electronic devices

Abstract

The present disclosure provides an electronic device comprising a substrate, a light-emitting unit, and a circuit layer. The substrate has a first surface and a second surface, the second surface being opposite to the first surface. The light-emitting unit is disposed on the first surface, and the circuit layer is disposed on the second surface. The circuit layer comprises a first layer and a second layer, the second layer being disposed on the first layer. The first layer comprises a plurality of first traces, the second layer comprises a plurality of second traces, and the plurality of first traces and the plurality of second traces are interlaced.

Description

Technical Field

[0001] The present disclosure relates to an electronic device, and more particularly to a circuit configuration of the electronic device. Background Art

[0002] With the rapid development of electronic products, consumers have high expectations for the quality and functionality of electronic products (including panels). Signal and / or power lines in electronic devices are often placed on the same side of the substrate to save space. However, excessive concentration of signal and / or power lines on one side can easily lead to uneven current distribution, resulting in heat accumulation and power loss, which in turn affects the quality of displayed images, such as uneven brightness. Therefore, developing structural designs that can improve panel reliability and performance is a current research topic in the industry. Summary of the Invention

[0003] According to some embodiments of the present disclosure, an electronic device is provided, comprising a substrate, a light-emitting unit, and a circuit layer. The substrate has a first surface and a second surface, the second surface being opposite to the first surface. The light-emitting unit is disposed on the first surface, and the circuit layer is disposed on the second surface. The circuit layer comprises a first layer and a second layer, the second layer being disposed on the first layer. The first layer comprises a plurality of first traces, the second layer comprises a plurality of second traces, and the plurality of first traces and the plurality of second traces are interlaced.

[0004] According to some embodiments of the present disclosure, an electronic device is provided, comprising a substrate, a light-emitting unit, and a circuit layer. The substrate has a first surface and a second surface, the second surface being opposite to the first surface. The light-emitting unit is disposed on the first surface, and the circuit layer is disposed on the second surface. The circuit layer comprises a first layer, the first layer comprising a plurality of first traces and a plurality of second traces, wherein the plurality of first traces and the plurality of second traces are alternately arranged along a direction. BRIEF DESCRIPTION OF THE DRAWINGS

[0005] In order to make the above-mentioned objects, features and advantages of the present invention more clearly understood, the specific embodiments of the present invention are described in detail below with reference to the accompanying drawings, in which:

[0006] Figure 1A A schematic diagram showing the structure of some components of an electronic device according to some embodiments of the present disclosure;

[0007] Figure 1B A schematic diagram showing the structure of some components of an electronic device according to some embodiments of the present disclosure;

[0008] Figure 2A According to some embodiments of the present disclosure, Figure 1B A schematic cross-sectional structural diagram of the electronic device taken along the line T-T';

[0009] Figure 2B According to some embodiments of the present disclosure, Figure 1B A schematic cross-sectional structural diagram of the electronic device taken along the line T-T';

[0010] Figure 3 A schematic diagram showing the structure of some components of an electronic device according to some embodiments of the present disclosure;

[0011] Figure 4 A schematic diagram showing the structure of some components of an electronic device according to some embodiments of the present disclosure;

[0012] Figure 5 According to some embodiments of the present disclosure, Figure 4 A schematic cross-sectional structural diagram of the electronic device taken along the section line Q-Q';

[0013] Figure 6 A schematic diagram showing the structure of some components of a spliced electronic device according to some embodiments of the present disclosure is shown.

[0014] Explanation of symbols

[0015] 10, 20, 30, 10U: Electronic devices

[0016] 40: Splicing electronic devices

[0017] 100:Substrate

[0018] 100A: First surface

[0019] 100B: Second surface

[0020] 100S: Side

[0021] 200: Circuit layer

[0022] 210: First floor

[0023] 212: First route

[0024] 212s: First side line

[0025] 220: Second floor

[0026] 222: Second route

[0027] 222s: Second side line

[0028] 222-1: Branch routing

[0029] 300: driving element

[0030] 400: Protective layer

[0031] 400a: First sublayer

[0032] 400b: Second sublayer

[0033] B1, B2, B3, B4: Side

[0034] D1: First distance

[0035] D2: Second distance

[0036] W1: First line width

[0037] W2: Second line width

[0038] W2-1, W2-2: Width

[0039] T2: Thickness

[0040] T-T', Q-Q': cut line

[0041] P1: Light-emitting unit

[0042] X, Y: direction

[0043] Z: normal direction DETAILED DESCRIPTION

[0044] The following is a detailed description of the electronic device according to an embodiment of the present disclosure. It should be understood that the following description provides many different embodiments for implementing different aspects of some embodiments of the present disclosure. The specific elements and arrangements described below are only for a simple and clear description of some embodiments of the present disclosure. Of course, these are only used as examples and are not limitations of the present disclosure. In addition, similar and / or corresponding numbers may be used in different embodiments to indicate similar and / or corresponding elements in order to clearly describe the present disclosure. However, the use of these similar and / or corresponding numbers is only for a simple and clear description of some embodiments of the present disclosure and does not represent any correlation between the different embodiments and / or structures discussed.

