Method for manufacturing a resin composition for temporary fixation, a support belt for substrate transport, and an electronic device.

Abstract

A manufacturing method of an electronic device apparatus includes: a first step of obtaining a laminate by adhering a support to an organic substrate having a thickness of 1000 μm or less via a temporary fixing material; a second step of heating the temporary fixing material of the laminate; a third step of mounting a semiconductor chip on the organic substrate of the laminate after the second step; a fourth step of sealing the semiconductor chip mounted on the organic substrate with a sealing material; and a fifth step of peeling the support and the temporary fixing material from the organic substrate of the laminate after the fourth step, wherein the temporary fixing material contains a thermoplastic resin and does not contain a silicone-based releasing agent or a content of the silicone-based releasing agent is 10% by mass or less based on a total amount of the temporary fixing material, a shear viscosity at 60°C is 100 to 10000 Pa·s, an elastic modulus at 25°C after heating at 130°C for 30 minutes and heating at 170°C for 1 hour is 10 to 1000 MPa, and a 5% weight reduction temperature after heating at 130°C for 30 minutes and heating at 170°C for 1 hour is 300°C or higher.

Description

TECHNICAL FIELD

[0001] The present application relates to a temporary fixing resin composition, a support tape for substrate conveyance, and a manufacturing method of an electronic device. BACKGROUND

[0002] With the multi-functionality of electronic devices such as smartphones and tablet PCs, stacked MCPs (Multi Chip Package) that are high in capacity by stacking semiconductor elements in multiple stages have become widespread. A film-shaped adhesive is widely used as a die-bonding adhesive when mounting semiconductor elements. However, when using a connection method of semiconductor elements using existing wire bonding, the processing speed of data is limited, and thus the operation of electronic devices tends to be slow. Also, there is an increasing demand for low power consumption and use without charging for a longer period of time, and thus power saving is also required. From such a viewpoint, in recent years, electronic device apparatuses that use a new structure in which semiconductor elements are connected to each other using through electrodes instead of wire bonding for the purpose of further improving the speed and further saving power have also been developed.

[0003] However, electronic device apparatuses of new structures have been developed, but there is still a demand for higher capacity, and development of technology that enables stacking of semiconductor elements in more stages regardless of the package structure is being promoted. However, in order to stack more semiconductor elements in a limited space, it is essential to stabilize the thinning of semiconductor elements.

[0004] For example, a semiconductor wafer is thinned by grinding from the back surface side. In the grinding process at this time, it is mainstream to perform the grinding process in a state in which a tape called a so-called BG tape (back grinding tape) is attached to the semiconductor wafer to support the semiconductor wafer. However, the semiconductor wafer used in the grinding process has a circuit formed on the surface side, and when thinned by grinding, warping is likely to occur due to the influence thereof. The BG tape is a tape material that is easily deformed, and thus cannot sufficiently support the thinned semiconductor wafer, and is likely to cause warping of the semiconductor wafer. Therefore, a method of performing back grinding and conveyance by fixing the wafer to a support body via a pressure-sensitive adhesive has also been proposed (for example, refer to Patent Documents 1 and 2 below).

[0005] PRIOR ART DOCUMENTS

[0006] PATENT DOCUMENTS

[0007] Patent Document 1: Japanese Patent No. 4565804

[0008] Patent Document 2: Japanese Patent No. 4936667 SUMMARY

[0009] PROBLEMS TO BE SOLVED BY THE INVENTION

[0010] In order to achieve thinning of semiconductor devices, the use of a thin organic substrate as a substrate is considered, and specifically, the development of a coreless substrate that does not use a core layer impregnated with a thermosetting resin in a glass cloth is being actively pursued. A coreless substrate does not have a core layer, and thus can reduce the layer thickness of the substrate, but on the other hand, since it does not have a core layer with high elasticity, it is difficult to ensure the rigidity of the substrate itself, and the operability in the manufacturing process of semiconductor devices becomes a problem.

[0011] Therefore, an object of the present application is to provide a manufacturing method of an electronic device apparatus capable of manufacturing an electronic device apparatus having a semiconductor device using an organic substrate thinning at a high productivity, and a temporary fixing resin composition and a substrate conveying support tape capable of being used in the manufacturing method.

[0012] Means for solving the technical problem

[0013] In order to solve the above problems, the present inventors have investigated the manufacturing of semiconductor devices using a coreless substrate and the manufacturing of electronic device apparatuses using the semiconductor devices. With regard to the problem of operability, there is a problem of flexing of the organic substrate during conveying, and as a means to solve this problem, it is considered to adhere a support body to the organic substrate. In such a process, in order to peel the adhered support body from the organic substrate, it is necessary to adhere the support body using a temporary fixing material such as a pressure-sensitive adhesive. As a means to adjust the peelability of the temporary fixing material, a method of adding a release agent is known. However, in a substrate on which a semiconductor chip is mounted, it is required that contamination caused by residues and the like after peeling the temporary fixing material be as little as possible, and the release agent is easily transferred from the temporary fixing material to the substrate, and in particular, when a silicone-based release agent remains on the organic substrate, it is not preferable from the viewpoint of connection reliability.

[0014] In addition, the conventional technology described above and the like assumes processing of a semiconductor wafer, and thus although the peelability with respect to a silicon wafer is considered, the peelability with respect to an organic substrate and the problem of the release agent described above are not mentioned.

[0015] Therefore, as a result of the present inventors considering a temporary fixing resin composition for temporarily fixing a support body for conveying a substrate to an organic substrate, it was found that in a resin composition containing a thermoplastic resin and not containing a silicone-based release agent or containing a silicone-based release agent in an amount limited to a certain amount or less, by making the shear viscosity when in a film shape, the elastic modulus after a predetermined heating, and the 5% weight reduction temperature after a predetermined heating be within a certain range, appropriate peel strength with respect to an organic substrate can be exhibited, and the present application was completed based on this insight.

[0016] One embodiment of the present application relates to a method for manufacturing an electronic device, including: a first step of obtaining a laminate by adhering a support to an organic substrate having a thickness of 1000 μm or less via a temporary fixing material; a second step of heating the temporary fixing material of the laminate; a third step of mounting a semiconductor chip on the organic substrate of the laminate after the second step; a fourth step of sealing the semiconductor chip mounted on the organic substrate with a sealing material; and a fifth step of peeling the support and the temporary fixing material from the organic substrate of the laminate after the fourth step, wherein the temporary fixing material contains a thermoplastic resin and does not contain a silicone-based releasing agent or a content of a silicone-based releasing agent is 10% by mass or less based on the total amount of the temporary fixing material, a shear viscosity at 60°C is 100 to 10000 Pa·s, an elastic modulus at 25°C after heating at 130°C for 30 minutes and heating at 170°C for 1 hour is 10 to 1000 MPa, and a 5% weight reduction temperature after heating at 130°C for 30 minutes and heating at 170°C for 1 hour is 300°C or higher.

[0017] According to the method for manufacturing an electronic device of the present application, an electronic device having a semiconductor element using a thin organic substrate can be manufactured at high productivity. That is, the present manufacturing method can exhibit the following effects by making the temporary fixing material have a specific composition and exhibit a specific shear viscosity, a specific elastic modulus, and a specific 5% weight reduction temperature: (i) the organic substrate and the support can be adhered in the first step, and the operability of the thin organic substrate (e.g., easy conveyance of the thin organic substrate) is improved; (ii) the temporary fixing material after the second step can sufficiently fix the organic substrate and the support in the third step and the fourth step, and the semiconductor chip can be efficiently mounted and sealed; and (iii) the support can be easily peeled from the organic substrate without contaminating the surface of the substrate in the fifth step; and the like.

[0018] The organic substrate can be a coreless substrate.

[0019] The support can be a polyethylene terephthalate film, a polybutylene terephthalate film, a polyethylene naphthalate film, a polypropylene film, a polyamide film, or a polyimide film.

[0020] In the first step, the support can be supplied in a tape shape and continuously. At this time, the thin organic substrate can be continuously conveyed, and the productivity and the like can be improved.

[0021] In the first step, the laminate can be obtained using a support tape including a support film as the support and a temporary fixing material layer formed of the temporary fixing material provided on the support film.

[0022] Compared to the method of forming a temporary fixing material layer on an organic substrate or support by coating a liquid temporary fixing material, the method of using such a support strip can further reduce the unevenness of the temporary fixing material, making it easier to obtain a uniform semiconductor device after processing. Furthermore, the temporary fixing material can be easily utilized without waste.

[0023] Another aspect of the present invention relates to a resin composition for temporary fixation, used to temporarily fix a support for transporting a substrate to an organic substrate. This resin composition contains a thermoplastic resin and is free of silicone-based release agents, or the content of silicone-based release agents is 10% by mass or less based on the total amount of the resin composition. When formed into a film, it has a shear viscosity of 100 to 10000 Pa·s at 60°C, an elastic modulus of 10 to 1000 MPa at 25°C after heating at 130°C for 30 minutes and then at 170°C for 1 hour, and a 5% weight reduction temperature of 300°C or higher after heating at 130°C for 30 minutes and then at 170°C for 1 hour.

