Conveyor inspection system, substrate rotator, and test system having the foregoing

Abstract

Embodiments disclosed herein include a substrate rotator, a substrate edge metrology system, and a method of performing metrology on a substrate. The substrate rotator includes a body, a body actuator coupled with the body and configured to rotate the body, and a first clamp and a second clamp coupled with the body. The substrate rotator is configured to rotate one or more substrates. The substrate edge metrology system includes two metrology systems and the substrate rotator. The substrate edge metrology system measures side gap or other defects on all sides of a substrate. The method includes performing metrology on a first set of sides of the first substrate, rotating the first substrate by a first angle, and performing metrology on a second set of sides of the first substrate. The method allows measurement of side gap or other defects on all sides of the substrate.

Description

[0001] background

[0002] field

[0003] The embodiments of this disclosure generally relate to apparatus and methods, and more specifically to conveyor inspection systems, substrate rotators, and substrate testing systems having the foregoing.

[0004] Description of related technologies

[0005] Substrates (such as semiconductor substrates, solar substrates, and the like) are routinely inspected at separate inspection stations during processing to ensure compliance with predetermined quality control standards. Different inspection technologies provide comprehensive data related to the product and process. However, comprehensive inspection can be time-consuming, thus reducing throughput, due to the number of inspection stations required and the resulting transfer time for moving substrates between stations. Therefore, device manufacturers often face the decision of choosing between thorough inspection and the prohibitively high inspection / transfer times or prior inspection processes.

[0006] A typical substrate testing system can process approximately 3,600 substrates per hour in a linear array. However, as inspection processes continue to reduce the time required to complete inspection steps, there is a need for substrate handling equipment within the testing system that can keep up with the faster inspection times and / or additional inspection procedures.

[0007] One drawback in this field is that damaged substrates can be unintentionally introduced into substrate testing systems. In particular, most conventional systems cannot detect substrates with damaged sides. In such cases, time and effort are wasted analyzing damaged or otherwise undesirable wafers that are immediately rejected. Furthermore, undesirable wafers can clog components of the testing system, necessitating a system shutdown to remove the damaged substrate. This increases the ownership cost for the user of the testing system.

[0008] Therefore, there is a need in the art for equipment and methods for improving substrate processing in substrate testing systems.

[0009] Overview

[0010] The embodiments disclosed herein include a substrate rotator, a substrate edge metrology system, and a method for performing metrology on a substrate. Substrate analysis through the substrate edge metrology system identifies notches or other defects on all four sides of the substrate, thereby allowing for easier identification and removal of unwanted substrates.

[0011] In one embodiment, a substrate rotator is provided. The substrate rotator includes a body having a first end and a second end, a body actuator coupled to the body between the first and second ends and configured to rotate the body, a first gripper coupled to the first end, and a second gripper coupled to the second end. The first gripper is configured to rotate a first rotation in response to a 180-degree rotation of the body. The first gripper is configured to rotate a first substrate held in the first gripper by the first rotation in response to a 180-degree rotation of the body. The second gripper is configured to rotate a second rotation in response to a 180-degree rotation of the body. The second gripper is configured to rotate a second substrate held in the second gripper by the second rotation in response to a 180-degree rotation of the body. The absolute value of the second rotation is greater than the first rotation.

[0012] In another embodiment, a substrate edge metering system is provided. The substrate edge metering system includes a first metering system configured to perform metering on a first set of side surfaces of a first substrate, a substrate rotator, and a second metering system configured to perform metering on a second set of side surfaces of the first substrate. The substrate rotator includes a body having a first end and a second end, a body actuator coupled to the body between the first and second ends and configured to rotate the body, a first gripper coupled to the first end, and a second gripper coupled to the second end. The first gripper is configured to rotate in response to rotation of the body. The first gripper is configured to rotate a first substrate held in the first gripper by a first rotation in response to a 180-degree rotation of the body. The second gripper is configured to rotate in response to rotation of the body. The second gripper is configured to rotate a second substrate held in the second gripper by a second rotation in response to a 180-degree rotation of the body. The absolute value of the second rotation is greater than the first rotation.

[0013] In another embodiment, a method for performing measurement on a first substrate is provided. The method includes performing measurement on a first set of side surfaces of the first substrate, rotating the first substrate by a first angle, and performing measurement on a second set of side surfaces of the first substrate. Before rotating the first substrate, the second set of side surfaces of the first substrate is in the same orientation as the first set of side surfaces.

[0014] Brief description of the attached figures

[0015] To gain a more detailed understanding of the features described above in this disclosure, reference can be made to embodiments that provide a more specific description of the disclosure briefly outlined above, some of which are illustrated in the accompanying drawings. However, it should be noted that the drawings illustrate only exemplary embodiments of the disclosure and should not be construed as limiting the scope of the disclosure, as other equivalent embodiments are applicable.

[0016] Figure 1The illustration is a top plan view of an inspection (e.g., testing) system according to one embodiment.

[0017] Figure 2 The figure shows a top plan view of a high-speed rotary sorting machine according to one embodiment.

[0018] Figure 3A The figure shows a top plan view of a conveyor inspection system according to one embodiment.

[0019] Figure 3B The figure shows a side plan view of a conveyor inspection system in a first orientation according to one embodiment.

[0020] Figure 3C The figure shows a side plan view of a conveyor inspection system in a second orientation according to one embodiment.

[0021] Figure 4 This is a flowchart of a method for sorting substrates according to one embodiment.

[0022] Figure 5A The figure shows a side plan view of a substrate rotator in a first orientation according to one embodiment.

[0023] Figure 5B The figure shows a top plan view of a substrate rotator in a first orientation according to one embodiment.

[0024] Figure 5C The figure shows a side plan view of a substrate rotator in a second orientation according to one embodiment.

[0025] Figure 5D The figure shows a top plan view of a substrate rotator in a second configuration according to one embodiment.

[0026] Figure 5E The figure shows a side plan view of a substrate rotator in a third configuration according to one embodiment.

[0027] Figure 5F The figure shows a top plan view of a substrate rotator in a third configuration according to one embodiment.

[0028] Figure 6 This is a flowchart of a method for performing measurement on a substrate according to one embodiment.

[0029] Figure 7A The figure shows a schematic diagram of a main body rotating in a first direction according to one embodiment.

[0030] Figure 7B The figure shows a schematic diagram of a main body rotating in a second direction according to one embodiment.

[0031] Figure 7C The figure shows a schematic diagram of a main body rotating in a first direction according to one embodiment.

[0032] Figure 7D The figure shows a schematic diagram of a main body rotating in a second direction according to one embodiment.

[0033] For ease of understanding, the same reference numerals have been used as much as possible to indicate common elements in the figures. It should be considered that elements and features of one embodiment may be beneficially incorporated into other embodiments without further description.

[0034] Detailed Explanation

[0035] The embodiments disclosed herein include a substrate rotator, a substrate edge metering system, and a method for performing metering on a substrate. The substrate rotator includes a body having a first end and a second end, a body actuator coupled to the body between the first and second ends and configured to rotate the body, a first gripper coupled to the first end, and a second gripper coupled to the second end. The substrate rotator is configured to rotate one or more substrates without interfering with the substrate's movement along a conveyor. The substrate edge metering system includes two metering systems and a substrate rotator. The substrate edge metering system measures notches or other defects on all four sides of a substrate by rotating the substrate as it moves between metering stations. The method includes performing metering on a first set of sides of a first substrate, rotating the first substrate by a first angle, and performing metering on a second set of sides of the first substrate. The method allows measurement of side notches or other defects on all sides of the substrate. Analyzing notches or other defects on all sides of a substrate passing through the substrate edge metering system allows for easier identification and removal of unwanted substrates. Advantageously, the substrate rotator allows measurement of all sides of a substrate without interrupting the substrate's movement along a conveyor.

[0036] As used herein, the term “about” means a change of + / - 10% from the nominal value. It should be understood that such a change can include any value provided herein.

[0037] Figure 1The figure shows a top plan view of an inspection (e.g., testing) system 100 according to one embodiment. The inspection system 100 is configured to inspect and sort a plurality of substrates 110. As shown, the inspection system 100 includes a front end 102, a conveyor system 114, a modular inspection unit 104, a sorting unit 106, and a controller 190. The front end 102 may be a loading unit. The conveyor system 114 is configured to transfer substrates from the loading unit (e.g., the front end 102) to the modular inspection unit 104. The modular inspection unit 104 may be a metering unit. The sorting unit 106 may be a sorting module that uses grippers to transfer substrates into bins based on information obtained from instructions received from the substrates in the modular inspection unit 104. The front end 102, modular inspection unit 104, and sorting unit 106 may be arranged linearly relative to each other, for example, wherein the conveyor system 114 extends in a linear or substantially linear orientation via the front end 102, modular inspection unit 104, and sorting unit 106 of the inspection system 100. Alternatively, the front end 102, modular inspection unit 104, and sorting unit 106 may be arranged in another orientation, such as an "L-shape".

