Bonding pad structure for electronic device and manufacturing method thereof

Abstract

A bonding pad structure for an electronic device and a manufacturing method thereof, the electronic device comprising a substrate and a flexible circuit board. A plurality of first pins are disposed on the substrate. A plurality of second pins are disposed on the flexible circuit board. The plurality of first pins and the plurality of second pins are mutually bonded to form a plurality of bonding pins. The plurality of bonding pins include at least one central bonding pin and at least two first bonding pins. At least one central bonding pin is located at the center position of the plurality of bonding pins. At least two first bonding pins are farthest from at least one central bonding pin and are mirror symmetric with at least one central bonding pin. At least one central bonding pin includes a first end and a second end. A first width a of the first end and a second width b of the second end satisfy the relation 0 < a / b ≤ 1. One of the at least two first bonding pins and one side of the substrate include an inclination angle θ, and the inclination angle θ satisfies the relation 0 < θ ≤ 90. This case improves the problem that the pin material on the ultra-thin flexible substrate is offset during bonding due to thermal expansion and contraction.

Description

Technical Field

[0001] The present invention relates to an electronic device and a method thereof. Specifically, the present invention relates to a bonding pad structure for an electronic device and a method for manufacturing the bonding pad structure for an electronic device. Background Art

[0002] Existing display panels are developing towards ultra-thin flexible substrate technology, and the bonding area around the panel is continuously compressed to increase the screen-to-body ratio of the panel.

[0003] In addition, during the manufacturing process, the pin material will be offset during the bonding due to thermal expansion and contraction. According to the prior art CN201571253U, the conventional two mutually superimposed circuit substrates need to face the problem of increased tolerance when superimposed and aligned, and often use the anti-expansion and contraction of the hard board material itself to reduce the press misalignment; however, in the face of the development of the next generation of ultra-thin flexible substrate technology, the press thermal expansion and contraction problem of the press film substrate itself will be more serious, and the traditional superposition method can no longer effectively suppress the press misalignment; therefore, it is necessary for practitioners in this field to develop other design methods suitable for combating press misalignment. Summary of the invention

[0004] One aspect of the present case relates to a bonding pad structure for an electronic device. The bonding pad structure for an electronic device includes a substrate and a flexible circuit board. The substrate includes a plurality of first pins. The plurality of first pins are disposed on the substrate. The flexible circuit board includes a plurality of second pins. The plurality of second pins are disposed on the flexible circuit board. The plurality of first pins and the plurality of second pins are bonded to each other to form a plurality of bonding pins. The plurality of bonding pins include at least one central bonding pin and at least two first bonding pins. The at least one central bonding pin is located at the center of the plurality of bonding pins. The at least two first bonding pins are farthest away from the at least one central bonding pin and are mirror-symmetrical to the at least one central bonding pin. The at least one central bonding pin includes a first end and a second end. The first width of the first end is set to a. The second width of the second end is set to b. a and b satisfy the relationship 0

[0005] In some embodiments, the plurality of bonding pins further include at least two second bonding pins. The at least two second bonding pins are located between the at least one central bonding pin and the at least two first bonding pins and are mirror-symmetric with the at least one central bonding pin. One of the at least two second bonding pins includes a third end and a fourth end. The third width of the third end is set to c, and the fourth width of the fourth end is set to d, and c and d satisfy the relationship 0 <c / d≦1。

[0006] In some embodiments, a first width of a first end of at least one central bonding pin is the same as a third width of a third end of one of the at least two second bonding pins.​

[0007] In some embodiments, the second width of the second end of the at least one central bonding pin is the same as the fourth width of the fourth end of one of the at least two second bonding pins.

[0008] In some embodiments, a first distance is included between the first end of the at least one central bonding pin and the third end of one of the at least two second bonding pins. The first distance, the first width of the first end and the third width of the third end are all the same.

[0009] In some embodiments, a second distance is included between the second end of at least one central bonding pin and the fourth end of one of the at least two second bonding pins. The second distance, the second width of the second end and the fourth width of the fourth end are all the same. The first distance is smaller than the second distance.

