A chip clamping device suitable for an ultralow temperature environment

Abstract

The application discloses a chip clamping device suitable for an ultralow-temperature environment, which comprises a supporting assembly, a bearing assembly installed on the upper end of the supporting assembly, a bearing surface for bearing a chip, a plurality of fixing assemblies arranged at intervals around the bearing surface, and the fixing assemblies being movable relative to the bearing surface to fix the chip in cooperation with the bearing surface. The supporting assembly, the bearing assembly and the fixing assemblies are all cold-resistant material pieces, and the supporting assembly and the bearing assembly both have low-temperature medium flow channels. The chip clamping device composed of the supporting assembly, the bearing assembly and the plurality of fixing assemblies has a simple structure, avoids the use of a suction cup or a motor structure, and reduces the cost. Moreover, the use of low-temperature resistant materials makes the chip clamping device not easy to be damaged when being immersed in a low-temperature medium.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of chip testing technology, and in particular to a chip clamping device suitable for an ultralow-temperature environment. BACKGROUND

[0002] In the production process of semiconductor chips, chip testing is an important process. After the chip manufacturing is completed, a probe is used to make stable physical contact with each pad on the chip to test its electrical parameter characteristics. Chips that do not meet the electrical parameters are marked and removed in subsequent processes to improve the yield. Different chips for different purposes require different test environments, such as high temperature, high pressure, low temperature, or ultralow temperature environment, etc. The existing chip testing equipment uses a vacuum chuck or a motor-driven mechanism as an actuator clamp, which has the problems of high manufacturing or purchase cost of parts and cannot be directly applied to low-temperature and ultralow-temperature working conditions. To meet the low-temperature or ultralow-temperature environment, especially the ultralow-temperature environment, the chip needs to be immersed in a low-temperature medium together with the clamping device. The existing vacuum chuck or motor-driven mechanism cannot meet this requirement. SUMMARY

[0003] The present application provides a chip clamping device suitable for an ultralow-temperature environment to at least solve the problem of high cost and inability to immerse in a low-temperature medium of the chip testing clamp in the prior art.

[0004] According to an embodiment of the present application, a chip clamping device suitable for an ultralow-temperature environment is provided, which comprises:

[0005] a support assembly;

[0006] a bearing assembly installed on the upper end of the support assembly, the bearing assembly having a bearing surface for bearing a chip;

[0007] a plurality of fixing assemblies arranged at intervals around the bearing surface, the fixing assemblies being movable relative to the bearing surface to fix the chip in cooperation with the bearing surface;

[0008] The support assembly, the bearing assembly, and the fixing assemblies are all cold-resistant material pieces, and the support assembly and the bearing assembly both have low-temperature medium flow channels.

[0009] According to some embodiments of the present application, the cold-resistant material piece comprises a polyetherimide piece.

[0010] According to some embodiments of the present application, the support assembly comprises:

[0011] a hollow base in the shape of a circular truncated cone, the peripheral wall of the base being provided with at least one through slot; and a hollow workbench in the shape of a circular cylinder, one end of the workbench being connected to the base through a flange structure, the workbench and the base being in internal communication.

[0012] According to some embodiments of the present application, the bearing assembly comprises:

[0013] A positioning pedestal, the bottom of which is connected to the other end of the working pedestal, and the top of which is provided with a first recess, the bottom wall of which has a through channel communicating with the inside of the working pedestal;

[0014] A bearing piece, the bottom of which is connected to the top of the positioning pedestal, and the bottom of which is provided with a second recess, the second recess and the first recess defining a containing space, and the bearing surface being located on the top of the bearing piece.

[0015] According to some embodiments of the present application, the bottom of the positioning pedestal is provided with a protruding part, and the other end of the working pedestal is adapted to be sleeved on the protruding part, and the through channel penetrates through the protruding part.

[0016] According to some embodiments of the present application, the central region of the bearing piece is raised to form the bearing surface.

[0017] According to some embodiments of the present application, the fixing assembly comprises:

[0018] A screw, which is connected to the threaded hole on the bearing assembly, the screw being perpendicular to the bearing surface, and the nut of the screw being spaced apart from the bearing assembly;

[0019] A spring, which is sleeved on the screw rod of the screw;

[0020] A pressing piece, which is sleeved on the screw rod and located between the nut and the spring, the free end of the pressing piece being adapted to fix the chip by cooperating with the bearing surface.

