Electronic device

Abstract

The present application provides an electronic device, which comprises: a main body having an air flow hole; a differential pressure sensor package structure having a first through hole, the first through hole being communicated with the air flow hole to form an air flow channel; at least one air vent hole being communicated with the air flow channel and connecting the air flow channel with the outside to reduce the pressure of the air flow channel. The present application has the advantage that the pressure of the air flow channel is reduced by the air vent hole communicated with the air flow channel, and only when the air flow pressure in the air flow channel reaches a higher value, the air flow pressure acting on the differential pressure sensor package structure through the first through hole can make the pressure difference detected by the differential pressure sensor package structure reach the starting threshold of the electronic device, and at this time the electronic device will start, thereby avoiding the electronic device from being affected by the external interference air flow and being mis-started.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of sensor packaging, in particular to an electronic device. BACKGROUND

[0002] At present, in the electronic device which needs to detect the air pressure difference, two methods are usually used to detect the air pressure difference.

[0003] One method is to place two air pressure sensors on the PCB circuit board of the electronic device, and to judge whether the pressure difference reaches the threshold value through the pressure difference value processing of the two air pressure sensors, so as to realize the detection of the air pressure difference. However, the use of two air pressure sensors will lead to the increase of the cost of the electronic device; and the two air pressure sensors occupy a large space and affect the miniaturization design of the product; moreover, the two air pressure sensors are strongly dependent on each other, and the damage of any one of them will lead to the failure of the whole product, so that the failure risk of the electronic device is large.

[0004] Another method is to directly measure the pressure difference by using a differential pressure sensor, and to judge whether the pressure difference reaches the threshold value, so as to realize the detection of the air pressure difference and start the electronic device. However, when the start threshold value of the electronic device is small, the signal generated by the differential pressure sensor due to the external airflow is easy to be regarded as an effective signal, so that the electronic device is misstarted.

[0005] Therefore, how to avoid the misstart of the electronic device has become a problem to be solved at present. SUMMARY

[0006] The technical problem to be solved by the present application is to provide an electronic device which can avoid the misstart of the electronic device.

[0007] In order to solve the above problems, the present application provides an electronic device, which comprises:

[0008] a main body having an airflow hole;

[0009] a differential pressure sensor packaging structure having a first through hole, the differential pressure sensor packaging structure being in communication with the airflow hole through the first through hole to form an airflow channel;

[0010] at least one air vent hole in communication with the airflow channel and connecting the airflow channel with the outside to reduce the pressure of the airflow channel.

[0011] Further, an annular pad is arranged between the differential pressure sensor packaging structure and the main body, the annular pad has a via hole at the center, and the via hole connects the first through hole and the airflow hole.

[0012] Further, the air vent hole is arranged on the side wall of the first through hole, the via hole or the airflow hole.

[0013] Furthermore, the annular pad has at least one notch, and the notch forms the air leakage hole.

[0014] Furthermore, when the annular pad has a plurality of notches, the plurality of notches are symmetrically arranged with the central axis of the via hole as a symmetry axis.

[0015] Furthermore, along the axial direction of the via hole, in a region corresponding to the notch, the annular pad is partially or completely removed to form the notch.

[0016] Furthermore, in the area corresponding to the notch, the annular pad is completely removed to form the notch, and the bottom of the differential pressure sensor packaging structure has a groove corresponding to the notch, and the groove and the notch serve as the vent hole.

[0017] Furthermore, the bottom of the differential pressure sensor packaging structure has a solder resist layer. In the area corresponding to the notch, the first annular pad is completely removed to form the notch. At least in the area corresponding to the notch, the solder resist layer has a window to serve as the vent hole together with the notch.

[0018] Furthermore, on the annular pad, a blocking block protruding from the annular pad is provided at the edge of the notch.

[0019] Furthermore, in a region corresponding to the notch, the annular pad is completely removed to form the notch, and the main body has a groove corresponding to the notch, and the groove and the notch serve as the air vent.

[0020] Furthermore, the main body surface has a solder resist layer, and in the case where the annular pad is completely removed in the area corresponding to the notch to form the notch, at least in the area corresponding to the notch, the solder resist layer has a window to serve as the vent hole together with the notch.

