Method for manufacturing low heat resistance sensor

Abstract

The present invention provides a method for manufacturing a low heat resistance sensor having excellent chemical resistance, waterproofness and dustproofness. The method for manufacturing the low heat resistance sensor includes at least: a process of arranging a sensor unit in a recess of a fluororesin storage member, inserting a cable through a through hole passing through the recess, and electrically connecting the sensor unit arranged in the recess to the cable; a process of arranging a fluororesin plate to block the opening of the recess, thereby covering the recess; a process of covering the cable with a fluororesin tube; a process of arranging a fluororesin frame to surround the plate; a process of thermally bonding the frame, the storage member and the plate; and a process of thermally bonding the storage member and the tube.

Description

Technical Field

[0001] The present invention relates to a method for manufacturing a low heat resistance sensor used in industrial equipment such as a vibration measuring instrument. Background Art

[0002] Conventionally, various sensors such as acceleration sensors, temperature sensors, and pressure sensors are used in various industrial equipment. Such sensors are mainly composed of a sensor body that houses a sensor unit for acquiring various information in a housing and a cable that electrically connects the sensor unit to the sensor body.

[0003] In particular, the housing of the sensor body is made of metal materials such as stainless steel and aluminum for the purpose of strength, noise suppression, heat resistance, etc., or resin materials for the purpose of insulation, weight reduction, etc.

[0004] However, chemicals such as acids or alkalis are used in manufacturing sites such as factories, and industrial equipment is sometimes exposed to such chemicals. Generally, sensors used in industrial equipment exposed to chemicals are often coated with fluororesins by calcining the sensor body and cable at a high temperature of more than 300 degrees to provide chemical resistance (e.g., Patent Document 1).

[0005] Prior art literature

[0006] Patent Literature

[0007] Patent Document 1: Japanese Patent Application Publication No. 2016-130633 Summary of the invention

[0008] Technical problem to be solved by the invention

[0009] However, among various sensors, in low heat resistance sensors with low heat resistance temperature, represented by acceleration sensors, the heat resistance temperature of the sensor unit in the sensor body is as low as about 85 degrees, and sometimes even as low as about 60 degrees. If the shell that accommodates the sensor unit is directly covered with fluororesin, the sensor unit may be damaged and the sensor body cannot be covered with fluororesin.

[0010] Alternatively, only the cable may be covered with fluororesin, or only the housing may be covered with fluororesin before the sensor unit is housed. However, in this case, the cable and housing must be covered with fluororesin, the sensor unit must be placed in the housing, and the cable and the sensor body must be electrically connected. Therefore, this low heat resistance sensor has a structure in which a small gap is formed between the sensor body and the cable, and cannot reliably prevent chemicals from entering the sensor body from the connection portion between the sensor body and the cable.

[0011] In addition, chemicals may enter, and of course, moisture and dust may enter. Since they will have an adverse effect on the accuracy of low-heat-resistant sensors, there is actually a demand for the development of new low-heat-resistant sensors that are resistant to chemicals, moisture, and dust.

[0012] The present invention has been made in view of the above-mentioned actual situation, and an object of the present invention is to provide a method for manufacturing a low heat-resistant sensor having excellent chemical resistance, waterproofness, and dustproofness.

[0013] Technical means for solving technical problems

[0014] The present invention is made to solve the above-mentioned problems in the prior art. The low heat resistance sensor of the present invention is characterized by comprising:

[0015] a sensor main body having a sensor unit disposed in a housing; and

[0016] a cable electrically connected to the sensor unit of the sensor main body,

[0017] The housing of the sensor main body is made of fluororesin, and the cable is covered with a fluororesin tube.

[0018] The housing is thermally bonded to a connection portion of the pipe, so that the housing is integrally formed with the pipe.

[0019] Therefore, if the fluororesin shell and the fluororesin tube are integrally formed, the entire low heat resistance sensor will not have any gaps anywhere, that is, the sensor unit and the cable are a structure completely covered with fluororesin, so it can become a low heat resistance sensor with excellent chemical resistance and excellent waterproof and dustproof properties.

[0020] Furthermore, the low heat resistance sensor of the present invention is characterized in that:

[0021] The housing and the pipe are thermally joined by a connecting member made of fluororesin.

[0022] The connection portion between the shell and the tube is easily loaded, and a gap may be generated due to repeated use. However, if the shell and the tube are thermally joined via a fluororesin connecting member in the above manner, no gap will be generated between the shell and the tube even after repeated use, thereby achieving a low heat-resistant sensor having continuously excellent chemical resistance, waterproofness, and dustproofness.