[0024] The resin composition for temporary fixation according to the present invention can adequately fix an organic substrate and a support for transport, and the support can be easily peeled off from the organic substrate without contaminating the substrate surface.

[0025] Another aspect of the present invention relates to a support belt for transporting a substrate, comprising: a support film for transporting an organic substrate; and a temporary fixing material layer disposed on the support film and used for temporarily fixing the organic substrate and the support film. The temporary fixing material layer contains a thermoplastic resin but does not contain a silicone-based release agent, or the content of the silicone-based release agent is 10% by mass or less based on the total amount of the temporary fixing material; its shear viscosity at 60°C is 100 to 10000 Pa·s; its elastic modulus after heating at 130°C for 30 minutes and then at 170°C for 1 hour is 10 to 1000 MPa at 25°C; and its 5% weight reduction temperature after heating at 130°C for 30 minutes and then at 170°C for 1 hour is 300°C or higher.

[0026] The substrate transport support belt of the present invention can improve the operability of organic substrates and can be easily peeled off from organic substrates without contaminating the substrate surface.

[0027] The aforementioned support film can be a polyethylene terephthalate film, a polybutylene terephthalate film, a polyethylene naphthalate film, a polypropylene film, a polyamide film, or a polyimide film.

[0028] Invention Effects

[0029] According to the present invention, a method for manufacturing an electronic device having an electronic device having a semiconductor element thinned using an organic substrate is provided, which can be manufactured with high productivity, and a temporary fixing resin composition and a substrate transport support belt that can be used in the manufacturing method.

[0030] The temporary fixing resin composition of the present invention can adequately fix the organic substrate and the transport support, and the support can be easily peeled off from the organic substrate without contaminating the substrate surface. The substrate transport support belt of the present invention can improve the operability of the organic substrate and can be easily peeled off from the organic substrate without contaminating the substrate surface. Attached Figure Description

[0031] Figure 1 The figure shows one embodiment of the support belt for substrate transport. Figure 1 (A) is a top view. Figure 1 (B) is along Figure 1 (A) is a schematic cross-sectional view of the II line cut.

[0032] Figure 2 The figure shows another embodiment of the support belt for substrate transport. Figure 2 (A) is a top view. Figure 2 (B) is along Figure 2 (A) is a schematic cross-sectional view of the II-II line cut.

[0033] Figure 3 (a)~ Figure 3 (c) is a schematic cross-sectional view illustrating one embodiment of a method for manufacturing an electronic device.

[0034] Figure 4 (d)~ Figure 4 (e) is a schematic cross-sectional view illustrating one embodiment of a method for manufacturing an electronic device.

[0035] Figure 5 (f)~ Figure 5 (h) is a schematic cross-sectional view illustrating one embodiment of a method for manufacturing an electronic device. Detailed Implementation

[0036] Hereinafter, the embodiments for carrying out the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the following embodiments. Furthermore, in this specification, "(meth)acrylic acid" means acrylic acid or methacrylic acid, and "(meth)acrylate" means acrylate or its corresponding methacrylate. "A or B" may contain either A or B, or both.

[0037] Furthermore, in this specification, the term "layer," when viewed in a plan view, includes not only structures formed on the entire surface but also structures formed on a portion of it. Also, in this specification, the term "process" includes not only independent processes but also processes that, even if they cannot be clearly distinguished from other processes, are included as long as the desired function of the process can be achieved. Furthermore, the numerical range indicated by "~" represents the range of minimum and maximum values, including the values ​​before and after "~".

[0038] Furthermore, in this specification, when multiple substances equivalent to each component are present in the composition, unless otherwise specified, the content of each component in the composition means the total amount of the multiple substances present in the composition. Also, unless otherwise specified, the exemplary materials can be used alone or in combination of two or more.

[0039] Furthermore, in the numerical ranges described in stages in this specification, the upper or lower limit of a certain stage's numerical range can be replaced with the upper or lower limit of a numerical range in other stages. Also, in the numerical ranges described in this specification, the upper or lower limit of the numerical range can be replaced with the values ​​shown in the embodiments.

[0040] [Resin composition for temporary fixation]

[0041] The temporary fixation resin composition of this embodiment contains a thermoplastic resin. In addition to the above-mentioned components, the temporary fixation resin composition may further contain thermosetting components, curing accelerators, or other components.

[0042] The resin composition for temporary fixation in this embodiment can be used as a temporary fixation material for temporarily fixing a support for transporting a substrate to an organic substrate.

[0043] <Thermoplastic Resins>

[0044] As a thermoplastic resin, any resin that is thermoplastic before being bonded to the organic substrate and the support can be used without particular limitation. In this embodiment, the thermoplastic resin can be a resin that forms a cross-linked structure by heating or the like. Polymers having cross-linking functional groups can be cited as examples of such resins.

[0045] Examples of polymers with crosslinking functional groups include thermoplastic polyimide resins, (meth)acrylic acid copolymers with crosslinking functional groups, amine ester resins, polyphenylene ether resins, polyetherimide resins, phenoxy resins, and modified polyphenylene ether resins. Among these, (meth)acrylic acid copolymers with crosslinking functional groups are preferred.

[0046] (Meth)acrylic acid copolymers with crosslinking functional groups can be obtained by polymerization methods such as bead polymerization and solution polymerization, or commercially available products can be used. The polymer with crosslinking functional groups can have crosslinking functional groups in the polymer chain or at the ends of the polymer chain. Specific examples of crosslinking functional groups include epoxy groups, alcohol hydroxyl groups, phenolic hydroxyl groups, and carboxyl groups. Among the crosslinking functional groups, carboxyl groups are preferred. Carboxyl groups can be introduced into the polymer chain using acrylic acid.

[0047] The glass transition temperature (hereinafter, sometimes referred to as "Tg") of the thermoplastic resin is preferably -50°C to 50°C, more preferably -40°C to 20°C. As long as Tg is within this range, it is possible to suppress the deterioration of workability (caused by excessively high adhesive strength) and obtain more sufficient fluidity, thereby further reducing the elastic modulus after curing, and thus further suppressing the peel strength from becoming too high.

[0048] Tg is the midpoint glass transition temperature value when thermoplastic resins are measured using differential scanning calorimetry (DSC, such as Rigaku Corporation's "Thermo Plus 2"). Specifically, the above-mentioned Tg is the midpoint glass transition temperature calculated by measuring the heat change under the conditions of a heating rate of 10°C / min and a measurement temperature of -80 to 80°C, and using a method based on JIS K 7121:1987.

[0049] The weight-average molecular weight of the thermoplastic resin is not particularly limited, but is preferably between 100,000 and 1,200,000, more preferably between 200,000 and 1,000,000. As long as the weight-average molecular weight of the thermoplastic resin is within this range, film-forming properties and flowability can be easily ensured. The weight-average molecular weight is the polystyrene conversion value used in gel permeation chromatography (GPC) based on a calibration line of standard polystyrene.

[0050] Thermoplastic resins can be used alone or in combination of two or more.

[0051] <Thermosetting components>

[0052] Examples of thermosetting components include thermosetting resins and their curing agents.

[0053] Examples of thermosetting resins include epoxy resins, acrylic resins, silicone resins, phenolic resins, thermosetting polyimide resins, polyurethane resins, melamine resins, and urea resins.

[0054] There are no particular limitations on the type of epoxy resin used, as long as it provides heat resistance during curing. Difunctional epoxy resins such as bisphenol A type epoxy, phenolic varnish epoxy resins, and phenolic varnish epoxy resins such as cresol varnish epoxy resins can be used. Furthermore, known epoxy resins such as polyfunctional epoxy resins, glycidylamine type epoxy resins, heterocyclic epoxy resins, and alicyclic epoxy resins can also be applied.

[0055] Examples of bisphenol A type epoxy resins include the jER (registered trademark) series (Epikote 807, Epikote 815, Epikote 825, Epikote 827, Epikote 828, Epikote 834, Epikote 1001, Epikote 1004, Epikote 1007, Epikote e1009, "Epikote" is a registered trademark) manufactured by Mitsubishi Chemical Corporation, DER-330, DER-301, DER-361 manufactured by The Dow Chemical Company, and YD8125 and YDF8170 manufactured by NIPPON STEELC Chemical & Material Co., Ltd.

[0056] Examples of phenolic resin epoxy resins for varnishes include Epikote 152 and Epikote 154 manufactured by JER Corporation, EPPN-201 manufactured by Nippon Kayaku Co., Ltd., and DEN-438 manufactured by The Dow Chemical Company.

[0057] Examples of o-cresol phenolic resins for clear varnish include EO CN-102S, EOCN-103S, EOCN-104S, EOCN-1012, EOCN-1025, and EOCN-1027 (“EO CN” is a registered trademark) manufactured by Nippon Kayaku Co., Ltd., and YDCN701, YDCN702, YDCN703, and YDCN704 manufactured by NIPPON STEEL Chemical & Material Co., Ltd.

