A method for assembling an electrostatic chuck

Abstract

The present invention provides an assembly method of an electrostatic suction cup, comprising: providing a base; fixing a ceramic disc on one side of the base through a first adhesive layer, wherein the flatness of the surface of the ceramic disc away from the base is less than or equal to 2 threads. The base and the ceramic disc are assembled through the first adhesive layer, and during the assembly process, the flatness of the first adhesive layer and / or the ceramic disc itself is controlled to ensure that after the assembly is completed, the flatness of the surface of the ceramic disc away from the base is less than or equal to 2 threads, thereby meeting the flatness requirements required by the process.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor devices, and more specifically, to an assembling method of an electrostatic chuck. Background Art

[0002] The electrostatic adsorption technology used by the electrostatic chuck (ESC) is an advantageous technology that replaces traditional mechanical support and vacuum adsorption methods. It is widely used in semiconductors, panel displays, optics and other fields.

[0003] However, currently after the electrostatic chuck is assembled, the flatness of its ceramic disc cannot meet the process requirements. Summary of the invention

[0004] In view of this, in order to solve the above problems, the present invention provides an assembly method of an electrostatic chuck, and the technical solution is as follows:

[0005] An assembling method of an electrostatic chuck, the assembling method comprising:

[0006] providing a base;

[0007] The ceramic disk is fixed to one side of the base through a first adhesive layer, and the flatness of the surface of the ceramic disk facing away from the base is less than or equal to 2 wires.

[0008] Preferably, in the above assembly method, the ceramic disk is fixed to one side of the base through the first adhesive layer, and the flatness of the surface of the ceramic disk away from the base is less than or equal to 2 degrees, comprising:

[0009] Performing a glue coating process on one side of the base to form the first bonding layer, wherein the flatness of the surface of the first bonding layer away from the base is smaller than the flatness of the surface of the ceramic plate away from the base;

[0010] The ceramic disk is placed on the side of the first bonding layer facing away from the base for pressing.

[0011] Preferably, in the above assembly method, the assembly method further comprises:

[0012] Using a clamp device to fix the base and the ceramic disk;

[0013] Carry out drying and curing treatment.

[0014] Preferably, in the above assembly method, the first bonding layer is formed by applying glue on one side of the base, and the flatness of the surface of the first bonding layer away from the base is less than the flatness of the surface of the ceramic plate away from the base, comprising:

[0015] The first bonding layer is formed by printing and gluing one side of the base using a 300-400 mesh screen, and the flatness of the surface of the first bonding layer away from the base is less than the flatness of the surface of the ceramic disk away from the base.

[0016] Preferably, in the above assembly method, the assembly method further comprises:

[0017] The surface of the ceramic disk facing away from the base is ground.

[0018] Preferably, in the above assembly method, before fixing the ceramic disk, the assembly method further comprises:

[0019] Fixing the heating plate to one side of the base through a second adhesive layer;

[0020] The method of fixing the ceramic disk on one side of the base by the first adhesive layer, and the flatness of the surface of the ceramic disk facing away from the base is less than or equal to 2 degrees, comprises:

[0021] The ceramic disk is fixed to the side of the heating disk away from the base through the first adhesive layer, and the flatness of the surface of the ceramic disk away from the base is less than or equal to 2 wires.

[0022] Preferably, in the above assembly method, fixing the heating plate to one side of the base through the second adhesive layer comprises:

[0023] Performing a glue coating process on one side of the base to form the second bonding layer;

[0024] The heating plate is placed on the side of the second adhesive layer away from the base for pressing, and the flatness of the surface of the second adhesive layer away from the base is smaller than the flatness of the surface of the heating plate away from the base.

[0025] Preferably, in the above assembly method, before fixing the ceramic disk, the assembly method further comprises:

[0026] Using a clamp device to fix the base and the heating plate;

[0027] Carry out drying and curing treatment.