[0038] The front end portion 102 is configured to transfer the substrate 110 to the remainder of the inspection system 100 via the conveyor system 114. As shown, the conveyor system 114 includes a first conveyor device 115, an intermediate conveyor device 117, and a second conveyor device 119. The conveyor system 114, and therefore the first conveyor device 115, the intermediate conveyor device 117, and the second conveyor device 119, may include any means configured to transport the substrate through the inspection system 100. For example, the conveyor system 114 may include one or more belts, rollers, webs, or other means / mechanisms suitable for transporting the substrate through the inspection system 100. The conveyor system 114 may further include a carrier or pallet to hold the substrate as it moves along the conveyor system 114, wherein the carrier or pallet is moved by a drive mechanism. Each of the first conveyor device 115, the intermediate conveyor device 117, and the second conveyor device 119 may be driven individually.

[0039] Intermediate conveyor equipment 117 is part of conveyor inspection system 170. Conveyor inspection system 170 is configured to pick out unwanted substrates 110 and remove unwanted substrates from conveyor system 114 before they can enter modular inspection unit 104 of inspection system 100. Conveyor inspection system 170 is also configured to pass substrates 110 suitable for further testing and / or inspection to second conveyor equipment 119 for transfer to modular inspection unit 104. Further details regarding conveyor inspection system 170 are given in the description of Figure 3 below.

[0040] The conveyor system 114 may be an electric motor-driven conveyor system and may include one or more conveyors, such as a transmission belt or track driven by actuators via rollers and / or drive gears. The conveyor system 114 may be arranged in a linear configuration to convey substrates through the modular inspection unit 104. Accordingly, the conveyor system 114 is disposed within the modular inspection unit 104 and facilitates the conveying of substrates 110 through the modular inspection unit 104. Additional modular inspection units may be located between the front end 102 and the modular inspection unit 104, and / or between the modular inspection unit 104 and the sorting unit 106, and / or after the sorting unit 106 to facilitate the expansion of the inspection system 100.

[0041] As shown, the front end portion 102 includes a transfer robot 108. The transfer robot 108 is configured to transfer substrates 110 from one or more boxes 112 positioned within the front end portion 102 to a first conveyor device 115. The substrates loaded on the first conveyor device 115 are transferred to an intermediate conveyor device 117 and then to a second conveyor device 119 for further transfer to a modular inspection unit 104. The transfer robot 108 includes support elements 108E, such as suction elements, end actuators, and gripper clamps for clamping and transferring the substrates 110.

[0042] Front end portion 102 receives one or more boxes 112. Each box 112 contains substrates 110 in a stacked configuration. The substrates 110 can be stacked horizontally or vertically. For example, each box 112 includes a plurality of grooves therein, and each groove is configured to hold the substrates 110. The boxes 112 can be positioned such that the substrates 110 are positioned one on top of the other. The substrates 110 are transferred from the boxes 112 to a conveyor system 114 via a transfer robot 108 for transfer via the conveyor system through an inspection system 100. Front end portion 102 includes a controller 190. The controller 190 may include a graphical user interface adapted to present information related to the operations occurring in front end portion 102, including processing measurements, lot numbers, and the like. In one example, the controller 190 includes a touchscreen interface.

[0043] Modular inspection unit 104 is configured to perform one or more measurements on substrate 110 passing through modular inspection unit 104. As shown, modular inspection unit 104 includes one or more metrology stations 116, substrate edge metrology system 181, and substrate rotator 180. Figure 1 In this embodiment, the modular inspection unit 104 includes five metrology stations 116A-116E, two of which are part of the substrate edge metrology system 181. Figure 1In the embodiment depicted, metering stations 116D and 116E, separated by the substrate rotator 180, are part of the substrate edge metering system 181. It should be considered that, where space permits, the inspection system 100 can be modified by adding or removing metering stations from the modular inspection unit 104, rather than adding a second modular inspection unit, thus increasing throughput and / or the number of metering processes performed.

[0044] Metrology station 116 may include any of the following: a microcrack inspection unit, a thickness measurement unit, a resistivity measurement unit, a photoluminescence unit, a geometric inspection unit, a saw mark detection unit, a stain detection unit, a notch detection unit, and / or a crystal fraction detection unit. The microcrack inspection unit may be configured to inspect substrate cracks and identify crystal fractions on the substrate. The geometric inspection unit may be configured to analyze the surface properties of the substrate. The saw mark detection unit may be configured to identify saw marks on the substrate, including grooves, steps, and double-step marks. Metrology station 116 may also include other examples besides those listed above. Each metrology station 116 is used to deliver one or more metrological values ​​to sorting unit 106, as described in detail below.

[0045] Metering station 116B may be a thickness measuring unit adapted to measure the thickness of the substrate. Metering station 116B may also, or alternatively, measure the resistivity of substrate 110. After inspection at metering station 116A, metering station 116B receives substrate 110 conveyed along conveyor system 114, which is of any type. Metering station 116B is positioned downstream of metering station 116A along a serial path of substrate 110 defined by conveyor system 114. Metering station 116B performs one or more inspection processes on substrate 110. The inspection processes occurring at metering station 116B may be performed while the substrate is in motion. It should be considered that the movement of substrate 110 may be stopped at metering station 116B to facilitate improved inspection accuracy.

[0046] Metrology station 116C may be a photoluminescent unit configured to detect defects and / or perform impurity measurements. Additionally, another metrology station (not shown) may be a geometry inspection unit configured to analyze the geometry and surface properties of substrate 110.

[0047] Metering station 116C receives substrate 110 conveyed along conveyor system 114 after substrate 110 has been inspected at metering station 116B. Metering station 116D receives substrate 110 conveyed along conveyor system 114 after substrate 110 has been inspected at metering station 116C. Metering station 116E receives substrate 110 conveyed along conveyor system 114 after substrate 110 has been inspected at metering station 116D, and so on, if additional metering units are used in a linear path as shown. Additionally, in some embodiments, a non-linear path inspection is used. Accordingly, substrate 110 can be conveyed between metering stations 116A-116E in a non-linear manner, such as in a ring or an arch. Substrate rotator 180 picks up a substrate exiting metering station 116D on conveyor system 114, rotates the substrate, and then returns the rotated substrate to conveyor system 114 for transfer to metering station 116E.

[0048] A substrate edge measurement system 181 is configured to measure defects on the edge of substrate 110. As shown, the substrate edge measurement system includes measurement stations 116D and 116E, and a substrate rotator 180. According to one embodiment, measurement stations 116D and 116E are notch side inspection (CSI) tools. CSI tools include image acquisition devices such as cameras, charge-coupled devices (CCDs), and the like, adapted to acquire images of the side surfaces of each substrate 110 as the substrate passes through measurement stations 116D and 116E to inspect for notches, cracks, or other defects on the substrate side surfaces. The CSI tools are configured to image the side surfaces of substrate 110 parallel to the direction in which the substrate moves downward along conveyor system 114. Figure 1 In the example illustrated, each metrology station 116D, 116E has a CSI tool positioned to obtain images of two opposite sides of a substrate, typically sides of the substrate having an orientation parallel to the direction in which the substrate travels along a portion of a conveyor system 114 disposed within the modular inspection unit 104. In one example, the CSI tool is positioned to obtain images of two opposite sides of the substrate while the substrate is held on the conveyor system 114 within the metrology stations 116D, 116E.

[0049] A substrate rotator 180 is disposed between metering stations 116D and 116E. At the first metering station 116D, notches, cracks, or other defects are inspected on the sides of the substrate (i.e., not the leading or trailing edges of the substrate when on the conveyor system 114). After the substrate 110 passes the first metering station 116D, the substrate rotator 180 rotates the substrate 110 about 90 degrees or about 270 degrees about its central axis, while simultaneously flipping the substrate 180 degrees. By flipping the substrate 180 degrees, as the substrate travels at a high speed along the conveyor system 114, it can be picked up and placed on the conveyor system 114 in substantially the same orientation as other substrates on the conveyor system 114. In other words, the substrate rotator 180 has a substrate pick-up orientation above a first position on the conveyor system 114 and a substrate unloading orientation above a second position on the conveyor system 114, wherein the substrate rotator 180 flips (i.e., rotates) 180 degrees between the first and second positions on the conveyor system 114. Additionally, depending on the direction of the 180-degree rotation of the substrate rotator 180, the substrate is rotated approximately 90° or approximately 270° around its central axis, such that regardless of the direction of rotation, the same edges (front or rear edges) of the substrate are placed on the conveyor system 114 in the same orientation. In other words, when the substrate rotator 180 rotates 180 degrees between the first and second positions, the substrate rotates 90 degrees. This exposes the unmeasured sides of the substrate 110 (i.e., the front and rear edges before being rotated by the substrate rotator 180) to the metrology station 116E, where inspection is performed to detect notches, cracks, or other defects. Therefore, each side of the substrate 110 is inspected by CSI tools. In the following... Figure 4 More details about the substrate rotator were discovered during the discussion.

