Single-bracket support structure for force sensing and haptic feedback

Abstract

This implementation relates to a support structure for an input device that supports deflection of an input surface in response to an input force applied thereon and vibration of the input surface in response to haptic feedback generated by a haptic actuator. The support structure includes one or more fixed structures mounted to a housing and a dynamic surface mounted to a sensor layer of the input device. A plurality of first deformable segments cantilever from the one or more fixed surfaces and deflect in a vertical direction when an input force is applied on the sensor layer, where the input force is normal to the input surface. A plurality of second deformable segments connect the plurality of first deformable segments to the dynamic surface and deflect in a horizontal direction when a shear force is applied on the dynamic surface, where the shear force is parallel to the input surface.

Description

[0001] Cross-references to related applications

[0002] This application claims priority and benefit to U.S. Provisional Patent Application No. 63 / 110,486, filed November 6, 2020, pursuant to 35 USC §119(e), which is incorporated herein by reference in its entirety. Technical Field

[0003] This implementation generally relates to input devices, and more specifically to a single-bracket support structure for supporting force sensing and haptic feedback input devices. Background Technology

[0004] Input devices, including proximity sensor devices (often also called touchpads or touch sensor devices), are widely used in a variety of electronic systems. A proximity sensor device typically includes a sensing area, usually defined by a surface, within which the proximity sensor device determines the presence, orientation, and / or movement of one or more input objects. Proximity sensor devices can be used to provide interfaces for electronic systems. For example, proximity sensor devices are commonly used as input devices in larger computing systems (such as opaque touchpads integrated into or surrounding laptops or desktop computers). Proximity sensor devices are also commonly used in smaller computing systems (such as touchscreens integrated into cellular phones).

[0005] Some input devices may be able to detect the amount of force or pressure applied to an input surface, for example, based on the degree to which the input surface deforms or deflects under such an external force. Force sensing can provide an additional dimension to the type of input that can be used to control or operate electronic systems. Among other examples, when a user presses a button, key, or other mechanical actuator, the user can provide a "click" input by pressing down on the input surface. However, unlike mechanical actuators, the deflection of the input surface provides little (if any) feedback to the user of the input device. Therefore, some input devices have incorporated haptic actuators, which can send vibrations to the input surface to provide haptic feedback to the user. Summary of the Invention

[0006] The present invention is provided to present, in a simplified form, the selection of concepts further described below in the detailed embodiments. The present invention is not intended to identify key or essential features of the claimed subject matter, nor is it intended to limit the scope of the claimed subject matter.

[0007] One innovative aspect of the subject matter of this disclosure can be implemented in a support structure for an input device. The support structure includes one or more fixed surfaces configured to be mounted to a housing, a dynamic surface configured to be mounted to a sensor layer of the input device, a plurality of first deformable segments cantilevered from the one or more fixed surfaces, and a plurality of second deformable segments connecting the plurality of first deformable segments to the dynamic surface. The plurality of first deformable segments are configured to deflect in a first direction in response to an input force applied to the sensor layer, wherein the input force is orthogonal to the input surface of the input device. The plurality of second deformable segments are configured to deflect in one or more second directions in response to a shear force applied to the dynamic surface, wherein the shear force is parallel to the input surface.

[0008] Another innovative aspect of the subject matter of this disclosure can be implemented in an input device comprising a housing, a sensor layer, and a support structure. The support structure includes one or more fixed surfaces mounted to the housing, a dynamic surface mounted to the sensor layer, a plurality of first deformable segments cantilevered from the one or more fixed surfaces, and a plurality of second deformable segments connecting the plurality of first deformable segments to the dynamic surface. The plurality of first deformable segments are configured to deflect in a first direction in response to an input force applied to the sensor layer, wherein the input force is orthogonal to the input surface of the input device. The plurality of second deformable segments are configured to deflect in one or more second directions in response to a shear force applied to the dynamic surface, wherein the shear force is parallel to the input surface. Attached Figure Description

[0009] This implementation is shown by way of example and is not intended to be limited to the figures in the accompanying drawings.

[0010] Figure 1 An example input device that can be used with this implementation is shown.

[0011] Figure 2 An example force sensor configuration of an input device is shown, based on some implementations.

[0012] Figure 3A and 3B An example stack of input devices is shown, based on some implementations.

[0013] Figure 4 An exploded isometric view of an input device is shown, depending on some implementation.

[0014] Figure 5A and 5B It shows Figure 4 A perspective view of the support layer of the input device depicted in the image.

[0015] Figure 6 It shows Figure 5A and Figure 5B A more detailed view of the support structure shown.

[0016] Figure 7A and 7B It shows Figure 4 Example stacking of input devices depicted in the image. Detailed Implementation

[0017] In the following description, numerous specific details, such as examples of specific components, circuits, and processes, are set forth to provide a thorough understanding of this disclosure. As used herein, the term "coupled" means directly connected to or connected via one or more intermediate components or circuits. The terms "electronic system" and "electronic device" are used interchangeably to refer to any system capable of electronically processing information. Furthermore, specific nomenclature is set forth in the following description and for purposes of explanation to provide a thorough understanding of various aspects of this disclosure. However, it will be apparent to those skilled in the art that these specific details may not be required to practice the exemplary implementations. In other instances, well-known circuits and devices are shown in block diagram form to avoid obscuring this disclosure. Some portions of the following detailed description are presented according to procedures, logic blocks, processes, and other symbolic representations of operations on data bits within computer memory.

