Packaging structure, circuit board assembly, and electronic device

Abstract

The application provides a packaging structure with high safety, a circuit board assembly and an electronic device. The packaging structure comprises a first substrate, an electronic element and a plastic package. The first substrate comprises a first ceramic layer, a first metal layer and a second metal layer, the first ceramic layer is located between the first metal layer and the second metal layer, the electronic element is fixed on the first metal layer and electrically connected to the first metal layer. The plastic package covers the electronic element and is connected to the first metal layer. The plastic package is provided with a groove, and the opening of the groove is located on the outer surface of the plastic package. The mechanical strength of the plastic package at the groove is reduced, and when the electronic element explodes, the internal air pressure of the packaging structure first breaks the plastic package, thereby solving the problem that the first metal layer and the second metal layer are short-circuited and the packaging structure is electrified.

Description

Technical Field

[0001] This application relates to the field of packaging technology, and in particular to a packaging structure, circuit board assembly and electronic device. Background Technology

[0002] Direct-bonded copper (DBC) ceramic substrates are widely used in packaging technology due to their excellent high-voltage resistance. A DBC substrate consists of two copper layers and a ceramic plate between them. A traditional DBC package structure includes the DBC substrate, a molding compound, and electronic components. The molding compound encapsulates the electronic components on the DBC substrate. However, when an electronic component malfunctions and explodes, the internal pressure of the DBC package can cause the ceramic plate to crack, resulting in a short circuit between the two copper layers. This makes the DBC package structure prone to becoming electrified, posing a risk to personal safety. Summary of the Invention

[0003] This application provides a highly secure packaging structure, circuit board assembly, and electronic device.

[0004] In a first aspect, this application provides a packaging structure. The packaging structure includes a first substrate, an electronic component, and a molding compound. The first substrate includes a first ceramic layer, a first metal layer, and a second metal layer. The first ceramic layer is located between the first metal layer and the second metal layer. The electronic component is fixed to the first metal layer and electrically connected to the first metal layer. The molding compound covers the electronic component and is connected to the first metal layer. The molding compound has a groove, the opening of which is located on the outer surface of the molding compound.

[0005] Understandably, setting grooves on the plastic package reduces its mechanical strength. In the event of an explosion due to a malfunction of an electronic component, the internal air pressure of the package structure will first break through the plastic package with the grooves, thus preventing the first ceramic layer from cracking and causing a short circuit between the first and second metal layers, which would result in the package structure becoming electrified.

[0006] In one possible implementation, the outer surface of the molding compound includes a top surface. The top surface faces away from the first metal layer. The opening of the recess is located on the top surface. It is understood that by placing the opening of the recess on the top surface of the molding compound, with the top surface facing away from the first metal layer, the recess is positioned away from the first substrate. Thus, when the electronic component explodes, the explosive pressure can be released from the top surface of the molding compound, i.e., the explosive pressure is released in a direction away from the first substrate, thereby preventing the explosive pressure from damaging the first ceramic layer and thus solving the problem of the package structure becoming charged due to a short circuit between the first and second metal layers.

[0007] In one possible implementation, the outer surface of the molding compound includes a peripheral side surface. The peripheral side surface is connected to the first substrate. The opening of the recess is located on the peripheral side surface. It is understood that by placing the opening of the recess on the peripheral side surface of the molding compound, the recess is positioned to a greater extent away from the first substrate. Thus, when the electronic component explodes, the explosive pressure can be released from the side of the molding compound, i.e., the explosive pressure is released in a direction away from the first substrate, thereby preventing the pressure from damaging the first ceramic layer and thus solving the problem of the package structure becoming charged due to a short circuit between the first and second metal layers.

[0008] In one possible implementation, the package structure includes a second substrate. The second substrate includes a second ceramic layer, a third metal layer, and a fourth metal layer. The second ceramic layer is located between the third and fourth metal layers. The third metal layer is disposed close to the first metal layer relative to the fourth metal layer. The molding compound is also connected to the third metal layer.

[0009] It is understandable that by additionally setting a second substrate, which includes a second ceramic layer, a third metal layer, and a fourth metal layer, the strength of the packaging structure can be further enhanced by utilizing the third and fourth metal layers, while the insulation effect of the packaging structure can be further guaranteed by utilizing the second ceramic substrate.

[0010] In addition, the first metal layer of the first substrate and the third metal layer of the second substrate can both be used to set electronic components. Compared with the packaging structure with only the first substrate, this embodiment can set more electronic components, the overall structure is more compact, and it is conducive to the multi-functional setting of the packaging structure.

[0011] In one possible implementation, the encapsulation structure includes a flexible element. The flexible element is disposed within a recess. The mechanical strength of the flexible element is less than that of the plastic encapsulation.