[0050] Conveyor system 114 transports inspected substrates 110 from modular inspection unit 104 to sorting unit 106. Depending on the metering value of each substrate detected by metering station 116 in modular inspection unit 104, sorting unit 106 is configured to sort substrates 110 into different categories. As shown, sorting unit 106 includes rotary sorting system 120. Conveyor system 114 delivers inspected substrates 110 into sorting unit 106 to a position accessible to rotary sorting system 120. Additionally, conveyor system 114 can continue through sorting unit 106 to connector 150. Accordingly, if sorting unit 106 does not sort substrate 110, then inspected substrate 110 bypasses rotary sorting system 120 of sorting unit 106. Furthermore, if inspected substrate 110 is not picked up by rotary sorting system 120, then the substrate continues along conveyor system 114 toward connector 150.

[0051] In some embodiments, substrates not picked up by the rotary sorting system 120 continue along the conveyor system 114, leading to a bin of unsorted substrates. In some embodiments, the sorting unit 106 is further connected via connector 150 to additional units, such as additional inspection systems, additional sorting units, and / or additional metering units. Connector 150 may further allow the conveyor system 114 to be coupled with the conveyor systems of additional units, such as additional inspection systems, additional sorting units, and / or additional metering units.

[0052] Controller 190 is configured to control and automate inspection system 100. Controller 190 can be coupled to or communicate with one or more of the following: conveyor system 114, front end 102, modular inspection unit 104, sorting unit 106, conveyor robot 108, conveyor inspection system 170, substrate rotator 180, and / or metering stations 116A-116E. Inspection system 100 can provide controller 190 with information regarding the performed substrate movement, substrate transfer, substrate sorting, and / or metering.

[0053] Controller 190 includes a central processing unit (CPU) (not shown), memory (not shown), and support circuitry (or I / O) (not shown). The CPU is one type of computer processor used in industrial settings for controlling various processes and hardware (e.g., pattern generators, electric motors, and other hardware) and monitoring processes (e.g., processing time, substrate orientation or position). The memory (not shown) is connected to the CPU and is one or more readily available memories, such as random access memory (RAM), read-only memory (ROM), floppy disk, hard disk, or any other form of local or remote digital storage. Software instructions and data can be encoded and stored in the memory to instruct the CPU. Support circuitry (not shown) is also connected to the CPU for supporting the processor in a conventional manner. Support circuitry includes conventional caches, power supplies, clock circuits, input / output circuits, subsystems, and the like. A program (or computer instructions) readable by controller 190 determines which tasks can be performed on the substrate. The program can be software readable by controller 190 and can include code to monitor and control, for example, processing time and check substrate orientation or position within system 100.

[0054] Figure 2The figure shows a top plan view of a rotary sorting system 120 according to one embodiment. Depending on the metering value of each substrate, the rotary sorting system 120 is configured to store substrates 110 in various bins. As shown, the rotary sorting system 120 includes a rotatable support 122. The rotatable support 122 is configured to rotate the substrates 110 about a rotation axis R. The rotatable support 122 can be a rotating disk, an annular support, or any other shape for effectively sorting the substrates 110.

[0055] As shown, the rotatable support 122 includes a plurality of arms 124. Each arm 124 is configured to rotate a given substrate 110 about the sorting unit 106. Each arm 124 has a first end 126 and a second end 128. The first end 126 of each arm 124 is coupled to the rotatable support 122 via a suitable connection mechanism, such as a welded connection mechanism, a pin connection mechanism, a fastening connection mechanism, etc. The second end 128 of each arm 124 extends radially outward relative to the axis of rotation R. In one embodiment, the rotatable support 122 includes twelve arms 124. It should be considered that any number of arms 124 may be included, such as ten or more arms 124, such as fourteen or sixteen arms.

[0056] At least one gripper 130 is coupled to the second end 128 of each arm 124. Each gripper 130 is disposed on the bottom side or end of each arm 124 such that once the substrate 110 to be inspected arrives at the sorting unit 106, each gripper 130 grasps the substrate 110. Each gripper 130 may be a suction gripper, a claw gripper, a magnetic gripper, a pick-up device, or other suitable gripper. In one embodiment, each gripper 130 is a Bernoulli pick-up device.

[0057] One or more sorting bins 140 are arranged radially outward from the axis of rotation R. In one embodiment, ten sorting bins 140 are used. It should be considered that any number of sorting bins 140, such as six, eight, or twelve, can be used. As the plurality of arms 124 are rotated by the rotatable support 122, the sorting bins 140 can be positioned directly below the path taken by the gripper 130. According to one embodiment, the rotary sorting system 120 rotates in a stepwise manner about the axis of rotation R such that as each substrate 110 enters the sorting unit 106, the rotary sorting system 120 stops to grip (i.e., pick up) the substrate 110 from the conveyor system 114. The sorting bins 140 are positioned to receive the substrates 110 from the rotary sorting system 120. In response to one or more substrate characteristics determined during one or more inspection processes performed in the metering stations 116A-116E, the substrates 110 are sorted into the sorting bins 140. The rotary sorting system 120 positions the substrate 110 above a sorting bin 140, which is allocated to receive substrates having at least one predefined substrate characteristic. The substrate 110 is then released from a corresponding gripper 130 into the appropriate sorting bin 140. The sorting bin 140 stores the sorted substrate 110 released by the gripper 130.

[0058] Each sorting bin 140 can be individually removed from the sorting unit 106. Each sorting bin 140 can be removably connected to the sorting unit 106, such as via a drawer or container that can be individually removed, by sliding out a container, or by pulling out a drawer or container. Each sorting bin 140 can be accessible from outside the sorting unit 106, such that each sorting bin 140 can be removed from the sorting unit 106 without entering the sorting unit 106. The entire sorting bin 140 can be removed from the sorting unit 106 by pulling out the sorting bin 140. Each sorting bin 140 can be removed from the sorting unit 106 while the sorting unit 106 is on the sorting substrate 110. Thus, sorting on the substrate 110 can continue even if a particular sorting bin 140 is full or has been removed. Therefore, each sorting bin 140 can be emptied or replaced when sorting occurs.

[0059] Additionally, the controller 190 can count the number of substrates 110 in each sorting bin 140 using a counter (not shown). Accordingly, when a particular sorting bin 140 is full or not in place, the sorting unit 106 skips full or removed sorting bins 140 until the full or removed sorting bin 140 is emptied or replaced. Once an empty sorting bin 140 has been replaced within the sorting unit 106, the counter for that particular sorting bin 140 is reset. The counter can be automatically reset each time a sorting bin 140 is replaced or emptied. Full sorting bins 140 can be emptied or replaced by the operator. Accordingly, the sorting unit 106 can continue to rotate the substrates 110 until a suitable sorting bin 140 becomes available. If no sorting bin 140 is available, the sorting unit 106 can alarm the operator and continue to rotate the substrates 110 until a suitable sorting bin 140 becomes available. Once the controller 190 determines that a particular sorting box 140 is close to or has reached its capacity, the controller 190 can alert the operator by sounding an alarm and / or displaying an alarm.

[0060] Although not shown, it should be considered that an additional sorting bin 140 could be positioned within the sorting unit 106 to receive substrates 110 that are inadvertently missed from sorting, thus preventing damage to such substrates. While ten sorting bins 140 are shown, it should be considered that more or fewer sorting bins 140 could be included within the sorting unit 106, such as six, eight, eighteen, or twenty-four sorting bins 140. Additionally, a rejection bin 144 could be positioned within the sorting unit 106 to collect substrates 110 that have been rejected by one or more metering stations 116A-116E of the modular inspection unit 104. Accordingly, the rotary sorting system 120 could deliver unwanted substrates to the rejection bin 144.

