Wafer inspection apparatus

Abstract

The present application provides a wafer detecting device, which includes a clamp and a probe card. The clamp is used to clamp a wafer. The probe card is arranged on a ground and located between the clamp and the ground, and below the clamp, and a detecting side of the probe card faces away from the ground. The clamp moves the wafer towards the probe card, and makes a detecting surface of the wafer contact the probe card. The present application can improve the time and efficiency of the detecting process, reduce the operation risk, and greatly improve the process quality.

Description

TECHNICAL FIELD

[0001] The present application relates to a wafer testing device, and more particularly to a wafer testing device comprising a chuck and a probe card. BACKGROUND

[0002] Generally, a conventional wafer testing device is configured to place a wafer in a holding port, to pick up the wafer from a wafer cassette by a handling mechanism, to place the wafer on a chuck after alignment, and to move the chuck to a corresponding position for a probe device to perform electrical testing. The size and weight of a probe head of the probe device vary according to product requirements. For example, a single DUT cantilever probe card is used for simple laboratory testing, such as wafer acceptance test (WAT) testing. A complex probe card is used for testing a CPU wafer. In order to handle various wafer testing, the testing device must be strong enough.

[0003] In the case of a large number of DUTs, the diameter of the probe head is relatively large and heavy. In the past testing process, the probe head is manually locked on an inner ring in contact with a POGO tower or placed on an auto probe card changer (APC) for automatic loading. However, the configuration of these devices may not comply with human factors engineering, such as not being able to see the downward probe and having handling risks. In these testing processes, there may be debris accumulated on the wafer due to friction, causing a needle collision risk. In addition, for maintenance of the testing device, other mechanical devices are often required to move it for processing, and after processing, it also needs to be reset. Therefore, how to provide a better wafer testing device is an important issue. SUMMARY

[0004] An embodiment of the present application provides a wafer testing device comprising a chuck and a probe card. The chuck is configured to hold a wafer. The probe card is disposed on a ground and located between the chuck and the ground, and below the chuck. A testing side of the probe card faces away from the ground. The chuck moves the wafer towards the probe card, and a testing surface of the wafer contacts the probe card.

[0005] In an embodiment, the probe card comprises a probe assembly located on the testing side of the probe card and extending away from the ground.

[0006] In an embodiment, the wafer testing device comprises a transport module configured to transport the wafer to the chuck.

[0007] In one embodiment, the aforementioned chuck comprises a body and a chucking assembly movably disposed around the body. When the wafer is transported to the chuck by the transport module, the chucking assembly carries the wafer and moves toward the body, and a back surface of the wafer abuts against the body of the chuck, wherein the back surface of the wafer is opposite to the detection surface.

[0008] In one embodiment, the aforementioned chucking assembly comprises a plurality of chucking members disposed around the body, and each of the chucking members has an L-shaped structure and a carrying segment parallel to the body of the chuck and used to carry the wafer.

[0009] In one embodiment, the aforementioned chuck comprises a body and a chucking assembly movably disposed around the body. When the wafer is transported to the chuck by the transport module, the chucking assembly carries the wafer and moves toward the body, and a back surface of the wafer abuts against the body of the chuck, wherein the back surface of the wafer is opposite to the detection surface.

[0010] Another embodiment of the present application provides a wafer detection device comprising a chuck and a probe card. The chuck has a chucking surface used to chuck a wafer. The probe card has a detection side used to detect the wafer, wherein the chuck and the probe card are disposed on a ground surface, and the chucking surface of the chuck and the detection side of the probe card are perpendicular to the ground surface. When the chuck chucks the wafer and moves toward the probe card to a detection position, a detection surface of the wafer contacts the probe card, and the detection surface is perpendicular to the ground surface.

[0011] In one embodiment, the aforementioned transport module rotates the wafer from a horizontal state to a vertical state, and transports the wafer in the vertical state to the chuck, wherein when the wafer is in the vertical state, a central axis of the wafer is parallel to the ground surface.

