Optical Component and Its Manufacturing Method

Abstract

The present invention relates to an optical component and a manufacturing method thereof. The optical component includes a substrate and a first film layer; wherein, the substrate has a rough first surface, the average roughness Ra of the first surface is 1 μm to 100 μm, and Ra is less than 1 / 2 of the thickness of the substrate; the first film layer is attached to the first surface. While ensuring the antireflection performance, the structure and manufacturing process are simpler.

Description

Technical Field

[0001] The present invention relates to the field of optical technologies, and particularly to an optical component and a manufacturing method thereof. Background Art

[0002] Anti-reflection refers to reducing or eliminating the reflected light on the surface of an optical component, thereby increasing the light transmittance of the optical component and reducing or eliminating the stray light of the system. For electronic products such as mobile phones and displays, an effective anti-reflection device is required to reduce the reflectivity, so as to achieve the purpose of making the edges of the electronic products present a "one-piece black" appearance. "One-piece black" can make the appearance of the electronic product uniformly black and look more beautiful. At the same time, with the wide application of flexible screens and folding screens in electronic products, "one-piece black" can also make the creases generated when the flexible screen and folding screen are bent or folded look less obvious.

[0003] Traditional anti-reflection devices usually include a substrate and an optical coating and a hard layer laminated on the substrate. In the research and development of its anti-reflection effect, one of the main directions is to coat a low-refractive-index optical coating on the surface of the substrate. The refractive index of this optical coating generally ranges between 1.35 and 1.40. Since light passes through different substances and the refractive indices between them are different, according to Snell's law, light will undergo refraction and reflection (as Figure 1 shown), however, the theoretical calculation of the reflectivity is only related to the refractive index. The calculation formula for the reflectivity R (Reflectivity) is Therefore, simply reducing the reflectivity by changing the refractive index of the material (N 1 ) has physical limitations, the reduction amplitude of the reflectivity is limited, and the low-refractive-index coating is not scratch-resistant and is prone to embrittlement. An additional coating process will be added during construction. In addition, the sources of low-refractive-index coating materials are few and the prices are high, and further screening is required to meet the adhesion to the following coating or substrate, and the selectable materials are very limited.

[0004] In addition, there is also a method to further roughen the optical coating with anti-reflection effect. Although this method can obtain a lower reflectivity, there are still problems such as the need to use a specific material for the optical coating and the increase in the coating process. Summary of the Invention

[0005] Based on this, the present invention provides an optical component and a manufacturing method thereof with a simpler structure and manufacturing process while ensuring the anti-reflection performance.

[0006] In the first aspect of the present invention, an optical component is provided, including a substrate and a first film layer;

[0007] Wherein, the substrate has a rough first surface, the average roughness Ra of the first surface is 1 μm to 100 μm, and Ra is less than 1 / 2 of the thickness of the substrate;

[0008] The first film layer is attached to the first surface.

[0009] In one embodiment, Ra is less than 1 / 3 of the thickness of the substrate.

[0010] In one embodiment, Ra is 25 μm to 50 μm.

[0011] In one embodiment, the thickness of the substrate is 50 μm to 500 μm.

[0012] In one embodiment, the protrusions and depressions on the first surface are arranged irregularly.

[0013] In one embodiment, the Tg of the material of the substrate is 80 °C to 300 °C.

[0014] In one embodiment, the thickness of the first film layer is 2 μm to 10 μm.

[0015] In one embodiment, by mass percentage, the raw materials for preparing the first film layer include:

[0016] 20% to 40% of acrylic resin oligomer, 10% to 20% of photocurable active diluent, 1% to 5% of photoinitiator, 1.5% to 8% of additive, and 50% to 70% of solvent.

[0017] In one embodiment, anti-reflection particles accounting for 1% to 20% of the mass percentage of the hard film layer are dispersed in the hard film layer.