[0045] The present disclosure will be understood by referring to the following detailed description in conjunction with the accompanying drawings. It should be noted that, for ease of understanding and simplicity, many of the drawings in this disclosure depict only portions of the electronic device, and certain components in the drawings are not drawn to scale. Furthermore, the number and dimensions of components in the drawings are for illustrative purposes only and are not intended to limit the scope of this disclosure.

[0046] It should be understood that the elements or devices of the drawings may exist in various forms known to those skilled in the art. In addition, relative terms may be used in the embodiments, such as "lower" or "bottom" or "higher" or "top" to describe the relative relationship of one element of the drawings to another element. It is understood that if the device of the drawings is turned upside down, the elements described on the "lower" side will become elements on the "higher" side. The embodiments of the present disclosure can be understood in conjunction with the drawings, and the drawings of the present disclosure are also considered to be part of the disclosure. Furthermore, when a first material layer is mentioned as being on or above a second material layer, this includes the situation where the first material layer is in direct contact with the second material layer, or there may be one or more other material layers in between, in which case the first material layer and the second material layer may not be in direct contact.

[0047] Certain words are used throughout the present disclosure and in the claims that follow to refer to specific components. It should be understood by those skilled in the art that electronic equipment manufacturers may refer to the same components by different names. This document does not intend to distinguish between components that have the same function but different names. In the following description and claims, words such as "include", "contain", "have" are open-ended words and should therefore be interpreted as meaning "including but not limited to..." Therefore, when the terms "include", "contain" and / or "have" are used in the description of the present disclosure, they specify the presence of corresponding features, areas, steps, operations and / or components, but do not exclude the presence of one or more corresponding features, areas, steps, operations and / or components.

[0048] The directional terms mentioned herein, such as "up," "down," "front," "back," "left," "right," etc., are only used with reference to the directions in the accompanying drawings. Therefore, the directional terms used are for illustration and not for limitation of the present disclosure. In the accompanying drawings, each figure shows the general characteristics of the methods, structures and / or materials used in a particular embodiment. However, these figures should not be interpreted as defining or limiting the scope or nature of the embodiments. For example, for clarity, the relative size, thickness and position of each film layer, region and / or structure may be reduced or exaggerated.

[0049] When a component (such as a layer or region) is referred to as being "on" another component, it can be directly on the other component or there can be other components between the two components. On the other hand, when a component is referred to as being "directly on" another component, there are no components between the two components. In addition, when a component is referred to as being "on" another component, the two components have a top-to-bottom relationship in a top-down view, and the component can be above or below the other component, depending on the orientation of the device.

[0050] Furthermore, it should be understood that although the terms "first," "second," "third," etc. may be used herein to describe various elements, components, or parts, these elements, components, or parts should not be limited by these terms. These terms are merely used to distinguish different elements, components, regions, layers, or parts. Thus, a first element, component, region, layer, or part discussed below may be referred to as a second element, component, region, layer, or part without departing from the teachings of this disclosure.

[0051] As used herein, the terms "about" and "substantially" generally mean within 10%, 5%, 3%, 2%, 1%, or 0.5% of a given value or range. A given quantity is an approximate quantity, meaning that even without the specific wording "about" or "substantially," the meaning of "about" or "substantially" is implied. Furthermore, the phrase "a range between a first value and a second value" means that the range includes the first value, the second value, and any values therebetween.

[0052] It should be understood that the following embodiments may be implemented by replacing, recombining, or combining features from various embodiments to create other embodiments without departing from the spirit of the present disclosure. Features from various embodiments may be mixed and matched as needed, as long as they do not violate the spirit of the invention or conflict with it.

[0053] In the present disclosure, thickness, length, and width can be measured using an optical microscope, and thickness can be measured using cross-sectional images obtained through an electron microscope, but this is not limited to these measurements. Furthermore, any two values or directions used for comparison may have a certain degree of error. If a first value is equal to a second value, this implies that there may be an error of approximately 10% between the first and second values. If a first direction is perpendicular to a second direction, the angle between the first and second directions may be between 80 and 100 degrees. If the first direction is parallel to the second direction, the angle between the first and second directions may be between 0 and 10 degrees.

[0054] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meanings as commonly understood by those skilled in the art to which this disclosure belongs. It is understood that these terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with the background or context of the relevant technology and this disclosure, and should not be interpreted in an idealized or overly formal manner unless specifically defined in the embodiments of this disclosure.

[0055] When a component (such as a layer or region) is referred to as being "on" another component, it can be directly on the other component or there can be other components between the two components. On the other hand, when a component is referred to as being "directly on" another component, there are no components between the two components. In addition, when a component is referred to as being "on" another component, the two components have a top-to-bottom relationship in a top-down view, and the component can be above or below the other component, depending on the orientation of the device.

[0056] Furthermore, if a value is between a first value and a second value, the value may be the first value, the second value, or another value between the first value and the second value.

[0057] According to some embodiments of the present disclosure, an electronic device is provided that can improve the distribution uniformity of signals (such as power signals) transmitted to each light-emitting unit through the configuration design of the circuit layer, reduce the excessive concentration of signal lines that causes heat accumulation or power loss, and thus improve the display quality of the electronic device, for example, improving the problem of uneven screen brightness.