[0012] In one embodiment, the aforementioned chuck is an electrostatic chuck, and when the electrostatic chuck chucks the wafer, a central axis of the electrostatic chuck is parallel to the ground surface.

[0013] In one embodiment, the aforementioned probe card comprises a probe assembly at the detection side of the probe card used to detect the wafer, wherein when the probe card detects the wafer, an extension direction of the probe assembly is parallel to the ground surface and parallel to a central axis of the chuck. BRIEF DESCRIPTION OF DRAWINGS

[0014] Figure 1 FIG. 1 is a schematic view showing a wafer detection device according to an embodiment of the present application.

[0015] Figures 2A-2D FIG. 2 is a schematic view showing Figure 1 the chuck, the transport of the wafer by the transport module, and the chucking of the wafer.

[0016] Figures 3A-3DThis is a schematic diagram illustrating the transport and clamping of a clamping device, transport module, and wafer according to another embodiment.

[0017] Figures 4A-4B This is a schematic diagram illustrating the transport and clamping of a clamping device, transport module, and wafer according to another embodiment.

[0018] Figure 5 This is a schematic diagram illustrating a wafer inspection apparatus according to another embodiment of the present invention.

[0019] Figures 6A-6D It means Figure 5 The diagram illustrates the transport and clamping of the device, transport module, and wafer.

[0020] [Symbol Explanation]

[0021] 100, 200: Wafer inspection equipment;

[0022] 10: Clamping devices;

[0023] 10C: The central axis of the clamp;

[0024] 10H: Clamping surface;

[0025] 11: Ontology;

[0026] 12: Clamping assembly;

[0027] 13: Adsorption component;

[0028] 131: Adsorption head;

[0029] 20: Probe card;

[0030] 20S1: Detection side;

[0031] 21: Probe assembly;

[0032] 30: Transportation module;

[0033] 31: Transport items;

[0034] 32: Control unit;

[0035] D1: Direction of movement;

[0036] G: Ground;

[0037] R1: Rotation direction;

[0038] RD: Clamping component;

[0039] RD1: Bearing section;

[0040] W: chip;

[0041] WC: The central axis of the wafer;

[0042] W1: Detection surface;

[0043] W2: Back. Detailed Implementation

[0044] Other scope of application of the apparatus, devices, and methods of this application will become apparent from the detailed description provided below. It should be understood that the following detailed description and specific embodiments, when presenting exemplary embodiments of the carrier components, are for illustrative purposes only and are not intended to limit the scope of this application.

[0045] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. It is understood that these terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with the relevant art and the background or context of this application, and should not be interpreted in an idealized or overly formal manner, unless specifically defined herein.

[0046] Please see Figure 1 This is a schematic diagram illustrating a wafer inspection apparatus 100 according to an embodiment of this application. The wafer inspection apparatus 100 can be used, for example, in the inspection process of semiconductor wafers. By using the wafer inspection apparatus 100, the characteristics of semiconductor components on the wafer can be detected before entering the subsequent processes, thereby confirming whether there are defective products. The structure of the wafer inspection apparatus 100 will be described in detail below.

[0047] Please continue reading. Figure 1 The wafer inspection device 100 includes a clamping fixture 10 and a probe card 20 for inspecting a test surface W1 of a wafer W. The clamping fixture 10 holds the wafer W and moves it to the probe card 20 for testing. In some embodiments, the wafer inspection device 100 further includes a transport module 30. For example, the transport module 30 is used to transport the wafer W to the clamping fixture 10, and then the clamping fixture 10 moves the wafer W toward the probe card 20. In some embodiments, the transport module 30 includes a transport member 31 and a control unit 32. The transport member 31 may be a robotic arm that can move the wafer W by clamping the back surface W2 (opposite to the aforementioned test surface W1), for example, moving it from a wafer cassette onto the clamping fixture 10. The control unit 32 is used to control the transport member 31. In some embodiments, the transport module 30 may be considered as an external device for transferring the wafer W.