[0018] In one embodiment, by mass percentage, the anti-reflection particles include 48% to 52% of the first anti-reflection particles, 28% to 32% of the second anti-reflection particles, and 18% to 22% of the third anti-reflection particles;

[0019] Wherein, the particle size of the first anti-reflection particles is ≥50 nm and ≤100 nm;

[0020] The particle size of the second anti-reflection particles is ≥20 nm and <50 nm;

[0021] The particle size of the third anti-reflection particles is <20 nm.

[0022] In the second aspect of the present invention, a method for manufacturing the optical component is provided, including the following steps:

[0023] The substrate is roll-pressed with a heated hot press roller to form the first surface;

[0024] The material of the first film layer is coated on the first surface and cured to form the first film layer.

[0025] In one embodiment, the temperature of the hot press roller is heated to 70°C to 150°C.

[0026] In a third aspect of the present invention, an electronic device is provided, including a main body and an antireflection device fitted to the main body, and the antireflection device is the optical component as described above.

[0027] In one embodiment, the antireflection device is a protective cover plate.

[0028] The above optical component directly forms a first surface with a specific size and rough morphology on the substrate. Through this rough morphology, the purpose of destroying the reflected light can be achieved, ensuring the antireflection rate function of the optical component. At the same time, there is no need to design an additional antireflection layer in terms of structure, breaking through the limitation of the small optional range of low-refractive-index materials, and also simplifying the manufacturing process of the optical component, having relatively wide application value.

[0029] At the same time, during the research process, it was also found that based on the rough morphology of the first surface of the substrate, the contact area between the first film layer and the substrate increases, which can effectively improve the adhesion ability between the first film layer and the substrate, and can also reduce the internal stress during its internal bending, making the optical component have good bending resistance. Thus, it effectively solves the problem that the traditional antireflection coating directly applied to a flexible screen or a foldable screen will crack after bending or folding for a period of time, and is applicable to flexible screens, foldable screens, etc. of electronic devices.

[0030] In addition, the above optical component also has a high light transmittance and a low haze. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 It is a schematic diagram of refraction and reflection of light passing through a medium;

[0032] Figure 2 It is a schematic structural diagram of an optical component in an embodiment of the present invention;

[0033] Figure 3 It is a schematic diagram of the antireflection principle of an optical component in an embodiment of the present invention;

[0034] Figure 4 It is a processing schematic diagram of step S1 of the manufacturing method of an optical component in an embodiment of the present invention;

[0035] Figure 5 It is a schematic diagram of the substrate after processing in step S1 of the manufacturing method of an optical component in an embodiment of the present invention. Detailed Embodiments

[0036] The following further elaborates on the optical component of the present invention and its manufacturing method in conjunction with specific embodiments. The present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, these embodiments are provided to make the disclosure of the present invention more thorough and comprehensive.

[0037] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field to which the present invention belongs. The terms used in the description of the present invention herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention.

[0038] In the present invention, "one or more" refers to any one, any two, or any two or more of the listed items.

[0039] In the present invention, "the first aspect", "the second aspect", "the third aspect", "the fourth aspect", "the fifth aspect", etc. are only for descriptive purposes and should not be construed as indicating or implying relative importance or quantity, nor should they be construed as implicitly indicating the importance or quantity of the indicated technical features. Moreover, "the first", "the second", "the third", "the fourth", "the fifth", etc. only serve the purpose of non-exhaustive enumerative description and should be understood not to constitute a closed limitation on quantity.

[0040] In the present invention, among the technically characterized features described in an open-ended manner, there are included closed technical solutions composed of the listed features, as well as open technical solutions containing the listed features.

[0041] In the present invention, regarding numerical ranges, unless otherwise specified, the above numerical ranges are considered continuous and include the minimum and maximum values of the range, as well as each value between such minimum and maximum values. Further, when the range refers to integers, it includes each integer between the minimum and maximum values of the range. In addition, when multiple ranges are provided to describe features or characteristics, these ranges can be combined. In other words, unless otherwise specified, all ranges disclosed herein should be understood to include any and all sub-ranges subsumed therein.