[0021] Furthermore, the differential pressure sensor packaging structure includes:

[0022] shell;

[0023] a substrate, wherein the edge of the housing is fixed to the front surface of the substrate, forming a first cavity between the edge of the housing and the substrate, and the first through hole passes through the substrate;

[0024] A pressure sensing element is fixed to the front surface of the substrate and is located in the first cavity. The pressure sensing element has a second cavity and a pressure sensing layer. The pressure sensing layer is located between the first cavity and the second cavity. The second cavity is connected to the airflow hole through the first through hole to form the airflow channel.

[0025] Furthermore, the pressure sensing element is connected to the substrate via a sealing layer, and the sealing layer has a through hole, which communicates with the first through hole and the second cavity.

[0026] Furthermore, the air leakage hole is provided on the second cavity or the side wall of the through hole.

[0027] Furthermore, the electronic device is an electronic cigarette.

[0028] The advantage of the present invention is that the pressure of the air flow channel is reduced by utilizing the air leakage hole connected to the air flow channel. Only when the air flow pressure in the air flow channel reaches a higher value, the air flow pressure acting on the pressure difference sensor packaging structure through the first through hole can make the pressure difference detected by the pressure difference sensor packaging structure reach the startup threshold of the electronic device. Only then will the electronic device start, thereby avoiding the electronic device being affected by external interference airflow and mistakenly starting. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figures 1 to 28 It is a structural schematic diagram of the electronic device of the present invention. DETAILED DESCRIPTION

[0030] The specific implementation of the electronic device provided by the present invention is described in detail below with reference to the accompanying drawings.

[0031] First embodiment

[0032] Figure 1 This is a partial cross-sectional structural diagram of the first embodiment of the electronic device of the present invention. Figure 1 The electronic device includes a main body and a differential pressure sensor package structure 2, wherein the differential pressure sensor package structure 2 is disposed on the main body. Specifically, in this embodiment, the main body has a circuit board 1, and the pressure sensor package structure 2 is disposed on the circuit board 1 and electrically connected to the circuit board 1.

[0033] The main body has an air flow hole 10. The air flow hole 10 allows air in the main body to flow toward the pressure sensor package structure 2 through the air flow hole 10. In this embodiment, the air flow hole 10 consists of a section that passes through the circuit board 1 and a section located outside the circuit board 1.

[0034] The pressure sensor packaging structure 2 has a first through hole 20 , which is connected to the air flow hole 10 to form an air flow channel.

[0035] The pressure sensor package 2 includes a substrate 21, a housing 22, and a pressure sensing element 23. The edge of the housing 22 is fixed to the front surface of the substrate 21, forming a first cavity 24 between the housing 22 and the substrate 21. The first through-hole 20 extends through the substrate 21. The pressure sensing element 23 is located within the first cavity 24 and covers the first through-hole 20. A fifth through-hole 25 is also provided in the housing 22, communicating with the first cavity 24.

[0036] Since the pressure sensing element 2 covers the first through hole 20, that is, the pressure sensing element 23 is located between the first cavity 24 and the first through hole 20, the gas pressures in the first cavity 24 and the first through hole 20 act on the pressure sensing element 23 at the same time, so that the pressure finally exerted on the pressure sensing element 23 is the pressure difference between the first cavity 24 and the first through hole 20, so that the detection signal output by the pressure sensing element 23 corresponds to the pressure difference between the first cavity 24 and the first through hole 20. The detection signal output by the pressure sensing element 23 is then calculated by a dedicated integrated circuit chip to obtain the corresponding pressure difference value, thereby realizing the function of the pressure difference sensor packaging structure to detect the pressure difference.

[0037] As described in the background art, when the startup threshold of an electronic device is low, the external airflow makes it easy for the signal generated by the pressure difference sensor packaging structure to be regarded as a valid signal, causing the electronic device to start up by mistake. Therefore, the electronic device of the present invention also includes at least one air vent 3. The air vent 3 is connected to the air flow channel and connects the air flow channel to the outside to reduce the pressure in the air flow channel. Specifically, the air flow direction in the air flow channel can be seen in FIG. Figure 1 As shown by the middle arrow, when air flows through the air flow channel to the pressure sensing element 23, part of the air flow will flow out to the outside through the air bleed hole 3, thereby reducing the actual air flow pressure acting on the pressure sensing element 23 through the first through hole 20. Only when the air flow pressure in the air flow channel reaches a higher value, the air flow pressure acting on the pressure sensing element 23 through the first through hole 20 is large enough, so that the pressure difference between the first cavity 24 and the first through hole 20 reaches the startup threshold of the electronic device. Only then will the electronic device start, thereby preventing the electronic device from being affected by external interference airflow and mistakenly starting.

