Touch sensing modules and electronic devices

Abstract

This disclosure provides a touch sensing module and an electronic device. The touch sensing module includes: a first sensing coil and a second sensing coil, both having inductance that varies in response to an applied force touch; a first pad having capacitance that varies in response to an applied contact touch, the first pad being positioned closer to the second sensing coil than to the first sensing coil and electrically connected to the first sensing coil to form a first resonant circuit; and a second pad having capacitance that varies in response to the applied contact touch, the second pad being positioned closer to the first sensing coil than to the second sensing coil and electrically connected to the second sensing coil to form a second resonant circuit.

Description

[0001] This application claims the benefit of priority to Korean Patent Application No. 10-2020-0141906, filed on October 29, 2020, with the Korean Intellectual Property Office, the entire disclosure of which is incorporated herein by reference for all purposes. Technical Field

[0002] The following description relates to touch sensing modules and electronic devices that include touch sensing modules. Background Technology

[0003] Typically, wearable devices are expected to be thin and have a simple, clean design. To achieve this, non-mechanical switches implemented using dustproof and waterproof technologies can be used to replace existing mechanical switches in wearable devices, enabling the production of wearable devices with seamless housings.

[0004] Current technologies such as Touch on Metal (ToM) for achieving touch on metal surfaces, capacitive sensing methods using touch panels, microelectromechanical systems (MEMS), microstrain gauges, and others have been developed. Furthermore, force touch functionality is under development.

[0005] In the case of existing mechanical switches, large size and a lot of internal space may be required to realize the switching function, and the outward protruding shape of the switch (which may not be integrated with the housing) may result in a somewhat messy design and require a lot of space.

[0006] Furthermore, there is a risk of electric shock due to direct contact with the electrically connected mechanical switch. Additionally, the structure of the mechanical switch may make it difficult to achieve dust and water resistance.

[0007] The above information is presented as background information only to aid in understanding this disclosure. No determination or assertion is made regarding whether any of the above content is suitable as prior art to this disclosure. Summary of the Invention

[0008] The present invention is provided to introduce, in a simplified form, the selected concepts further described in the detailed embodiments below. The present invention is not intended to limit the key or essential features of the claimed subject matter, nor is it intended to be used to help determine the scope of the claimed subject matter.

[0009] In one general aspect, a touch sensing module includes: a first sensing coil and a second sensing coil, both having inductance that varies in response to an applied force touch; a first pad having capacitance that varies in response to an applied contact touch, the first pad being positioned closer to the second sensing coil than to the first sensing coil and electrically connected to the first sensing coil to form a first resonant circuit; and a second pad having capacitance that varies in response to the applied contact touch, the second pad being positioned closer to the first sensing coil than to the second sensing coil and electrically connected to the second sensing coil to form a second resonant circuit.

[0010] The first resonant circuit may be configured to generate a first resonant signal having a first resonant frequency that varies in response to an applied touch, the applied touch including either or both of an applied force touch and an applied contact touch. The second resonant circuit may be configured to generate a second resonant signal having a second resonant frequency that varies in response to the applied touch, the applied touch including either or both of an applied force touch and an applied contact touch.

[0011] The touch sensing module may further include: a detection circuit electrically connected to the first resonant circuit and the second resonant circuit, and configured to determine the touch application position based on the change in the first resonant frequency and the change in the second resonant frequency.

[0012] The detection circuit may also be configured to: compare the change in the first resonant frequency with the change in the second resonant frequency; determine that the applied touch is applied to the first resonant circuit in response to the change in the first resonant frequency being greater than the change in the second resonant frequency; and determine that the applied touch is applied to the second resonant circuit in response to the change in the second resonant frequency being greater than the change in the first resonant frequency.

[0013] The first resonant circuit may also be configured to generate the first resonant signal based on the sum of the change in the first resonant frequency depending on the change in the inductance of the first sensing coil and the change in the first resonant frequency depending on the change in the capacitance of the first pad. The second resonant circuit may also be configured to generate the second resonant signal based on the sum of the change in the second resonant frequency depending on the change in the inductance of the second sensing coil and the change in the second resonant frequency depending on the change in the capacitance of the second pad.

[0014] The first sensing coil and the second sensing coil may be spaced apart from each other. The second pad and the first pad may be symmetrically disposed outside the first sensing coil and the second sensing coil, respectively.

[0015] The touch sensing module may further include: a third sensing coil having an inductance that varies in response to the applied force of the touch, the third sensing coil being spaced apart from the second sensing coil to be symmetrical with respect to the first sensing coil about the second sensing coil; a third pad having a capacitance that varies in response to the applied contact touch, the third pad being positioned closer to the second sensing coil than to the first sensing coil and the third sensing coil, and being electrically connected to the third sensing coil to form a third resonant circuit; and an additional second pad having a capacitance that varies in response to the applied contact touch, the additional second pad being positioned closer to the third sensing coil than to the first sensing coil and the second sensing coil, and being electrically connected to the second sensing coil.

[0016] The touch sensing module may further include at least one sensing coil disposed between the first sensing coil and the second sensing coil.

[0017] In another general aspect, an electronic device includes: a touch switch unit disposed on a housing; and a touch sensing module configured to sense touch input applied to the touch switch unit. The touch switch unit includes a first touch member and a second touch member. The touch sensing module includes: a first sensing coil and a second sensing coil, both having inductance that varies in response to an applied force touch, the first sensing coil and the second sensing coil being disposed on inner portions spaced apart from the first touch member and the second sensing coil being spaced apart from the second touch member, respectively; a first pad having capacitance that varies in response to an applied contact touch, the first pad being disposed on the inner portion spaced apart from the second touch member, and the first pad being electrically connected to the first sensing coil to form a first resonant circuit; and a second pad having capacitance that varies in response to the applied contact touch, the second pad being disposed on the inner portion spaced apart from the first touch member, and the second pad being electrically connected to the second sensing coil to form a second resonant circuit.

[0018] The first sensing coil and the first pad may be configured to generate a first resonant signal having a first resonant frequency that varies in response to an applied touch, including either an applied force touch or an applied contact touch, applied to the touch switch unit. The second sensing coil and the second pad may be configured to generate a second resonant signal having a second resonant frequency that varies in response to an applied touch, including either an applied force touch or an applied contact touch, applied to the touch switch unit.

[0019] The touch sensing module can be configured to determine the touch application position in the touch switch unit based on the change in the first resonant frequency and the change in the second resonant frequency.

[0020] The first resonant signal can be generated based on the sum of the changes in the first resonant frequency depending on the change in inductance of the first sensing coil and the changes in the first resonant frequency depending on the change in capacitance of the first pad. Similarly, the second resonant signal can be generated based on the sum of the changes in the second resonant frequency depending on the change in inductance of the second sensing coil and the changes in the second resonant frequency depending on the change in capacitance of the second pad.

[0021] The amount of change of the first resonant frequency and the amount of change of the second resonant frequency can be compared with each other to determine that the applied touch is applied to the first touch member in response to the amount of change of the first resonant frequency being greater than the amount of change of the second resonant frequency, and to determine that the applied touch is applied to the second touch member in response to the amount of change of the second resonant frequency being greater than the amount of change of the first resonant frequency.

[0022] The first sensing coil and the second sensing coil may be spaced apart from each other. The second pad and the first pad may be symmetrically disposed outside the first sensing coil and the second sensing coil, respectively.

[0023] The touch switch unit may further include a third touch component. The touch sensing module may further include: a third sensing coil having an inductance that varies in response to the applied force of the touch, the third sensing coil being disposed on an inner portion spaced apart from the third touch component; a third pad having a capacitance that varies in response to the applied contact touch, the third pad being disposed on the inner portion spaced apart from the second touch component, and the third pad being electrically connected to the third sensing coil to form a third resonant circuit; and an additional second pad having a capacitance that varies in response to the applied contact touch, the additional second pad being disposed on the inner portion spaced apart from the third touch component and electrically connected to the second sensing coil.