[0023] Furthermore, the low heat resistance sensor of the present invention is characterized in that:

[0024] The housing comprises:

[0025] a housing member made of fluororesin and used to house the sensor unit in the recess;

[0026] a plate made of fluororesin serving as a cover for closing the opening of the recess; and

[0027] a frame body made of fluororesin and arranged to surround the plate;

[0028] The frame is thermally bonded to the housing member, and the frame is thermally bonded to the plate.

[0029] Therefore, if the frame and the storage member are thermally bonded, and the frame and the plate are thermally bonded, the sensor unit can be sealed in the housing without contacting the sensor unit, and the sensor unit can be reliably prevented from being damaged by heating during thermal bonding.

[0030] Furthermore, the low heat resistance sensor of the present invention is characterized in that:

[0031] The fluororesin is any one of polytetrafluoroethylene (PTFE) resin, tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer (PFA) resin, tetrafluoroethylene-hexafluoropropylene copolymer (FEP) resin, tetrafluoroethylene-ethylene copolymer (ETFE) resin, polyvinylidene fluoride (PVDF) resin, polychlorotrifluoroethylene (PCTFE) resin, chlorotrifluoroethylene-ethylene copolymer (ECTFE) resin, and polyvinyl fluoride (PVF) resin.

[0032] Such a fluororesin can provide a low heat-resistant sensor having excellent chemical resistance, waterproofness, and dustproofness.

[0033] Furthermore, the low heat resistance sensor of the present invention is characterized in that:

[0034] The frame and the connection member are formed of tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer (PFA) resin.

[0035] Furthermore, the low heat resistance sensor of the present invention is characterized in that:

[0036] The housing member, the plate, and the tube are formed of polytetrafluoroethylene (PTFE) resin.

[0037] If the frame and connecting components are formed of the above-mentioned PFA resin, and the storage components, plates and tubes are formed of PTFE resin, since the melting point of PFA resin is lower than that of PTFE resin, the frame and the storage components can be thermally bonded, the frame and the plate can be thermally bonded, the connecting components and the storage components can be thermally bonded, and the connecting components and the tubes can be thermally bonded without causing any deformation of the storage components, plates and tubes.

[0038] Furthermore, the low heat resistance sensor of the present invention is characterized in that:

[0039] The low heat resistance sensor is a MEMS (Micro Electro Mechanical System) or a pickup.

[0040] Therefore, if the low heat resistance sensor is a MEMS or a pickup, the characteristic structure of the present invention can be preferably adopted.

[0041] Furthermore, the low heat resistance sensor of the present invention is an acceleration sensor.

[0042] Therefore, if it is an acceleration sensor, the effect of the structure of the present invention can be further improved.

[0043] In addition, the method for manufacturing a low heat-resistant sensor of the present invention is characterized by at least comprising:

[0044] The step of placing the sensor unit in a recessed portion of a fluororesin housing member, inserting a cable into a through hole passing through the recessed portion, and electrically connecting the sensor unit placed in the recessed portion to the cable;

[0045] a step of disposing a fluororesin plate so as to block the opening of the recessed portion, thereby covering the recessed portion;

[0046] The step of covering the cable with a fluororesin tube;

[0047] A step of disposing a fluororesin frame so as to surround the plate;

[0048] a step of thermally bonding the frame, the storage member, and the plate; and

[0049] A step of thermally bonding the housing member and the tube.

[0050] According to this manufacturing method, the sensor unit and the cable have an integrated structure completely covered with fluororesin, so that a low heat-resistant sensor having excellent chemical resistance, waterproofness, and dustproofness can be manufactured.

[0051] Furthermore, the method for manufacturing a low heat-resistant sensor of the present invention is characterized in that:

[0052] In the step of thermally bonding the frame, the storage member, and the plate,

[0053] The frame body is pressed toward the sensor unit while being heated to melt a portion of the frame body, thereby thermally bonding the frame body and the housing member, and thermally bonding the frame body and the plate.

[0054] Therefore, by pressing the frame while heating it, if the frame is thermally bonded to the storage member and the frame is thermally bonded to the plate, the sensor unit can be sealed in the shell without heating the sensor unit, thereby reliably preventing the sensor unit from being damaged by heating.

[0055] Furthermore, the method for manufacturing a low heat-resistant sensor of the present invention is characterized in that:

[0056] In the step of thermally bonding the housing member and the tube,

[0057] The housing member and the tube are thermally bonded by a connecting member made of fluororesin.

