A substrate preheating device and equipment for epitaxial process

Abstract

This application relates to the field of semiconductor manufacturing. Specifically, it relates to a substrate preheating device and equipment for epitaxial processes, which are used to preheat the substrate before epitaxial growth. The substrate preheating device for epitaxial processes includes: a base; a substrate loading and unloading table for loading and fixing the substrate; a substrate heater for preheating the substrate, the substrate heater is arranged above the substrate, and the substrate heater is fixedly connected to the base; a lifting drive assembly for driving the substrate loading and unloading table to move up and down, so that the substrate approaches or moves away from the substrate heater. The substrate preheating device for epitaxial processes arranges the substrate heater above the substrate, so that the heat emitted by the substrate heater directly acts on the upper surface of the substrate, thereby making the temperature of the upper surface of the substrate meet the temperature requirements of the epitaxial process.

Description

Technical Field

[0001] The present application relates to the field of semiconductor manufacturing, and more particularly, to a substrate preheating device and equipment for epitaxial processes. Background Art

[0002] Epitaxial growth processes are carried out in a high-temperature and low-pressure environment. During the epitaxial process, the growth process of the substrate is a complex chemical process. In order to prepare high-quality epitaxial layers, the substrate needs to be pretreated before epitaxial growth, including degassing at a certain temperature, removing the oxide layer and other impurities on the substrate surface, and backsealing before the heavy doping process. Therefore, the substrate needs to be preheated.

[0003] In some existing substrate preheating devices, the substrate heater heats the substrate by heating the bottom of the substrate. However, in the epitaxial process, the substrate grows on the surface layer. Therefore, heating the bottom of the substrate will cause the temperature of the substrate surface to fail to meet the process requirements, affecting the epitaxial quality.

[0004] In view of the above problems, there is currently no effective technical solution. Summary of the Invention

[0005] The purpose of the present application is to provide a substrate preheating device and equipment for epitaxial processes, aiming to solve the problem of poor epitaxial quality caused by the substrate temperature not reaching the epitaxial process temperature requirements during the preheating process of the substrate before the epitaxial process.

[0006] In a first aspect, the present application provides a substrate preheating device for epitaxial processes, which is used to preheat the substrate before epitaxial growth. The substrate preheating device for epitaxial processes includes:

[0007] A base;

[0008] A substrate loading and unloading table for loading and fixing the substrate;

[0009] A substrate heater for preheating the substrate. The substrate heater is arranged above the substrate and fixedly connected to the base;

[0010] A lifting drive assembly for driving the substrate loading and unloading table to move up and down, so that the substrate approaches or moves away from the substrate heater.

[0011] The substrate preheating device for epitaxial process provided by the present application has a substrate fixed on a substrate picking and placing table. By arranging a substrate heater above the substrate picking and placing table, the heat emitted by the substrate heater directly acts on the top of the substrate. Meanwhile, the distance between the substrate picking and placing table and the substrate heater is controlled by a lifting drive assembly, so that the temperature at the top of the substrate reaches the temperature requirement of the epitaxial process, improving the substrate preheating efficiency and ensuring the quality of the epitaxial process.

[0012] Optionally, for the substrate preheating device for epitaxial process of the present application, the substrate preheating device further includes a rotation drive assembly, which is connected to the lifting drive assembly and is used for driving the substrate picking and placing table to rotate when the substrate heater preheats the substrate.

[0013] The present application arranges a rotation drive assembly, and the substrate rotates at a constant speed during the preheating process, making the heat received by each part of the substrate uniform, realizing uniform preheating of the substrate, and improving the preheating efficiency.

[0014] Optionally, for the substrate preheating device for epitaxial process of the present application, the rotation drive assembly includes a rotation drive motor, a rotation shaft and a small gear. The upper end face of the substrate picking and placing table is fixedly connected with a rotation connecting pipe, and a large gear is arranged on the rotation connecting pipe, and the large gear meshes with the small gear.

[0015] Optionally, for the substrate preheating device for epitaxial process of the present application, the rotation drive assembly further includes a rotation bellows, which is arranged on the rotation shaft and is used for realizing the sealing between the rotation drive assembly and the base.