[0012] Understandably, by placing the flexible component within the groove, it can intercept fragments ejected from the plastic encapsulation when the electronic component explodes, thus preventing the fragments from breaking out of the encapsulation structure and affecting the operation of other devices.

[0013] In one possible implementation, the flexible component is made of silicone gel, and the molding compound is made of epoxy resin.

[0014] In one possible implementation, the molding compound has grooves. The opening of the groove is located on the bottom wall of the recess.

[0015] Understandably, by creating grooves on the bottom wall of the recess, the mechanical strength of the molded component in the recess area is further reduced. Thus, when an electronic component explodes due to a malfunction, the grooves can guide the explosive pressure to be released first from the molded component with the grooves, thereby preventing the explosive pressure from damaging the first ceramic layer. This also solves the problem of the package structure becoming charged due to a short circuit between the first and second metal layers.

[0016] In one possible implementation, the groove is shaped like an "X", a cross, a straight line, or a herringbone. It is understood that the groove in this embodiment has a relatively simple structure and is easy to manufacture.

[0017] In one possible implementation, the mechanical strength of the molding compound is less than that of the first ceramic layer. This ensures that when an electronic component explodes due to a malfunction, the explosive pressure will first breach the molding compound, preventing the post-explosion pressure from damaging the first ceramic layer. This also solves the problem of the package structure becoming charged due to a short circuit between the first and second metal layers.

[0018] In one possible implementation, both the first and second metal layers are made of copper.

[0019] It is understandable that metallic copper has excellent electrical and thermal conductivity, so direct copper-clad ceramic substrates have the advantages of high current carrying capacity and fast heat dissipation, making them suitable for high-power and high-voltage applications.

[0020] In one possible implementation, the encapsulation structure further includes a paint layer that covers the outer surface of the molding compound and the surface of the second metal layer facing away from the first ceramic layer.

[0021] Understandably, the paint layer enhances insulation, and its thinness ensures it doesn't affect the pressure relief effect of the groove. Additionally, the paint layer protects the molded parts from damage caused by friction.

[0022] Secondly, this application provides a circuit board assembly. The circuit board assembly includes a circuit board and a package structure. The plastic encapsulation of the package structure is connected to the circuit board. The first metal layer of the package structure is electrically connected to the circuit board.

[0023] Understandably, because the first and second metal layers of the package structure are less likely to become charged due to short circuits, the package structure has better reliability. When the package structure is applied to circuit board assemblies, the reliability of the circuit board assembly is also better.

[0024] Thirdly, this application provides an electronic device. The electronic device includes a heat sink and a circuit board assembly, wherein the circuit board assembly secures the heat sink.

[0025] Understandably, by fixing the circuit board assembly to a heat sink, the heat sink can quickly dissipate heat from the electronic device when it is transferred to the package structure. This allows heat to dissipate more quickly within the package structure, reducing the likelihood of the electronic components exploding due to overheating. It also further reduces the probability of the circuit board becoming charged due to a crack in the first substrate.

[0026] In one possible implementation, the heat sink serves as the casing of the electronic device. This allows for rapid heat dissipation from the encapsulation structure, preventing the electronic components within from overheating and potentially exploding. It also reduces the risk of the circuit board assembly becoming charged due to a crack in the first substrate, thus minimizing the risk of the casing becoming charged and threatening user safety. Furthermore, the casing protects the internal components of the electronic device. The casing thus serves a dual purpose. In this embodiment, the electronic device does not require an additional heat sink, saving internal space and reducing production costs.

[0027] Furthermore, in the event of an explosion, the first and second metal layers of the electronic component in this embodiment are less likely to short-circuit, preventing the packaging structure from becoming charged. Therefore, when the circuit board assembly is used in an electronic device, the second metal layer is also less likely to short-circuit with the casing. Consequently, the casing is less likely to become charged. When a user touches the casing of the electronic device, the user is less likely to experience electric shock, and their personal safety is less threatened, meaning the electronic device has higher reliability.

[0028] In one possible implementation, the electronic device includes a heat-conducting component. This component connects the circuit board assembly to a heat sink. Understandably, the heat-conducting component improves the efficiency of heat transfer from the electronic components to the heat sink, further accelerating the temperature reduction of the electronic components. This further reduces the likelihood of the circuit board assembly becoming charged due to a crack in the first substrate, further reducing the probability of the electronic device's casing becoming charged, thus further ensuring user safety. Attached Figure Description

[0029] Figure 1 This is a schematic diagram of one embodiment of the packaging structure provided in this application.

[0030] Figure 2 yes Figure 1 The diagram shows a partial cross-sectional view of the encapsulation structure at line AA.