[0058] Furthermore, the method for manufacturing a low heat-resistant sensor of the present invention is characterized in that:

[0059] The connecting member is pressed toward the recessed portion while being heated, so that a portion of the connecting member is melted, the connecting member and the housing member are thermally bonded, and the connecting member and the tube are thermally bonded.

[0060] Therefore, if the storage member and the tube are thermally joined by a fluororesin connecting member, no gap will be generated in the connection portion between the storage member and the tube even with continuous use, thereby manufacturing a low heat-resistant sensor with continuous excellent chemical resistance and continuous excellent waterproof and dustproof properties.

[0061] Effects of the Invention

[0062] According to the low heat resistance sensor of the present invention, the shell of the sensor body is made of fluororesin, and the cable is covered by a fluororesin tube. The shell and the tube are thermally bonded to form an integrated structure, so it has excellent chemical resistance, waterproofness and dustproofness.

[0063] In addition, according to the manufacturing method of the low heat resistance sensor of the present invention, the sensor unit and the cable can adopt an integrated structure completely covered by fluororesin, and the sensor unit will not be heated to a high temperature during the manufacturing process. Therefore, a low heat resistance sensor with excellent chemical resistance and excellent waterproof and dustproof properties can be reliably manufactured without damaging the sensor unit. BRIEF DESCRIPTION OF THE DRAWINGS

[0064] Figure 1 It is a perspective view of the low heat-resistant sensor in Embodiment 1 of the present invention.

[0065] Figure 2 yes Figure 1 FIG. 2 is a cross-sectional view taken along line AA of the low heat-resistant sensor according to Embodiment 1 of the present invention.

[0066] Figure 3 It is an exploded perspective view of the low heat-resistant sensor in Embodiment 1 of the present invention.

[0067] Figure 4 It is a perspective view of a low heat-resistant sensor in Embodiment 2 of the present invention.

[0068] Figure 5 yes Figure 4 A cross-sectional view taken along line BB of the low heat-resistant sensor according to Embodiment 2 of the present invention is shown.

[0069] Figure 6 It is an exploded perspective view of the low heat-resistant sensor in Embodiment 2 of the present invention.

[0070] Figure 7 This is a process diagram showing a manufacturing process of the low heat-resistant sensor according to the first embodiment of the present invention.

[0071] Figure 8 This is a process diagram showing a manufacturing process of the low heat-resistant sensor according to the first embodiment of the present invention.

[0072] Fig. 9 is with Figure 8 (a) is a stereoscopic view similar to the process diagram shown.

[0073] Fig.10 is with Figure 8 (c) is a stereoscopic view similar to the process diagram shown.

[0074] Fig.11 This is a process diagram showing a manufacturing process of the low heat-resistant sensor according to the first embodiment of the present invention.

[0075] Fig.12 This is a process diagram showing a manufacturing process of the low heat-resistant sensor according to the first embodiment of the present invention.

[0076] Fig.13 This is a process diagram showing a manufacturing process of the low heat-resistant sensor according to the first embodiment of the present invention.

[0077] Fig.14 This is a process diagram showing a manufacturing process of the low heat-resistant sensor according to the second embodiment of the present invention.

[0078] Fig.15 This is a process diagram showing a manufacturing process of the low heat-resistant sensor according to the second embodiment of the present invention.

[0079] Fig.16 This is a process diagram showing a manufacturing process of the low heat-resistant sensor according to the second embodiment of the present invention.

[0080] Fig.17This is a process diagram showing a manufacturing process of the low heat-resistant sensor according to the second embodiment of the present invention.

[0081] Fig.18 This is a process diagram showing a manufacturing process of the low heat-resistant sensor according to the second embodiment of the present invention. DETAILED DESCRIPTION

[0082] Hereinafter, embodiments of the present invention will be described in more detail based on the drawings.

[0083] <Low heat resistance sensor 10>

[0084] The low heat resistance sensor 10 of the present invention is a sensor with a low heat resistance and a heat resistance temperature of 100 degrees or less, and is not particularly limited to a certain sensor. In particular, the sensor unit 26 described later sometimes has a substrate or an integrated circuit, etc., which sometimes have low heat resistance depending on the sensor. The present invention provides a low heat resistance sensor 10 and a method for manufacturing the low heat resistance sensor 10, wherein the low heat resistance sensor 10 has the above-mentioned sensor unit 26 with low heat resistance, and has excellent chemical resistance, excellent waterproofness, and excellent dustproofness. Here, as an example of the low heat resistance sensor 10, an acceleration sensor can be cited.