[0010] In some embodiments, the plurality of bonding pins are located in a bonding area of ​​the electronic device. The relationship between the second spacing, the second width of the second end, the fourth width of the fourth end, and the length of the bonding area is as follows:

[0011] b=d=f=L / (x+y)

[0012] b is the second width of the second end, d is the fourth width of the fourth end, f is the second spacing, L is the length of the bonding area, x is the number of the plurality of bonding pins, and y is the number of intervals between the plurality of bonding pins.

[0013] In some embodiments, at least one central bonding pin comprises a trapezoid, at least two first bonding pins comprise a trapezoid, and at least two second bonding pins comprise a trapezoid.

[0014] In some embodiments, the at least one central bonding pin, the at least two first bonding pins, and the at least two second bonding pins are arranged on the same straight line.

[0015] In some embodiments, the plurality of bonding pins further include at least two third bonding pins. The at least two third bonding pins are located between the at least two first bonding pins and the at least two second bonding pins and are mirror-symmetric with the at least one central bonding pin. One of the at least two third bonding pins includes a fifth end and a sixth end. The fifth width of the fifth end is less than g, and the sixth width of the sixth end is h, and g and h satisfy the relationship 0 <g / h≦1。

[0016] In some embodiments, the third end of at least two second bonding pins and the fifth end of at least two third bonding pins comprise a third spacing. The fourth end of at least two second bonding pins and the sixth end of at least two third bonding pins comprise a fourth spacing. The third spacing is smaller than the fourth spacing.

[0017] In some embodiments, the first pitch, the third pitch, the first width, the third width and the fifth width are equal, and the second pitch, the fourth pitch, the second width, the fourth width and the sixth width are equal.

[0018] In some embodiments, the at least one central bonding pin, the at least two first bonding pins, the at least two second bonding pins and the at least two third bonding pins are arranged on the same straight line.

[0019] In some embodiments, during the pre-bonding process of the plurality of bonding pins, one of the plurality of first pins and the plurality of second pins has expansion and contraction.

[0020] Another aspect of the present invention relates to a method for manufacturing a bonding pad structure for an electronic device. The method for manufacturing a bonding pad structure for an electronic device includes the following steps: setting a plurality of first pins on a substrate; setting a plurality of second pins on a flexible circuit board; and joining a plurality of first pins and a plurality of second pins to form at least one central bonding pin at the center of a bonding area in the electronic device, and forming at least two first bonding pins that are mirror-symmetrical to the at least one central bonding pin at a position farthest from the at least one central bonding pin. The at least one central bonding pin includes a first end and a second end. The first width of the first end is set to a. The second width of the second end is set to b. a and b satisfy the relationship 0

[0021] In some embodiments, the step of bonding the plurality of first pins and the plurality of second pins comprises: bonding the plurality of first pins and the plurality of second pins in advance, wherein the plurality of second pins expand and contract during the pre-bonding process.

[0022] In some embodiments, the step of joining the plurality of first pins and the plurality of second pins further includes: adjusting the plurality of first pins and the plurality of second pins according to the expansion and contraction amount to form at least one central joining pin and at least two first joining pins.

[0023] In some embodiments, the step of joining a plurality of first pins and a plurality of second pins includes: joining a plurality of first pins and a plurality of second pins to form at least one central joining pin at the center of the joining area in the electronic device, forming at least two first joining pins that are mirror-symmetrical to the at least one central joining pin at the position farthest from the at least one central joining pin, and forming at least two second joining pins that are mirror-symmetrical to the at least one central joining pin between the at least one central joining pin and the at least two first joining pins. One of the at least one second joining pins includes a third end and a fourth end. The third width of the third end is set to c, and the fourth width of the fourth end is set to d, and c and d satisfy the relationship 0 <c / d≦1。

[0024] ​Another aspect of the present case relates to a bonding pad structure for an electronic device. The bonding pad structure for an electronic device includes a substrate and a flexible circuit board. The substrate includes a plurality of first pins. The plurality of first pins are disposed on the substrate. The flexible circuit board includes a plurality of second pins. The plurality of second pins are disposed on the flexible circuit board. The plurality of first pins and the plurality of second pins are bonded to each other to form a plurality of bonding pins. The plurality of bonding pins include at least one central bonding pin and at least two first bonding pins. The at least one central bonding pin is located at the center of the plurality of bonding pins. The at least two first bonding pins are farthest away from the at least one central bonding pin and are mirror-symmetrical to the at least one central bonding pin. The at least one central bonding pin includes a first end and a second end. The first width of the first end is set to a'. The second width of the second end is set to b'. a' and b' satisfy the relationship a' / b'≧1. At least one of the two first bonding pins includes an inclination angle with one side of the substrate. The inclination angle is set to Satisfy the relationship