[0058] Examples of multifunctional epoxy resins include Epon 1031S manufactured by JER Corporation, ARALDITE0163 manufactured by Huntsman Japan, and Denacol EX-611, EX-614, EX-614B, EX-622, EX-512, EX-521, EX-421, EX-411, and EX-321 manufactured by Nagase ChemteX Corporation ("ARA LDITE" and "Denacol" are registered trademarks).

[0059] Examples of amine-type epoxy resins include Epikote 604 manufactured by JER Corporation, YH-434 manufactured by NIPPON STEEL Chemical & Material Co., Ltd., TETRAD-X and TETRAD-C ("TETRAD" is a registered trademark) manufactured by MITSUBISHI GAS CHEMICAL COMPANY, INC., and ELM-120 manufactured by Sumitomo Chemical Co., Ltd.

[0060] Examples of heterocyclic epoxy resins include ARALDITEPT810 manufactured by Ciba Specialty Chemicals, and ERL4234, ERL4299, ERL4221, and ERL4206 manufactured by UCC.

[0061] The epoxy resins mentioned above can be used alone or in combination of two or more.

[0062] When epoxy resin is used as a thermosetting resin, it is preferable to use an epoxy resin curing agent as well.

[0063] Epoxy resin curing agents can be commonly used and known curing agents. Hereinafter, epoxy resin curing agents and curing agents are collectively referred to as "thermosetting components." Examples of epoxy resin curing agents include: amines; polyamides; acid anhydrides; polysulfides; boron trifluoride; bisphenols such as bisphenol A, bisphenol F, and bisphenol S, which have two or more phenolic hydroxyl groups in one molecule; phenolic resins such as phenolic varnish resins, bisphenol A phenolic varnish resins, and cresol phenolic varnish resins; etc. In particular, from the viewpoint of excellent resistance to electrolytic corrosion during moisture absorption, phenolic resin curing agents such as phenolic varnish resins, bisphenol A phenolic varnish resins, and cresol phenolic varnish resins are preferred.

[0064] Preferred phenolic resins (as curing agents for the aforementioned epoxy resins) include, for example, those manufactured by DICCORPORATION under the trade names PHENOLITE LF2882, PHENOLITE LF2822, PHENOLITE TD-2090, PHENOLITE TD-2149, PHENOLITE VH-4150, PHENOLITE VH 4170; those manufactured by MEIWA PLASTICINDUSTRIES,LTD. under the trade name H-1; those manufactured by JER Corporation under the trade names jER CURE MP402FPY, EPICURE YL6065, EPICURE YLH129B65; and those manufactured by Mitsui Chemicals,Inc. under the trade names MILEX XL, MILEX XLC, MILEX RN, MILEX RS, and MILEX VR (“PHENOLITE”, “EPICURE”, and “MILEX” are registered trademarks).

[0065] Thermosetting resins and curing agents can be used individually or in combination of two or more.

[0066] The content of thermosetting resin in the temporary fixing resin composition of this embodiment is preferably 10 to 500 parts by weight relative to 100 parts by weight of thermoplastic resin, more preferably 20 to 300 parts by weight. If the content of thermosetting resin is within the above range, the temporary fixing material can easily possess sufficient low-temperature adhesion, heat resistance, curing properties, and peelability. As long as the content of thermosetting resin is 10 parts by weight or more, the adhesion and heat resistance are improved, and the retention of the organic substrate when manufacturing electronic devices is also improved, making the components constituting the electronic devices (e.g., semiconductor chips, etc.) less prone to damage. On the other hand, as long as the content of thermosetting resin is 500 parts by weight or less, the viscosity before curing is less likely to become too low, curing can be carried out in a shorter time, and it is easier to balance the retention of the organic substrate and the support and the peelability of the organic substrate and the support.

[0067] <Curing Accelerator>

[0068] Examples of curing accelerators include imidazoles, cyanoguanidine derivatives, dicarboxylic acid dihydrazide, triphenylphosphine, tetraphenylboronic acid tetraphenylboronic acid ester, 2-ethyl-4-methylimidazolium-tetraphenylboronic acid ester, and 1,8-diazabicyclo[5,4,0]undecene-7-tetraphenylboronic acid ester.

[0069] In the case where the temporary fixation resin composition of this embodiment contains an epoxy-containing (meth)acrylic acid copolymer as a thermoplastic resin, it is preferable to further contain a curing accelerator that promotes the curing of the epoxy groups present in the copolymer. Imidazoles are examples of such curing accelerators.

[0070] Curing accelerators can be used alone or in combination of two or more.

[0071] The content of the curing accelerator in the temporary fixing resin composition of this embodiment is preferably 0.01 to 5.0 parts by weight relative to the total of 100 parts by weight of the polymer (thermoplastic resin) with crosslinking functional groups and the thermosetting resin contained in the temporary fixing resin composition. As long as the content of the curing accelerator is 0.01 parts by weight or more, the temporary fixing resin composition can be sufficiently cured according to the thermal history during the manufacture of semiconductor devices, and the organic substrate and support can be fixed more reliably. On the other hand, as long as the content of the curing accelerator is 5.0 parts by weight or less, the melt viscosity of the temporary fixing resin composition will not increase excessively, and storage stability can be easily ensured.

[0072] <Other Ingredients>

[0073] Other components besides those mentioned above include fillers (inorganic fillers and / or organic fillers) and silane coupling agents.

[0074] Examples of inorganic fillers include metallic fillers such as silver powder, gold powder, and copper powder; and non-metallic inorganic fillers such as silica, alumina, boron nitride, titanium dioxide, glass, iron oxide, and ceramics. Inorganic fillers can be selected based on the desired function. Metallic fillers can be added to impart reversibility to the resin composition for temporary fixation. Non-metallic inorganic fillers can be added to impart low thermal expansion and low hygroscopicity to the resin composition for temporary fixation. Inorganic fillers can be used alone or in combination of two or more.

[0075] The inorganic filler is preferably provided with organic groups on its surface. By modifying the surface of the inorganic filler with organic groups, it is easy to improve the dispersibility of the temporary fixation resin composition in organic solvents when preparing the coating liquid for forming a film-like temporary fixation material, as well as the adhesion and heat resistance of the formed film-like temporary fixation material.

[0076] Inorganic fillers with organic groups on their surface can be obtained, for example, by mixing a silane coupling agent represented by the following general formula (B-1) with an inorganic filler and stirring at a temperature above 30°C. The organic group modification of the inorganic filler surface can be confirmed using UV (ultraviolet) measurement, IR (infrared) measurement, XPS (X-ray photoelectron spectroscopy), etc.

[0077] [Chemical Formula 1]

[0078]

[0079] In formula (B-1), X represents an organic group selected from the group consisting of phenyl, epoxypropoxy, acryloyl, methacryloyl, mercapto, amino, vinyl, isocyanate, and methacryloyloxy; s represents 0 or an integer from 1 to 10; R 11 R 12 and R 13 Each alkyl group, having 1 to 10 carbon atoms, is represented independently.

[0080] Examples of alkyl groups having 1 to 10 carbon atoms include methyl, ethyl, propyl, butyl, pentyl, hexyl, heptyl, octyl, nonyl, decyl, isopropyl, and isobutyl. From the viewpoint of easy availability, alkyl groups having 1 to 10 carbon atoms are preferably methyl, ethyl, and pentyl.

[0081] From the viewpoint of heat resistance, X is preferably an amino group, epoxy propoxy group, mercapto group, and isocyanate group, and more preferably epoxy propoxy group and mercapto group.

[0082] From the viewpoint of suppressing the flowability of temporarily fixed materials at high temperatures and improving heat resistance, s in formula (B-1) is preferably 0 to 5, and more preferably 0 to 4.

[0083] Preferred silane coupling agents include, for example, trimethoxyphenylsilane, dimethyldimethoxyphenylsilane, triethoxyphenylsilane, dimethoxymethylphenylsilane, vinyltrimethoxysilane, vinyltriethoxysilane, vinyltri(2-methoxyethoxy)silane, N-(2-aminoethyl)-3-aminopropylmethyldimethoxysilane, N-(2-aminoethyl)-3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-aminopropyltrimethoxysilane, and 3-epoxypropoxypropyltrimethoxysilane. Silanes, 3-epoxypropoxypropylmethyldimethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-isocyanopropyltriethoxysilane, 3-methacryloyloxypropyltrimethoxysilane, 3-mercaptopropyltrimethoxysilane, 3-ureidopropyltriethoxysilane, N-(1,3-dimethylbutylene)-3-(triethoxysilyl)-1-propylamine, N,N'-bis(3-(trimethoxysilyl)propyl)ethylenediamine, polyoxyethylenepropyltrialkoxysilane, polyethoxydimethylsiloxane, etc. Preferably, it is 3-aminopropyltriethoxysilane, 3-epoxypropoxypropyltrimethoxysilane, 3-isocyanopropyltriethoxysilane, and 3-mercaptopropyltrimethoxysilane, and more preferably trimethoxyphenylsilane, 3-epoxypropoxypropyltrimethoxysilane, and 3-mercaptopropyltrimethoxysilane.