[0085] like Figures 1 to 3 As shown, the low heat-resistant sensor 10 in the first embodiment of the present invention includes a sensor body 20 in which a sensor unit 26 is arranged in a housing 22 , and a cable 40 electrically connected to the sensor unit 26 of the sensor body 20 .

[0086] The housing 22 of the sensor main body 20 is made of fluororesin, and the cable 40 is covered with a tube 42 made of fluororesin. The connection portion between the housing 22 and the tube 42 is thermally bonded, so that the housing 22 and the tube 42 are integrally configured.

[0087] The structure of the housing 22 is not particularly limited as long as it can firmly fix the sensor unit 26 in the internal space and can reliably cover the entire sensor unit 26 .

[0088] like Figures 1 to 3 As shown, such a housing 22 includes: a storage member 32, which is roughly a rectangular parallelepiped and has a recess 24 formed in the center; a plate 28, which is made of fluororesin and is arranged on the upper part of the sensor unit 26, i.e., the step portion 23 provided at the opening edge of the recess 24, and serves as a cover of the recess 24 when the sensor unit 26 is arranged in the recess 24; and a frame 30, which is made of fluororesin and is arranged on the step portion 27 provided around the plate 28 and surrounds the plate 28. In addition, Figure 1 and Figure 3In the figure, reference numeral 21 denotes a mounting hole used when the low heat-resistant sensor 10 is mounted on a target member (not shown) via a fastening member. The mounting hole 21 is an independent through hole that is not connected at all to the recessed portion 24 of the housing 22 .

[0089] In the present embodiment, four mounting holes 21 are provided, but there is no particular limitation on the number, and there may be no mounting holes 21. If no mounting holes 21 are provided, the low heat resistance sensor 10 may be installed on a target member (not shown) by means of a double-sided tape or adhesive.

[0090] As will be described later, by pressing the frame body 30 while heating, the frame body 30 and the storage member 32 as well as the frame body 30 and the plate 28 are thermally bonded to form an integrated structure.

[0091] That is, a part of the frame body 30 is melted by heating, and the plate 28 and the storage member 32 are thermally bonded via the frame body 30 , so that the frame body 30 , the storage member 32 , and the plate 28 are integrally formed.

[0092] The sensor unit 26 provided in the recess 24 of the storage member 32 may be fixed to the recess 24 in any manner, but is preferably fixed by an adhesive 29. That is, the adhesive 29 is applied to the bottom of the recess 24, and in this state, the sensor unit 26 is arranged in the recess 24. When the adhesive 29 solidifies, the storage member 32 and the sensor unit 26 are integrated. For example, the adhesive 29 formed of low siloxane can be used.

[0093] On the other hand, on one side of the housing 22 ( Figures 1 to 3 A through hole 25 communicating with the recess 24 is provided (right side in the middle), and the cable 40 is passed through the through hole 25. The sensor unit 26 arranged in the recess 24 is electrically connected to the cable 40 via solder 45, for example.

[0094] The cable 40 for electrical connection is covered by a fluororesin tube 42, one end of which ( Figure 1 , 2 The left end portion in the middle) is inserted into the through hole 25.

[0095] A step 41 for the tube 42 is provided in the through hole 25 , thereby positioning the tube 42 in the housing 22 .

[0096] In addition, if Figure 2As shown, the connection portion between the tube 42 and the housing 22 is thermally bonded by a fluororesin connection member 50. That is, the connection member 50 is inserted into the end of the through hole 25 of the housing 22, and in this state, the connection member 50 is pressed while being heated, so that a part of the connection member 50 melts, whereby the housing 22 (housing member 32) and the tube 42 are thermally bonded by the connection member 50, and thus are integrally formed.

[0097] The step portion 43 for connecting the member 50 is provided at the end of the through hole 25 ( Figure 1 , 2 The right end portion in the housing 22 is thus Figures 1 to 3 The connecting member 50 is positioned (on the right side in the figure).

[0098] Here, the fluororesin used as the material of the shell 22, plate 28, frame 30, tube 42, and connecting member 50 can be exemplified by polytetrafluoroethylene (PTFE) resin, tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer (PFA) resin, tetrafluoroethylene-hexafluoropropylene copolymer (FEP) resin, tetrafluoroethylene-ethylene copolymer (ETFE) resin, polyvinylidene fluoride (PVDF) resin, polychlorotrifluoroethylene (PCTFE) resin, chlorotrifluoroethylene-ethylene copolymer (ECTFE) resin, and polyvinyl fluoride (PVF) resin, etc.