[0018] These descriptions and representations are means by which those skilled in the art of data processing most effectively communicate the substance of their work to others skilled in the art. In this disclosure, processes, logic blocks, procedures, etc., are considered as a self-consistent sequence of steps or instructions that lead to a desired result. A step is a step that requires physical manipulation of physical quantities. Typically, though not always, these quantities take the form of electrical or magnetic signals that can be stored, transmitted, combined, compared, and otherwise manipulated in a computer system. However, it should be remembered that all these and similar terms will be associated with appropriate physical quantities and are merely convenient labels applied to those quantities.

[0019] Unless otherwise expressly stated, it should be understood, as will be apparent from the following discussion, that throughout this application, discussions using terms such as “access,” “receive,” “send,” “use,” “select,” “determine,” “normalize,” “multiply,” “average,” “monitor,” “compare,” “apply,” “update,” “measure,” and “derive” refer to the actions and processes of a computer system or similar electronic computing device that manipulate and convert data represented as physical (electronic) quantities in the registers and memories of the computer system into other data represented similarly as physical quantities in the memory or registers of the computer system or other such information storage, transmission, or display devices.

[0020] In the accompanying drawings, a single block may be described as performing one or more functions; however, in practice, the one or more functions performed by that block may be performed in a single component or across multiple components, and / or may be performed using hardware, software, or a combination of hardware and software. To clearly illustrate this interchangeability between hardware and software, various illustrative components, blocks, modules, circuits, and steps have been generally described below in terms of their functionality. Whether such functionality is implemented as hardware or software depends on the specific application and the design constraints imposed on the system as a whole. Those skilled in the art may implement the described functionality in different ways for each specific application, but such implementation decisions should not be construed as departing from the scope of the invention. Furthermore, the example input device may include components other than those shown, including well-known components such as processors and memory.

[0021] The techniques described herein can be implemented in hardware, software, firmware, or any combination thereof, unless specifically described as being implemented in a particular manner. Any feature described as a module or component may also be implemented together in an integrated logic device or separately as a discrete but interoperable logic device. If implemented in software, the techniques may be implemented at least in part by a non-transitory processor-readable storage medium comprising instructions that, when executed, perform one or more of the methods described above. The non-transitory processor-readable data storage medium may form part of a computer program product that may include encapsulation material.

[0022] Non-transitory processor-readable storage media may include random access memory (RAM) (such as synchronous dynamic random access memory (SDRAM)), read-only memory (ROM), non-volatile random access memory (NVRAM), electrically erasable programmable read-only memory (EEPROM), flash memory, and other known storage media. Additionally or alternatively, the technology may be implemented at least in part by a processor-readable communication medium that carries or transmits code in the form of instructions or data structures and is accessible, read, and / or executed by a computer or other processor.

[0023] The various illustrative logic blocks, modules, circuits, and instructions described in conjunction with the implementations disclosed herein can be executed by one or more processors. As used herein, the term "processor" can refer to any general-purpose processor, conventional processor, controller, microcontroller, special-purpose processor, and / or state machine capable of executing the scripts or instructions of one or more software programs stored in memory.

[0024] The various implementations generally involve input devices capable of force sensing and haptic feedback. Some implementations more specifically involve support structures or brackets for the input device that support the input surface in response to deflection of an input force applied thereto and vibration of the input surface in response to haptic feedback generated by a haptic actuator. The support structure includes one or more fixed structures to be mounted to a housing and a dynamic surface to be mounted to a sensor layer of the input device. A plurality of first deformable segments cantilevered from one or more fixed surfaces and are configured to deflect in a vertical direction when an input force is applied to the sensor layer, wherein the input force is orthogonal to the input surface. A plurality of second deformable segments connect the plurality of first deformable segments to the dynamic surface and are configured to deflect in a horizontal direction when a shear force is applied to the dynamic surface, wherein the shear force is parallel to the input surface. In some implementations, the support structure may be formed from a single continuous layer or sheet of spring metal.

[0025] Specific implementations of the subject matter described in this disclosure can be implemented to achieve one or more of the following potential advantages. In some implementations, the described techniques can be used to manufacture low-cost support brackets for input devices, providing robust performance and user experience. For example, by forming the support bracket from a single metal sheet, the manufacturing and assembly process can be simplified, and the associated costs reduced. By deflecting in the vertical direction, a plurality of first deformable segments allow the input device to detect input forces, for example, applied to the input surface by an input object. By deflecting in the horizontal direction, a plurality of second deformable segments allow the input device to provide haptic feedback, for example, via the input surface through a haptic actuator. Furthermore, the integration of the first deformable segments with the second deformable segments allows the input device to provide haptic feedback while receiving input forces via the input surface.

[0026] Figure 1An example input device 100 that can be used with this implementation is shown. Input device 100 includes a processing system 110 and a sensing area 120. In some implementations, input device 100 may be configured to provide input to and / or control access to an electronic system (not shown for simplicity). Example electronic systems may include, but are not limited to, personal computing devices (e.g., desktop computers, laptop computers, netbook computers, tablet computers, web browsers, e-book readers, personal digital assistants (PDAs), etc.), composite input devices (e.g., physical keyboards, joysticks, push-button switches, etc.), data input devices (e.g., remote controls, mice, etc.), data output devices (e.g., display printers, etc.), remote terminals, kiosks, video game consoles (e.g., video game consoles, portable gaming devices, etc.), communication devices (e.g., cellular phones, smartphones, etc.), and media devices (e.g., recorders, editors, televisions, set-top boxes, music players, digital photo frames, digital cameras, etc.).