[0025] In some embodiments, at least two second bonding pins are located between at least one central bonding pin and at least two first bonding pins and are mirror-symmetric with at least one central bonding pin. At least two second bonding pins include a third end and a fourth end. The third width of the third end is set to c'. The fourth width of the fourth end is set to d'. c' and d' satisfy the relationship c' / d'≧1.

[0026] In some embodiments, a first width of a first end of at least one central bonding pin is the same as a third width of a third end of one of the at least two second bonding pins.

[0027] In some embodiments, the second width of the second end of the at least one central bonding pin is the same as the fourth width of the fourth end of one of the at least two second bonding pins.

[0028] In some embodiments, a first distance is included between the first end of the at least one central bonding pin and the third end of one of the at least two second bonding pins. The first distance, the first width of the first end and the third width of the third end are all the same.

[0029] In summary, the present invention provides a bonding pad structure for an electronic device and a method for manufacturing the bonding pad structure for an electronic device, so as to improve the problem of the pin material being offset during bonding due to thermal expansion and contraction.

[0030] The above description is only used to illustrate the problem to be solved by this case, the technical means to solve the problem, and the effects produced, etc. The specific details of this case will be introduced in detail in the following implementation method and related drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] The content of this case can be better understood by referring to the embodiments in the subsequent paragraphs and the following drawings:

[0032] Figure 1A It is a schematic diagram of expected pins according to some embodiments of the present case;

[0033] Figure 1B It is a schematic diagram of actual pins according to some embodiments of the present invention;

[0034] Figure 2 A schematic diagram of pins of a substrate according to some embodiments of the present invention;

[0035] Figure 3 A schematic diagram of pins of a flexible printed circuit board according to some embodiments of the present invention;

[0036] Figure 4 is a schematic diagram of bonding pins according to some embodiments of the present invention;

[0037] Figure 5 is a schematic diagram of bonding pins according to some embodiments of the present invention;

[0038] Fig. 6A is a schematic diagram of pre-compression expansion and contraction of a joint pin according to some embodiments of the present invention;

[0039] Figure 6B is a schematic diagram of adjusting the bonding of bonding pins according to some embodiments of the present invention;

[0040] Figure 6C is a schematic diagram of pre-compression expansion and contraction of a joint pin according to some embodiments of the present invention;

[0041] Fig.6D is a schematic diagram of adjusting the bonding of bonding pins according to some embodiments of the present invention;

[0042] Fig. 6E is a schematic diagram of pre-compression expansion and contraction of a joint pin according to some embodiments of the present invention;

[0043] Fig. 6F is a schematic diagram of pre-adjusting the bonding of bonding pins according to some embodiments of the present invention;

[0044] Figure 7 A flowchart of steps of a method for manufacturing a bonding pad structure for an electronic device according to some embodiments of the present invention; and

[0045] Figure 8 FIG. 5 is a schematic diagram illustrating bonding pins according to some embodiments of the present invention.

[0046]