[0099] Since the frame 30 and the connecting member 50 are directly heated, it is preferable to select a fluororesin with a relatively low melting point, and the remaining case 22 , plate 28 , and tube 42 are preferably selected from a fluororesin with a higher melting point than the fluororesin used for the frame 30 and the connecting member 50 .

[0100] In particular, it is preferable to use tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer (PFA) resin as the frame 30 and the connection member 50 , and it is preferable to use polytetrafluoroethylene (PTFE) resin as the case 22 , the plate 28 , and the tube 42 .

[0101] However, these combinations are not particularly limited, and the resins of the case 22 , the plate 28 , the frame 30 , the tube 42 , and the connecting member 50 may be changed individually, respectively, and appropriate selection may be freely made.

[0102] As described above, the low heat resistance sensor 10 of embodiment 1 of the present invention first thermally bonds the frame 30 to the storage member 32 and thermally bonds the frame 30 to the plate 28 in the sensor main body 20, thereby being able to seal the sensor unit 26 in the housing 22 to form an integrated structure without direct contact with the sensor unit 26, and being able to reliably prevent the sensor unit 26 from being damaged by heating during thermal bonding.

[0103] Furthermore, since the cable 40 is also covered by the tube 42 and the tube 42 is thermally bonded to the housing 22 to form an integral structure, no gap is generated anywhere, and the low heat-resistant sensor 10 having excellent chemical resistance, waterproofness, and dustproofness can be provided.

[0104] Next, the low heat-resistant sensor 10 according to the second embodiment of the present invention will be described.

[0105] Figures 4 to 6 The low heat resistance sensor 10 shown is basically the same as Figures 1 to 3 Since the low heat-resistant sensor 10 of the illustrated first embodiment has the same structure, the same components are denoted by the same reference numerals and detailed description thereof is omitted.

[0106] like Figures 4 to 6 As shown, the low heat resistance sensor 10 in the second embodiment of the present invention described above includes a sensor body 20 in which a sensor unit 26 is arranged in a substantially cylindrical housing 22, and a cable 40 electrically connected to the sensor unit 26 of the sensor body 20. In addition, a support plate 88 is attached to the bottom of the sensor unit 26 via a fastening member 90.

[0107] The housing 22 of the sensor main body 20 is made of fluororesin, and the cable 40 is covered with a tube 42 made of fluororesin. The connection portion between the housing 22 and the tube 42 is thermally bonded, so that the housing 22 and the tube 42 are integrally configured.

[0108] like Figures 4 to 6 As shown, the above-mentioned shell 22 includes: a storage member 32, which is roughly cylindrical and has a recess 24 formed in the center; a plate 28, which is made of fluororesin. When the sensor unit 26 is arranged in the recess 24, the plate 28 is arranged on the upper part of the sensor unit 26, that is, on the step portion 86 provided at the opening edge of the recess 24, and serves as a cover for the opening of the recess 24; and a frame 30, which is made of fluororesin, is arranged around the plate 28, is arranged on the step portion 86 and surrounds the plate 28.

[0109] The support plate 88 provided at the bottom of the sensor unit 26 is configured to fit tightly with the bottom of the recessed portion 24 , thereby making it possible to reliably hold the sensor unit 26 in the housing 22 .

[0110] In addition, a mounting hole 21 is provided in the flange portion 33 arranged at the lower end of the shell 22. The mounting hole 21 is used when the low heat resistance sensor 10 is mounted on an object component (not shown) through a fastening component. The mounting hole 21 is an independent through hole that is completely disconnected from the recess 24 of the shell 22.

[0111] In the present embodiment, three mounting holes 21 are provided, but there is no particular limitation on the number, and there may be no mounting holes 21. If no mounting holes 21 are provided, the low heat resistance sensor 10 may be installed on a target member (not shown) by means of a double-sided tape or adhesive.

[0112] As will be described later, by pressing the frame body 30 while heating, the frame body 30 and the storage member 32 as well as the frame body 30 and the plate 28 are thermally bonded to form an integrated structure.

[0113] That is, a part of the frame body 30 is melted by heating, and the plate 28 and the storage member 32 are thermally bonded via the frame body 30 , so that the frame body 30 , the storage member 32 , and the plate 28 are integrally formed.

[0114] The sensor unit 26 disposed in the recess 24 of the storage member 32 may be fixed to the recess 24 in any manner, but is preferably fixed by an adhesive 29. That is, the adhesive 29 is applied to the bottom of the recess 24, and in this state, the sensor unit 26 with the support plate 88 is arranged in the recess 24. When the adhesive 29 solidifies, the storage member 32 and the sensor unit 26 are integrated via the support plate 88. For example, the adhesive 29 formed of low siloxane can be used.