[0024] The first sensing coil and the second pad may be positioned facing the first touch member. The third sensing coil and the additional second pad may be positioned facing the third touch member. The second sensing coil, the first pad, and the third pad may be positioned facing the second touch member.

[0025] The electronic device may further include: at least one sensing coil disposed between the first sensing coil and the second sensing coil.

[0026] The first sensing coil and the second pad may be positioned facing the first touch component. The second sensing coil and the first pad may be positioned facing the second touch component.

[0027] Other features and aspects will become apparent from the following detailed description, drawings, and claims. Attached Figure Description

[0028] Figure 1 This is a perspective view showing the appearance of an electronic device according to an example.

[0029] Figure 2 It shows relative to Figure 1 An example view of the cross-sectional structure (XY section) of one side surface of an electronic device.

[0030] Figure 3 It is shown in Figure 2 A view of an example of the structure in a touch sensing module, showing the sensing coil and pad connected to each other.

[0031] Figure 4A and Figure 4B It shows the application based on what is applied to Figure 2 A schematic diagram illustrating an example of touch changes in a touch switch unit.

[0032] Figure 5 It is shown in Figure 2 A schematic diagram illustrating an example of the connection structure of the circuitry included in the touch sensing module.

[0033] Figure 6 It shows that when... Figure 2 A view showing the changes that occur when a touch is applied to the touch sensing module, and an example of a sensing method based on those changes.

[0034] Figure 7 This is an example view showing the structure of a touch sensing module, where the sensing coil and pad are connected to each other.

[0035] Figure 8This is an example view showing the structure of a touch sensing module according to another example, in which the sensing coil and pad are connected to each other.

[0036] Throughout the accompanying drawings and detailed embodiments, the same reference numerals indicate the same elements. The drawings may not be drawn to scale, and for clarity, illustration, and convenience, the relative sizes, scales, and depictions of the elements in the drawings may be exaggerated. Detailed Implementation

[0037] The following detailed embodiments are provided to aid the reader in gaining a comprehensive understanding of the methods, apparatus, and / or systems described herein. However, various changes, modifications, and equivalents of the methods, apparatus, and / or systems described herein will be apparent upon understanding this disclosure. For example, the order of operations described herein is merely illustrative and is not limited to the order set forth herein; rather, changes may be made that will be apparent upon gaining an understanding of this disclosure, except for operations that must be performed in a specific order. Furthermore, for clarity and brevity, descriptions of features known in the art may be omitted.

[0038] The features described herein may be implemented in different forms and are not to be construed as limited to the examples described herein. Rather, the examples provided herein are merely to illustrate some of the many feasible ways of implementing the methods, apparatus, and / or systems described herein that will be apparent upon understanding this disclosure. In the following, although embodiments of the disclosure will be described in detail with reference to the accompanying drawings, it should be noted that the examples are not limited thereto.

[0039] Throughout this specification, when an element such as a layer, region, or substrate is described as being "on" another element, "connected" to another element, or "bonded" to another element, the element may be directly "on" said other element, directly "connected" to said other element, or directly "bonded" to said other element, or there may be one or more other elements between them. In contrast, when an element is described as being "directly on" another element, directly "connected" to another element, or "bonded" to another element, there are no other elements between them. As used herein, a "part" of an element may include the entire element or less than the entire element.

[0040] As used herein, the term “and / or” includes any one or any combination of two or more of the relevant listed items; similarly, “at least one of…” includes any one and any combination of two or more of the relevant listed items.

[0041] Although terms such as “first,” “second,” and “third” may be used herein to describe various components, assemblies, regions, layers, or parts, these components, assemblies, regions, layers, or parts will not be limited by these terms. Rather, these terms are used only to distinguish one component, assembly, region, layer, or part from another. Therefore, without departing from the teaching of the examples described herein, the first component, first assembly, first region, first layer, or first part referred to as the first component, first assembly, first region, first layer, or first part may also be referred to as the second component, second assembly, second region, second layer, or second part.

[0042] For ease of description, spatial relative terms such as “above,” “above,” “below,” and “under” are used herein to describe the relationship between one element and another as shown in the accompanying drawings. Such spatial relative terms are intended to include not only the orientation depicted in the drawings but also the different orientations of the device during use or operation. For example, if the device in the drawings is flipped, an element described as being “above” or “above” relative to another element will be “below” or “under” relative to that other element. Therefore, the term “above” includes both “above” and “below” orientations depending on the spatial orientation of the device. The device may also be positioned in other ways (rotated 90 degrees or in other orientations), and the spatial relative terms used herein will be interpreted accordingly.

[0043] The terminology used herein is for the purpose of describing various examples only and is not intended to limit this disclosure. Unless the context clearly indicates otherwise, the singular form is intended to include the plural form as well. The terms “comprising,” “including,” and “having” enumerate the presence of the stated features, quantities, operations, components, elements, and / or combinations thereof, but do not exclude the presence or addition of one or more other features, quantities, operations, components, elements, and / or combinations thereof.

[0044] Due to manufacturing techniques and / or tolerances, variations in the shapes shown in the accompanying drawings may occur. Therefore, the examples described herein are not limited to the specific shapes shown in the drawings, but include changes in shape that occur during manufacturing.

[0045] The features of the examples described herein can be combined in various ways that will be apparent upon understanding this disclosure. Furthermore, although the examples described herein have various constructions, other constructions that will be apparent upon understanding this disclosure are possible.

[0046] Here, it should be noted that the use of the term “may” in relation to examples (e.g., what an example may include or implement) implies that there exists at least one example that includes or implements such a feature, but not all examples are limited to this.

[0047] Figure 1This is a perspective view showing the exterior of the electronic device 10 according to the example.

[0048] Reference Figure 1 The electronic device 10 may include, for example, a front display glass 52, a rear glass 53, and a housing 500.

[0049] The front display glass 52 may be disposed on one surface of the electronic device 10, and the rear glass 53 may be disposed on another surface (e.g., the opposite surface) of the electronic device 10.

[0050] The housing 500 may be an outer shell exposed to the outside of the electronic device 10. As an example, when a touch sensing module is applied to the electronic device 10 and the electronic device 10 is a mobile device, the housing 500 may be a cover disposed on a side surface of the electronic device 10. The housing 500 may be integrated with the rear glass 53, which may be disposed on the rear surface of the electronic device 10, or the housing 500 may be separate from the rear glass 53, which may be disposed on the rear surface of the electronic device 10.

[0051] The electronic device 10 may include a touch switch unit (TSW). The touch switch unit (TSW) may be disposed on the housing 500, but is not limited to being disposed on the housing 500. Additionally, the touch switch unit (TSW) may include a single switch unit or may be as follows: Figure 1 The area shown includes multiple switching units.

[0052] The following description will provide an example of a touch switch unit TSW including multiple switch units, and the multiple switch units will be defined as a first touch component TM1, a second touch component TM2, etc.

[0053] As described above, when multiple touch components (e.g., first touch component TM1 and second touch component TM2) are included in the touch switch unit TSW, the multiple touch components can be implemented as switches with different functions. For example, the first touch component TM1 can be used as a volume down switch, and the second touch component TM2 can be used as a volume up switch.

[0054] For example, a touch switch unit (TSW) including three touch components may include touch components that function as a volume down switch, a volume up switch, and a power (on / off) switch, respectively. However, the functions of the touch components described above are merely examples, and the functions of the touch components may be configured differently, so that the touch components are used according to the type or characteristics of the electronic device.

[0055] In the description herein, "touch" or "touch application" can include a contact touch performed to contact the touch switch unit TSW without accompanying force, and a force touch performed to press the touch switch unit TSW with accompanying force (e.g., pressure). Therefore, it will be understood that the term "touch" encompasses an operation including at least one of contact touch and force touch.