[0061] The rotary sorting system 120 may also include a production analysis server 146 accessible by one or more access panels. The production analysis server 146 is coupled to one or more of the front end 102 and metering stations 116A-116E and is adapted to receive, collect, analyze, store and / or report data received from the front end 102 and one or more metering stations 116A-116E (regarding each substrate 110 passing through the front end 102 and one or more metering stations 116A-116E).

[0062] A rotatable support 122 is coupled to a rotary actuator (not shown), such as a pneumatic cylinder or a stepper motor. The rotary actuator causes the rotatable support 122 to rotate, for example, in an indexing manner. After each indexing step of the rotatable support 122, a new substrate 110 is received from the modular inspection unit 104 via a conveyor system 114 onto the rotary sorting system 120 via each gripper 130. Additionally, and as further discussed below, the rotatable support 122 can be indexed above a corresponding sorting bin 140 and / or above a rejection bin 144 in each of a plurality of arms 124, such that the substrate 110 is released into the sorting bin 140 or rejection bin 144. By continuous movement or indexing steps, substrates 110 can be continuously removed from the conveyor system 114, thus immediately freeing up space on the conveyor system 114 for the next substrate 110. Accordingly, the rotational motion allows each gripper 130 to dock with each sorting bin 140, such that the substrate held by the gripper 130 is released into one of the sorting bins 140 before the gripper 130 rotates back to the position of receiving another substrate 110. The rotary sorting system 120 continues to move until all substrates 110 have been sorted.

[0063] In some embodiments, the rotary sorting system 120 picks up substrates 110 delivered from the modular inspection unit 104 via the conveyor system 114 every 2 / 3 of a second. In such embodiments, the rotary sorting system 120 sorts at least 5,400 substrates per hour, which is a significant improvement over conventional sorting systems.

[0064] Figure 3A This is a partial top plan view of the inspection system 100 of the conveyor inspection system 170 according to one embodiment. Figure 3B This is a side plan view of an inspection system 100, illustrating a conveyor inspection system 170 in a first orientation, according to one embodiment. The conveyor inspection system 170 is configured to transport a substrate 110 to a destination, wherein the destination depends on the quality of the substrate. As shown, the conveyor inspection system 170 includes an intermediate conveyor device 117, a movable conveyor actuator 209, an exit conveyor 203, an image acquisition device 250, one or more illumination sources 260, a fast conveyor 210, and a waste bin 240. The movable conveyor actuator 209 and any of the other actuators described herein may be an electric motor, a hydraulic actuator, a pneumatic actuator, or other motion control mechanism.

[0065] As shown, the intermediate conveyor device 117 includes an inlet conveyor 201, a movable conveyor 202, and a movable conveyor actuator 209. The intermediate conveyor device 117 and therefore the inlet conveyor 201, the movable conveyor 202, and the outlet conveyor 203 may include any means configured to transport substrates along the intermediate conveyor device 117. For example, the intermediate conveyor device 117 may include one or more of the following: belts, rollers, meshes, or other means / mechanisms suitable for transporting substrates through the intermediate conveyor device 117. The intermediate conveyor device 117 may further include a carrier or tray for transporting substrates, wherein the carrier or tray is moved by a drive mechanism. Each of the inlet conveyor 201, the movable conveyor 202, and the movable conveyor actuator 209 may be driven individually.

[0066] Image acquisition device 250 may be a camera, charge-coupled device (CCD), or other device suitable for determining whether the substrate is unsuitable for further transfer to modular inspection unit 104. Substrate 110 may be transferred from front end 102 across entry conveyor 201, movable conveyor 202, exit conveyor 203, and into modular inspection unit 204, and thus entry conveyor 201, movable conveyor 202, and exit conveyor 203 may be considered components of intermediate conveyor equipment 117.

[0067] As in Figure 3A As illustrated in the diagram, the turning devices 270, 272, and 274 (e.g., conveyor belts or equivalents) of the inlet conveyor 201, the movable conveyor 114, and the outlet conveyor 203 are typically (but not required) aligned in a linear direction. The turning devices 272 of the movable conveyor 114 are typically closer to each other than the turning devices 276 of the fast conveyor 210. The turning devices 276 of the fast conveyor 210 are typically narrower than the width of the substrate, such that as the movable conveyor 114 moves between the turning devices 276 of the fast conveyor 210, the substrate is lifted from the movable conveyor 114 and placed on the fast conveyor 210, as further described below.

[0068] Figure 3BThe illustration shows the path of an exemplary substrate 110 through a conveyor inspection system 170 in a first orientation. The substrate is positioned on an inbound conveyor 201 from a cassette (or other source) by a transport robot 108. During the transfer of the substrate 110 across the inbound conveyor 201, the portion of the inbound conveyor 201 traversed by the substrate is illuminated by one or more illumination sources 260 (illustrated by beam 261). The portion of the inbound conveyor 201 illuminated by the one or more illumination sources 260 is also within the field of view of the image acquisition device 250. As the substrate 110 is illuminated, the image acquisition device 250 acquires an image of at least the edges of the substrate. Typically, the inbound conveyor 201 acquires an image of the substrate 110 as the substrate moves across the inbound conveyor 201.

[0069] The controller 190 acquires images or image data from the image acquisition device 250. The controller 190 analyzes the images to determine whether the substrate 110 is undesirable or suitable for further transfer to the modular inspection unit 104. Examples of undesirable substrates include substrates with visible damage, such as cracks, notches, or damaged corners and / or edges. In another example, an undesirable substrate might include two substrates stacked one on top of the other, i.e., a double substrate. Standard image analysis algorithms or other suitable algorithms can be used to analyze the images to determine whether the substrate 110 is undesirable or suitable for further inspection. In one example, the outline of the substrate 110 is measured and the area of ​​the substrate is calculated from the outline. If the area of ​​the substrate 110 is less than a certain area limit, then the substrate is considered damaged and therefore undesirable. If the area of ​​the substrate 110 is greater than a certain area limit, then the substrate is considered a double substrate and therefore undesirable.

[0070] In response to controller 190 determining that the substrate is desirable, controller 190 causes conveyor inspection system 170 to guide the substrate from movable conveyor 202 to exit conveyor 203; or in response to controller 190 determining that the substrate is undesirable, controller 190 causes conveyor inspection system 170 to guide the substrate from movable conveyor 202 to high-speed conveyor 210. (Return to Reference) Figure 3B In one instance, when it is determined that the substrate 110 is suitable, the suitable substrate 110 is then transferred to the modular inspection unit 104 via the movable conveyor 202 and the exit conveyor 203.

[0071] The movable conveyor 202 is configured to transport substrate 110 from the inlet conveyor 201 to the outlet conveyor 203. The movable conveyor 202 is configured to transport substrate 110 at the same speed as the inlet conveyor 201 and the outlet conveyor 203. Although the movable conveyor 202 is illustrated as being coplanar with the inlet conveyor 201 and the outlet conveyor 203, any suitable arrangement of the inlet conveyor, movable conveyor, and outlet conveyor is considered in the first orientation of the conveyor inspection system 170. For example, the inlet conveyor 201 and / or the outlet conveyor 203 may be positioned at an angle to the movable conveyor 202, provided that the movable conveyor 202 is configured to move the substrate from the inlet conveyor to the outlet conveyor when the conveyor inspection system 170 is in the first orientation.

[0072] Figure 3C The figure shows a side plan view of a conveyor inspection system 170 in a second orientation according to one embodiment. The figure illustrates the path of an undesirable substrate 111 (e.g., a fractured substrate as determined by the image acquisition device 250) passing through the conveyor inspection system 170 in the second orientation. In response to the substrate 111 being determined to be undesirable, a movable conveyor actuator 209 rotates a movable conveyor 202 in a direction away from the exit conveyor 203. In other words, the movable conveyor actuator 209 rotates the movable conveyor 202 from an orientation coplanar with the exit conveyor 203 to an orientation below the exit conveyor 203 and forming an acute angle with it.

[0073] The high-speed conveyor 210 is positioned at an acute angle to the movable conveyor 202 and below the movable conveyor (when in the first orientation) and at an acute angle to the exit conveyor 203. The high-speed conveyor 210 may include any suitable means configured to carry substrates across it. For example, the high-speed conveyor 210 may include one or more belts, rollers, meshes, or other means / mechanisms suitable for transferring substrates across it. The high-speed conveyor 210 may further include a carrier or tray for carrying the substrates, wherein the carrier or tray is moved by a drive mechanism. The high-speed conveyor 210 may be driven individually.