[0115] On the other hand, on one side of the housing 22 ( Figures 4 to 6 The through hole 25 connected to the recess 24 is provided in the middle (right side), and the cable 40 is inserted into the through hole 25, and the engaging protrusion 85 of the sensor unit 26 arranged in the recess 24 is electrically connected to the engaging recess 84 provided on the end of the cable 40 through the concave-convex engagement. In addition, the sensor unit 26 and the cable 40 are not limited to being electrically connected through the concave-convex engagement, and can also be electrically connected by welding, for example. In addition, the engaging recess 84 and the engaging protrusion 85 can also be arranged with the concave and convex opposite to each other.

[0116] The cable 40 for electrical connection is covered by a fluororesin tube 42, one end of which ( Figure 4 , 5 The left end portion in the middle) is inserted into the through hole 25.

[0117] In addition, if Figure 4 and Figure 5 As shown, the connection portion between the tube 42 and the housing 22 is thermally bonded by a fluororesin connection member 50. That is, the connection member 50 is inserted into the end of the through hole 25 of the housing 22, and in this state, the connection member 50 is pressed while being heated, so that a part of the connection member 50 melts, whereby the housing 22 (housing member 32) and the tube 42 are thermally bonded by the connection member 50, and thus are integrally formed.

[0118] Furthermore, the flange portion 51 is provided on the connection member 50 , and thus, when the connection member 50 is fitted into the through-hole 25 , the flange portion 51 can prevent the connection member 50 from entering deep into the through-hole 25 .

[0119] Here, the fluororesin used as the material of the shell 22, plate 28, frame 30, tube 42, and connecting member 50 can be exemplified by polytetrafluoroethylene (PTFE) resin, tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer (PFA) resin, tetrafluoroethylene-hexafluoropropylene copolymer (FEP) resin, tetrafluoroethylene-ethylene copolymer (ETFE) resin, polyvinylidene fluoride (PVDF) resin, polychlorotrifluoroethylene (PCTFE) resin, chlorotrifluoroethylene-ethylene copolymer (ECTFE) resin, and polyvinyl fluoride (PVF) resin, etc.

[0120] Since the frame 30 and the connecting member 50 are directly heated, it is preferable to select a fluororesin with a relatively low melting point, and the remaining case 22 , plate 28 , and tube 42 are preferably selected from a fluororesin with a higher melting point than the fluororesin used for the frame 30 and the connecting member 50 .

[0121] In particular, it is preferable to use tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer (PFA) resin as the frame 30 and the connection member 50 , and it is preferable to use polytetrafluoroethylene (PTFE) resin as the case 22 , the plate 28 , and the tube 42 .

[0122] However, these combinations are not particularly limited, and the resins of the case 22 , the plate 28 , the frame 30 , the tube 42 , and the connecting member 50 may be changed individually, respectively, and appropriate selection may be freely made.

[0123] As described above, the low heat resistance sensor 10 of embodiment 2 of the present invention firstly thermally bonds the frame 30 to the storage member 32 and thermally bonds the frame 30 to the plate 28 in the sensor main body 20, thereby being able to seal the sensor unit 26 in the housing 22 to form an integrated structure without direct contact with the sensor unit 26, and being able to reliably prevent the sensor unit 26 from being damaged by heating during thermal bonding.

[0124] Furthermore, since the cable 40 is also covered by the tube 42 and the tube 42 is thermally bonded to the housing 22 to form an integral structure, no gap is generated anywhere, and the low heat-resistant sensor 10 having excellent chemical resistance, waterproofness, and dustproofness can be provided.

[0125] <Method for Manufacturing Low Heat Resistance Sensor 10>

[0126] Next, a method for manufacturing the low heat-resistant sensor 10 according to the first embodiment of the present invention described above will be described.

[0127] First, if Figure 7 As shown in (a), a housing 22 made of fluororesin having a recess 24 for a sensor unit 26 is prepared.

[0128] Then, if Figure 7 As shown in (b), adhesive 29 is applied to the bottom of the recess 24 of the housing 22, and the sensor unit 26 is arranged in the recess 24 on top of the adhesive 29. The adhesive 29 is dried to firmly fix the sensor unit 26 in the recess 24.

[0129] In addition, if Figure 7 As shown in (c), a fluororesin connecting member 50 is attached to the through hole 25 provided on the side of the housing 22 .