[0084] Silane coupling agents can be used alone or in combination of two or more.

[0085] From the viewpoint of achieving a balance between improving heat resistance and storage stability, the amount of the coupling agent used is preferably 0.01 to 50 parts by mass relative to 100 parts by mass of the inorganic filler, more preferably 0.05 to 20 parts by mass, and even more preferably 0.5 to 10 parts by mass from the viewpoint of improving heat resistance.

[0086] From the viewpoint of improving the operability of the film-like temporary fixation material in the B-stage state and improving low thermal expansion, the content of inorganic filler in the resin composition for temporary fixation in this embodiment is preferably 300 parts by weight or less, more preferably 200 parts by weight or less, and even more preferably 100 parts by weight or less, relative to 100 parts by weight of the thermoplastic resin. There is no particular limitation on the lower limit of the inorganic filler content, but it is preferably 5 parts by weight or more relative to 100 parts by weight of the thermoplastic resin. By keeping the inorganic filler content within the above range, it is easier to sufficiently ensure adhesion to the organic substrate while imparting the desired function.

[0087] Examples of organic fillers include carbon, rubber-based fillers, silicone microparticles, polyamide microparticles, and polyimide microparticles.

[0088] The content of organic filler in the temporary fixing resin composition of this embodiment is preferably 300 parts by weight or less, more preferably 200 parts by weight or less, and even more preferably 100 parts by weight or less, relative to 100 parts by weight of the thermoplastic resin. There is no particular limitation on the lower limit of the organic filler content, but it is preferably 5 parts by weight or more relative to 100 parts by weight of the thermoplastic resin. By keeping the organic filler content within the above range, it is easier to ensure sufficient adhesion to the organic substrate while imparting the desired function.

[0089] The temporary fixation resin composition of this embodiment preferably does not contain silicone-based strippers or the content of silicone-based strippers is 10% by mass or less based on the total amount of the temporary fixation resin composition.

[0090] <Silicone-based release agent>

[0091] As silicone-based stripping agents, examples include silicone compounds with a polysiloxane structure, such as silicone-modified resins, pure silicone oils, non-reactive modified silicone oils, and reactive modified silicone oils.

[0092] Examples of silicone-modified resins include silicone-modified alkyd resins. Examples of modified silicone oils include polyether-modified silicones, alkyl-modified silicones, and epoxy-modified silicones.

[0093] Commercially available silicone compounds include those manufactured by Dow Toray Co., Ltd. under the trade names SH3773M, L-7001, SH-550, and SH-710; those manufactured by Shin-Etsu Chemical Co., Ltd. under the trade names X-22-163, KF-105, X-22-163B, and X-22-163C; and those manufactured by BYK under the trade name BYK-UV3500.

[0094] In the case where the temporary fixation resin composition of this embodiment contains a silicone-based release agent, the silicone-based release agent may be used alone or in combination of two or more.

[0095] From the viewpoint of suppressing contamination of organic substrates, the content of silicone-based stripping agent in the temporary fixation resin composition of this embodiment is preferably 10% by mass or less, more preferably 5% by mass or less, and even more preferably 2% by mass or less, based on the total amount of the temporary fixation resin composition. Particularly preferred is the absence of silicone-based stripping agent. Specifically, the total content of linear silicones without reactive functional groups or non-reactive modified silicones, i.e., silicone-based stripping agents, is preferably 10% by mass or less, more preferably 5% by mass or less, even more preferably 2% by mass or less, and even more preferably 0% by mass, based on the total amount of the temporary fixation resin composition.

[0096] The resin composition for temporary fixation in this embodiment preferably has the following properties when it is formed into a film: a shear viscosity of 100 to 10000 Pa·s at 60°C; an elastic modulus of 10 to 1000 MPa at 25°C after heating at 130°C for 30 minutes and then at 170°C for 1 hour; and a 5% weight reduction temperature of 300°C or higher after heating at 130°C for 30 minutes and then at 170°C for 1 hour.

[0097] Shear viscosity was measured in the following order. First, a 240 μm thick measurement sample was prepared by stacking four 60 μm thick films of a temporary fixing resin composition at 80 °C. The sample was then heated from 35 °C to 200 °C at a rate of 20 °C / min using a rotary viscoelastic measuring apparatus (manufactured by TA Instruments Japan Inc., ARES) set to the following conditions, while applying a 5% strain. The viscosity at 60 °C was measured.

[0098] Measurement method: "parallel plate"

[0099] Measuring tool: A round tool with a diameter of 8mm

[0100] Measurement mode: "Dynamic temperature ramp"

[0101] Frequency: 1Hz

[0102] The elastic modulus after heating was measured in the following order. First, a film with a thickness of 240 μm was prepared by laminating four films of a temporary fixing resin composition with a thickness of 60 μm at 80 °C. After heating under predetermined conditions (e.g., heating in an oven at 130 °C for 30 minutes, followed by heating at 170 °C for 1 hour), the film was cut into pieces with a width of 4 mm and a length of 33 mm in the thickness direction. The cut film was placed on a dynamic viscoelastic apparatus (product name: Rheogel-E4000, manufactured by UMB), a tensile load was applied, and measurements were taken at a frequency of 10 Hz and a heating rate of 3 °C / min. The measurements were recorded at 25 °C.

[0103] The 5% weight loss temperature after heating was measured in the following order. First, a 240 μm thick film was prepared by laminating four 60 μm thick films of a temporary fixing resin composition at 80 °C. After heating under predetermined conditions (e.g., in an oven at 130 °C for 30 minutes, followed by heating at 170 °C for 1 hour), 10 mg was cut off as a test sample. The temperature was determined by measuring the temperature using a differential thermal balance (Seiko Instruments Inc., TG / DTA220) at a heating rate of 10 °C / min.

[0104] From the viewpoint of layering, the shear viscosity at 60°C is preferably 1000–9000 Pa·s, more preferably 2000–8000 Pa·s, and even more preferably 3000–7000 Pa·s.

[0105] The shear viscosity at 60°C can be adjusted, for example, by changing the Tg and molecular weight of the thermoplastic resin, the softening point temperature and molecular weight of the thermosetting resin, the addition ratio of thermoplastic and thermosetting resins, and the addition of fillers and resins.

[0106] From the viewpoint of peelability and rigidity, the elastic modulus at 25°C after heating is preferably 50-980 MPa, more preferably 100-960 MPa, and even more preferably 200-940 MPa.

[0107] The elastic modulus at 25°C after heating can be adjusted, for example, by changing the Tg, molecular weight and functional groups of the thermoplastic resin, changing the functional groups of the thermosetting resin, changing the addition ratio of thermoplastic resin and thermosetting resin, and adding fillers and resins.

[0108] From the viewpoint of heat resistance, the 5% weight reduction temperature after the above heating is preferably 260 to 600°C, more preferably 280 to 550°C, and even more preferably 300 to 500°C.

[0109] The 5% weight reduction temperature after heating can be adjusted, for example, by changing the Tg, molecular weight and functional groups of the thermoplastic resin, changing the functional groups of the thermosetting resin, changing the addition ratio of thermoplastic and thermosetting resins, and adding fillers and resins.

[0110] The temporary fixation resin composition of this embodiment is laminated in film form onto a substrate having solder resist AUS308. After heating at 130°C for 30 minutes and then at 170°C for 1 hour, the 90° peel strength at 25°C between the composition and the substrate can be 30–300 N / m, 40–250 N / m, or 50–200 N / m. If the 90° peel strength is within the above range, the organic substrate and the temporary fixation material are not easily peeled off, making it easier to mount and seal semiconductor chips on the organic substrate reinforced with a support, and the temporary fixation material and support can be easily peeled off from the organic substrate.

[0111] The 90° peel strength was measured as follows. A substrate (material: glass epoxy board, substrate thickness: 1000 μm) with a surface having solder resist "PSR-4000AUS308" (manufactured by TAIYO INK MFG.CO.,LTD.) was placed on the stage of a roll laminator (manufactured by Taisei Laminator Co.,LTD., First Laminator VA-400III), and a temporary fixing resin composition with a film thickness of 60 μm was applied to adhere it to the substrate. The substrate was laminated at a speed of 0.2 m / min, a temperature of 80°C, and a pressure of 0.2 MPa to obtain a sample for measurement. After heating the obtained sample under predetermined heating conditions (e.g., heating at 130°C for 30 minutes and then at 170°C for 1 hour), it was cut into 10 mm widths. A peel test was performed on the sample using a peel tester set to a peel angle of 90° at a speed of 300 mm / min. The peel strength at this point was taken as the 90° peel strength.

[0112] Furthermore, the temporary fixing resin composition of this embodiment is laminated in the form of a film onto a substrate having solder resist AUS308. After heating at 130°C for 30 minutes, at 170°C for 1 hour, and at 260°C for 5 minutes, the 90° peel strength at 25°C between the resin composition and the substrate can be 30-300 N / m, 40-250 N / m, or 50-200 N / m.

