Inspection device

Abstract

Provided is an inspection apparatus capable of improving the responsiveness of temperature adjustment of a substrate. The inspection apparatus of the present invention includes: a stage capable of placing a substrate; a cooling section that cools the substrate placed on the stage; a probe card having a probe that contacts the substrate to supply power; a light irradiation mechanism that irradiates a surface of the substrate opposite the placement surface with light; and a control section that controls the light irradiation mechanism.

Description

Technical Field

[0001] This invention relates to an inspection device. Background Technology

[0002] A known inspection apparatus places a wafer with electronic components and a support on a mounting stage. Current is supplied to the electronic components from a tester via probes to inspect their electrical characteristics. The temperature of the electronic components is controlled by a cooling mechanism and a heating mechanism within the mounting stage.

[0003] Patent document 1 discloses a stage having a cooling mechanism for placing a subject to be examined and a light irradiation mechanism disposed opposite to the subject to be examined through the cooling mechanism. The cooling mechanism is composed of a light-transmitting component and a light-transmitting refrigerant flows inside it. The light irradiation mechanism has a plurality of LEDs pointing towards the subject to be examined.

[0004] Existing technical documents

[0005] Patent documents

[0006] Patent Document 1: Japanese Patent Application Publication No. 2018-151369 Summary of the Invention

[0007] The technical problem that the invention aims to solve

[0008] However, in Patent Document 1, the heat generated by the electronic device under inspection is regulated by irradiating light from the stage on which the electronic device is placed. Furthermore, improving the responsiveness of temperature regulation is required when regulating the temperature of the electronic device.

[0009] In one aspect, the present invention provides an inspection apparatus that can improve the responsiveness of a substrate to temperature regulation.

[0010] Technical means for solving problems

[0011] To address the aforementioned problems, an inspection apparatus is provided according to one method, comprising: a stage capable of placing a substrate; a cooling unit for cooling the substrate placed on the stage; a probe card having probes that contact the substrate to provide power; a light irradiation mechanism for irradiating light onto a surface of the substrate opposite to the placement surface; and a control unit for controlling the light irradiation mechanism.

[0012] Invention Effects

[0013] According to one aspect, an inspection device can be provided that can improve the responsiveness of substrate temperature regulation. Attached Figure Description

[0014] Figure 1 This is an example of a cross-sectional schematic diagram illustrating the structure of the inspection device according to this embodiment.

[0015] Figure 2 An example of a cross-sectional schematic diagram of the temperature regulation mechanism for the wafer in the inspection apparatus of this embodiment.

[0016] Figure 3 This is an example of a cross-sectional schematic diagram illustrating the temperature regulation of the wafer in the inspection apparatus of this embodiment.

[0017] Figure 4 This is an example of a chart illustrating the amount of heat generated in the heat-generating area of ​​a chip.

[0018] Figure 5 This is an example of a schematic diagram obtained by observing the LED array from the irradiated side.

[0019] Figure 6 This is an example of a cross-sectional schematic diagram illustrating the temperature regulation of the wafer in the inspection apparatus of this embodiment.

[0020] Explanation of reference numerals in the attached figures

[0021] 10 Inspection Device

[0022] 11 mounting platforms

[0023] 12 storage rooms

[0024] 13 Loaders

[0025] 14 Testers

[0026] 15 probe cards

[0027] 16 probes

[0028] 19 Control Department

[0029] 20 light irradiation mechanisms

[0030] 21-LED array (light source)

[0031] 22 LED control ports

[0032] 30. Refrigerant Flow Path (Cooling Section)

[0033] W-chip (substrate) Detailed Implementation

[0034] Hereinafter, the embodiments for carrying out the present invention will be described with reference to the accompanying drawings. In the drawings, the same reference numerals are used to label the same components, and sometimes repeated descriptions are omitted.

[0035] <Inspection Device>

[0036] use Figure 1 This embodiment describes an inspection device 10 having a stage (stage) 11. Figure 1This is an example of a cross-sectional schematic diagram illustrating the structure of the inspection device 10 of this embodiment.