[0058] According to some embodiments of the present disclosure, the electronic device may include a display device, a light-emitting device, a touch device, a sensing device, a splicing device or a combination thereof, but is not limited thereto. The electronic device may include a bendable or flexible electronic device. According to some embodiments, the electronic device may include a light-emitting diode (LED), a liquid crystal, fluorescence, phosphorescence, a quantum dot (QD), other suitable media, or a combination thereof, but is not limited thereto. The light-emitting diode may, for example, include an organic light-emitting diode (OLED), an inorganic light-emitting diode (inorganic light-emitting diode), a sub-millimeter light-emitting diode (mini LED), a micro LED or a quantum dot light-emitting diode (QD, for example, QLED, QDLED), other suitable materials or any combination thereof, but is not limited thereto. Furthermore, the electronic device may have a rectangular, circular, polygonal, irregular, curved, or other suitable shape. The electronic device may include peripheral systems such as a drive system, a control system, a light source system, or a shelf system to support the display device. The following description of the electronic device will use a display device as an example, but the present disclosure is not limited thereto.

[0059] Please refer to Figure 1A and Figure 1B, Figure 1A and Figure 1B The following is a schematic diagram illustrating the structure of some components of an electronic device 10 according to some embodiments of the present disclosure. It should be understood that for clarity, some components of the electronic device 10 are omitted in the figure and are only shown schematically. According to some embodiments, additional features may be added to the electronic device 10 described below. According to other embodiments, some features of the electronic device 10 described below may be replaced or omitted.

[0060] like Figure 1A and Figure 1B As shown, the electronic device 10 includes a substrate 100, and the substrate 100 has a first surface 100A and a second surface 100B, and the second surface 100B is opposite to the first surface 100A, that is, the first surface 100A and the second surface 100B are surfaces on opposite sides of the substrate 100. Furthermore, the substrate 100 has a side surface 100S, and the side surface 100S is connected to the first surface 100A and the second surface 100B. According to some embodiments, the electronic device 10 has a plurality of light-emitting units P1, and the light-emitting units P1 can be arranged on the first surface 100A. The plurality of light-emitting units P1 can, for example, define an active area (such as a display area or a light-emitting area). The first surface 100A can, for example, face the observer. The electronic device 10 includes a circuit layer 200, and the circuit layer 200 can be arranged on the second surface 100B.

[0061] According to some embodiments, the substrate 100 includes a flexible substrate, a rigid substrate, or a combination thereof, but is not limited thereto. According to some embodiments, the material of the substrate 100 may include glass, quartz, sapphire, ceramic, polyimide (PI), polycarbonate (PC), polyethylene terephthalate (PET), polypropylene (PP), other suitable materials, or a combination thereof, but is not limited thereto.

[0062] According to some embodiments, the light emitting unit P1 may include a light emitting diode, such as an organic light emitting diode, an inorganic light emitting diode such as a sub-millimeter light emitting diode, a micro light emitting diode or a quantum dot light emitting diode (QLED, QDLED), or a combination thereof, but is not limited thereto.

[0063] like Figure 1BAs shown, according to some embodiments, the circuit layer 200 includes a first layer 210 and a second layer 220, with the second layer 220 disposed on the first layer 210. The first layer 210 may include a plurality of first traces 212, and the second layer 220 may include a plurality of second traces 222, with the first traces 212 and the second traces 222 interlaced. According to some embodiments, in the normal direction Z of the substrate 100, the first traces 212 and the second traces 222 may partially overlap or interlace. According to some embodiments, the plurality of first traces 212 may be used to provide data signals or scan signals, and the plurality of second traces 222 may be used to provide power signals. Specifically, according to some embodiments, the first traces 212 may be data lines or scan lines, and the second traces 222 may be power signal lines that transmit an operating voltage (VDD) or a common ground voltage (VSS), but are not limited thereto.

[0064] like Figure 1B As shown, according to some embodiments, the electronic device 10 may include a driving element 300. The driving element 300 may be disposed on the second surface 100B and electrically connected to the first trace 212 and the second trace 222. According to some embodiments, the driving element 300 may include an integrated circuit (IC), a microchip, etc. to control the driving element, but is not limited thereto.

[0065] According to some embodiments, the driver component 300 may be disposed on the second surface 100B of the substrate 100 in the form of a chip on film (COF) package or a chip on glass (COG) package, but the present invention is not limited thereto. Furthermore, the number of driver components 300 is not limited to that shown in the figures. According to different embodiments, the electronic device 10 may have any suitable number of driver components 300.