[0056] Reference Figure 1 The electronic device 10 is not limited to a specific device, and may include, but is not limited to, electronic devices having switches for controlling operation, such as portable devices like smartphones, wearable devices like smartwatches, etc.

[0057] Electronic device 10 may correspond to, for example, smartphones, personal digital assistants (PDAs), digital cameras, digital cameras, network systems, computers, monitors, tablet PCs, laptop PCs, netbook PCs, televisions, video game consoles, smartwatches, automobiles, etc.

[0058] In the case of electronic devices such as general-purpose mobile phones, volume buttons or power buttons may be formed as physical buttons (keys) on the side of the mobile phone. In this case, the physical button should protrude so that it can be pressed by hand. However, when using physical buttons, they have a limited lifespan due to physical wear and tear. In addition, the protruding shape of the physical button may make it difficult to implement a waterproof structure.

[0059] In the following text, reference will be made to Figures 2 to 7 This describes an example touch sensing module and electronic device configured to solve the above problems.

[0060] For components that have the same reference numerals and the same function in the examples of the various figures, unnecessary repetitive descriptions may be omitted, while the differences between the examples in the various figures may be described.

[0061] exist Figures 2 to 5 The diagram illustrates the structure and operation of a touch sensing module comprising two touch components (a first touch component TM1 and a second touch component TM2) according to an example, such that an example will be described with reference to the accompanying drawings.

[0062] Figure 2 It shows relative to Figure 1 An example view of the cross-sectional structure (XY section) of one side surface of the electronic device 10. Figure 3 It is shown in Figure 2 A view of an example structure in which a first sensing coil 101 and a second sensing coil 102, as well as a first pad 401 and a second pad 402, are connected to each other in a touch sensing module. Figure 4A and Figure 4B It shows the application based on what is applied to Figure 2 A schematic diagram illustrating an example of a touch switch unit (TSW) that changes upon touch, and Figure 5 It is shown in Figure 2 A schematic diagram illustrating an example of the connection structure of circuits 600 and 700 included in the touch sensing module.

[0063] Reference Figure 1 and Figure 2 For example, one side surface of the electronic device 10 may be provided with a housing 500 corresponding to a side cover, and at least a certain area of ​​the housing 500 may be provided with a touch switch unit (TSW). For reference, another touch switch unit may be provided on the other side surface of the electronic device 10. The description of the touch switch unit (TSW) on one side surface can be equivalently applied to the touch switch unit on the other side surface.

[0064] A touch switch unit (TSW) may include multiple touch components. For example, such as Figure 2 As shown, the first touch component TM1 and the second touch component TM2 can be arranged parallel to each other to form a touch switch unit (TSW). The shape of each touch component and the structure in which multiple touch components are arranged can be modified in various ways. Figure 2 The shapes and structures shown are just one example among many.

[0065] Additionally, no dividing lines or surfaces need to be provided between the multiple touch components (e.g., TM1 and TM2). Therefore, the two side surfaces of the electronic device 10 can have a seamless appearance.

[0066] However, in this case, depending on the intensity of the touch applied to each touch component, some of the force may be transmitted to other touch components, leading to malfunction.

[0067] Therefore, in the disclosure herein, when force is simultaneously transmitted to adjacent touch components through a user's touch operation, a touch input signal can be generated only in the touch component the user intends to press (e.g., a specific switch) to reduce the occurrence of malfunctions. For example, as Figures 2 to 5 As shown, the electronic device 10 may include a touch sensing module 50. The touch sensing module 50 includes a first sensing coil 101 and a second sensing coil 102 respectively disposed below the first touch component TM1 and the second touch component TM2, and a first pad 401 and a second pad 402 respectively disposed below the second touch component TM2 and the first touch component TM1, so as to clearly distinguish the signals between different touch switches.

[0068] The touch sensing module 50 can be inserted into the housing 500 and disposed on the inner side spaced apart from the housing 500. The touch sensing module 50 can sense touch input applied to the touch switch unit TSW.

[0069] More specifically, the touch sensing module 50 can detect force touch input using inductive sensing and capacitive sensing methods. For example, a touch input signal can be generated based on the result of both inductive sensing performed by the first sensing coil 101 and the second sensing coil 102 and capacitive sensing performed by the first pad 401 and the second pad 402.

[0070] like Figure 4A and Figure 4B As shown, when a user applies a touch to the touch switch unit TSW, the housing 500 can bend inward around the point of application of the touch (“touch application point”). Therefore, the size of the air gap formed between each of the first sensing coil 101 and the second sensing coil 102 and the housing 500 can be changed.

[0071] Changes in the air gap size may cause changes in inductance. When an inductance change greater than or equal to a reference value is sensed, the touch sensing module 50 can detect that a force-actuated touch input has been applied to the touch switch unit TSW.

[0072] Furthermore, when a user applies a touch to the touch switch unit TSW, the size of the air gap formed between each of the first pad 401 and the second pad 402 and the housing 500 can also change. In this case, each of the first pad 401 and the second pad 402 may experience a change in capacitance.

[0073] The touch sensing module 50 can simultaneously sense this change in inductance and this change in capacitance, so as to use the amplification of the signal amplitude to more clearly distinguish touch operations between adjacent sensors.

[0074] Reference Figure 2 and Figure 3 The touch sensing module 50 may include a first sensing coil 101 and a second sensing coil 102, a first pad 401 and a second pad 402, a substrate 200, a bracket 300, and a sensing circuit CS. The first sensing coil 101 and the second sensing coil 102 may be disposed on the substrate 200, and the substrate 200 may be fixed to the internal space of the housing 500 by the bracket 300.

[0075] The first sensing coil 101 may be disposed on an inner portion spaced apart from the first touch member TM1, and the second sensing coil 102 may be disposed on an inner portion spaced apart from the second touch member TM2. For example, the first sensing coil 101 and the second sensing coil 102 may be spaced apart from the housing 500, and the first sensing coil 101 may be disposed facing the first touch member TM1, and the second sensing coil 102 may be disposed facing the second touch member TM2. The first touch member TM1 and the second touch member TM2 may be spaced apart from the first sensing coil 101 and the second sensing coil 102 by a predetermined distance, respectively, to form an air gap between the first touch member TM1 and the first sensing coil 101 and between the second touch member TM2 and the second sensing coil 102.

[0076] The shape of each of the first sensing coil 101 and the second sensing coil 102 is not limited. Figure 2 In the diagram, the coil patterns of the first sensing coil 101 and the second sensing coil 102 are shown as having a rectangular shape. However, the coil patterns can be formed in various shapes, such as circular shapes, track shapes, etc. Furthermore, each of the first sensing coil 101 and the second sensing coil 102 can be implemented by forming a wiring pattern on a printed circuit board (PCB) or a flexible PCB (FPCB) or by providing a chip inductor.

[0077] Each of the first sensing coil 101 and the second sensing coil 102 may have an inductance that varies with the applied force of a touch. For example, the housing 500 may be formed using a conductive material such as metal, and the change in inductance may be caused by a change in the spacing distance (e.g., the size of the air gap) between the housing 500 and each of the first sensing coil 101 and the second sensing coil 102. Therefore, the touch sensing module 50 may sense the change in inductance induced in each of the first sensing coil 101 and the second sensing coil 102 to perform inductive sensing to sense touch input.

[0078] For example, such as Figure 4A and Figure 4B As shown, when a user's hand 1 applies a forceful touch F to a region of the housing 500, the housing 500 can bend inward around the point of touch application. In this case, the distance between the first sensing coil 101 and the housing 500 can be reduced from D1 to D1'.