[0037] The inspection apparatus 10 is an apparatus for inspecting the electrical characteristics of multiple electronic devices formed on a wafer (subject to inspection) W. Furthermore, the subject to inspection is not limited to the wafer W, but includes carriers on which electronic devices are disposed, glass substrates, chip units, etc. The inspection apparatus 10 includes: a housing chamber 12 housing a mounting stage 11 capable of mounting the wafer W; a loader 13 disposed adjacent to the housing chamber 12; and a tester 14 disposed to cover the housing chamber 12.

[0038] The storage chamber 12 has a frame shape with an internal cavity. Inside the storage chamber 12 are: a mounting stage 11 capable of mounting the wafer W; and a probe card 15 disposed opposite to the mounting stage 11. The probe card 15 has a plurality of needle-shaped probes (contact terminals) 16 disposed corresponding to electrode pads or solder pads, wherein the electrode pads or solder pads are disposed corresponding to the electrodes of each electronic device of the wafer W.

[0039] The stage 11 has a fixing mechanism (not shown) for fixing the wafer W to the stage 11. This prevents the wafer W from shifting relative to the stage 11. In addition, a moving mechanism (not shown) is provided in the storage chamber 12 to move the stage 11 in the horizontal and vertical directions. This adjusts the relative position of the probe card 15 and the wafer W so that the electrode pads or solder pads corresponding to the electrodes of each electronic device come into contact with the probes 16 of the probe card 15.

[0040] The loader 13 removes the chip W containing electronic components from the FOUP (not shown), which serves as a transport container, and places it on the mounting stage 11 inside the storage chamber 12. In addition, the inspected chip W is removed from the mounting stage 11 and stored in the FOUP.

[0041] The probe card 15 is connected to the tester 14 via the interface 17. When each probe 16 contacts the electrode pad or solder pad that is disposed corresponding to the electrode of each electronic device of the wafer W, each probe 16 supplies power to the electronic device from the tester 14 via the interface 17, or transmits the signal from the electronic device to the tester 14 via the interface 17.

[0042] The tester 14 has a test port (not shown) that reproduces a portion of the circuit structure of a motherboard equipped with electronic components. The test port is connected to a test computer 18 that determines the pass or fail of electronic components based on signals received from them. By switching the test port in the tester 14, various motherboard circuit structures can be reproduced.

[0043] The control unit 19 controls the operation of the stage 11. The control unit 19 controls the moving mechanism (not shown) of the stage 11, causing the stage 11 to move horizontally and vertically. Furthermore, the control unit 19 is connected to the light irradiation mechanism 20 via wiring 23. The control unit 19 controls the operation of the light irradiation mechanism 20 (described later) via wiring 23.

[0044] The refrigerant supply device 31 is connected to the refrigerant flow path 30 of the mounting platform 11 via an output pipe 32 and a return pipe 33, enabling the refrigerant to circulate between the refrigerant supply device 31 and the refrigerant flow path 30 of the mounting platform 11. The control unit 19 controls the refrigerant supply device 31 to control the temperature, flow rate, etc. of the refrigerant supplied from the refrigerant supply device 31 to the refrigerant flow path 30.

[0045] Furthermore, the control unit 19 and the refrigerant supply device 31 are illustrated as components installed inside the loader 13, but they are not limited to this and may be installed in other locations.

[0046] In the inspection device 10, when performing electrical characteristic checks on electronic devices, the test computer 18 sends data to the test ports connected via the electronic devices and each probe 16, and determines whether the sent data is correctly processed by the test port based on the electrical signals from the test ports.

[0047] <Wafer Temperature Control Mechanism>

[0048] Next, use Figure 2 The temperature control mechanism of the wafer W in the inspection apparatus 10 of this embodiment will be explained. Figure 2 This is an example of a cross-sectional schematic diagram illustrating the temperature adjustment mechanism of the wafer W in the inspection apparatus 10 of this embodiment.

[0049] A wafer W, on which electronic devices are formed, is placed on a mounting stage 11. A refrigerant flow path (cooling section) 30 is formed on the mounting stage 11. For the refrigerant flow path 30, a refrigerant supply device 31 (see reference 31) supplies refrigerant. Figure 1 via output piping 32 (refer to) Figure 1 The refrigerant is supplied. The refrigerant flowing in refrigerant path 30 is returned via return piping 33 (see reference). Figure 1 Return to refrigerant supply device 31. For example, water, a colorless and light-transmitting liquid, or Galden (registered trademark) can be used as a refrigerant.