[0028] Compared with the prior art, the present invention has the following beneficial effects:

[0029] The present invention provides an assembly method for an electrostatic suction cup, comprising: providing a base; fixing a ceramic disc on one side of the base through a first adhesive layer, wherein the flatness of the surface of the ceramic disc away from the base is less than or equal to 2 threads. The base and the ceramic disc are assembled through the first adhesive layer, and during the assembly process, the flatness of the first adhesive layer and / or the ceramic disc itself is controlled to ensure that after the assembly is completed, the flatness of the surface of the ceramic disc away from the base is less than or equal to 2 threads, thereby meeting the flatness requirements required by the process. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying creative work.

[0031] Figure 1 A schematic diagram of a flow chart of an assembly method of an electrostatic chuck provided in an embodiment of the present invention;

[0032] Figure 2 A schematic cross-sectional view of the principle structure of an electrostatic chuck provided by an embodiment of the present invention;

[0033] Figure 3 A schematic flow chart of another method for assembling an electrostatic chuck provided in an embodiment of the present invention;

[0034] Figure 4 A schematic flow chart of another method for assembling an electrostatic chuck provided in an embodiment of the present invention;

[0035] Figure 5 A schematic flow chart of another method for assembling an electrostatic chuck provided in an embodiment of the present invention;

[0036] Figure 6 A schematic flow chart of another method for assembling an electrostatic chuck provided in an embodiment of the present invention;

[0037] Figure 7 A cross-sectional schematic diagram of the principle structure of another electrostatic chuck provided by an embodiment of the present invention;

[0038] Figure 8 A schematic flow chart of another method for assembling an electrostatic chuck provided in an embodiment of the present invention;

[0039] Fig. 9 A schematic flow chart of another method for assembling an electrostatic chuck provided in an embodiment of the present invention. DETAILED DESCRIPTION

[0040] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0041] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments.

[0042] refer to Figure 1 , Figure 1 A schematic diagram of a flow chart of an assembly method of an electrostatic chuck provided in an embodiment of the present invention; Figure 2 , Figure 2 A cross-sectional schematic diagram of the principle structure of an electrostatic chuck provided in an embodiment of the present invention.

[0043] like Figure 1 As shown, the assembly method includes:

[0044] S101: Provide a base 11.

[0045] S102: Fixing a ceramic disk 13 on one side of the base 11 through a first adhesive layer 12, wherein the flatness of a surface of the ceramic disk 13 facing away from the base 11 is less than or equal to 2 degrees.

[0046] In this embodiment, the material of the base 11 includes but is not limited to aluminum material. It should be noted that the aluminum material itself has the advantages of light weight, good strength, good corrosion resistance and good processing performance. Therefore, in the embodiment of the present invention, aluminum material is preferably used to make the base 11 of the electrostatic suction cup.

[0047] The base 11 and the ceramic disk 13 are assembled via a first adhesive layer 12. During the assembly process, the flatness of the first adhesive layer 12 and / or the ceramic disk 13 itself is controlled to ensure that after assembly, the flatness of the surface of the ceramic disk 13 away from the base 11 is less than or equal to 2 wires, thereby achieving the flatness requirement required by the process.

[0048] Optionally, in another embodiment of the present invention, refer to Figure 3 , Figure 3 A schematic flow chart of another method for assembling an electrostatic chuck provided in an embodiment of the present invention.

[0049] As an implementation method of step S102 "fixing the ceramic disk 13 on one side of the base 11 through the first adhesive layer 12, and the flatness of the surface of the ceramic disk 13 facing away from the base 11 is less than or equal to 2 degrees", the following steps can be used:

[0050] S103 : performing glue coating on one side of the base 11 to form the first bonding layer 12 , wherein the flatness of the surface of the first bonding layer 12 away from the base 11 is smaller than the flatness of the surface of the ceramic plate 13 away from the base 11 .

[0051] S104: placing the ceramic disk 13 on the side of the first adhesive layer 12 facing away from the base 11 for pressing.

[0052] In this embodiment, the base 11 and the ceramic disk 13 are assembled through the first bonding layer 12. During the assembly process, the flatness of the first bonding layer 12 is controlled to ensure that the flatness of the surface of the ceramic disk 13 away from the base 11 after assembly is less than or equal to 2 wires, thereby achieving the flatness requirement required by the process.