[0074] The high-speed conveyor 210 includes a plurality of transfer devices 211 (e.g., belts of the high-speed conveyor or equivalent). The high-speed conveyor 210 is also positioned below the exit conveyor 203. According to one embodiment, the transfer devices 211 include a plurality of lower belts, and two of the lower belts are located on opposite sides of the movable conveyor 202. The transfer devices 211 are located on the outside of the movable conveyor 202, as shown in... Figure 3AAs illustrated in the figure. However, the transfer device 211 can be located anywhere, as long as it is positioned to remove the substrate when the conveyor inspection system 170 is oriented in the second orientation. According to one embodiment, the transfer device 211 is located inside the movable conveyor 202, and the movable conveyor includes a hole (not shown) that allows the transfer device 211 to pass through when the movable conveyor 202 is moved to the second orientation. The transfer device 211 can be moved from above the movable conveyor 202 to the appropriate orientation such that it is positioned to move the substrate in the second orientation.

[0075] The movable conveyor 202 is rotated so that the unwanted substrate 111 disposed in the movable conveyor 202 is reversed by the flipping device of the high-speed conveyor 210. Figure 3A As shown in Figure 176), the substrate 111 is thus transferred from the movable conveyor 202 to the high-speed conveyor 210. The high-speed conveyor 210 then transfers the unwanted substrate 111 to a waste bin 240 located below the inlet conveyor. Thus, the unwanted substrate 111 is removed from the inspection system 100 before a suitable substrate can be moved to the modular inspection unit 104. Removing the unwanted substrate 111 from the inspection system 100 reduces congestion in the modular inspection unit 104, thereby reducing the cost of ownership.

[0076] According to one embodiment, a movable conveyor 202 is configured to operate at a first speed, and a high-speed conveyor 210 is configured to operate at a second speed, the second speed being greater than the first speed. The relative first and second speeds are determined at least in part by the dimensions of the substrate 110 during operation of the conveyor inspection system 170, the substrate movement rate across the conveyor inspection system 170, and the inter-substrate distance. Typically, the relative first and second speeds are selected to allow substrates to be conveyed from the movable conveyor 202 to the high-speed conveyor 210, and to allow the movable conveyor 202 to return to a first orientation to receive the next substrate traveling across the conveyor inspection system 170, without causing any interruption to the rate at which substrates pass through the inspection system 100.

[0077] The movable conveyor 202 is typically capable of moving between a first orientation (e.g., a first position) configured to transport substrates from the inlet conveyor 201 to the outlet conveyor 203 and a second orientation (e.g., a second position) configured to transport substrates from the inlet conveyor 201 to the fast conveyor 210. (See also...) Figure 3B and Figure 3CAs illustrated, the movable conveyor 202 is pivotable at a first end 230 located closer to the entry conveyor 201. For example, the first end 230 is attached to a shaft (not shown) that allows the movable conveyor 202 to pivot about its axis, thus allowing controllable selection of the angular orientation of the movable conveyor 202. However, in other embodiments, the movable conveyor 202 is capable of pivoting about an axis offset from the movable conveyor 202, such that the first end 230 moves as the movable conveyor 202 rotates. In any case, the movable conveyor 202 rotates and / or moves away from the exit conveyor 203 to allow the substrate to be transferred from the movable conveyor 202 to the high-speed conveyor 210.

[0078] The controller 190 may include or access a non-transitory computer-readable medium storing instructions. The non-transitory computer-readable medium storing instructions is executable by a processor (e.g., the CPU of the controller 190). The instructions are executable by the processor to determine, based on an image, whether substrate 110 is defective, and, in response to the defective substrate being detected on the movable conveyor 202, to cause the movable conveyor 202 to move from a first orientation (e.g., ...). Figure 3B The orientation shown in the diagram is moved (e.g., rotated) to a second orientation (e.g., Figure 3C (The orientation shown in the diagram) This causes defective substrates to be conveyed to the high-speed conveyor 210 and transported by the high-speed conveyor 210 to the waste bin 240, and the mobile conveyor 202 is returned to the first orientation before the next substrate arrives on the mobile conveyor.

[0079] Although the movable conveyor 202 in the second orientation is illustrated as being substantially coplanar with the high-speed conveyor 210, any arrangement of the movable conveyor and the high-speed conveyor in the second orientation of the conveyor inspection system 170 can be considered. For example, the high-speed conveyor 210 may be positioned at an angle to the movable conveyor 202, provided that the movable conveyor 202 is configured to move the substrate from the inlet conveyor to the high-speed conveyor when the conveyor inspection system 170 is in the second orientation.

[0080] Figure 4 This is a flowchart of a method 400 for sorting substrates 110 according to one embodiment. Although the method operation is combined... Figure 3B , Figure 3C and Figure 4 The method 400 is described herein, but those skilled in the art will understand that other means may be used to perform the method 400. The method 400 may be stored in or accessible to the controller 190 as a computer-readable medium containing instructions, which, when executed by the processor of the controller 190, causes the inspection system 100 to perform the method 400.

[0081] Method 400 begins at operation 410, wherein substrate 110 is transported by an entry conveyor, such as entry conveyor 201 of conveyor inspection system 170.

[0082] At operation 420, an image acquisition device 250 (such as a camera) acquires an image of the substrate 110. In one example, when operation 420 is performed, the substrate 110 continues to move on a conveyor.

[0083] At operation 430, the image is analyzed to determine whether substrate 110 is undesirable or suitable for further inspection. A controller (such as controller 190) determines whether substrate 110 is undesirable or suitable based on predefined criteria, such as by comparing the acquired image with a reference image obtained from an image library or derived from an algorithm. Operation 430 includes determining the measured area of ​​substrate 110 from the image of the substrate, and comparing the measured area with a predefined range of acceptable values ​​to determine whether substrate 110 is undesirable or suitable for further inspection.

[0084] At operation 440, in response to determining whether the substrate is suitable or undesirable, substrate 110 is transferred to its destination. If at operation 430 it is determined that substrate 110 is suitable for further inspection, then the substrate is transferred across movable conveyor 202, and when in the first orientation, across exit conveyor 203 to modular inspection unit 104, as in Figure 3B The diagram shows that if it is determined at operation 430 that the substrate is undesirable, then the movable conveyor actuator 209 moves the movable conveyor 202, on which the undesirable substrate is placed, to a second position in a direction away from the exit conveyor 203, where the substrate is transferred from the movable conveyor 202 to the fast conveyor 210. In one example, the movable conveyor 202 rotates in a direction away from the exit conveyor 203 and between the fast conveyors 210. The fast conveyor 210 is positioned at an angle to the movable conveyor 202 and below the movable conveyor. The movable conveyor 202 is rotated such that the undesirable substrate 111 comes into contact with the fast conveyor 210, thus lifting the substrate from the movable conveyor and onto the fast conveyor 210. The fast conveyor 210, which moves the substrate at a speed greater than the speed at which the substrate moves across the movable conveyor, then transfers the undesirable substrate 111 to a waste bin 240 located below the entry conveyor. Once the substrate moving on the fast conveyor 210 leaves the movable conveyor 202, the movable conveyor 202 returns to the first orientation, where the movable conveyor 202 can accept the next substrate from the incoming conveyor 201.

[0085] Figure 5A The figure shows a side plan view of a substrate rotator 180 in a first orientation according to one embodiment. Figure 5B The figure shows a top plan view of a substrate rotator 180 in a first orientation according to one embodiment. As shown, the substrate rotator 180 includes a rotating device 554 and a supporting device 550. When the rotating device rotates, the supporting device 550 supports the rotating device 554.

[0086] The substrate rotator 180 includes a body 501 having a first gripper 510 and a second gripper 512, the first gripper 510 and the second gripper 512 being coupled to the body 501 in a manner that allows the grippers 510 and 512 to rotate in response to rotation of the body 501. Synchronous relative movement of the grippers 510, 512 and the body 501 can be achieved by using one or more electric motors, actuators, linkages, belts, gears, combinations thereof, or other suitable means. In the example described below, a single actuator can be used to achieve synchronous rotation of the grippers 510 and 512 in response to simultaneous rotation of the body 501.

[0087] Support device 550 is configured to support rotating device 554. As shown, support device 550 includes machine base 587, support column 586, support rod 585, overhead support 583, main actuator 502, main belt 582, shaft 557, vacuum supply tube 581, vacuum supply source 556, and rotating assembly 555. The overhead support 583 is coupled to the support column 586 by the support rod 585. The support column 586 is supported by machine base 587.

[0088] A shaft 557 is connected to a main actuator 502 by a main belt 582. The shaft 557 is held by one or more bearings 575, which allow the shaft to rotate on its central axis. The main actuator 502 rotates the shaft 557 via the main belt 582. The shaft 557 is disposed in a channel (not shown) in a headrest 583, and is rotated while in the channel, while the headrest 583 does not rotate. The shaft 557 extends through the headrest 583 and into the body 501 below. The shaft 557 is surrounded by a tube 584. The tube 584 is separated from the shaft 557 by one or more bearings 575.