[0021] According to some embodiments of the present application, the middle section of the pressing piece is provided with a limiting hole;

[0022] The support assembly is provided with a cooperating hole, and a limiting pin is adapted to pass through the limiting hole and cooperate with the cooperating hole to define the pressing piece.

[0023] According to some embodiments of the present application, the free end of the pressing piece is provided with a stopper on the side facing the bearing surface.

[0024] According to some embodiments of the present application, the bearing surface is provided with a strip-shaped groove, one end of the strip-shaped groove extending to the edge of the bearing surface.

[0025] By using the chip clamping device composed of the support assembly, the bearing assembly and the plurality of fixing assemblies, the structure is simple, the use of the suction cup or the motor structure is avoided, and the cost is reduced. Moreover, the use of the low-temperature resistant material makes the chip clamping device be able to be immersed in the low-temperature medium without being easily damaged.

[0026] The above description is only a summary of the technical solutions of the present application. In order to enable one skilled in the art to better understand the technical means of the present application and implement the same according to the contents of the description, and in order to enable the above and other purposes, features and advantages of the present application to be more apparent and understandable, the following specific embodiments of the present application are described. BRIEF DESCRIPTION OF DRAWINGS

[0027] Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the embodiments. The accompanying drawings are included to provide a description of preferred embodiments, and are not meant to limit the present application. In the drawings:

[0028] Figure 1 is a structural schematic diagram of a chip clamping device suitable for an ultralow-temperature environment in an embodiment of the present application;

[0029] Figure 2 is a structural schematic diagram of a chip supporting table in an embodiment of the present application;

[0030] Figure 3 is a structural schematic diagram of a tablet pressing device in an embodiment of the present application;

[0031] Figure 4 is a structural schematic diagram of a positioning pedestal in an embodiment of the present application;

[0032] Figure 5 is a structural schematic diagram of a work pedestal in an embodiment of the present application;

[0033] Figure 6 is a structural schematic diagram of a base in an embodiment of the present application. DETAILED DESCRIPTION

[0034] Exemplary embodiments of the present application will be described in greater detail below with reference to the accompanying drawings. Although exemplary embodiments of the present application are shown in the drawings, it should be understood that the present application can be implemented in various forms and should not be limited by the embodiments set forth herein. Rather, these embodiments are provided so that the present application can be more thoroughly understood and so that the scope of the present application can be conveyed to those skilled in the art.

[0035] An embodiment of the present application proposes a chip clamping device suitable for an ultralow-temperature environment, comprising:

[0036] A support assembly. The support assembly plays a supporting role in the chip clamping device, and by setting the height of the support assembly, the position of the chip can be determined. The support assembly is suitable for being fixed to a chip testing platform.

[0037] A bearing assembly is installed on the upper end of the support assembly, and the bearing assembly has a bearing surface for bearing the chip.

[0038] A plurality of fixing assemblies are arranged at intervals around the bearing surface, and the fixing assemblies are movable relative to the bearing surface to fix the chip in cooperation with the bearing surface.

[0039] The support assembly, the bearing assembly and the fixing assembly are all made of cold-resistant material, and the support assembly and the bearing assembly both have low-temperature medium flow channels.

[0040] The low-temperature medium flow channels are used to introduce low-temperature medium, so that the low-temperature medium can flow into the chip clamping device to achieve rapid cooling and avoid local overcooling or overheating of the chip clamping device, which can cause large temperature difference and deformation or cracking. The low-temperature medium flow channels can also reduce the overall weight and material consumption of the chip clamping device suitable for an ultralow-temperature environment.

[0041] It should be noted that the ultralow-temperature environment mentioned above can be understood as an environment with a temperature of -200°.

[0042] According to the embodiments of the present application, the chip clamping device composed of the support assembly, the bearing assembly and the plurality of fixing assemblies has a simple structure, avoids the use of a suction cup or a motor structure, and reduces the cost. In addition, the use of low-temperature-resistant material makes the chip clamping device less likely to be damaged when immersed in low-temperature medium.

[0043] On the basis of the above-mentioned embodiments, further variant embodiments are proposed. It should be noted that, in order to make the description brief, only the differences from the above-mentioned embodiments are described in the variant embodiments.