[0016] The present application arranges a rotation bellows for realizing the sealing between the rotation drive assembly and the base, and at the same time reducing the load of the rotation drive assembly and improving the service life of the substrate preheating device.

[0017] Optionally, for the substrate preheating device for epitaxial process of the present application, the substrate picking and placing table includes a fixed connection part and a substrate supporting part, and the fixed connection part and the substrate supporting part are connected by a connecting rod.

[0018] The present application arranges a connecting rod to connect the fixed connection part and the substrate supporting part, so that there is a spacing between the substrate heater and the substrate, facilitating the manipulator to extend into the substrate picking and placing table to clamp or move the substrate, and preventing the manipulator from damaging the substrate preheating device.

[0019] Optionally, for the substrate preheating device for epitaxial process of the present application, the preheating acting surface of the substrate heater is parallel to the supporting surface of the substrate supporting part.

[0020] In the present application, the working surface of the substrate heater for preheating is parallel to the supporting surface, so that the heat emitted by the substrate heater acts on the substrate uniformly, achieving uniform heating of the substrate.

[0021] Optionally, for the substrate preheating device for epitaxial process in the present application, the substrate heater includes a shielding cover, a heat insulation layer, and a heating plate arranged in sequence from top to bottom.

[0022] The shielding cover and the heat insulation layer provided in the present application effectively isolate the heat and radiation emission, enabling the heat of the heating plate to act on the substrate intensively and improving the heating efficiency.

[0023] Optionally, for the substrate preheating device for epitaxial process in the present application, the lifting drive assembly includes a lifting drive motor and a lead screw pair. The bottom of the lead screw pair is rotatably connected to the base. A lead screw nut on the lead screw pair is fixedly connected to a lifting plate, and the substrate pick - and - place table is installed on the lifting plate.

[0024] In the present application, the lead screw nut is fixedly connected to the lifting plate, so that when the lifting drive assembly works, the substrate pick - and - place table makes a lifting movement accordingly.

[0025] In a second aspect, the present application further provides a substrate preheating device for epitaxial process, including:

[0026] A substrate preheating chamber;

[0027] A substrate preheating device for preheating the substrate before epitaxial growth. The substrate preheating device is installed on the substrate preheating chamber.

[0028] The substrate preheating device includes:

[0029] A base fixed on the substrate preheating chamber for fixing the substrate preheating device;

[0030] A substrate pick - and - place table for loading and fixing the substrate;

[0031] A substrate heater for preheating the substrate. The substrate heater is arranged above the substrate and is fixedly connected to the base;

[0032] A lifting drive assembly for driving the substrate pick - and - place table to make a lifting movement, so that the substrate approaches or moves away from the substrate heater.

[0033] The substrate preheating equipment for epitaxial process provided by this application, the substrate preheating chamber is used to provide a vacuum environment for the substrate preheating process. The base in the substrate preheating device is fixedly installed on the substrate preheating chamber, so that the part below the base is in the vacuum environment of the substrate preheating chamber, and the part above the base is in the atmosphere. The substrate heater is arranged directly above the substrate and acts on the top of the substrate. The lifting drive assembly makes the substrate approach or move away from the substrate heater, so that the temperature of the substrate meets the temperature requirements of the epitaxial process and improves the substrate preheating efficiency.

[0034] Optionally, for the substrate preheating equipment for epitaxial process described in this application, the base is a flange weldment, and the base is used to fix the substrate preheating device in the substrate preheating chamber.

[0035] As can be seen from the above, for the substrate preheating device and equipment for epitaxial process provided by this application, the substrate preheating device is installed on the substrate preheating chamber through the base, the substrate is installed on the substrate loading / unloading table, the substrate heater acts directly on the top of the substrate to heat the substrate, and the distance between the substrate and the substrate heater is adjusted through the lifting drive assembly to achieve efficient preheating of the substrate. At the same time, it is convenient for the manipulator to extend into the substrate loading / unloading table to clamp and move the substrate. The rotation drive assembly makes the substrate rotate uniformly during the preheating process, so that all parts of the substrate are evenly heated, and finally high-efficiency preheating of the epitaxial process is achieved and the preheating uniformity is ensured.