[0089] Vacuum supply source 556 is coupled to first gripper 510 and second gripper 512 via vacuum supply tube 581. The vacuum provided by vacuum supply source 556 allows first gripper 510 and second gripper 512 to pick up the substrate, as described in further detail below. Vacuum supply tube 581 passes through shaft 557 and enters the body 501, and also enters the first gripper 510 and second gripper 512. In embodiments where vacuum is not required for first gripper 510 and second gripper 512 to function, vacuum supply 556 and vacuum supply tube 581 may be omitted.

[0090] The rotating device 554 is configured to rotate one or more substrates. Figure 5A In the example shown, the rotating device 554 includes a body 501, a first gear 511, a main gear 590, a first gripper 510, a second gear 513, a second gripper 512, a belt 534, a first minor gear 531, and a second minor gear 532. The main actuator 502 is configured to rotate the shaft 557 and thus the body 501 about an axis 592. The axis 592 is substantially perpendicular to the plane of the conveyor system 114 and the substrate moving on the conveyor system 114. The axis 592 is positioned through the center of the body 501.

[0091] The main actuator 502 can rotate the main body 501 in clockwise and counterclockwise directions. The main actuator 502 is configured to rotate the main body 501 approximately 180 degrees between a first orientation and a second orientation. The main actuator 502 is configured to rotate the main body 501 in alternating clockwise and counterclockwise directions such that when the main body 501 is in either the first or second orientation, the grippers 510 and 512 attached to the main body 501 are positioned above and linearly aligned with the conveyor system 114.

[0092] The main body 501 is elongated and has a first end 551 and a second end 552. A first gripper 510 is coupled to the first end 551 such that the first gripper 510 is rotatable about a first gripper axis 594. Similarly, a second gripper 512 is coupled to the second end 552 such that the second gripper 512 is rotatable about a second gripper axis 596. Axes 594 and 596 are generally parallel to axis 592 such that as the main body 501 is rotated by the main body actuator 502, the grippers 510 and 512 and their axes 594 and 596 rotate laterally about axis 590. A first auxiliary gear 531 and a second auxiliary gear 532 are disposed on opposite sides of the main body actuator 502 and axis 592. A main gear 590 is rotatably coupled to the main body 501, and an intermediate gear is disposed about shaft 557. The belt 534 is used to engage the main gear 590 with the first auxiliary gear 531 and the second auxiliary gear 532. As the body 501 is rotated by the body actuator 502, the main gear 590 remains stationary relative to the body 501, while the grippers 510 and 512 and the auxiliary gears 531 and 532 rotate freely with the body 501 laterally about the shaft 557 on the axis 592. As the body actuator 502 rotates the body 501, the relative lateral rotation of the gears 531 and 532 about the main gear 590 causes the belt 534 to be driven (i.e., propelled) by the main gear 590.

[0093] A first gear 511 is disposed at the first end 551 of the main body 501. A first auxiliary gear 531 is connected to the first gear 511 by a belt 534. The first gear 511 is coupled to a first clamp 510 such that when the first gear 511 rotates about the axis 594 in a first direction, the first clamp 510 also rotates about the axis 594 in the first direction. A second gear 513 is disposed at the second end 552 of the main body 501. A second auxiliary gear 532 is connected to the second gear 513 by a belt 534. The second gear 513 is coupled to a second clamp 512 such that when the second gear undergoes a first rotation about the axis 596, the second clamp 512 also rotates about the axis 596 in the first direction. Because belt 534 is coupled to gears 531 and 532, in response to the simultaneous lateral rotation of grippers 510 and 512 by the main body 501 around axis 592, grippers 510 and 512 rotate simultaneously at a predetermined ratio.

[0094] In one example, when the body 501 rotates in one direction, the belt 534 is routed such that the two grippers 510, 512 turn in opposite directions. In another embodiment, when the body 501 rotates in one direction, the belt 534 is routed such that the two grippers 510, 512 turn in the same direction, for example, by twisting the belt 534 between one of the gears 531, 532 and the main gear 590. Alternatively, the relative directions of simultaneous rotation of the grippers 510, 512 can be selected by using multiple belts, gears, or other mechanisms. In embodiments where the simultaneous rotation of the grippers 510, 512 is in opposite directions, the substrate rotator 180 is configured such that one gripper rotates 180 degrees more than the other, for example, in response to a 180-degree rotation of the body 501, one gripper rotates 90 degrees and the other rotates 270 degrees. In an embodiment where the simultaneous rotation of clamps 510 and 512 is in the same direction, the substrate rotator 180 is configured such that one clamp rotates by the same amount as the other clamp, for example, in response to a 180-degree rotation of the body 501, both clamps 510 and 512 rotate by 90 degrees.

[0095] In one example, the body 501 rotates in a first direction to rotate the substrate held in the first gripper 510 to a position closer to the next module 116, while the second gripper 512, without the substrate, moves to a position to receive the next substrate being advanced down along the conveyor system 114. As the first gripper rotates in the first direction, the substrate is oriented such that one of the trailing or leading edges of the substrate (as oriented in the previous module 116) is rotated. Subsequently, the second gripper 512 picks up the next substrate being advanced down along the conveyor system 114, and as the body 510 rotates the second gripper 512 and the substrate in a second direction to a position closer to the next module 116, the substrate is rotated in the same orientation as the previous substrate was placed back on the conveyor system 114 by the first gripper 510. When the body 501 rotates in the opposite first and second directions, torsion in the electrical and fluid conduits within the substrate rotator 180 is largely eliminated.

[0096] The first gripper 510 and the second gripper 512 are configured to grip the first substrate and the second substrate, respectively. Each gripper 510, 512 may be a suction gripper, an electrostatic chuck (ESC), a claw gripper, a magnetic gripper, a pickup, or other suitable gripper. In one embodiment, each gripper 510, 512 is a Bernoulli pickup.

[0097] exist Figure 5B In the example depicted, the gear ratio between the first gear 511 and the main gear 590 is 2:1, causing the first gripper 510 to rotate by half a first angle of rotation of the main actuator. For example, if the main actuator 502 rotates the main body 501 by approximately 180 degrees, then the first gripper 510 rotates by approximately 90 degrees. The gear ratio between the main gear 590 and the second gear 513 is 1:1.5, causing the second gripper 512 to rotate by half a first angle of rotation of the main body 501. For example, if the main actuator 502 rotates the main body 501 by approximately 180 degrees, then the second gripper 512 rotates by approximately 270 degrees.

[0098] Despite Figures 5A-5F The first gripper 510 and the second gripper 512 shown in the diagram are coupled to the main actuator 502 by a belt 534 and gears 511, 513, 531, 532, and 590, but other coupling devices can be used. For example, gears 511 and 513 are directly coupled to the main gear 590. In other instances, a linkage can couple the main actuator 502 to the first gripper 510 and the second gripper 512. In yet another instance, a separate actuator (not shown) is coupled to the first gripper 510 and the second gripper 512 independently of the main actuator 502 and rotates both grippers 510 and 512.

[0099] Figure 6 This is a flowchart of a method 600 for performing measurement on a substrate according to one embodiment. Although the method operation is combined... Figures 5A-5F and Figure 6 As will be understood by those skilled in the art, any system configured to perform the method operations in any order falls within the scope of the embodiments described herein. Method 600 may be stored as a computer-readable medium containing instructions or accessible to controller 190, which, when executed by the processor of controller 190, causes inspection system 100 to perform method 600.

[0100] Method 600 begins at operation 610, wherein metrology is performed on a first set of side surfaces of a substrate (such as the first set of side surfaces 520FS of a first substrate 520). Metrology may be performed at metrology station 116D. Metrology station 116D includes a CSI, and as the substrate passes through metrology station 116D, the CSI images the first set of side surfaces 520FS of the first substrate 520 to inspect for notches, cracks, or other defects on the first set of side surfaces of the substrate. According to one embodiment, the first set of side surfaces 520FS of the first substrate 520 is parallel to the direction in which the substrate moves downward along conveyor system 114.

[0101] At operation 615, metrology is performed on the first set of side surfaces 521S of the second substrate 521. Metrology can be performed at metrology station 116D. Metrology station 116D includes a CSI (Computer Integrated Signal Processor), and as the second substrate passes through metrology station 116D, the CSI images the first set of side surfaces 521FS of the second substrate 521 to inspect for notches, cracks, or other defects on the first set of side surfaces of the substrate. According to one embodiment, the first set of side surfaces 521FS of the second substrate 521 is parallel to the direction in which the substrate moves downward along the conveyor system 114.

