Display device and multi-panel display device

Abstract

The disclosure relates to a display device and a multi-panel display device, and a display device according to an exemplary embodiment of the disclosure includes a plurality of signal lines disposed on an upper surface of a first substrate and electrically connected to a display unit, a plurality of connection lines disposed below the first substrate, a plurality of polymer patterns disposed on a side surface of the first substrate and connecting each of the signal lines and each of the connection lines to each other, and a plurality of side lines electrically connecting the plurality of signal lines and the plurality of connection lines and disposed on the plurality of polymer patterns to overlap each of the polymer patterns. According to an exemplary embodiment of the disclosure, a bezel area is narrow and includes a polymer pattern to suppress migration of a metal component generated in a side line and improve adhesion of the side line. By doing so, reliability of the display device is improved and a wiring pattern having a narrow pitch can be formed.

Description

[0001] Cross-reference to related applications

[0002] This application claims priority to Korean Patent Application No. 10-2020-0125518, filed with the Korean Intellectual Property Office on September 28, 2020, the disclosure of which is incorporated herein by reference. Technical Field

[0003] This disclosure relates to display devices and multi-panel display devices, and more specifically, to display devices and multi-panel display devices that can achieve narrow bezels with high reliability by delaying the migration of metal components generated in the side lines. Background Technology

[0004] Typically, a display device includes a display panel having a display area in which an image is displayed and a non-display area defined along the periphery of the display area, multiple drive circuits disposed in the non-display area, and a printed circuit board (PCB) providing control signals to the drive circuits. Multiple connecting lines between the display panel and the drive circuits are disposed in the non-display area. The non-display area is obscured by a black matrix or casing of the display panel, so that the image is essentially not displayed; therefore, this area is often referred to as the bezel area. To increase the effective display screen size within the same area, the drive circuits and connecting lines are disposed in the lower part of the display panel corresponding to the non-display area, and side lines are provided on the side surface of the display panel to electrically connect the display panel and the drive circuits.

[0005] Meanwhile, the size and shape of displays are becoming increasingly diverse, and in recent years, ultra-large displays have gained attention. In ultra-large displays, it is difficult to achieve a large screen using a single panel; therefore, multi-panel display devices are being used, where multiple display panels are arranged adjacent to each other. These multi-panel display devices achieve ultra-large screens by arranging multiple display panels in a tile pattern. However, in multi-panel display devices, seams are formed between adjacent display panels due to their bezel areas. These seams are clearly visible to users, which can make a discontinuous and rough feeling when an image is displayed across the entire screen. Therefore, it is necessary to minimize the bezel area of ​​each display panel.

[0006] Furthermore, as the circuitry of displays becomes increasingly integrated, the width of the wiring and the spacing between it gradually decrease. This makes it easier for the metal components constituting the wiring to become ionized and migrate to their surroundings, leading to short-circuit defects between the wiring. Summary of the Invention

[0007] Therefore, the purpose of this disclosure is to provide a display device and a multi-panel display device that have high reliability by suppressing migration phenomena caused in the side lines, while having a narrow bezel.

[0008] The purpose of this disclosure is to provide a display device that improves the adhesion between the side line and the substrate and can protect the display device from external impacts.

[0009] The purpose of this disclosure is not limited to the above-mentioned purposes, and other purposes not mentioned above will be clearly understood by those skilled in the art through the following description.

[0010] According to one aspect of this disclosure, a display device includes: a first substrate including a display area and a non-display area surrounding the display area; a display unit disposed on an upper surface of the first substrate; a plurality of signal lines disposed on the upper surface of the first substrate and electrically connected to the display unit; a plurality of connecting lines disposed below the first substrate; a plurality of polymer patterns disposed on a side surface of the first substrate and connecting each signal line and each connecting line to each other; and a plurality of side lines electrically connecting the plurality of signal lines and the plurality of connecting lines and disposed on the plurality of polymer patterns to overlap with each polymer pattern.

[0011] According to another aspect of this disclosure, a multi-panel display device includes a plurality of display devices as described above, wherein the plurality of display devices are arranged adjacent to each other.

[0012] Further details of the exemplary embodiments are included in the detailed description and drawings.

[0013] According to this disclosure, migration can be delayed while improving the adhesion of the side lines. By doing so, the mechanical and physical properties of the side lines are improved, and the reliability of the display device is enhanced.

[0014] Furthermore, according to this disclosure, the display device has a narrow bezel area and can achieve fine-pitch line patterns while maintaining high reliability.

[0015] Furthermore, according to this disclosure, problems such as thermal damage to display units caused by energy irradiated during the process of forming side lines to harden the paste used to form wiring are solved, thereby reducing the failure rate and improving display quality.

[0016] The effects of this disclosure are not limited to those illustrated above; this specification includes a variety of other effects. Attached Figure Description

[0017] The above and other aspects, features and advantages of this disclosure will become clearer from the following detailed description taken in conjunction with the accompanying drawings, wherein:

[0018] Figure 1 This is a cross-sectional view of a display device according to an exemplary embodiment of the present disclosure;

[0019] Figure 2 This is a top view of a first substrate in a display device according to an exemplary embodiment of the present disclosure;

[0020] Figure 3 This is a side view of a display device according to an exemplary embodiment of the present disclosure;

[0021] Figure 4A It is a side view photograph of a display device including a polymer pattern that does not contain black material;

[0022] Figure 4B It is a side view photograph of a display device including a polymer pattern containing black material;

[0023] Figure 5 This is a cross-sectional view used to explain the placement structure of the polymer pattern, side lines, and protective layer in a display device according to exemplary embodiments of the present disclosure;

[0024] Figure 6 This is a cross-sectional view of a display device according to another exemplary embodiment of the present disclosure;

[0025] Figure 7 This is a side view of a display device according to another exemplary embodiment of the present disclosure;

[0026] Figure 8 This is a cross-sectional view used to specifically explain the placement structure of the polymer pattern, side lines, and protective layer in a display device according to another exemplary embodiment of the present disclosure;

[0027] Figure 9 This is a cross-sectional view used to specifically explain the placement structure of the polymer pattern, side lines, and protective layer in a display device according to yet another exemplary embodiment of the present disclosure;

[0028] Figure 10 This is a cross-sectional view of a display device according to yet another exemplary embodiment of the present disclosure;

[0029] Figure 11 This is a plan view of a multi-panel display device according to exemplary embodiments of the present disclosure;

[0030] Figure 12 yes Figure 11 A magnified planar view of region X; and

[0031] Figure 13 It is along Figure 12 A sectional view taken by line I-I'. Detailed Implementation

[0032] The advantages and features of this disclosure, as well as methods for achieving these advantages and features, will become clear from the exemplary embodiments described in detail below with reference to the accompanying drawings. However, this disclosure is not limited to the exemplary embodiments disclosed herein, but will be implemented in various forms. The exemplary embodiments are provided by way of example only to enable those skilled in the art to fully understand the disclosure and scope of this disclosure. Therefore, this disclosure will be limited only by the scope of the appended claims.