Explanation of symbols

[0047] 100: Electronic devices

[0048] 10: Pin

[0049] 20: Pin

[0050] 120: Substrate

[0051] 220: Flexible printed circuit board

[0052] 110: First pin

[0053] a1~a2: Width of the top

[0054] b1~b2: Width of the lower end

[0055] 210: Second pin

[0056] 310: Engage pins

[0057] Z: Width of the actual joint area

[0058] 410~410A: Central bonding pin

[0059] 420~420A: Second bonding pin

[0060] 430~430A: Third bonding pin

[0061] 440~440A: Fourth bonding pin

[0062] 450~450A: First bonding pin

[0063] a,a': first width

[0064] b,b': second width

[0065] c,c': third width

[0066] d, d': fourth width

[0067] e,e': first spacing

[0068] f,f': second spacing

[0069] g,g': fifth width

[0070] h,h': sixth width

[0071] i,i': the third spacing

[0072] j,j': the fourth spacing

[0073] θ, Tilt Angle

[0074] P1: Boundary line

[0075] P2: Boundary line

[0076] L, L': length of the joint area

[0077] L1~L2: Design length of the joint area

[0078] M1: First side

[0079] M2: Second side

[0080] o,t,o',t': upper spacing

[0081] q,u,q',u': lower spacing

[0082] r,v,r',v': upper width

[0083] s,w,s',w': bottom width

[0084] α1~α3: Expansion and contraction

[0085] β1~β3: Displacement

[0086] 700: Methods

[0087] 710~730: Steps DETAILED DESCRIPTION

[0088] The spirit of the present invention will be clearly illustrated below with the accompanying drawings and detailed descriptions. After understanding the embodiments of the present invention, any person having ordinary knowledge in the technical field can make changes and modifications based on the techniques taught by the present invention without departing from the spirit and scope of the present invention.

[0089] The terms used herein are only for describing specific embodiments and are not intended to be limiting of the present invention. Singular forms such as "a", "this", "here", "this" and "the" as used herein also include plural forms.

[0090] The words “include,” “including,” “have,” “contain,” etc. used in this document are open-ended terms, meaning including but not limited to.

[0091] The terms used herein generally have the ordinary meaning of each term used in the field, in the context of the present invention, and in the specific context, unless otherwise noted. Certain terms used to describe the present invention will be discussed below or elsewhere in this specification to provide additional guidance to those skilled in the art in describing the present invention.

[0092] In some embodiments, to make the structure of the electronic device 100 of the present invention easier to understand, please refer to Figure 1A to Figure 1B , Figure 1A FIG. 1 is a schematic diagram of expected pins according to some embodiments of the present invention. Figure 1Bis a schematic diagram of actual pins according to some embodiments of the present invention. Figure 1A to Figure 1B , the electronic device 100 includes a substrate 120 and a flexible printed circuit board 220. In some embodiments, the electronic device 100 may be a panel and a display device.

[0093] In some embodiments, see Figure 1A and Figure 1B , the substrate 120 includes a pin 10. The flexible printed circuit board 220 includes a pin 20. In the simulation, it is expected that the pin 10 and the pin 20 completely overlap. Figure 1A However, in practice, the pins 10 and 20 may expand and contract due to the expansion and contraction of the pin materials themselves. Figure 1B of misalignment.

[0094] In some embodiments, to make the bonding pad structure of the electronic device 100 of the present invention easier to understand, please refer to Figures 2 to 4 , Figure 2 FIG. 1 is a schematic diagram of pins of a substrate according to some embodiments of the present invention. Figure 3 FIG. 4 is a schematic diagram of pins of a flexible printed circuit board according to some embodiments of the present invention. Figure 4 FIG. 4 is a schematic diagram of bonding pins according to some embodiments of the present invention.

[0095] In some embodiments, see Figure 2 , Figure 2 Schematic diagram of substrate pins in the electronic device 100. The substrate 120 includes a plurality of first pins 110. The width a1 of the upper end of the first pin 110 shown in the figure has an inherent error of ±50 μm. The width b1 of the lower end of the first pin 110 shown in the figure has an inherent error of ±50 μm.

[0096] In some embodiments, see Figure 3 , Figure 3 Schematic diagram of the flexible printed circuit pins in the electronic device 100. The flexible printed circuit 220 includes a plurality of second pins 210. The width a2 of the upper end of the second pin 210 shown in the figure has a self-tolerance of ±50 μm. The width b2 of the lower end of the second pin 210 shown in the figure has a self-tolerance of ±50 μm.

[0097] In some embodiments, see Figures 2 to 4 , the plurality of first pins 110 and the plurality of second pins 210 are bonded to each other to form a plurality of bonding pins 310. In some embodiments, Z is the width of the bonding region where the plurality of first pins 110 and the plurality of second pins 210 are actually bonded.

[0098] Figure 5 Schematic diagram of bonding pins according to some embodiments of the present invention. In some embodiments, Figure 4 The multiple bonding pins 310 are actually bonded to form Figure 5 The electronic device 100 includes a first side M1 and a second side M2. Figure 5 Although the first side M1 and the second side M2 ​​are illustrated as the left side and the right side in the figure, in practice, the first side M1 and the second side M2 ​​are not limited to the left side and the right side.