[0102] At operation 620, the first substrate 520 is rotated by a first angle such that the second set of side surfaces 520SS of the first substrate is in the same orientation as the first set of side surfaces 520FS before the first substrate was rotated. The substrate 520 can be picked up from an upstream position of the conveyor system 114. According to one embodiment, the first substrate 520 is square, and the first angle is approximately 90 degrees. According to one embodiment, the conveyor system 114 can be stopped, and the first substrate 520 can be rotated while stationary. The conveyor system 114 can move while the first substrate 520 is being rotated, but this requires that the first substrate 520 be placed further downstream of the conveyor system 114 when the rotation is complete. If the first substrate 520 is not placed further downstream of the conveyor system 114, then the substrate 520 may be undesirably placed on another substrate.

[0103] In some implementations, operation 620 is performed by substrate rotator 180. Figure 5A and Figure 5B The figure illustrates a substrate rotator 180 in a first orientation, wherein the substrate rotator grips a first substrate 520 with a first gripper 510. According to one embodiment, when the first substrate is rotated laterally by 180 degrees in the first direction, the first substrate 520 is rotated approximately 90 degrees about the centerline of the first substrate. According to another embodiment, when the first substrate is rotated laterally by 180 degrees in the first direction, the first substrate 520 is rotated approximately 270 degrees about the centerline of the first substrate. In either case, the first substrate 520 is rotated such that a second set of side surfaces 520SS is positioned in the same facing direction as the first set of side surfaces 520FS. In embodiments where the first gripper 510 and the second gripper 512 are Bernoulli pickers, the first substrate 520 is picked up by the first gripper 510 in the absence of movement of the first gripper in the z-direction (i.e., away from the surface of the conveyor system 114 and / or away from the top surface of the first substrate 520). The Bernoulli pick-up uses a vacuum to attract and grip the first substrate 520, and therefore movement of the first gripper 510 in the z-direction is not necessary. According to one embodiment, the second substrate 521 continues to move downward along the conveyor system 114, and thus the picked-up first substrate 520 partially overlaps with the second substrate 521 before the substrate rotator 180 is rotated.

[0104] Figure 5C The figure shows a side plan view of a substrate rotator 180 in a second orientation according to one embodiment. Figure 5D The figure shows a top plan view of a substrate rotator 180 in a second orientation according to one embodiment. In this embodiment, the second orientation illustrates a substrate rotator 180 rotated approximately 180° relative to the first orientation. If the gear ratio between the first gear 511 and the gear of the main actuator 502 is 2:1, then the first gripper 510 also rotates approximately 90 degrees. The substrate 520 is rotated a total of 180 degrees + 90 degrees = 270 degrees relative to its original orientation. Therefore, the first set of side surfaces 520FS is perpendicular to the direction in which the substrate 520 moves downward toward the conveyor system 114. Moreover, the second set of side surfaces 520SS is parallel to the direction in which the substrate 521 moves downward toward the conveyor system 114. Finally, the length of the main body 501 and the rotational speed of the main actuator 502 can be selected such that the substrate 520 is placed under the conveyor system 114 at the correct distance with sufficient substrate spacing. The substrate 520 continues to move downward along the conveyor system 114 to the metering station 116E.

[0105] in addition, Figure 5C and Figure 5DThe diagram illustrates a second gripper 512 that holds a second substrate 521, wherein the first set of side surfaces 521FS of the second substrate is parallel to the direction in which the substrate moves downward toward the conveyor system 114. The second substrate 521 can be picked up from an upstream position on the conveyor system 114. The second gripper 512 also allows rotation of the second substrate 521, as further described below. Holding the second substrate 521 increases the efficiency of the method by doubling the number of substrates redirected in the same time period. According to one embodiment, when the second substrate is rotated 180 degrees in a direction opposite to the first direction, the second substrate 521 is rotated approximately -270 degrees about the centerline of the second substrate. According to one embodiment, when the second substrate is rotated 180 degrees in a direction opposite to the first direction, the second substrate 521 is rotated approximately -90 degrees about the centerline of the second substrate. In either case, the second substrate 522 is rotated such that the second set of side surfaces 521SS is positioned in the same facing direction as the first set of side surfaces 521FS. In embodiments where the first gripper 510 and the second gripper 512 are Bernoulli pickers, the second substrate 521 is picked up by the second gripper 512 in the absence of movement of the second gripper in the z-direction (i.e., away from the surface of the conveyor system 114). The Bernoulli picker uses a vacuum to attract and hold the second substrate 521, and therefore movement of the second gripper 512 in the z-direction is not necessary. Furthermore, when the vacuum in the Bernoulli picker decreases, the first substrate 520 falls onto the conveyor system 114 in the absence of movement of the Bernoulli picker in the z-direction.

[0106] At operation 625, the second substrate 521 is rotated by a second angle such that the second set of side surfaces 521SS of the second substrate is in the same orientation as the first set of side surfaces 521FS before the second substrate was rotated. According to one embodiment, the second substrate 521 is square, and the second angle is approximately 270°. According to one embodiment, the conveyor system 114 can be stopped, and the second substrate 521 can rotate while stationary. While the second substrate 521 is being rotated, the conveyor system 114 can move, but this requires that the second substrate 521 be placed further downstream of the conveyor system 114 when the rotation is complete. If the second substrate 521 is not placed further downstream of the conveyor system 114, then the second substrate 521 may be undesirably placed on another substrate.

[0107] Figure 5E The figure shows a side plan view of a substrate rotator 180 in a third orientation according to one embodiment. Figure 5FThe figure shows a top plan view of a substrate rotator 180 in a third orientation according to one embodiment. In this embodiment, the third orientation illustrates a substrate rotator 180 rotated approximately -180 degrees relative to a second orientation. Therefore, the third orientation of the substrate rotator 180 is similar to the first orientation.

[0108] If the gear ratio between the second gear 513 and the gear of the main actuator 502 is 3:2, then the second gripper 512 also rotates approximately -270 degrees. The second substrate 521 is rotated a total of -180 degrees - 270 degrees = -90 degrees = 270 degrees relative to its original orientation. Therefore, the second set of side surfaces 521FS is perpendicular to the direction in which the substrate 521 moves downward along the conveyor system 114. Moreover, the second set of side surfaces 521SS is parallel to the direction in which the substrate 521 moves downward along the conveyor system 114. Ultimately, the orientations of the first substrate 520 and the second substrate 521 are the same, that is, rotated 270 degrees relative to their original orientations.

[0109] At operation 630, metrology is performed on a second set of side surfaces of the substrate (such as the second set of side surfaces 520SS of the first substrate 520). Metrology can be performed at metrology station 116E. Metrology station 116E includes a CSI, and as the substrate passes through metrology station 116E, the CSI images the second set of side surfaces 520SS of the first substrate 520 to inspect for notches, cracks, or other defects on the first set of side surfaces of the substrate. According to one embodiment, the second set of side surfaces 520SS of the first substrate 520 is parallel to the direction in which the substrate moves downward along the conveyor system 114. Therefore, method 600 results in metrology of multiple sets of side surfaces 520FS, 520SS of the first substrate 520.

[0110] At operation 635, metrology is performed on the second set of side surfaces 521SS of the second substrate 521. Metrology can be performed at metrology station 116E. Metrology station 116E includes a CSI (Computer Integrated Signal Processor), and as the substrate passes through metrology station 116E, the CSI images the second set of side surfaces 521SS of the second substrate 521 to inspect for notches, cracks, or other defects on the first set of side surfaces of the substrate. According to one embodiment, the second set of side surfaces 521SS of the second substrate 521 is parallel to the direction in which the substrate moves downward along the conveyor system 114. Therefore, method 600 results in metrology of multiple sets of side surfaces 521FS, 521SS of the second substrate 521.

[0111] In one instance, the body 501 rotates in a first direction in one step, and the body rotates in the opposite direction in a second step. Figure 7A The figure shows a schematic diagram of a main body 501 rotating in a first direction according to one embodiment. Figure 7A The illustration is in Figure 5B and Figure 5D There are identical movements between them. The main body 501 rotates in a first direction (shown by arrow 701). The first gripper rotates in the same direction as the first direction of the main body 501 (shown by arrow 702). The second gripper rotates in the opposite direction to the first direction of the main body 501 (shown by arrow 703). For example, the main body 501 rotates 180 degrees in the first direction, the first gripper rotates 90 degrees in the first direction, and the second gripper rotates -270 degrees in the first direction.