[0079] When the spacing distance changes, current can flow through the first sensing coil 101, and the magnitude of the eddy current can vary according to the distance to the housing 500, which is an adjacent conductor. Furthermore, the inductance of the first sensing coil 101 can be reduced by the amplitude-varying eddy current (Lind-ΔLind). The touch sensing module 50 can detect this change in inductance to determine whether touch input is applied.

[0080] When the housing 500 bends around the touch application point, the adjacent portion adjacent to the touch application point can also gradually bend inward. Therefore, the distance between the second sensing coil 102 and the housing 500 can be reduced from D2 to D2'. For example, Figure 4A and Figure 4B An example is shown where a touch is applied near the first touch member TM1, and the decrease from D2 to D2' is less than the decrease from D1 to D1'.

[0081] When the spacing distance changes, current can flow through the second sensing coil 102, and the magnitude of the eddy current can vary according to the distance to the housing 500, which is an adjacent conductor. Furthermore, the inductance of the second sensing coil 102 can be reduced by the amplitude-varying eddy current (Lind-ΔLind). In this case, since the reduction from D2 to D2' is less than the reduction from D1 to D1', the change in inductance of the second sensing coil 102 is less than the change in inductance of the first sensing coil 101.

[0082] like Figure 2 As shown, substrate 200 can be configured to mount a first sensing coil 101 and a second sensing coil 102, a first pad 401 and a second pad 402, and a sensing circuit CS thereon. As an example, substrate 200 may include a first substrate 201 and a second substrate 202, with the first sensing coil 101 and the second pad 402 mounted on the first substrate 201, and the second sensing coil 102 and the first pad 401 mounted on the second substrate 202.

[0083] The first substrate 201 and the second substrate 202 can be independent of each other, or can be as follows: Figure 2 As shown, it is integrated into a single substrate 200. The substrate 200 may correspond to an FPCB, but is not limited to it. For example, in addition to an FPCB, the substrate 200 may be one of a variety of substrates selected from various substrates, each of which has a structure in which at least one metal layer and at least one wiring layer are stacked alternately.

[0084] The support 300 supports the substrate 200 to maintain a first predetermined interval (distance) D1 between the first sensing coil 101 and the first touch member TM1, and a second predetermined interval (distance) D2 between the second sensing coil 102 and the second touch member TM2. Since the support 300 supports the substrate 200, it also maintains a third predetermined interval D3 between the second pad 402 and the first touch member TM1, and a fourth predetermined interval D4 between the first pad 401 and the second touch member TM2. As an example, the support 300 may include a first support 301 supporting the first substrate 201 and a second support 302 supporting the second substrate 202.

[0085] The first support 301 and the second support 302 can be independent of each other, or can be as follows: Figure 2 As shown, it is integrated into a single support 300. The support 300 may be formed using a conductor such as metal, but the material of the support 300 is not limited to metal.

[0086] The bracket 300 can be attached to the internal structure of the electronic device 10 that uses the touch sensing module 50, or it can be supported by an additional support member. Furthermore, the bracket 300 can have any structure, as long as it maintains the spacing between the first sensing coil 101 and the housing 500, the spacing between the second sensing coil 102 and the housing 500, the spacing between the first pad 401 and the housing 500, and the spacing between the second pad 402 and the housing 500 at predetermined first spacing distances D1, second spacing distance D2, third spacing distance D3, and fourth spacing distance D4, respectively.

[0087] The touch sensing module 50 may include a first pad 401 and a second pad 402. The first pad 401 may be disposed on an inner portion spaced apart from the second touch member TM2, and the second pad 402 may be disposed on an inner portion spaced apart from the first touch member TM1. For example, the first pad 401 and the second pad 402 may be spaced apart from the housing 500, with the second pad 402 positioned facing the first touch member TM1 and the first pad 401 positioned facing the second touch member TM2. The first touch member TM1 and the second touch member TM2 may be spaced apart from the second pad 402 and the first pad 401 by a predetermined distance, respectively, to form air gaps between the first touch member TM1 and the second pad 402 and between the second touch member TM2 and the first pad 401.

[0088] The shape of each of the first pad 401 and the second pad 402 is not limited. For example, the first pad 401 and the second pad 402 can be any of various devices used by those skilled in the art to sense a user's touch. Therefore, various components constituting the first pad 401 and the second pad 402 and their internal structures can also be provided.

[0089] As an example, the first pad 401 and the second pad 402 may include a pair of electrodes with opposite polarities, and the pair of electrodes may be electrically connected to the first sensing coil 101 and the second sensing coil 102, and electrically connected to the sensing circuit CS, etc., respectively.

[0090] Each of the first pad 401 and the second pad 402 may have a capacitance that varies with the application of a contact touch. For example, the housing 500 may be formed using a conductive material such as metal. When a contact touch is applied to the housing 500 by the user's hand 1, the medium of contact may be changed to cause a change in the capacitance sensed by each of the first pad 401 and the second pad 402.

[0091] In this case, the distance between each point in the first pad 401 and the second pad 402 that comes into contact with the user's hand 1 may also affect the amount of change in capacitance. For example, as Figure 4A and Figure 4B As shown, when a touch is made near the first touch member TM1, the change in the contact medium made by the user's hand 1 can have a stronger effect on the second pad 402 near the first touch member TM1 than on the first pad 401.

[0092] Furthermore, when force accompanies this contact touch, the resulting change in the air gap size may also affect the amount of change in capacitance of the first pad 401 and the second pad 402. For example, as Figure 4A and Figure 4B As shown, when a force is applied to the vicinity of the first touch member TM1, a greater capacitance change can be caused in the second pad 402 than in the first pad 401. The second pad 402 is located at a position corresponding to the position where the housing 500 is further bent inward.

[0093] Given the two effects described above, when a touch is applied near the first touch member TM1, a relatively large capacitance change occurs in the second pad 402, and a relatively small capacitance change occurs in the first pad 401. Therefore, the touch sensing module 50 can perform capacitance sensing to sense the capacitance change sensed in each of the first pad 401 and the second pad 402 to detect touch input.

[0094] Reference Figure 3 The first pad 401 may be positioned closer to the second sensing coil 102 than to the first sensing coil 101, and may be electrically connected to the first sensing coil 101. In this case, the first sensing coil 101 and the first pad 401 may be connected to each other, for example, by a first connecting conductor 611.

[0095] The second pad 402 may be positioned closer to the first sensing coil 101 than to the second sensing coil 102, and may be electrically connected to the second sensing coil 102. In this case, the second sensing coil 102 and the second pad 402 may be connected to each other via, for example, a second connecting conductor 612.

[0096] As described above, the first sensing coil 101 and the second pad 402 can be positioned close to each other, and the second sensing coil 102 and the first pad 401 can be positioned close to each other. Therefore, a structure can be formed in which electrically connected components are arranged to cross each other. In this case, the structure can be any structure, as long as the electrically connected components are arranged to cross each other, and the spacing between the components is not limited.

[0097] For example, such as Figures 2 to 5As shown, the first sensing coil 101 and the second sensing coil 102 are spaced apart by a predetermined distance from each other, and the second pad 402 and the first pad 401 are symmetrically disposed outside the first sensing coil 101 and the second sensing coil 102, respectively.

[0098] The first sensing coil 101 and the first pad 401, which are electrically connected to each other, and the second sensing coil 102 and the second pad 402, which are electrically connected to each other, can constitute a resonant circuit 600. For example, as Figure 5 As shown, the first sensing coil 101 and the first pad 401 can constitute a first resonant circuit 601, which generates a first resonant signal LCosc1 having a resonant frequency that varies with the applied touch. The second sensing coil 102 and the second pad 402 can constitute a second resonant circuit 602, which generates a second resonant signal LCosc2 having a resonant frequency that varies with the applied touch.

[0099] The first resonant circuit 601 and the second resonant circuit 602 can be electrically connected to the sensing circuit CS. As an example, such as... Figure 5 As shown, the sensing circuit CS may include a detection circuit 700, and each of the first resonant circuit 601 and the second resonant circuit 602 may be electrically connected to the detection circuit 700.