[0033] The shapes, dimensions, ratios, angles, quantities, etc., shown in the accompanying drawings to describe exemplary embodiments of this disclosure are merely examples, and this disclosure is not limited thereto. Throughout the specification, the same reference numerals generally denote the same elements. Furthermore, in the following description of this disclosure, detailed explanations of known related technologies may be omitted to avoid unnecessarily obscuring the subject matter of this disclosure. Terms such as “comprising,” “having,” and “consisting of” as used herein are generally intended to allow for the addition of additional components, unless these terms are used in conjunction with the term “only.” Unless otherwise expressly stated, any reference to the singular may include the plural.

[0034] Even if not explicitly stated, the composition is interpreted as including the normal range of error.

[0035] When using terms such as “above,” “over,” “below,” and “adjacent” to describe the positional relationship between two parts, one or more parts may be located between the two parts unless these terms are used in conjunction with the terms “immediately adjacent” or “directly.”

[0036] When one element or layer is placed "on" another element or layer, another layer or another element can be directly inserted on or between the other element.

[0037] Although the terms "first," "second," etc., are used to describe various components, these components are not limited by these terms. These terms are only used to distinguish one component from other components. Therefore, the first component mentioned below can be a second component in the technical concept of this disclosure.

[0038] Throughout the specification, the same reference numerals generally denote the same elements.

[0039] The dimensions and thicknesses of each component shown in the accompanying drawings are for ease of description and this disclosure is not limited to the dimensions and thicknesses of the components shown.

[0040] Features of the various embodiments of this disclosure may be partially or wholly dependent on or combined with each other, and may be technically interlocked and operated in a variety of ways, and the embodiments may be implemented independently of each other or in relation to each other.

[0041] Throughout this specification, unless otherwise specified, the particle size is the particle size at point (D50), where the cumulative volume is 50% of the cumulative particle size distribution.

[0042] This disclosure will be described in detail below with reference to the accompanying drawings.

[0043] Figures 1 to 3 This is a view used to explain the display device according to exemplary embodiments of the present disclosure. Figure 1 This is a schematic cross-sectional view of a display device according to an exemplary embodiment of the present disclosure. Figure 2 This is a schematic top view of a first substrate in a display device according to an exemplary embodiment of the present disclosure. Figure 3 This is a side view of a display device according to an exemplary embodiment of the present disclosure.

[0044] refer to Figures 1 to 3 The display device 100 according to an exemplary embodiment of the present disclosure includes a first substrate 110, a display unit 120, a sealant 170, a second substrate 130, signal lines 140, connecting lines 150, a polymer pattern 160, side lines 180, and a protective layer 190. Each component will be described in more detail below.

[0045] The first substrate 110 is a base substrate for supporting the components of the display unit. The first substrate 110 may be formed of an insulating material. For example, the first substrate 110 may be a glass substrate or a plastic film. The first substrate 110 may be flexible enough to be bent as needed.

[0046] In the first substrate 110, a display area DA and a non-display area NDA surrounding the display area DA can be defined. The display area DA is the area in the display device 100 where an image is actually displayed, and a display unit 120, which will be described below, is disposed in the display area DA. The non-display area NDA is the area where no image is actually displayed, and therefore the non-display area NDA can be defined as the edge region of the first substrate 110 surrounding the display area DA. Various wirings, such as gate lines and data lines of thin-film transistors connected to the display unit 120 disposed in the display area DA, can be disposed in the non-display area NDA. Furthermore, driving circuitry, such as a data driving integrated circuit chip or a gate driving integrated circuit chip, can be disposed in the non-display area NDA, and multiple pads can be disposed, but not limited thereto.

[0047] Multiple pixels PX are defined within the display area DA of the first substrate 110. Each of the multiple pixels PX is a separate unit that emits light and may include red, green, and blue pixels. If necessary, white pixels may be included. A display unit 120 is formed in each of the multiple pixels PX.

[0048] Display unit 120 displays an image. For example, display unit 120 may include an organic light-emitting diode (OLED) and circuitry for driving the OLED. Specifically, the OLED may include an anode, at least one organic layer, and a cathode, such that electrons and holes are coupled to emit light. The organic layer includes an organic light-emitting layer, and may further include, but is not limited to, a hole injection layer, a hole transport layer, an electron transport layer, and an electron injection layer. For example, the circuitry may include multiple thin-film transistors, capacitors, and multiple wirings to drive the OLED.

[0049] When the display device 100 is driven in a top-emitting mode, a circuit unit is disposed on the first substrate 110 and an organic light-emitting diode can be disposed on the circuit unit. Specifically, a thin-film transistor is disposed on the first substrate 110, a planarization layer is disposed on the thin-film transistor, and an anode, a plurality of organic layers including an organic light-emitting layer, and a cathode are sequentially disposed on the planarization layer to form the display unit 120.

[0050] As another example, the display unit 120 may include a liquid crystal display element and a circuit unit. Specifically, the liquid crystal display element includes a backlight and a liquid crystal layer, and displays an image by adjusting the transmittance of the liquid crystal.

[0051] A second substrate 130 is disposed on the display unit 120 opposite to the first substrate 110. The second substrate 130 is an encapsulation substrate that prevents moisture or air from penetrating from the outside and protects the display unit 120 from physical impact. For example, the second substrate 130 may be a material selected from glass, metal foil, and plastic substrate, but is not limited thereto, and may be an encapsulation layer formed by coating organic and / or inorganic materials.

[0052] A sealant 170 is disposed between the first substrate 110 and the second substrate 130 in the non-display area NDA. The sealant 170 is configured to surround the outer periphery of the display unit 120 and bond the first substrate 110 and the second substrate 130. The sealant 170 blocks moisture and oxygen from penetrating from the side surface of the display unit 120 and can be referred to as a dam. When an encapsulation layer formed by coating organic and / or inorganic materials is used as the second substrate 130, the encapsulation layer itself is adhesive, allowing the first substrate 110 and the second substrate 130 to bond to each other. Therefore, when the second substrate 130 does not have a plate shape but is formed by coating an encapsulation layer with organic and / or inorganic materials, the sealant 170 can be omitted.

[0053] Multiple signal lines 140 are disposed on the upper surface (also referred to as the front surface) of the first substrate 110, and multiple connection lines 150 are disposed below the first substrate 110, for example, on the lower surface (also referred to as the rear surface) of the first substrate 110. The multiple signal lines 140 are electrically connected to components of the display unit 120 to transmit signals to the display unit 120. The multiple connection lines 150 are wirings connecting the multiple signal lines 150 formed on the upper surface of the first substrate 110 and the driving circuit.