[0113] The resin composition for temporary fixation in this embodiment can form a film-like temporary fixation material. This makes it easier to control the film thickness of the temporary fixation material, reducing thickness unevenness in the laminate of the organic substrate, the temporary fixation material, and the support. Furthermore, the film-like temporary fixation material can be easily bonded to the organic substrate or support using simple methods such as lamination, resulting in excellent workability.

[0114] The thickness of the film-like temporary fixing material is not particularly limited, but from the viewpoint of sufficiently fixing the organic substrate and the transport support, it is preferably 10 to 350 μm. As long as the thickness is 10 μm or more, thickness unevenness during coating is reduced, and the thickness is sufficient, thus the strength of the temporary fixing material or the cured temporary fixing material becomes good, enabling more sufficient fixing of the organic substrate and the transport support. As long as the thickness is 350 μm or less, thickness unevenness of the temporary fixing material is less likely to occur, and sufficient drying can easily reduce the amount of residual solvent in the temporary fixing material, further reducing foaming when heating the cured temporary fixing material.

[0115] Support belt for substrate transport

[0116] The substrate transport support belt of this embodiment includes a support film for transporting an organic substrate and a temporary fixing material layer disposed on the support film for temporarily fixing the organic substrate and the support film.

[0117] The temporary fixation material layer may contain thermoplastic resin and be free of silicone-based release agents, or the content of silicone-based release agents may be less than 10% by mass based on the total amount of the temporary fixation material. It may have a shear viscosity of 100 to 10000 Pa·s at 60°C, an elastic modulus of 10 to 1000 MPa at 25°C after heating at 130°C for 30 minutes and then at 170°C for 1 hour, and a 5% weight reduction temperature of 300°C or higher after heating at 130°C for 30 minutes and then at 170°C for 1 hour. Such a temporary fixation material layer may be formed from the temporary fixation resin composition of this embodiment described above.

[0118] Figure 1 The figure shows one embodiment of the support belt for substrate transport. Figure 1 (A) is a top view. Figure 1 (B) is along Figure 1 (A) is a schematic cross-sectional view of the II-line cut. The substrate transport support belt 10 shown in these figures sequentially includes a support film 1, a temporary fixing material layer 2A formed of the temporary fixing resin composition of this embodiment, and a protective film 3.

[0119] As for the support film 1, there are no particular limitations as long as it can transport the organic substrate. Examples include polyethylene terephthalate film, polybutylene terephthalate film, polyethylene naphthalate film, polyethylene film, polypropylene film, polyamide film, and polyimide film. Among these, from the viewpoint of excellent flexibility and toughness, polyethylene terephthalate film, polybutylene terephthalate film, polyethylene naphthalate film, polypropylene film, polyamide film, and polyimide film are preferred. Furthermore, from the viewpoint of heat resistance, polyimide film and polyethylene naphthalate film are more preferred.

[0120] The thickness of the support film 1 can be appropriately set according to the target strength and flexibility, preferably 3 to 350 μm. As long as the thickness is 3 μm or more, sufficient film strength is tended to be obtained, and as long as the thickness is 350 μm or less, sufficient flexibility is tended to be obtained. From this point of view, the thickness of the support film 1 is more preferably 5 to 200 μm, and even more preferably 7 to 150 μm.

[0121] There are no particular limitations on the protective film 3, and examples include polyethylene terephthalate film, polybutylene terephthalate film, polyethylene naphthalate film, polyethylene film, and polypropylene film. From the viewpoint of flexibility and toughness, the protective film 3 is preferably a polyethylene terephthalate film, a polyethylene film, or a polypropylene film. Furthermore, from the viewpoint of improving the peelability from the temporarily fixed material layer, it is preferable to use a film that has undergone a release treatment with silicone compounds, fluorine compounds, etc., as the protective film 3.

[0122] The thickness of the protective film 3 can be appropriately set according to the target strength and flexibility, for example, preferably 10 to 350 μm. As long as the thickness is 10 μm or more, sufficient film strength is tended to be obtained, and as long as the thickness is 350 μm or less, sufficient flexibility is tended to be obtained. From this point of view, the thickness of the protective film 3 is more preferably 15 to 200 μm, and even more preferably 20 to 150 μm.

[0123] The temporary fixing material layer 2A can be formed by mixing and kneading the components constituting the temporary fixing resin composition of this embodiment in an organic solvent to prepare a varnish, and then applying the prepared varnish onto the support film 1 and drying it.

[0124] The organic solvent is not particularly limited and can be determined based on factors such as boiling point and volatility during film formation. Specifically, from the viewpoint of making film curing difficult during film formation, solvents with low boiling points such as methanol, ethanol, 2-methoxyethanol, 2-ethoxyethanol, 2-butoxyethanol, methyl ethyl ketone, acetone, methyl isobutyl ketone, toluene, and xylene are preferred. Furthermore, for the purpose of improving film formation properties, solvents with higher boiling points such as dimethylacetamide, dimethylformamide, N-methylpyrrolidone, and cyclohexanone are preferred. These solvents can be used alone or in combination of two or more. The concentration of solids in the varnish is preferably 10-80% by mass.

[0125] Mixing and kneading are carried out using common mixers, pounders, three-shaft rollers, ball mills, and other dispersers, which can be combined appropriately. As long as the conditions allow for sufficient evaporation of the organic solvents used, drying is not particularly limited and can usually be carried out by heating at 60°C to 200°C for 0.1 to 90 minutes.

[0126] After forming a temporary fixing material layer 2A on the support film 1, a protective film 3 is attached to the temporary fixing material layer 2A, thereby obtaining a support belt 10 for substrate transport.

[0127] The substrate transport support belt 10 can be easily stored, for example, by being wound into a roll. Alternatively, it can be stored by cutting the roll of substrate transport support belt 10 into a preferred size.

[0128] Figure 2 The figure shows another embodiment of the support belt for substrate transport. Figure 2 (A) is a top view. Figure 2 (B) is along Figure 2 (A) is a schematic cross-sectional view of the II-II wire cut. The substrate transport support belt 20 shown in these figures sequentially includes a support film 1a, a temporary fixing material layer 2B composed of a first resin layer 2a and a second resin layer 2b, and a support film 1b.

[0129] The first resin layer 2a and the second resin layer 2b can be composed of the same composition or different compositions. When the first resin layer 2a and the second resin layer 2b are composed of different compositions, for example, if the second resin layer 2b is the side in contact with the organic substrate, the support film 1a can be used as a transport support film. In this case, by using the temporary fixing resin composition of this embodiment to form the second resin layer 2b, it is possible to both adequately fix the organic substrate and the transport support film, and to easily peel the transport support film from the organic substrate. The first resin layer 2a can be designed to have excellent adhesion to the transport support film, i.e., the support film 1a.

[0130] The temporary fixing material layer 2B can be formed by bonding the following two laminates: a laminate prepared by mixing and kneading the above-mentioned components in an organic solvent, applying it to the support film 1a, and drying it; and a laminate prepared by applying the same or separately prepared varnish to the support film 1b and drying it. When the first resin layer 2a and the second resin layer 2b are formed from the same varnish, it has the advantage that even if a relatively thick temporary fixing material layer is formed, the residual amount of organic solvent can be easily and sufficiently reduced. The first resin layer 2a and the second resin layer 2b can be integrally formed into a single-layer structure, or a double-layer structure can be maintained between the two layers through an interface.

[0131] [Manufacturing Method of Electronic Devices]

[0132] The method for manufacturing an electronic device using the temporary fixing resin composition of this embodiment can be roughly divided into the following five steps.

[0133] (a) The first step of obtaining a laminate by attaching a support to an organic substrate with a thickness of less than 1000 μm using a temporary fixing material.

[0134] (b) The second step of heating the temporary fixing material of the laminate.

[0135] (c) The third process of mounting a semiconductor chip on an organic substrate of a laminate after the second process.

[0136] (d) Step 4: Seal the semiconductor chip mounted on the organic substrate using a sealing material.

[0137] (e) Step 5: Peeling the support and temporary fixing material from the organic substrate of the laminate after step 4.

[0138] Figure 3 , Figure 4 and Figure 5 This is a schematic cross-sectional view illustrating one embodiment of a method for manufacturing an electronic device. Additionally, in Figure 3 , Figure 4 and Figure 5 The diagram shows the temporary fixing material (temporary fixing material layer) as follows: Figure 1 (B) shows the case of the temporary fixing material layer 2A of the substrate transport support belt 10, but the composition of the temporary fixing material is not limited to this.

[0139] <(a) Step 1>

[0140] In the first step, the support film 1 is bonded to the organic substrate 30 via a temporary fixing material layer 2A to obtain the laminate 15. Figure 3 (a)).

[0141] The organic substrate 30 can be a substrate with a thickness of 1000 μm or less. From the viewpoint of thin semiconductor devices or electronic devices, the thickness of the organic substrate 30 can be 500 μm or less, 300 μm or less, or 200 μm or less. The thickness of the organic substrate 30 can be 10 μm or more, or 30 μm or more.

