Chip bonding device

Abstract

The present invention discloses a chip bonding device, which comprises a carrier and a bonding table spaced apart from each other, a chip ejector located on one side of the carrier, and a bonding device and a correction module located between the carrier and the bonding table. The carrier is used to hold a soft film and a plurality of chips arranged on the soft film. The chip ejector can operate repeatedly to push the plurality of chips toward the bonding device, so that the bonding device can hold the plurality of chips by gravity and its suction. The correction module is used to adjust the plurality of chips held by the bonding device to a predetermined arrangement position. The bonding device can move toward the bonding table and synchronously set the plurality of chips held by it and located at the predetermined arrangement position on the bonding table. Accordingly, the bonding device can effectively use gravity and its suction to hold the plurality of chips, thereby achieving a large-scale transfer effect of the plurality of chips.

Description

Technical Field

[0001] The invention relates to a crystal bonding device, in particular to a chip crystal bonding device. Background Art

[0002] As the structure of electronic products becomes more and more complex and the demand for various chips increases, a large number of chips need to be bonded during the production process. However, existing bonding devices are unable to handle the increasing number of chip bonding operations.

[0003] Therefore, the inventors believe that the above defects can be improved, and have devoted themselves to research and applied scientific principles, and finally proposed the present invention which has a reasonable design and effectively improves the above defects. Summary of the invention

[0004] The embodiment of the present invention provides a chip bonding device, which can effectively improve the defects that may occur in the existing chip bonding device.

[0005] The embodiment of the present invention discloses a chip bonding device, which includes: a carrier and a bonding table, which are arranged at intervals from each other in a predetermined direction; wherein the carrier is used to hold a soft film and a plurality of chips arranged on the soft film; a chip ejector, which is located on a side of the carrier away from the bonding table, and the chip ejector includes at least one ejector pin that can operate in a predetermined direction to push against the soft film and then push against at least one chip; and a bonding device and a correction module, which are located between the carrier and the bonding table, and the bonding device can move in sequence between a suction position, a correction position, and a bonding position, and the bonding device includes at least one suction head; wherein when the bonding device When the crystal device is located at the suction position, at least one suction head faces the chip ejector, and at least one ejector repeatedly operates along a predetermined direction to push multiple chips against at least one suction head, so that at least one suction head can hold multiple chips through gravity and its suction force; wherein, when the crystal bonder is located at the correction position, at least one suction head faces the correction module, and the correction module is used to adjust the multiple chips held by the at least one suction head to a predetermined arrangement position; wherein, when the crystal bonder is located at the crystal bonding position, at least one suction head faces the crystal bonding table, and at least one suction head can be used to fix the multiple chips held by it and adjusted by the correction module on the crystal bonding table.

[0006] Preferably, the chip bonding device further includes: a carrier stage camera, electrically coupled to the chip ejector, and the carrier stage camera is used to detect the positions of multiple chips arranged on the soft film; and a bonding table camera, electrically coupled to the bonder, and the bonding table camera is used to provide at least one suction head required to fix the multiple chips to the bonding table.

[0007] Preferably, the number of die bonders included in the chip die bonding device is further limited to two, and the two die bonders are respectively located at two of the suction position, the correction position, and the die bonding position.

[0008] Preferably, the calibration module comprises: a calibration camera facing at least one suction head at the calibration position and a plurality of chips held therein; and a calibrator electrically coupled to the calibration camera for contacting and adjusting the plurality of chips held by the at least one suction head to a predetermined arrangement position.

[0009] Preferably, the predetermined direction is further defined as a plumb bob direction, and the support platform can move relative to the chip ejector and the crystal bonder along a plane perpendicular to the predetermined direction; when the crystal bonder moves from the suction position to the correction position, at least one suction head does not rotate at all, and when the crystal bonder moves from the correction position to the crystal bonding position, at least one suction head rotates 180 degrees.

[0010] Preferably, the number of the at least one ejector pin included in the chip ejector is further limited to a plurality, and the spacing between the plurality of ejector pins can be maintained within a predetermined range, and each ejector pin can operate independently.

[0011] Preferably, the number of the at least one ejector pin included in the chip ejector is further limited to two, and the chip ejector is capable of adjusting the distance between the two ejector pins, and each ejector pin can operate independently.

[0012] Preferably, the distance between two ejector pins can be adjusted to N times the distance between two adjacent chips held on the carrier, and N is a positive integer.