[0066] like Figure 1BAs shown, according to some embodiments, the second trace 222 may have multiple branch traces, and the first trace 212 may not have branch traces. According to some embodiments, the second surface 100B of the substrate 100 has a side B1, a side B2, a side B3, and / or a side B4, with side B1 opposite to side B2, and side B3 opposite to side B4. According to some embodiments, the first trace 212, for example, extends from side B1 at least to the bottom surface of the driving element 300 (i.e., a surface of the driving element 300 facing the substrate 100), but does not extend to the opposite side B2, but is not limited to this. According to some embodiments, the second trace 222 may extend from side B1 to the bottom surface of the driving element 300 (i.e., a surface of the driving element 300 facing the substrate 100), and may optionally extend to the opposite side B2, but is not limited to this. In addition, according to some embodiments (not shown), the second trace 222 may extend to side B3 and / or side B4, but is not limited to this.

[0067] According to some embodiments, the second routing 222 may have a plurality of branch routings 222-1, and the plurality of branch routings 222-1 may converge and extend to the bottom surface of the driving element 300, and the second routing 222 may be electrically connected to the driving element 300 via corresponding electrode pads (not shown). According to some embodiments, at least two second routings 222 corresponding to the bottom surface of the driving element 300 may be, for example, located between a plurality of first routings 212, but not limited thereto. In other embodiments (not shown), the second routings 222 corresponding to the bottom surface of the driving element 300 and the first routings 212 may, for example, selectively have other configuration methods. In some embodiments, the number of second routings 222 corresponding to the bottom surface of the driving element 300 may be the same as or different from the number of first routings 212 corresponding to the bottom surface of the driving element 300. In some embodiments (such as Figure 1B ), the number of the second traces 222 corresponding to the bottom surface of the driving element 300 is, for example, less than the number of the first traces 212. Figure 1B ), there are, for example, two second traces 222 corresponding to the bottom surface of the driver element 300, one for transmitting the operating voltage (VDD) and the other for transmitting the common ground voltage (VSS), but this is not limited to this. The signals transmitted by the second traces 222 can be adjusted as needed. According to some embodiments, the second trace 222 corresponding to the bottom surface of the driver element 300 can extend toward the side B1 and / or the side B2 and split into multiple branch traces 222-1, but this is not limited to this. In other embodiments, the number of branch traces 222-1 of the second trace 222 can be greater or lesser.

[0068] like Figure 1BAs shown, according to some embodiments, the electronic device 10 includes a plurality of first side lines 212s and a plurality of second side lines 222s. The first side lines 212s are disposed on the side surface 100S of the substrate 100 and are respectively electrically connected to the first traces 212. The second side lines 222s are disposed on the side surface 100S of the substrate 100 and are respectively electrically connected to the second traces 222. The first side lines 212s and the second side lines 222s do not overlap. According to some embodiments, the second side lines 222s are, for example, electrically connected to a branch trace 222-1 of the second trace 222.

[0069] According to some embodiments, the first side circuit 212s and the second side circuit 222s may be electrically connected to circuits disposed on the first surface 100A of the substrate 100. Figure 1A The circuits arranged on the first surface 100A of the substrate 100 are not fully illustrated, but it should be understood that according to some embodiments, the circuits on the first surface 100A can be electrically connected to the light-emitting unit P1, and can be electrically connected to the first trace 212 and the second trace 222 of the circuit layer 200 through the first side trace 212s and / or the second side trace 222s.

[0070] According to some embodiments, the first side lines 212s and the second side lines 222s disposed on the side surface 100S extend substantially along a normal direction Z of the substrate 100, but this is not limited thereto. According to some embodiments, the first side lines 212s and the second side lines 222s disposed on the side surface 100S are substantially parallel to each other and are arranged alternately along a direction X, but this is not limited thereto. Direction X is, for example, a direction perpendicular to the normal direction of the side surface 100S, which may be substantially the longitudinal direction of the side surface 100S. According to some embodiments, in direction X, one of the plurality of first side lines 212s and one of the plurality of second side lines 222s are adjacent and separated by, for example, a first distance D1. The first distance D1 is, for example, the shortest distance between the first side line 212s and the second side line 222s. According to some embodiments, the first distance D1 ranges from 50 micrometers (μm) to 300 micrometers (50 μm ≤ first distance D1 ≤ 300 μm), but is not limited thereto. According to some embodiments, the first distance D1 ranges from 70 μm to 250 μm (70 μm ≤ first distance D1 ≤ 250 μm). According to some embodiments, the first distance D1 ranges from 100 μm to 200 μm (100 μm ≤ first distance D1 ≤ 200 μm).

[0071] Furthermore, in the direction X, a second distance D2 is separated between the first trace 212 and the second trace 222 corresponding to or overlapping the bottom surface of the driving element 300 . The second distance D2 is, for example, the shortest distance between the first trace 212 and the second trace 222 corresponding to this area.

[0072] According to embodiments of the present disclosure, the distance between components, the spacing between components, or the thickness or width of each component can be measured using an optical microscope (OM), a scanning electron microscope (SEM), an α-step thin film thickness profilometer, an ellipsometer, or other suitable methods. Specifically, according to some embodiments, a scanning electron microscope can be used to obtain a cross-sectional image of a structure and measure the distance between components, or the thickness or width of each component.