[0099] In addition, the plurality of bonding pins include at least one central bonding pin 410 and at least two first bonding pins 450. The at least one central bonding pin 410 is located at the center of the plurality of bonding pins. The at least two first bonding pins 450 are farthest from the at least one central bonding pin 410 and are mirror-symmetrical with respect to the at least one central bonding pin 410. The first bonding pin 450 is closest to the first side M1 and the second side M2, and the angle between the first bonding pin 450 and one side of the substrate 120 (such as the lower side of the figure) is the tilt angle θ. When the bonding pin is closer to the center position, the tilt angle θ is closer to 90°.

[0100] In addition, the first width of the first end is set to a. The second width of the second end is set to b. a and b satisfy the relationship 0

[0101] In some embodiments, the plurality of bonding pins further include at least two second bonding pins 420, which are located between the at least one central bonding pin 410 and the at least two first bonding pins 450 and are mirror-symmetric with the at least one central bonding pin 410. The at least two second bonding pins 420 include a third end and a fourth end. The third width of the third end is set to c. The fourth width of the fourth end is set to d. c and d satisfy the relationship 0 <c / d≦1。

[0102] In addition, the at least one central bonding pin 410 includes a first end (an upper end in the figure) and a second end (a lower end in the figure). In some embodiments, the at least one central bonding pin 410 may be trapezoidal.

[0103] In addition, at least one of the two second bonding pins 420 (such as the second bonding pin 420 on the right side in the figure) includes a third end (the upper end in the figure) and a fourth end (the lower end in the figure). In some embodiments, each second bonding pin 420 in the figure can be trapezoidal.

[0104] Furthermore, at least two first bonding pins 450 closest to both sides of the first side M1 and the second side M2 ​​may be trapezoidal in shape.

[0105] In some embodiments, see Figure 5 ​, a first width a of a first end of at least one central bonding pin 410 is the same as a third width c of a third end of at least one of the two second bonding pins 420 .

[0106] In some embodiments, the second width b of the second end of the at least one central bonding pin 410 is the same as the fourth width d of the fourth end of one of the at least two second bonding pins 420 .

[0107] In some embodiments, a first distance e is included between the first end of at least one central bonding pin 410 and the third end of at least two second bonding pins 420 (such as the second bonding pin 420 on the right side in the figure). The first distance e, the first width a of the first end and the third width c of the third end are all the same.

[0108] In some embodiments, a second spacing f is included between the second end of at least one central bonding pin 410 and the fourth end of one of the at least two second bonding pins 420 (such as the second bonding pin 420 on the right side in the figure). The second spacing f, the second width b of the second end, and the fourth width d of the fourth end are all the same. The first spacing e is smaller than the second spacing f. It should be noted that since the boundary line P1 of at least one central bonding pin 410 and the boundary line P2 of one of the at least two second bonding pins 420 (such as the second bonding pin 420 on the right side in the figure) are not parallel, the spacing gradually shrinks from the second spacing f along the boundary line P1 and the boundary line P2 to the first spacing e.

[0109] In some embodiments, the plurality of bonding pins are located in the bonding area of ​​the electronic device 100. The relationship between the second spacing f, the second width b of the second end, the fourth width d of the fourth end and the length L of the bonding area is as follows:

[0110] b=d=f=L / (x+y)…Formula 1

[0111] In Formula 1, x is the number of the plurality of bonding pins, and y is the number of intervals between the plurality of bonding pins. For example, the intervals may be Figure 4 The spacing f between the bonding pin 410 and the bonding 2 pin 420 is .

[0112] Next, the relationship between the first spacing e, the first width a of the first end, the third width c of the third end, and the design length L1 of the bonding area is as follows:

[0113] a=c=e=L1 / (x+y)…Formula 2

[0114] In Formula 2, L1 is the design length of the bonding area that makes the bonding pin present an "eight" shape. The relationship between L and L1 satisfies 0 <L1 / L≦1。

[0115] In some embodiments, see Figure 4, at least one central bonding pin 410 is an isosceles trapezoid. It should be noted that when the number of bonding pins on both sides of at least one central pin 410 increases, the shapes of the bonding pins on both sides approach a parallelogram.

