point between the first electrical path 4701 and the tunable circuit 600. According to an embodiment, the low resistance circuit 700 may be connected in parallel to the tunable circuit 600.

[0098] According to an embodiment, the processor 460 may provide a control signal 4601 to the tunable circuit 600 so that the frequency of the antenna structure 500 is shifted to a frequency band corresponding to the current detection environment of the electronic device 400. According to an embodiment, the communication unit 470, the matching circuit 480, the tunable circuit 600 and / or the low resistance circuit 700 may be arranged on a first PCB (e.g., Figure 4 431) or the second PCB (eg, Figure 4 On the second PCB 432).

[0099] According to an embodiment, the tunable circuit 600 may include at least one element (eg, Figure 6B According to an embodiment, the low resistance circuit 700 may include at least one resistor. According to an embodiment, the low resistance circuit 700 may be connected to at least one element of the tunable circuit 600 (e.g., Figure 6B Therefore, the total resistance connected to the antenna structure 500 can be lower than the internal resistance (Ron) of the elements in the tunable circuit 600, and the gain of the antenna structure 500 can also be increased.

[0100] Now, the tunable circuit 600 and the low resistance circuit 700 connected thereto will be described in detail.

[0101] Fig. 6A It is shown Figure 5 A schematic diagram of the configuration of a tunable circuit 600 is shown.

[0102] refer to Fig. 6A , the tunable circuit 600 may include a switch 610 and one or more lumped elements 620 (eg, T1, T2, ..., Tn) selectively connected to the second electrical path 4702 via the switch 610. According to an embodiment, the switch 610 may be configured in a processor (eg, Figure 4 The switch 610 may be a single-pole single-throw (SPST) switch, a single-pole double-throw (SPDT) switch, or a switch having three or more throws.

[0103] According to an embodiment, the tunable circuit 600 may have an internal resistance value (eg, a first resistance value) caused by the switch structure. However, when a low resistance circuit (eg, Figure 5 When the low resistance circuit 700 in the embodiment is connected in parallel to the second electrical path 4702, the total resistance value can be reduced. As a result, the antenna structure (for example, Figure 5 The gain of the antenna structure 500).

[0104] Figure 6B It is shown Figure 5 Equivalent circuit diagram of area B.

[0105] refer to Figure 6B , the tunable circuit 600 may be arranged on the second electrical path 4702, which connects the communication unit (eg, Figure 5 The communication unit 470 in the antenna structure 500 is connected to the first electrical path 4701 branch of the antenna structure 500. The second electrical path 4702 is electrically connected to the ground (G). According to an embodiment, the tunable circuit 600 may include a switch 610 and one or more lumped elements 620 (e.g., T1, T2, ..., Tn) selectively connected to the second electrical path 4702 through the switch 610. According to an embodiment, each of the one or more lumped elements 620 may include an inductor (L) and / or a capacitor (C). According to an embodiment, the switch 610 may be implemented in the form of a field effect transistor (FET) module including one or more FET elements. According to an embodiment, the switch 610 may be operated so that one of the one or more lumped elements (T1, T2, ..., Tn) is connected to the second electrical path 4702 by a processor (e.g., Figure 5 A control signal 4601 applied by a processor 460 in the tunable circuit 600 is connected to a second electrical path 4702. According to an embodiment, when a bias voltage is applied to any one FET element of the switch, the other FET elements may remain closed. In this case, the other FET elements may have parasitic capacitance. There is a trade-off between this parasitic capacitance value (Coff, for example, CF1, CF2, ..., CFn) and the total resistance value (RF) generated from at least one internal resistance value (Ron, for example, RF1, RF2, ..., RFn) of the switch 610 of the tunable circuit 600. For example, when the internal resistance value (Ron or RF) of the tunable circuit 600 decreases, the parasitic capacitance value (Coff) becomes higher. This may make it difficult to obtain the desired frequency shift. In addition, the relatively high internal resistance value (RF) of the tunable circuit 600 may reduce the gain of the antenna structure 500.