[0031] Figure 3 yes Figure 2 A partial cross-sectional schematic diagram of another embodiment of the packaging structure shown;

[0032] Figure 4 yes Figure 2A partial cross-sectional schematic diagram of another embodiment of the packaging structure shown;

[0033] Figure 5 yes Figure 2 A schematic diagram of another embodiment of the packaging structure shown;

[0034] Figure 6 yes Figure 5 The diagram shows a partial cross-sectional view of the packaging structure at the BB line.

[0035] Figure 7 yes Figure 2 A partial cross-sectional schematic diagram of another embodiment of the packaging structure shown;

[0036] Figure 8 yes Figure 2 A partial cross-sectional schematic diagram of another embodiment of the packaging structure shown;

[0037] Figure 9 yes Figure 8 A partial cross-sectional view of another embodiment of the packaging structure shown;

[0038] Figure 10 yes Figure 2 A partial cross-sectional view of another embodiment of the packaging structure shown;

[0039] Figure 11 This is a partial structural cross-sectional view of one embodiment of the circuit board assembly provided in this example;

[0040] Figure 12 This is a schematic diagram of one embodiment of the electronic device provided in this application.

[0041] Figure 13 for Figure 12 A partial cross-sectional schematic diagram of the electronic device shown. Detailed Implementation

[0042] The embodiments of this application are described below with reference to the accompanying drawings.

[0043] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the term "connection" should be interpreted broadly. For example, "connection" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium. "Fixed" means that the devices are connected to each other and their relative positional relationship remains unchanged after the connection. The directional terms mentioned in the embodiments of this application, such as "top" and "bottom," are only for reference to the directions in the accompanying drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the embodiments of this application, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application. Furthermore, "multiple" refers to at least two.

[0044] In the embodiments of this application, several implementation methods of the packaging structure will be described in detail with reference to the relevant accompanying drawings.

[0045] First implementation method: Please refer to Figure 1 and Figure 2 , Figure 1 This is a schematic diagram of one embodiment of the packaging structure 10 provided in this application. Figure 2 yes Figure 1 The diagram shows a partial cross-sectional view of the packaging structure 10 at line AA. The packaging structure 10 includes a first substrate 11, electronic components 12, and a molding compound 13. Exemplarily, the electronic component 12 can be an active device such as a chip, or a passive device such as a capacitor, inductor, or resistor. Those skilled in the art can select the type and quantity of the electronic component 12 according to actual needs, and this application does not limit this. The first substrate 11 includes a first metal layer 111, a first ceramic layer 112, and a second metal layer 113. The first ceramic layer 112 is located between the first metal layer 111 and the second metal layer 113. In one embodiment, the second metal layer 113, the first ceramic layer 112, and the first metal layer 111 can be sequentially fixedly connected.

[0046] In this embodiment, both the first metal layer 111 and the second metal layer 113 are made of copper. In this case, the first substrate 11 is a direct copper-clad ceramic substrate. It is understood that copper has excellent electrical and thermal conductivity; therefore, the direct copper-clad ceramic substrate has the advantages of high current carrying capacity and fast heat dissipation, making it suitable for high-power and high-voltage applications. In other embodiments, the first substrate 11 can be a direct aluminum-clad ceramic substrate, and the first metal layer 111 and the second metal layer 113 are made of aluminum. For example, the first ceramic layer 112 can be made of alumina ceramic or aluminum nitride ceramic, etc. Thus, the first ceramic layer 112 has advantages such as strong heat dissipation, good insulation performance, and strong mechanical properties.

[0047] Please refer to it again. Figure 2Electronic component 12 is fixed to and electrically connected to the first metal layer 111. Exemplarily, the package structure 10 includes a bonding wire 14. One end of the bonding wire 14 is fixed to and electrically connected to the first metal layer 111. The other end of the bonding wire 14 is fixedly connected to and electrically connected to the electronic component 12. Thus, the electronic component 12 can be electrically connected to the first metal layer 111 via the bonding wire 14.

[0048] In one embodiment, the first metal layer 111 includes a first portion 1111 and a second portion 1112 spaced apart. There are multiple first portions 1111 and multiple second portions 1112. The multiple first portions 1111 are also spaced apart. The multiple second portions 1112 are also spaced apart. The first portions 1111 can be used to fix electronic components 12. Exemplarily, electronic components 12 can be electrically connected to the second portions 1112 via bonding wires 14. Additionally, the second portions 1112 can be used to fix and electrically connect pins 15. A portion of the pins 15 is located inside the package structure 10, and a portion is located outside the package structure 10. Pins 15 can be used to electrically connect to devices outside the package structure 10. Thus, electronic components 12 can be electrically connected to external devices of the package structure 10 via bonding wires 14, second portions 1112, and pins 15. It is understood that in this embodiment, there are multiple first portions 1111, and the package structure 10 can accommodate a large number of electronic components 12, or a large variety of electronic components 12.