[0073] According to some embodiments, the materials of the first trace 212, the second trace 222, the first side line 212s, and the second side line 222s may include, but are not limited to, metallic conductive materials, transparent conductive materials, other suitable materials, or combinations thereof. The metallic conductive materials may include, but are not limited to, copper (Cu), silver (Ag), gold (Au), tin (Sn), aluminum (Al), molybdenum (Mo), tungsten (W), chromium (Cr), nickel (Ni), platinum (Pt), titanium (Ti), alloys of any of the foregoing metals, other suitable materials, or combinations thereof. The transparent conductive material may include a transparent conductive oxide (TCO), such as indium tin oxide (ITO), antimony zinc oxide (AZO), tin oxide (SnO), zinc oxide (ZnO), indium zinc oxide (IZO), indium gallium zinc oxide (IGZO), indium tin zinc oxide (ITZO), antimony tin oxide (ATO), other suitable transparent conductive materials, or combinations thereof, but is not limited thereto. According to some embodiments, the first trace 212, the second trace 222, the first side circuit 212s, and the second side circuit 222s may be, for example, a single-layer structure or a multi-layer structure. According to some embodiments, the materials of the first trace 212, the second trace 222, the first side circuit 212s, and the second side circuit 222s may be the same, different, or partially the same and partially different.

[0074] According to some embodiments, the first trace 212, the second trace 222, the first side circuit 212s, and / or the second side circuit 222s may be formed using a screen printing process, an inkjet printing process, a chemical vapor deposition process, a physical vapor deposition process, an electroplating process, an electroless plating process, other suitable methods, or a combination thereof. According to some embodiments, the first trace 212, the second trace 222, the first side circuit 212s, and / or the second side circuit 222s may be patterned using one or more photolithography processes and / or etching processes. According to some embodiments, the photolithography process may include, but is not limited to, photoresist coating (e.g., spin coating), soft baking, hard baking, mask alignment, exposure, post-exposure baking, photoresist development, cleaning, and drying. The etching process may include, but is not limited to, a dry etching process or a wet etching process.

[0075] Furthermore, the first trace 212 and the second trace 222 may be formed in the same or different processes, the first side trace 212s and the second side trace 222s may be formed in the same or different processes, and the process for forming the first trace 212 and the second trace 222 and the process for forming the first side trace 212s and the second side trace 222s may be performed together or separately.

[0076] It is worth noting that compared to the method of configuring the circuit on only one side, that is, the second side circuit 222s is only arranged on one side (such as the side B1), Figure 1B The second side lines 222s are arranged on multiple sides. For example, the second line 222 can extend from the bottom surface of the driving element 300 in different directions, such as extending toward the side B1 and the side B2 and can be split into multiple branch lines 222-1. These branch lines 222-1 are electrically connected to the second side lines 222s arranged on the side B1 and / or the side B2, respectively. The power signal transmitted by the second line 222 can be transmitted to the second side lines 222s located on different sides in a more uniform or dispersed manner. Through these second side lines 222s, the power signal can be transmitted to the light-emitting unit P1 in a multi-endpoint manner, but is not limited thereto. As shown in FIG. Figure 1A As shown, the power signal transmitted via the second trace 222 can be transmitted to different light-emitting units P1 via the second side line 222s disposed on the side B1 and / or the second side line 222s (not shown) disposed on the side B2, thereby reducing the situation where the signal is excessively concentrated and thus generates heat accumulation or power loss. For example, Figure 1AAs shown, the electronic device 10 has a plurality of light-emitting units P1, which are divided into an upper half and a lower half, for example. The second side circuit 222s provided on the side B1 can, for example, transmit different power signals (such as VDD or VSS) to the portion of the light-emitting units P1 corresponding to the lower half, and the second side circuit 222s provided on the side B2 can, for example, transmit different power signals (such as VDD or VSS) to the portion of the light-emitting units P1 corresponding to the upper half, but is not limited thereto. In other embodiments (not shown), the plurality of light-emitting units P1 can be partitioned in other ways, and the second side circuits 222s located on different sides can transmit power signals to the plurality of light-emitting units P1 located in different areas. It should be noted that, Figure 1A The circuit configuration shown on the first surface 100A is only a simple schematic diagram, and some electronic components (such as transistors, capacitors, scan lines or data lines, or other electronic components, etc.) are omitted between the circuits. In other embodiments, the connection relationship between the circuits provided on the first surface 100A and the light-emitting unit P1 can be adjusted as needed. It should be noted that the second side circuits 222s or the second traces 222 that transmit different power signals need to be electrically insulated from each other. For example, when the second side circuits 222s or the second traces 222 that transmit different power signals are the same conductive layer, they need not overlap with each other in the circuit design. For example, when the second side circuits 222s or the second traces 222 that transmit different power signals are different conductive layers, these different conductive layers can be separated by a dielectric layer to reduce short circuit problems.

[0077] It should be understood that the number of first traces 212 and second traces 222, and first side traces 212s and second side traces 222s in the circuit layer 200 is not limited to those shown in the drawings. According to different embodiments, the electronic device 10 may have other suitable numbers of first traces 212, second traces 222, first side traces 212s, and second side traces 222s.