[0044] According to some embodiments of the present application, the cold-resistant material piece includes a polyetherimide piece and / or a polytetrafluoroethylene piece. It can be understood that the support assembly, the bearing assembly and the plurality of fixing assemblies can all be made of polyetherimide material. The support assembly, the bearing assembly and the plurality of fixing assemblies can also all be made of polytetrafluoroethylene material. Of course, part of the support assembly, the bearing assembly and the plurality of fixing assemblies can be made of polyetherimide material, and the rest can be made of polytetrafluoroethylene material.

[0045] According to some embodiments of the present application, the structural components in the chip clamping device will also be subjected to cryogenic treatment after being prepared. In this way, the toughness of the chip clamping device can be improved, the deformation of the clamping device during low-temperature testing can be prevented, and the testing accuracy can be improved.

[0046] According to some embodiments of the present application, the support assembly includes:

[0047] The hollow base 4, as shown in Figure 6 , is in the shape of a circular truncated cone, and the peripheral wall of the base 4 is provided with three through notches 41. The notches 41 connect the hollow area of the base 4 with the outside. When performing ultralow-temperature testing, low-temperature medium flows into the hollow area through the notches 41 to reduce heat loss.

[0048] The hollow workbench 3, as shown in the figure, Figure 5 is cylindrical, and one end of the workbench 3 is connected with the base 4 through a flange structure 32, and the hollow area of the workbench 3 is in communication with the hollow area of the base 4.

[0049] According to some embodiments of the present application, the hollow area of the base 4 and the hollow area of the workbench 3 are both cylindrical passages with the same diameter, and when the base 4 and the flange structure 32 of the workbench 3 are fixedly connected through a screw, the hollow areas of the two form a cylindrical through passage.

[0050] According to some embodiments of the present application, four first through holes 31 are opened on the cylindrical peripheral wall of the workbench 3, the four first through holes 31 are evenly distributed along the peripheral wall of the workbench 3, and the four first through holes 31 are all in communication with the hollow area of the workbench 3 and the outside. The first through hole 31 can facilitate the inflow of low-temperature medium during chip testing, while reducing heat loss.

[0051] According to some embodiments of the present application, the bearing assembly comprises:

[0052] The positioning seat 2, as shown in the figure, Figure 4 The bottom of the positioning seat 2 is connected with the other end of the workbench 3, and the top of the positioning seat 2 is provided with a first groove 22, and the bottom wall of the first groove 22 has a through passage in communication with the inside of the workbench 3.

[0053] The chip supporting table 1, as shown in the figure, Figure 2 The bottom of the chip supporting table 1 is connected with the top of the positioning seat 2, and the bottom of the chip supporting table 1 is provided with a second groove, and the second groove and the first groove 22 define an accommodation space, so that the low-temperature medium flows into the hollow area through the defined accommodation space during ultra-low temperature testing, thereby reducing heat loss. The bearing surface is located at the top of the chip supporting table 1.

[0054] According to some embodiments of the present application, the positioning seat 2 is cylindrical, and the height h1 of the positioning seat 2 satisfies: 0.1d≤h1≤0.12d; and the diameter d2 satisfies: d2≥d+30mm, where d represents the diameter of the chip to be tested. The influence of the deformation of the workpiece in the low-temperature medium on the flatness is avoided.

[0055] According to some embodiments of the present application, the positioning seat 2 is hollow to form a through passage through the positioning seat 2, the diameter d3 of the through passage satisfies the condition: 0.3d≤d3≤0.4d, the upper surface of the positioning seat 2 is provided with an annular first groove 22, the outer diameter d4 of the first groove 22 satisfies: 0.6d≤d4≤0.7d, the inner diameter d5 of the first groove 22 satisfies: 0.45d≤d5≤0.55d, and the height h2 of the first groove 22 satisfies: The width is l2, 0.1d≤l2≤0.15d, and d represents the diameter of the chip to be measured. The workpiece will be slightly deformed in the ultra-low temperature medium, and the precision of the workpiece flatness is ensured, so that the low-temperature medium flows in, and rapid cooling is realized.