[0130] Then, if Figure 8 (a) and Fig. 9 As shown, the cable 40 is inserted into the through hole 25 so that the end of the cable 40 reaches the recess 24 of the housing 22 .

[0131] Furthermore, if Figure 8 As shown in (b), the sensor unit 26 and the cable 40 inserted into the through hole 25 are soldered with solder 45 to electrically connect the sensor unit 26 and the cable 40. On the other hand, a plate 28 is arranged on the upper part of the sensor unit 26 provided in the recess 24, that is, on the step portion 23 provided at the opening edge of the recess 24, so that the recess 24 is covered with the plate 28.

[0132] Then, if Figure 8 (c) and Fig.10 As shown, a frame 30 made of fluororesin is placed on the step portion 27 provided around the plate 28, and the plate 28 is surrounded by the frame 30. At this time, it is preferable to set the thickness of the frame 30 so that the frame 30 protrudes slightly upward from the plate 28.

[0133] In addition, if Fig.11 As shown, a heating and pressing unit 61 for pressing the frame body 30 is arranged above the housing 22 , and a heating and pressing unit 71 for heating and pressing the connecting member 50 is arranged on the side of the connecting member 50 .

[0134] Then, if Fig.12 As shown, the heating and pressing unit 61 is moved to the position directly above the frame 30 by the air cylinder 80 , and the heating and pressing unit 71 is moved to the position directly on the side of the connecting member 50 by the air cylinder 82 .

[0135] Then, if Fig.13 As shown, the heating and pressing unit 61 presses the frame 30 toward the housing 22 by the cylinder 80 and heats it for a certain period of time, so that a part of the frame 30 melts, thereby integrating the frame 30 with the housing 22 and integrating the frame 30 with the plate 28 .

[0136] At the same time, the cylinder 82 causes the heating and pressing unit 71 to press the connecting member 50 toward the housing 22 and heat it for a certain period of time, so that a part of the connecting member 50 melts, thereby integrating the connecting member 50 with the housing 22 and integrating the connecting member 50 with the pipe 42. Reference numerals 60 and 62 are heaters, and reference numerals 68 and 70 are thermocouples.

[0137] After integration, the cooling units 64 and 66 of the heating and pressing units 61 and 71 are immediately activated to cool the heated parts. It is preferable to use a two-stage Peltier element as the cooling units 64 and 66.

[0138] After cooling for a certain period of time, the cylinders 80 and 82 are used to move the heating and pressing units 61 and 71 away from the housing 22. Figure 1 and Figure 2 The manufacturing of the low heat resistance sensor 10 shown is completed.

[0139] Next, a method for manufacturing the low heat-resistant sensor 10 according to the second embodiment of the present invention described above will be described.

[0140] First, if Fig.14 As shown in (a), a cylindrical housing 22 made of fluororesin and having a recess 24 for a sensor unit 26 is prepared.

[0141] On the other hand, the support plate 88 is installed on the bottom of the sensor unit 26 by the fastening member 90 separately from the housing 22, so that the mating protrusion 85 of the sensor unit 26 and the mating recess 84 of the cable 40 are mated together, thereby electrically connecting the sensor unit 26 and the cable 40.

[0142] Then, if Fig.14 As shown in (b), the adhesive 29 is applied to the bottom of the recessed portion 24 of the housing 22, and in this state, the sensor unit 26 with the cable 40 and the support plate 88 mounted thereon is arranged in the recessed portion 24 of the housing 22. At this time, it is preferable to form the support plate 88 in advance so that the bottom of the recessed portion 24 and the support plate 88 are tightly fitted. In addition, the cable 40 passes through the through hole 25 from the recessed portion 24 and extends to the outside of the housing 22. Then, the adhesive 29 is dried, and the sensor unit 26 is firmly fixed in the recessed portion 24 through the support plate 88.

[0143] In addition, if Fig.15 As shown in (a), a fluororesin connecting member 50 is attached to the through hole 25 provided on the side of the housing 22 .

[0144] Then, if Fig.15As shown in (b), the cable 40 is inserted into the tube 42 so that the end of the tube 42 reaches the fitting recess 84 of the end of the cable 40 located in the through hole 25.

[0145] In addition, if Fig.16 As shown, the plate 28 is arranged on the upper part of the sensor unit 26 provided in the recess 24 of the housing 22, that is, on the step portion 86 provided on the opening edge of the recess 24, so that the recess 24 is in a state covered by the plate 28.

[0146] Next, the fluororesin frame 30 is placed on the step portion 86 provided around the plate 28, and the plate 28 is surrounded by the frame 30. At this time, the thickness of the frame 30 is preferably set so that the frame 30 protrudes slightly upward from the plate 28.

