An LED packaging structure, a packaged device and a packaging method

Abstract

An LED packaging structure, a packaging device and a packaging method, the LED packaging structure comprising a substrate, a light emitting diode unit, a light conversion layer, a first encapsulation layer and a second encapsulation layer; the number of the light emitting diode unit is two or more, and the light emitting diode units are independently arranged on the surface of the substrate; the light conversion layer is arranged above the light emitting diode unit correspondingly, and a flow channel is formed between adjacent light conversion layers; the first encapsulation layer is arranged between adjacent light emitting diode units; and the second encapsulation layer is arranged in the flow channel. By using different reflectivity and transmittance of the silicone material through multi-layer dispensing, the brightness is improved, the light absorption layer filled on the matrix surface forms a black wall, and the contrast can be effectively improved.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of LED, and particularly relates to an LED packaging structure, a packaging device and a packaging method. BACKGROUND

[0002] With the development of lighting technology, pixelization of LED light source, intelligent matrix lighting and display have become the development trend, and it is urgent to introduce high dynamic contrast light source devices, especially in the field of intelligent lighting and display for vehicles, higher brightness and better contrast effect are required for light sources. The prior art improves the contrast by separately packaging multiple chips and then mounting them on a PCB, or directly filling black light shielding material between different pixels. The current scheme has the following disadvantages:

[0003] 1. After independent packaging of multiple chips and mounting on a PCB, on the one hand, the size of the packaged LED structure is large, which limits the size of the entire PCB; on the other hand, the distance between different pixels after mounting is large, and it is difficult to realize high-resolution pixel display, and the light emission is uneven.

[0004] 2. Directly filling black light shielding material, due to the light absorption effect of black material, the final packaging brightness will be greatly reduced. SUMMARY

[0005] In order to overcome the above-mentioned shortcomings of the prior art, the purpose of the present application is to provide an LED packaging structure, a packaging device and a packaging method, which aims to solve the problems of large packaging size and reduced packaging brightness in the prior art.

[0006] In order to achieve the purpose of the present application, the technical scheme adopted is as follows:

[0007] An LED packaging structure comprises:

[0008] a substrate, a light emitting diode unit, a light conversion layer, a first packaging layer and a second packaging layer;

[0009] The number of light emitting diode units is two or more, and they are independently arranged on the surface of the substrate;

[0010] The light conversion layer is arranged above the light emitting diode unit, and a flow channel is formed between adjacent light conversion layers;

[0011] The first packaging layer is arranged between adjacent light emitting diode units;

[0012] The second packaging layer is arranged in the flow channel.

[0013] Preferably, the light conversion layer is in an inverted trapezoidal structure, and the flow channel is in a trapezoidal structure.

[0014] Preferably, the light conversion layer is in direct contact with the surface directly above the light emitting diode unit, and adjacent light conversion layers are not in contact with each other and are independently arranged.

[0015] Preferably, the spacing between adjacent light emitting diode units is 0.02-2mm.

[0016] Preferably, the height of the first encapsulation layer is consistent with the height of the light emitting diode unit, and the height of the second encapsulation layer is consistent with the height of the light conversion layer.

[0017] Preferably, a fence glue is further included, which is arranged on the substrate and surrounds the light emitting diode unit.

[0018] Preferably, a third encapsulation layer is arranged between the light emitting diode unit and the light conversion layer.

[0019] Preferably, the first encapsulation layer is a thermosetting silicone glue with a high reflectivity additive, and the second encapsulation layer is a thermosetting silicone glue with a high light resistance additive.

[0020] The application further discloses an encapsulation device, which comprises a plurality of pixel points composed of a light emitting diode unit and a light conversion layer, and the pixel point has the LED encapsulation structure of any one of claims 1-8.

[0021] The application further discloses an encapsulation method applied to the above-mentioned LED encapsulation structure, which comprises the following steps:

[0022] S1, fixing a plurality of light emitting diode units on the substrate;

[0023] S2, fixing the fence glue on the substrate in a damming manner to form a rectangular fence and surround all the light emitting diode units;

[0024] S3, filling the first encapsulation layer around the light emitting diode unit in a dispensing manner, and the height of the first encapsulation layer is flush with the height of the light emitting diode unit;

[0025] S4, covering the light conversion layer on the light emitting diode unit in a spraying or dispensing manner;

[0026] S5, cutting the light conversion layer above the light emitting diode unit at different positions to form a flow channel;

[0027] S6, filling the second encapsulation layer in the flow channel in a dispensing manner.

[0028] Compared with the prior art, the beneficial effects of the present invention are:

[0029] The LED packaging structure, packaging device, and packaging method provided by this invention, through multi-layer dispensing and the use of silicone materials with different reflectivities and transmittances, not only improves brightness but also forms a black wall by filling the light-absorbing layer on the matrix surface, which can effectively improve contrast. Attached Figure Description

[0030] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the following description of the embodiments will be briefly introduced. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0031] Figure 1 This is a top view schematic diagram of the first embodiment of the present invention.