[0048] In this embodiment, the probe card 20 is disposed on a ground surface G, and the clamp 10 is located above the probe card 20, or in other words, the probe card 20 is located above the clamp 10. The clamp is farther away from the ground surface G than the probe card 20. The wafer W to be tested is located between the clamp 10 and the probe card 20. The probe card 20 has a probe assembly 21 located on the detection side 20S1 of the probe card 20. The probe assembly 21 extends in a direction away from or away from the ground surface G and in a direction toward the clamp 10, with the detection side 20S1 facing away from the ground surface G.

[0049] Figures 2A-2D A schematic diagram showing the clamp 10 holding the chip W is shown. (See diagram.) Figure 2A As shown, in this embodiment, the clamp 10 has a body 11 and a clamping assembly 12. The clamping assembly 12 is located around the body 11, extends in the direction of the central axis 10C of the clamp 10, and is movable relative to the body 11. Specifically, the clamping assembly 12 has a plurality of (three in this embodiment) clamping elements RD located around the body 11. In some embodiments, if the body 11 is considered as a circular clock, the clamping elements RD are located at the three o'clock, six o'clock, and nine o'clock positions, respectively.

[0050] The clamping component RD has an L-shaped structure, which includes a load-bearing section RD1. For example... Figure 2B As shown, when the clamping device 10 has not yet carried or held the chip W, the clamping component 12 protrudes from the body 11 and faces the probe card 11 or the ground G, as shown. Figure 2B When the wafer W is moved to the clamping position by the transport module 30, the wafer W is placed on the carrying section RD1 of each clamping member RD by the transport member 31; or, the clamping member RD moves and moves its carrying section RD1 toward the wafer W. In this way, the wafer W can be carried by the clamping members, and the transport module 30 can be detached from the wafer W.

[0051] Next, as Figure 2C As shown, the clamping member 12 carrying the chip W rises and moves towards the body W, or in other words, moves away from the probe card 20 and the ground G, so that the back side W2 of the chip W abuts against and leans against the body 11, as shown. Figure 3D As shown, at this point, the clamping surface 10H of the clamping device 10 can be considered as holding and supporting the wafer W. In this way, the clamping device 10 stably clamps the wafer W. Afterwards, the clamping device 10 can move the wafer W towards the probe card 20, such as in the direction of movement D1, to detect the wafer W.

[0052] In this way, the inspection efficiency can be improved by moving the clamp 10 positioned above the probe card 20. For example, the probe card 20 is designed to be large enough to handle the testing of chips of various sizes and shapes. The ground G located below simplifies the mounting mechanism of the probe card 20, and it eliminates the need to move the probe card through the mounting mechanism, thus improving the time and efficiency of the inspection process. In addition, since the chip W is held by the clamp 10 and moved relative to the probe card 20 below, the chip W and the probe card 20 can be directly observed during the setup and testing, which reduces operational risks, such as avoiding or minimizing damage to the inspection surface W1 of the chip W. Furthermore, since the probe card 20 inspects the chip W with its face upward, even if friction generates debris during inspection, gravity will cause these debris to fall downward. Compared to the method of inspecting the chip with the probe card facing downward, this avoids debris accumulation on the chip W and also avoids the risk of collision, significantly improving process quality.

[0053] Figures 3A-3D This diagram shows a clamping device 10 holding a wafer W according to another embodiment. In this embodiment, the clamping device 10 has an adsorption component 13 disposed inside the body 11 of the clamping device 10, extending along the central axis 10C of the clamping device 10, and movable relative to the body 11. The adsorption component 13 is used to adsorb the back surface W2 of the wafer W.

[0054] like Figures 3A-3B When the transport module 30 intends to transport the wafer W to the clamping fixture 10, the adsorption component 13 protrudes from the body 11 and adsorbs the back surface W2 of the wafer W. Thus, the transport module 30 transfers the wafer W to the clamping fixture 10 and exits. Afterwards, as... Figures 3C-3D As shown, the adsorption component 13 moves toward the body 11 of the clamping device 10 so that the body 11 can stably support the wafer W. At this time, it can be regarded as the clamping surface 10H of the clamping device 10 holding and supporting the wafer W. After that, the clamping device 10 can move with the wafer W toward the probe card 20 to detect the wafer W.