[0147] Furthermore, a heating and pressing unit 61 for pressing the frame body 30 is arranged above the housing 22 , and a heating and pressing unit 71 for heating and pressing the connecting member 50 is arranged on the side of the connecting member 50 .

[0148] Then, if Fig.17 As shown, the heating and pressing unit 61 is moved to the position directly above the frame 30 by the air cylinder 80 , and the heating and pressing unit 71 is moved to the position directly on the side of the connecting member 50 by the air cylinder 82 .

[0149] Then, if Fig.18 As shown, the frame 30 is pressed toward the housing 22 by the heating and pressing unit 61 through the cylinder 80 and heated for a certain period of time, so that a part of the frame 30 is melted, thereby integrating the frame 30 with the housing 22 and integrating the frame 30 with the plate 28 .

[0150] At the same time, the cylinder 82 causes the heating and pressing unit 71 to press the connecting member 50 toward the housing 22 and heat it for a certain period of time, so that a part of the connecting member 50 melts, thereby integrating the connecting member 50 with the housing 22 and integrating the connecting member 50 with the pipe 42. Reference numerals 60 and 62 are heaters, and reference numerals 68 and 70 are thermocouples.

[0151] After integration, the cooling units 64 and 66 of the heating and pressing units 61 and 71 are immediately activated to cool the heated parts. It is preferable to use a two-stage Peltier element as the cooling units 64 and 66.

[0152] After cooling for a certain period of time, the cylinders 80 and 82 are used to move the heating and pressing units 61 and 71 away from the housing 22. Figure 4 and Figure 5 The manufacturing of the low heat resistance sensor 10 shown is completed.

[0153] As mentioned above, the low heat-resistant sensor 10 and the method for manufacturing the low heat-resistant sensor 10 of the present invention are described, but the structure of the low heat-resistant sensor 10 , that is, the structure of the housing 22 that accommodates the sensor unit 26 is not particularly limited.

[0154] In the present embodiment, MEMS (Micro Electro Mechanical Systems) (Embodiment 1) and a pickup (Embodiment 2) are used as the sensor unit 26 , but the present invention is not limited to these, and for example, other piezoelectric elements may be used.

[0155] Furthermore, the production method of the present invention is not limited to the above-described sequence, and various changes may be made within the scope not departing from the purpose of the present invention.

[0156] Description of symbols

[0157] 10 Low heat resistance sensor

[0158] 20 Sensor body

[0159] 21 Mounting holes

[0160] 22 Shell

[0161] 23 Steps

[0162] 24 recesses

[0163] 25 through holes

[0164] 26 sensor units

[0165] 27 Steps

[0166] 28 boards

[0167] 29 Adhesive

[0168] 30 frame

[0169] 32 Storage components

[0170] 33 flange

[0171] 40 Cable

[0172] 41 Steps

[0173] 42 tubes

[0174] 43 Steps

[0175] 45 Solder

[0176] 50Connection components

[0177] 51 flange

[0178] 60 Heater

[0179] 61 Heating and pressing unit

[0180] 62 Heater

[0181] 64 cooling units

[0182] 66 cooling units

[0183] 68 Thermocouple

[0184] 70 Thermocouple

[0185] 71 Heating and pressing unit

[0186] 80 cylinders

[0187] 82 cylinders

[0188] 84 fitting recess

[0189] 85 fitting convex part

[0190] 86 Steps

[0191] 88 support plate

[0192] 90 fastening member.

Claims

1. A method for manufacturing a low heat resistance sensor, characterized in that: At least: The step of placing the sensor unit in a recessed portion of a fluororesin housing member, inserting a cable into a through hole passing through the recessed portion, and electrically connecting the sensor unit placed in the recessed portion to the cable; a step of disposing a fluororesin plate so as to block the opening of the recess as a cover of the recess; The step of covering the cable with a fluororesin tube; A step of disposing a fluororesin frame so as to surround the plate; A step of pressing the frame toward the sensor unit while heating the frame to melt a portion of the frame, thermally bonding the frame to the storage member, and thermally bonding the frame to the plate; as well as The process of pressing the fluororesin connecting member toward the recessed portion while heating the connecting member to melt a portion of the connecting member, thermally joining the connecting member to the housing member, and thermally joining the connecting member to the pipe, The fluororesin used for the housing member, the plate, and the tube is a fluororesin having a higher melting point than that of the fluororesin used for the frame body and the connecting member.

Images