[0054] Specifically, let's refer to each other. Figure 1 and Figure 2 The multiple signal lines 140 disposed on the upper surface of the first substrate 110 may be multiple gate lines GL and multiple data lines DL. The multiple gate lines GL and multiple data lines DL are electrically connected to the thin-film transistors of the display unit 120 disposed in the display area DA to transmit gate signals and data signals.

[0055] Meanwhile, the multiple connection lines 150 disposed on the lower surface of the first substrate 110 can be multiple gate connection lines and multiple data connection lines. The multiple gate connection lines are wiring connecting multiple gate lines GL disposed on the upper surface of the first substrate 110 and the gate driving circuit. The multiple data connection lines are wiring connecting multiple data lines DL disposed on the upper surface of the first substrate 110 and the data driving circuit. The multiple gate connection lines and multiple data connection lines can extend from the end of the lower surface of the first substrate 110 to the center of the lower surface of the first substrate 110.

[0056] Furthermore, on the lower surface of the first substrate 110, a gate driving circuit is configured to be electrically connected to multiple gate connection lines, and a data driving circuit is configured to be electrically connected to multiple data connection lines. In this case, the gate driving circuit and the data driving circuit can be directly formed on the lower surface of the first substrate 110, and can be disposed on the lower surface of the first substrate 110 in a chip-on-film manner. As another example, the gate driving circuit and the data driving circuit can be connected to a printed circuit board. The printed circuit board can transmit various signals to the multiple signal lines 140 formed on the first substrate 110 and the display unit 120.

[0057] refer to Figure 1 Each of the multiple signal lines 140 may include a first pad unit PAD1, and each of the multiple connection lines 150 may include a second pad unit PAD2. The first pad unit PAD1 may be a conductive layer extending from the multiple signal lines 140, and the second pad unit PAD2 may be a conductive layer extending from the multiple connection lines 150.

[0058] Multiple polymer patterns 160 are disposed on the side surface of the first substrate 110. Each polymer pattern 160 extends along the side surface of the first substrate 110 to physically connect each signal line 140 disposed on the upper surface of the first substrate 110 and each connection line 150 disposed on the lower surface of the first substrate 110.

[0059] For example, a polymer pattern 160 contacts the end of a signal line 140 disposed on the upper surface of the first substrate 110 and the end of a connecting line 150 disposed on the lower surface of the first substrate 110.

[0060] Furthermore, each polymer pattern 160 is in contact with a first pad unit PAD1 and a second pad unit PAD2. That is, each polymer pattern 160 is configured to continuously contact the side surface of the first substrate 110 from the first pad unit PAD1 of each signal line 140 to the second pad unit PAD2 of each connection line 150.

[0061] If desired, each polymer pattern 160 can be configured to selectively cover a portion of the upper surface of the first pad unit PAD1 and a portion of the lower surface of the second pad unit PAD2. That is, one end of each polymer pattern 160 contacts the end of the first pad unit PAD1 and a portion of the upper surface of the first pad unit PAD1, while the other end contacts the end of the second pad unit PAD2 and a portion of the lower surface of the second pad unit PAD2.

[0062] The plurality of polymer patterns 160 may include a first polymer pattern and a second polymer pattern. The first polymer pattern is configured to continuously cover the ends of the gate line GL formed on the upper surface of the first substrate 110, the side surface of the first substrate 110, and the ends of the gate connection lines formed on the lower surface of the first substrate 110. Furthermore, the second polymer pattern is configured to continuously cover the ends of the data line DL formed on the upper surface of the first substrate 110, the side surface of the first substrate 110, and the ends of the data connection lines formed on the lower surface of the first substrate 110.

[0063] Multiple polymer patterns 160 can be formed from epoxy resins. After curing, epoxy resins have strong resistance to stress changes, thus exhibiting excellent durability, as well as excellent heat resistance, chemical resistance, and abrasion resistance.

[0064] For example, the epoxy resin may be one or more selected from bisphenol A epoxy resin and glycidyl amine epoxy resin, but is not limited thereto. Such epoxy resin has excellent mechanical properties, such as heat resistance or impact resistance, and includes a plurality of hydroxyl or glycidyl groups to bond the side line 180 to the side surface of the first substrate 110.

[0065] For example, the storage modulus of multiple polymer patterns 160 can be from 100 MPa to 500 MPa. In this case, polymer patterns 160 are easily formed, which can suppress the migration of lateral lines 180 and have excellent buffering performance against external impacts.

[0066] The polymer pattern 160 can be formed by various methods, but pad printing is particularly suitable. Using a resilient silicone rubber pad (e.g., polydimethylsiloxane (PDMS)) for pad printing results in excellent printability even on surfaces with unevenness or steps. The polymer pattern 160 is formed on a portion of the stepped side surface of the first substrate 110, making pad printing possible. When the storage modulus of multiple polymer patterns 160 is below 100 MPa, it is difficult to form the polymer pattern 160 using pad printing, resulting in poor printability and difficulty in forming a polymer pattern 160 with the desired thickness. Conversely, when the storage modulus of the polymer pattern 160 exceeds 500 MPa, the buffering effect achieved by the polymer pattern 160 may be reduced and the migration inhibition effect may be insignificant.

[0067] The plurality of polymer patterns 160 may also include a getter material to block moisture or oxygen from penetrating the side surface of the first substrate 110 from the outside. As the getter material, known materials used in the field of display devices can be used.

[0068] Desiredly, the multiple polymer patterns 160 do not include black materials such as carbon black. When black materials are included, they absorb or conduct heat applied during the formation of the side lines 180. Consequently, components such as black embankments formed from heat-sensitive organic materials are partially melted, resulting in bleaching phenomena that cause deformation and discoloration.

[0069] Figure 4A It is a side view photograph of a display device including a polymer pattern that does not contain black material. Figure 4B This is a side view photograph of a display device including a polymer pattern containing black material. (Reference) Figure 4A and 4B It can be confirmed that the polymer pattern includes black material. Figure 4B In the display device, in comparison Figure 4A Bleaching occurs in a much wider area of ​​the display device.

[0070] Multiple polymer patterns 160 maintain high electrical characteristics over a long period of time and suppress short circuits between wirings by delaying migration phenomena generated in the side lines 180, which will help improve reliability, as will be described below.

[0071] Multiple side lines 180 are electrically connected to signal lines 140 disposed on the upper surface of the first substrate 110 and connection lines 150 disposed on the lower surface of the first substrate 110. The multiple side lines 180 are patterned to electrically connect multiple corresponding signal lines 140 and multiple corresponding connection lines 150 to each other. Each side line 180 is disposed on a polymer pattern 160 to overlap with the polymer pattern 160. That is, a complete side line 180 is configured to overlap a portion of the corresponding polymer pattern 160. Furthermore, each of the multiple side lines 180 has a structure extending along the polymer pattern 160 from the corresponding signal line 140 to the connection line 150. Therefore, the side lines 180 do not directly contact the first substrate 110, and migration generated in the side lines 180 can be suppressed.