[0038] The air leakage hole 3 is provided on the side wall of the air flow hole 10. Specifically, in this embodiment, the air leakage hole 3 is provided on the side wall of the air flow hole 10 in the section outside the circuit board 1. The air leakage hole 3 can be connected to the outside of the electronic device through a connecting tube or other structure to achieve the effect of reducing the pressure of the air flow channel. In this embodiment, the electronic device is provided with only one air leakage hole 3, while in other embodiments of the present invention, the electronic device can be provided with multiple air leakage holes 3 on the air flow channel to assist each other and better reduce the pressure of the air flow channel, thereby preventing the electronic device from being affected by external interference airflow and erroneously starting.

[0039] Optionally, an annular pad is provided between the differential pressure sensor package 2 and the main body, with a via hole at its center connecting the first through hole and the airflow hole. The annular pad may be provided at the bottom of the differential pressure sensor package 2, or on the circuit board 1 of the main body, or both.

[0040] In this embodiment, an annular pad is provided on the bottom of the differential pressure sensor package structure 2 and the circuit board of the main body. Figure 2 , which is Figure 1 An enlarged schematic diagram of area A in the middle. A first annular pad 26 is provided at the bottom of the differential pressure sensor package structure 2. The first annular pad 26 is a closed annular configuration with a second through hole 27 at its center. The first annular pad 26 protrudes from the substrate 21 of the differential pressure sensor package structure 2, while in other embodiments, the first annular pad 26 does not protrude from the substrate 21 of the differential pressure sensor package structure 2. The main body has a second annular pad 12. Specifically, the second annular pad 12 is provided on the circuit board 1. The second annular pad 12 is a closed annular configuration with a third through hole 13 at its center. The second through hole 27 and the third through hole 13 constitute the through hole. The second annular pad 12 protrudes from the circuit board 1, while in other embodiments, the second annular pad 12 does not protrude from the circuit board 1.

[0041] The first annular pad 26 and the second annular pad 12 can be welded to each other using solder 4 to secure the differential pressure sensor package 2 to the main body. The first through hole 20, the second through hole 27, the third through hole 13, and the airflow hole 11 are connected to form the airflow channel. This embodiment has the advantage of accurately controlling airflow by adjusting the size and shape of the air vent 3.

[0042] Second embodiment

[0043] Figure 3 This is a partial cross-sectional structural diagram of the second embodiment of the electronic device of the present invention. Figure 3 The difference between the second embodiment and the first embodiment lies in the different positions of the bleed holes 3. Specifically, in this embodiment, the bleed holes 3 are arranged on the sidewall of the section where the airflow hole 10 passes through the circuit board 1. The bleed holes 3 can pass through the circuit board 1 at an angle and communicate with the outside. For example, after the bleed holes 3 pass through the circuit board 1 at an angle, they can communicate with the outside through a connecting tube or other structure, thereby achieving the purpose of reducing the pressure in the airflow channel. The advantage of this embodiment is that the bleed holes 3 are formed by operating the circuit board 1, which is a one-time molding method and easy to operate.

[0044] Third embodiment

[0045] Figure 4 This is a partial cross-sectional structural diagram of the third embodiment of the electronic device of the present invention. Figure 4 The difference between the third embodiment and the first embodiment is that the position of the air bleed hole 3 is different. Specifically, in this embodiment, the air bleed hole 3 is arranged on the side wall of the first through hole 20. The air bleed hole 3 passes through the circuit board 1 along the axial direction perpendicular to the first through hole 20, and is connected to the outside, thereby achieving the purpose of reducing the pressure of the air flow channel. In other embodiments of the present invention, the air bleed hole 3 can also pass through the circuit board 1 obliquely downward in a direction forming an acute angle with the axial direction of the first through hole 20, and is connected to the outside, thereby achieving the purpose of reducing the pressure of the air flow channel. The advantage of this embodiment is that the operation of the air bleed hole 3 can be completed before the differential pressure sensor packaging structure leaves the factory, and there is no need to cooperate in subsequent use and supporting solutions.