[0027] In some aspects, the input device 100 can be implemented as a physical part of the corresponding electronic system. Alternatively, the input device 100 can be physically separated from the electronic system. The input device 100 can be coupled to (and communicate with) components of the electronic system using various wired and / or wireless interconnection and communication technologies such as buses and networks. Suitable examples of such technologies may include inter-integrated circuits (IICs). 2 C) Serial Peripheral Interface (SPI), PS / 2, Universal Serial Bus (USB), Bluetooth ® Infrared Data Association (IrDA) and various radio frequency (RF) communication protocols defined by the IEEE 802.11 standard family.

[0028] exist Figure 1In the example, input device 100 may correspond to a proximity sensor (also referred to as a “touchpad” or “touch sensor device”) configured to sense input provided by an input object 140 in sensing area 120. Among other examples, example input object 140 includes a finger, stylus, or active pen. Sensing area 120 may cover any space above, around, in, and / or near input device 100, where input device 100 is capable of detecting user input. The size, shape, and / or orientation of sensing area 120 may vary depending on the actual implementation. In some implementations, sensing area 120 may extend from the surface of input device 100 in one or more directions in space, for example, until the sensor’s signal-to-noise ratio (SNR) drops below a threshold suitable for object detection. For example, the distance (the distance from which sensing area 120 extends in a particular direction) may be on the order of less than one millimeter, several millimeters, several centimeters, or larger, and may vary depending on the type of sensing technology used and / or the desired accuracy.

[0029] Input device 100 can utilize various sensing technologies to detect user input. Example sensing technologies may include capacitive sensing, optical sensing, elastic sensing, resistive sensing, inductive sensing, magnetic sensing, acoustic sensing, and ultrasonic sensing. In some implementations, sensing area 120 may be formed by an array of capacitive sensing elements (e.g., sensor electrodes) used to measure changes in capacitance caused by interaction between a finger and sensing area 120. For example, sensing area 120 may include one or more capacitive sensing elements (e.g., sensor electrodes) to create an electric field. Input device 100 can detect input based on changes in the capacitance of the sensor electrodes. For example, an object in contact with (or in close proximity to) an electric field can cause changes in voltage and / or current in the sensor electrodes.

[0030] Example capacitive sensing techniques can be based on "self-capacitance" (also known as "absolute capacitance") and / or "mutual capacitance" (also known as "cross-capacitance"). Absolute capacitance sensing methods detect changes in the capacitive coupling between sensor electrodes and an input object. For example, an input object near the sensor electrodes can alter the electric field near the sensor electrodes, thereby changing the measured capacitive coupling. In some implementations, input device 100 can achieve absolute capacitance sensing by modulating the sensor electrodes relative to a reference voltage and detecting the capacitive coupling between the sensor electrodes and the input object. The reference voltage can be substantially constant or can vary. In some aspects, the reference voltage can correspond to ground potential.

[0031] Transcapacitive sensing methods detect changes in capacitive coupling between sensor electrodes. For example, an input object near the sensor electrodes can alter the electric field between the sensor electrodes, thereby changing the measured capacitive coupling of the sensor electrodes. In some implementations, input device 100 can achieve transcapacitive sensing by detecting the capacitive coupling between one or more “transmitter” electrodes and one or more “receiver” electrodes. The transmitter electrode can be modulated relative to the receiver electrode. For example, the transmitter electrode can be modulated relative to a reference voltage to transmit a signal, while the receiver electrode can be held at a relatively constant voltage to “receive” the transmitted signal. The signal received by the receiver electrode may be affected by environmental interference, such as from objects in contact with or in close proximity to the sensor electrodes. In some aspects, each sensor electrode can be a dedicated transmitter or a dedicated receiver. In other aspects, each sensor electrode can be configured to both transmit and receive.

[0032] In some implementations, the input device 100 may also detect forces applied to an input surface coinciding with the sensing area 120. For example, the input device 100 may include one or more force sensors configured to generate force information representing the force applied by the input object 140 upon contact with the sensing area 120. The force information may be in the form of an electrical signal representing the amount of force applied to the input surface. For example, the force sensor may be formed at least partially from a multilayer of conductors disposed on the underside of the input surface. The input surface may be configured to deflect or compress in the event of a force applied by the input object 140. Movement of the input surface may cause a change in displacement between the conductors of the force sensor. The force sensor may generate an electrical signal based on a change in capacitance between the conductors caused by the deflection of the input surface. Therefore, the change in capacitance may be correlated with the amount of force applied to the input surface.

[0033] Processing system 110 can be configured to operate the hardware of input device 100 to detect input in sensing area 120. In some implementations, processing system 110 can control one or more sensor electrodes and / or force sensors to detect objects in sensing area 120. For example, processing system 110 can be configured to transmit signals via one or more transmitter sensor electrodes and receive signals via one or more receiver sensor electrodes. Processing system 110 can also be configured to receive force sensing signals via one or more force sensors. In some aspects, one or more components of processing system 110 can be co-located, for example, closely proximate to the sensing element of input device 100. In some other aspects, one or more components of processing system 110 can be physically separated from the sensing element of input device 100. For example, input device 100 can be a peripheral device coupled to a computing device, and processing system 110 can be implemented as software executed by the central processing unit (CPU) of the computing device. In another example, input device 100 can be physically integrated into a mobile device, and processing system 110 can at least partially correspond to the CPU of the mobile device.