[0100] As another example, the sensing circuit CS may include at least a portion of the first resonant circuit 601 and the second resonant circuit 602. For example, the sensing circuit CS may correspond to an integrated circuit (IC) including the first pad 401 and the second pad 402 and the detection circuit 700. In this example and the examples described above, since the range of the sensing circuit CS can vary depending on the type of connection between the circuits, the sensing circuit CS is not limited to a specific configuration and type.

[0101] As described above, when a touch is applied to the touch switch unit TSW, the housing 500 can bend inward, and a change in inductance can be sensed in each of the first sensing coil 101 and the second sensing coil 102. Furthermore, since the touch includes contact touch, a change in capacitance can be caused in each of the first pad 401 and the second pad 402 when a touch is applied.

[0102] Changes in inductance and capacitance can cause changes in the resonant frequencies of the first resonant signal LCosc1 and the second resonant signal LCosc2 generated by the first resonant circuit 601 and the second resonant circuit 602. In this case, according to the example, the direction of the resonant frequency change caused by the change in inductance may be different from the direction of the resonant frequency change caused by the change in capacitance.

[0103] For example, when a touch is applied, the inductance of each of the first sensing coil 101 and the second sensing coil 102 can decrease, and therefore can change in the direction in which the resonant frequency of each of the first resonant signal LCosc1 and the second resonant signal LCosc2 increases. Additionally, when a touch is applied, the capacitance of each of the first pad 401 and the second pad 402 can increase, and therefore can change in the direction in which the resonant frequency of each of the first resonant signal LCosc1 and the second resonant signal LCosc2 decreases.

[0104] like Figure 4A and Figure 4B As shown, an example is given of a touch being applied near the first touch member TM1. In this case, since the distance D1 between the first sensing coil 101 and the housing 500 changes by a relatively large amount when a touch is applied, the resonant frequency of the first resonant circuit 601 can increase by a relatively large amount (e.g., an increase of 5 MHz).

[0105] On the other hand, since the distance D2 between the second sensing coil 102 and the housing 500 changes by a relatively small amount, the resonant frequency of the second resonant circuit 602 can be increased by a relatively small amount (e.g., by 2 MHz).

[0106] As described above, the amount of capacitance change caused in the first pad 401 and the second pad 402 can vary depending on the location where the touch is applied. Therefore, as Figure 4A and Figure 4B As shown, when a touch is applied near the first touch member TM1, the capacitance of the second pad 402, which is positioned relatively close to the first touch member TM1, can increase by a relatively large amount. Therefore, the resonant frequency of the second resonant circuit 602 can decrease by a relatively large amount (e.g., a decrease of 3 MHz).

[0107] On the other hand, when a touch is applied, the capacitance of the first pad 401, which is positioned relatively far from the first touch member TM1, can increase by a relatively small amount. Therefore, the resonant frequency of the first resonant circuit 601 can decrease by a relatively small amount (e.g., a decrease of 0.5 MHz).

[0108] The first resonant circuit 601 can generate a first resonant signal LCosc1 based on the sum of the resonant frequency changes depending on the inductance change of the first sensing coil 101 and the resonant frequency changes depending on the capacitance change of the first pad 401. Similarly, the second resonant circuit 602 can generate a second resonant signal LCosc2 based on the sum of the resonant frequency changes depending on the inductance change of the second sensing coil 102 and the resonant frequency changes depending on the capacitance change of the second pad 402.

[0109] Therefore, based on the example values ​​above, when a touch is applied to the first touch component TM1, the resonant frequency of the first resonant signal LCosc1 increases by 5 MHz and decreases by 0.5 MHz simultaneously. As a result, the total resonant frequency of the first resonant signal LCosc1 increases by 4.5 MHz. On the other hand, the resonant frequency of the second resonant signal LCosc2 increases by 2 MHz and decreases by 3 MHz simultaneously. As a result, the total resonant frequency of the second resonant signal LCosc2 decreases by 1 MHz.

[0110] When the above results are compared with those of a prior art touch sensing module that includes only sensing coils, the following results are obtained. When a touch is applied to a prior art touch sensing module, the change in inductance caused by each sensing coil results in a change in the resonant frequency. When the sensing coils of the prior art touch sensing module are the same as those in the example herein, the resonant frequencies of the sensing coils of the prior art touch sensing module can be increased by 5 MHz and 2 MHz, respectively. Therefore, the difference between the resonant frequencies of the resonant signals generated by the resonant circuits is 3 MHz.

[0111] On the other hand, when a touch is applied to the touch sensing module 50 according to the example herein, the resonant frequency of the first resonant signal LCosc1 increases by 4.5 MHz, and the resonant frequency of the second resonant signal LCosc2 decreases by 1 MHz. Therefore, the difference between the resonant frequency of the first resonant signal LCosc1 and the resonant frequency of the second resonant signal LCosc2 is 5.5 MHz.

[0112] As a result, it can be confirmed that, according to the embodiments disclosed herein, the difference between the resonant frequencies of the two resonant signals LCosc1 and LCosc2 is further increased. In other words, the first sensing coil 101 and the first pad 401, which are electrically connected to each other, and the second sensing coil 102 and the second pad 402, which are electrically connected to each other, can be alternately arranged to increase the resonant frequency difference between the first resonant signal LCosc1 and the second resonant signal LCosc2 generated by the first resonant circuit 601 and the second resonant circuit 602, respectively. Therefore, the signals between adjacent sensors can be more clearly separated to reduce the occurrence of faults.

[0113] Reference Figure 5 The first resonant signal LCosc1 and the second resonant signal LCosc2 generated by the first resonant circuit 601 and the second resonant circuit 602, respectively, can be sent to the detection circuit 700. The detection circuit 700 can be electrically connected to the first resonant circuit 601 and the second resonant circuit 602, and can determine the touch application position based on the change in the resonant frequency of the generated first resonant signal LCosc1 and the second resonant signal LCosc2.

[0114] More specifically, the detection circuit 700 can determine that a touch is applied to a resonant circuit that has a larger change in the resonant frequency between the first resonant signal LCosc1 and the second resonant signal LCosc2. For example, when the change in the resonant frequency of the first resonant signal LCosc1 is larger, the detection circuit 700 can determine that a touch is applied to the first touch member TM1. When the change in the resonant frequency of the second resonant signal LCosc2 is larger, the detection circuit 700 can determine that a touch is applied to the second touch member TM2.

[0115] For example, such as Figure 4A and Figure 4B As shown, when a touch is applied to the first touch component TM1, the change in the distance between the first touch component TM1 and the first sensing coil 101 can be greater than the change in the distance between the second touch component TM2 and the second sensing coil 102. Therefore, the change in the inductance of the first sensing coil 101 can be greater than the change in the inductance of the second sensing coil 102, and the change in the first resonant frequency caused by the change in the inductance of the first sensing coil 101 (e.g., an increase of 5 MHz) can be greater than the change in the second resonant frequency caused by the change in the inductance of the second sensing coil 102 (e.g., an increase of 2 MHz).

[0116] Furthermore, the contact touch applied to the first touch member TM1 has a greater effect on the second pad 402 than on the first pad 401. Therefore, the change in capacitance of the second pad 402 can be greater than the change in capacitance of the first pad 401, and the change in the first resonant frequency caused by the change in capacitance of the second pad 402 (e.g., a decrease of 3 MHz) can be greater than the change in the first resonant frequency caused by the change in capacitance of the first pad 401 (e.g., a decrease of 0.5 MHz).

[0117] When the changes made through inductive sensing and capacitive sensing are summed, the first resonant frequency increases by 4.5 MHz and the second resonant frequency decreases by 1 MHz.