[0078] Next, please refer to Figure 2A as well as Figure 2B , Figure 2A as well as Figure 2B According to some embodiments of the present disclosure, Figure 1B It should be understood that for the sake of clarity, Figure 2A as well as Figure 2B Only the first layer 210, the second layer 220 and the protective layer 400 of the circuit layer 200 are shown, and other components are omitted. The first layer 210 and the second layer 220 of the cross-sectional structural diagram only show a single layer structure, but the first layer 210 and the second layer 220 can selectively be a single layer or a multi-layer structure.

[0079] like Figure 2A as well as Figure 2B As shown, according to some embodiments, the electronic device 10 includes a protective layer 400, and the protective layer 400 covers the circuit layer 200. According to some embodiments, the protective layer 400 can be disposed on the second surface 100B of the substrate 100, but in order to Figure 2A More clearly, Figure 2A The protective layer is omitted and not shown. The protective layer 400 can refer to Figure 2B Specifically, the protective layer 400 may include at least one sublayer, for example, the protective layer 400 may include a first sublayer 400a and a second sublayer 400b, wherein the first sublayer 400a covers the first layer 210 (for example, a plurality of first traces 212) of the circuit layer 200, and the second sublayer 400b covers the second layer 220 (for example, a plurality of second traces 222) of the circuit layer 200. The first layer 210 and the second layer 220 belong to different layers of the circuit layer 200, but are not limited thereto. According to some embodiments (such as the subsequent Figure 3 ), the protection layer 400 can be disposed on the plurality of first side lines 212s and the plurality of second side lines 212s.

[0080] According to some embodiments, the protective layer 400 can be used to protect the first trace 212 and the second trace 222, reducing the risk of corrosion or oxidation of the first trace 212 and / or the second trace 222 due to moisture or oxygen. According to some embodiments, the protective layer 400 may include an organic material, an inorganic material, other suitable protective materials, or a combination thereof, but is not limited thereto. According to some embodiments, the inorganic material may include silicon nitride, silicon oxide, silicon oxynitride, aluminum oxide, or other suitable materials, but is not limited thereto. According to some embodiments, the organic material may include epoxy resins, silicone resins, acrylic resins (e.g., polymethylmethacrylate (PMMA), benzocyclobutene (BCB), polyimide, polyester, polydimethylsiloxane (PDMS), tetrafluoroethylene-perfluoroalkoxy vinyl ether copolymer (PFA)), other suitable materials, or a combination thereof, but is not limited thereto. Furthermore, the material of the first sub-layer 400a and the second sub-layer 400b of the protection layer 400 may be the same or different. According to some embodiments, the material of the first sub-layer 400a may have dielectric properties to reduce short circuits between the first trace 212 and the second trace 222 .

[0081] In addition, if Figure 2AAs shown, according to some embodiments, the second layer 220 of the circuit layer 200 is disposed on the first layer 210, that is, the second trace 222 is disposed on the first trace 212. According to some embodiments, as Figure 2B As shown, the first layer 210 of the circuit layer 200 may be disposed on the second layer 220 , that is, the first trace 212 is disposed on the second trace 222 .

[0082] According to some embodiments, one of the plurality of first traces 212 has a first line width W1, and one of the plurality of second traces 222 has a second line width W2, where the second line width W2 is greater than or equal to the first line width W1 (the second line width W2 ≥ the first line width W1). The first line width W1 is defined as the maximum width of the first trace 212 in the direction X, and the second line width W2 is defined as the maximum width of the second trace 222 in the direction X. According to some embodiments, the width of one of the plurality of second traces 222 located on the second surface 100B of the substrate 100 (i.e., the second line width W2) or the width W2-1 of the second side trace 222s located on the side surface 100S (see FIG. 1 ). Figure 1A The maximum width of the second side line 222s in the X direction) may be greater than or equal to the width W2-2 of the second trace 222 located on the first surface 100A of the substrate 100 (refer to Figure 1A The maximum width of the second trace 222 in the X-direction is, but is not limited to, this. According to some embodiments, the thickness T2 of the second trace 222 on the second surface 100B of the substrate 100 or the thickness of the second side circuit 222s (not shown) may be greater than or equal to the thickness of the second trace 222 on the first surface 100A of the substrate 100 (not shown), but is not limited to this. By designing the width (or thickness) of the second trace 222 or the second side circuit 222s on the second surface 100B to be greater than the width or thickness of the second trace 222 on the first surface 100A, the resistance of the second trace 222 or the second side circuit 222s on the second surface 100B can be reduced, thereby reducing power loss and other issues.

[0083] Next, please refer to Figure 3 , Figure 3 Schematic diagrams of the structure of some components of an electronic device 20 according to other embodiments of the present disclosure are shown. It should be understood that components or elements that are the same or similar to those described above will be represented by the same or similar reference numerals, and their materials, manufacturing methods, and functions are the same or similar to those described above, and therefore will not be described in detail hereafter.

[0084] Figure 3 The electronic device 20 shown is Figure 1BThe electronic device 10 shown is substantially similar, with the difference that the protective layer 400 of the electronic device 20 may be disposed on the side surface 100S of the substrate 100. The protective layer 400 may cover the plurality of first-side circuits 212s and the plurality of second-side circuits 222s. According to some embodiments, the protective layer 400 may cover the circuit layer 200, the first-side circuits 212s, and / or the second-side circuits 222s, but is not limited thereto. According to some embodiments, the protective layer 400 may be at least partially disposed on the driving element 300.