[0034] The processing system 110 can be implemented as a set of modules, in firmware, software, or a combination thereof. Example modules include a hardware operation module for operating hardware such as one or more sensing elements; a data processing module for processing data such as sensor signals; and a reporting module for reporting information to other components of the electronic system, such as a host processor or CPU. In some implementations, the processing system 110 may include: a sensor operation module configured to operate the sensing elements to detect user input in the sensing area 120; a recognition module configured to recognize gestures associated with some user input; and a mode-changing module for changing the operating mode of the input device 100 and / or the electronic system.

[0035] In some aspects, the processing system 110 may respond to user input in the sensing area 120 by triggering one or more actions. Example actions include changing the operating mode of the input device 100 and / or graphical user interface (GUI) actions, such as cursor movement, selection, menu navigation, etc. In some implementations, the processing system 110 may provide information about the detected input to an electronic system (e.g., to the CPU of the electronic system). The electronic system may then process the information received from the processing system 110 to perform additional actions (e.g., changing the mode of the electronic system and / or GUI actions).

[0036] Processing system 100 can operate the sensing element of input device 100 to generate an electrical signal indicating input (or the absence of input) in sensing area 120. Processing system 110 can perform any appropriate amount of processing on the electrical signal to convert or generate information for provision to electronic system. For example, processing system 110 can digitize analog signals received via sensor electrodes and / or perform filtering or conditioning on the received signals. In some aspects, processing system 110 can subtract or otherwise account for a “baseline” associated with the sensor electrodes. For example, the baseline can represent the state of the sensor electrodes when no user input is detected. Therefore, the information provided to electronic system by processing system 110 can reflect the difference between the signal received from the sensor electrodes and the baseline associated with each sensor electrode.

[0037] In some implementations, the processing system 110 may also determine position information and / or force information of the detected input. As used herein, the term "position information" refers to any information describing or otherwise indicating the position or orientation of the detected input (e.g., within the sensing area 120). Example position information may include absolute position, relative position, velocity, acceleration, and / or other types of spatial information. Similarly, as used herein, the term "force information" refers to any information describing or otherwise indicating the force exerted by an input object in contact with the input surface of the input device 100. For example, force information may be provided as a vector or scalar (e.g., indicating direction and / or magnitude). As another example, force information may include a time history component and / or a description of whether the force exerted by the input object exceeds a threshold amount.

[0038] In some implementations, input device 100 may include a touchscreen interface (e.g., a display screen) that at least partially overlaps with sensing area 120. For example, sensor electrodes of input device 100 may form a substantially transparent overlay on the display screen, thereby providing a touchscreen interface for associated electronic systems. The display screen can be any type of dynamic display capable of displaying a visual interface to a user. Examples of suitable display screen technologies may include light-emitting diodes (LEDs), organic LEDs (OLEDs), cathode ray tubes (CRTs), liquid crystal displays (LCDs), plasma, electroluminescent (EL), or other display technologies.

[0039] In some implementations, the input device 100 may share physical components with the display screen. For example, one or more of the sensor electrodes may be used for both the display interface and sensing input. More specifically, the sensor electrodes used for sensing input may also operate as display electrodes for at least a portion of the display interface. In some implementations, the input device 100 may include a first sensor electrode configured for at least a portion of the display interface and sensing input, and a second sensor electrode configured for input sensing only. For example, the second sensor electrode may be disposed between the substrates of the display device or may be external to the display device.

[0040] In some aspects, the display screen may be at least partially controlled or operated by the processing system 110. The processing system 110 may be configured to execute instructions related to sensing input and displaying the interface. For example, the processing system 110 may simultaneously drive display electrodes to display at least a portion of the interface and sense user input. In another example, the processing system 110 may drive a first display electrode to display at least a portion of the interface while simultaneously driving a second display electrode to sense user input.

[0041] As described above, force sensing can provide an additional dimension to the type of input that can be used to control or operate electronic systems. Among other examples, when a user presses a button, key, or other mechanical actuator, the user can provide a "click" input by pressing down on the input surface. However, unlike mechanical actuators, the deflection of the input surface provides little (if any) feedback to the user of the input device. In some implementations, input device 100 may also include one or more tactile actuators (such as linear resonant actuators (LRAs), piezoelectric actuators, etc.) to provide tactile feedback to the user of input device 100. For example, processing system 110 may operate tactile actuators to send vibrations to the input surface in response to detecting a force input via one or more force sensors.

[0042] This disclosure recognizes that haptic feedback causes movement of the input surface in a direction orthogonal to the direction of the input force. For example, assuming the input object 140 applies an input force in a vertical direction (e.g., a plane orthogonal to the input surface), a haptic actuator can apply a vibratory force in a horizontal direction (e.g., a plane parallel to the input surface). Therefore, one of the challenges of combining haptic feedback with force sensing is designing an input device or apparatus having an input surface that can deflect in multiple orthogonal directions. In particular, this implementation provides a support structure for the input device that allows horizontal movement of the input surface (e.g., in response to haptic feedback) while the input surface is vertically compressed (e.g., in response to an input force).