[0049] Please refer to it again. Figure 2 The molding compound 13 is connected to the first metal layer 111 and covers the electronic component 12. The molding compound 13 protects the electronic component 12, making it less susceptible to damage. In one embodiment, the molding compound 13 can be made of epoxy resin. This provides better resistance to corrosion from external moisture and solvents, and also insulates the electronic component 12 from the external environment. It is understood that in this embodiment, the molding compound 13 also connects to the first ceramic layer 112 and the second metal layer 113. This strengthens the connection between the first metal layer 111, the first ceramic layer 112, and the second metal layer 113, resulting in a more robust and reliable overall structure of the encapsulation structure 10. In other embodiments, the molding compound 13 may only connect to the first metal layer 111.

[0050] Please refer to it again. Figure 2The molding compound 13 is provided with a groove 16. The opening 161 of the groove 16 is located on the outer surface of the molding compound 13. In one embodiment, the outer surface of the molding compound 13 includes a top surface 131. The top surface 131 faces away from the first metal layer 111. The opening 161 of the groove 16 is located on the top surface 131. It is understood that by providing the opening 161 of the groove 16 on the top surface 131 of the molding compound 13, the top surface 131 of the molding compound 13 faces away from the first metal layer 111, so that the groove 16 can be disposed away from the first substrate 11. In this way, when the electronic component 12 explodes due to a malfunction, the explosion pressure can be released from the top surface 131 of the molding compound 13, that is, the explosion pressure is released in a direction away from the first substrate 11, thereby avoiding the explosion pressure from damaging the first ceramic layer 112, and thus solving the problem of the package structure 10 becoming charged due to the short circuit between the first metal layer 111 and the second metal layer 113. In other embodiments, the opening 161 of the groove 16 may also be located at other positions on the outer surface of the molding compound 13, and the number of grooves 16 is not limited to... Figure 2 This application does not limit the scope of the illustration. The following will provide a detailed description in conjunction with the relevant accompanying drawings.

[0051] Please see Figure 3 , Figure 3 yes Figure 2 The diagram shows a partial cross-sectional view of another embodiment of the encapsulation structure 10. The outer surface of the molding compound 13 includes a peripheral side surface 132. The peripheral side surface 132 is connected to the first substrate 11. The opening 161 of the recess 16 is located on the peripheral side surface 132. It is understood that by providing the opening 161 of the recess 16 on the peripheral side surface 132 of the molding compound 13, the recess 16 is positioned to a greater extent away from the first substrate 11. In this way, when the electronic component 12 explodes, the explosive pressure can be released from the side of the molding compound 13, that is, the explosive pressure is released in a direction away from the first substrate 11, thereby preventing the explosive pressure from damaging the first ceramic layer 112, and thus solving the problem of the encapsulation structure 10 becoming charged due to short circuit between the first metal layer 111 and the second metal layer 113.

[0052] Please see Figure 4 , Figure 4 yes Figure 2The diagram shows a partial cross-sectional view of another embodiment of the encapsulation structure 10. There are two recesses 16, spaced apart. The openings 161 of both recesses 16 are located on the top surface 131 of the molding compound 13. This allows for a greater release of the explosive pressure from the top surface 131 of the molding compound 13 when the electronic component 12 explodes due to a malfunction. In other words, the explosive pressure can be released in a direction away from the first substrate 11, thus preventing the explosive pressure from damaging the first ceramic layer 112 and resolving the problem of the encapsulation structure 10 becoming charged due to a short circuit between the first metal layer 111 and the second metal layer 113. In other embodiments, the opening 161 of one recess 16 may be located on the top surface 131 of the molding compound 13, and the opening 161 of the other recess 16 may be located on the peripheral side surface 132 of the molding compound 13. Alternatively, the openings 161 of both recesses 16 may both be located on the peripheral side surface 132 of the molding compound 13.

[0053] The preceding text, with reference to the accompanying drawings, detailed one embodiment of the package structure 10. The following text, with reference to the accompanying drawings, will further describe several other packages 10 structures.

[0054] The second implementation method, which shares the same technical content as the first implementation method, will not be described again: Please refer to... Figure 5 and Figure 6 , Figure 5 yes Figure 2 A schematic diagram of another embodiment of the packaging structure 10 shown. Figure 6 yes Figure 5 The diagram shows a partial cross-sectional view of the packaging structure 10 at the BB line. The packaging structure 10 includes a first substrate 11, electronic components 12, and a molding compound 13. The arrangement of the first substrate 11, electronic components 12, and molding compound 13 in this embodiment can be found in the arrangement of the first substrate 11, electronic components 12, and molding compound 13 in the first embodiment. Specific details will not be repeated here.