[0106] According to an embodiment of the present invention, an electronic device (eg, Figure 5The electronic device 400 in the embodiment may include a low resistance circuit 700. Even if the internal resistance component (i.e., the switching element) of the tunable circuit 600 has a high internal resistance value (RF) in order to reduce the parasitic capacitance value of the tunable circuit 600, from the perspective of the antenna structure 500, the total resistance (RT) is kept low by the low resistance circuit 700. Therefore, the low resistance circuit 700 can improve the gain of the antenna structure 500. According to an embodiment, the low resistance circuit 700 may be arranged on a third electrical path 4703 branched from the second electrical path 4702 and electrically connected to the ground (G). According to an embodiment, the low resistance circuit 700 may include a resistor 711 arranged in series on the third electrical path 4703 and having a constant resistance value (RL). According to an embodiment, the low resistance circuit 700 may also include an inductor 712, which is arranged between the resistor 711 on the third electrical path 4703 and the ground (G) and has a constant inductance value (LL). According to an embodiment, resistor 711 of low resistance circuit 700 is connected in parallel with tunable circuit 600, thereby reducing the total resistance (RT) and improving the gain of antenna structure 500. According to an embodiment, inductor 712 can cause low resistance circuit 700 to be treated as an open circuit at a particular RF frequency at which antenna structure 500 operates.

[0107] For example, from the perspective of the antenna structure 500 , the total resistance (RT ) may be calculated by Equation 1 below.

[0108] [Equation 1]

[0109]

[0110] In Equation 1, “RT” represents a total resistance value from the perspective of the antenna structure 500 . In addition, “RF” represents an internal resistance value of the tunable circuit 600 , and “RL” represents a resistance value of the resistor 711 included in the low resistance circuit 700 .

[0111] According to an embodiment, in order to make the total resistance value (RT) meaningful from the perspective of the antenna structure 500, the resistance value (RL) of the resistor 711 of the low resistance circuit 700 may be determined within a range of about 0.3 to 3 times the internal resistance value (RF) of the tunable circuit 600. The resistance value (RL) of the resistor 711 of the low resistance circuit 700 should at least be designed so that the radiation efficiency of the antenna structure 500 exhibits Fig. 7A and 7BAccording to an embodiment, in order to make the low resistance circuit 700 be regarded as an open circuit from the perspective of the antenna structure 500 at a desired frequency, the inductance value (LL) of the inductor 712 of the low resistance circuit 700 may be determined to be about twice or more the inductance value (e.g., T1, T2, ..., Tn) of the lumped element 620. The inductance value (LL) of the inductor 712 of the low resistance circuit 700 should at least be designed so that the radiation efficiency of the antenna structure 500 shows Fig. 7A and 7B Gain shown.

[0112] Fig. 7A and 7B is a graph showing that the radiation efficiency of the antenna structure 500 depends on the presence or absence of the low resistance circuit 700 according to some embodiments of the present invention.

[0113] Fig. 7A The efficiency of the antenna structure 500 operating in a first frequency band (e.g., LB20 band) is shown under the control of the tunable circuit 600 through the processor 460. It can be seen that the radiation efficiency (represented by 702) when the low resistance circuit 700 is applied is generally improved by about 0.5 dBm or more compared to the radiation efficiency (represented by 701) when the low resistance circuit 700 is not present.

[0114] Figure 7B The efficiency of the antenna structure 500 operating in a second frequency band (e.g., an EGSM band) higher than the first frequency band under the control of the tunable circuit 600 is shown. It can be seen that the radiation efficiency (represented by 704) when the low resistance circuit 700 is applied is generally improved by about 0.5 dBm or more compared to the radiation efficiency (represented by 703) when the low resistance circuit 700 is not present.

[0115] Therefore, when using the low resistance circuit 700 connected in parallel between the antenna structure 500 and the tunable circuit 600 , the gain of the antenna structure 500 is improved, while the operating frequency band of the antenna structure 500 can be easily shifted using the tunable circuit 600 .

[0116] According to an embodiment of the present invention, an electronic device (eg, Figure 4 The electronic device 400 may include: having an internal space (eg, Figure 4 The internal space 4001 of the housing (eg, Figure 4 410 in the housing); arranged in the internal space of the housing and including a wireless communication circuit (eg, Figure 5 A first printed circuit board (PCB) (eg, Figure 4 431 in the first PCB); through a first electrical path (eg, Figure 6BThe first electrical path 4701 in the embodiment is connected to the antenna structure of the wireless communication circuit (e.g., Figure 6B 500 in the antenna structure); and a tunable circuit (eg, Figure 6B , which has a first resistance value (eg, Figure 6B The internal resistance value (RF) in the first electrical path is arranged in a manner that branches from the first electrical path and is connected to the ground (for example, Figure 6B A second electrical path (e.g., Figure 6B The electronic device may also include a low resistance circuit (e.g., Figure 6B 700), which is arranged in a third electrical path (eg, Figure 6B 4703) in the third electrical path and includes a resistor (e.g., Figure 6B The resistor 711 in the embodiment of the present invention and the inductor (e.g., Figure 6B The inductor 712 in FIG. 1 has a second resistance value determined based on the first resistance value (eg, Figure 6B The electronic device may further include at least one processor (e.g., Figure 5 The processor 460 in the embodiment is configured to control the tunable circuit to enable the wireless communication circuit to send and / or receive wireless signals in a second frequency band shifted from the first frequency band by using the antenna structure.