[0046] Fourth embodiment

[0047] Figure 5 The fourth embodiment of the differential pressure sensor packaging structure of the electronic device of the present invention is Figure 1 The bottom schematic diagram of area A is shown. Figure 6 It is along Figure 5 For the cross-sectional structural diagram of the middle BB direction, please refer to Figure 5 and Figure 6The difference between the fourth embodiment and the first embodiment is that the position of the air leakage hole 3 is different. Specifically, the air leakage hole 3 is located on the side wall of the second through hole 27. The first annular pad 26 has a first notch 261, and the first notch 261 is the air leakage hole 3. In this embodiment, in the axial direction O along the second through hole 27, in the area corresponding to the first notch, the first annular pad 26 is completely removed to form the first notch 261. That is, in this embodiment, the first annular pad 26 is not a closed figure, but a non-closed figure interrupted by the first notch 261. The first notch 261 serves as the air leakage hole 3 to achieve the purpose of reducing the pressure in the air flow channel. The advantage of this embodiment is that the operation of the first notch 261 can be completed before the differential pressure sensor packaging structure leaves the factory. The operation is simple and does not require additional cost to increase the differential pressure sensor packaging structure.

[0048] Fifth embodiment

[0049] Figure 7 The pressure difference sensor packaging structure of the fifth embodiment of the electronic device of the present invention is Figure 1 The bottom schematic diagram of area A is shown. Figure 8 It is along Figure 7 For the cross-sectional structural diagram of the middle BB direction, please refer to Figure 7 and Figure 8 The fifth embodiment differs from the fourth embodiment in that, in the region corresponding to the first notch, the first annular pad 26 is partially removed to form the first notch 261. That is, in this embodiment, along the axial direction O of the second through-hole 27, in the region corresponding to the first notch, the first annular pad 26 is not completely removed, but only partially removed, with some remaining. For example, in this embodiment, in the region corresponding to the first notch 261, the bottom of the first annular pad 26 is removed, while the top is retained, forming the first notch 261. The first notch 261 serves as the air bleed hole 3 to reduce the pressure in the airflow channel. The advantage of this embodiment is that the first notch 261 can be completed before the differential pressure sensor package structure leaves the factory. Compared to the fourth embodiment, the air bleed hole 3 can be controlled within a relatively small range.

[0050] Sixth embodiment

[0051] Figure 9 The pressure difference sensor packaging structure of the sixth embodiment of the electronic device of the present invention is Figure 1 The bottom schematic diagram of area A is shown. Figure 10 It is along Figure 9 For the cross-sectional structural diagram of the middle BB direction, please refer to Figure 9 and Figure 10The sixth embodiment differs from the fourth embodiment in that, in the area corresponding to the first notch 261, the first annular pad 26 is completely removed to form the first notch 261. A groove corresponding to the first notch 261 is formed at the bottom of the differential pressure sensor package 2. This groove and the first notch 261 serve as the bleed hole 3. Specifically, a groove 211 corresponding to the first notch 261 is formed at the bottom of the substrate 21. The groove 211 is recessed toward the interior of the substrate 21. Together, the groove 211 and the first notch 261 serve as the bleed hole 3, thereby increasing the volume of the bleed hole 3. This embodiment has the advantage that the first notch 261 can be completely removed before the differential pressure sensor package is shipped. Furthermore, compared to the fourth and fifth embodiments, the bleed hole 3 is enlarged, further reducing the pressure in the airflow channel.

[0052] Seventh embodiment

[0053] Figure 11 The pressure difference sensor packaging structure of the seventh embodiment of the electronic device of the present invention is Figure 1 The bottom schematic diagram of area A is shown. Figure 12 It is along Figure 11 For the cross-sectional structural diagram of the middle BB direction, please refer to Figure 11 and Figure 12 The difference between the seventh embodiment and the fourth embodiment is that the bottom of the differential pressure sensor package structure 2 has a solder resist layer 27. In the area corresponding to the first notch 261, the first annular pad 26 is completely removed to form the first notch 261. At least in the area corresponding to the first notch 261, the solder resist layer 27 has a window to serve as the vent 3 together with the first notch 261. Specifically, in this embodiment, the solder resist layer 27 is provided on the bottom of the substrate 21. In the area corresponding to the first notch 261 and the area away from the first annular pad 26 (such as Figure 11 In the solder resist layer 27 (shown as shaded areas), a window is provided to serve as the vent hole 3 together with the first notch 261. In other embodiments of the present invention, the solder resist layer 27 may have a window only in the area corresponding to the first notch 261. This embodiment has the advantage that the first notch 261 can be completed before the differential pressure sensor package is shipped. Furthermore, compared to the fourth and fifth embodiments, the vent hole 3 is enlarged, further reducing the pressure in the airflow channel.