[0055] In addition, the molding compound 13 is also provided with a groove 17, the opening 171 of which is located on the bottom wall of the recess 16. In this embodiment, the groove 17 is X-shaped. It is understood that the structure of the groove 17 in this embodiment is relatively simple and easy to process. In other embodiments, the shape of the groove 17 may also be a cross, a straight line, a herringbone, or other shapes, and this application does not limit this.

[0056] Understandably, by providing the groove 17 on the bottom wall of the recess 16, the mechanical strength of the molding compound 13 in the area of ​​the recess 16 is further reduced. Thus, when the electronic component 12 explodes due to a malfunction, the groove 17 can further guide the explosive pressure to be released first from the molding compound 13 with the groove 17, thereby preventing the explosive pressure from damaging the first ceramic layer 112, and thus solving the problem of the first metal layer 111 and the second metal layer 113 becoming charged due to a short circuit.

[0057] The third implementation method, which shares the same technical content as the first implementation method, will not be repeated here: Please refer to... Figure 7 , Figure 7 yes Figure 2 The diagram shows a partial cross-sectional view of another embodiment of the encapsulation structure 10. The encapsulation structure 10 includes a first substrate 11, electronic components 12, a molding compound 13, and a flexible member 18. The arrangement of the first substrate 11, electronic components 12, and molding compound 13 in this embodiment can be found in the arrangement of the first substrate 11, electronic components 12, and molding compound 13 in the first embodiment. Specific details will not be repeated here. Furthermore, the flexible member 18 is disposed within the groove 16. The flexible member 18 may or may not completely fill the groove 16. The mechanical strength of the flexible member 18 is less than that of the molding compound 13. For example, the material of the flexible member 18 includes silicone gel.

[0058] It is understandable that by setting the flexible element 18 in the groove 16, the flexible element 18 and the molding compound 13 form an integral structure. Since the mechanical strength of the flexible element 18 is less than that of the molding compound 13, when the electronic component 12 explodes due to a malfunction, the explosive pressure can be released from the less mechanically strong flexible element 18. That is, the explosive pressure is released from the flexible element 18, thereby preventing the explosive pressure from damaging the first ceramic layer 112, and thus solving the problem of the first metal layer 111 and the second metal layer 113 becoming charged due to short circuit.

[0059] Furthermore, by providing a flexible element 18 within the groove 16, when the electronic component 12 explodes due to a malfunction, and the explosive pressure is released from the encapsulation 13 with the groove 16, the flexible element 18 can intercept the fragments, thereby preventing damage to the surrounding devices of the encapsulation structure 10. In other embodiments, the third embodiment can also be combined with the second embodiment. In this case, when a groove 17 is provided within the groove 16, a portion of the flexible element 18 can be disposed within the groove 17.

[0060] The fourth implementation method, which shares the same technical content as the first implementation method, will not be described again: Please refer to... Figure 8 , Figure 8 yes Figure 2The diagram shows a partial cross-sectional view of another embodiment of the packaging structure 10. The packaging structure 10 includes a first substrate 11, a second substrate 19, electronic components 12, and a molding compound 13. The arrangement of the first substrate 11, electronic components 12, and molding compound 13 in this embodiment can be found in the arrangement of the first substrate 11, electronic components 12, and molding compound 13 in the first embodiment. Specific details will not be repeated here.

[0061] Furthermore, the second substrate 19 includes a third metal layer 191, a second ceramic layer 192, and a fourth metal layer 193. The second ceramic layer 192 is located between the third metal layer 191 and the fourth metal layer 193, and the third metal layer 191 is disposed relative to the fourth metal layer 193, close to the first metal layer 111 of the first substrate 11. In other words, the third metal layer 191 is located between the fourth metal layer 193 and the first metal layer 111. In one embodiment, the third metal layer 191, the second ceramic layer 192, and the fourth metal layer 193 can be sequentially fixedly connected. It is understood that by additionally providing the second substrate 19, and the second substrate 19 including the third metal layer 191, the second ceramic layer 192, and the fourth metal layer 193, the strength of the encapsulation structure 10 is further enhanced by utilizing the third metal layer 191 located on the fourth metal layer 193, and the insulation effect of the encapsulation structure 10 is further ensured by utilizing the second ceramic layer 192. In addition, the molding compound 13 also connects the first metal layer 111 and the third metal layer 191. In this way, the first substrate 11, the second substrate 19, and the molding compound 13 can form a relatively robust integrated structure.