[0042] In the present invention, regarding the percentage content, unless otherwise specified, for solid-liquid mixtures and solid-solid mixtures, it refers to the mass percentage, and for liquid-liquid mixtures, it refers to the volume percentage.

[0043] In the present invention, regarding the percentage concentration, unless otherwise specified, it refers to the final concentration. The final concentration refers to the proportion of the added component in the system after adding the component.

[0044] In the present invention, the temperature parameter, without special limitation, allows both constant temperature treatment and treatment within a certain temperature range. The constant temperature treatment allows the temperature to fluctuate within the accuracy range controlled by the instrument.

[0045] In the present invention, "attached to the surface of..." can mean direct contact with the attachment object or indirect contact with the attachment object, that is, connection is achieved through other intermediate structures.

[0046] In the present invention, "Tg" refers to the glass transition temperature of the material.

[0047] In the present invention, "oligomer" refers to a polymer composed of a relatively small number of repeating units, and its relative molecular mass is between that of small molecules and high polymers. Without limitation, the "oligomer" in the present invention refers to a polymer composed of 10 to 20 repeating units.

[0048] The present invention provides an optical component, as Figure 2 shown, comprising a substrate 100 and a first film layer 200;

[0049] Wherein, the substrate 100 has a rough first surface 101, the average roughness Ra of the first surface 101 is 1 μm to 100 μm, and Ra is less than 1 / 2 of the thickness of the substrate 100; the first film layer 200 is attached to the first surface 101.

[0050] It can be understood that the thickness of the substrate 100 refers to the distance between the bottom surface of the substrate 100 and the top end of the rough first surface 101.

[0051] Without limitation, the first film layer 200 can be any functional film layer on the surface of the substrate of the electronic device, which is set according to the different electronic devices. Further, the first film layer 200 is not an optical coating.

[0052] In one specific example, the first film layer 200 is a protective film layer, that is, it provides an encapsulation and protection function for the substrate 100. Further, the first film layer 200 is a hard layer.

[0053] Without limitation, referring to Figure 3 , the anti-reflection principle of the above optical component is as follows:

[0054] When light enters the substrate 100 with a rough first surface 101, it can disrupt the light traveling path and change the light reflection path. Especially when the incident light is close to perpendicular to the interface, the light path will move forward and refract. At the same time, since the original traveling direction of the light is changed, the energy of the light is also attenuated, and the energy of the reflected light is also reduced. Thus, the purpose of anti-reflection can be achieved.

[0055] The first surface 101 of the above optical component requires reasonable control of the size of its rough morphology. When Ra is too large, that is, when the surface has large undulations, since the glue used for the hard layer is usually viscous, it is difficult to reach the bottom part during glue coating and cannot completely cover the first surface, resulting in voids. This will cause two problems: (1) The voids mean incomplete adhesion, and the voids may be randomly distributed or of different sizes, resulting in non-uniformity and other abnormalities in appearance, affecting the user experience; (2) What may exist in the voids is air (bubbles) or other small foreign objects (impurities). These voids will change the refraction and reflection of light, and abnormalities in appearance will be found under special inspection light sources, presenting an uneven visual effect. At the same time, too large Ra will also lead to an increase in haze and a decrease in transmittance. When Ra is too small, since the wavelength range of light is 380nm - 780nm, if the size is smaller than one wavelength of light, the complete behavior of one wavelength of light cannot be reflected, increasing the proportion of reflected light, affecting the antireflection effect, and it is also difficult to achieve in the manufacturing process. The fine processing also increases the production cost. In addition, Ra needs to be less than 1 / 2 of the thickness of the substrate 100. In this way, while achieving the antireflection effect, the support of the substrate is ensured.

[0056] Specifically, Ra includes but is not limited to: 1μm, 5μm, 10μm, 12μm, 20μm, 23μm, 25μm, 27μm, 30μm, 30μm, 35μm, 37μm, 40μm, 43μm, 45μm, 47μm, 50μm, 60μm, 70μm, 80μm, 100μm. Further, Ra is 25μm - 50μm. More specifically, Ra is 35μm - 40μm.