[0043] Figure 2An example force sensor configuration of input device 200 according to some implementations is shown. In some implementations, input device 200 may be... Figure 1 An example of input device 100. Input device 200 includes an upper layer 210 and a lower layer 220. For simplicity, and to illustrate the force sensor configuration, in Figure 2 Only two layers of the input device 200 are depicted in this paper. However, in actual implementations, the input device 200 may include... Figure 2 Additional layers and / or sensor circuits not shown.

[0044] exist Figure 2 In the example, a pair of force-sensing electrodes 212 and 214 are coupled to the upper layer 210 of the input device 200. In some implementations, force-sensing electrode 212 may be a transmitter electrode, and force-sensing electrode 214 may be a receiver electrode. A processing system (such as processing system 110) may drive the force-sensing signal on the transmitter electrode 212 and receive the resulting signal via the receiver electrode 214 to measure or detect the capacitance (C) between the pair of force-sensing electrodes 212 and 214. In some implementations, the lower layer 220 may be formed of (or include) a conductive material that may be grounded or driven to a specific voltage level.

[0045] In some implementations, the upper layer 210 may be further coupled to the input surface of the input device 200 (not shown for simplicity). Therefore, the upper layer 210 may deflect toward the lower layer 220 in response to an input force applied to the input surface. When the upper layer 210 is brought closer to the lower layer 220, the voltage on the lower layer 220 affects the change in capacitance C between the force sensing electrodes 212 and 214. Therefore, the voltage on the lower layer 220 may change the capacitance C between the force sensing electrodes 212 and 214 at least in part based on the distance (D) between the upper and lower layers 210. More specifically, the change in capacitance C between the force sensing electrodes 212 and 214 increases as the distance D between layers 210 and 220 decreases.

[0046] Figure 3A and 3B An example stack of input device 300 according to some implementations is shown. More specifically, Figure 3A An input device 300 in an uncompressed state (e.g., without any input force) is depicted, and Figure 3B An input device 300 in a compressed state (e.g., when one or more input forces are applied) is depicted. In some implementations, the input device 300 may be... Figure 1 or Figure 2 An example of any input device in input device 100 or 200.

[0047] The input device includes a cover layer 310, a sensor layer 320, a spacer layer 330, and a support layer 340. The cover layer 310 protects the circuitry disposed below and serves as the input surface of the input device 300. For example, the cover layer 310 may be formed of plastic, glass, polyester film, or any other suitable material that can deform or deflect under an applied input force and return to its original form when no such input force is applied. In some aspects, the cover layer may be transparent. In some other aspects, the cover layer may be colored or opaque.

[0048] Sensor layer 320 includes the sensor circuitry of input device 300. For example... Figure 3A As shown, sensor layer 320 includes a plurality of force-sensing electrodes 322 disposed thereon. For example, sensor layer 320 may include a printed circuit board (PCB) formed of a glass-reinforced epoxy laminate (e.g., FR4) or a polyethylene terephthalate (PET) film. In some implementations, sensor layer 320 may be an example of an upper layer 210 of input device 200. See, for example, [reference needed]. Figure 2 The force sensing electrode 322 can be Figure 2 An example of force sensing electrodes 212 and 214. Therefore, force sensing electrode 322 may include one or more transmitter electrodes paired with one or more receiver electrodes. In some other implementations, sensor layer 320 may include... Figure 3A Or additional sensor circuitry not shown in 3B, such as multiple sensor electrodes configured, for example, for capacitive (e.g., proximity) sensing.

[0049] Spacer layer 330 couples sensor layer 320 to underlying support layer 340. For example, spacer layer 330 may be formed of an adhesive material (e.g., glue). In some implementations, spacer layer 330 may maintain a separation distance between sensor layer 320 and support layer 340. See reference, for example. Figure 2 The separation distance between the sensor layer 320 and the support layer 340 can be an example of the distance D between the upper layer 210 and the lower layer 220 of the input device 200. Therefore, the separation distance between the sensor layer 320 and the support layer 340 can depend on whether the spacer layer 330 is in an uncompressed state (e.g., when no input force is applied to the input surface, such as...). Figure 3A (as shown) or in a compressed state (e.g., when an input force is applied to the input surface, such as...) Figure 3B (as shown in the figure) and changes.

[0050] The support layer 340 further couples the input device 300 to the housing (or midframe) or underlying electronics of the input device 300. For example, the support layer 340 may include a plurality of fixed surfaces 342 that can be mounted or attached to the housing. The fixed surfaces 342 do not move or deflect relative to the housing. In some implementations, the support layer 340 may include a first set of deformable segments 344 and a second set of deformable segments 346. The deformable segments 344 are attached to the fixed surfaces 342 and cantilevered out from the fixed surfaces 342. In some aspects, the deformable segments 344 are configured to deflect in a vertical direction (e.g., orthogonal to the input surface). The deformable segments 346 connect the deformable segments 344 to a dynamic surface 348. In some aspects, the deformable segments 346 are configured to deflect in a horizontal direction (e.g., parallel to the input surface). The dynamic surface 348 is configured to move laterally (in the horizontal or vertical direction) relative to the fixed surface 342 in response to the deflection of the deformable segment 344 or 346.