[0053] Specifically, a screen printing technique is used to print and coat one side of the base 11 with a screen of 300-400 mesh to form the first bonding layer 12 . The flatness of the surface of the first bonding layer 12 facing away from the base 13 is less than the flatness of the surface of the ceramic disk 13 facing away from the base 11 .

[0054] For example, when the assembly is completed, the flatness of the surface of the ceramic disk 13 away from the base 11 needs to reach 1.5 lines. Therefore, after the first adhesive layer 12 is formed, the flatness of the surface of the ceramic disk 13 away from the base 11 needs to be at least less than 1.5 lines. Only in this way can it be ensured that the flatness of the surface of the ceramic disk 13 away from the base 11 can reach 1.5 lines after the assembly is completed.

[0055] If the flatness of the surface of the first adhesive layer 12 facing away from the base 11 is greater than 1.5 degrees after it is formed, it means that the flatness of the surface on which the ceramic plate 13 is placed is already very poor. Then, after the ceramic plate 13 is pressed against the first adhesive layer 12, it is difficult to ensure that the flatness of the surface of the ceramic plate 13 facing away from the base 11 can reach 1.5 degrees.

[0056] Optionally, in another embodiment of the present invention, refer to Figure 4 , Figure 4 A schematic flow chart of another method for assembling an electrostatic chuck provided in an embodiment of the present invention.

[0057] The assembly method further comprises:

[0058] S105: using a clamp device to fix the base 11 and the ceramic plate 13.

[0059] S106: performing drying and curing treatment.

[0060] In this embodiment, when the first adhesive layer 12 is a glue layer, it itself has a certain fluidity. After the ceramic disk 13 and the base 11 are bonded together through the first adhesive layer 12, the relative position relationship between the two may change. Therefore, before the first adhesive layer 12 is dried and cured, a clamp device is used to fix the base 11 and the ceramic disk 13 to prevent the relative position relationship between the two from changing, and further ensure that after the assembly is completed, the flatness of the surface of the ceramic disk 13 away from the base 11 can meet the requirement of being less than or equal to 2 silks.

[0061] Optionally, in another embodiment of the present invention, refer to Figure 5 , Figure 5 A schematic flow chart of another method for assembling an electrostatic chuck provided in an embodiment of the present invention.

[0062] The assembly method further comprises:

[0063] S107: Grinding the surface of the ceramic disk 13 that is away from the base 11.

[0064] In this embodiment, after the ceramic disk 13 and the base 11 are bonded and fixed by the first adhesive layer 12, the surface of the ceramic disk 13 facing away from the base 11 can be further ground. For example, the surface of the ceramic disk 13 facing away from the base 11 can be ground in batches using grinding wheels of different mesh sizes to further optimize the flatness of the surface of the ceramic disk 13 facing away from the base 11, and further ensure that the flatness of the surface of the ceramic disk 13 facing away from the base 11 can meet the requirement of being less than or equal to 2 wires after assembly is completed.

[0065] Optionally, in another embodiment of the present invention, refer to Figure 6 , Figure 6 A schematic diagram of a flow chart of another method for assembling an electrostatic chuck provided in an embodiment of the present invention; Figure 7 , Figure 7 A cross-sectional schematic diagram of the principle structure of another electrostatic chuck provided in an embodiment of the present invention.

[0066] Before fixing the ceramic disc, the assembly method further comprises:

[0067] S108: Fixing the heating plate 15 to one side of the base 11 through the second adhesive layer 14;

[0068] Wherein, step S102 fixes the ceramic disk 13 on one side of the base 11 through the first adhesive layer 12, and the flatness of the surface of the ceramic disk 13 away from the base 11 is less than or equal to 2 degrees, including:

[0069] S109: Fix the ceramic plate 13 to the side of the heating plate 15 away from the base 11 through the first adhesive layer 12, and the flatness of the surface of the ceramic plate 13 away from the base 11 is less than or equal to 2 wires.