[0055] In this embodiment, the adsorption component 13 is a component having multiple (three) adsorption heads 131 for adsorbing the wafer W. In other embodiments, the adsorption component 13 may have other numbers of adsorption heads 131, such as one, two, or four adsorption heads. In some embodiments, the adsorption heads 131 of the adsorption component 13 adsorb the back surface W2 of the wafer W by vacuum adsorption.

[0056] Figures 4A-4BThis is a schematic diagram illustrating another embodiment of the clamping device 10, which includes a clamping assembly 12 and an adsorption member 13. When the wafer W is to be transported to the clamping device 10 by the transport module 30, the wafer W is placed on the carrying section RD1 of the clamping assembly 12, or the carrying section RD1 of the clamping assembly 12 is moved toward the wafer W which has been moved to the corresponding position by the transport module, so as to carry the wafer W, and the back side W2 of the wafer W is adsorbed by the adsorption member 13 and moved toward the body 11 of the clamping device 10.

[0057] Figure 5 This diagram shows a wafer inspection apparatus 200 according to another embodiment of the present invention. The wafer inspection apparatus 200 of this embodiment performs wafer inspection in a vertical manner. The wafer inspection apparatus 200 includes a clamp 10, a probe card 20, and a transport module 30. The wafer inspection apparatus 200 can inspect wafers W. The details of the wafer inspection apparatus 200 will be described in detail below.

[0058] See Figures 6A-6B The aforementioned transport module 30 is used to transport the wafer W onto the clamping fixture 10. The transport module 30 holds the back side W2 of the wafer W and rotates the wafer W from a horizontal state to a vertical state, such as in the rotation direction R1. In some embodiments, pre-alignment may be performed before rotating the wafer W.

[0059] Next, as Figure 6C As shown, the vertically positioned wafer W is placed in the clamp 10, or the clamp 10 is moved close to the wafer W so that it clamps the wafer W, such as through the clamping surface 10H of the clamp. Then, as... Figure 6D As shown, the wafer W is moved horizontally to the probe card 20 using the clamp 10, such as in the direction of movement D1, to perform a wafer testing procedure. In some embodiments, alignment of the wafer W with the probe assembly 21 is performed before the wafer W is moved horizontally to the probe card 20.

[0060] In some embodiments, the clamp 10 may be an electrostatic chuck (E-chuck), which generates an adsorption force by providing a bias voltage. Its clamping surface 10H is provided with copper wires, which are polarized by a voltage and electric field, generating an adsorption force on the surface of the object being adsorbed, thereby holding it in place. Thus, even if a power supply anomaly occurs in the process plant, the wafer W can be continuously adsorbed. In some embodiments, the electrostatic chuck may use different base materials, such as stainless steel, aluminum plate, glass, or synthetic plastic.

[0061] It is worth noting that the transport module 30 rotates the wafer W into a vertical position (relative to the ground G) before handing it over to the clamp 10. The standing clamp 10 (relative to the ground G) can be pushed horizontally towards the probe card 20, and the extension direction of the probe assembly 21 of the probe card 20 is parallel to the ground G or parallel to the central axis 10C of the clamp 10. In this way, since the clamp 10 is in a standing position, the clamping surface 10H of its clamping surface for holding the wafer W is perpendicular (or considered to be approximately perpendicular, for example, between +5 and -5 degrees) to the ground G, allowing for direct visual observation of the overall condition during operation, which is beneficial for inspection.

[0062] Furthermore, since all components are in an upright position—that is, the central axis 10C of the clamp 10, the central axis WC of the wafer W, and the extension direction of the probe 21 of the probe card are parallel to the ground G (or considered approximately parallel, for example, between +5 and -5 degrees)—it is possible to prevent debris from accumulating on the wafer W or the probe card 20 if contact occurs between components. Additionally, in high-temperature testing processes, hot air dissipates upwards. Compared to traditional probe cards 20, which may be affected by hot air above the clamp 10, leading to warping, probe expansion, and probe deformation, this effectively avoids these issues.