[0062] In this embodiment, the opening 161 of the groove 16 on the molding compound 13 is located on the peripheral side surface 132 of the molding compound 13. The groove 16 can be disposed away from both the first substrate 11 and the second substrate 19. In this way, when the electronic component 12 explodes due to a malfunction, the explosion pressure can be released from the peripheral side surface 132 of the molding compound 13, that is, the explosion pressure is released in a direction away from the first substrate 11 and the second substrate 19. This can prevent the explosion pressure from damaging the first ceramic layer 112, thereby solving the problem of the package structure 10 becoming charged due to the short circuit between the first metal layer 111 and the second metal layer 113. It can also prevent the explosion pressure from damaging the second ceramic layer 192, thereby solving the problem of the package structure 10 becoming charged due to the short circuit between the third metal layer 191 and the fourth metal layer 193.

[0063] In one embodiment, the molding compound 13 further includes a first support member 133. The first support member 133 is embedded within the molding compound 13. One end of the first support member 133 is connected to the first metal layer 111 of the first substrate 11, and the other end is connected to the third metal layer 191 of the second substrate 19. In this way, the first support member 133 can support the first substrate 11 and the second substrate 19, keeping the first substrate 11 and the second substrate 19 at a certain distance, so that the encapsulation structure 10 will not deform or collapse due to external pressure during the encapsulation process.

[0064] In one embodiment, the molding compound 13 further includes a second support member 134. The second support member 134 is embedded within the molding compound 13. One end of the second support member 134 is connected to the electronic component 12, and the other end is connected to the third metal layer 191 of the second substrate 19. The second support member 134 can maintain a certain distance between the electronic component 12 and the second substrate 19.

[0065] In one implementation, please refer to Figure 9 , Figure 9 yes Figure 8 The diagram shows a partial cross-sectional view of another embodiment of the packaging structure 10. The packaging structure 10 includes an auxiliary electronic component 12a. The auxiliary electronic component 12a can be an active device such as a chip, or a passive device such as a capacitor, inductor, or resistor. Those skilled in the art can select the type and quantity of the auxiliary electronic component 12a according to actual needs; this application does not limit this selection. The auxiliary electronic component 12a is fixed to and electrically connected to the third metal layer 191. The molding compound 13 covers the auxiliary electronic component 12a; that is, the auxiliary electronic component 12a is embedded within the molding compound 13.

[0066] In this embodiment, the first metal layer 111 of the first substrate 11 can be used to set electronic components 12, and the third metal layer 191 of the second substrate 19 can be used to set auxiliary electronic components 12a. In this way, the packaging structure 10 of this embodiment can set more electronic components 12 and auxiliary electronic components 12a, and the overall structure is more compact, which is conducive to the multi-functional setting of the packaging structure 10.

[0067] In other embodiments, the solution of this embodiment can also be combined with the second or third embodiment to form a new solution. The solution of this embodiment can also be combined with both the second and third embodiments simultaneously to form a new solution.

[0068] The fifth implementation method, which shares the same technical content as the first implementation method, will not be repeated here: Please refer to [link to relevant documentation]. Figure 10 , Figure 10 yes Figure 2The diagram shows a partial cross-sectional view of another embodiment of the encapsulation structure 10. The encapsulation structure 10 includes a first substrate 11, electronic components 12, a molding compound 13, and a paint layer 21. The arrangement of the first substrate 11, electronic components 12, and molding compound 13 in this embodiment can be found in the arrangement of the first substrate 11, electronic components 12, and molding compound 13 in the first embodiment. Specific details will not be repeated here. Furthermore, the paint layer 21 covers the outer surface of the molding compound 13 and the surface of the second metal layer 113 facing away from the first ceramic layer 112. In other embodiments, the paint layer 21 may only cover the outer surface of the molding compound 13. It is understood that the paint layer 21 can enhance the insulation effect, and since the paint layer 21 is relatively thin, it will not affect the pressure relief effect of the groove 16. Additionally, the paint layer 21 can also be used to protect the molding compound 13, preventing damage to the molding compound 13 due to friction.

[0069] In other embodiments, the solution of this embodiment can also be combined with the second, third, or fourth embodiment to form a new solution. Of course, while the second, third, or fourth embodiment is combined with each other to form a new solution, the new solution can also be combined with this embodiment.

[0070] Please see Figure 11 , Figure 11 This is a partial structural cross-sectional view of one embodiment of the circuit board assembly 100 provided in this embodiment. The circuit board assembly 100 includes a package structure 10 and a circuit board 20. The circuit board 20 can be a rigid circuit board, a flexible circuit board, or a rigid-flex circuit board. The circuit board 20 can use an FR-4 dielectric substrate, a Rogers dielectric substrate, or a hybrid dielectric substrate of Rogers and FR-4, etc. Taking the package structure 10 of the first embodiment as an example, the connection relationship between the package structure 10 and the circuit board 20 is specifically described.