[0117] According to an embodiment, the second resistance value of the low resistance circuit may be determined to be within a range of approximately 0.3 to 3 times the first resistance value of the tunable circuit.

[0118] According to an embodiment, the third electrical path may branch from the second electrical path at a point between the first electrical path and the tunable circuit.

[0119] According to an embodiment, the tunable circuit may include a switch having a first resistance value (eg, Figure 6B ), and one or more lumped elements (e.g., Figure 6B lumped element 620 in).

[0120] According to an embodiment, the inductance value of the inductor of the low resistance circuit may be determined to be approximately twice or more the inductance value of the one or more lumped elements.

[0121] According to an embodiment, the electronic device may further include at least one matching circuit (eg, Figure 6B Matching circuit 480 in.

[0122] According to an embodiment, the second electrical path may branch from the first electrical path at a point between the antenna structure and the at least one matching circuit.

[0123] According to an embodiment, the second electrical path may branch from the first electrical path at a point between the wireless communication circuit and the at least one matching circuit.

[0124] According to an embodiment, the tunable circuit and / or the low resistance circuit may be arranged on the first PCB.

[0125] According to an embodiment, the electronic device may further include a second PCB (eg, Figure 4 The second PCB 432 is arranged in the inner space of the housing, separated from the first PCB, and connected to the housing by an electrical connection member (eg, Figure 4 The electrical connection member 440 in the embodiment is connected to the first PCB, and the antenna structure can be arranged on the second PCB.

[0126] According to an embodiment, the electrical connection member may include a radio frequency (RF) coaxial cable or a flexible PCB (FPCB) type radio frequency cable (FRC).

[0127] According to an embodiment, the antenna structure may include a laser direct structuring (LDS) pattern disposed on a dielectric structure of an inner space of the housing.

[0128] According to an embodiment, the housing may include a side surface including a conductive member, and the antenna structure may include at least one conductive portion of the conductive member electrically isolated from a remaining portion of the conductive member by at least one non-conductive portion.

[0129] According to an embodiment of the present invention, an electronic device (eg, Figure 4 The electronic device 400 may include: having an internal space (eg, Figure 4 The internal space 4001 of the housing (eg, Figure 4 410 in the housing); a printed circuit board (PCB) (eg, Figure 4 The first PCB 431 in the housing is arranged in the inner space of the housing and includes a wireless communication circuit (eg, Figure 5 470); an antenna structure electrically connected to a wireless communication circuit (eg, Figure 6B 500 in the antenna structure); and at least one intermediate circuit (eg, Figure 6B , which has a first resistance value (eg, Figure 6B ) connected in parallel with the wireless communication circuit to the antenna structure and to ground (e.g., Figure 6B The electronic device may also include a low resistance circuit (e.g., Figure 6BThe low resistance circuit 700 in FIG. 1 is connected in parallel to at least one intermediate circuit, is grounded, and includes a resistor (e.g., Figure 6B The resistor 711 in FIG. 1 and the inductor (eg, Figure 6B 712 in the inductor), the resistor has a second resistance value determined based on the first resistance value (eg, Figure 6B The resistance value (RL) in the resistor is 0), and the inductor has a constant inductance value and is arranged between the resistor and the ground.

[0130] According to an embodiment, the second resistance value of the low resistance circuit may be determined to be within a range of approximately 0.3 to 3 times the first resistance value of the at least one intermediate circuit.

[0131] According to an embodiment, the at least one intermediate circuit may include a tuner or a tunable circuit.

[0132] According to an embodiment, at least one intermediate circuit may include a switch having a first resistance value (eg Figure 6B ), and one or more lumped elements (e.g., Figure 6B lumped element 620 in).

[0133] According to an embodiment, the electronic device may further include at least one processor (eg, Figure 5 A processor 460 in the apparatus is configured to control at least one intermediate circuit to enable the wireless communication circuit to use the antenna structure to send and / or receive wireless signals through a second frequency band shifted from the first frequency band.

[0134] According to an embodiment, the inductance value of the inductor of the low resistance circuit may be determined to be approximately twice or more the inductance value of the one or more lumped elements.