[0112] Figure 7B The figure shows a schematic diagram of a main body 501 rotating in a second direction according to one embodiment. Figure 7B The illustration is in Figure 5D and Figure 5F There exists the same motion between them. The body 501 rotates in a second direction (shown by arrow 701). The second direction is opposite to the first direction. The first gripper rotates in the same direction as the second direction of the body 501 (shown by arrow 702). The second gripper rotates in the opposite direction to the second direction of the body 501 (shown by arrow 703). For example, the body 501 rotates 180 degrees in the second direction, the first gripper rotates 90 degrees in the second direction, and the second gripper rotates -270 degrees in the second direction. Therefore, the body 501 and the first and second grippers are finally in the same orientation as they began. Figure 7A , Figure 7B The movement of the main body 501 shown in the figure can be achieved using an actuator that rotates only 180 degrees and does not necessarily have to rotate the entire 360 ​​degrees (e.g., main actuator 502).

[0113] In another example, the body 501 rotates in a first direction in one step, and the body rotates in the same direction in a second step. Figure 7C The figure shows a schematic diagram of a body 501 rotating in a first direction according to one embodiment. The body 501 rotates in the first direction (shown by arrow 701). A first gripper rotates in the same direction as the first direction of the body 501 (shown by arrow 702). A second gripper rotates in the same direction as the first direction of the body 501 (shown by arrow 703). For example, the body 501 rotates 180 degrees in the first direction, the first gripper rotates 90 degrees in the first direction, and the second gripper rotates 270 degrees in the first direction.

[0114] Figure 7DThe diagram illustrates a schematic of a body 501 rotating in a second direction according to one embodiment. The body 501 rotates in the second direction (shown by arrow 701). A first gripper rotates in the same direction as the first direction of the body 501 (shown by arrow 702). A second gripper rotates in the same direction as the first direction of the body 501 (shown by arrow 703). For example, the body 501 rotates 180 degrees in the second direction, the first gripper rotates 90 degrees in the second direction, and the second gripper rotates 270 degrees in the second direction. Therefore, the body 501 and the first and second grippers are ultimately in the same orientation as they initially were. Figure 7C , Figure 7D The movement of the main body 501 shown in the figure can be achieved using an actuator that rotates in one direction and does not necessarily have to rotate backward (e.g., main actuator 502).

[0115] As described above, a substrate rotator, a substrate edge metering system, and a method for rotating a substrate are provided. The substrate rotator includes a body having a first end and a second end, a body actuator coupled to the body between the first and second ends and configured to rotate the body, a first gripper coupled to the first end, and a second gripper coupled to the second end. The substrate rotator is configured to rotate one or more substrates as the substrate is further moved along a conveyor. The substrate edge metering system includes two metering systems and the substrate rotator. The substrate edge metering system measures side notches or other defects on all sides of the substrate by rotating the substrate between metering stations. The method includes performing metering on a first set of sides of a first substrate, rotating the first substrate by a first angle, and performing metering on a second set of sides of the first substrate. The method allows for the measurement of side notches or other defects on all sides of the substrate.

[0116] Substrate analysis via a substrate edge metering system identifies lateral notches or other defects on all sides of the substrate, allowing for easier identification and removal of unwanted substrates. Unlike traditional substrate metering systems, the substrate rotator allows measurement of all sides of the substrate without necessarily stopping the conveyor.

[0117] Those skilled in the art will understand that the preceding examples are exemplary and not restrictive. It is anticipated that all modifications, enhancements, equivalents, and improvements of the described examples, which will become apparent to those skilled in the art upon reading this specification and studying the accompanying drawings, are included within the true spirit and scope of this disclosure. Therefore, it is intended that the appended claims include all such modifications, variations, and equivalents falling within the true spirit and scope of these teachings.

Claims

1. A substrate rotator, comprising: The main body has a first end and a second end; A body actuator, which is coupled to the body between the first end and the second end and is configured to rotate the body; A first clamp, coupled to the first end, is configured to rotate a first rotation in response to a 180-degree rotation of the body, and is configured to cause a first substrate held in the first clamp to rotate the first rotation. and A second gripper, coupled to the second end, is configured to rotate a second rotation in response to a 180-degree rotation of the body, and is configured to cause the second substrate held by the second gripper to rotate the second rotation, wherein: The absolute value of the second rotation is greater than that of the first rotation; The first clamp is configured to vacuum clamp the first substrate and the second clamp is configured to vacuum clamp the second substrate; and The first gripper is configured to pick up the first substrate when the first substrate at least partially overlaps with the second substrate.

2. The substrate rotator of claim 1, wherein the first clamp and the second clamp are configured to rotate at different speeds.

3. The substrate rotator as claimed in claim 1, further comprising: A shaft that couples the body to the body actuator; Tube, the tube surrounding the axis; The main gear surrounds the tube; A belt, which is coupled to the main gear; A first gear, the first gear being coupled to the belt; and The second gear is coupled to the belt.

4. The substrate rotator of claim 3, wherein the main gear, the first gear, and the second gear have different radii from each other.

5. The substrate rotator of claim 4, wherein the gear ratio between the first gear and the main gear is 2:1, and the gear ratio between the main gear and the second gear is 1:1.

5.

6. The substrate rotator of claim 3, wherein the first rotation and the second rotation are in opposite directions.

7. The substrate rotator of claim 3, wherein the first rotation and the second rotation are in the same direction.

8. The substrate rotator of claim 3, further comprising: A first auxiliary gear is coupled to the belt and the first gear, and the first gear is coupled to the belt via the first auxiliary gear; and A second auxiliary gear is coupled to the belt and the second gear, which is coupled to the belt via the second auxiliary gear.

9. A substrate edge measurement system, comprising: A first metering station is configured to perform metering on a first set of sides of a first substrate. A substrate rotator includes: The main body has a first end and a second end; A body actuator, which is coupled to the body and configured to rotate the body; A first gripper, coupled to the first end, is configured to rotate the first substrate held by the first gripper by a first rotation in response to a 180-degree rotation of the body; and A second gripper, coupled to the second end, is configured to rotate the second substrate held by the second gripper by a second rotation in response to a 180-degree rotation of the body, wherein: The absolute value of the second rotation is greater than that of the first rotation; The first clamp is configured to vacuum clamp the first substrate and the second clamp is configured to vacuum clamp the second substrate; and The first gripper is configured to pick up the first substrate when the first substrate at least partially overlaps with the second substrate; and A second metering station is configured to perform metering on a second set of sides of the first substrate.

10. The substrate edge metering system of claim 9, wherein the first metering station and the second metering station each include a notch side inspection (CSI) tool.

11. The substrate edge metering system of claim 9, wherein the first clamp and the second clamp each comprise a Bernoulli pick-up device.

12. The substrate edge measurement system of claim 11, wherein the first gripper is configured to pick up the first substrate when the first substrate at least partially overlaps with the second substrate.

13. The substrate edge measurement system of claim 11, wherein the first gripper is configured to pick up the first substrate in the absence of movement of the first gripper in a first direction parallel to the top surface of the first substrate.

14. The substrate edge metering system of claim 9, wherein the first rotation is 90 degrees and the second rotation is 270 degrees, and the first rotation is in the opposite direction to the second rotation.

15. A method for performing measurement on multiple substrates, comprising: Metering is performed on a first set of side surfaces of a first substrate among the plurality of substrates; The first substrate is rotated by a first angle such that the second set of side surfaces of the first substrate are in the same orientation as the first set of side surfaces before the first substrate was rotated. Metering is performed on the second set of side surfaces of the first substrate; Metering is performed on the first set of side surfaces of the second substrate among the plurality of substrates; and The second substrate is rotated by a second angle such that the second set of side surfaces of the second substrate are in the same orientation as the first set of side surfaces before the second substrate is rotated, wherein rotating the first substrate by the first angle is in the opposite direction to rotating the second substrate by the second angle.

16. The method of claim 15, wherein the first angle is 90 degrees.

17. The method of claim 15, further comprising: Metering is performed on the first set of side surfaces of the second substrate; The second substrate is rotated by a second angle such that the second set of side surfaces of the second substrate are in the same orientation as the first set of side surfaces before the second substrate is rotated. and Metering is performed on the second set of side surfaces of the second substrate.

18. The method of claim 17, wherein the second angle is 270 degrees.

19. The method of claim 17, wherein rotating the first substrate by the first angle is in the opposite direction to rotating the second substrate by the second angle.

20. The method of claim 17, wherein rotating the first substrate by the first angle is in the same direction as rotating the second substrate by the second angle.

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