[0118] The detection circuit 700 can compare the first resonant frequency and the second resonant frequency to determine that the change in the first resonant frequency is greater than the change in the second resonant frequency. Therefore, the detection circuit 700 can determine that a touch has been applied to the first touch member TM1 and can generate a touch input signal corresponding to the first touch member TM1.

[0119] When a touch is applied to the second touch component TM2, the change in the second resonant frequency may be greater than the change in the first resonant frequency. Then, the detection circuit 700 can compare the first and second resonant frequencies to determine that the change in the second resonant frequency is greater than the change in the first resonant frequency, and can generate a touch input signal corresponding to the second touch component TM2.

[0120] Figure 6 It shows that when... Figure 2 A view of the changes that occur when a touch is applied to the touch sensing module and an example of the sensing method S100 based on these changes.

[0121] Reference Figures 2 to 6 When a touch is applied to the touch switch unit TSW of the touch sensing module 50 in operation S110, the inductance of the first sensing coil 101 and the second sensing coil 102, as well as the capacitance of the first pad 401 and the second pad 402, can be changed in operations S121, S122, S123, and S124. In this case, the amount of change in each inductance and each capacitance can vary depending on the location where the touch is applied.

[0122] For example, such as Figure 4A and Figure 4B As shown, when a touch is applied to the housing 500 near the first sensing coil 101, the change in inductance of the first sensing coil 101 is greater than the change in inductance of the second sensing coil 102. Furthermore, since the second pad 402 is positioned near the first sensing coil 101, the change in capacitance of the second pad 402 is greater than the change in capacitance of the first pad 401.

[0123] Since the first sensing coil 101 and the first pad 401 are electrically connected to each other to form the first resonant circuit 601, the amount of change in the resonant frequency of the first resonant circuit 601 can be determined by summing the amount of change in the resonant frequency caused by the change in inductance of the first sensing coil 101 in operation S121 and the amount of change in the resonant frequency caused by the change in capacitance of the first pad 401 in operation S122.

[0124] Furthermore, since the second sensing coil 102 and the second pad 402 are electrically connected to each other to form the second resonant circuit 602, the amount of change in the resonant frequency of the second resonant circuit 602 is determined by summing the amount of change in the resonant frequency caused by the change in inductance of the second sensing coil 102 and the amount of change in the resonant frequency caused by the change in capacitance of the second pad 402.

[0125] Therefore, as Figure 6 As shown, the inductance change of the first sensing coil 101 occurring in operation S121 and the capacitance change of the first pad 401 occurring in operation S122 can be reflected together in the first resonant signal LCosc1 generated by the first resonant circuit 601, so as to change the first resonant frequency in operation S131. Furthermore, the inductance change of the second sensing coil 102 occurring in operation S123 and the capacitance change of the second pad 402 occurring in operation S124 can be reflected together in the second resonant signal LCosc2 generated by the second resonant circuit 602, so as to change the second resonant frequency in operation S133.

[0126] In this configuration, the changes in resonant frequency caused by variations in inductance and capacitance can occur in different directions. For example, when approaching the housing 500, the inductance of each of the first sensing coil 101 and the second sensing coil 102 can change in the decreasing direction, and therefore, the resonant frequency can change in the increasing direction. Simultaneously, when approaching the housing 500, the capacitance of each of the first pad 401 and the second pad 402 can change in the increasing direction, and therefore, the resonant frequency can change in the decreasing direction.

[0127] In addition, such as Figure 2 and Figure 5 As shown, the first sensing coil 101 and the second sensing coil 102, as well as the first pad 401 and the second pad 402, are arranged to cross each other. Therefore, the change in resonant frequency caused by the first pad 401 and the second pad 402 can compensate for the change in resonant frequency caused by the first sensing coil 101 and the second sensing coil 102.

[0128] For example, when a touch is applied to the first touch component TM1, the first resonant frequency can be increased by approximately 5 MHz through the first sensing coil 101, and the second resonant frequency can be increased by approximately 3 MHz through the second sensing coil 102. Therefore, the difference between the changes in the first and second resonant frequencies can be 2 MHz.

[0129] In this configuration, the first resonant frequency can be reduced by approximately 0.5 MHz via the first pad 401, and the second resonant frequency can be reduced by approximately 2 MHz via the second pad 402. Then, when the changes caused by the first sensing coil 101 and the second sensing coil 102, as well as the first pad 401 and the second pad 402, are summed, the difference between the changes in the first and second resonant frequencies can be 3.5 MHz. For example, it has been confirmed that the first pad 401 and the second pad 402 can perform a compensation operation to further increase the difference between the changes in the first and second resonant frequencies.

[0130] The detection circuit 700 can detect changes in the first resonant frequency and changes in the second resonant frequency, and can compare the changes in the first resonant frequency and the second resonant frequency with each other in operation S140. Furthermore, in operation S150, the detection circuit 700 can determine the touch application position based on the comparison result.

[0131] For example, when the change in the first resonant frequency is greater than the change in the second resonant frequency, the detection circuit 700 can determine that a touch has been applied to the first touch member TM1. When the change in the second resonant frequency is greater than the change in the first resonant frequency, the detection circuit 700 can determine that a touch has been applied to the second touch member TM2. Furthermore, the detection circuit 700 can generate a touch input signal corresponding to the determined touch application location.

[0132] Based on the modified example, the number of sensing coils and pads included in the touch sensing module 50 can be changed in various ways to reduce the failure between three or more adjacent sensors.

[0133] Figure 7 This is an example view showing the structure in which the sensing coil and pad of the touch sensing module 50-1 are connected to each other, according to the example. Figure 8 This is an example view showing the structure in which the sensing coil and pad are connected to each other according to another example of a touch sensing module 50-2.

[0134] Reference Figure 7 ,and Figures 2 to 5 Similar to the touch sensing module 50 shown, the touch sensing module 50-1 may include a first sensing coil 111 and a second sensing coil 112, as well as a first pad 411 and a second pad 412a. The touch sensing module 50-1 also includes a third sensing coil 113, a third pad 413, and an additional second pad 412b.

[0135] The first sensing coil 111 and the first pad 411 can be electrically connected to each other to form a first resonant circuit that generates a first resonant signal. In addition, the second sensing coil 112 and the second pad 412a can be electrically connected to each other to form a second resonant circuit that generates a second resonant signal.

[0136] Similar to the first sensing coil 111 and the second sensing coil 112, the third sensing coil 113 may have an inductance that changes with the applied force of a touch. Figure 7 As shown, the third sensing coil 113 can be spaced apart from the second sensing coil 112 by a predetermined distance so as to be symmetrical with respect to the first sensing coil 111 about the second sensing coil 112.

[0137] Similar to the first pad 411 and the second pad 412a, the third pad 413 and the additional second pad 412b may have capacitance that varies with the application of a contact touch. The third pad 413 may be positioned closer to the second sensing coil 112 than to the first sensing coil 111 and the third sensing coil 112, and may be electrically connected to the third sensing coil 113.

[0138] Therefore, the third sensing coil 113 and the third pad 413, which are electrically connected to each other, can constitute a third resonant circuit. Furthermore, when a touch input is applied, the resonant frequency of the third resonant signal generated by the third resonant circuit can be changed. The third resonant circuit can be electrically connected to... Figure 5 The detection circuit 700 shown can detect changes in the resonant frequency of the third resonant signal.

[0139] The additional second pad 412b may be positioned closer to the third sensing coil 113 than to the first sensing coil 111 and the second sensing coil 112, and may be electrically connected to the second sensing coil 112. For example, the second pad 412a and the additional second pad 412b may be connected together to the second sensing coil 112.

[0140] Therefore, the second sensing coil 112 and the additional second pad 412b, which are electrically connected to each other, can constitute an additional second resonant circuit, and the resonant frequency of the additional second resonant signal generated by the additional second resonant circuit can be changed when a touch input is applied. The additional second resonant circuit can be electrically connected to Figure 5 The detection circuit 700 shown can therefore detect changes in the resonant frequency of the additional second resonant signal.