[0013] Preferably, the number of at least one suction head included in the crystal bonder is further limited to two, and the crystal bonder is capable of adjusting the distance between the two suction heads; wherein the distance between the two suction heads located at the suction position corresponds to the distance between the two ejector pins, and the two suction heads are respectively used to receive multiple chips pushed by the two ejector pins.

[0014] Preferably, the distance between the two suction heads located at the die-bonding position is different from the distance between the two ejector pins.

[0015] In summary, the chip bonding device disclosed in the embodiment of the present invention, through the structural combination of the carrier platform, the bonding table, the chip ejector, and the bonding device, enables the bonding device to effectively utilize gravity and its suction force to hold multiple chips, thereby achieving a large-scale transfer effect of multiple chips between the carrier platform and the bonding table, thereby meeting the requirements of today's increasingly large-scale chip bonding operations.

[0016] Furthermore, the chip bonding device disclosed in the embodiment of the present invention is also provided with the correction module, so that before the multiple chips are set on the bonding table by the bonder, the multiple chips can be fine-tuned to the predetermined arrangement position through the correction module, so as to achieve the requirements of high-precision bonding operation.

[0017] To further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, such description and drawings are only used to illustrate the present invention and are not intended to limit the protection scope of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 FIG. 1 is a schematic diagram of the operation of the chip bonding device according to the first embodiment of the present invention (I).

[0019] Figure 2 FIG. 2 is a schematic diagram of the operation of the chip bonding device according to the first embodiment of the present invention (II).

[0020] Figure 3 FIG. 3 is a schematic diagram of the operation of the chip bonding device according to the first embodiment of the present invention. FIG.

[0021] Figure 4 FIG4 is a schematic diagram of the operation of the chip bonding device according to the first embodiment of the present invention.

[0022] Figure 5 FIG5 is a schematic diagram of the operation of the chip bonding device according to the first embodiment of the present invention (V).

[0023] Figure 6 FIG. 1 is a schematic diagram of the operation of the chip bonding device according to the second embodiment of the present invention (I).

[0024] Figure 7 FIG. 2 is a schematic diagram of the operation of the chip bonding device according to the second embodiment of the present invention (II).

[0025] Figure 8 FIG. 3 is a schematic diagram of the operation of the chip bonding device according to the second embodiment of the present invention.

[0026] Fig. 9 FIG4 is a schematic diagram of the operation of the chip bonding device according to the second embodiment of the present invention.

[0027] Fig.10 FIG5 is a schematic diagram of the operation of the chip bonding device according to the second embodiment of the present invention (V).

[0028] Fig.11 FIG. 1 is a schematic diagram of the operation of the chip bonding device according to the third embodiment of the present invention (I).

[0029] Fig.12 FIG. 2 is a schematic diagram of the operation of the chip bonding device according to the third embodiment of the present invention. DETAILED DESCRIPTION

[0030] The following is an explanation of the implementation of the "chip bonding device" disclosed in the present invention through specific embodiments. Those skilled in the art can understand the advantages and effects of the present invention from the contents disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only simple schematic illustrations and are not depicted according to actual dimensions. It is stated in advance. The following implementation methods will further explain the relevant technical contents of the present invention in detail, but the disclosed contents are not intended to limit the scope of protection of the present invention.

[0031] It should be understood that, although the terms "first", "second", "third", etc. may be used herein to describe various components or signals, these components or signals should not be limited by these terms. These terms are mainly used to distinguish one component from another component, or one signal from another signal. In addition, the term "or" used herein may include any one or more combinations of the associated listed items depending on the actual situation.

[0032] [Example 1]

[0033] See also Figures 1 to 5 As shown, it is the first embodiment of the present invention. This embodiment discloses a chip bonding device 100, which is used to perform a bonding operation on a plurality of chips 300 disposed on a soft film 200 according to actual needs. In this embodiment, the soft film 200 refers to a carrier that can be elastically deformed, and the type of the chip 300 can be a micro light emitting diode (mini LED), but the actual type of the chip 300 can be adjusted and changed according to design requirements (such as: semiconductor chip), and the present invention is not limited here.

[0034] The chip bonding device 100 in this embodiment includes a carrier 1 and a bonding table 2 spaced apart from each other, a chip ejector 3 located on one side of the carrier 1, a carrier camera 4 electrically coupled to the chip ejector 3, a bonding device 5 and a correction module 6 located between the carrier 1 and the bonding table 2, and a bonding table camera 7 electrically coupled to the bonding device 5. Among them, although the chip bonding device 100 in this embodiment is described as including the above-mentioned components, the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the chip bonding device 100 may also omit the carrier camera 4 and the bonding table camera 7, or replace the carrier camera 4 and the bonding table camera 7 with other components.