[0071] The package structure 10 is fixed to the circuit board 20. The electronic components 12 of the package structure 10 are electrically connected to the circuit board 20. The circuit board 20 can be understood as a carrier of the package structure 10, capable of supporting and assembling with it. Exemplarily, the plastic encapsulation of the package structure 10 is fixed to the circuit board 20. The pins 15 of the package structure 10 are fixed to and electrically connected to the circuit board 20. Thus, the electronic components 12 within the package structure 10 can be electrically connected to the circuit board 20 via the pins 15.

[0072] It should be noted that the structures illustrated in the embodiments of this application do not constitute a specific limitation on the circuit board assembly 100. In other embodiments of this application, the circuit board assembly 100 may include more components than illustrated, or combine some components, or split some components, or have different component arrangements. In one embodiment, the circuit board assembly 100 includes a plurality of package structures 10, and the plurality of package structures 10 are electrically connected to each other through a circuit board 20.

[0073] Understandably, because the first metal layer 111 and the second metal layer 113 of the package structure 10 are less likely to become charged due to short circuits, the package structure 10 has better reliability. When the package structure 10 is applied to the circuit board assembly 100, the reliability of the circuit board assembly 100 is also better.

[0074] In this embodiment, the package structure 10 is described as being mounted on the circuit board 20. In other embodiments, the package structure 10 can also be mounted on other structures, and this application is not limited thereto.

[0075] Please see Figure 11 The top surface 131 of the molding compound 13 is fixed to the circuit board 20. The groove 16 and the circuit board 20 enclose a pressure relief space. It is understood that when the electronic component 12 explodes due to a malfunction, and the explosive pressure is released from the molding compound 13 with the groove 16, the fragments can be collected within the pressure relief space, meaning the fragments are less likely to be ejected from the outside of the encapsulation structure 10. Thus, the fragments are less likely to cause failure of other devices or circuits, thereby preventing damage to surrounding devices of the encapsulation structure 10.

[0076] In other embodiments, the peripheral side 132 of the molding compound 13 can also be fixed to the circuit board 20.

[0077] In other embodiments, when the packaging structure 10 adopts the packaging structure 10 of the fourth embodiment (that is, the packaging structure 10 includes the second substrate 19), the circuit board 20 can also fix the fourth metal layer 193 of the second substrate 19.

[0078] Please see Figure 12 and Figure 13 , Figure 12 This is a schematic diagram of one embodiment of the electronic device 1000 provided in this application. Figure 13 for Figure 12The diagram shows a partial cross-sectional view of the electronic device 1000. This application provides an electronic device 1000. The electronic device 1000 can be a mobile phone, tablet computer, laptop computer, in-vehicle device, wearable device, drone, router, etc. The electronic device 1000 can also be a power supply module, communication signal transmitting base station, network switching equipment, etc. In this embodiment, a refrigerator is used as an example for description.

[0079] Electronic device 1000 includes a circuit board assembly 100 and a housing 200. The circuit board assembly 100 is fixed to the housing 200. Exemplarily, the second metal layer 113 of the first substrate 11 of the encapsulation structure 10 of the circuit board assembly 100 is fixed to the housing 200. In this embodiment, the housing 200 is a heat sink. Thus, when heat generated by the encapsulation structure 10 is transferred to the housing, the housing 200 can quickly dissipate the heat to the outside of the electronic device 1000. In this way, the heat inside the encapsulation structure 10 can be dissipated more quickly, thereby reducing the probability of the electronic components 12 inside the encapsulation structure 10 exploding due to temperature rise. It further reduces the probability of the circuit board 20 becoming charged due to the first substrate 11 cracking. In addition, the housing 200 has the effect of protecting the internal components of the electronic device 1000. Therefore, the housing 200 of this embodiment has a "dual-purpose" function. Compared with the solution of setting a heat sink inside the electronic device 1000 and then fixing the circuit board assembly 100 to the heat sink. The electronic device 1000 of this embodiment does not require additional heat dissipation components, which saves internal space of the electronic device 1000 and reduces production costs.

[0080] Furthermore, in this embodiment, when the electronic component 12 explodes, the first metal layer 111 and the second metal layer 113 are less likely to short-circuit, causing the encapsulation structure 10 to become electrified. Thus, when the circuit board assembly 100 is applied to the electronic device 1000, the second metal layer 113 is also less likely to short-circuit with the housing 200. At this time, the housing 200 is less likely to become electrified. When a user touches the housing 200 of the electronic device 1000, the user is less likely to experience electric shock, and the user's personal safety is less likely to be threatened; that is, the reliability of the electronic device 1000 is better.

[0081] In other embodiments, the circuit board assembly 100 may also be fixed to other heat sinks of the electronic device 1000.