[0063] In other embodiments, different holding trays and testing fixtures may be used. For example, after a horizontally oriented wafer W is removed from the standard processing tray (JEDEC Tray) and placed into the test tray (T-Tray) via the transport assembly 30, the test tray is rotated 90 degrees to bring the wafer W into a horizontal position before being horizontally pushed towards the high-fixed test socket for testing. After testing, the test tray is rotated to return the tested wafer W to a horizontal position, and then the wafer W is placed back into the standard processing tray.

[0064] According to the foregoing embodiments, this application also provides a method for testing a wafer, the method comprising: transferring or transporting the wafer to a clamping fixture by means of a transport module, wherein the clamping fixture holds the wafer and moves it toward a probe card for testing.

[0065] In some embodiments, the method for detecting a wafer further includes: a transport module transporting the wafer to a clamping component of a clamping fixture; the clamping component, after carrying the wafer, moves toward the body of the clamping fixture, causing the back side of the wafer to abut against the body; and the clamping fixture then moves the wafer toward a probe card. In some embodiments, the method for detecting a wafer further includes: a transport module transporting the wafer to a clamping fixture; the clamping fixture's adsorption component adsorbing the back side of the wafer and moving toward the body of the clamping fixture, causing the back side of the wafer to abut against the body; and the clamping fixture then moves the wafer toward a probe card.

[0066] In other embodiments, the method for detecting a wafer further includes: a transport module transporting the wafer to a clamping component of a clamping fixture, the clamping component carrying the wafer moving toward the body of the clamping fixture, and an adsorption component of the clamping fixture adsorbing the back side of the wafer, the clamping component and the adsorption component moving toward the body of the clamping fixture so that the back side of the wafer abuts against the body, and then the clamping fixture moving the wafer toward the probe card.

[0067] In some embodiments, the method for detecting a wafer further includes: a transport module rotating a horizontally positioned wafer to a vertical (or upright) position (relative to the ground) and placing it on a clamp that holds the back side of the wafer, wherein the clamp and the central axis of the wafer are parallel to the ground, and the clamp moves the wafer toward a probe card along the direction of the central axis, wherein the extension direction of the probes of the probe card is parallel to the ground.

[0068] It should be noted that features of various embodiments can be combined and used, provided they do not violate or conflict with the spirit and scope of this application. For example, Figure 1 The clamp 10 in the middle can be an electrostatic chuck; Figure 5 The clamp 10 can be equipped with clamping component 12.

[0069] In summary, one embodiment of this application provides a wafer inspection apparatus, including a clamp and a probe card. The clamp is used to clamp a wafer. The probe card is disposed on a ground surface, located between the clamp and the ground surface, and below the clamp, with one detection side of the probe card facing away from the ground surface. The clamp moves the wafer toward the probe card, bringing one detection surface of the wafer into contact with the probe card.

[0070] Another embodiment of this application provides a wafer inspection apparatus, including a clamp and a probe card. The clamp has a clamping surface for clamping a wafer. The probe card has a detection side for detecting the wafer, wherein the clamp and the probe card are disposed on a ground, and the clamping surface of the clamp and the detection side of the probe card are perpendicular to the ground. When the clamp moves the wafer toward the probe card to a detection position, a detection surface of the wafer contacts the probe card. In some embodiments, the wafer inspection apparatus includes a transport module for moving and rotating the wafer, thereby allowing the wafer to be rotated from a horizontal state to a vertical state.

[0071] The embodiments of this application have at least one of the following advantages or effects. In this way, the aforementioned embodiments, by moving the clamp and fixing the probe card, eliminate the need for a moving device for the fixed probe card. Therefore, the size, specifications, and functions of the probe card can be designed to be larger and more comprehensive to accommodate wafers of various sizes and shapes, thus improving the time and efficiency of the testing process. Furthermore, by using the clamp to hold the wafer and move it relative to the probe card, the wafer is not obstructed by the probe card during testing, allowing for direct visual observation. This reduces operational risks, such as avoiding or minimizing damage to the wafer's testing surface. Additionally, by using a probe card facing upwards or with the probe assembly perpendicular to the ground to test the wafer, even if friction generates debris during testing, gravity will cause these debris to fall downwards. Compared to testing the wafer with the probe card facing downwards, this avoids debris accumulation on the wafer and also avoids the risk of impact, significantly improving process quality. In addition, under high-temperature testing processes, hot air dissipates upwards. Compared to traditional probes that are held above the holder and may be affected by hot air, resulting in warping, probe expansion, and probe deformation, the wafer testing device of this application can effectively avoid the above situations.