[0085] According to some embodiments, the first side wiring 212s and / or the second side wiring 222s disposed on the side surface 100S of the substrate 100 may contact the side surface 100S. According to some embodiments, the first side wiring 212s and the second side wiring 222s may be located on the same layer, and the protective layer 400 may cover the first side wiring 212s and the second side wiring 222s, but the present invention is not limited thereto. According to some embodiments, the protective layer 400 disposed on the side surface 100S may include a first sublayer (not shown) and a second sublayer (not shown), wherein the first sublayer (not shown) may cover the first side wiring 212s, and the second sublayer (not shown) may cover the second side wiring 222s, but the present invention is not limited thereto.

[0086] Next, please refer to Figure 4 , Figure 4 Shows a schematic diagram of the structure of some components of the electronic device 30 according to some other embodiments of the present disclosure. Figure 4 As shown, according to some embodiments, the circuit layer 200 of the electronic device 30 includes a plurality of first traces 212 and a plurality of second traces 222, and the plurality of first traces 212 and the plurality of second traces 222 do not overlap with each other or are arranged alternately along a direction X. Specifically, in the normal direction Z of the substrate 100, the first traces 212 and the second traces 222 do not overlap, and the first side traces 212s and the second side traces 222s disposed on the side surface 100S of the substrate 100 also do not overlap. According to some embodiments, the first side traces 212s and the second side traces 222s disposed on the side surface 100S are substantially parallel to each other, but are not limited thereto. According to some embodiments, the plurality of first side traces 212s and the plurality of second side traces 222s are arranged alternately along a direction X.

[0087] It should be understood that although in the illustrated embodiment, the first side lines 212s and the second side lines 222s are arranged alternately in a one-to-one manner (i.e., one first side line 212s, followed by one second side line 222s, which is then connected to one first side line 212s, etc.), according to other embodiments, the first side lines 212s and the second side lines 222s may be arranged alternately in any other suitable number and manner. For example, the first side lines 212s and the second side lines 222s may be arranged alternately in a one-to-many manner (i.e., one first side line 212s, followed by multiple second side lines 222s, which are then connected to one first side line 212s, etc.), or in a many-to-one manner (i.e., multiple first side lines 212s, followed by one second side line 222s, which are then connected to multiple first side lines 212s, etc.), or in a many-to-many manner, but the present disclosure is not limited thereto.

[0088] like Figure 4 As shown, according to some embodiments, the plurality of second traces 222 may not have branch lines, and these second traces 222 may extend from the side B1 to the side B2 of the substrate 100. In other words, the second traces 222 extending from the side B1 to the bottom surface of the driver element 300 may be electrically connected to the second traces 222 extending from the side B2 to the driver element 300.

[0089] Figure 4 The circuit configuration can also allow the power signal transmitted by the second trace 222 to be transmitted to the second side circuits 222s located on different sides in a more uniform or distributed manner. Through these second side circuits 222s, the power signal can be transmitted to the light-emitting unit P1 in a multi-endpoint manner.

[0090] Next, please refer to Figure 5 , Figure 5 According to some embodiments of the present disclosure, Figure 4 It should be understood that for the sake of clarity, Figure 5 Only the first trace 212 , the second trace 222 and the protection layer 400 of the circuit layer 200 are shown, and other elements are omitted.

[0091] like Figure 5As shown, according to some embodiments, the protective layer 400 may have a single-layer structure, and the plurality of second traces 222 and the plurality of first traces 212 may be located on the same layer. According to some embodiments, the second traces 222 and the first traces 212 may be in contact with the second surface 100B of the substrate 100, and the protective layer 400 may cover the first traces 212 and the second traces 222. In this embodiment, the first side traces 212s and the second side traces 222s may be in contact with the side surface 100S of the substrate 100, that is, the first side traces 212s and the second side traces 222s may be located on the same layer. Furthermore, in this embodiment, the first traces 212 and the second traces 222 may be formed in the same process. The first side traces 212s and the second side traces 222s may be formed in the same or different processes, and the process for forming the first traces 212 and the second traces 222 may be performed together or separately from the process for forming the first side traces 212s and the second side traces 222s.

[0092] Next, please refer to Figure 6 , Figure 6 Shown is a schematic diagram of the structure of some components of the spliced electronic device 40 according to some other embodiments of the present disclosure. Figure 6 As shown, the spliced electronic device 40 may include electronic devices 10U that are spliced adjacent to each other, and the structure of the electronic device 10U may be the same as or similar to the electronic device described in any of the aforementioned embodiments or a combination thereof. According to some embodiments, the side B3 and side B4 of the substrate 100 of the electronic device 10U may be selectively not provided with wiring to facilitate joining the substrates 100 of two adjacent electronic devices 10U, such as joining the side B4 of the substrate 100 of the left electronic device 10U with the side B3 of the substrate 100 of the right electronic device 10U, thereby reducing the gap at the splicing point of the two electronic devices 10U and reducing the interference of the gap at the splicing point on the image display quality, but the present invention is not limited thereto. According to different embodiments, the spliced electronic device 40 may have any suitable number of electronic devices 10U and may be spliced in other suitable ways.