[0057] In one specific example, Ra is less than 1 / 3 of the thickness of the substrate 100.

[0058] In one specific example, the protrusions and depressions on the first surface 101 are arranged irregularly. When the optical component is applied to the outermost protective cover plate of a flexible or foldable display panel, since it is closer to the user's eyes, if a regular arrangement is adopted, it is easy to generate interference phenomena with the pixels on the display screen. These interference phenomena will significantly affect the appearance of the product and are difficult to be accepted by users.

[0059] In one specific example, the thickness of the substrate 100 is 50 μm to 500 μm. If the thickness of the substrate 100 is too thin, the flatness will be poor, and it is prone to cracking, resulting in a low product yield; if the thickness is too thick, the material cost and weight will increase, and the appearance will become opaque. Specifically, the thickness of the substrate 100 includes but is not limited to: 50 μm, 80 μm, 100 μm, 150 μm, 160 μm, 170 μm, 185 μm, 188 μm, 190 μm, 200 μm, 250 μm, 300 μm, 400 μm, 500 μm.

[0060] In one specific example, the Tg of the material of the substrate 100 is 80 °C to 300 °C. Further, the Tg of the material of the substrate 100 is 100 °C to 170 °C. If the Tg temperature is too low, the substrate is prone to deformation at a relatively low temperature. When the ambient temperature is slightly higher, it will cause slight deformation of the surface morphology of the substrate 100, affecting its optical properties; if the Tg temperature is too high, a higher processing temperature is required during the production of the optical component, the available equipment is limited, and the energy consumption increases.

[0061] Without limitation, the material of the substrate 100 is polyimide (CPI), polyethylene terephthalate (PET), triacetyl cellulose (TAC), glass (such as ultra-thin glass UTG), polycarbonate (PC), or polymethyl methacrylate (PMMA). Among them, PET is mainly used as the outermost protective cover plate of the flexible folding display panel; CPI is mainly used as the outermost protective cover plate of the flexible folding display panel; TAC is mainly used as the outermost protective cover plate of sunglasses; UTG is mainly used as the outermost protective cover plate of the flexible folding display panel. PC is mainly used as the outermost protective cover plate of the liquid crystal display (TFT-LCD) panel. PMMA is mainly used as the outermost protective cover plate of the liquid crystal display (TFT-LCD) panel.

[0062] In one specific example, the thickness of the first film layer 200 is 2 μm to 10 μm. It can be understood that the thickness of the first film layer 200 refers to the distance between the surface of the first film layer 200 and the top of the rough first surface 101. Specifically, the thickness of the first film layer 200 includes but is not limited to: 2 μm, 5 μm, 6 μm, 7 μm, 8 μm, 9 μm, 10 μm.

[0063] In one specific example, by mass percentage, the raw materials for preparing the first film layer 200 include:

[0064] 20% to 40% of acrylic resin oligomer, 10% to 20% of photocurable active diluent, 1% to 5% of photoinitiator, 1.5% to 8% of additive, and 50% to 70% of solvent.

[0065] Among them, without limitation, the functionality of the acrylic resin oligomer is 6 to 15 functional groups, and it can be selected from one or more of polyether-type polyurethane acrylate oligomers, polyester-type polyurethane acrylate oligomers, polycarbonate-type polyurethane acrylate oligomers, aliphatic polyurethane acrylate oligomers, silicone-modified polyurethane acrylate oligomers, fluorine-modified polyurethane acrylate oligomers, epoxy-modified polyurethane acrylate oligomers, and polyester acrylate oligomers.

[0066] Without limitation, the functionality of the photocurable active diluent is mainly 2 to 6 functional groups, and it can be selected from one or more of pentaerythritol triacrylate, pentaerythritol tetraacrylate, dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate, trimethylolpropane triacrylate, ethoxylated trimethylolpropane triacrylate, trimethylolpropane trimethacrylate, 1,6-hexanediol di(meth)acrylate, trimethylolpropane triacrylate, trimethylolpentane trimethacrylate, trimethylolpropane pentaerythritol triacrylate, propoxylated neopentyl glycol diacrylate, ethoxylated 1,6-hexanediol diacrylate, and tris(2-acryloyloxyethyl) isocyanurate.