[0035] The carrier 1 and the die bonding table 2 are arranged at intervals from each other in a predetermined direction H, and the predetermined direction H in this embodiment refers to a plumb direction substantially perpendicular to the horizontal plane; wherein the term "substantially perpendicular" in this embodiment is not limited to correspond to only 90 degrees, and may correspond to 85 degrees to 95 degrees. Furthermore, the carrier 1 is used to hold the soft film 200 and the plurality of chips 300 disposed on the soft film 200, so that the plurality of chips 300 face the die bonding table 2; and the die bonding table 2 is used to carry at least part of the plurality of chips 300 arranged according to a predetermined rule according to the die bonding requirements.

[0036] In more detail, the carrier 1 in this embodiment can move relative to the chip ejector 3 and the die bonder 5 along a plane (e.g., a horizontal plane) perpendicular to the predetermined direction H. That is, the carrier 1 that can move along the plane can move relative to the chip ejector 3 and the die bonder 5 by including (or being connected to) a moving mechanism (not shown, such as a motor and a linear slide), but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the carrier 1 can also remain stationary, but the chip ejector 3 and / or the die bonder 5 can move by including (or being connected to) a moving mechanism.

[0037] The chip ejector 3 is located on a side of the carrier platform 1 away from the crystal bonding platform 2 (eg: Figure 1 ), and the chip ejector 3 includes a plurality of ejector pins 31 that can operate along the predetermined direction H. In this embodiment, the spacing between the plurality of ejector pins 31 can be maintained within a predetermined range (e.g., the spacing is kept fixed or slightly adjusted), and each of the ejector pins 31 can operate independently, but the present invention is not limited thereto.

[0038] Furthermore, any one of the ejector pins 31 is used to push against the soft film 200 (operating along the predetermined direction H), thereby pushing against one of the chips 300. It should be noted that the number of the ejector pins 31 included in the chip ejector 3 is two in this embodiment, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the number of the ejector pins 31 included in the chip ejector 3 may be at least one, which is used to push against the soft film 200, thereby pushing against at least one of the chips 300.

[0039] The platform camera 4 is located on a side of the chip ejector 3 away from the platform 1 (eg: Figure 1). Further, the carrier camera 4 can be selectively configured according to design requirements, for example: when the chip ejector 3 is at least translucent, the carrier camera 4 can be located directly above the chip ejector 3; or, when the chip ejector 3 is non-transparent, the carrier camera 4 can be located obliquely above the chip ejector 3, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the carrier camera 4 can also be located at approximately the same height as the chip ejector 3.

[0040] Furthermore, the carrier stage camera 4 can be used to detect the positions of the plurality of chips 300 disposed on the soft film 200, and the chip ejector 3 can obtain the results measured by the carrier stage camera 4. Among them, the carrier stage camera 4 detects the positions of the plurality of chips 300 disposed on the soft film 200 through the (at least translucent) soft film 200 in this embodiment, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the carrier stage camera 4 can also be disposed between the carrier stage 1 and the die bonding stage 2, and the positions of the plurality of chips 300 disposed on the soft film 200 can be directly measured by the relative movement between the carrier stage camera 4 and the carrier stage 1.

[0041] Accordingly, the chip ejector 3 can, based on the positions of the multiple chips 300 obtained by the carrier camera 4, push the corresponding chips 300 that meet the die bonding requirements with the multiple ejector pins 31 (e.g., the multiple ejector pins 31 push the chips 300 that are good products) through relative movement between the chip ejector 3 and the carrier 1, but the present invention is not limited to this.

[0042] The die bonder 5 located between the carrier 1 and the die bonder 2 can be moved in sequence (by including or being connected to a moving mechanism) at a suction position (e.g. Figure 1 and Figure 2 ), a correction position (such as: Figure 3 ), and a die-bonding position (such as: Figure 4 and Figure 5 ). In this embodiment, the crystal bonder 5 includes a driving unit 51 and at least one suction head 52 connected to the driving unit 51, and at least one of the suction heads 52 can operate along the predetermined direction H. The crystal bonder 5 is rotated by the driving unit 51 to change the position of at least one of the suction heads 52. It should be additionally noted that the number of the at least one suction head 52 included in the crystal bonder 5 is described as one in this embodiment, but the present invention is not limited thereto.