[0032] Figure 2 This is a structural cross-sectional view of the first embodiment of the present invention.

[0033] Figure 3 This is a structural cross-sectional view of the second embodiment of the present invention.

[0034] Figure 4 This is a flowchart illustrating the packaging method of the first embodiment of the present invention.

[0035] Explanation of reference numerals in the attached figures:

[0036] 1-Substrate, 2-Walling adhesive, 3-Light emitting diode unit, 4-Light conversion layer, 5-First encapsulation layer, 6-Second encapsulation layer, 7-Third encapsulation layer. Detailed Implementation

[0037] To make the technical problems solved by the present invention, the technical solutions adopted, and the technical effects achieved clearer, the technical solutions of the embodiments of the present invention will be further described in detail below. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0038] In the description of this invention, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0039] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0040] Example 1:

[0041] Depend on Figures 1 to 2 As shown, an LED packaging structure includes a substrate 1, a wall adhesive 2, a light-emitting diode unit 3, a light conversion layer 4, a first encapsulation layer 5, and a second encapsulation layer 6.

[0042] The number of light-emitting diode units 3 is two or more, and they are independently disposed on the surface of substrate 1. The wall adhesive 2 is disposed on substrate 1 and surrounds the light-emitting diode units 3.

[0043] The light conversion layer 4 is in direct contact with the surface directly above the light-emitting diode unit 3. Adjacent light conversion layers 4 are not in contact with each other and are set independently. A flow channel is formed between adjacent light conversion layers 4. Specifically, the light conversion layer 4 has an inverted trapezoidal structure and the flow channel has a trapezoidal structure.

[0044] The first encapsulation layer 5 is disposed between adjacent light-emitting diode units 3, and the height of the first encapsulation layer 5 is the same as the height of the light-emitting diode unit 3. The height of the second encapsulation layer 6 is the same as the height of the light conversion layer 4.

[0045] The spacing between adjacent light-emitting diode units 3 is 0.02-2mm. The first encapsulation layer 5 is a thermosetting silicone with high reflectivity additives, and the second encapsulation layer 6 is a thermosetting silicone with high light-blocking additives.

[0046] Depend on Figure 4 As shown, the packaging method for the LED packaging structure of Embodiment 1 includes the following steps:

[0047] S1. Fix multiple light-emitting diode units 3 onto substrate 1;

[0048] S2. Fix the wall adhesive 2 to the substrate 1 in a dam-like manner to form a rectangular wall, which surrounds all the light-emitting diode units 3.

[0049] S3. The first encapsulation layer 5 is filled around the light-emitting diode unit 3 by dispensing glue, and the height of the first encapsulation layer 5 is flush with the height of the light-emitting diode unit 3.

[0050] S4. The light conversion layer 44 is applied to the top of the light-emitting diode unit 3 by spraying or dispensing.

[0051] S5. Cut out flow channels in the light conversion layer 4 above the light-emitting diode unit 3 at different positions by cutting.

[0052] S6. The second encapsulation layer 6 is filled into the flow channel by dispensing adhesive.

[0053] Example 2:

[0054] Depend on Figure 3 As shown, an LED packaging structure includes a substrate 1, a wall adhesive 2, a light-emitting diode unit 3, a light conversion layer 4, a first encapsulation layer 5, a second encapsulation layer 6, and a third encapsulation layer 7.

[0055] The number of light-emitting diode units 3 is two or more, and they are independently disposed on the surface of substrate 1. The wall adhesive 2 is disposed on substrate 1 and surrounds the light-emitting diode units 3.

[0056] The light conversion layer 4 is directly above the light-emitting diode unit 3. The third encapsulation layer 7 is disposed between the light-emitting diode unit 3 and the light conversion layer 4. Adjacent light conversion layers 4 do not contact each other and are set independently. A flow channel is formed between adjacent light conversion layers 4. Specifically, the light conversion layer 4 has an inverted trapezoidal structure and the flow channel has a trapezoidal structure.

[0057] The first encapsulation layer 5 is disposed between adjacent light-emitting diode units 3, and the height of the first encapsulation layer 5 is the same as the height of the light-emitting diode unit 3. The height of the second encapsulation layer 6 is the same as the height of the light conversion layer 4.

[0058] The spacing between adjacent light-emitting diode units 3 is 0.02-2mm. The first encapsulation layer 5 is a thermosetting silicone with high reflectivity additives, and the second encapsulation layer 6 is a thermosetting silicone with high light-blocking additives.