[0056] According to some embodiments of the application, the upper surface of the positioning seat 2 is provided with a positioning pin to provide positioning and fixing for the wafer supporting table 1. The upper surface of the positioning seat 2 is provided with three leveling screws evenly distributed in the circumferential direction of the positioning seat 2, which can realize the leveling function for the wafer supporting table 1. The positioning seat 2 and the work seat 3 are connected by screws. The positioning seat 2 and the wafer supporting table 1 are connected by a special-shaped screw 7.

[0057] According to some embodiments of the application, the diameter D of the wafer supporting table 1 satisfies: D≥d+30mm. The height H satisfies: 0.1d≤H≤0.12d. The second groove is annular, and the inner diameter d1 of the second groove satisfies: 0.45d≤d1≤0.55d. The depth h3 of the second groove satisfies: The width l of the second groove satisfies: 0.1d≤l≤0.15d, and d represents the diameter of the chip to be measured. The lower surface of the wafer supporting table 1 is provided with a second groove, which can not only reduce the weight of the wafer supporting table 1, but also reduce the consumption of the low-temperature medium.

[0058] According to some embodiments of the application, referring to Figure 4 , the circumferential wall of the positioning seat 2 is provided with a second through hole 21 for connecting the hollow area of the positioning seat 2 with the outside, which facilitates the rapid inflow of the low-temperature medium during the chip testing.

[0059] According to some embodiments of the application, the bottom of the positioning seat 2 is provided with a protruding part, and the other end of the work seat 3 is adapted to be sleeved on the protruding part, and the through channel penetrates the protruding part.

[0060] According to some embodiments of the application, the central area of the wafer supporting table 1 is raised to form a bearing surface. The bearing surface is used to place the chip to be tested.

[0061] According to some embodiments of the application, the fixing assembly comprises:

[0062] The screw 6 is connected with the threaded hole on the bearing assembly, the screw 6 is perpendicular to the bearing surface, and the threaded nut is spaced apart from the bearing assembly.

[0063] The spring is sleeved on the screw rod of the screw 6.

[0064] The wafer pressing plate 8, referring to Figure 3, is sleeved on the screw and located between the nut and the spring. The free end of the pressing plate 8 is adapted to cooperate with the bearing surface to fix the chip. It can be understood that due to the presence of the spring, the pressing plate 8 can rotate around the screw 6, and can also move along the direction of the screw 6 by compressing or loosening the spring, thereby clamping chips of different thicknesses.

[0065] According to some embodiments of the present invention, the number of the fixing components is 3, and the 3 fixing components are arranged at 120° intervals along the circumferential edge of the bearing surface.

[0066] According to some embodiments of the present invention, there may be two groups of fixing components, and the two groups of fixing components are used to clamp chips of two different sizes.

[0067] For example, the number of fixing components is six and they are divided into two groups. The first group of three fixing components are arranged 120° apart along the circumferential edge of the support surface. The distance between the second group of three fixing components and the center of the support surface is greater than the distance between the first group of three fixing components and the center of the support surface. The second group of three fixing components are arranged 120° apart along the circumferential edge of the wafer stage 1. This allows for clamping of chips of different sizes.

[0068] According to some embodiments of the present invention, the exposed length of the screw 6 is adjustable. By adjusting the exposed length of the screw 6 , the elastic force of the spring on the pressing plate 8 is adjusted, so that the clamping of the pressing plate 8 and the carrier surface to the chip is more firmly.

[0069] According to some embodiments of the present invention, reference Figure 3 A limiting hole 81 is provided in the middle section of the pressing piece 8.

[0070] The support assembly is provided with a matching hole, and the limiting pin 5 is suitable for passing through the limiting hole 81 and matching with the matching hole to limit the position of the pressing piece 8 to remain unchanged relative to the support assembly, preventing the pressing piece 8 from moving when not in use and affecting the test of the chip.

[0071] According to some embodiments of the present invention, reference Figure 3 The free end of the pressing piece 8 is provided with a stop member 83 on one side facing the carrying surface. The stop member 83 is used to contact the chip and cooperate with the carrying surface to clamp the chip.

[0072] According to some embodiments of the present invention, the stopper 83 is an elastic member, such as soft rubber, which can reduce the damage to the chip caused by the contact and compression between the pressing sheet 8 and the chip.

[0073] According to some embodiments of the present invention, reference Figure 2 The carrying surface is provided with a strip groove 11, one end of which extends to the edge of the carrying surface, making it easy to use tools to clamp the chip.

