A hydrolytic ceramic housing for transient circuit packaging

Abstract

The invention belongs to the technical field of microelectronic packaging, and specifically relates to a hydrolyzable ceramic shell for transient circuit packaging, the shell comprising: a pin component, a metal pin, a shell substrate, a sealing ring and a cover plate; grooves are arranged on both sides of the front side of the shell substrate; one end of the metal pin is arranged in the groove of the shell substrate, and the other end is connected to the pin component; the sealing ring is arranged above the front side of the shell substrate, so that the sealing ring and the shell substrate form a cavity, and the cavity is used to arrange a transient circuit chip; the cover plate is arranged above the sealing ring, and is used to perform airtight packaging on the cavity formed by the sealing ring and the shell substrate; the invention designs a hydrolyzable ceramic shell for transient circuits, which can withstand high temperatures in a packaging process, has a structure that is convenient for chip assembly and interconnection, and has a structural strength that meets the requirements of the packaging process and subsequent use.

Description

Technical Field

[0001] The invention belongs to the technical field of microelectronic packaging, and in particular relates to a hydrolytic ceramic shell for transient circuit packaging. Background Art

[0002] Transient electronic technology involves materials science, electronics, physics, chemistry and other disciplines. It is a brand-new field of science and technology in the field of microelectronics, and is highly innovative and disruptive. "Transient circuits" can work stably under normal conditions. When the device is out of control, its physical form and function can disappear partially or completely immediately under external stimuli, and there will be very little or no traceable residue. The corresponding conventional circuit can be understood as a "constant-state circuit", which pursues stable performance and physical firmness and reliability.

[0003] Because transient circuits are stable and reliable when in use and disappear transiently when abandoned, they have important application needs in military information security, electronic waste and environmental protection, implantable electronic devices and biomedicine. According to the different types of external stimulus triggers, transient circuits can be divided into: water-triggered transient circuits, light-triggered transient circuits, heat-triggered transient circuits, and electrical-triggered transient circuits.

[0004] For water-triggered transient circuits, the structural materials of the packaging shell are mostly made of high-molecular organic materials such as polyvinyl alcohol and polyanhydride, which have the disadvantages of poor high temperature resistance, low hardness, small modulus, and easy deformation. Therefore, a transient circuit ceramic shell based on hydrolyzable ceramic materials is urgently needed. Summary of the invention

[0005] In order to solve the problems existing in the above-mentioned prior art, the present invention designs a hydrolytic ceramic shell for transient circuit packaging, which shell includes: a pin component 1, a metal pin 2, a shell substrate 3, a sealing ring 5 and a cover plate 6; grooves 4 are arranged on both sides of the front side of the shell substrate 3; one end of the metal pin 2 is arranged in the groove of the shell substrate 3, and the other end is connected to the pin component 1; the sealing ring 5 is arranged above the front side of the shell substrate 3, so that the sealing ring 5 and the shell substrate 3 form a cavity, and the cavity is used to set the transient circuit chip 7; the cover plate 6 is arranged above the sealing ring 5, and is used to air-tightly package the cavity formed by the sealing ring 5 and the shell substrate 3.

[0006] Preferably, grooves 4 are arranged on both sides of the front surface of the housing substrate 3 , the number of which is the same as the number of pins of the transient circuit chip 7 , and the pins of the transient circuit chip 7 are arranged in the grooves 4 .

[0007] Preferably, the groove 4 provided on the housing substrate 3 has a width of 0.2-1 mm and a depth of 0.1 mm-0.5 mm.

[0008] Preferably, the shell substrate 3 is a rectangular parallelepiped structure, the sealing cap ring 5 is a rectangular ring structure, and the cover plate 6 is a rectangular parallelepiped structure; the shell substrate 3, the sealing cap ring 5 and the cover plate 6 are of the same size.

[0009] Furthermore, the shell substrate 3 , the sealing cap ring 5 and the cover plate 6 are made of the same material, which is a ceramic material soluble in water.

[0010] Furthermore, the thickness of the sealing cap ring 5 is 0.3-1 mm; the thickness of the cover plate 6 is 0.3-1 mm.

[0011] Preferably, the pin component 1 is a rectangular ring structure, and the housing substrate 3 is located at the exact center of the rectangular ring structure of the pin component 1 .