[0036] Other features and advantages of this application will be described in the subsequent description, and part of them will become obvious from the description, or be understood by implementing this application. The objectives and other advantages of this application can be achieved and obtained through the structures specifically pointed out in the written description, claims, and drawings. Description of the Drawings

[0037] Figure 1 It is a schematic structural diagram of the substrate preheating device for epitaxial process provided by an embodiment of this application.

[0038] Figure 2 It is a schematic structural diagram of the cooperation between the rotation drive assembly and the substrate loading / unloading table provided by an embodiment of this application.

[0039] Figure 3 It is a schematic structural diagram of the substrate heater provided by an embodiment of this application.

[0040] Figure 4 It is a schematic structural diagram of the substrate preheating equipment for epitaxial process provided by an embodiment of this application.

[0041] Label description: 1. Substrate; 100. Substrate preheating chamber; 200. Substrate preheating device; 210. Base; 211. Fixed connection plate; 220. Substrate picking and placing table; 221. Fixed connection part; 222. Substrate supporting part; 223. Connecting rod; 224. Lifting plate; 225. Rotating fixed shaft; 230. Substrate heater; 231. Shielding cover; 232. Heat insulation layer; 233. Heating plate; 234. Direct connection pipe; 240. Lifting drive assembly; 241. Lifting drive motor; 242. Lead screw pair; 2421. Lead screw; 2422. Lead screw nut; 243. Lifting drive fixing plate; 244. Second sealing bearing; 245. Bellows for lifting; 250. Rotating drive assembly; 251. Rotating drive motor; 252. Rotating shaft; 253. Pinion; 254. Bellows for rotation; 255. Rotating drive fixing plate; 256. First sealing bearing; 260. Rotating connection pipe; 261. Large gear. Detailed implementation manners

[0042] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and illustrated herein can be arranged and designed in various different configurations. Therefore, the detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application to be protected, but only represents the selected embodiments of the present application. All other embodiments obtained by those skilled in the art based on the embodiments of the present application without creative efforts belong to the scope of protection of the present application.

[0043] It should be noted that similar reference numerals and letters indicate similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings. At the same time, in the description of the present application, the terms "first", "second", etc. are only used for distinguishing descriptions and cannot be understood as indicating or implying relative importance.

[0044] During the epitaxial process, the substrate needs to be preheated. However, some substrate preheating devices heat the bottom of the substrate, which may cause the surface temperature of the substrate to fail to meet the process requirements and affect the quality of the epitaxial process.

[0045] In the first aspect, referring to Figure 1 , Figure 1 which is a schematic structural diagram of a substrate preheating device for epitaxial process provided by the present application, Figure 1 as shown in

[0046] Base 210;

[0047] Substrate loading and unloading table 220, for loading and fixing substrate 1;

[0048] Substrate heater 230, for preheating substrate 1. The substrate heater 230 is arranged above substrate 1 and fixedly connected to the base 210;

[0049] Lifting drive assembly 240, for driving the substrate loading and unloading table 220 to move up and down, so that substrate 1 approaches or moves away from the substrate heater 230.

[0050] Specifically, substrate 1 is divided into a bottom layer and a top growth layer. During the epitaxial process, the substrate grows on the growth layer. Therefore, the temperature of the growth layer needs to meet the conditions of the epitaxial process.

[0051] Preferably, a flange welded part is selected as the base 210 to fix the substrate preheating device. Specifically, the base 210 is installed in the substrate preheating chamber 100, so that the part below the base 210 is located in the substrate preheating chamber 100, and the part above the base 210 is located in the atmosphere, providing a vacuum environment for the growth of substrate 1 and meeting the vacuum conditions of the epitaxial process.