[0072] Multiple side lines 180 are configured to contact multiple signal lines 140 disposed on the upper surface of the first substrate 110 and multiple connecting lines 150 disposed on the lower surface of the first substrate 110, so as to electrically connect the signal lines 140 and the connecting lines 150.

[0073] refer to Figure 1 The first substrate 110 protrudes outward from the second substrate 130. Therefore, the end of each of the plurality of signal lines 140 disposed on the upper surface of the first substrate 110, i.e., the upper surface of the first pad unit PAD1, is exposed. Side lines 180 are configured to directly contact the upper surface of the first pad unit PAD1 and the lower surface of the second pad unit PAD2, wherein the upper surface of the first pad unit PAD1 and the lower surface of the second pad unit PAD2 are not directly in contact with the polymer pattern 160 and are therefore exposed.

[0074] That is, multiple side lines 180 are continuously arranged from the upper surface of the first pad unit PAD1 of multiple signal lines 140 to the lower surface of the second pad unit PAD2 of multiple connection lines 150, so as to directly contact the first pad unit PAD1, the polymer pattern 160 and the second pad unit PAD2.

[0075] The multiple side lines 180 may include a first side line and a second side line. The first side line is electrically connected to a gate line GL formed on the upper surface of the first substrate 110 and a gate connection line formed on the lower surface of the first substrate 110. The second side line is electrically connected to a data line DL formed on the upper surface of the first substrate 110 and a data connection line formed on the lower surface of the first substrate 110.

[0076] The multiple side lines 180 comprise conductive material and resin. For example, the multiple side lines 180 can be formed by patterning a slurry comprising conductive particles and a curable resin using a pad printing method and then heat-treating it thereon. During the heat treatment, the conductive particles are sintered, and the curable resin is hardened to form the side lines 180 comprising conductive material and resin.

[0077] For example, the conductive particles may include one or more metals selected from silver (Ag), gold (Au), platinum (Pt), palladium (Pd), and copper (Cu). For example, the conductive particles may be silver or its alloys, which are difficult to oxidize and have excellent electrical properties.

[0078] For example, the particle size of the conductive particles can be from 10 nm to 5 μm or from 100 nm to 4 μm. The conductive particles can have a single particle size distribution, and can have multiple particle size distributions if desired. For example, the conductive particles can include conductive particles with a particle size of 10 nm to 400 nm and conductive particles with a particle size of 1 μm to 5 μm.

[0079] For example, a curable resin provides adhesion between interfaces to allow sidelines 180 to be bonded to polymer pattern 160 without separation. For example, the curable resin may be an epoxy-based resin. Epoxy-based resins can improve adhesion between interfaces and, after curing, exhibit strong resistance to stress deformation and protect sidelines 180 from physical impacts. The epoxy-based resin contained in sidelines 180 may be the same as, but not limited to, the epoxy-based resin contained in polymer pattern 160.

[0080] Furthermore, each of the multiple side lines 180 can be formed as a single layer, and can be selectively formed from multiple layers if desired. In this case, when the side lines 180 are formed as multiple layers, each layer can be formed from a paste comprising conductive particles with different particle sizes. For example, when each of the multiple side lines 180 is formed as a double layer, the lower layer is formed using a paste comprising conductive particles with a particle size of 10 nm to 400 nm, and the upper layer can be formed using a paste comprising conductive particles with a particle size of 1 μm to 5 μm. In this case, the electrical properties of the side lines 180 are superior, and their mechanical strength can be improved.

[0081] The metal constituting the side line 180 can be ionized according to the external environment, and the ionized metal can be deposited between adjacent side lines 180 while moving to the adjacent side line 180, causing short circuit defects.

[0082] In this disclosure, each side line 180 is disposed on the corresponding polymer pattern 160 for direct contact with it. Therefore, each side line 180 does not directly contact the first substrate 110. By doing so, the migration path is increased, making it possible to suppress migration and short circuits between wirings, thereby improving the reliability of the display device, as will be described below.

[0083] A protective layer 190 is disposed on multiple side lines 180. The protective layer 190 comprises a black material, making the side lines 180 invisible from the outside. The multiple side lines 180 are formed of a metallic material with glossy properties, such as silver (Ag), so that external light or light emitted from the display unit 120 is reflected and recognized by the user. Therefore, the protective layer 190 is formed of an insulating material comprising a black material. That is, the protective layer 190 may be an insulating layer comprising a black material.

[0084] For example, a pad printing method can be used to form the protective layer 190, but it is not limited to this.

[0085] For example, the protective layer 190 may be configured to surround all side surfaces of the first substrate 110. That is, the protective layer 190 may be formed as a single layer to cover all of the plurality of polymer patterns 160 and the plurality of side lines 180 patterned to connect corresponding signal lines 140 and connecting lines.

[0086] As another example, the protective layer 190 may be patterned to correspond to a plurality of polymer patterns 160 and a plurality of side lines 180. That is, the protective layer 190 may have a structure that is patterned to overlap with the plurality of polymer patterns 160 and the plurality of side lines 180 that are patterned to connect corresponding signal lines 140 and connecting lines.

[0087] The patterned protective layer 190 may include a first protective pattern and a second protective pattern. The first protective pattern covers the polymer pattern 160 and side lines 180 connecting the gate line GL formed on the upper surface of the first substrate 110 and the gate connection line formed on the lower surface of the first substrate 110. The second protective pattern covers the polymer pattern 160 and side lines 180 connecting the data line DL formed on the upper surface of the first substrate 110 and the data connection line formed on the lower surface of the first substrate 110. The widths of the first and second protective patterns may be greater than the width of the polymer pattern 160 to cover all corresponding polymer patterns 160 and side lines 180.

[0088] In the following text, reference will be made to Figure 5 The placement and effects of the polymer pattern, side lines, and protective layer are described in more detail. Figure 5 This is yet another cross-sectional view used to specifically explain the placement structure of the polymer pattern, side lines, and protective layer in a display device according to exemplary embodiments of the present disclosure. Figure 5 For ease of description, components other than the first substrate, polymer pattern, side lines, and protective layer are not shown.

[0089] refer to Figure 5 A polymer pattern 160 is disposed on the first substrate 110 and a side line 180 is disposed on the polymer pattern 160. As described above, the polymer pattern 160 is disposed between the first substrate 110 and the side line 180 to suppress migration generated in the side line 180.

[0090] Specifically, the metal used as the conductive material constituting the wiring may be ionized by moisture or oxygen entering from the outside, and the metal ions can easily be eluted from the wiring and diffuse into adjacent wirings. As described above, the diffused metal ions deposit on the surface of adjacent wirings and grow along the substrate to form a dendritic shape, resulting in short circuits between wirings. This short-circuit fault occurs more frequently in fine-pitch wiring structures with narrow spacing of 100 μm or less between side lines.