[0012] Furthermore, the pin component 1 is made of a conductive metal material that is soluble in water.

[0013] Preferably, the hydrolyzed ceramic housing further comprises transient conductive ink 8 ; the pins of the transient circuit chip 7 arranged on the front side of the housing substrate 3 are connected to the metal pins 2 through the transient conductive ink 8 .

[0014] Beneficial effects of the present invention:

[0015] The purpose of the present invention is to provide a hydrolyzable ceramic shell for a transient circuit, which can withstand the high temperature of the packaging process, the structure is convenient for chip assembly and interconnection, and the structural strength meets the requirements of the packaging process and subsequent use; at the same time, it can be quickly hydrolyzed and disappear after contacting with water, thereby ensuring the overall transient characteristics of the circuit; the present invention solves the problems of transient shells developed in the early stage with high molecular organic materials such as polyvinyl alcohol and polyanhydride as the main material, such as poor high temperature resistance, low hardness, low modulus, and easy deformation; the structural design, material selection, and processing process design of the present invention provide a reference idea for the design of other transient packaging shells. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 A diagram showing the connection relationship between the pin components and the metal pins of the housing of the present invention;

[0017] Figure 2 It is a schematic diagram of the tube shell substrate structure of the housing of the present invention;

[0018] Figure 3 It is a schematic diagram of the sealing cap ring structure of the housing of the present invention;

[0019] Figure 4 Schematic diagram of the cover plate structure of the housing of the present invention

[0020] Figure 5 It is a schematic diagram of the shell structure of the present invention;

[0021] Figure 6This is a schematic diagram of the process flow of manufacturing the housing of the present invention;

[0022] Figure 7 This is a schematic diagram of the shell structure after the chip is packaged in the present invention;

[0023] 1. Pin component; 2. Metal pin; 3. Tube shell substrate; 4. Groove; 5. Cap ring; 6. Cover plate; 7. Transient circuit chip; 8. Transient conductive ink. DETAILED DESCRIPTION

[0024] The following describes the embodiments of the present invention by specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present invention. It should be noted that the following embodiments and features in the embodiments can be combined with each other without conflict.

[0025] A hydrolytic ceramic housing for transient circuit packaging, such as Figures 1 to 7 As shown, the hydrolysis ceramic shell includes: a pin component 1, a metal pin 2, a shell substrate 3, a sealing ring 5 and a cover plate 6; grooves 4 are arranged on both sides of the front of the shell substrate 3; one end of the metal pin 2 is arranged in the groove of the shell substrate 3, and the other end is connected to the pin component 1; the sealing ring 5 is arranged above the front of the shell substrate 3, so that the sealing ring 5 and the shell substrate 3 form a cavity, and the cavity is used to set the transient circuit chip 7; the cover plate 6 is arranged above the sealing ring 5, and is used to air-tightly package the cavity formed by the sealing ring 5 and the shell substrate 3.

[0026] The various components of the casing such as Figures 1 to 4The structure shown in the figure is designed; wherein the pin component 1 is designed as a hollow quadrilateral as a whole, and metal pins 2 are designed symmetrically on the corresponding two sides, the width of the metal pin is typically 0.2-1 mm, the spacing of the metal pins is typically 0.2-1 mm, the length of the metal pin is typically about 5-20 mm, the thickness of the pin component is typically about 0.1-0.5 mm, and the pin component is made of a conductive metal material soluble in water, including but not limited to a magnesium-gold composite metal material based on the principle of electrochemical corrosion; grooves 4 are designed on both sides of the front side of the tube shell substrate 3 for mounting the pins; the width of the grooves is typically about 0.2- 1 mm, the depth is typically about 0.1-0.5 mm, the total thickness of the tube shell substrate 3 is typically about 1-2 mm, the tube shell substrate 3 is made of water-soluble ceramic material, and the ceramic material includes but is not limited to silicate ceramic material; the size of the groove 4 matches the size of the metal pin 2; the sealing ring 5 is designed as a hollow quadrilateral as a whole, the outer dimensions of the sealing ring 5 are the same as those of the outer shell substrate 3, and the material is also the same as that of the outer shell substrate 3; the outer shell size of the cover plate 6 is the same as that of the sealing ring 5, and it is used for sealing the outer shell, the thickness of the cover plate 6 is typically about 0.3-1 mm, and the material is also the same as that of the outer shell substrate 3.

