Test equipment

Abstract

The present invention provides a testing device comprising a base and a preheating unit disposed on the base. The preheating unit includes a gas generator, a blocking mechanism, and a heating device. The gas generator is configured to discharge air toward the base to form an air wall. The blocking mechanism is located above the air wall and forms a heat-insulating space with the air wall. The heating device is disposed within the heat-insulating space.

Description

Technical Field

[0001] The present invention relates to a testing device, in particular to a testing device with an air wall. Background Art

[0002] Typically, chips are placed in testing equipment, such as a handler, for final testing (FT). Before testing, they must be preheated according to test temperature conditions. Furthermore, because preheating occurs in an open environment, heat dissipates more easily, preventing the preheated chips from achieving optimal temperature stability.

[0003] However, some tests (such as electrical tests) are highly sensitive to temperature. In the case of poor temperature stability, the test results will be easily affected, which will also be reflected in the yield performance. Summary of the Invention

[0004] The present invention is directed to a testing device that can achieve better temperature stability for preheating chips, thereby improving yield performance.

[0005] According to an embodiment of the present invention, a testing device includes a base and a preheating unit disposed on the base. The preheating unit includes a gas generator, a blocking mechanism, and a heating device. The gas generator is configured to discharge air toward the base to form an air wall. The blocking mechanism is located above the air wall and forms a heat-insulating space with the air wall. The heating device is disposed within the heat-insulating space.

[0006] According to an embodiment of the present invention, a test device is provided for detecting a chip, wherein the test device includes a first station, a second station, and a third station. The second station includes a preheating unit. The preheating unit includes a gas generator, a blocking mechanism, and a heating device. The gas generator is used to discharge air toward the base to form an air wall. The blocking mechanism is located above the air wall and forms an insulation space with the air wall. The heating device is arranged in the insulation space. The second station connects the first station and the third station. The chip is transported from the first station to the second station so that the chip performs a preheating action, and the chip is transported from the second station to the third station so that the chip performs a testing action.

[0007] Based on the above, the preheating unit of the test equipment of the present invention utilizes a gas generator to form an air wall. This air wall and the barrier structure create a thermally insulated space that resembles a closed environment. This effectively reduces heat dissipation from the heating device, ensuring optimal temperature stability during preheating of the chips, thereby improving yield performance. Furthermore, the air wall design allows for the free transfer of chips while maintaining effective thermal insulation, allowing them to freely enter and exit the first, second, and third workstations for preheating and testing, further enhancing its practicality.

[0008] In order to make the above features and advantages of the present invention more clearly understood, embodiments are given below with reference to the accompanying drawings for detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 is a partial side schematic diagram of a testing device according to an embodiment of the present invention;

[0010] Figure 2 is a partial three-dimensional schematic diagram of a testing device according to an embodiment of the present invention;

[0011] Figure 3 FIG. 1 is a partial top view of a blocking structure of a testing device according to an embodiment of the present invention.

[0012] It should be noted that Figure 2 Only for the sake of clarity of the closed environment of the second workstation, the internal components of the second workstation and other workstations and components are omitted. Figure 3 In order to clearly show the hole 1241, a perspective view is used. DETAILED DESCRIPTION

[0013] Reference will now be made in detail to exemplary embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Whenever possible, the same reference numerals are used in the drawings and the description to refer to the same or like parts.

[0014] Directional terms used herein (eg, up, down, right, left, front, back, top, bottom) are used only with reference to the drawings and are not intended to imply an absolute orientation.

[0015] The present invention will be more fully described with reference to the accompanying drawings of the present embodiment. However, the present invention may be embodied in various forms and should not be limited to the embodiments described herein. The thickness, dimensions, or sizes of layers or regions in the drawings may be exaggerated for clarity. Identical or similar reference numbers denote identical or similar elements, and detailed descriptions will not be repeated in the following paragraphs.

[0016] Figure 1 is a partial side view schematic diagram of a testing device according to an embodiment of the present invention. Figure 2 It is a partial three-dimensional schematic diagram of a testing device according to an embodiment of the present invention. Figure 3 FIG. 1 is a partial top view of a blocking structure of a testing device according to an embodiment of the present invention.

[0017] Please refer to Figures 1 to 3The test device 100 of this embodiment can be used to test a chip (not shown), wherein the chip can be any suitable chip and the present invention is not limited thereto. Here, the aforementioned test can be, for example, the test required in the final test (FT) of the chip, but the present invention is not limited thereto.