[0093] In summary, according to some embodiments of the present disclosure, in the provided electronic device, the configuration design of the circuit and / or the channel of the driving element can be used to improve the uniformity of the distribution of the circuit (e.g., the power signal line) in the active area, thereby reducing the situation where excessive current concentration causes heat accumulation or power loss, or further improve the display image quality of the electronic device, for example, to improve the problem of uneven screen brightness.

[0094] Although the embodiments of the present disclosure and their advantages have been disclosed as above, it should be understood that any person skilled in the art can make changes, substitutions and modifications without departing from the spirit and scope of the present disclosure. The features between the embodiments of the present disclosure can be arbitrarily mixed and matched for use as long as they do not violate the spirit of the invention or conflict with each other. In addition, the scope of protection of the present disclosure is not limited to the processes, machines, manufactures, material compositions, devices, methods and steps in the specific embodiments described in the specification. Any person skilled in the art can understand from the disclosure of the present disclosure that the processes, machines, manufactures, material compositions, devices, methods and steps currently or in the future can be used according to the present disclosure as long as they can implement substantially the same functions or obtain substantially the same results in the embodiments described herein. Therefore, the scope of protection of the present disclosure includes the above-mentioned processes, machines, manufactures, material compositions, devices, methods and steps. The scope of protection of the present disclosure shall be based on the scope of the claims. Any embodiment or claim of the present disclosure is not required to achieve all the purposes, advantages and features disclosed in this disclosure.

Claims

1. An electronic device, characterized in that: include: A substrate having a first surface, a second surface, a first side surface, and a second side surface, wherein the second surface is opposite to the first surface, the first side surface is opposite to the second side surface, the first side surface is connected to the first surface and the second surface, and the second side surface is connected to the first surface and the second surface, wherein the second surface has a first side edge and a second side edge opposite to each other, the first side edge is connected to the first side edge, and the second side edge is connected to the second side edge; a light-emitting unit disposed on the first surface; a circuit layer disposed on the second surface, the circuit layer comprising a first layer and a second layer, the second layer being disposed on the first layer, the first layer comprising a plurality of first traces, the second layer comprising a plurality of second traces, and the plurality of first traces being interlaced with the plurality of second traces; a plurality of first side circuits, disposed on the first side surface and electrically connected to the plurality of first traces respectively; as well as A plurality of second side lines are provided on the first side surface and are electrically connected to the plurality of second traces respectively. wherein at least one of the plurality of first traces extends to the first side, at least one of the plurality of second traces extends to the first side, and at least another one of the plurality of second traces extends to the second side, The plurality of first wirings are data lines or scan lines, and the plurality of second wirings are power signal lines.

2. The electronic device according to claim 1, wherein The plurality of first side lines and the plurality of second side lines do not overlap with each other.

3. The electronic device according to claim 2, wherein The plurality of first side lines and the plurality of second side lines are alternately arranged along a direction.

4. The electronic device according to claim 3, wherein One of the plurality of first side lines is adjacent to one of the plurality of second side lines and is separated by a first distance, and the first distance ranges from 50 micrometers to 300 micrometers.

5. The electronic device according to claim 1, wherein: The line width of one of the plurality of second routing lines is greater than the line width of one of the plurality of first routing lines.

6. The electronic device according to claim 1, wherein: Also includes: A protection layer has a first sublayer and a second sublayer, wherein the first sublayer covers the plurality of first traces, and the second sublayer covers the plurality of second traces.

7. The electronic device according to claim 1, wherein: Also includes: A driving element is disposed on the second surface and electrically connected to the plurality of first traces and the plurality of second traces.

8. An electronic device, characterized in that: include: A substrate having a first surface, a second surface, a first side surface, and a second side surface, wherein the second surface is opposite to the first surface, the first side surface is opposite to the second side surface, the first side surface is connected to the first surface and the second surface, and the second side surface is connected to the first surface and the second surface, wherein the second surface has a first side edge and a second side edge opposite to each other, the first side edge is connected to the first side edge, and the second side edge is connected to the second side edge; a light-emitting unit disposed on the first surface; A circuit layer is disposed on the second surface, the circuit layer including a first layer, the first layer including a plurality of first traces and a plurality of second traces, and the plurality of first traces and the plurality of second traces are alternately arranged along a direction; a plurality of first-side circuits, disposed on the first side surface and electrically connected to the plurality of first traces respectively; and A plurality of second side lines are provided on the first side surface and are electrically connected to the plurality of second traces respectively. wherein at least one of the plurality of first traces extends to the first side, at least one of the plurality of second traces extends to the first side, and at least another one of the plurality of second traces extends to the second side, The plurality of first wirings are data lines or scan lines, and the plurality of second wirings are power signal lines.

9. The electronic device according to claim 8, wherein: The plurality of first side lines and the plurality of second side lines do not overlap with each other.

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