[0027] The shell substrate is made of a water-soluble ceramic material, including but not limited to a silicate ceramic material; the typical hydrolysis time of such material is about 1-10 hours / mm; the typical value of the substrate thickness is about 1-2 mm.

[0028] like Figure 5 As shown, the metal pin 2 of the pin component 1 is arranged in the groove 4 of the shell substrate 3 to ensure that the front side of the shell substrate 3 and the front side of the metal pin 2 are in the same plane, so that the chip and the pin component are interconnected using conductive ink; a sealing ring 5 is arranged above the shell substrate 3 to provide space for chip assembly and interconnection and to support the cover plate; a cover plate 6 is arranged above the sealing ring 5 to seal the shell.

[0029] A process for manufacturing a shell, such as Figure 6 As shown; first, assemble the pin component 1 on the shell substrate 3, ensure that the metal pin 2 is embedded in the groove 4, and ensure that its upper surface is located in the same plane; next, assemble the sealing ring 5 on the shell substrate 3; next, prepare the cover plate 6, and after completing the chip assembly and interconnection, assemble the cover plate 6 on the sealing ring 5; the above assembly all adopts the bonding method, and the bonding material adopts a hydrolyzable adhesive, including but not limited to polyvinyl alcohol material.

[0030] A transient circuit chip 7 is assembled in the center of the shell substrate 3, and the typical thickness of the chip is 20-50 microns; the chip 7 and the metal pin 2 are interconnected by transient conductive ink 8, which can be dissolved in water, and the material includes but is not limited to zinc oxide nanomaterials.

[0031] The above embodiments further illustrate the purpose, technical solutions and advantages of the present invention in detail. It should be understood that the above embodiments are only preferred implementation modes of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made to the present invention within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A hydrolytic ceramic housing for transient circuit packaging, characterized in that: include: A pin component (1), a metal pin (2), a shell substrate (3), a sealing ring (5) and a cover plate (6); grooves (4) are arranged on both sides of the front side of the shell substrate (3); one end of the metal pin (2) is arranged in the groove of the shell substrate (3), and the other end is connected to the pin component (1); the sealing ring (5) is arranged above the front side of the shell substrate (3), so that the sealing ring (5) and the shell substrate (3) form a cavity, and the cavity is used to set a transient circuit chip (7); the cover plate (6) is arranged above the sealing ring (5) and is used to airtightly package the cavity formed by the sealing ring (5) and the shell substrate (3); The shell substrate (3) is a rectangular parallelepiped structure, the sealing ring (5) is a rectangular ring structure, and the cover plate (6) is a rectangular parallelepiped structure; the shell substrate (3), the sealing ring (5) and the cover plate (6) are of the same size; the shell substrate (3), the sealing ring (5) and the cover plate (6) are made of the same material, which is a silicate ceramic material soluble in water; The pin component (1) is a rectangular ring structure, and the shell substrate (3) is located at the exact center of the rectangular ring structure of the pin component (1); the pin component (1) is made of a conductive metal material that is soluble in water.

2. The hydrolytic ceramic housing for transient circuit packaging according to claim 1, characterized in that: The front sides of the housing substrate (3) are provided with grooves (4) whose number is the same as the number of pins of the transient circuit chip (7), and the pins of the transient circuit chip (7) are arranged in the grooves (4).

3. The hydrolytic ceramic housing for transient circuit packaging according to claim 1, characterized in that: The groove (4) arranged on the shell substrate (3) has a width of 0.2 to 1 mm and a depth of 0.1 to 0.5 mm.

4. The hydrolytic ceramic housing for transient circuit packaging according to claim 1, characterized in that: The thickness of the sealing cap ring (5) is 0.3-1 mm; the thickness of the cover plate (6) is 0.3-1 mm.

5. The hydrolytic ceramic housing for transient circuit packaging according to claim 1, characterized in that: The hydrolytic ceramic shell also includes transient conductive ink (8); the pins of a transient circuit chip (7) arranged on the front side of the shell substrate (3) are connected to the metal pins (2) via the transient conductive ink (8).

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