[0018] The testing apparatus 100 may include a base 110 and a preheating unit 120 disposed on the base 110 for preheating the chip during the test process. Specifically, the preheating unit 120 may include a gas generator 122, a blocking mechanism 124, and a heating device 126. The gas generator 122 may be configured to discharge air toward the base 110 to form an air wall W. The blocking mechanism 124 may be located above the air wall W and define a heat-insulating space S with the air wall W. The heating device 126 may be disposed within the heat-insulating space S.

[0019] In this embodiment, the preheating unit 120 of the testing equipment 100 forms an air wall W through the gas generator 122, and the air wall W and the blocking structure 124 constitute an insulating space S that is a closed environment. Therefore, it can effectively reduce the heat dissipation of the heating device 126, so that the preheated chip can achieve better temperature stability, thereby improving the yield performance.

[0020] Furthermore, the air wall W can be an invisible wall formed around the heating device 126 to prevent cold air outside the air wall W from entering the insulation space S. That is, the air wall W can have a wall blocking effect but is not limited by a physical structure, and the blocking structure 124 above can be regarded as a top cover structure, so that the air wall W and the blocking structure 124 can form an invisible chamber. Figure 2 As shown, the heat preservation space S formed by the air wall W and the blocking structure 124 can effectively reduce the heat dissipation of the heating device 126, so that the preheating chip can achieve better temperature stability, thereby improving the yield performance.

[0021] Furthermore, the testing apparatus 100 may include a first workstation 101, a second workstation 102, and a third workstation 103, wherein the second workstation 102 may include the aforementioned preheating unit 120. Furthermore, the second workstation 102 may connect the first workstation 101 and the third workstation 103. In other words, the second workstation 102 may be located between the first workstation 101 and the third workstation 103.

[0022] In this embodiment, the chip can be transported from the first station 101 to the second station 102 to perform a preheating operation on the chip, and the chip can be transported from the second station 102 to the third station 103 to perform a test operation on the chip. Figure 1As shown in the conveying path P in the figure, the test equipment 100 can freely convey chips under an effective heat preservation state through the design of the air wall W, so that the chips can freely enter and exit the first workstation 101, the second workstation 102 and the third workstation 103 for preheating and testing, thereby improving its practicality.

[0023] For example, the test equipment 100 can use the design of the air wall W to allow the robot arm 10 that transports the chip to freely enter and exit the first workstation 101, the second workstation 102 and the third workstation 103 while effectively keeping the temperature low, so that the chip can be preheated and tested. Since the air wall W and the blocking structure 124 can form an invisible chamber, the robot arm 10 will not be restricted by the physical structure, but the present invention is not limited to this.

[0024] In some embodiments, in order to reduce the probability of turbulence generated at the bottom of the air wall W and thus interfering with the temperature stability of the chip, the testing equipment 100 may also include a circulation pipeline 130 for receiving the exhaust gas from the gas generator 122 and returning the exhaust gas to the gas generator 120 to serve as a gas source for the gas generator 122, but the present invention is not limited to this.

[0025] In some embodiments, the exhaust gas of the gas generator 122 is, for example, exhaust gas having a temperature higher than normal temperature formed by absorbing the waste heat of the machine when the exhaust gas is discharged to form the air wall W. Therefore, by returning the exhaust gas with a higher temperature, the heat loss in the insulation space S can be further reduced, thereby achieving energy saving, but the present invention is not limited to this.

[0026] In this embodiment, the first station 101 can be used to provide chips, while the third station 103 can be used to test the chips. Therefore, the first station 101 can include a loading unit 140, and the third station 103 can include a testing unit 150. Further, the loading unit 140 can be disposed on the base 110 and connected to the preheating unit 120, while the testing unit 150 can be disposed on the base 110 and connected to a side of the preheating unit 120 opposite the loading unit 140. In other words, the loading unit 140 and the testing unit 150 can be located on opposite sides of the preheating unit 120.

[0027] In some embodiments, the first workstation 101 may have a tray 142 for carrying chips to be tested, so that the robot arm 10 can grab the chips thereon and transport them to the second workstation 102 , but the present invention is not limited thereto.

[0028] In some embodiments, through the design of the invisible wall of the air wall W, the loading unit 140 of the first workstation 101, the preheating unit 120 of the second workstation 102 and the testing unit 150 of the third workstation 103 can have a connecting space separated by the air wall W, so that the chip can freely enter and exit the connecting space under an effective heat preservation state, thereby improving the practicality of the testing equipment, but the present invention is not limited to this.

[0029] Furthermore, the interconnected spaces may have different ambient temperatures. In some embodiments, the ambient temperature of the preheating unit 120 (second workstation 102) may be greater than the ambient temperature of the testing unit 150 (third workstation 103) and the ambient temperature of the loading unit 140 (first workstation 101), but the present invention is not limited thereto.