[0052] In the substrate preheating device for the epitaxial process in the embodiment of the present application, the substrate 1 is preheated in the substrate preheating chamber 100 before the epitaxial reaction. Specifically, the manipulator grabs substrate 1 and places it on the substrate loading and unloading table 220. The substrate heater 230 is arranged above substrate 1. The lifting drive assembly 240 controls the substrate loading and unloading table 220 to rise close to the substrate heater 230, so that the substrate heater 230 heats the growth layer on the top surface of substrate 1. After the heating is completed, the lifting drive assembly 240 controls the substrate loading and unloading table 220 to descend away from the substrate heater 230, so that there is enough distance between the substrate heater 230 and substrate 1 for the manipulator to extend into the substrate loading and unloading table 220 to grab substrate 1. In this embodiment, arranging the substrate heater 230 above substrate 1 can make the temperature of the growth layer at the top of substrate 1 reach the process requirements, ensuring the epitaxial growth quality. At the same time, the lifting drive assembly 240 drives the substrate loading and unloading table 220 to move up and down, so that the substrate heater 230 approaches or moves away from substrate 1, thereby preventing the manipulator from contacting the substrate heating device 200 when grabbing substrate 1 and damaging the substrate heating device.

[0053] In some preferred embodiments, the substrate preheating device 200 further includes a rotation drive assembly 250. The rotation drive assembly 250 is connected to the lifting drive assembly 240 and is used to drive the substrate loading and unloading table 220 to rotate when the substrate heater 230 preheats substrate 1.

[0054] Specifically, refer to Figure 2, Figure 2 This is a schematic diagram of the cooperation structure between the rotation drive assembly and the substrate pick - and - place table provided by the embodiment of the present application. In some embodiments, the rotation drive assembly 250 is arranged on one side of the substrate preheating device. The rotation drive assembly 250 includes, from top to bottom, a rotation drive motor 251, a rotation drive fixing plate 255, a rotation drive coupling, a speed reducer, a rotation bellows 254, a rotation shaft 252, and a pinion 253.

[0055] In some preferred embodiments, the rotation drive assembly 250 includes a rotation drive motor 251, a rotation shaft 252, and a pinion 253. A rotation connection pipe 260 is fixedly connected to the upper end surface of the substrate pick - and - place table 220. A large gear 261 is arranged on the rotation connection pipe 260. The large gear 261 meshes with the pinion 253. When the rotation drive assembly 250 works, the pinion 253 on the rotation drive assembly 250 meshes with the large gear 261 on the rotation connection pipe 260, driving the large gear 261 to rotate, thereby driving the substrate pick - and - place table 220 to rotate, so that the substrate 1 rotates at a constant speed during the preheating process, enabling all parts of the substrate 1 to be evenly heated.

[0056] Specifically, as Figure 2 shown, the large gear 261 meshes with the pinion 253. When the rotation drive assembly 250 works, the pinion 253 drives the large gear 261 to rotate. The large gear 261 is coaxial with the rotation connection pipe 260 and is fixedly connected to the top of the rotation connection pipe 260, keeping the large gear 261 and the pinion 253 meshing at the same height, with more stable relative movement. And the rotation connection pipe 260 is fixedly connected to the substrate pick - and - place table 220. Therefore, the substrate pick - and - place table 220 rotates accordingly, and the substrate 1 on the substrate pick - and - place table 220 also rotates accordingly, making the substrate 1 evenly heated. Since the rotation drive assembly 250 and the substrate pick - and - place table 220 move relative to each other, to ensure that the substrate pick - and - place table 220 rotates relative to the substrate preheating cavity 100, a rotation drive fixing plate 255 is provided on the rotation drive assembly 250. Preferably, the rotation drive fixing plate 255 is a right - angled plate. One side serves as the fixing plate of the rotation drive motor 251, and the other side is fixedly connected to the lifting plate 224, thereby ensuring that the rotation drive assembly 250 is more stable during operation. At the same time, the rotation drive assembly 250 and the lifting plate 224 are lifted and lowered synchronously, and the large gear 261 and the pinion 253 always remain in the meshing state.

[0057] In some preferred embodiments, the rotation drive assembly 250 further includes a rotation bellows 254. The rotation bellows 254 is arranged on the rotation shaft 252 and is used to achieve the sealing between the rotation drive assembly 250 and the base 210.