[0043] In more detail, Figure 1 and Figure 2 As shown, when the crystal bonder 5 is located at the suction position, the suction head 52 faces the chip ejector 3 (the multiple ejector pins 31), and any one of the ejector pins 31 repeatedly operates along the predetermined direction H to push the multiple chips 300 toward the suction head 52, so that the suction head 52 can hold the multiple chips 300 by gravity and its suction force.

[0044] Furthermore, if Figure 3 As shown, when the die bonder 5 is located at the calibration position, the suction head 52 faces the calibration module 6, and the calibration module 6 is used to adjust the plurality of chips 300 held by the suction head 52 to a predetermined arrangement position. When the die bonder 5 moves from the suction position to the calibration position, the suction head 52 preferably does not rotate at all.

[0045] In more detail, the calibration module 6 in this embodiment includes a calibration camera 61 and a calibrator 62 (such as a robot arm or a nozzle) electrically coupled to the calibration camera 61. The calibration camera 61 faces the suction head 52 located at the calibration position and the plurality of chips 300 held therein, and is used to detect the positions of the plurality of chips 300 disposed on the soft film 200, and the die bonder 5 can obtain the results measured by the calibration camera 61. The calibrator 62 is adjacent to the die bonder 5, and the calibrator 62 can contact and adjust the plurality of chips 300 held by the suction head 52 to the predetermined arrangement position based on the positions of the plurality of chips 300 obtained by the calibration camera 61.

[0046] It should be noted that the correction camera 61 is located on the upper side of the corrector 62 in this embodiment, but the position of the correction camera 61 can be selectively configured according to design requirements. For example: when the corrector 62 is at least translucent, the correction camera 61 can be located directly above the corrector 62; or, when the corrector 62 is non-transparent, the corrector 62 can be moved directly below it after the correction camera 61 completes the detection, or the correction camera 61 can be located obliquely above the corrector 62, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the correction camera 61 can also be located at approximately the same height as the corrector 62.

[0047] Furthermore, if Figures 3 to 5As shown, when the die bonder 5 moves from the calibration position to the die bonding position, the sucker 52 (can be driven by the driving unit 51) rotates 180 degrees; that is, when the die bonder 5 is located at the die bonding position, the sucker head 52 rotates 180 degrees from facing the chip ejector 3 to facing the die bonding table 2. When the die bonder 5 is located at the die bonding position, the sucker head 52 faces the die bonding table 2, and the sucker head 52 can be used to synchronously set the plurality of chips 300 held by it and adjusted by the calibration module 6 (along the predetermined direction H through the driving unit 51) on the die bonding table 2.

[0048] In more detail, the crystal bonding stage camera 7 is located on the upper side of the crystal bonding stage 2 in this embodiment, but the position of the crystal bonding stage camera 7 can be selectively configured according to design requirements. The crystal bonding stage camera 7 faces the crystal bonding stage 2 to provide the position required by the suction head 52 to fix the plurality of the chips 300 to the crystal bonding stage 2. In other words, the crystal bonder 5 can synchronously set the plurality of the chips 300 held by the suction head 52 and located at the predetermined arrangement position at the predetermined position of the crystal bonding stage 2 according to the information provided by the crystal bonding stage camera 7.

[0049] Accordingly, the chip bonding device 100 disclosed in this embodiment, through the structural combination between the carrier 1, the bonding platform 2, the chip ejector 3, and the bonding device 5, enables the bonding device 5 to effectively use gravity and its suction force to hold the plurality of the chips 300, thereby achieving a large-scale transfer effect of the plurality of the chips 300 between the carrier 1 and the bonding platform 2, and thus can meet the requirements of the current increasing number of chip bonding operations. Among them, the chip ejector 3 and the bonding device 5 can be adjusted accordingly based on the positions of the plurality of the chips 300 obtained by the carrier camera 4, so that the chip ejector 3 can accurately eject the corresponding chip 300, and the bonding device 5 can accurately receive the corresponding chip 300.

[0050] Furthermore, the chip bonding device 100 is also provided with the correction module 6, so that before the multiple chips 300 are set on the bonding table 2 by the bonder 5, the multiple chips 300 can be fine-tuned to the predetermined arrangement position through the correction module 6, so as to achieve the requirements of high-precision bonding operation.

[0051] In addition, the chip bonding device 100 in this embodiment is described by the support platform 1 and the bonding platform 2 being matched with one chip ejector 3 and one bonding device 5, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the support platform 1 and the bonding platform 2 can also be divided into a plurality of areas, and each area is matched with one chip ejector 3 and one bonding device 5.