[0074] According to some embodiments of the present application, the bearing surface is circular, suitable for bearing a circular chip, and the upper surface of the bearing surface is provided with a circular mark line, which can provide a position reference when the chip is placed.

[0075] According to some embodiments of the present application, the bearing assembly can also be provided with an electrically controlled heating assembly.

[0076] For example, the bottom of the chip bearing table 1 is provided with a layer of polytetrafluoroethylene wrapped resistance wire heating layer, and the heating switch and heating time can be controlled manually or by an industrial computer. After the test is completed, the function of quickly heating the chip bearing table 1 can be realized, which effectively prevents the chip wafer and the chip surface from being damaged due to condensation on the surface after the chip wafer and the chip surface are separated from the low-temperature medium, and also shortens the chip replacement time and improves the test efficiency.

[0077] In the following, a chip clamping device suitable for an ultra-low temperature environment is described in detail with a specific embodiment. It should be understood that the following description is only exemplary and is not a specific limitation of the present application. Any similar structure and similar changes thereof shall be included in the protection scope of the present application.

[0078] In this embodiment, referring to Figure 1 , the chip clamping device suitable for an ultra-low temperature environment comprises:

[0079] a hollow base 4, referring to Figure 6 , which is cylindrical, and the bottom surface of the base 4 is provided with a slot 41 communicating with the hollow area and the outside.

[0080] a hollow workbench 3, referring to Figure 5 , which is cylindrical, and the sidewall of the workbench 3 is provided with a first through hole 31, and the bottom of the workbench 3 is provided with a flange structure 32, which is fixed to the upper surface of the base 4 by screws, so that the hollow areas of the base 4 and the workbench 3 form a through channel.

[0081] a hollow positioning seat 2, referring to Figure 4 , which is provided with an annular first groove 22 on the upper surface of the positioning seat 2, and a second through hole 21 connecting the hollow area of the positioning seat 2, the first groove 22 and the outside. The positioning seat 2 is fixed to the upper end of the workbench 3 by screws, so that the hollow areas of the positioning seat 2 and the workbench 3 form a through channel.

[0082] a chip bearing table 1, referring to Figure 2 , the center part of the upper surface of the chip bearing table 1 is raised to form a circular bearing surface, and the bearing surface is provided with a chip positioning reference line and a strip-shaped groove 11, and the strip-shaped groove 11 is provided to facilitate clamping and placing the chip. The chip bearing table 1 is fixed to the upper end of the positioning seat 2 by a special screw 7, and a plurality of screw holes and matching holes are provided along the edge of the upper surface of the chip bearing table 1 in the circumferential direction.

[0083] 6 tablets 8, such as Figure 3 As shown, one end of the pressing sheet 8 is provided with a through hole 82 for fixing the pressing sheet 8 to the edge of the sheet support table 1 close to the bearing surface by means of screws 6. Figure 1 , three of the pressing plates 8 are closer to the bearing surface, while the other three are farther away. A rubber stopper 83 is provided on the other end of the pressing plate 8, facing the plate support 1. A limit hole 81 is provided at the middle end of the pressing plate 8, which is used to cooperate with the limit pin 5 and the matching hole to limit the position of the pressing plate 8. The pressing plate 8 can rotate around the screw 6, and the stoppers 83 of all six pressing plates 8 can be rotated above the bearing surface.

[0084] The screw 6, the part of the screw rod close to the nut is a plain rod without threads, and the pressing sheet 8 is fixed to the wafer support table 1 by the screw 6. The length of the screw 6 exposed from the wafer support table 1 is adjustable.

[0085] The spring is sleeved on the polished rod portion of the screw 6 , one end of the spring contacts the pressing piece 8 , and the other end contacts the sheet support platform 1 .

[0086] The above materials can all be made of polytetrafluoroethylene and have been cryogenically treated.

[0087] When using a chip clamping device to test a chip, fix the chip clamping device to the test platform. Select different positions of the pressing piece 8 according to the size of the chip to be tested to fix the chip. Place the chip to be tested on the carrying surface according to the reference line, remove the limit pin 5 of the pressing piece 8 to be used, rotate the pressing piece 8 so that the stop member 83 of the pressing piece 8 contacts the chip, and through the elastic force of the spring, the pressing piece 8 cooperates with the carrying surface to fix the chip to the carrying surface. Add a low-temperature medium to the test platform so that the test environment is about minus 200°C. The low-temperature medium can quickly flow in through the hollow channel and notch of the clamping device to achieve ultra-low temperature testing of the chip. After the test is completed, rotate the pressing piece 8 to keep the stop member 83 away from the chip, and then take out the chip.