[0072] The ordinal numbers in this specification and the claims, such as "first", "second", etc., are not sequential in any way; they are only used to distinguish two different elements with the same name.

[0073] The above embodiments are described in sufficient detail to enable those skilled in the art to implement the apparatus disclosed in this application by means of the above description. It should be understood that some modifications and refinements may be made without departing from the spirit and scope of this application. Therefore, the scope of protection of this application shall be determined by the scope of the claims.

Claims

1. A wafer inspection device, characterized in that, include: A clamping device for holding a chip; A probe card is disposed on the ground, located between the clamp and the ground, and below the clamp, with one detection side of the probe card facing away from the ground; and A transport module for transporting the wafer to the clamp; The clamp holds the wafer and moves it toward the probe card, so that one detection surface of the wafer contacts the probe card; The clamp includes a body and a clamping assembly. The clamping assembly is movably disposed around the body. When the transport module transports the wafer to the clamp, the clamping assembly carries the wafer and moves toward the body. A back side of the wafer abuts against the body of the clamp, wherein the back side of the wafer is opposite to the detection surface. The clamp further includes an adsorption component, which is disposed on the body and movable relative to the body, and the adsorption component extends along a central axis of the clamp. When the transport module transports the wafer to the clamp, the adsorption component adsorbs the back side of the wafer and moves toward the body.

2. The wafer inspection apparatus according to claim 1, characterized in that, The probe card includes a probe assembly located on the detection side of the probe card and extending away from the ground.

3. The wafer inspection apparatus according to claim 1, characterized in that, The clamping assembly includes multiple clamping members disposed around the body, and each clamping member has an L-shaped structure and a support section, which is parallel to the body of the clamping device and is used to support the wafer.

4. A wafer inspection device, characterized in that, include: A clamping device having a clamping surface for clamping a chip; A probe card has a detection side for detecting the wafer, wherein a clamping device and the probe card are disposed on a ground surface, and the clamping surface of the clamping device and the detection side of the probe card are perpendicular to the ground surface; and A transport module for transporting the wafer to the clamp; When the clamping device moves the wafer toward the probe card to a detection position, a detection surface of the wafer contacts the probe card, and the detection surface is perpendicular to the ground. The clamp includes a body and a clamping assembly. The clamping assembly is movably disposed around the body. When the transport module transports the wafer to the clamp, the clamping assembly carries the wafer and moves toward the body. A back side of the wafer abuts against the body of the clamp, wherein the back side of the wafer is opposite to the detection surface. The clamp further includes an adsorption component, which is disposed on the body and movable relative to the body, and the adsorption component extends along a central axis of the clamp. When the transport module transports the wafer to the clamp, the adsorption component adsorbs the back side of the wafer and moves toward the body.

5. The wafer inspection apparatus according to claim 4, characterized in that, It also includes a transport module for transporting the wafer to the clamp, wherein the transport module rotates the wafer from a horizontal state to a vertical state and transports the wafer in the vertical state to the clamp, wherein when the wafer is in the vertical state, the central axis of the wafer is parallel to the ground.

6. The wafer inspection apparatus according to claim 4, characterized in that, The clamp is an electrostatic chuck. When the electrostatic chuck adsorbs the wafer, one of the center lines of the electrostatic chuck is parallel to the ground.

7. The wafer inspection apparatus according to claim 4, characterized in that, The probe card includes a probe assembly located on the detection side of the probe card for detecting the wafer, wherein when the probe card detects the wafer, the extension direction of the probe assembly is parallel to the ground and parallel to the central axis of the clamp.

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