[0142] The organic substrate 30 can be a substrate made of organic materials such as polymers, or it can have organic materials on at least a portion or the entire main surface. Examples of organic materials include photosensitive insulating materials and their cured forms, and photosensitive solder resists and their cured forms (solder resists). When the organic substrate 30 has photosensitive insulating materials or their cured forms, or photosensitive solder resists or their cured forms (solder resists) on a portion or the entire surface, the core substrate can be a glass epoxy board impregnated with epoxy resin in glass cloth. Furthermore, the organic substrate 30 can be a coreless substrate. Examples of materials for coreless substrates include thermoplastic resins such as polyimide resin, thermosetting resins such as epoxy resin, and resin compositions containing one or more of these resins (e.g., build-up materials).

[0143] like Figure 3 As shown in (a), when the laminate 15 is obtained using the substrate transport support belt 10, the organic substrate 30 and the support film 1 can be laminated via the temporary fixing material layer 2A using a roller laminator. When the substrate transport support belt 10 is equipped with a protective film 3, the protective film 3 can be peeled off before lamination, or the temporary fixing material layer 2A and the support film 1 can be laminated while peeling off the protective film 3.

[0144] As a roll laminator, an example is the Taisei Laminator Co.,LTD. VA400III (trade name). When using this device, the organic substrate 30 and the support film 1 can be bonded via a temporary fixing material layer 2A under conditions of pressure 0.1MPa to 1.0MPa, temperature 40°C to 150°C, and speed 0.1 to 1.0m / min.

[0145] In this embodiment, the strip-shaped substrate transport support belt 10 can be continuously supplied. At this time, the organic substrate 30 reinforced by the strip-shaped support film 1 can be continuously transported, which can improve productivity, etc.

[0146] A vacuum laminator can also be used instead of a roller laminator.

[0147] Examples of vacuum laminators include the NPC Incorporated LM-50×50-S (trade name) and the Nichigo-Morton Co., Ltd. V130 (trade name). Lamination conditions can be achieved by bonding the organic substrate 30 and the support film 1 via the temporary fixing material layer 2A under the following conditions: pressure below 1 hPa, pressing temperature 40°C to 150°C (preferably 60°C to 120°C), lamination pressure 0.01 to 0.5 MPa (preferably 0.1 to 0.5 MPa), and holding time 1 second to 600 seconds (preferably 30 seconds to 300 seconds).

[0148] <(b) Second Process>

[0149] In the second step, the temporary fixing material layer 2A of the heated laminate 15 is used. Through this step, the organic substrate 30 and the support film 1 can be sufficiently fixed using the cured temporary fixing material layer 2C. Figure 3 (b) Improves the operability of organic substrate 30.

[0150] Heating can be performed using, for example, an explosion-proof dryer or a constant-temperature, forced-air dryer (manufactured by Yamato Scientific Co., Ltd., DKN602). The preferred heating conditions are curing at 100–200°C for 10–300 minutes (preferably 20–210 minutes). Temperatures above 100°C ensure sufficient curing of the temporary fixing material, minimizing problems in subsequent processes. Temperatures below 200°C prevent degassing during curing, further inhibiting peeling. Furthermore, heating time of 10 minutes or more minimizes problems in subsequent processes, and heating time of 300 minutes or less minimizes operational inefficiency. Figure 3 In (b), the temporary fixing material layer 2C represents the cured form of the temporary fixing material layer 2A.

[0151] <(c) Step 3>

[0152] In the third step, the semiconductor chip is mounted on the organic substrate of the laminate after the second step. For example, a flip-chip bonder can be used to mount the semiconductor chip 40 onto the organic substrate 30. Figure 3 (c)). As a device for installation, for example, TORAY ENGINEERING Co., Ltd.'s FC3000L (trade name) can be used, and the installation conditions can be arbitrarily selected according to the desired organic substrate and semiconductor chip.

[0153] <(d) Step 4>

[0154] In the fourth process, such as Figure 4As shown in (d), the semiconductor chip 40 mounted on the organic substrate 30 is sealed using a sealing material 50. Examples of sealing devices include the TOWA JAPAN-made FFT1030G (trade name), and the sealing conditions can be arbitrarily selected based on the desired organic substrate, semiconductor chip, and sealing material. Furthermore, the curing conditions of the sealing material after sealing can be arbitrarily selected based on the type of sealing material.

[0155] <(e) Step 5>

[0156] In the fifth process, such as Figure 4 As shown in (e), the support film 1 and the temporary fixing material layer 2C are peeled off from the organic substrate 30 of the laminate after the fourth process. Examples of peeling methods include: horizontally fixing one of the semiconductor chip mounting substrate or the support film on which the semiconductor chip is mounted and sealed on the organic substrate, and tilting the other at a certain angle from the horizontal direction; and attaching a protective film to the sealing surface of the semiconductor chip mounting substrate, and peeling off the semiconductor chip mounting substrate and the protective film from the support film by a peeling method; etc.

[0157] These stripping methods are typically performed at room temperature, but can also be performed at temperatures ranging from 40 to 100°C.

[0158] In this embodiment, if temporary fixing material remains partially on the semiconductor chip mounting substrate, a cleaning process for removing the temporary fixing material can be provided. The removal of the temporary fixing material can be performed, for example, by cleaning the semiconductor chip mounting substrate.

[0159] There are no particular limitations on the cleaning solution, as long as it can remove localized residues of temporary fixation material. Examples of such cleaning solutions include the aforementioned organic solvents that can be used to dilute the resin composition for temporary fixation. These organic solvents can be used alone or in combination of two or more.

[0160] Furthermore, in cases where it is difficult to remove residual temporary fixative material, salt groups or acids can be added to the organic solvent. Examples of salt groups include amines such as ethanolamine, diethanolamine, triethanolamine, triethylamine, and ammonia; and ammonium salts such as tetramethylammonium hydroxide. Acids such as acetic acid, oxalic acid, benzenesulfonic acid, and dodecylbenzenesulfonic acid can be used. The preferred addition amount is 0.01 to 10% by mass, based on the concentration in the cleaning solution. Furthermore, to improve the removal of residues, existing surfactants can be added to the cleaning solution.

[0161] There are no particular limitations on the cleaning method. Examples include cleaning with the above-mentioned cleaning solution under stirring, cleaning by spraying with a sprayer, and immersion in a cleaning solution tank. The suitable temperature is 10–80°C, preferably 15–65°C. Finally, the substrate is washed with water or alcohol and then dried to obtain a semiconductor chip mounting substrate.

[0162] Furthermore, as described above, the temporary fixation resin composition according to this embodiment can be well peeled off from the organic substrate, and can sufficiently reduce contamination caused by the silicone-based stripper, thus eliminating or simplifying the cleaning process.

[0163] In this embodiment, the semiconductor chip mounting substrate 55, on which semiconductor chips are mounted and sealed, is further cut into individual semiconductor elements 60. Figure 5 (f) and Figure 5 (g)).

[0164] Figure 5 (h) is a schematic cross-sectional view showing the electronic device 100 manufactured through the above-described process. The electronic device 100 has a plurality of semiconductor elements 60 disposed on a circuit board 70 via solder balls 65. The electronic device of this embodiment may also be referred to as a semiconductor device.

[0165] The embodiments of the present invention have been described above, but the present invention is not necessarily limited to the above embodiments, and appropriate modifications can be made without departing from its spirit. The temporary fixing resin composition, substrate transport support belt, and manufacturing method of electronic device of the present invention can be applied to the miniaturization of general electronic devices. Examples of electronic devices include AP (application processor), GPU (graphics processing unit), storage system (DRAM, NAND), and smartphones and tablet terminals equipped with these.

[0166] Example

[0167] The present invention will be further described in detail below through embodiments and comparative examples, but the present invention is not limited to the following embodiments.

[0168] Synthesis of Acrylic Rubber K-1

[0169] In a 500cc detachable flask equipped with a stirrer, thermometer, nitrogen purging device (nitrogen inlet pipe), and reflux cooler with attached moisture receiving container, 200g of deionized water, 60g of butyl acrylate, 10g of methyl methacrylate, 10g of hydroxyethyl 2-methacrylate, 20g of glycidyl methacrylate, 1.94g of 1.8% polyvinyl alcohol aqueous solution, 0.2g of lauroyl peroxide, and 0.08g of n-octyl mercaptan were added. Next, after blowing N2 gas into the flask to remove air from the system for 60 minutes, the system temperature was raised to 65°C and polymerization was carried out for 5 hours. Then, the system temperature was raised to 90°C and stirred continuously for 2 hours to complete the polymerization. The transparent beads obtained from the polymerization reaction were separated by filtration, washed with deionized water, and dried in a vacuum dryer at 50°C for 6 hours to obtain acrylic rubber K-1.

[0170] The weight-average molecular weight of acrylic rubber K-1, measured using GPC, is 300,000 when converted to polystyrene. Furthermore, the Tg of acrylic rubber K-1 is -20℃.