[0052] [Example 2]

[0053] See also Figures 6 to 10 As shown, this is the second embodiment of the present invention. Since this embodiment is similar to the above-mentioned first embodiment, the similarities between the two embodiments will not be described in detail, and the differences between this embodiment and the above-mentioned first embodiment are roughly described as follows:

[0054] In this embodiment, the number of the ejector pins 31 included in the chip ejector 3 is two, and each of the ejector pins 31 can operate independently; and the number of the suction heads 52 included in the die bonder 5 is further limited to two, but the present invention is not limited thereto.

[0055] In more detail, any two corresponding chips 300 (e.g., good chips 300) that are located on the soft film 200 and meet the die-bonding requirements and are to be transferred to the die-bonding station 2 may not be arranged adjacent to each other on the soft film 200. Accordingly, in order for the chip die-bonding device 100 to have a preferred operating performance, the chip die-bonding device 100 may have at least one of the following conditions, but the present invention is not limited thereto.

[0056] The chip ejector 3 can adjust the distance G31 between the two ejector pins 31, and the distance G31 between the two ejector pins 31 can preferably be adjusted to N times (N is a positive integer) the distance G300 between two adjacent chips 300 held on the carrier 1, so that the two ejector pins 31 can synchronously push against any two chips 300 located on the soft film 200. For example, when N is equal to 1, the two ejector pins 31 are used to synchronously push against two adjacent chips 300; but when N is not equal to 1, the two ejector pins 31 are used to synchronously push against two non-adjacent chips 300.

[0057] Furthermore, the crystal bonder 5 can adjust the distance G52 between the two suction heads 52. Figure 6As shown, the spacing G52 between the two suction heads 52 located at the suction position corresponds to (e.g., is approximately equal to) the spacing G31 between the two ejector pins 31, and the two suction heads 52 are respectively used to receive the multiple chips 300 pushed by the two ejector pins 31 (repeatedly operated).

[0058] like Figure 6 and Fig.10 As shown, the distance G52 between the two suction heads 52 located at the crystal bonding position can be different from the distance G31 between the two ejector pins 31 (for example, the distance G52 between the two suction heads 52 located at the crystal bonding position is approximately equal to the distance G300 between any two chips 300 located on the soft film 200), so that the suction head 52 can be used to synchronously set the multiple chips 300 it holds on the crystal bonding table 2 according to predetermined rules.

[0059] [Example 3]

[0060] See also Fig.11 and Fig.12 As shown, this is the second embodiment of the present invention. Since this embodiment is similar to the above-mentioned first embodiment, the similarities between the two embodiments will not be described in detail, and the differences between this embodiment and the above-mentioned first embodiment are roughly described as follows:

[0061] In the present embodiment, the number of the die bonders 5 included in the chip die bonder 100 may be two, and the two die bonders 5 are respectively located at two of the suction position, the correction position, and the classification position, so that the chip die bonder 100 can have a smoother and more efficient operation. In more detail, when one of the two die bonders 5 moves to the correction position, the other of the two die bonders 5 moves to the suction position, so that the two die bonders 5 can be synchronously maintained in an operating state, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the number of the die bonders 5 included in the chip die bonder 100 may also be three, which are respectively located at the suction position, the correction position, and the classification position, so as to achieve the effect of synchronous operation.

[0062] [Technical Effects of Embodiments of the Invention]

[0063] In summary, the chip bonding device disclosed in the embodiment of the present invention, through the structural combination of the carrier platform, the bonding table, the chip ejector, and the bonding device, enables the bonding device to effectively utilize gravity and its suction force to hold multiple chips, thereby achieving a large-scale transfer effect of multiple chips between the carrier platform and the bonding table, thereby meeting the requirements of today's increasingly large-scale chip bonding operations.

[0064] Furthermore, the chip bonding device disclosed in the embodiment of the present invention is also provided with the correction module, so that before the multiple chips are set on the bonding table by the bonder, the multiple chips can be fine-tuned to the predetermined arrangement position through the correction module, so as to achieve the requirements of high-precision bonding operation.

[0065] Furthermore, in the chip bonding device disclosed in the embodiment of the present invention, the chip ejector can, based on the multiple chip positions obtained by the carrier camera, use the multiple ejector pins to push the corresponding chips that meet the bonding requirements (such as: multiple ejector pins push the chips that are good products) through relative movement between the chip ejector and the carrier.