[0091] In this disclosure, side lines 180 are disposed on polymer pattern 160, and the width d2 of polymer pattern 160 is greater than the width d1 of side lines 180. Therefore, metal ions generated from side lines 180 do not contact the first substrate 110, thus suppressing migration. According to related technologies, since the side lines are formed to directly contact the substrate, migration travels in a straight line along the surface of the substrate between adjacent side lines, easily leading to short circuits between the side lines. In contrast, according to this disclosure, side lines 180 are disposed on and in contact with the polymer pattern 160, so that side lines 180 do not directly contact the first substrate 110. Therefore, even if migration occurs, unlike in the prior art, the migration travels along the first substrate 110 via the exposed surface of the polymer pattern 160 that is not in contact with the side lines 180, thereby increasing the migration travel path. Therefore, short circuits generated between adjacent side lines can be suppressed.

[0092] For example, the width d2 of the polymer pattern 160 can be from 40 μm to 100 μm and the width d1 of the side line 180 can be from 20 μm to 80 μm. Within this range, the migration path increases while keeping the electrical characteristics of the side line 180 high, thereby minimizing short-circuit defects.

[0093] According to this disclosure, the migration path can be increased without increasing the spacing between the side lines 180. Therefore, short-circuit defects can be minimized while maintaining a narrow spacing of 100 μm or less between the side lines 180, thereby achieving highly integrated circuits with improved reliability.

[0094] For example, the spacing d3 between adjacent polymer patterns 160 can be 10 μm to 60 μm or 15 μm to 40 μm, and the spacing d4 between adjacent side lines 180 can be 20 μm to 100 μm or 30 μm to 80 μm. Within this range, migration is suppressed without increasing the spacing of the side lines 180, thus delaying short-circuit defects.

[0095] Let's refer to each other. Figure 1 and Figure 5 The protective layer 190 is configured to cover the polymer pattern 160 and side lines 180 formed on the first substrate 110. That is, the side lines 180 are surrounded by the polymer pattern 160 and the protective layer 190 so as not to be exposed. Therefore, each side line 180 is formed in a tunnel shape having a connection signal line 140 and a connection line 150. As described above, the side lines 180 are completely covered by the polymer pattern 160 and the protective layer 190, which further suppresses migration generated in the side lines 180 and thereby minimizes short-circuit defects. By doing so, the reliability of the display device can be significantly improved.

[0096] Figures 6 to 8 This is a view used to explain a display device according to another exemplary embodiment of the present disclosure. Figure 6 This is a cross-sectional view of a display device according to another exemplary embodiment of the present disclosure. Figure 7 This is a side view of a display device according to another exemplary embodiment of the present disclosure. Figure 8 This is a cross-sectional view used to specifically explain the placement structure of the polymer pattern, side lines, and protective layer in a display device according to another exemplary embodiment of this disclosure. Figure 8 For ease of description, components other than the first substrate, polymer pattern, side lines, and protective layer are not shown. Figures 1 to 3 and Figure 5 Compared to the display device shown, Figures 6 to 8 The other components of the exemplary embodiments shown are substantially the same, except that the arrangement of the recessed portions and side lines formed on the polymer pattern is different, and therefore redundant descriptions will be omitted.

[0097] Let's refer to each other. Figures 6 to 8 Each of the plurality of polymer patterns 260 includes a recessed portion 261.

[0098] refer to Figure 7 and Figure 8 The recessed portion 261 is formed such that a portion of the surface of the polymer pattern 260 that contacts the side line 280 is recessed. Therefore, the thickness of the region of the polymer pattern 260 in which the recessed portion 261 is formed is less than the thickness of the region in which the recessed portion is not formed.

[0099] The recessed portion 261 is formed to be elongated from one end of the polymer pattern 260 that contacts the end of the signal line 140 to the other end of the polymer pattern 260 that contacts the end of the connecting line 150.

[0100] The recessed portion 261 of the polymer pattern 260 surrounds the side surface of the side line 280. As described above, when the area of ​​the side line 280 in contact with the polymer pattern 260 increases, the influence of moisture that causes migration is reduced and migration is delayed, thereby further improving the reliability of the display device.

[0101] As described above, the polymer pattern 260 can be formed by performing a pad printing process on an epoxy resin. For example, the pad printing process of the polymer pattern 260 may include the steps of applying epoxy resin to a metal plate in which engraved pattern units are formed, coating the patterned epoxy resin onto a silicon pad (e.g., PDMS), printing the patterned epoxy resin on a side surface of a first substrate, and curing the resin. However, this is merely illustrative, and the pad printing process is not limited to the steps described above.

[0102] The rigidity of the polymer pattern 260 varies depending on the degree of curing of the epoxy resin. The lower the degree of curing of the epoxy resin, the lower the storage modulus of the polymer pattern 260 to be formed, resulting in lower rigidity. When the rigidity of the polymer pattern 260 is low, during the process of forming side lines 280 on the polymer pattern 260 using a pad printing method, the polymer pattern 260 is extruded to form recesses 261. Therefore, the lower the storage modulus of the polymer pattern 260, the higher its ductility, and the deeper the recesses 261 to be formed.

[0103] As described above, the storage modulus of the polymer pattern 260 can be from 100 MPa to 500 MPa. When the storage modulus of the polymer pattern 260a is below 100 MPa, the spreadability of the polymer pattern 260a increases, making it impossible to maintain the pattern shape. Furthermore, it may be difficult to form a polymer pattern 260a with the desired thickness. In addition, the significantly increased extensibility results in poor printability when pad printing is performed on the side lines 280a above the polymer pattern 260a.

[0104] Conversely, when the storage modulus of the polymer pattern 260b is 500 MPa or higher, the rigidity of the polymer pattern 260b is too high, which may reduce its impact cushioning properties. Furthermore, when the rigidity of the polymer pattern 260b is too high, the portion in contact with the side line 280b is not compressed but remains flat. As described above, when the paste is printed onto the highly rigid polymer pattern 280b using a pad printing method, side lines 280b with a width greater than the target width and a thickness less than the target thickness may be formed. In this case, the effect of increasing the migration path achieved through the polymer pattern 260b may be slightly reduced.

[0105] Therefore, the storage modulus of the polymer pattern 260 can be from 100 MPa to 500 MPa, but is not limited to this. The storage modulus of the polymer pattern 260 can vary depending on the printing method, the composition of the composite material used to form the polymer pattern 260, and the composition of the paste used to form the side lines 280.