[0051] Dynamic surface 348 (e.g., via spacer layer 330) is coupled to sensor layer 320. In some implementations, support layer 340 may be an example of the lower layer 220 of input device 200. Therefore, support layer 340 may be formed of a conductive material that can be grounded or driven to a specific voltage level. In some aspects, support layer 340 may be formed of a single continuous layer of material. More specifically, support layer 340 may be formed of any suitable material having spring-like properties, such that deformable segments 344 and 346 can deform or deflect under applied force and return to their original shape or configuration when no such force is applied. Examples of suitable materials include various types of spring metals (e.g., spring steel).

[0052] The deformable segment 344 enables the dynamic surface 348 to respond to an input force (F) applied to (and orthogonal to) the input surface. in It moves or deflects in the vertical direction. For example... Figure 3B As shown, the vertical movement of the dynamic surface 348 allows the force-sensing electrode 322 to move closer to one or more portions of the support layer 340, resulting in a change in capacitance between the transmitter and receiver electrodes of the force-sensing electrode 322. This change in capacitance can be measured as an input force (by a processing system). Furthermore, the deformable segment 346 enables the dynamic surface 348 to move or deflect in the horizontal direction in response to a shear force applied to it. As described in more detail below, the shear force can correspond to haptic feedback generated by a haptic actuator.

[0053] Figure 4An exploded isometric view of an input device 400 according to some implementations is shown. The input device 400 includes a cover layer 410, a sensor layer 420, a spacer layer 430, a support layer 440, and a haptic actuator 450. In some implementations, the input device 400 may be an example of the input device 300 of FIG3. Therefore, the cover layer 410, sensor layer 420, spacer layer 430, and support layer 440 may be example implementations of the cover layer 310, sensor layer 320, spacer layer 330, and support layer 340 of the input device 300, respectively.

[0054] like Figure 4 As shown, a spacer layer 430 is disposed on a portion of the support layer 440. In some implementations, the spacer layer 430 only covers the dynamic surface of the support layer 440 (such as dynamic surface 348 in FIG. 3). Therefore, the spacer layer 430 can couple the dynamic surface to the central region of the sensor layer 420 while allowing the outer regions of the sensor layer 420 (e.g., along the perimeter) to "float" above the corresponding portions of the support layer 440. Thus, an air gap can be formed between the force-sensing electrodes disposed on the sensor layer 420 and the conductive surface of the support layer 440. (See reference...) Figure 2 As described in Figure 3, the air gap supports the change in the distance between the force sensing electrode of the sensor layer 420 and the conductive surface of the support layer 440 in response to the input force applied to the input surface (e.g., cover layer 410) of the input device 400.

[0055] In some implementations, a haptic actuator 450 may be disposed below the sensor layer 420. The haptic actuator 450 may be coupled to the dynamic surface of the sensor layer 420 and / or the support layer 440. The haptic actuator 450 may be any suitable device capable of generating vibration or tactile sensation, including but not limited to linear resonant actuators (LRAs) and piezoelectric actuators. In some aspects, the vibration generated by the haptic actuator 450 may exert a shear force on the dynamic surface of the support layer 440. More specifically, this shear force may cause lateral movement of the support layer 440 (e.g., parallel to the input surface). As described above with reference to FIG. 3, the support layer 440 may include one or more features that allow the dynamic surface to move vertically and horizontally relative to one or more fixed surfaces. In some implementations, such features may be integrally formed with the dynamic and fixed surfaces, such that the support layer 440 may be generated or manufactured from a single continuous layer of material (e.g., a single sheet of metal).

[0056] Figure 5A and 5B It shows Figure 4 The image depicts a perspective view of the support layer 440 of the input device 400. More specifically, Figure 5A A top perspective view of the support layer 440 is shown, and Figure 5BA bottom perspective view of the support layer 440 is shown. The support layer 440 may also be referred to herein as a support structure or support bracket.

[0057] like Figure 5A and 5B As shown, the support layer 440 includes a dynamic surface 502 and a plurality of fixed surfaces 510, which can be mounted to or attached to the housing or lower electronic system of the input device 400. In some implementations, the dynamic surface 502 and the fixed surfaces 510 can be examples of the dynamic surface 348 and the fixed surface 342 of FIG3, respectively. For example, each fixed surface 510 may include one or more mounting features 512 (in... Figure 5A and Figure 5B (Depicted as a through hole), which can be attached to a corresponding part of the housing. Once installed, the mounting surface 510 can remain stationary relative to the housing of the input device 400.

[0058] The dynamic surface 502 is coupled to the fixed surface 510 via multiple deformable segments 504 and 506. In some implementations, the deformable segments 504 and 506 can be examples of deformable segments 344 and 346 of FIG. 3, respectively. Figure 5A and Figure 5B In the example, a set of deformable segments 504 and 506 may be provided at each corner of the support layer 440. In some implementations, the deformable segments 504 and 506 may be coplanar with the dynamic surface 502. More specifically, the deformable segment 504 is attached to and cantilevered from the fixed surface 510, and the deformable segment 506 connects the deformable segment 504 to the dynamic surface 502. See, for example, [reference needed]. Figure 3A and 3B Deformable segments 504 and 506 can correspond to deformable segments 344 and 346 of input device 300, respectively. Therefore, deformable segment 504 can be configured to deflect in the vertical direction, while deformable segment 506 can be configured to deflect in the horizontal direction.