[0171] Synthesis of Acrylic Rubber K-2

[0172] In a 500cc detachable flask equipped with a stirrer, thermometer, nitrogen purging device (nitrogen inlet pipe), and reflux cooler with a water receiving container, 200g of deionized water, 70g of butyl acrylate, 10g of methyl methacrylate, 10g of hydroxyethyl 2-methacrylate, 10g of glycidyl methacrylate, 1.94g of 1.8% polyvinyl alcohol aqueous solution, 0.2g of lauroyl peroxide, and 0.06g of n-octyl mercaptan were added. Next, after blowing N2 gas into the flask to remove air from the system for 60 minutes, the system temperature was raised to 65°C and polymerization was carried out for 5 hours. Then, the system temperature was raised to 90°C and stirred continuously for 2 hours to complete the polymerization. The transparent beads obtained from the polymerization reaction were separated by filtration, washed with deionized water, and dried in a vacuum dryer at 50°C for 6 hours to obtain acrylic rubber K-2.

[0173] The weight-average molecular weight of acrylic rubber K-2, measured using GPC, is 400,000 when converted to polystyrene. Furthermore, the Tg of acrylic rubber K-2 is -28℃.

[0174] (Examples 1-5, Comparative Examples 1-3)

[0175] Fabrication of support belts for substrate transport

[0176] A varnish for forming a temporary fixing material layer was prepared according to the parts by weight shown in Tables 1 and 2. The prepared varnish was coated onto a polyimide film (UBE INDUSTRIES, LTD., Upilex 25SGA, 25 μm thick), dried at 90°C for 5 minutes, and then dried at 120°C for 5 minutes, thereby forming a temporary fixing material layer with a thickness of 60 μm. A protective film was then attached to the temporary fixing material layer to obtain a substrate transport support belt with a structure comprising a support film, a temporary fixing material layer, and a protective film.

[0177] [Table 1]

[0178]

[0179] [Table 2]

[0180]

[0181] The details of each component recorded in Tables 1 and 2 are as follows.

[0182] (Thermoplastic resin)

[0183] Acrylic Rubber K-1: The acrylic rubber synthesized above (weight-average molecular weight 300,000, glycidyl methacrylate 20% by mass, Tg -20℃ as measured by GPC)

[0184] Acrylic Rubber K-2: The acrylic rubber synthesized above (weight-average molecular weight of 400,000, glycidyl methacrylate of 10% by mass, Tg-28℃ as measured by GPC)

[0185] HTR-860P-3CSP: An acrylic rubber (manufactured by Nagase ChemteX Corporation, trade name) with a weight-average molecular weight of 800,000, 3% glycidyl methacrylate, and a Tg of 12°C, measured by GPC.

[0186] (Thermosetting components)

[0187] N500P-10: Cresol-phenolic varnish type multifunctional epoxy resin (manufactured by DIC CORPORATION, trade name)

[0188] EXA-830CRP: Bisphenol F type epoxy resin (manufactured by DIC CORPORATION, trade name)

[0189] MEH-7800M: Phenolic varnish resin (manufactured by MEIWA PLASTIC INDUSTRIES, LTD., trade name)

[0190] (Silicone compounds)

[0191] SH3773M: Polyether-modified silicone compound (manufactured by Dow Toray Co., Ltd., trade name)

[0192] TA31-209E: Silicone-modified alkyd resin (manufactured by Hitachi Kasei Co., Ltd., trade name)

[0193] (Curing accelerator)

[0194] 2PZ-CN: Imidazole-based curing accelerator (manufactured by SHIKOKU CHEMICALS CORPORATION, trade name)

[0195] (filler)

[0196] SC2050-HLG: Epoxy Silane Surface-Treated Silica Filler (Manufactured by Admatechs, trade name)

[0197] The shear viscosity, elastic modulus after heating, 5% weight reduction temperature after heating, and 90° peel strength after heating of the substrate transport support belts of the examples and comparative examples were evaluated according to the methods shown below. The evaluation results are shown in Tables 3 and 4.

[0198] [Measurement of Shear Viscosity]

[0199] Shear viscosity was measured in the following order. First, four 60 μm thick temporary fixing material layers were stacked at 80°C, thus preparing a 240 μm thick measurement sample. Using a rotary viscoelastic measuring apparatus (manufactured by TAInstruments Japan Inc., ARES) set to the following conditions, the sample was heated from 35°C to 200°C at a heating rate of 20°C / min while applying a 5% strain. The viscosity at 60°C was then measured.

[0200] Measurement method: "parallel plate"

[0201] Measuring tool: A round tool with a diameter of 8mm

[0202] Measurement mode: "Dynamic temperature ramp"

[0203] Frequency: 1Hz

[0204] [Measurement of elastic modulus after heating]

[0205] The elastic modulus was measured in the following order. First, four 60 μm thick temporary fixing material layers were laminated at 80°C to form a 240 μm thick film. This film was then heated in an oven at 130°C for 30 minutes, followed by heating at 170°C for 1 hour. The film was then cut into 4 mm wide and 33 mm long sections in the thickness direction. The cut film was placed on a dynamic viscoelastic apparatus (Rheogel-E4000, manufactured by UMB) under tensile load, and measurements were taken at a frequency of 10 Hz and a heating rate of 3°C / min. The measurements were recorded at 25°C.

[0206] [5% weight reduction in temperature after heating]

[0207] The 5% weight loss temperature after heating was measured in the following order. First, four 60 μm thick temporary fixation material layers were laminated at 80 °C, thus forming a 240 μm thick film. After heating under predetermined conditions (e.g., in an oven at 130 °C for 30 minutes, followed by heating at 170 °C for 1 hour), 10 mg was cut off as the measurement sample. The temperature was measured using a differential thermal balance (Seiko Instruments Inc., TG / DTA220) at a heating rate of 10 °C / min.

[0208] [Measurement of 90° peel strength after heating (1)]

[0209] The 90° peel strength between the substrate and the temporary fixing material layer was evaluated using the following method. A 200 μm thick organic substrate with a surface covered by solder resist AUS308 was placed on the stage of a roll laminator (Taisei Laminator Co.,LTD., VA-400III). The substrate transport support belt with the peeled protective film was laminated at 80°C, 0.2 MPa pressure, and 0.2 m / mins, with the temporary fixing material layer adhered to the organic substrate side. The resulting sample was heated at 130°C for 30 minutes, followed by heating at 170°C for 1 hour, and then cut into 10 mm wide pieces as measurement films. A peel test was performed on the measurement films using a peel tester set to a 90° peel angle at a speed of 300 mm / min. The peel strength at this point was taken as the 90° peel strength.

[0210] [Measurement of 90° peel strength after heating (2)]

[0211] The 90° peel strength between the substrate and the temporary fixing material layer was evaluated using the following method. A 200 μm thick organic substrate with a surface covered by solder resist AUS308 was placed on the stage of a roll laminator (Taisei Laminator Co.,LTD., VA-400III). The temporary fixing material layer was adhered to the organic substrate side, and a substrate transport support belt with a peeled protective film was laminated at 80°C, 0.2 MPa pressure, and 0.2 m / mins. The resulting sample was heated at 130°C for 30 minutes, then at 170°C for 1 hour, and further heated at 260°C for 5 minutes. It was then cut into 10 mm wide pieces as measurement films. Peel tests were performed on the measurement films using a peel tester set to a 90° peel angle at a speed of 300 mm / min. The peel strength at this point was taken as the 90° peel strength.

[0212] [Table 3]

[0213]

[0214] [Table 4]

[0215]

[0216] The support tapes of Examples 1-5, with a shear viscosity of 100-10000 Pa·s at 60°C, can fully adhere to the organic substrate at low temperatures, improving the operability of thin organic substrates. Furthermore, the support tapes of Examples 1-5, with their elastic modulus after heating and 5% weight reduction temperature within a predetermined range, exhibit sufficient heat resistance and can fix the support film to the organic substrate with appropriate peel strength, thus sufficiently reinforcing the organic substrate while effectively mounting and sealing the semiconductor chip onto it. Moreover, the support tapes of Examples 1-5, which are free of silicone-based release agents or have a silicone-based release agent content below a predetermined range and an elastic modulus after heating within a predetermined range, exhibit appropriate peel strength, thus significantly reducing contamination of the organic substrate and facilitating easy peeling.

[0217] Symbol Explanation

[0218] 1, 1a, 1b - Support film; 2A, 2B, 2C - Temporary fixing material layer; 2a - First resin layer; 2b - Second resin layer; 3 - Protective film; 10, 20 - Support strip; 15 - Laminate; 30 - Thin substrate; 35 - Laminate; 40 - Semiconductor chip; 50 - Sealing material; 55 - Semiconductor chip mounting substrate; 60 - Semiconductor element; 65 - Solder ball; 70 - Circuit board; 100 - Electronic device.