[0058] Specifically, to further ensure the vacuum environment during the preheating of the substrate 1, a rotary bellows 254 needs to be provided at the connection between the rotary drive assembly 250 and the base 210. The rotary shaft 252 passes through the rotary bellows 254. During the lifting movement, the top of the rotary bellows 254 always abuts against the base of the reducer, and the bottom of the rotary bellows 254 always abuts against the base 210, so as to ensure good sealing between the rotary drive assembly 250 and the substrate preheating chamber 100 during the lifting process. Further, to better ensure the movement stability of the rotary drive assembly, a first sealing bearing 256 is provided at the connection between the rotary shaft 252 and the base 210. The first sealing bearing 256 is embedded in the base 210, and the rotary shaft 252 is in clearance fit with the first sealing bearing 256, so that the rotary shaft 252 moves smoothly in the first sealing bearing 256, increasing the service life of the rotary drive assembly 250.

[0059] In some preferred embodiments, the substrate loading and unloading table 220 includes a fixed connection portion 221 and a substrate supporting portion 222, and the fixed connection portion 221 and the substrate supporting portion 222 are connected by a connecting rod 223.

[0060] Specifically, a connecting rod 223 extending in the vertically downward direction is provided on the lower surface of the fixed connection portion 221, and the tail of the connecting rod 223 extends inward to form a substrate supporting portion 222 for fixing the substrate 1. The space formed by the fixed connection portion 221, the substrate supporting portion 222, and the connecting rod 223 is used to place the substrate heater 230, and at the same time, it is convenient for the manipulator to extend in and perform operations such as clamping and moving the substrate 1.

[0061] Specifically, the upper end surface of the fixed connection portion 221 is fixedly connected to the rotary connection pipe 260, and the substrate supporting portion 222 is used to support the substrate 1. Optionally, the substrate supporting portion 222 can be set to support the entire bottom of the substrate 1, and grooves can be provided according to the shape of the substrate 1 so that the substrate 1 is embedded in the grooves to achieve fixed installation of the substrate 1. It can also be set to support the substrate 1 by supporting the edges of the substrate 1 according to the shape of the substrate 1. Preferably, in this embodiment, to facilitate the manipulator to clamp the substrate 1, the substrate supporting portion 222 is set to support the edges of the substrate 1 according to the shape of the substrate 1, and only supports the two opposite edges of the substrate 1, so that the manipulator can perform operations such as clamping and moving the substrate 1 on the other two sides.

[0062] Optionally, the fixed connection part 221 and the substrate supporting part 222 of the substrate pick-and-place table 220 are connected by a connecting rod 223. The substrate heater 230 is arranged between the fixed connection part 221 and the substrate supporting part 222. To facilitate the manipulator to extend in to clamp the substrate 1 and move out, and to prevent the manipulator from colliding with the substrate preheating device 200, the length of the connecting rod 223 should be greater than the sum of the height of the substrate heater 230 and the distance between the highest point of the manipulator after lifting the clamped substrate 1 and the substrate supporting part 222.

[0063] Optionally, to ensure the stable connection between the fixed connection part 221 and the substrate supporting part 222 and facilitate the manipulator to extend into the substrate pick-and-place table 220 to clamp and move the substrate 1, the connecting rods 223 should be distributed on both sides of the edge of the substrate 1 supported. The number of connecting rods 223 on both sides is the same and they are correspondingly arranged. To reduce the processing cost, preferably, in the present embodiment, the number of connecting rods 223 is set to 4, which are arranged at the four corners of the substrate supporting part 222.

[0064] In some preferred embodiments, the preheating working surface of the substrate heater 230 is parallel to the supporting surface of the substrate supporting part 222.

[0065] Specifically, the substrate heater 230 is arranged above the substrate 1. The preheating working surface of the substrate heater 230 is parallel to the supporting surface of the substrate supporting part 222, that is, the shortest distance from each position on the preheating working surface of the substrate heater 230 to the substrate 1 is equal, making the heating of the substrate 1 by the substrate heater 230 more uniform. Preferably, to ensure that each part of the substrate 1 is uniformly heated during the heating process of the substrate 1, the axis direction of the preheating working surface of the substrate heater 230 coincides with the axis direction of the substrate 1, that is, the substrate heater 230 and the substrate 1 rotate coaxially.

[0066] In some preferred embodiments, the substrate heater 230 includes a shielding cover 231, a heat insulation layer 232 and a heating plate 233 which are arranged in sequence from top to bottom.