[0070] In this embodiment, a heating plate 15 is arranged between the ceramic plate 13 and the base 11 to achieve thermal balance treatment of the object sucked by the electrostatic suction cup. For example, when processing the wafer, the wafer is first sucked by the electrostatic suction cup, and then the wafer is processed. However, during the processing of the wafer, the local temperature of the wafer may suddenly change and have a large temperature difference with other areas, thereby affecting the performance of the wafer. Therefore, the heating plate 15 can be used to perform thermal balance treatment on the temperature of each area during the processing of the wafer to improve the processing yield of the wafer.

[0071] Since the assembly process of the heating plate 15 and the base 11 is not completed in the same process as the assembly process of the heating plate 15 and the ceramic plate 13, that is, the two assemblies cannot be completed on the same platform, in order to ensure the flatness requirement of the surface of the ceramic plate 13 away from the base 11 after the electrostatic suction cup is assembled, it is necessary to control the flatness of the second adhesive layer 14 during the assembly process of the heating plate 15 and the base 11 to ensure the flatness of the surface of the heating plate 15 away from the base 11, and further ensure that the flatness of the surface of the ceramic plate 13 away from the base 11 is less than or equal to 2 wires.

[0072] Optionally, in another embodiment of the present invention, refer to Figure 8 , Figure 8 A schematic flow chart of another method for assembling an electrostatic chuck provided in an embodiment of the present invention.

[0073] As an implementation method of step S108 of "fixing the heating plate 15 on one side of the base 11 through the second adhesive layer 14", the following steps may be adopted:

[0074] S110 : performing a glue coating process on one side of the base 11 to form the second adhesive layer 14 .

[0075] S111: Place the heating plate 15 on the side of the second adhesive layer 14 away from the base 11 for pressing, the flatness of the surface of the second adhesive layer 14 away from the base 11 is smaller than the flatness of the surface of the heating plate 15 away from the base 11, which is smaller than the flatness of the surface of the first adhesive layer 12 away from the base 11.

[0076] In this embodiment, the base 11 and the heating plate 15 are assembled via a second adhesive layer 14. During the assembly process, the flatness of the second adhesive layer 14 is controlled to ensure the flatness of the surface of the heating plate 15 away from the base 11, and further ensure that the flatness of the surface of the ceramic plate 13 away from the base 11 is less than or equal to 2 degrees.

[0077] Specifically, the second bonding layer 14 is formed by printing and gluing one side of the base 11 using a lower mesh screen in combination with screen printing technology. The flatness of the surface of the second bonding layer 14 facing away from the base 11 is less than the flatness of the surface of the ceramic plate 13 facing away from the base 11.

[0078] For example, when the assembly is completed, the flatness of the surface of the ceramic disk 13 away from the base 11 needs to reach 1.5 lines. Therefore, after the second adhesive layer 14 is formed, the flatness of the surface away from the base 11 and the flatness of the surface of the heating disk 15 away from the base 11 both need to be at least less than 1.5 lines. Only in this way can it be ensured that the flatness of the surface of the ceramic disk 13 away from the base 11 can reach 1.5 lines after the assembly is completed.

[0079] If the flatness of the surface of the second adhesive layer 14 facing away from the base 11 is greater than 1.5 lines after the second adhesive layer 14 is formed, it is obvious that the flatness of the surface of the heating plate 15 facing away from the base 11 after the heating plate 15 is assembled with the base 11 will also be greater than 1.5 lines, which means that the flatness of the surface on which the ceramic plate 13 is placed is already very poor. Therefore, after the ceramic plate 13 is pressed with the first adhesive layer 12, it is difficult to ensure that the flatness of the surface of the ceramic plate 13 facing away from the base 11 can reach 1.5 lines.

[0080] Optionally, in another embodiment of the present invention, refer to Fig. 9 , Fig. 9 A schematic flow chart of another method for assembling an electrostatic chuck provided in an embodiment of the present invention.

[0081] Before fixing the ceramic disc, the assembly method further comprises:

[0082] S112: using a clamp device to fix the base 11 and the heating plate 15.

[0083] S113: performing drying and curing treatment.