Claims

1. A manufacturing method of an electronic device apparatus, comprising: a first step of obtaining a laminate by adhering a support to an organic substrate having a thickness of 1000 μm or less via a temporary fixing material; a second step of heating the temporary fixing material of the laminate; a third step of mounting a semiconductor chip on the organic substrate of the laminate after the second step; a fourth step of sealing the semiconductor chip mounted on the organic substrate with a sealing material; and a fifth step of peeling the support and the temporary fixing material from the organic substrate of the laminate after the fourth step, wherein, in the temporary fixing material, a thermoplastic resin having a glass transition temperature of -50°C to 50°C, a thermosetting component, and a curing accelerator are contained, the thermoplastic resin is a (meth)acrylic copolymer having a crosslinkable functional group, and the content of a silicone-based peeling agent or a silicone-based peeling agent is 10% by mass or less based on the total amount of the temporary fixing material, the shear viscosity at 60°C measured by the following method is 100 to 10000 Pa-s, the elastic modulus at 25°C after heating at 130°C for 30 minutes and at 170°C for 1 hour is 10 to 1000 MPa, and the 5% weight loss temperature after heating at 130°C for 30 minutes and at 170°C for 1 hour is 300°C or higher. [Shear viscosity at 60°C] First, a measurement sample having a thickness of 240 μm was prepared by laminating four films of the temporary fixing resin composition having a thickness of 60 μm at 80°C, and a rotational viscoelasticity measuring device ARES manufactured by TA Instruments Japan Inc. was used to measure the viscosity at 60°C by applying a strain of 5% to the measurement sample while increasing the temperature from 35°C to 200°C at a rate of 20°C / min. Measurement method: "parallel plate" Measurement tool: circular tool having a diameter of 8 mm Measurement mode: "Dynamic temperature ramp" Frequency: 1 Hz [Elastic modulus after heating] First, a film having a thickness of 240 μm was prepared by laminating four films of the temporary fixing resin composition having a thickness of 60 μm at 80°C, and the film was heated in an oven at 130°C for 30 minutes and further heated at 170°C for 1 hour, and then cut into a width of 4 mm and a length of 33 mm in the thickness direction. The cut film was set in a dynamic viscoelasticity device Rheogel-E4000 manufactured by UBM Co., Ltd., a tensile load was applied, and the elastic modulus at 25°C was measured at a frequency of 10 Hz and a temperature increase rate of 3°C / min. [5% weight loss temperature after heating] First, a film having a thickness of 240 μm was prepared by laminating four films of the temporary fixing resin composition having a thickness of 60 μm at 80°C, and the film was heated in an oven at 130°C for 30 minutes and further heated at 170°C for 1 hour, and then cut into a width of 4 mm and a length of 33 mm in the thickness direction. The cut film was set in a dynamic viscoelasticity device Rheogel-E4000 manufactured by UBM Co., Ltd., a tensile load was applied, and the elastic modulus at 25°C was measured at a frequency of 10 Hz and a temperature increase rate of 3°C / min. ​ ​ ​ ​ ​ First, four films of the temporary fixing resin composition having a thickness of 60 μm were laminated at 80°C to produce a film having a thickness of 240 μm, which was heated in an oven at 130°C for 30 minutes, and further heated at 170°C for 1 hour, and then 10 mg was cut out as a measurement sample, and the 5% weight reduction temperature was measured using a differential thermal balance TG / DTA220 manufactured by Seiko Instruments Inc. at a temperature increase rate of 10°C / minute.

2. The manufacturing method of an electronic device according to claim 1, wherein The organic substrate is a coreless substrate.

3. The manufacturing method of an electronic device according to claim 1 or 2, wherein The support is a polyethylene terephthalate film, a polybutylene terephthalate film, a polyethylene naphthalate film, a polypropylene film, a polyamide film, or a polyimide film.

4. The manufacturing method of an electronic device according to claim 1 or 2, wherein In the first step, the support is supplied continuously in a tape shape.

5. The manufacturing method of an electronic device according to claim 1 or 2, wherein In the first step, the laminate is obtained using a support tape having a support film as the support and a temporary fixing material layer formed of the temporary fixing material provided on the support film.

6. A temporary fixing resin composition for temporarily fixing a support for substrate conveyance to an organic substrate, The temporary fixing resin composition contains a thermoplastic resin having a glass transition temperature of -50°C to 50°C, a thermosetting component, and a curing accelerator, contains a (meth)acrylic copolymer having a crosslinkable functional group as the thermoplastic resin, and does not contain a silicone-based releasing agent or contains the silicone-based releasing agent in an amount of 10% by mass or less based on the total amount of the resin composition, When formed into a film, the shear viscosity at 60°C measured by the following method is 100 to 10,000 Pa·s, the elastic modulus after heating at 130°C for 30 minutes and heating at 170°C for 1 hour is 10 to 1,000 MPa at 25°C, and the 5% weight reduction temperature after heating at 130°C for 30 minutes and heating at 170°C for 1 hour is 300°C or higher, [Shear viscosity at 60°C] First, a measurement sample having a thickness of 240 μm was produced by laminating four films of the temporary fixing resin composition having a thickness of 60 μm at 80°C, and the viscosity at 60°C was measured by using a rotational viscoelasticity measuring device ARES manufactured by TA Instruments Japan Inc. set to the following conditions, and measuring the viscosity at 60°C while applying a strain of 5% to the measurement sample while increasing the temperature at a rate of 20°C / minute from 35°C to 200°C, Measurement method: "parallel plate" Measurement tool: a circular tool having a diameter of 8 mm Measurement mode: "Dynamic temperature ramp" Frequency: 1 Hz [Elastic modulus after heating] First, four films of the temporary fixing resin composition having a thickness of 60 μm were stacked at 80°C to produce a film having a thickness of 240 μm, which was heated in an oven at 130°C for 30 minutes, and further heated at 170°C for 1 hour, and then cut in the thickness direction to a width of 4 mm and a length of 33 mm. The cut film was set in a dynamic viscoelasticity device Rheogel-E4000 manufactured by UBM Co., Ltd., and a tensile load was applied to measure the elastic modulus at 25°C at a frequency of 10 Hz and a temperature increase rate of 3°C / min. [5% weight reduction temperature after heating] First, four films of the temporary fixing resin composition having a thickness of 60 μm were stacked at 80°C to produce a film having a thickness of 240 μm, which was heated in an oven at 130°C for 30 minutes, and further heated at 170°C for 1 hour, and then 10 mg of the film was cut out as a measurement sample. The 5% weight reduction temperature was measured at a temperature increase rate of 10°C / min using a differential thermal balance TG / DTA220 manufactured by Seiko Instruments Inc.

7. A support tape for carrying a substrate, comprising: a support film for carrying an organic substrate; and a temporary fixing material layer provided on the support film and for temporarily fixing the organic substrate and the support film, In the temporary fixing material layer, a thermoplastic resin having a glass transition temperature of -50°C to 50°C, a thermosetting component, and a curing accelerator are contained, the (meth)acrylic copolymer having a crosslinkable functional group is contained as the thermoplastic resin, and the silicone-based releasing agent is not contained or the content of the silicone-based releasing agent is 10% by mass or less based on the total amount of the temporary fixing material, the shear viscosity at 60°C measured by the following method is 100 to 10,000 Pa·s, the elastic modulus at 25°C after heating at 130°C for 30 minutes and heating at 170°C for 1 hour is 10 to 1,000 MPa, and the 5% weight reduction temperature after heating at 130°C for 30 minutes and heating at 170°C for 1 hour is 300°C or higher, [Shear viscosity at 60°C] First, a measurement sample having a thickness of 240 μm was produced by stacking four films of the temporary fixing resin composition having a thickness of 60 μm at 80°C, and the viscosity at 60°C was measured by increasing the temperature from 35°C to 200°C at a temperature increase rate of 20°C / min while applying a strain of 5% to the measurement sample using a rotational viscoelasticity measuring device ARES manufactured by TA Instruments Japan Inc. set to the following conditions, Measurement method: "parallel plate" Measurement tool: circular tool having a diameter of 8 mm Measurement mode: "Dynamic temperature ramp" Frequency: 1 Hz; [Elastic modulus after heating] ​ First, four films of the temporary fixing resin composition having a thickness of 60 μm were stacked at 80°C to produce a film having a thickness of 240 μm, which was heated in an oven at 130°C for 30 minutes, and further heated at 170°C for 1 hour. After that, the film was cut in the thickness direction to have a width of 4 mm and a length of 33 mm, and the cut film was set in a dynamic viscoelasticity device Rheogel-E4000 manufactured by UBM Co., Ltd. A tensile load was applied, and the measurement was performed at a frequency of 10 Hz and a temperature elevation rate of 3°C / min to measure the elastic modulus at 25°C. [5% weight reduction temperature after heating] First, four films of the temporary fixing resin composition having a thickness of 60 μm were stacked at 80°C to produce a film having a thickness of 240 μm, which was heated in an oven at 130°C for 30 minutes, and further heated at 170°C for 1 hour. After that, 10 mg of the film was cut out as a measurement sample, and a differential thermal balance TG / DTA220 manufactured by Seiko Instruments Inc. was used to measure the 5% weight reduction temperature at a temperature elevation rate of 10°C / min.

8. The support tape according to claim 7, wherein The support film is a polyethylene terephthalate film, a polybutylene terephthalate film, a polyethylene naphthalate film, a polypropylene film, a polyamide film, or a polyimide film.

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