[0054] Eighth embodiment

[0055] Figure 13 The pressure difference sensor packaging structure of the sixth embodiment of the electronic device of the present invention is Figure 1 The bottom schematic diagram of area A is shown. Figure 14 It is along Figure 13For the cross-sectional structural diagram in CC direction, please refer to Figure 13 and Figure 14 The eighth embodiment differs from the seventh embodiment in that a first stopper 262 is provided on the edge of the first notch 261 on the first annular pad 26, protruding from the first annular pad 26. The first stopper 262 limits the height of the solder 4 connecting the first annular pad 26 to the second annular pad 12, thereby limiting the size of the formed vent hole 3 to prevent the vent hole from being too large and affecting the normal operation of the electronic device. Furthermore, the first stopper 262 prevents the solder 4 from flowing toward the window area of ​​the solder resist layer 27, thereby preventing short circuits and other problems.

[0056] Ninth embodiment

[0057] In the first to eighth embodiments, the air leakage hole 3 is provided on the side wall of the first through hole 20 , the second through hole 27 or the air flow hole 11 , while in the ninth embodiment of the present invention, the air leakage hole 3 is provided on the side wall of the third through hole 13 . Figure 15 The circuit board of the ninth embodiment of the electronic device of the present invention is Figure 1 The top schematic diagram of area A is shown. Figure 16 It is along Figure 15 For the cross-sectional structural diagram of the middle BB direction, please refer to Figure 15 and Figure 16 The difference between the ninth embodiment and the first embodiment is that the air leakage hole 3 is arranged on the side wall of the third through hole 13. Specifically, the second annular pad 12 has a second notch 121, and the second notch 121 is the air leakage hole 3. In this embodiment, in the axial direction O along the third through hole 13, in the area corresponding to the second notch 121, the second annular pad 12 is completely removed to form the second notch 121. That is, in this embodiment, the second annular pad 12 is not a closed figure, but a non-closed figure interrupted by the second notch 121. The second notch 121 serves as the air leakage hole 3 to achieve the purpose of reducing the pressure in the air flow channel. The advantage of this embodiment is that the second notch 121 can be formed before the differential pressure sensor packaging structure is combined with the body, which is simpler than operating on the differential pressure sensor packaging structure, and does not require additional operations on the differential pressure sensor packaging structure, saving costs.

[0058] The structure of the first annular pad 26 at the bottom of the differential pressure sensor package structure 2 can be the same as that of the first annular pad 26 of the first to eighth embodiments, and will not be further described. Furthermore, the first notch 261 of the first annular pad 26 can be aligned with the second notch 121 of the second annular pad 12, thereby jointly serving as the vent 3.

[0059] Tenth embodiment

[0060] Figure 17 The circuit board of the tenth embodiment of the electronic device of the present invention is Figure 1 The top schematic diagram of area A is shown. Figure 18 It is along Figure 17 For the cross-sectional structural diagram of the middle BB direction, please refer to Figure 17 and Figure 18 The tenth embodiment differs from the ninth embodiment in that, in the region corresponding to the second notch, the second annular pad 12 is partially removed to form a second notch 121. That is, in this embodiment, in the region corresponding to the second notch 121 along the axial direction O of the third through hole 13, the second annular pad 12 is not completely removed, but only partially removed, with some remaining. For example, in this embodiment, in the region corresponding to the second notch 121, the top of the second annular pad 12 is removed, while the bottom is retained, forming the second notch 121. The second notch 121 serves as the air bleed hole 3 to reduce the pressure in the airflow channel. This embodiment has the advantage that the second notch 121 can be formed before the differential pressure sensor package structure is combined with the body, which is simpler than performing the operation on the differential pressure sensor package structure. Furthermore, compared to the ninth embodiment, the air bleed hole 3 can be controlled to a relatively small range.

[0061] The structure of the first annular pad 26 at the bottom of the differential pressure sensor package structure 2 can be the same as that of the first annular pad 26 of the first to eighth embodiments, and will not be further described. Furthermore, the first notch 261 of the first annular pad 26 can be aligned with the second notch 121 of the second annular pad 12, thereby jointly serving as the vent 3.