[0106] Figure 9 This is a view used to explain a display device according to yet another exemplary embodiment of the present disclosure. Figure 9 This is a cross-sectional view used to specifically explain the placement structure of the polymer pattern, side lines, and protective layer in a display device according to yet another exemplary embodiment of this disclosure. Figure 9 For ease of description, components other than the first substrate, polymer pattern, side lines, and protective layer are not shown. Figures 6 to 8 Compared to the display device shown, Figure 9 The components of the exemplary embodiments shown are substantially the same, except for the depth of the recessed portion and the arrangement of the polymer pattern and side lines, so redundant descriptions will be omitted.

[0107] refer to Figure 9 In a display device according to yet another exemplary embodiment of the present disclosure, the depth of the recessed portion 361 formed on the polymer pattern 360 is greater than that of the recessed portion 361. Figure 6 and Figure 7 The depth of the exemplary embodiment shown is deep. As described above, the depth of the recessed portion is affected by the degree of hardening of the polymer pattern and the storage modulus. That is, the degree of hardening and storage modulus of the polymer pattern 360 are lower than... Figures 6 to 7 Those of the exemplary embodiments shown make it possible to form a deeper recess 361.

[0108] The recessed portion 361 of the polymer pattern 360 not only surrounds the side surface of the side line 380, but also a portion of the upper surface of the side line 180. That is, the side surface and a portion of the upper surface of the side line 380 are in contact with the polymer pattern 360, while the portion of the upper surface of the side line 180 that is not in contact with the polymer pattern 360 is in contact with the protective layer 190. Therefore, the influence of moisture that causes migration and accelerates migration travel is reduced, and the occurrence and travel of migration can be further delayed.

[0109] Figure 10 This is a cross-sectional view of a display device according to yet another exemplary embodiment of the present disclosure. Figures 1 to 3 Compared to the display device shown, Figure 10 The exemplary embodiment shown also includes a third substrate on the lower surface of the first substrate and has a different structure formed by multiple connecting lines, multiple polymer patterns, multiple side lines, and a protective layer. However, other components are substantially the same, so redundant descriptions will be omitted.

[0110] refer to Figure 10 A third substrate 110' is disposed on the lower surface of the first substrate 110. The third substrate 110' is an auxiliary substrate supporting components in the lower part of the display device 400. The third substrate 110' can be formed of an insulating material. For example, the third substrate 110' can be a glass substrate or a plastic film. The third substrate 110' can be formed of the same material as the first substrate 110.

[0111] An adhesive layer Addh is disposed between the first substrate 110 and the third substrate 110'. The adhesive layer Addh adheres to the first substrate 110 and the third substrate 110'. The adhesive layer Addh can be disposed on either the first substrate 110 or the third substrate 110' to correspond to the non-display area NDA of the first substrate 110. However, it is not limited to this, therefore the adhesive layer Addh can be disposed in the entire area between the first substrate 110 and the third substrate 110'.

[0112] exist Figures 1 to 3 In the case of the display device 100 shown, the display unit 120 and multiple signal lines 140 are disposed on the upper surface of the first substrate 110, and the connection line 150 and the drive circuit are disposed on the lower surface of the first substrate 110. As described above, when components are disposed on both surfaces of a substrate, it is difficult to ensure the stability of the process during the process of disposing of some components on one surface and then disposing of other components on the other surface.

[0113] Therefore, after the display unit 120 and signal line 140 are disposed on the first substrate 110 and the connection line 450 and driving circuit are disposed on the third substrate 110', the display device 400 can be easily manufactured by bonding the first substrate 110 and the third substrate 110'. In addition, this is beneficial to the stability of the process and the reliability of the product.

[0114] Multiple interconnect lines 450 are formed belonging to the third substrate 110', for example, on the lower surface of the third substrate 110'. Specifically, multiple gate interconnect lines and multiple data interconnect lines may be formed on the lower surface of the third substrate 110'. Furthermore, on the lower surface of the third substrate 110', a gate drive circuit is configured to be electrically connected to the multiple gate interconnect lines, and a data drive circuit may be configured to be electrically connected to the multiple data interconnect lines.

[0115] Multiple polymer patterns 460 are disposed on the side surfaces of the first substrate 110 and the third substrate 110'. The multiple polymer patterns 460 physically connect corresponding signal lines 140 and connecting lines 450. That is, each polymer pattern 460 is configured to continuously cover the side surfaces of the first substrate 110 and the third substrate 110' from the end of each signal line 140 to the end of each connecting line 450. Therefore, the multiple polymer patterns 460 are in direct contact with the ends of the multiple signal lines disposed on the upper surface of the first substrate 110, the side surfaces of the first substrate 110 and the third substrate 110', and the ends of the multiple connecting lines 450 disposed on the lower surface of the third substrate 110'.

[0116] Multiple side lines 480 electrically connect the signal line 140 and the connecting line 450. Each of the multiple side lines 480 is disposed on a corresponding polymer pattern 460 to contact it. Each side line 480 is continuously disposed from the upper surface of the signal line 140 that is not in contact with the polymer pattern 460 and is exposed to the lower surface of the connecting line 450 disposed on the lower surface of the third substrate 110'. In doing so, each side line 480 is in direct contact with the upper surface of each signal line 140, the polymer pattern 460, and the lower surface of each connecting line 450.

[0117] A protective layer 490 is disposed on multiple side lines 480. For example, the protective layer 490 may be configured to surround all side surfaces of the first substrate 110 and the third substrate 110'. That is, the protective layer 490 may be formed as a single layer to cover all the multiple polymer patterns 460 and multiple side lines 480 that are patterned to connect corresponding signal lines 140 and connection lines 450. However, it is not limited thereto, and the protective layer 490 may be selectively patterned to correspond to the multiple polymer patterns 460 and multiple side lines 480.

[0118] In display devices according to various exemplary embodiments of the present disclosure, side lines are provided on a polymer pattern to minimize migration and resulting short circuits in the side lines and to minimize the bezel area, thereby achieving a narrow bezel. Such display devices are arranged in a tile pattern so as to be implemented as a multi-panel display device. Referring below... Figures 13 to 13 A multi-panel display apparatus according to exemplary embodiments of the present disclosure is described.

[0119] Figure 11 This is a plan view of a multi-panel display device according to exemplary embodiments of the present disclosure. Figure 12 yes Figure 11 A magnified planar view of region X. Figure 13 It is along Figure 12 A sectional view taken by line I-I'.

[0120] refer to Figure 11 A multi-panel display device 1000 according to an exemplary embodiment of the present disclosure includes a plurality of display devices. The plurality of display devices are arranged in an m×n tile pattern to be implemented as a single multi-panel display device 1000. For ease of description, in... Figure 11 Although the illustration shows 20 display devices arranged in a 5×4 tile pattern, this disclosure is not limited thereto, allowing for the arrangement of an appropriate number of display devices as needed.