[0059] In some implementations, the support layer 440 may further include a plurality of bridging elements 508. Each of the bridging elements 508 may at least partially overlap the top surface of the corresponding deformable segment 504. The bridging elements 508 may provide structural support for the sensor layer 420. For example, corners of the sensor layer 420 may rest on the top of the bridging elements 508. In some aspects, the bridging elements 508 may help diffuse or distribute input forces applied to the input surface to achieve a more uniform distribution at the corners of the sensor layer 420. For example, the bridging elements 508 may transfer input forces to portions of the deformable segment 504 and / or the underlying dynamic surface 502. In some other aspects, the bridging elements 508 may serve as a “bridge” above one or more portions of the dynamic surface 502. For example, even when an input force is applied, the bridging elements 508 may enable the dynamic surface 502 to move laterally relative to the deformable segment 504.

[0060] Figure 6 It shows Figure 5A and Figure 5B A more detailed view of the support structure 440 shown. See, for example, reference... Figure 5A ,exist Figure 6 Only the upper left corner of the supporting structure 440 is depicted.

[0061] like Figure 6 As shown, an air gap 602 is formed along a portion of the perimeter of the dynamic surface 502 to minimize the contact area between the dynamic surface 502 and other portions of the support layer 440. More specifically, the dynamic surface 502 is only connected to the ends of the deformable segments 506. In this way, the deformable segments 504 and 506 effectively suspend the dynamic surface 502 on the fixed surface 510, thereby allowing the dynamic surface 502 to move vertically and horizontally relative to the fixed surface 510. In some implementations, the deformable segment 504 may deflect vertically in response to an input force applied to the input surface. For example, deflection of the deformable segment 504 may cause a change in the air gap between the dynamic surface 502 and the fixed surface 510. In some implementations, the deformable segment 506 may deflect horizontally in response to a shear force applied to the dynamic surface 502. For example, deflection of the deformable segment 506 may cause a change in the air gap between the dynamic surface 502 and the deformable segments 504 and 506.

[0062] In some implementations, the dynamic surface 502 may include a plurality of protrusions 606 extending below the bridging element 508. In some aspects, the protrusions 606 may assist in transmitting input forces to the dynamic surface 502. For example, when a force is applied to a corner of the sensor layer 420, the bridging element 508 may transmit the force from the sensor layer 420 to the deformable segment 504 and the protrusions 606 below it. In some other aspects, the bridging element 508 may anchor the corner of the dynamic surface 502 via the protrusions 606. For example, when a force is applied to a particular corner or side of the sensor layer 420, the protrusions 606 on the opposite side or corner of the input device 400 may hook onto the underside of the corresponding bridging element 508 to prevent such corner elevation of the dynamic surface 502 (and thus causing unwanted capacitance changes between the force-sensing electrode pairs). In some implementations, the bridging element 508 may include raised bumps 604 configured to be disposed in corresponding recesses in the sensor layer 420.

[0063] Figure 7A and 7B It shows Figure 4 The example stack of input device 400 is depicted in the image. More specifically, Figure 7A A perspective view of the upper left corner of the input device 400 is shown, and Figure 7B A cross-sectional view of the upper left corner of the input device 400 is shown.

[0064] like Figure 7A and 7B As shown, a spacer layer 430 is disposed on the dynamic surface 502 and couples or attaches the sensor layer 420 to the support layer 440. However, the sensor layer 420 is not attached to any portion of the support layer 440 that extends beyond the dynamic surface 502. For example, a corner of the sensor layer 420 may rest on a bridging element 508. (See reference for example.) Figure 7B The bump 604 can be positioned within a corresponding groove on the bottom surface of the sensor layer 420 to maintain contact between the bridging element 508 and the sensor layer 420. For example, the bump 604 can maintain point contact with the sensor layer 420 even when the support layer 440 deforms or rotates relative to the sensor layer 420 under applied force. Figure 6-7B In the example, bump 604 is depicted as being formed or disposed on bridging element 508. However, in some other implementations, bumps (and corresponding recesses formed on bridging element 508) can be formed on sensor layer 420, for example, using solder paste dots on the PCB. Furthermore, protrusion 606 is tucked under bridging element 508 to further prevent corners of sensor layer 420 from being lifted or separated from support layer 440.

[0065] like Figure 7AAs shown, the deformable segment 506 is responsive to a shear force (F) applied to the dynamic surface 502. sh The horizontal deflection facilitates the transmission of haptic feedback from the dynamic surface 502 to the input surface of the input device 400. Figure 7B As shown, the deformable segment 504 is responsive to an input force (F) applied to the dynamic surface 502. in The vertical deflection facilitates the detection of input forces on the input surface of the input device 400. In some implementations, the deflection of the deformable segment 504 does not impede the deflection of the deformable segment 506. In other words, the dynamic surface 502 can move in the horizontal direction (e.g., in response to F). sh ), while it is simultaneously shifted in the vertical direction (e.g., in response to F). in Therefore, the support layer 440 allows the input device 400 to provide haptic feedback in response to input force. Thus, the input device 400 can provide a user experience similar to clicking or pressing a mechanical button, key, or other type of actuator.