[0067] Specifically, referring to Figure 3 , Figure 3 which is the structural schematic diagram of the substrate heater provided by the present application. The heating plate 233 emits heat to heat the substrate 1. Specifically, heat generating heads are evenly distributed on the heating plate 233 to uniformly heat the substrate 1. Optionally, limit contacts can also be arranged on the heating plate 233 to monitor the distance between the substrate heater 230 and the substrate 1, preventing the substrate heater 230 from squeezing the substrate 1 and causing damage to the substrate 1 when the lifting drive assembly 240 works; the heat insulation layer 232 arranged above the heating plate 233 is used to separate heat and prevent heat dissipation, improving the heating efficiency of the substrate 1; a shielding cover 231 is arranged above the heat insulation layer 232 to further isolate heat dissipation and shield radiation at the same time.

[0068] Specifically, the substrate heater 230 is connected to the base 210 through a direct connection pipe 234, that is, the substrate heater 230 is always in a relatively static state with respect to the base 210 and does not move with the lifting drive assembly 240 and the rotary drive assembly 250. Therefore, when the substrate pick-and-place table 220 is driven by the lifting drive assembly 240 and the rotary drive assembly 250 to perform lifting and rotary movements, the substrate pick-and-place table 220 and the substrate heater 230 perform relative lifting and relative rotary movements.

[0069] In some preferred embodiments, the lifting drive assembly 240 includes a lifting drive motor 241 and a lead screw pair 242. The bottom of the lead screw pair 242 is rotatably connected to the base 210. A lead screw nut 2422 on the lead screw pair 242 is fixedly connected to a lifting plate 224, and the substrate pick-and-place table 220 is installed on the lifting plate 224.

[0070] Specifically, in this embodiment, the lifting drive assembly 240 sequentially includes a lifting drive motor 241, a lifting drive reducer, and a lead screw pair 242 from top to bottom. The lead screw pair 242 includes a lead screw nut 2422. The lead screw nut 2422 is fixedly connected to the lifting plate 224. The lifting plate 224 is fixedly connected to a rotary drive fixing plate 255 of the above-mentioned rotary drive assembly 250. When the lifting drive assembly 240 works, the lead screw nut 2422 moves up and down along the lead screw 2421, driving the lifting plate 224 to perform a lifting movement, and the rotary drive assembly 250 and the substrate pick-and-place table 220 also perform a lifting movement accordingly. Since the lifting drive assembly 240 and the substrate pick-and-place table 220 perform relative movements, a lifting drive fixing plate 243 is fixedly connected to the lifting drive assembly 240. The lifting drive fixing plate 243 is fixedly connected to the substrate preheating chamber 100, realizing the lifting movement of the substrate pick-and-place table 220 relative to the substrate preheating chamber 100.

[0071] Specifically, the bottom of the lead screw pair 242 includes a fixed connection plate 211. The fixed connection plate 211 is fixedly connected to the base 210. Preferably, to better ensure the movement stability of the lifting drive assembly 240, a second sealing bearing 244 is provided at the connection between the lead screw pair 242 and the fixed connection plate 211. The second sealing bearing 244 is embedded in the fixed connection plate 211, and the lead screw pair 242 is in clearance fit with the second sealing bearing 244, enabling the lead screw pair 242 to move smoothly in the second sealing bearing 244, increasing the service life of the lifting drive assembly 240. At the same time, the lead screw pair 242 does not need to pass through the base 210, ensuring the airtightness of the device.

[0072] Specifically, a rotating fixed shaft 225 is provided between the lifting plate 224 and the rotating connecting tube 260, the upper end of the rotating fixed shaft 225 is fixedly connected to the lifting plate 224, and the lower end of the rotating fixed shaft 225 is rotatably connected to the rotating connecting tube 260, and the rotating connecting tube 260 and the rotating fixed shaft 225 are provided with channels for installing the above-mentioned direct connecting tube 234, so that when the rotating fixed shaft 225 is lifted and lowered with the lifting plate 224, the direct connecting tube 234 and the rotating fixed shaft 225 are relatively lifted and lowered and always keep the same axis. Preferably, in order to ensure the airtightness of the substrate preheating device during the lifting and lowering process, a lifting bellows 245 is provided between the lifting plate 224 and the base 210. During the lifting and lowering process, the top of the lifting bellows 245 is always against the lifting plate 224, and the bottom of the lifting bellows 245 is always against the base 210, so as to ensure the good airtightness between the lifting drive assembly 240 and the substrate preheating chamber 100 during the lifting and lowering process.