[0135] According to an embodiment, at least one intermediate circuit and / or a low-resistance circuit may be arranged on a PCB.

[0136] Some of the above-described embodiments of the present invention may be implemented by hardware, firmware, or by executing software or computer code, which may be stored in a recording medium, such as a CD ROM, a digital versatile disc (DVD), a magnetic tape, a RAM, a floppy disk, a hard disk, or a magneto-optical disk, or downloaded over a network, initially stored on a remote recording medium or a non-transitory machine-readable medium and to be stored on a local recording medium, so that a computer code of the methods described herein can be presented via such software stored on a recording medium using a general-purpose computer or a special processor or programmable or dedicated hardware (such as an ASIC or FPGA). As will be understood in the art, a computer, processor, microprocessor controller, or programmable hardware includes memory components, such as RAM, ROM, flash memory, etc., which can store or receive software or computer code, which, when accessed and executed by a computer, processor, or hardware, implements the processing methods described herein.

[0137] While the invention has been particularly shown and described with reference to exemplary embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the scope of the subject matter defined in the following claims.

Claims

1. An electronic device, comprising: case; A first printed circuit board PCB is arranged in the inner space of the housing and includes a wireless communication circuit; an antenna structure connected to the wireless communication circuit via a first electrical path; a tunable circuit having a first resistance value and arranged on a second electrical path branching from the first electrical path and connected to ground; a low resistance circuit arranged on a third electrical path branched from the second electrical path and connected to the ground, and including a resistor and an inductor, the resistor having a second resistance value determined based on the first resistance value, and the inductor having a constant inductance value and arranged between the resistor and the ground; as well as At least one processor is configured to control the tunable circuit so that the wireless communication circuit can transmit and / or receive wireless signals in a second frequency band shifted from the first frequency band by using the antenna structure.

2. The electronic device according to claim 1, wherein: The second resistance value of the low resistance circuit is determined to be within a range of approximately 0.3 to 3 times the first resistance value of the tunable circuit.

3. The electronic device according to claim 1, wherein: The third electrical path branches from the second electrical path at a point between the first electrical path and the tunable circuit.

4. The electronic device according to claim 1, wherein: The tunable circuit comprises: a switch having the first resistance value; and One or more lumped elements are selectively connected to the antenna structure via the switch.

5. The electronic device according to claim 4, wherein: The inductance value of the inductor of the low resistance circuit is determined to be approximately twice or more the inductance value of the one or more lumped elements.

6. The electronic device according to claim 1, further comprising: At least one matching circuit is arranged on the first electrical path.

7. The electronic device according to claim 6, wherein: The second electrical path branches from the first electrical path at a point between the antenna structure and the at least one matching circuit.

8. The electronic device according to claim 6, wherein: The second electrical path branches from the first electrical path at a point between the wireless communication circuit and the at least one matching circuit.

9. The electronic device according to claim 1, wherein: The tunable circuit and / or the low resistance circuit are arranged on the first PCB.

10. The electronic device according to claim 1, further comprising: a second PCB, arranged in the inner space of the housing, separated from the first PCB and connected to the first PCB through an electrical connection member, Wherein, the antenna structure is arranged on the second PCB.

11. The electronic device according to claim 10, wherein: The electrical connection component includes a radio frequency RF coaxial cable or a flexible PCB FPCB type radio frequency cable FRC.

12. The electronic device according to claim 1, wherein: The antenna structure includes a laser direct structuring (LDS) pattern disposed on a dielectric structure in the interior space of the housing.

13. The electronic device according to claim 1, wherein: The housing includes a side surface including a conductive member, and The antenna structure includes at least one conductive portion of the conductive component, which is electrically isolated from the remaining portion of the conductive component by at least one non-conductive portion.

14. An electronic device comprising: A housing having an internal space; a printed circuit board PCB, arranged in the inner space of the housing and comprising a wireless communication circuit; an antenna structure electrically connected to the wireless communication circuit; at least one intermediate circuit having a first resistance value, connected to the antenna structure in parallel with the wireless communication circuit and connected to ground; as well as A low resistance circuit is connected in parallel to the at least one intermediate circuit, is grounded, and includes a resistor and an inductor, the resistor having a second resistance value determined based on the first resistance value, and the inductor having a constant inductance value and arranged between the resistor and the ground.

15. The electronic device according to claim 14, wherein: The second resistance value of the low resistance circuit is determined to be within a range of approximately 0.3 to 3 times the first resistance value of the at least one intermediate circuit.

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