[0050] The probe card 15 has a light irradiation mechanism 20 that heats the electronic device on the wafer W by irradiating light from the upper surface of the wafer W (the surface of the wafer W opposite to the mounting surface). The light irradiation mechanism 20 has an LED array 21 and an LED control port 22. The LED array 21 is controlled by the LED control port 22 to adjust the illumination and light intensity. Furthermore, the LED array 21 is tilted towards the electronic device (the electronic device under inspection) connected to the probe 16 and supported by the LED control port 22. Additionally, a lens (not shown) is provided in the LED array 21 to control the directionality of the LED light, thus enabling the LED light to be irradiated onto the electronic device under inspection. The LED control port 22 supports the LED array 21 and is suspended from the probe card 15. The LED control port 22 is connected via a wiring 23 (see reference 23). Figure 1 ) and control unit 19 (refer to) Figure 1 )connect.

[0051] Figure 3 This is an example of a cross-sectional schematic diagram illustrating the temperature adjustment of the wafer W in the inspection apparatus 10 of this embodiment.

[0052] During the inspection of electronic components, power is supplied to the electronic components of chip W from tester 14 via probe 16. This causes the electronic components of chip W to heat up. Figure 3 The heating zone 40 is indicated in the diagram. Additionally, the control unit 19 controls the light irradiation mechanism 20. Figure 3 In the diagram, the light 25 irradiated from the light irradiation mechanism 20 is illustrated by a double-dotted line. The light radiated from the light irradiation mechanism 20 irradiates the heating region 40 from the upper surface of the wafer W. Additionally, refrigerant is supplied through the refrigerant flow path 30. Thus, the heat in the heating region 40, as indicated by the hollowed-out arrow, is absorbed by the refrigerant in the refrigerant flow path 30 via the mounting stage 11.

[0053] Figure 4 This is an example of a graph used to illustrate the amount of heat generated in the heat-generating region 40 of the wafer W. Figure 4 In the diagram, the vertical axis represents heat generation, and the horizontal axis represents time. During the inspection of electronic devices, the power supplied from probe 16 to the electronic devices on the wafer W changes accordingly to the inspection content. Therefore, the heat generation 101 of the electronic devices themselves changes over time.

[0054] The control unit 19 controls the change in the amount of light from the light irradiation mechanism 20 over time based on the change in the heat generated 101 of the electronic device itself. Specifically, the control is performed so that the total heat generated 102 of the device, which is the sum of the heat generated 111 of the electronic device itself due to power supply and the heat generated 112 by the light irradiation mechanism 20, remains constant.

[0055] According to the inspection apparatus 10 of this embodiment, light is irradiated from the upper surface of the wafer W, which can directly heat the electronic device. This improves the temperature regulation responsiveness of the electronic device.

[0056] Furthermore, according to the inspection apparatus 10 of this embodiment, even if the heat generation of the electronic device changes due to a change in the power supply during inspection, the total heat generation can be kept constant by controlling the heating amount of the electronic device caused by the light irradiation mechanism 20. At this time, the refrigerant flow path 30 is controlled to absorb heat at a constant rate. As a result, the temperature of the electronic device during inspection can be kept constant.

[0057] Furthermore, by arranging the light irradiation mechanism 20 to irradiate light from the upper surface of the wafer W, the design freedom of the refrigerant flow path 30 in the stage 11 can be increased. This facilitates the assembly of cooling mechanisms with high heat absorption efficiency, such as microchannel structures and heat pipe structures.