[0084] In this embodiment, when the second adhesive layer 14 is a glue layer, it itself has a certain fluidity. After the heating plate 15 and the base 11 are attached through the second adhesive layer 14, the relative position relationship between the two may change. Therefore, before the second adhesive layer 14 is dried and cured, a clamp device is used to fix the base 11 and the heating plate 15 to prevent the relative position relationship between the two from changing, so as to ensure the flatness of the surface of the heating plate 15 away from the base 11, and further ensure that after the assembly is completed, the flatness of the surface of the ceramic plate 13 away from the base 11 can meet the requirement of being less than or equal to 2 silks.

[0085] The above is a detailed introduction to the assembly method of an electrostatic chuck provided by the present invention. Specific examples are used in this article to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method of the present invention and its core idea. At the same time, for those skilled in the art, according to the idea of ​​the present invention, there will be changes in the specific implementation method and application scope. In summary, the content of this specification should not be understood as limiting the present invention.

[0086] It should be noted that each embodiment in this specification is described in a progressive manner, and each embodiment focuses on the differences from other embodiments, and the same or similar parts between the embodiments can be referred to each other. For the device disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant parts can be referred to the method part description.

[0087] It should also be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that the process, method, article or device that includes a series of elements is inherent to the elements, or also includes elements inherent to these processes, methods, articles or devices. In the absence of further restrictions, the elements defined by the sentence "including a..." do not exclude the presence of other identical elements in the process, method, article or device that includes the elements.

[0088] The above description of the disclosed embodiments enables one skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to one skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A method for assembling an electrostatic chuck, characterized in that: The assembly method comprises: providing a base; The ceramic disk is fixed to one side of the base through a first adhesive layer, and the flatness of the surface of the ceramic disk facing away from the base is less than or equal to 2 wires; The base and the ceramic disk are assembled through a first bonding layer, and during the assembly process, the flatness of the first bonding layer is controlled to ensure that the flatness of the surface of the ceramic disk away from the base after the assembly is completed is less than or equal to 2 threads; The method of fixing the ceramic disk on one side of the base by the first adhesive layer, and the flatness of the surface of the ceramic disk facing away from the base is less than or equal to 2 degrees, comprises: Performing a glue coating process on one side of the base to form the first bonding layer, wherein the flatness of the surface of the first bonding layer away from the base is smaller than the flatness of the surface of the ceramic plate away from the base; Placing the ceramic disc on the side of the first bonding layer away from the base for pressing; The first bonding layer is formed by applying glue on one side of the base, and the flatness of the surface of the first bonding layer away from the base is less than the flatness of the surface of the ceramic plate away from the base, including: A 300-400 mesh screen is used to print and apply glue on one side of the base to form the first bonding layer, wherein the flatness of the surface of the first bonding layer away from the base is less than the flatness of the surface of the ceramic plate away from the base; Wherein, before fixing the ceramic disk, the assembly method further comprises: Fixing the heating plate to one side of the base through a second adhesive layer; The method of fixing the ceramic disk on one side of the base by the first adhesive layer, and the flatness of the surface of the ceramic disk facing away from the base is less than or equal to 2 degrees, comprises: The ceramic plate is fixed to the side of the heating plate away from the base through the first adhesive layer, and the flatness of the surface of the ceramic plate away from the base is less than or equal to 2 silks; The method of fixing the heating plate to one side of the base through the second adhesive layer comprises: Performing a glue coating process on one side of the base to form the second bonding layer; The heating plate is placed on the side of the second adhesive layer away from the base for pressing, the flatness of the surface of the second adhesive layer away from the base is smaller than the flatness of the surface of the heating plate away from the base, and the flatness of the surface of the heating plate away from the base is smaller than the flatness of the surface of the first adhesive layer away from the base.

2. The assembly method according to claim 1, characterized in that: The assembly method further comprises: Using a clamp device to fix the base and the ceramic disk; Carry out drying and curing treatment.

3. The assembly method according to claim 1, characterized in that: The assembly method further comprises: The surface of the ceramic disk facing away from the base is ground.

4. The assembly method according to claim 1, characterized in that: Before fixing the ceramic disc, the assembly method further comprises: Using a clamp device to fix the base and the heating plate; Carry out drying and curing treatment.

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