[0062] Eleventh embodiment

[0063] Figure 19 The circuit board of the eleventh embodiment of the electronic device of the present invention is Figure 1 The top schematic diagram of area A is shown. Figure 20 It is along Figure 19 For the cross-sectional structural diagram of the middle BB direction, please refer to Figure 19 and Figure 20The eleventh embodiment differs from the ninth embodiment in that, in the area corresponding to the second notch 121, the second annular pad 12 is completely removed to form the second notch 121. A groove corresponding to the second notch 121 is formed at the top and bottom of the circuit board 1. The groove and the second notch 121 serve as the bleed hole 3. Specifically, a groove 100 corresponding to the second notch 121 is formed at the top of the circuit board 1. The groove 100 is recessed toward the interior of the circuit board 1. The groove 100 and the second notch 121 together serve as the bleed hole 3, thereby increasing the volume of the bleed hole 3. The advantage of this embodiment is that the second notch 121 can be formed before the differential pressure sensor package structure is combined with the body, which is simpler than performing the operation on the differential pressure sensor package structure. Furthermore, compared with the ninth and tenth embodiments, the bleed hole 3 is enlarged, further reducing the pressure in the airflow channel.

[0064] The structure of the first annular pad 26 at the bottom of the differential pressure sensor package 2 can be the same as that of the first annular pad 26 of the first to eighth embodiments, and will not be further described. Furthermore, the first notch 261 of the first annular pad 26 can be aligned with the second notch 121 of the second annular pad 12 , and the groove 100 at the top of the circuit board 1 can be aligned with the groove 211 at the bottom of the differential pressure sensor package 2 , thereby jointly serving as the vent 3 .

[0065] Twelfth embodiment

[0066] Figure 21 The circuit board of the twelfth embodiment of the electronic device of the present invention is Figure 1 The top schematic diagram of area A is shown. Figure 22 It is along Figure 21 For the cross-sectional structural diagram of the middle BB direction, please refer to Figure 21 and Figure 22The twelfth embodiment differs from the ninth embodiment in that a solder resist layer 14 is provided on the top of the circuit board 1. In the area corresponding to the second notch 121, the second annular pad 12 is completely removed to form the second notch 121. A window is formed in the solder resist layer 14 at least in the area corresponding to the second notch 121, thereby serving together with the second notch 121 as the air vent 3. Specifically, in this embodiment, the solder resist layer 14 is provided on the top of the circuit board 1. A window is formed in the area corresponding to the second notch 121 and in an area facing away from the second annular pad 12, thereby serving together with the second notch 121 as the air vent 3. In other embodiments of the present invention, the solder resist layer 14 may also have a window only in the area corresponding to the second notch 121. This embodiment has the advantage that the second notch 121 can be formed before the differential pressure sensor package is assembled with the body, which is simpler than performing the operation on the differential pressure sensor package. Furthermore, compared to the ninth and tenth embodiments, the air vent 3 is enlarged, further reducing the pressure in the airflow channel.

[0067] The structure of the first annular solder pad 26 at the bottom of the differential pressure sensor package structure 2 can be the same as that of the first annular solder pad 26 of the first to eighth embodiments, and will not be further described. Furthermore, the first notch 261 of the first annular solder pad 26 can be aligned with the second notch 121 of the second annular solder pad 12, and the window of the solder resist layer 14 at the top of the circuit board 1 can be aligned with the window of the solder resist bead 27 at the bottom of the differential pressure sensor package structure 2, thereby jointly serving as the vent 3.

[0068] Thirteenth embodiment

[0069] Figure 23 The circuit board of the thirteenth embodiment of the electronic device of the present invention is Figure 1 The top schematic diagram of area A is shown. Figure 24 It is along Figure 23 For the cross-sectional structural diagram in CC direction, please refer to Figure 23 and Figure 24 The thirteenth embodiment differs from the twelfth embodiment in that a second stopper 122 is provided on the edge of the second notch 121 on the second annular pad 12, protruding from the second annular pad 12. The second stopper 122 limits the height of the solder 4 connecting the second annular pad 12 to the first annular pad 26, thereby limiting the size of the resulting vent hole 3 to prevent the vent hole from being too large and affecting the normal operation of the electronic device. Furthermore, the second stopper 122 prevents the solder 4 from flowing toward the window area of ​​the solder resist layer 14, thereby preventing short circuits and other problems.