[0066] Those skilled in the art will understand that information and signals can be represented using any of a variety of different techniques and skills. For example, data, instructions, commands, information, signals, bits, symbols, and chips that can be referenced throughout the foregoing description can be represented by voltage, current, electromagnetic waves, magnetic fields or magnetic particles, light fields or light particles, or any combination thereof.

[0067] Furthermore, those skilled in the art will understand that the various illustrative logic blocks, modules, circuits, and algorithmic steps described in conjunction with the aspects disclosed herein can be implemented as electronic hardware, computer software, or a combination of both. To clearly illustrate this interchangeability between hardware and software, various illustrative components, blocks, modules, circuits, and steps have been described above in general terms of their functionality. Whether this functionality is implemented as hardware or software depends on the specific application and the design constraints imposed on the system as a whole. Those skilled in the art can implement the described functionality in different ways for each specific application, but such implementation decisions should not be construed as departing from the scope of the invention.

[0068] The methods, sequences, or algorithms described in connection with the aspects disclosed herein may be embodied directly in hardware, in a software module executed by a processor, or in a combination of both. The software module may reside in RAM memory, flash memory, ROM memory, EPROM memory, EEPROM memory, registers, hard disk, removable disk, CD-ROM, or any other form of storage medium known in the art. An exemplary storage medium is coupled to the processor, enabling the processor to read information from and write information to the storage medium. Alternatively, the storage medium may be integrated into the processor.

[0069] In the foregoing specification, implementations have been described with reference to specific examples. However, it will be apparent that various modifications and changes may be made therein without departing from the broader scope of this disclosure as set forth in the appended claims. Therefore, the specification and drawings are to be considered illustrative rather than restrictive.

Claims

1. A support structure for an input device, comprising: One or more mounting surfaces configured to be mounted to a housing; A dynamic surface, which is configured to be mounted onto the sensor layer of the input device; A plurality of first deformable segments cantilevered out of the one or more fixed surfaces and configured to deflect in a first direction in response to an input force applied to the sensor layer, the input force being orthogonal to the input surface of the input device; A plurality of second deformable segments connect the plurality of first deformable segments to the dynamic surface and are configured to deflect in one or more second directions in response to a shear force applied to the dynamic surface, the shear force being parallel to the input surface; as well as A plurality of bridging elements, each of which at least partially covers the plurality of first deformable segments, are configured to transfer the input force from the sensor layer to the plurality of first deformable segments.

2. The support structure according to claim 1, wherein the one or more fixed surfaces, the dynamic surface, the plurality of first deformable segments, and the plurality of second deformable segments are integrally formed from a single continuous material layer.

3. The support structure according to claim 2, wherein the material comprises spring metal.

4. The support structure according to claim 1, wherein the plurality of first deformable segments and the plurality of second deformable segments are coplanar with the dynamic surface.

5. The support structure according to claim 1, wherein the plurality of second deformable segments are configured to deflect in one or more of the plurality of first deformable segments in the first direction while deflecting in one or more second directions.

6. The support structure according to claim 1, wherein each of the plurality of first deformable segments is disposed at a corresponding corner of the support structure.

7. The support structure according to claim 1, wherein the sensor layer is not attached to the plurality of bridging elements.

8. The support structure according to claim 1, wherein the dynamic surface includes a plurality of protrusions, the plurality of protrusions being respectively fastened under the plurality of bridging elements.

9. The support structure of claim 1, wherein each of the plurality of bridging elements includes a raised bump configured to be disposed within a corresponding recess in the sensor layer.

10. The support structure of claim 1, wherein each of the plurality of first deformable segments is configured to return to a corresponding stationary state in response to the removal of the input force from the sensor layer.

11. The support structure of claim 1, wherein each of the plurality of second deformable segments is configured to return to a corresponding static state in response to the removal of the shear force from the dynamic surface.

12. An input device, comprising: shell; Sensor layer; as well as The support structure includes: One or more fixed surfaces, said one or more fixed surfaces being mounted to the housing; A dynamic surface, which is mounted to the sensor layer; A plurality of first deformable segments cantilevered out of the one or more fixed surfaces and configured to deflect in a first direction in response to an input force applied to the sensor layer, the input force being orthogonal to the input surface of the input device; A plurality of second deformable segments, the plurality of second deformable segments connecting the plurality of first deformable segments to the dynamic surface and configured to deflect in one or more second directions in response to a shear force applied to the dynamic surface, the shear force being parallel to the input surface; and A plurality of bridging elements, each of which at least partially covers the plurality of first deformable segments, are configured to transfer the input force from the sensor layer to the plurality of first deformable segments.

13. The input device of claim 12, wherein the one or more fixed surfaces, the dynamic surface, the plurality of first deformable segments, and the plurality of second deformable segments are integrally formed from a single continuous material layer.

14. The input device according to claim 12, further comprising: A tactile actuator coupled to the support structure and configured to generate the shear force in response to the input force applied to the sensor layer.

15. The input device of claim 12, wherein the sensor layer includes one or more force-sensing electrodes grounded by the support structure.

16. The input device of claim 12, wherein the plurality of first deformable segments and the plurality of second deformable segments are coplanar with the dynamic surface.

17. The input device of claim 12, wherein the plurality of second deformable segments are configured to deflect in one or more of the plurality of first deformable segments in the first direction while deflecting in the one or more second directions.

18. The input device of claim 12, wherein each of the plurality of first deformable segments is disposed at a corresponding corner of the support structure.

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