[0141] When the touch sensing module 50-1 is applied to the electronic device 10, the touch switch unit TSW may include a first touch member to a third touch member. For example, a first sensing coil 111 and a second pad 412a may be disposed on an inner portion spaced apart from the first touch member, a second sensing coil 112, a first pad 411 and a third pad 413 may be disposed on an inner portion spaced apart from the second touch member, and an additional second pad 412b and a third sensing coil 113 may be disposed on an inner portion spaced apart from the third touch member.

[0142] The first sensing coil 111 and the first pad 411 may be connected to each other, the second sensing coil 112 may be connected to each of the second pad 412a and the additional second pad 412b, and the third sensing coil 113 and the third pad 413 may be connected to each other, such that the components electrically connected to each other may be configured to cross each other.

[0143] The following describes an example of applying a touch to the second touch component. In this example, the change in the spacing between the second touch component and the second sensing coil 112 is greater than the change in the spacing between the first touch component and the first sensing coil 111, and the change in the spacing between the third touch component and the third sensing coil 113. Therefore, the change in inductance of the second sensing coil 112 is greater than the change in inductance of each of the first sensing coil 111 and the third sensing coil 113. As a result, the change in the second resonant frequency (e.g., an increase of 5 MHz) is greater than the changes in the first resonant frequency and the third resonant frequency (e.g., an increase of 2 MHz).

[0144] Furthermore, the impact of the contact touch applied to the second touch member on the first pad 411 and the third pad 413 can be greater than its impact on the second pad 412a and the additional second pad 412b. Therefore, the capacitance change of each of the first pad 411 and the third pad 413 is greater than the capacitance change of each of the second pad 412a and the additional second pad 412b. Consequently, the change in each of the first and third resonant frequencies (e.g., an increase of 3 MHz) is greater than the change in each of the second and additional second resonant frequencies (e.g., a decrease of 0.5 MHz).

[0145] When the changes made by inductive sensing and capacitive sensing are summed, each of the first resonant frequency and the third resonant frequency decreases by 1 MHz, and each of the second resonant frequency and the additional second resonant frequency increases by 4.5 MHz.

[0146] The detection circuit 700 can compare the first to third resonant frequencies with each other to determine that the change in each of the second and additional second resonant frequencies is greater than the change in each of the first and third resonant frequencies. Therefore, the detection circuit 700 can determine that a touch has been applied to the second touch member and can generate a touch input signal corresponding to the second touch member.

[0147] exist Figure 7 The example shown only includes three sensing coils. However, a much larger number of sensing coils and pads can be provided to meet the shape, function, and other requirements of the electronic device 10.

[0148] Reference Figure 8 ,and Figures 2 to 5 Similar to the touch sensing module 50 shown, the touch sensing module 50-2 may include a first sensing coil 121 and a second sensing coil 122, as well as a first pad 421 and a second pad 422. The touch sensing module 50-2 may also include at least one sensing coil disposed between the first sensing coil 121 and the second sensing coil 122. For example, as... Figure 8 As shown, the touch sensing module 50-2 may also include a third sensing coil 123.

[0149] The first sensing coil 121 and the first pad 421 can be electrically connected to each other to form a first resonant circuit that generates a first resonant signal. Additionally, the second sensing coil 122 and the second pad 422 can be electrically connected to each other to form a second resonant circuit that generates a second resonant signal.

[0150] Similar to the first sensing coil 121 and the second sensing coil 122, the third sensing coil 123 may have an inductance that changes with the applied force of a touch. Figure 8 As shown, the third sensing coil 123 can be disposed between the first sensing coil 121 and the second sensing coil 122.

[0151] In this example, the third sensing coil 123 may be electrically connected to a sensing circuit CS including a pad to form a third resonant circuit having a resonant frequency that varies according to the inductance of the third sensing coil 123.

[0152] When the touch sensing module 50-2 is applied to the electronic device 10, the touch switch unit TSW may include a first touch component and a second touch component. For example, a first sensing coil 121 and a second pad 422 may be disposed on an inner portion spaced apart from the first touch component, and the second sensing coil 122 and the first pad 421 may be disposed on an inner portion spaced apart from the second touch component. A third sensing coil 123 may be disposed between the first sensing coil 121 and the second sensing coil 122.

[0153] Additionally, the first sensing coil 121 and the first pad 421 can be connected to each other, and the second sensing coil 122 and the second pad 422 can be connected to each other, such that the components electrically connected to each other can be configured to cross each other.

[0154] When a touch is applied to one of the first touch component and the second touch component, it can be used in conjunction with... Figures 2 to 5 Sensing is performed in the same manner as described in the example, and therefore, a description of sensing will be omitted here. In this example, it is possible to sense simultaneous application of touch to both the first and second touch components, which will be described in more detail below.

[0155] When the first touch component and the second touch component are touched simultaneously, the change in the distance between the housing 500 and the first sensing coil 121 and the second sensing coil 122 can be almost the same. Therefore, the change in inductance of the first sensing coil 121 and the second sensing coil 122 can be almost the same, and the change in the first resonant frequency and the second resonant frequency caused by the change in inductance of the first sensing coil 121 and the second sensing coil 122 (e.g., an increase of 5 MHz) can be almost the same.

[0156] Furthermore, the contact touch applied to the first touch member and the second touch member has almost the same effect on the first pad 421 and the second pad 422. Therefore, substantially the same capacitance change can be made in the first pad 421 and the second pad 422, and thus, the changes in the first resonant frequency and the second resonant frequency (e.g., a decrease of 3MHz) can also be almost the same.

[0157] For example, when summing the changes depending on inductive and capacitive sensing, each of the first and second resonant frequencies can increase by 2 MHz. However, the exact same amount of change in the resonant frequencies corresponds to ideal data, and the difference between the amount of change in the first and second resonant frequencies may actually occur based on the user's touch operation.

[0158] In this situation, the detection circuit 700 can compare the first resonant frequency and the second resonant frequency to determine the case where the resonant frequency change is greater, and determine that the touch input is applied to one of the first touch component and the second touch component. For example, the detection circuit 700 may not be able to recognize that the touch input is applied to both the first touch component and the second touch component simultaneously.

[0159] Since the touch sensing module 50-2 also includes a third sensing coil 123, an inductance change may also occur in the third sensing coil 123 when a touch is applied. In this case, the inductance change of the third sensing coil 123 may be relatively small when a touch is applied to either the first or second touch component. However, when a touch is applied to both the first and second touch components simultaneously, the inductance change of the third sensing coil 123 can be twice as large as when a touch is applied to either the first or second touch component.

[0160] For example, when a touch is applied to one of the first and second touch components, the change in the spacing between the housing 500 and the third sensing coil 123 is less than the change in the spacing between the housing 500 and each of the first and second sensing coils 121 and 122. Therefore, the change in the third resonant frequency should have a lower value than the change in each of the first and second resonant frequencies (e.g., an increase of 3 MHz). However, when the first and second touch components are touched simultaneously, the change in the spacing between the housing 500 and the third sensing coil 123 can be doubled. Therefore, the third resonant frequency can increase, for example, by 6 MHz.

[0161] The detection circuit 700 can compare the first resonant frequency to the third resonant frequency with each other to determine that the third resonant frequency is greater than each of the first and second resonant frequencies. Therefore, the detection circuit 700 can determine that a touch is applied to both the first and second touch components simultaneously, and can generate a corresponding touch input signal.

[0162] because Figure 7 and Figure 8 The modification example described is merely an example, and multiple sensing coils and multiple pads can be arranged in various ways. Therefore, touch input signals applied separately or simultaneously to the touch component can be distinguished and sensed, reducing frequent malfunctions among multiple sensors positioned close to each other.