[0121] refer to Figure 12 , Figure 12 Enlarged Figure 11 In region X, multiple display devices can be arranged to be in contact with each other vertically or horizontally. For example, the multiple display devices include a first display device 400A, a second display device 400B, a third display device 400C, and a fourth display device 400D. The first display device 400A and the second display device 400B are arranged to be in contact with each other horizontally, and the first display device 400A and the third display device 400C are arranged to be in contact with each other vertically.

[0122] Figure 13 It is along Figure 12 A sectional view taken along line I-I'. (Reference) Figure 13 In the multi-panel display device 1000 according to an exemplary embodiment of the present disclosure, a first display device 400A and a second display device 400B are arranged to be in horizontal contact with each other. The first display device 400A and the second display device 400B are... Figure 9 The display devices 400 shown are essentially the same, so redundant descriptions will be omitted, but the first display device 400A and the second display device 400B are not limited to... Figure 9 The embodiment shown.

[0123] The first display device 400A and the second display device 400B include a plurality of polymer patterns 460 and a plurality of side lines 480.

[0124] Multi-panel display devices include multiple display devices, which leads to significant power consumption as brightness and circuit integration increase, and are prone to short-circuit faults due to the narrow spacing between the wirings. However, in the multi-panel display device 1000 according to this disclosure, the side lines 480 are arranged on the polymer pattern 460 to overlap each other, such that migration occurring in the side lines 480 is suppressed and its travel can be delayed. By doing so, the electrical characteristics of the side lines 480 are improved to improve power efficiency, and migration is suppressed while maintaining a small spacing between the side lines 480 to improve reliability.

[0125] Furthermore, since the bezel area B is not significantly increased, an image can be displayed on the multi-panel display device 1000 without a broken or rough appearance due to the seam S. In addition, a high-quality multi-panel display device 1000 with improved power efficiency and enhanced reliability is provided.

[0126] The effects of this disclosure will be described in more detail below with reference to embodiments. However, while the following embodiments are presented to illustrate this disclosure, the scope of this disclosure is not limited to these embodiments.

[0127] Example 1

[0128] ITO by pad printing A composition containing bisphenol A epoxy resin is patterned on a substrate. The epoxy resin pattern is cured to form multiple polymer patterns. Next, a silver paste containing 80 wt% silver nanoparticles and 20 wt% epoxy-curable resin is prepared. The silver paste is patterned on each polymer pattern using a pad printing method. The patterned silver paste is then heat-treated to form silver wiring. Next, a protective layer composition containing a black material and epoxy resin is prepared. The protective layer composition is applied and cured to cover the multiple polymer patterns and silver wiring to produce a result with... Figure 8 The sample with the same structure shown. (The polymer pattern width is 60 μm, the spacing between polymer patterns is 20 μm, the silver wiring width is 50 μm, and the wiring spacing is 30 μm.)

[0129] Example 2

[0130] In Example 2, the formation of the protective layer was omitted, and polymer patterns and silver wiring were formed on the substrate using the same method as in Example 1.

[0131] Comparative Example 1

[0132] In Comparative Example 1, the formation of polymer patterns and protective layers was omitted, and silver wiring was formed directly on the substrate using the same method as in Example 1.

[0133] Comparative Example 2

[0134] In Comparative Example 2, the formation of the polymer pattern was omitted, and silver wiring was formed directly on the substrate using the same method as in Example 1, and a protective layer was formed on the silver wiring.

[0135] Experimental Examples

[0136] The silver migration delay effect, reliability, adhesion and surface hardness of the wiring in the measurement examples and comparative examples were evaluated.

[0137] 1. Water droplet acceleration test

[0138] To determine the effect of silver migration delay, a water droplet test was performed. In the water droplet test, distilled water was dropped between the wirings, and a voltage of 1V was applied to the wirings to induce silver migration. The time it took for a short circuit to occur between the wirings was measured. Each sample was measured three times, and the results are listed as averages in Table 1.

[0139] 2. Reliability Testing

[0140] In a chamber with high temperature (60°C) and high humidity (90% relative humidity), the time to short circuit due to migration was measured while a 30V voltage was applied to the sample. Four samples were fabricated for each example and comparative example, and each sample was then tested. The results are recorded in Table 1 below.

[0141] 3. Adhesion

[0142] To examine the adhesive strength of the samples, a cross-sectional separation test (YOSHIMITSU YCC-230 / 1) was performed. Adhesive strength was evaluated according to the methods specified in ASTM D3002 and D3359, and the results are recorded in Table 1 below. (0B: Separation occurs in most areas; 1B: Separation area is 35% to 65%; 2B: Separation area is 15% to 35%; 3B: Separation area is 5% to 15%; 4B: Separation area is approximately 5%; 5B: No separation occurs)

[0143] 4. Surface hardness

[0144] While applying a 500g load to the sample, the surface of the sample was scratched with a pen, and the scratches on the surface were then measured visually. The results are recorded in Table 1 below.

[0145] [Table 1]

[0146]

[0147] Referring to Table 1, it can be confirmed that in the silver wiring according to Example 1, the time taken to generate a short circuit due to migration during the water droplet acceleration test was the longest, and the time taken to generate a short circuit was also the longest for all four samples in the reliability test. It can be further confirmed that the wiring according to Example 1 has the highest adhesion and the highest surface hardness.

[0148] In Example 2, it can be confirmed that the wiring is formed on the polymer pattern, resulting in the same adhesive force as in Example 1. However, due to the absence of a protective layer, the migration delay effect is worse than that of Example 1, but better than that of Comparative Examples 1 and 2.

[0149] In Comparative Example 1, the silver wiring was formed directly on the substrate, minimizing the migration path. Furthermore, due to the absence of a protective layer, the silver wiring was fully exposed, potentially accelerating migration. Consequently, short circuits occurred in the shortest possible time, and reliability testing of some samples could not be performed due to the disconnection. Additionally, it was confirmed that the adhesion and mechanical strength of the wiring were worse than in Example 1.

[0150] Furthermore, in Comparative Example 2, it can be confirmed that the migration delay effect is slightly improved compared to Comparative Example 1, but worse than that of the Example 1, and the adhesion force is reduced.

[0151] Based on the combined experimental results, it can be confirmed that when wiring is formed on the polymer pattern, the migration path is increased to delay migration, which suppresses short circuits and thus improves wiring reliability. It can also be confirmed that the polymer pattern improves the adhesion between the substrate and the wiring to provide excellent adhesion. Furthermore, it can be confirmed that the polymer pattern provides a buffering effect against external impacts to improve mechanical strength.

[0152] Furthermore, when comparing the results of Examples 1 and 2, it can be confirmed that, as in Example 1, when the wiring is surrounded by a polymer pattern and a protective layer to form a tunnel structure, the generation and travel of migration are more effectively suppressed.