[0030] In some embodiments, the ambient temperature of the preheating unit 120 may be at least greater than 70° C., that is, the ambient temperature inside the air wall W may be greater than the ambient temperature outside the air wall W, so as to ensure that the chip has better temperature stability, but the present invention is not limited thereto.

[0031] In some embodiments, the heating device 126 can be a heating plate to carry and heat the chip transported by the robotic arm 10. Therefore, the heating device 126 heats the chip by heat conduction, for example, but the present invention is not limited to this. The heating device 126 can use any suitable heating method to heat the chip.

[0032] In some embodiments, the blocking mechanism 124 may include a thermal radiation reflector, so that the thermal radiation lost by the heating device 126 can be reflected back to the chip through the thermal radiation reflector to further achieve the energy-saving effect of thermal radiation recycling and reuse, but the present invention is not limited thereto.

[0033] In some embodiments, the preheating unit 120 may further include a windless ion fan 128. The windless ion fan 128 may be disposed on the blocking mechanism 124 and located outside the heat preservation space S. The blocking mechanism 124 may have a plurality of holes 1241 arranged in an array (e.g., Figure 3 As shown), it is used to allow the ions generated by the windless ion fan 128 to pass through, so as to eliminate static electricity and reduce the cooling effect caused by the chip being blown by the ion fan during preheating, so as to have better temperature stability. However, the present invention is not limited to this. In other embodiments, the preheating unit 120 can also be a windy ion fan.

[0034] It should be noted that Figure 1The loading unit 140 of the first station 101, the preheating unit 120 of the second station 102, and the testing unit 150 of the third station 103 are only schematically shown. The loading unit 140 of the first station 101, the preheating unit 120 of the second station 102, and the testing unit 150 of the third station 103 are not limited to Figure 1 The parts shown in the figure can be adjusted according to actual design requirements.

[0035] also, Figure 1 The relative relationship between the loading unit 140, preheating unit 120, and testing unit 150 is merely schematically illustrated. The loading unit 140, preheating unit 120, and testing unit 150 may be connected in any suitable manner, and the present invention is not limited thereto. Furthermore, the testing apparatus 100 may be adjusted to actual design requirements and further include other workstations (not shown). The present invention is not limited to the aforementioned workstation embodiments.

[0036] In summary, the preheating unit of the test equipment of the present invention utilizes a gas generator to form an air wall. This air wall and the barrier structure create a thermally insulated space that resembles a closed environment. This effectively reduces heat dissipation from the heating device, ensuring optimal temperature stability during preheating, thereby improving yield performance. Furthermore, the air wall design allows for the free transfer of chips while maintaining effective thermal insulation, allowing them to freely enter and exit the first, second, and third workstations for preheating and testing, further enhancing its practicality.

[0037] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the above embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A testing device, characterized in that: include: base; as well as A preheating unit is provided on the base, wherein the preheating unit comprises: a gas generator for discharging air toward the base to form an air wall; and a blocking mechanism, located above the air wall and forming a heat-insulating space with the air wall; A heating device is disposed in the heat-insulating space; and The circulation pipeline is used for receiving the exhaust gas of the gas generator and returning the exhaust gas to the gas generator to serve as a gas source for the gas generator.

2. The test device according to claim 1, characterized in that The device further comprises a loading unit, which is disposed on the base and connected to the preheating unit, wherein the loading unit and the preheating unit have a first communicating space separated by the air wall.

3. The testing device according to claim 2, characterized in that It also includes a testing unit, which is arranged on the base and connected to a side of the preheating unit opposite to the loading unit, wherein the loading unit, the preheating unit and the testing unit have a second connecting space separated by the air wall.

4. The testing device according to claim 3, characterized in that The ambient temperature of the preheating unit is greater than the ambient temperature of the testing unit, and the ambient temperature of the preheating unit is greater than the ambient temperature of the loading unit.

5. The testing device according to claim 4, characterized in that The ambient temperature of the preheating unit is at least greater than 70°C.

6. A testing device for testing a chip, wherein the testing device comprises: First workstation; The second station includes a preheating unit, wherein the preheating unit includes: a gas generator for discharging air to form an air wall around the first workstation; a blocking mechanism, located above the air wall and forming a heat-insulating space with the air wall; and A heating device is disposed in the heat-insulating space; and The third station, wherein the second station connects the first station and the third station, the chip is transported from the first station to the second station to perform a preheating operation on the chip, and the chip is transported from the second station to the third station to perform a test operation on the chip, wherein The testing device further includes a circulation pipeline for receiving the exhaust gas from the gas generator and returning the exhaust gas to the gas generator to serve as a gas source for the gas generator.

7. The testing device according to claim 6, characterized in that The first work station, the second work station and the third work station have communicating spaces separated by the air wall.

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