[0163] As described above, the touch sensing module and the electronic device including the touch sensing module can more clearly distinguish touch inputs acting on sensors at proximity locations.

[0164] Additionally, according to the example, electronic devices that include multiple touch switches can reduce the frequency of failures between different touch switches.

[0165] Although specific examples have been shown and described above, it will be apparent upon understanding this disclosure that various changes in form and detail may be made to these examples without departing from the spirit and scope of the claims and their equivalents. The examples described herein are to be considered merely for descriptive purposes and not for limitation. The description of features or aspects in each example is to be considered applicable to similar features or aspects in other examples. Suitable results may be obtained if the described techniques are performed in a different order, and / or if components in the described system, architecture, apparatus, or circuit are combined in a different manner and / or if components in the described system, architecture, apparatus, or circuit are replaced or supplemented with other components or their equivalents. Therefore, the scope of this disclosure is not limited by the specific embodiments but by the claims and their equivalents, and all variations within the scope of the claims and their equivalents shall be construed as included in this disclosure.

Claims

1. A touch sensing module, comprising: Both the first sensing coil and the second sensing coil have inductance that changes in response to an applied force applied during touch; A first pad has a capacitance that varies in response to an applied contact touch. The first pad is configured to be closer to the second sensing coil than to the first sensing coil, and is electrically connected to the first sensing coil to form a first resonant circuit. as well as The second pad has a capacitance that varies in response to the applied contact touch. The second pad is configured to be closer to the first sensing coil than to the second sensing coil, and is electrically connected to the second sensing coil to form a second resonant circuit.

2. The touch sensing module as described in claim 1, wherein, The first resonant circuit is configured to generate a first resonant signal having a first resonant frequency that varies in response to an applied touch, said applied touch including either or both of said applied force touch and said applied contact touch. The second resonant circuit is configured to generate a second resonant signal having a second resonant frequency that varies in response to the applied touch, the applied touch including either or both of the applied force touch and the applied contact touch.

3. The touch sensing module as described in claim 2, further comprising: The detection circuit is electrically connected to the first resonant circuit and the second resonant circuit, and is configured to determine the touch application position based on the change in the first resonant frequency and the change in the second resonant frequency.

4. The touch sensing module as described in claim 3, wherein, The detection circuit is further configured to: The change in the first resonant frequency is compared with the change in the second resonant frequency; In response to the change in the first resonant frequency being greater than the change in the second resonant frequency, it is determined that the applied touch is applied to the first resonant circuit; as well as In response to the change in the second resonant frequency being greater than the change in the first resonant frequency, it is determined that the applied touch is applied to the second resonant circuit.

5. The touch sensing module as described in claim 2, wherein, The first resonant circuit is further configured to generate the first resonant signal based on the sum of the change in the first resonant frequency, which depends on the change in inductance of the first sensing coil, and the change in the first resonant frequency, which depends on the change in capacitance of the first pad. The second resonant circuit is further configured to generate the second resonant signal based on the sum of the change in the second resonant frequency, which depends on the change in inductance of the second sensing coil, and the change in the second resonant frequency, which depends on the change in capacitance of the second pad.

6. The touch sensing module as described in claim 1, wherein, The first sensing coil and the second sensing coil are spaced apart from each other, and The second pad and the first pad are symmetrically disposed outside the first sensing coil and the second sensing coil, respectively.

7. The touch sensing module according to any one of claims 1-6, wherein the touch sensing module further comprises: A third sensing coil has an inductance that changes in response to the applied force of touch, the third sensing coil being spaced apart from the second sensing coil to be symmetrical with respect to the first sensing coil about the second sensing coil; A third pad, having a capacitance that varies in response to the applied contact touch, is configured to be closer to the second sensing coil than to the first sensing coil and the third sensing coil, and is electrically connected to the third sensing coil to form a third resonant circuit; as well as An additional second pad, having a capacitance that varies in response to the applied contact touch, is configured to be closer to the third sensing coil than to the first and second sensing coils, and is electrically connected to the second sensing coil.

8. The touch sensing module according to any one of claims 1-6, wherein the touch sensing module further comprises: At least one sensing coil is disposed between the first sensing coil and the second sensing coil.

9. An electronic device comprising: The touch switch unit is mounted on the housing. as well as The touch sensing module is configured to sense touch input applied to the touch switch unit. The touch switch unit includes a first touch component and a second touch component, and The touch sensing module includes: The first sensing coil and the second sensing coil both have inductance that changes in response to an applied force. The first sensing coil and the second sensing coil are respectively disposed on the inner side spaced apart from the first touch member and the inner side spaced apart from the second touch member. A first pad, having a capacitance that varies in response to an applied contact touch, is disposed on an inner portion spaced apart from the second touch member, and is electrically connected to the first sensing coil to form a first resonant circuit; and The second pad has a capacitance that varies in response to the applied contact touch. The second pad is disposed on the inner portion spaced apart from the first touch member, and the second pad is electrically connected to the second sensing coil to form a second resonant circuit.

10. The electronic device of claim 9, wherein, The first sensing coil and the first pad are configured to generate a first resonant signal having a first resonant frequency that varies in response to an applied touch, including either or both of the applied force touch and the applied contact touch, applied to the touch switch unit; and the second sensing coil and the second pad are configured to generate a second resonant signal having a second resonant frequency that varies in response to the applied touch, including either or both of the applied force touch and the applied contact touch, applied to the touch switch unit.

11. The electronic device of claim 10, wherein, The touch sensing module is configured to determine the touch application position in the touch switch unit based on the change in the first resonant frequency and the change in the second resonant frequency.

12. The electronic device of claim 10, wherein, The first resonant signal is generated based on the sum of the change in the first resonant frequency, which depends on the change in inductance of the first sensing coil, and the change in the first resonant frequency, which depends on the change in capacitance of the first pad. The second resonant signal is generated based on the sum of the change in the second resonant frequency, which depends on the change in inductance of the second sensing coil, and the change in the second resonant frequency, which depends on the change in capacitance of the second pad.

13. The electronic device of claim 12, wherein, The change in the first resonant frequency and the change in the second resonant frequency are compared with each other to determine that the applied touch is applied to the first touch member in response to the change in the first resonant frequency being greater than the change in the second resonant frequency, and to determine that the applied touch is applied to the second touch member in response to the change in the second resonant frequency being greater than the change in the first resonant frequency.

14. The electronic device as claimed in claim 9, wherein, The first sensing coil and the second sensing coil are spaced apart from each other, and The second pad and the first pad are symmetrically disposed outside the first sensing coil and the second sensing coil, respectively.

15. The electronic device according to any one of claims 9-14, wherein, The touch switch unit also includes a third touch component, and The touch sensing module further includes: The third sensing coil has an inductance that changes in response to the applied force of touch, and the third sensing coil is disposed on an inner portion spaced apart from the third touch member; A third pad, having capacitance that varies in response to the applied contact touch, is disposed on the inner portion spaced apart from the second touch member, and is electrically connected to the third sensing coil to form a third resonant circuit; and An additional second pad, having a capacitance that varies in response to the applied contact touch, is disposed on the inner portion spaced apart from the third touch member and is electrically connected to the second sensing coil.

16. The electronic device of claim 15, wherein, The first sensing coil and the second pad are positioned facing the first touch component. The third sensing coil and the additional second pad are positioned facing the third touch member, and The second sensing coil, the first pad, and the third pad are positioned facing the second touch component.

17. The electronic device according to any one of claims 9-14, wherein the electronic device further comprises: At least one sensing coil is disposed between the first sensing coil and the second sensing coil.

18. The electronic device according to any one of claims 9-14, wherein, The first sensing coil and the second pad are positioned facing the first touch component, and The second sensing coil and the first pad are positioned facing the second touch component.

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