[0067] Without limitation, the photoinitiator can be selected from one or more of 1-hydroxycyclohexyl phenyl ketone (photoinitiator 184), 2-hydroxy-2-methyl-1-phenyl-1-propanone (photoinitiator 1173), 2,4,6-trimethylbenzoyl-diphenylphosphine oxide (photoinitiator TPO), and 2-hydroxy-4-(2-hydroxyethoxy)-2-methylpropiophenone (photoinitiator 2959).

[0068] Without limitation, the additive can be selected from one or more of inorganic nanomaterials and fluorosilicon additives.

[0069] Without limitation, the solvent can be selected from one or more of ethyl acetate, butyl acetate, methyl ethyl ketone, methyl isobutyl ketone, propylene glycol methyl ether, and propylene glycol methyl ether acetate.

[0070] In one specific example, the raw materials for preparing the first film layer 200 may further include antireflection particles, so as to further enhance the antireflection effect. The materials of the antireflection particles include, but are not limited to, one or more of silica and titanium dioxide.

[0071] Furthermore, reasonably control the proportion of the antireflection particles in the hard film layer, and adopt a reasonable grading of three antireflection particles with different particle sizes, so that the optical component can have a better antireflection effect while not affecting its bending resistance.

[0072] In one specific example, the first film layer 200 is dispersed with antireflection particles accounting for 1% to 20% of the mass percentage of the first film layer 200.

[0073] In one specific example, by mass percentage, the antireflection particles include 48% to 52% of first antireflection particles, 28% to 32% of second antireflection particles, and 18% to 22% of third antireflection particles;

[0074] Among them, the particle size of the first antireflection particles is ≥50 nm and ≤100 nm;

[0075] The particle size of the second antireflection particles is ≥20 nm and <50 nm;

[0076] The particle size of the third antireflection particles is <20 nm; further, the particle size of the third antireflection particles is ≥10 μm and <20 nm.

[0077] The present invention also provides a method for manufacturing the optical component, including the following steps:

[0078] S1: Roll the substrate 100 with a heated hot pressing roller to form a first surface 101;

[0079] S2: Coat the material of the first film layer on the first surface 101 and cure to form the first film layer 200.

[0080] Specifically, as Figure 4 shown, in step S1, the hot pressing roller has a surface topography corresponding to the required first surface 101. By heating and rolling the substrate 100, the flatness of the substrate 100 is damaged to form the first surface 101. The rolled substrate 100 is as Figure 5 shown.

[0081] Without limitation, the method for obtaining the surface topography of the hot pressing roller includes the following steps:

[0082] First, electroplate a layer of copper on the surface of the hot pressing roller. The longer the electroplating time, the thicker this layer of copper will be. How thick to electroplate depends on the surface topography requirements of the hot pressing roller and can be set to 50 μm to 200 μm; after electroplating is completed, use a precision machining instrument equipped with machining components such as diamond knives to engrave the required shape and depth (Ra) on the electroplated copper layer.

[0083] Understandably, the temperature of the hot pressing roller can be set according to the different Tg points of different base material 100 materials for rolling, so that slight thermal deformation appears on the surface of the base material 100, and the morphology of the required first surface 101 can be achieved. In one specific example, the temperature of the hot pressing roller is heated to 70°C to 150°C. Further, for TAC, PET or PMMA, the temperature of the hot pressing roller is heated to 80°C to 130°C, for CPI or UTG, the temperature of the hot pressing roller is heated to 100°C to 150°C, and for PC, the temperature of the hot pressing roller is heated to 70°C to 120°C. Too high a temperature may cause overall deformation of the base material 100 and even damage the structure of the base material 100, while too low a temperature cannot cause deformation of the surface of the base material 100.