[0073] Specifically, the lifting drive assembly 240 and the rotation drive assembly 250 are both fixedly connected to the lifting plate 224. The lifting drive assembly 240 is fixedly connected to the lifting plate 224 through the screw nut 2422, so that when the lifting drive assembly 240 is working, the lifting plate 224 performs lifting and lowering motion along with the screw nut 2422; the rotation drive assembly 250 is fixedly connected to the lifting plate 224 through the rotation drive fixing plate 255, so that when the lifting plate 224 is lifted and lowered, the rotation drive assembly 250 also performs lifting and lowering motion, and the small gear 253 and the large gear 261 are always kept in meshing, so that the lifting and rotating motion and the rotation motion are performed synchronously when the substrate 1 is preheated. Preferably, the lifting drive assembly 240 and the rotation drive assembly 250 are installed at relative positions of the lifting plate 224, and the lifting drive assembly 240 and the rotation drive assembly 250 are installed offset.

[0074] In this embodiment, the substrate heater 230 is arranged above the substrate 1, and the lifting drive device 240 and the rotation drive assembly 250 are arranged, so that the robot arm can reach in and clamp the substrate 1, thereby improving the versatility of the substrate preheating device 200. By adjusting the distance between the substrate heater 230 and the substrate 1, the substrate 1 is kept rotating evenly during the preheating process, thereby improving the preheating efficiency of the substrate 1 and ensuring that the substrate preheating temperature meets the process requirements. At the same time, the lifting drive device 240 and the rotation drive assembly 250 are offsetly installed, so that the substrate preheating device 200 is subjected to uniform force, thereby reducing the load of the substrate preheating device 200 and improving the service life of the substrate preheating device 200.

[0075] Second, reference Figure 4 , Figure 4 This is a schematic diagram of the structure of a substrate preheating device for an epitaxial process provided in this application. Figure 4 A substrate preheating device is shown, comprising:

[0076] Substrate preheating chamber 100;

[0077] Substrate preheating device 200, used to preheat substrate 1 before epitaxial growth, and the substrate preheating device 200 is installed on the substrate preheating chamber 100.

[0078] The substrate preheating device 200 includes:

[0079] Base 210, which is fixed on the substrate preheating chamber 100 and is used to fix the substrate preheating device 200;

[0080] Substrate loading and unloading table 220, used to load and fix substrate 1;

[0081] Substrate heater 230, used to preheat substrate 1, the substrate heater 230 is arranged above substrate 1, and the substrate heater 230 is fixedly connected to the base 210;

[0082] Lifting drive assembly 240, used to drive the substrate loading and unloading table 220 to move up and down, so that substrate 1 approaches or moves away from the substrate heater 230.

[0083] In the substrate preheating equipment of the embodiment of the present application, the substrate preheating chamber 100 is isolated from the outside world. The base 210 in the substrate preheating device 200 is installed on the substrate preheating chamber 100. The substrate preheating chamber 100 provides a vacuum environment for the substrate preheating device 200. The part below the base 210 is located inside the substrate preheating chamber 100, and the part above the base 210 is located in the atmosphere. Substrate 1 is installed on the substrate loading and unloading table 220, and the upper surface of substrate 1 is heated by the substrate heater 230. The lifting drive assembly 240 makes the substrate loading and unloading table 220 approach or move away from the substrate heater 230, ensuring that the temperature of the upper surface of substrate 1 meets the requirements of the epitaxial process, thereby realizing the preheating of substrate 1.

[0084] In some preferred embodiments, the base 210 is a flange welded part, and the base 210 is used to fix the substrate preheating device 200 in the substrate preheating chamber 100.