[0066] In addition, the chip bonding device disclosed in the embodiment of the present invention can also have optimal operating performance through the structural matching design between various components (such as: the distance between the two ejector pins can be adjusted to N times the distance between the two adjacent chips held on the carrier; the distance between the two suction heads located at the suction position corresponds to the distance between the two ejector pins; the distance between the two suction heads located at the bonding position is different from the distance between the two ejector pins).

[0067] The contents disclosed above are only preferred feasible embodiments of the present invention, and are not intended to limit the patent scope of the present invention. Therefore, all equivalent technical changes made using the contents of the present invention's specification and drawings are included in the patent scope of the present invention.

Claims

1. A chip bonding device, characterized in that: The chip bonding device comprises: A carrier and a die bonding table are arranged at intervals from each other in a predetermined direction; wherein the carrier is used to hold a soft film and a plurality of chips disposed on the soft film; a chip ejector is located at a side of the carrier away from the die bonding table, and the chip ejector includes at least one ejector pin that can operate along the predetermined direction to push against the soft film and then push against at least one of the chips; and A crystal bonder and a correction module, which are located between the carrier and the crystal bonder, and the crystal bonder can be moved in sequence between a suction position, a correction position, and a crystal bonder position, and the crystal bonder includes at least one suction head; Wherein, when the die bonder is located at the suction position, at least one of the suction heads faces the chip ejector, and at least one of the ejector pins repeatedly operates along the predetermined direction to push the plurality of chips toward at least one of the suction heads, so that at least one of the suction heads can hold the plurality of chips by gravity and its suction force; Wherein, when the die bonder is located at the correction position, at least one of the suction heads faces the correction module, and the correction module is used to adjust the plurality of chips held by at least one of the suction heads to a predetermined arrangement position; Wherein, when the die bonder is located at the die bonding position, at least one of the suction heads faces the die bonding table, and at least one of the suction heads can be used to fix the plurality of chips held by the suction head and adjusted by the correction module on the die bonding table; Wherein, the predetermined direction is a plumb direction, and the supporting platform can move relative to the chip ejector and the crystal bonder along a plane perpendicular to the predetermined direction; when the crystal bonder moves from the suction position to the correction position, at least one of the suction heads does not rotate at all, and when the crystal bonder moves from the correction position to the crystal bonding position, at least one of the suction heads rotates 180 degrees.

2. The chip bonding device according to claim 1, characterized in that: The chip bonding device further comprises: a carrier stage camera, electrically coupled to the chip ejector, and the carrier stage camera is used to detect the positions of the plurality of chips disposed on the soft film; and A die bonding stage camera is electrically coupled to the die bonder and is used to provide a position of at least one of the suction heads required to fix the plurality of chips to the die bonding stage.

3. The chip bonding device according to claim 1, characterized in that: The number of the die bonders included in the chip die bonding device is further limited to two, and the two die bonders are respectively located at two of the suction position, the correction position, and the die bonding position.

4. The chip bonding device according to claim 1, characterized in that: The correction module includes: a calibration camera facing at least one of the pickup heads and the plurality of chips held therein at the calibration position; and A corrector is electrically coupled to the correction camera and is used for contacting and adjusting the plurality of chips held by at least one of the suction heads to the predetermined arrangement position.

5. The chip bonding device according to claim 1, characterized in that: The number of the at least one ejector pin included in the chip ejector is further limited to a plurality, and the spacing between the plurality of ejector pins can be maintained within a predetermined range, and each of the ejector pins can operate independently.

6. The chip bonding device according to claim 1, characterized in that: The number of the at least one ejector pin included in the chip ejector is further limited to two, and the chip ejector is capable of adjusting the distance between the two ejector pins, and each ejector pin can operate independently.

7. The chip bonding device according to claim 6, characterized in that: The distance between two ejector pins can be adjusted to N times the distance between two adjacent chips held on the carrier, and N is a positive integer.

8. The chip bonding device according to claim 5, characterized in that: The number of at least one suction head included in the crystal bonder is further limited to two, and the crystal bonder is capable of adjusting the distance between the two suction heads; wherein the distance between the two suction heads located at the suction position corresponds to the distance between the two ejector pins, and the two suction heads are respectively used to receive the multiple chips pushed by the two ejector pins.

9. The chip bonding device according to claim 8, characterized in that: The distance between the two suction heads located at the die-bonding position is different from the distance between the two ejector pins.

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