[0084] Specifically, in step S2, the material of the first film layer 200 is coated on the first surface 101, and after curing, the first film layer 200 is formed, and the optical component as shown in Figure 2 is prepared.

[0085] The present invention also provides an electronic device, including a main body and an antireflection device embedded in the main body, and the antireflection device is the above optical component. Further, the electronic device can be, for example, a mobile phone or a display.

[0086] In one specific example, the antireflection device is a protective cover plate. Further, the protective cover plate is a screen cover plate.

[0087] The following are specific embodiments.

[0088] The glue composition for forming the hard layer in the embodiment is as follows:

[0089] Jieshida DSP-552F (6-functional fluorine-modified polyurethane acrylate oligomer) 15%, Changxing Chemical 6195-100 (10-functional aliphatic polyurethane acrylate oligomer) 10%, dipentaerythritol hexaacrylate 10%, photoinitiator 2959 2%, NANOBYK-3605 (inorganic nanomaterial) 2.5%, Shin-Etsu KY-1203 (fluorosilicon additive) 1%, propylene glycol methyl ether 20% and butyl acetate 39.5%.

[0090] The optical components provided in Examples 1 to 5 and Comparative Example 2 are manufactured as follows:

[0091] (1) According to Table 1, using PET with a thickness of 188 μm as the base material, the hot pressing roller is heated to the temperature in Table 1 and then the base material is rolled to form a first surface, and its Ra is as shown in Table 1;

[0092] (2) Glue is coated on the first surface and cured to form a hard layer with a thickness of 10 μm.

[0093] The manufacturing method of Example 6 is the same as that of Example 3, and the main difference is that: a CPI film with a thickness of 65 μm is used as the substrate, and Ra is 12 μm.

[0094] The manufacturing method of Example 7 is the same as that of Example 3, and the main difference is that: silicon dioxide particles with a mass percentage of 10% are mixed in the glue to form a hard layer; the particle size distribution of the silicon dioxide particles is as follows: 50%: 50 nm ≤ R ≤ 100 nm; 30%: 20 nm ≤ R < 50 nm; 20%: 10 μm ≤ R < 20 nm.

[0095] The optical component provided by Comparative Example 1 has the same manufacturing method as that of Example 1, and the main difference is that: the rolling in step (1) is not carried out, that is, the surface of the substrate is not roughened.

[0096] Table 1

[0097]

[0098]

[0099] The test methods for the optical components of Examples 1 to 7 and Comparative Examples 1 to 2 are as follows:

[0100] (1) Reflectance test method (spectrometer model: Konica Minolta CM-5; light source is D65, angle is 100):

[0101] 1.1 Prepare two linear polarizers;

[0102] 1.2 Vertically bond the two polarizers;

[0103] 1.3 Bond the test sample and the crossed polarizers;

[0104] 1.4 Place the test sample surface on the sensor area;

[0105] 1.5 Ensure that the test sample is flat and there are no bubbles between the adhesives;

[0106] 1.6 Start the measurement and confirm the measurement result.

[0107] (2) Bending performance test method (equipment model: Yuasa DML HB-FS):

[0108] 2.1 Prepare the test sample for folding;

[0109] 2.2 The length of the test sample to be measured is not less than 150 mm;

[0110] 2.3 For inner folding, the hard layer faces up;

[0111] 2.4 Fix both sides of the test sample to the folding plate;

[0112] 2.5 Set the folding frequency to once per second;

[0113] 2.6 Monitor every 50,000 times until it stops at 200,000 times;

[0114] 2.7 Check the appearance and compare the optical results before and after folding.

[0115] (3) Transmittance / Haze:

[0116] After a beam of incident light passes through the product, part of the light will go straight, and part of the light will be scattered. The light within + / - 3 degrees is defined as the light that goes straight, and the light exceeding + / - 3 degrees is called scattered light.

[0117] The transmittance tests the ratio of the light that goes straight to the incident light; the haze tests the ratio of the scattered light to the incident light.