[0059] The packaging method for the LED packaging structure of Embodiment 2 includes the following steps:

[0060] S1. Fix multiple light-emitting diode units 3 onto substrate 1;

[0061] S2. Fix the wall adhesive 2 to the substrate 1 in a dam-like manner to form a rectangular wall, which surrounds all the light-emitting diode units 3.

[0062] S3. The first encapsulation layer 5 is filled around the light-emitting diode unit 3 by dispensing glue, and the height of the first encapsulation layer 5 is flush with the height of the light-emitting diode unit 3.

[0063] S4. The third encapsulation layer 7 is applied to the top of the light-emitting diode unit 3 by spraying or dispensing, and the light conversion layer 4 is applied to the top of the third encapsulation layer 7 by spraying or dispensing.

[0064] S5. Cut out flow channels in the light conversion layer 4 above the light-emitting diode unit 3 at different positions by cutting.

[0065] S6. The second encapsulation layer 6 is filled into the flow channel by dispensing adhesive.

[0066] The present invention also includes a packaging device comprising a plurality of pixels composed of light-emitting diode units 3 and light conversion layers 4, wherein the pixels have the LED packaging structures of Embodiment 1 and Embodiment 2 mentioned above.

[0067] The embodiments disclosed in this invention differ from the chip LED packaged on a PCB. By using adhesive dispensing, different light-emitting units are isolated, reducing light mixing between adjacent light-emitting units and ensuring the uniformity of the surface light source. At the same time, it can achieve high-pixel packaging with small pitch.

[0068] Between different pixels, the chip layer is filled with a white adhesive reflective layer, and the light conversion layer 4 is filled with a black adhesive light-absorbing layer. The light conversion layer 4 has an inverted trapezoidal structure. At the same time, by applying multiple layers of adhesive and using silicone materials with different reflectivities and transmittances, the light-absorbing layer filled on the matrix surface forms a black wall while improving brightness, which can effectively improve contrast.

[0069] Encapsulation can be achieved using existing packaging processes, without the need for additional molding processes, resulting in a simple process and low cost.

[0070] In the description herein, it should be understood that the terms "upper," "lower," "left," "right," and other orientations or positional relationships are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention. Furthermore, the terms "first" and "second" are used merely for descriptive distinction and have no special meaning.

[0071] In the description of this specification, references to terms such as "an embodiment," "example," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, illustrative expressions of the above terms do not necessarily refer to the same embodiment or example.

[0072] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style of the specification is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

[0073] The technical principles of the present invention have been described above with reference to specific embodiments. These descriptions are merely for explaining the principles of the invention and should not be construed as limiting the scope of protection of the invention in any way. Based on this explanation, those skilled in the art can readily conceive of other specific embodiments of the invention without inventive effort, and these embodiments will all fall within the scope of protection of the present invention.

Claims

1. A packaging method for a packaged device, characterized in that, The packaged device includes multiple pixels composed of light-emitting diode (LED) units and light conversion layers. Each pixel has an LED packaging structure, which includes: a substrate, LED units, a light conversion layer, a first encapsulation layer, and a second encapsulation layer. The number of LED units is two or more, and they are independently disposed on the surface of the substrate. The light conversion layers are correspondingly disposed above the LED units, and flow channels are formed between adjacent light conversion layers. The first encapsulation layer is disposed between adjacent LED units. The second encapsulation layer is disposed within the flow channels. The light conversion layer has an inverted trapezoidal structure, and the flow channels have a trapezoidal structure. The light conversion layer is in direct contact with the surface directly above the LED unit, and adjacent light conversion layers are not in contact and are independently disposed. The height of the first encapsulation layer is the same as the height of the LED unit, and the height of the second encapsulation layer is the same as the height of the light conversion layer. The spacing between adjacent LED units is 0.02-2 mm. The first encapsulation layer contains a high-reflectivity additive. The LED encapsulation structure comprises a thermosetting silicone, wherein the second encapsulation layer is a thermosetting silicone with high light-blocking additives; a third encapsulation layer is provided between the light-emitting diode unit and the light conversion layer, and the light conversion layer is filled with a black glue light-absorbing layer; the LED encapsulation structure also includes a wall adhesive, which is disposed on the substrate and surrounds the light-emitting diode unit; the encapsulation of the LED encapsulation structure includes the following steps: S1, fixing multiple light-emitting diode units on the substrate; S2, fixing the wall adhesive on the substrate by means of a dam to form a rectangular wall and surrounding all the light-emitting diode units; S3, filling the first encapsulation layer around the light-emitting diode units by dispensing glue, and the height of the first encapsulation layer is flush with the height of the light-emitting diode unit; S4, covering the light conversion layer above the light-emitting diode units by spraying or dispensing glue; S5, cutting out flow channels in the light conversion layer above the light-emitting diode units at different positions by cutting; S6, filling the flow channels with the second encapsulation layer by dispensing glue.

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