[0088] The chip clamping device, constructed from cryogenically resistant materials, employs an embodiment of the present invention and features a simple structure, economical durability, and ease of use. The clamping operation for chip testing is simple, enabling secure clamping of chips of varying sizes without requiring suction cups or motors, thus reducing costs. Furthermore, the use of cryogenically resistant materials allows the chip clamping device to withstand immersion in low-temperature media without damage.

[0089] It should be noted that the above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Those skilled in the art will readily appreciate that the present invention is susceptible to various modifications and variations, and that the various embodiments may be freely combined. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention are intended to be within the scope of protection of the present invention.

[0090] It should be noted that in the description of the specification, the known methods, structures and techniques are not shown in detail in order not to obscure the understanding of the specification.

[0091] The illustrated part is used as a reference for understanding the technical solution, and is not a limitation of the technical solution. The specific technical solution is described in the text part of the specification.

Claims

1. A chip clamping device suitable for ultra-low temperature environment, characterized in that: include: Support components; A carrying assembly is mounted on the upper end of the supporting assembly, and the carrying assembly has a carrying surface for carrying a chip; A plurality of fixing components are arranged at intervals around the carrying surface, and the fixing components are movable relative to the carrying surface to cooperate with the carrying surface to fix the chip; The supporting assembly, the bearing assembly and the fixing assembly are all made of cold-resistant materials, and the supporting assembly and the bearing assembly are both provided with a low-temperature medium circulation channel; The chip clamping device is used to be immersed in a low-temperature medium; The support assembly comprises: The hollow base is in the shape of a truncated cone, and the peripheral wall of the base is provided with at least one through-notch; the hollow workbench is in the shape of a cylinder, one end of the workbench is connected to the base through a flange structure, and the workbench is in communication with the interior of the base; The bearing assembly includes: A positioning base, the bottom of which is connected to the other end of the work base, the top of the positioning base is provided with a first groove, and the bottom wall of the first groove has a through passage communicating with the interior of the work base; The wafer support platform has a bottom connected to the top of the positioning base, and a second groove is provided at the bottom of the wafer support platform. The second groove and the first groove define a accommodating space, and the bearing surface is located at the top of the wafer support platform.

2. The chip clamping device suitable for ultra-low temperature environment according to claim 1, characterized in that: The cold-resistant material piece includes a polyetherimide piece.

3. The chip clamping device suitable for ultra-low temperature environment according to claim 1, characterized in that: A protrusion is provided at the bottom of the positioning seat, the other end of the working seat is adapted to be sleeved on the protrusion, and the through passage passes through the protrusion.

4. The chip clamping device suitable for ultra-low temperature environment according to claim 1, characterized in that: The central area of ​​the wafer stage is raised to form the carrying surface.

5. The chip clamping device suitable for ultra-low temperature environment according to claim 1, characterized in that: The fixing assembly includes: a screw, engaged with a threaded hole on the bearing assembly, wherein the screw is perpendicular to the bearing surface, and the threaded nut is spaced apart from the bearing assembly; a spring, sleeved on the screw rod of the screw; A pressing sheet is sleeved on the screw and located between the nut and the spring, wherein the free end of the pressing sheet is adapted to cooperate with the bearing surface to fix the chip.

6. The chip clamping device suitable for ultra-low temperature environment according to claim 5, characterized in that: The middle section of the pressing sheet is provided with a limiting hole; The support assembly is provided with a matching hole, and the limiting pin is adapted to pass through the limiting hole and match with the matching hole to limit the pressing sheet.

7. The chip clamping device suitable for ultra-low temperature environment according to claim 5, characterized in that: A stop member is provided on one side of the free end of the pressing sheet facing the bearing surface.

8. The chip clamping device suitable for ultra-low temperature environment according to claim 1, characterized in that: The bearing surface is provided with a strip groove, and one end of the strip groove extends to the edge of the bearing surface.

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