[0153] In other words, according to this disclosure, it can be confirmed that while maintaining narrow spacing between wirings, the reliability of the wiring is improved, which facilitates the realization of narrow bezels and circuit integration.

[0154] Exemplary embodiments of this disclosure can also be described as follows:

[0155] According to one aspect of this disclosure, a display device includes: a first substrate including a display area and a non-display area surrounding the display area; a display unit disposed on an upper surface of the first substrate; a signal line disposed on the upper surface of the first substrate and electrically connected to the display unit; a plurality of connecting lines disposed below the first substrate; a plurality of polymer patterns disposed on a side surface of the first substrate and connecting each signal line and each connecting line to each other; and a plurality of side lines electrically connecting the plurality of signal lines and the plurality of connecting lines and disposed on the plurality of polymer patterns to overlap with each polymer pattern.

[0156] Each polymer pattern can be configured to directly contact the end of each signal line and the end of each connector line, and can continuously contact the side surface of the first substrate from the end of the signal line to the end of the connector line.

[0157] Multiple polymer patterns may include epoxy resins.

[0158] The width of each polymer pattern can be from 40 μm to 100 μm, and the spacing between adjacent polymer patterns can be from 10 μm to 60 μm.

[0159] The energy storage modulus of multiple polymer patterns can range from 100 MPa to 500 MPa.

[0160] Each polymer pattern may include a recessed portion formed such that at least a portion of the surface of the polymer pattern that contacts the side line is recessed, and the recessed portion may extend from one end of the polymer pattern that contacts the end of the signal line to the other end of the polymer pattern that contacts the end of the connecting line.

[0161] The recessed portion can surround the side surface of the side line.

[0162] The recessed portion can surround part of the side surface and the top surface of the side line.

[0163] Multiple side lines can directly contact the upper surface of multiple signal lines and the lower surface of multiple connecting lines.

[0164] Multiple side wires may include conductive materials and resins.

[0165] The width of each lateral line can be from 20μm to 80μm, and the interval between adjacent lateral lines can be from 20μm to 100μm.

[0166] The display device may also include a protective layer that covers multiple side lines and includes a black material.

[0167] The protective layer can be formed as a single layer to surround all side surfaces of the first substrate and cover all of the multiple side lines, or it can be patterned to correspond to each of the multiple side lines.

[0168] Each sideline can be formed into a tunnel shape to connect signal lines and connecting lines between the polymer pattern and the protective layer.

[0169] The display device may further include a third substrate disposed below the first substrate, wherein a plurality of connecting lines may be disposed below the third substrate, each polymer pattern may be configured to continuously contact the side surfaces of the first substrate and the third substrate from the end of each signal line to the end of each connecting line, and each side line may be disposed on the polymer pattern to connect each signal line and each connecting line.

[0170] According to another aspect of this disclosure, a multi-panel display device includes a plurality of display devices as described above, wherein the plurality of display devices are arranged adjacent to each other.

[0171] Although exemplary embodiments of the present disclosure have been described in detail with reference to the accompanying drawings, the present disclosure is not limited thereto and may be implemented in many different forms without departing from the technical concept of the present disclosure. Therefore, the exemplary embodiments of the present disclosure are for illustrative purposes only and are not intended to limit the technical concept of the present disclosure. The scope of the technical concept of the present disclosure is not limited thereto. Therefore, it should be understood that the above exemplary embodiments are exemplary in all respects and do not limit the present disclosure. The scope of protection of the present invention should be determined by the appended claims, and all technical concepts within the equivalent scope thereof should be understood to fall within the scope of the present disclosure.

Claims

1. A display device, comprising: A first substrate includes a display area and a non-display area surrounding the display area; The display unit is disposed on the upper surface of the first substrate; Multiple signal lines are disposed on the upper surface of the first substrate and electrically connected to the display unit; Multiple connecting lines are disposed below the first substrate; Multiple polymer patterns are disposed on the side surface of the first substrate and connect each signal line and each connection line to each other. and Multiple side lines, which are electrically connected to the multiple signal lines and the multiple connection lines, are disposed on the multiple polymer patterns to overlap with each polymer pattern; The plurality of polymer patterns are arranged to be spaced apart from each other; Wherein, the polymer pattern includes a recessed portion, the recessed portion being formed such that at least a portion of the surface of the polymer pattern that contacts the side line is recessed; and The side line fills the recessed portion, and the recessed portion surrounds the side surface of the side line.

2. The display device according to claim 1, wherein, Each polymer pattern is configured to directly contact the end of each signal line and the end of each connector line, and to continuously contact the side surface of the first substrate from the end of the signal line to the end of the connector line.

3. The display device according to claim 1, wherein, The plurality of polymer patterns include epoxy resins.

4. The display device according to claim 1, wherein, Each polymer pattern has a width of 40 µm to 100 µm, and the spacing between adjacent polymer patterns is 10 µm to 60 µm.

5. The display device according to claim 1, wherein, The energy storage modulus of the plurality of polymer patterns is from 100 MPa to 500 MPa.

6. The display device according to claim 2, wherein, The recessed portion extends from one end of the polymer pattern that contacts the end of the signal line to the other end of the polymer pattern that contacts the end of the connecting line.

7. The display device according to claim 6, wherein, The recessed portion also surrounds a portion of the upper surface of the side line.

8. The display device according to claim 1, wherein, The multiple side lines are in direct contact with the upper surfaces of the multiple signal lines and the lower surfaces of the multiple connecting lines.

9. The display device according to claim 1, wherein, The multiple side lines comprise conductive material and resin.

10. The display device according to claim 1, wherein, Each sideline is 20 µm to 80 µm wide, and the interval between adjacent sidelines is 20 µm to 100 µm.

11. The display device according to claim 1, wherein, The display device further includes: A protective layer that covers the multiple side lines and includes a black material.

12. The display device according to claim 11, wherein, The protective layer is formed as a single layer to surround all side surfaces of the first substrate and cover all of the plurality of side lines, or it is patterned to correspond to each of the plurality of side lines.

13. The display device according to claim 11, wherein, Each side line is formed with a tunnel shape to connect the signal line and the connecting line between the polymer pattern and the protective layer.

14. The display device according to claim 1, wherein, The display device further includes: A third substrate is disposed below the first substrate. The plurality of connecting lines are disposed below the third substrate, and each polymer pattern is configured to continuously contact the side surfaces of the first substrate and the third substrate from the end of each signal line to the end of each connecting line, and each side line is disposed on the polymer pattern to connect each signal line and each connecting line.

15. The display device according to claim 1, wherein, The multiple connecting lines are disposed on the lower surface of the first substrate.

16. The display device according to claim 14, wherein, The multiple connecting lines are disposed on the lower surface of the third substrate.

17. A multi-panel display device, comprising: A plurality of display devices according to any one of claims 1 to 16, wherein the plurality of display devices are arranged adjacent to each other.

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