[0085] In the embodiments provided in the present application, it should be understood that the disclosed devices and methods can be implemented in other ways. The device embodiments described above are only illustrative. For example, the division of the units is only a logical function division, and there may be other division methods in actual implementation. For another example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point, the displayed or discussed coupling or direct coupling or communication connection between each other can be through some communication interfaces. The indirect coupling or communication connection of the devices or units can be in electrical, mechanical or other forms.

[0086] In addition, the units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed to multiple network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0087] Furthermore, in each embodiment of the present application, the various functional modules may be integrated together to form an independent part, or each module may exist alone, or two or more modules may be integrated to form an independent part.

[0088] In this text, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations.

[0089] The above are only the embodiments of the present application and are not used to limit the protection scope of the present application. For those skilled in the art, the present application may have various changes and modifications. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A substrate preheating device for epitaxial process, which is used to preheat a substrate (1) before epitaxial growth, and is characterized in that, The substrate preheating device for epitaxial process includes: a base (210); a substrate loading and unloading table (220) for loading and fixing the substrate (1); a substrate heater (230) for preheating the substrate. The substrate heater (230) is arranged above the substrate (1) and fixedly connected to the base (210); a lifting drive assembly (240) for driving the substrate loading and unloading table (220) to move up and down, so that the substrate (1) approaches or moves away from the substrate heater (230); The substrate preheating device further includes a rotation drive assembly (250). The rotation drive assembly (250) is connected to the lifting drive assembly (240) and is used for driving the substrate loading and unloading table (220) to rotate when the substrate heater (230) preheats the substrate (1).

2. The substrate preheating device for epitaxial process according to claim 1, wherein The rotation drive assembly (250) includes a rotation drive motor (251), a rotation shaft (252) and a pinion (253). A rotation connection pipe (260) is fixedly connected to the upper end surface of the substrate loading and unloading table (220). A large gear (261) is arranged on the rotation connection pipe (260). The large gear (261) meshes with the pinion (253).

3. The substrate preheating device for epitaxial process according to claim 2, wherein The rotation drive assembly (250) further includes a rotation bellows (254). The rotation bellows (254) is arranged on the rotation shaft (252) for realizing the sealing between the rotation drive assembly (250) and the base (210).

4. The substrate preheating device for epitaxial process according to claim 1, characterized in that, The substrate loading and unloading table (220) includes a fixed connection part (221) and a substrate supporting part (222). The fixed connection part (221) and the substrate supporting part (222) are connected by a connecting rod (223).

5. The substrate preheating device for epitaxial process according to claim 4, wherein, The working surface of the substrate heater (230) for preheating is parallel to the supporting surface of the substrate supporting part (222).

6. The substrate preheating device for epitaxial process according to claim 1, wherein, The substrate heater (230) includes a shielding cover (231), a heat insulation layer (232) and a heating plate (233) which are arranged in sequence from top to bottom.

7. The substrate preheating device for epitaxial process according to claim 1, characterized in that, The lifting drive assembly (240) includes a lifting drive motor (241) and a lead screw pair (242). The bottom of the lead screw pair (242) is rotatably connected to the base (210). A lead screw nut (2422) on the lead screw pair (242) is fixedly connected to a lifting plate (224). The substrate loading and unloading table (220) is installed on the lifting plate (224).

8. A substrate preheating equipment for epitaxial process, includes: a substrate preheating chamber (100); a substrate preheating device (200) for preheating the substrate (1) before epitaxial growth. The substrate preheating device (200) is installed on the substrate preheating chamber (100). It is characterized in that the substrate preheating device (200) includes: a base (210); a substrate loading and unloading table (220) for loading and fixing the substrate (1); A substrate heater (230) for preheating the substrate (1), the substrate heater (230) being disposed above the substrate (1), and the substrate heater (230) being fixedly connected to the base (210); A lifting drive assembly (240) for driving the substrate pick-up and placement table (220) to move up and down, so that the substrate (1) approaches or moves away from the substrate heater (230).

9. The substrate preheating device for epitaxial process according to claim 8, characterized in that, The base (210) is a flange welded part, and the base (210) is used to fix the substrate preheating device (200) in the substrate preheating chamber (100).

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