[0118] The results are shown in Table 2 below:

[0119] Table 2

[0120]

[0121] As can be seen from Table 2, by controlling the appropriate Ra value, the optical components of Examples 1 to 6 can all achieve better antireflection performance than Comparative Examples 1 to 2. Among them, when the substrate is the same PET, Examples 3 and 4 are better.

[0122] At the same time, the optical components of Examples 1 to 6 also have good bend resistance, high light transmittance and low haze. While Comparative Examples 1 to 2 cannot pass the bend performance test, and in Comparative Example 2, due to the large Ra value, the transmittance decreased significantly and the haze increased significantly.

[0123] Compared with Example 3, Example 7 can further reduce the antireflection effect by introducing silica particles into the hard layer, and at the same time, it will not affect the bend resistance, light transmittance and haze of the optical component.

[0124] The technical features of the above-described embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope described in this specification.

[0125] The above-described embodiments merely represent several implementation manners of the present invention, facilitating a specific and detailed understanding of the technical solution of the present invention, but should not be construed as a limitation on the protection scope of the invention patent. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present invention, several modifications and improvements can be made, and these all fall within the protection scope of the present invention. It should be understood that the technical solutions obtained by those skilled in the art through logical analysis, reasoning or limited experiments based on the technical solution provided by the present invention are all within the protection scope of the appended claims of the present invention. Therefore, the protection scope of the present invention patent shall be subject to the content of the appended claims, and the description and drawings can be used to explain the content of the claims.

Claims

1. An antireflection optical component, characterized in that, it includes a substrate and a first film layer; wherein, the substrate has a rough first surface, the average roughness Ra of the first surface is 35 μm to 40 μm, and Ra is less than 1 / 2 of the thickness of the substrate; the first film layer is attached to the first surface.

2. The antireflection optical component according to claim 1, characterized in that, Ra is less than 1 / 3 of the thickness of the substrate.

3. The antireflection optical component according to claim 1, characterized in that, the thickness of the substrate is 50 μm to 500 μm.

4. The antireflection optical component according to any one of claims 1 to 3, characterized in that, the protrusions and depressions on the first surface are arranged irregularly.

5. The antireflection optical component according to any one of claims 1 to 3, characterized in that, the glass transition temperature Tg of the substrate is 80 °C to 300 °C.

6. The antireflection optical component according to any one of claims 1 to 3, characterized in that, the thickness of the first film layer is 2 μm to 10 μm.

7. The antireflection optical component according to any one of claims 1 to 3, characterized in that, by mass percentage, the raw materials for preparing the first film layer include: 20% to 40% of acrylic resin oligomer, 10% to 20% of photocurable active diluent, 1% to 5% of photoinitiator, 1.5% to 8% of additive, and 50% to 70% of solvent.

8. The antireflection optical component according to any one of claims 1 to 3, characterized in that, antireflection particles accounting for 1% to 20% of the mass of the first film layer are dispersed in the first film layer.

9. The antireflection optical component according to claim 8, characterized in that, by mass percentage, the antireflection particles include 48% to 52% of first antireflection particles, 28% to 32% of second antireflection particles, and 18% to 22% of third antireflection particles; wherein, the particle size of the first antireflection particles is ≥50 nm and ≤100 nm; the particle size of the second antireflection particles is ≥20 nm and <50 nm; the particle size of the third antireflection particles is <20 nm.

10. A method for manufacturing the antireflection optical component according to any one of claims 1 to 9, characterized in that, it includes the following steps: Rolling the substrate with a heated hot press roller to form the first surface; Coating the material of the first film layer on the first surface and curing to form the first film layer.

11. The method for manufacturing the antireflection optical component according to claim 10, characterized in that, heating the temperature of the hot press roller to 70 °C to 150 °C.

12. An electronic device, characterized in that, it includes a main body and an antireflection device fitted in the main body, and the antireflection device is the antireflection optical component according to any one of claims 1 to 9.

13. The electronic device according to claim 12, characterized in that, the antireflection device is a protective cover plate.

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