[0070] The structure of the first annular solder pad 26 at the bottom of the differential pressure sensor package 2 can be the same as that of the first annular solder pad 26 in the first to eighth embodiments and will not be further described. Furthermore, the first notch 261 of the first annular solder pad 26 can directly face the second notch 121 of the second annular solder pad 12. The window in the solder resist layer 14 on the top of the circuit board 1 and the window in the solder resist bead 27 at the bottom of the differential pressure sensor package 2 can directly face each other, thereby jointly serving as the vent 3. The second stopper 122 abuts the first stopper 262 to prevent solder from flowing into the window area of ​​the solder resist layer.

[0071] Fourteenth embodiment

[0072] Figure 25 This is a cross-sectional structural diagram of the differential pressure sensor packaging structure of the fourteenth embodiment of the electronic device of the present invention. Figure 25 The pressure sensor packaging structure 2 includes a substrate 21, a housing 22 and a pressure sensing element 23. The edge of the housing 22 is fixed to the front of the substrate 21, and a first cavity 24 is formed between the housing 22 and the substrate 21. The first through hole 20 passes through the substrate 21. The pressure sensing element 23 is fixed to the front of the substrate 21 and is located in the first cavity 24. The pressure sensing element 23 has a second cavity 231 and a pressure sensing layer 232. The pressure sensing layer 232 is located between the first cavity 24 and the second cavity 231. The second cavity 231 is connected to the airflow hole through the first through hole 20 to form the airflow channel. A fifth through hole 25 is also provided on the housing 22, and the fifth through hole 25 is connected to the first cavity 24.

[0073] In this embodiment, the air bleed hole 3 is provided on the side wall of the second cavity 231. Specifically, the pressure sensing element 23 also includes a support structure 233 for supporting the edge of the pressure sensing layer 232. The support structure 233 serves as the side wall of the second cavity 231. The air bleed hole 3 passes through the support structure 233 to communicate with the second cavity 231, and then communicate with the air flow channel, thereby reducing the pressure in the air flow channel. The advantage of this embodiment is that the operation of the air bleed hole 3 can be completed before the pressure differential sensor packaging structure leaves the factory. The operation is simple and does not require additional cost increase for the pressure differential sensor packaging structure. In other embodiments of the present invention, the air bleed hole 3 may not be provided on the side wall of the second cavity 231, but may be provided in the manner shown in Examples 1 to 13.

[0074] Furthermore, the pressure sensing element 23 is connected to the substrate 21 via a sealing layer 28. Specifically, the support structure 233 is connected to the substrate 21 via the sealing layer 28, so that the first cavity 24 and the second cavity 231 are not connected.

[0075] Fifteenth embodiment

[0076] Figure 26 This is a cross-sectional structural diagram of the differential pressure sensor packaging structure of the fifteenth embodiment of the electronic device of the present invention. Figure 26 Compared with the fourteenth embodiment, in this embodiment, the setting position of the air leak hole 3 is changed. Specifically, in this embodiment, the air leak hole 3 is not set on the side wall of the second cavity 231, but is set on the sealing layer 28. The sealing layer 28 has a through hole 29, and the through hole 29 connects the first through hole 20 and the second cavity 231. The air leak hole 3 is set on the side wall of the through hole 29, that is, the air leak hole 3 passes through the sealing layer 28 and is connected to the outside, thereby achieving the purpose of reducing the pressure of the air flow channel. The advantage of this embodiment is that the operation of the air leak hole 3 can be completed before the differential pressure sensor packaging structure leaves the factory. The operation is simple and does not require additional cost increase of the differential pressure sensor packaging structure. Compared with the fourteenth embodiment, there is no need to operate the pressure sensing element 23, but to operate the sealing layer, which can avoid the pressure sensing element 23 from being damaged.

[0077] In this embodiment, the air leakage hole 3 passes through the sealing layer. It can be understood that in other embodiments of the present invention, when the pressure sensor element 23 is fixed on the substrate 21, sealing material may not be provided in the area corresponding to the air leakage hole 3 to form the air leakage hole 3 in the sealing layer.

[0078] In the above embodiments, only one air leakage hole is shown. In other embodiments of the present invention, there may be multiple air leakage holes.