[0082] In one embodiment, the electronic device 1000 further includes a heat-conducting element 300. The heat-conducting element 300 is fixedly connected between the circuit board assembly 100 and the heat sink. Exemplarily, the heat-conducting element 300 is fixed between the second metal layer 113 and the housing 200. It is understood that the heat-conducting element 300 can improve the efficiency of heat transfer from the electronic component 12 to the housing 200, further accelerate the temperature reduction of the electronic component 12, and reduce the probability of the electronic component 12 exploding.

[0083] In one embodiment, the thermal conductive element 300 can be made of thermally conductive gel. In this case, the thermal conductive element 300 has better adhesion, which can further improve the connection strength between the circuit board assembly 100 and the housing 200.

[0084] In one embodiment, by changing the shape of the housing 200, the circuit board 20 of the circuit board assembly 100 can also be fixed to the housing 200. In this way, the circuit board 20 of the circuit board assembly 100 and the first substrate 11 can be simultaneously fixed to the housing 200. Thus, the heat generated by the encapsulation structure 10 can be transferred to the housing 200 simultaneously via the circuit board 20 and the first substrate 11, and the housing 200 can quickly dissipate the heat to the outside of the electronic device 1000. This allows the heat within the encapsulation structure 10 to dissipate more quickly, thereby reducing the probability of the electronic components 12 within the encapsulation structure 10 exploding due to temperature rise. It further reduces the probability of the circuit board 20 becoming charged due to the first substrate 11 cracking.

[0085] In one embodiment, a heat-conducting component 300 may also be provided between the circuit board 20 and the housing 200. The heat-conducting component 300 can improve the efficiency of heat transfer from the electronic component 12 to the housing 200, and further accelerate the temperature reduction of the electronic component 12.

[0086] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Where there is no conflict, the embodiments and features in the embodiments of this application can be combined with each other. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A packaging structure, characterized in that, It includes a first substrate, electronic components, and a plastic package; The first substrate includes a first ceramic layer, a first metal layer, and a second metal layer. The first ceramic layer is located between the first metal layer and the second metal layer. The electronic components are fixed on the first metal layer and electrically connected to the first metal layer. The plastic package covers the electronic components, and the electronic components are located inside the plastic package. The plastic package is connected to the first metal layer, and the mechanical strength of the plastic package is less than that of the first ceramic layer; The plastic package is provided with a groove, and the opening of the groove is located on the outer surface of the plastic package.

2. The packaging structure according to claim 1, characterized in that, The outer surface of the plastic package includes a top surface that faces away from the first metal layer, and the opening of the groove is located on the top surface.

3. The packaging structure according to claim 1, characterized in that, The outer surface of the plastic package includes a peripheral side surface that is connected to the first substrate, and the opening of the groove is located on the peripheral side surface.

4. The packaging structure according to claim 3, characterized in that, The packaging structure includes a second substrate, and the second substrate includes a second ceramic layer, a third metal layer, and a fourth metal layer. The second ceramic layer is located between the third metal layer and the fourth metal layer. The third metal layer is disposed relatively close to the first metal layer with respect to the fourth metal layer; The plastic package is also connected to the third metal layer.

5. The packaging structure according to any one of claims 1 to 4, characterized in that, The packaging structure includes a flexible member, and the flexible member is disposed in the groove. The mechanical strength of the flexible member is less than that of the plastic package.

6. The packaging structure according to claim 5, characterized in that, The material of the flexible member includes silicone gel, and the material of the plastic package includes epoxy resin.

7. The packaging structure according to any one of claims 1 to 4, characterized in that, The plastic package is provided with a trench, and the opening of the trench is located on the bottom wall of the groove.

8. The packaging structure according to claim 7, characterized in that, The shape of the trench is "X" shape, "cross" shape, "one" shape, or "human" shape.

9. The packaging structure according to any one of claims 1 to 4, characterized in that, The materials of both the first metal layer and the second metal layer are copper.

10. The packaging structure according to any one of claims 1 to 4, characterized in that, The packaging structure further includes a paint layer that covers the outer surface of the plastic package and the surface of the second metal layer facing away from the first ceramic layer.

11. A circuit board assembly, characterized in that, [[ID=十三]]It includes a circuit board and the packaging structure according to any one of claims 1 to 10. The plastic package of the packaging structure is connected to the circuit board, and the first metal layer of the packaging structure is electrically connected to the circuit board.

12. An electronic device, characterized in that, It includes a heat dissipation member and the circuit board assembly according to claim 11, and the circuit board assembly fixes the heat dissipation member.

13. The electronic device according to claim 12, characterized in that, The heat dissipation member is the housing of the electronic device.

14. The electronic device according to claim 12 or 13, characterized in that, The electronic device includes a heat conducting member, and the heat conducting member is connected between the circuit board assembly and the heat dissipation member. It should be noted that there is an error in the numbering in the original text. It jumps from "ID=12" to "ID=十三". I have translated it as it is, but it may need to be corrected in the original content.

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