[0058] Figure 5 This is an example of a schematic diagram showing the LED array 21 as viewed from the irradiated surface side. The LED array 21 is configured to surround the probe 16 ( Figure 2 The outer periphery of the LED array 21 (referring to the reference point) includes, for example, an LED array group 251 that illuminates the outer periphery of the electronic device under inspection; an LED array group 252 that illuminates the center (between the outer periphery and the center) of the electronic device under inspection; and an LED array group 253 that illuminates the center (inner periphery) of the electronic device under inspection. The control unit 19 controls the light intensity of each LED according to the LED arrangement, and can adjust the light intensity distribution of the light illuminating the chip W. For example, the control unit 19 can adjust the light intensity for each LED array group 251-253. In other words, it can control the light intensity distribution of the light illuminating mechanism 20 illuminating the electronic device. Furthermore, in Figure 5 In the illustration, LED array 21 is shown to have three columns arranged from the center outwards, but it is not limited to this arrangement. Furthermore, it is explained that the light intensity is controlled for each of the three LED array groups, but the configuration of the LED array groups is not limited to this.

[0059] During the inspection of electronic devices, the device heats up as output is supplied from probe 16. Heat from the outer periphery of the chip dissipates to the surroundings, while heat remains trapped in the center of the chip. This results in an uneven heat distribution (temperature distribution) within the electronic device.

[0060] Figure 6 This is an example of a cross-sectional schematic diagram illustrating the temperature adjustment of the wafer W in the inspection apparatus 10 of this embodiment.

[0061] The control unit 19 controls the light distribution 26 of the light irradiation mechanism 20 based on the thermal distribution of the electronic components. Furthermore, in Figure 6 The light distribution 26 of the light irradiation mechanism 20 is schematically shown. For example, the light intensity of the LED array group 251 irradiating the outer peripheral side of the electronic device is controlled such that the light intensity of the LED array group 253 irradiating the inner peripheral side is stronger. As a result, the heat distribution in the surface direction of the electronic device can be made more uniform.

[0062] The inspection device 10 has been described above. However, the present invention is not limited to the above embodiments, and various modifications and improvements can be made within the scope of the spirit of the present invention as described in the claims.

[0063] The object to be inspected by the inspection device 10 is illustrated using a wafer W having multiple electronic devices formed on it as an example, but it is not limited to this. The object to be inspected by the inspection device 10 can also be a carrier C having multiple electronic devices configured on it.

[0064] The light irradiation mechanism 20 is described as using an LED as a light source, but it is not limited to this and can also be an electric lamp or the like.

Claims

1. An inspection apparatus characterized by comprising: including: a stage on which a substrate is placed; a cooling unit that cools the substrate placed on the stage; a probe card having probes that contact the substrate to supply power; a light irradiation mechanism that irradiates a top surface of the substrate on an opposite side from a placement surface of the substrate placed on the stage with light; and a control unit that controls the light irradiation mechanism, the light irradiation mechanism has a plurality of light sources, the plurality of light sources are arranged in a plurality of columns in a radial direction at an outer periphery of the probes and are arranged obliquely toward an electronic device connected to the probes, the control unit divides the plurality of light sources into an inner periphery light source group that irradiates an inner periphery side of the electronic device connected to the probes and an outer periphery light source group that irradiates an outer periphery side of the electronic device connected to the probes, controls the amount of light of each of the light source groups, and thereby controls the light amount distribution of the light irradiation mechanism.

2. The inspection apparatus according to claim 1, wherein: the control unit controls the amount of light of the light irradiation mechanism based on the amount of heat generated in the substrate due to the power supply.

3. The inspection apparatus according to claim 2, wherein: the control unit controls the change over time of the amount of light of the light irradiation mechanism based on the change over time of the amount of heat generated in the substrate due to the power supply.

4. The inspection apparatus according to claim 3, wherein: the control unit controls the amount of light of the light irradiation mechanism or the change over time of the amount of light of the light irradiation mechanism based on the sum of the amount of heat generated in the substrate due to the power supply and the amount of heat generated in the substrate due to the light irradiated from the light irradiation mechanism.

5. The inspection apparatus according to any one of claims 1 to 4, wherein: the control unit controls the light amount distribution of the light irradiation mechanism based on the heat distribution of the substrate.

6. The inspection apparatus according to claim 5, wherein: the substrate has a device that is supplied with power from the probes, the control unit controls the light amount distribution of the light irradiation mechanism so that the amount of light irradiated to an outer peripheral portion of the device is stronger than the amount of light irradiated to an inner peripheral portion of the device. ​

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