[0079] For example, in the fourth embodiment, the first annular pad 26 has a first notch 261, while in other embodiments, Figure 27 As shown, the pressure difference sensor packaging structure of the sixteenth embodiment of the electronic device of the present invention is Figure 1 As shown in the bottom schematic diagram of area A, in this embodiment, the first annular pad 26 has four first notches 261, and the four first notches 261 can form four air vents. Further, the four first notches 261 are symmetrically arranged with the central axis of the second through hole 27 as the symmetry axis. Figure 28 As shown, the pressure difference sensor packaging structure of the seventeenth embodiment of the electronic device of the present invention is Figure 1As shown in the bottom schematic diagram of area A, in this embodiment, the first annular pad 26 has two first notches 261, which can form two air vents. Furthermore, the two first notches 261 are symmetrically arranged about the central axis of the second through hole 27 to simplify the manufacturing process. It is understood that in other embodiments of the present invention, the number of first notches 261 can also be other, and the present invention is not limited to this.

[0080] For another example, in the ninth embodiment, the second annular pad 12 has one second notch 121 , while in other embodiments, the second annular pad 12 has multiple second notches 121 , the arrangement of which may refer to the arrangement of the first notch 261 .

[0081] For another example, in the fifteenth embodiment, the side wall of the through hole 29 has an air leakage hole 3, while in other embodiments of the present invention, the side wall of the through hole 29 has multiple air leakage holes, and the multiple air leakage holes can be symmetrically distributed with the central axis of the through hole 29 as the symmetry axis.

[0082] The electronic device of the present invention may be an electronic cigarette, wherein the air flow hole may be connected to the atomization channel in the electronic cigarette, so that the pressure difference sensor packaging structure can sense the pressure difference between the atomization channel and the outside world, thereby starting the electronic cigarette.

[0083] The above description is only a preferred embodiment of the present invention. It should be pointed out that ordinary technicians in this technical field can make several improvements and modifications without departing from the principles of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. An electronic device, characterized in that: include: a main body having air flow holes; A differential pressure sensor packaging structure has a first through hole, and the differential pressure sensor packaging structure is connected to the airflow hole through the first through hole to form an airflow channel: the differential pressure sensor packaging structure includes: a housing; a substrate, the edge of the housing is fixed to the front surface of the substrate, and a first cavity is formed between the housing and the substrate, and the first through hole passes through the substrate; a pressure sensing element is fixed to the front surface of the substrate and located in the first cavity, the pressure sensing element has a second cavity and a pressure sensing layer, the pressure sensing layer is located between the first cavity and the second cavity, and the second cavity is connected to the airflow hole through the first through hole to form the airflow channel; at least one air leakage hole, communicating with the air flow channel and connecting the air flow channel with the outside to reduce the pressure of the air flow channel; An annular pad is provided between the differential pressure sensor packaging structure and the main body, the annular pad has a via hole at its center, and the via hole connects the first through hole and the air flow hole; The annular pad has at least one notch, and the notch forms the air leakage hole.

2. The electronic device according to claim 1, wherein When the annular pad has a plurality of notches, the plurality of notches are symmetrically arranged with the central axis of the via hole as a symmetry axis.

3. The electronic device according to claim 1, wherein In the axial direction of the via hole, in the area corresponding to the notch, the annular pad is partially or completely removed to form the notch.

4. The electronic device according to claim 3, wherein: In the area corresponding to the notch, the annular pad is completely removed to form the notch, and the bottom of the differential pressure sensor packaging structure has a groove corresponding to the notch, and the groove and the notch serve as the vent hole.

5. The electronic device according to claim 3, wherein: The differential pressure sensor packaging structure has a solder resist layer at the bottom. In the area corresponding to the notch, the annular pad is completely removed to form the notch. At least in the area corresponding to the notch, the solder resist layer has a window to serve as the vent hole together with the notch.

6. The electronic device according to claim 5, characterized in that On the annular pad, a blocking block protruding from the annular pad is provided at the edge of the notch.

7. The electronic device according to claim 3, wherein: In a region corresponding to the notch, the annular pad is completely removed to form the notch, and the main body has a groove corresponding to the notch, and the groove and the notch serve as the vent hole.

8. The electronic device according to claim 3, wherein: The main body surface has a solder resist layer. In the area corresponding to the notch, the annular pad is completely removed to form the notch. At least in the area corresponding to the notch, the solder resist layer has a window to serve as the vent hole together with the notch.

9. The electronic device according to claim 1, wherein: The pressure sensing element is connected to the substrate via a sealing layer. The sealing layer has a through hole. The through hole communicates with the first through hole and the second cavity.

10. The electronic device according to claim 1, wherein The electronic device is an electronic cigarette.

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