[0116] In some embodiments, at least one central bonding pin 410 , at least two second bonding pins 420 , and at least two first bonding pins 450 are arranged on the same straight line.

[0117] In some embodiments, the plurality of bonding pins further include at least two third bonding pins 430. The at least two third bonding pins 430 are located between the at least two second bonding pins 420 and the at least two first bonding pins 450 and are mirror-symmetrical with respect to the at least one central bonding pin 410. One of the at least two third bonding pins 430 (the third bonding pin 430 on the right side in the figure) includes a fifth end (the upper end in the figure) and a sixth end (the lower end in the figure). The fifth width of the fifth end is set to g. The sixth width of the sixth end is set to h. g and h satisfy the relationship 0 <g / h≦1。

[0118] In some embodiments, see Figure 4 , a first end of at least one of the two second bonding pins 420 (such as the second bonding pin 420 on the right side in the figure) and a third end of at least one of the two third bonding pins 430 (such as the third bonding pin 430 on the right side in the figure) include a third interval i.

[0119] In addition, the second end of one of the at least two second bonding pins 420 and the fourth end of one of the at least two third bonding pins 430 include a fourth interval j. The third interval i is smaller than the fourth interval j. It should be noted that the at least two second bonding pins 420 may be trapezoidal, and the at least two third bonding pins 430 may be trapezoidal.

[0120] In some embodiments, the first spacing e, the third spacing i, the first width a of the first end, the third width c of the third end, and the fifth width g of the fifth end are equal. The second spacing f, the fourth spacing j, the second width b of the second end, the fourth width d of the fourth end, and the sixth width h of the sixth end are equal.

[0121] In some embodiments, at least one central bonding pin 410 , at least two second bonding pins 420 , at least two third bonding pins 430 , and at least two first bonding pins 450 are arranged on the same straight line.

[0122] In some embodiments, see Figure 5 According to the above-mentioned embodiment, the fourth bonding pin 440, the third bonding pin 430 and the first bonding pin 450 respectively include an upper spacing o and an upper spacing t. The fourth bonding pin 440 includes an upper width r and a lower width s.

[0123] In some embodiments, the fourth bonding pin 440, the third bonding pin 430 and the first bonding pin 450 respectively include a lower pitch q and a lower pitch u. The first bonding pin 450 includes an upper width v and a lower width w.

[0124] In some embodiments, the first spacing e, the third spacing i, the first width a of the first end, the third width c of the third end, the fifth width g of the fifth end, the upper end width r, the upper end width v, the upper spacing o and the upper spacing t are equal.

[0125] In addition, the second spacing f, the fourth spacing j, the second width b of the second end, the fourth width d of the fourth end, the sixth width h of the sixth end, the lower end width s, the lower end width w, the lower spacing q and the lower spacing u are equal.

[0126] In some embodiments, in order to make it easier to understand the differences in the bonding pins of the present invention due to the expansion and contraction of the materials and the adjustment of the bonding, please refer to 6A to 6F and Figure 7 . 6A to 6F It is a schematic diagram of pre-compression expansion and contraction of bonding pins and adjustment of bonding according to some embodiments of the present case. Figure 7 FIG. 7 is a flowchart of a method for manufacturing a bonding pad structure for an electronic device according to some embodiments of the present invention. In some embodiments, the method 700 for manufacturing a bonding pad structure for an electronic device is used to Figure 2 The substrate 120 and Figure 3 The flexible printed circuit boards 220 are bonded together to form a Figure 4 A plurality of bonding pins 310 are shown.

[0127] In step 710, a plurality of first pins are disposed on a substrate.

[0128] For example, see Figure 2 , a plurality of first pins 110 are disposed on the substrate 120 .

[0129] In step 720, a plurality of second pins are disposed on the flexible printed circuit board.

[0130] For example, see Figure 3 , a plurality of second pins 210 are disposed on the flexible printed circuit 220 .

[0131] In step 730, a plurality of first pins and a plurality of second pins are bonded to form at least one central bonding pin at the center of the bonding area in the electronic device, and at least two first bonding pins that are mirror-symmetric to the at least one central bonding pin are formed at the position farthest from the at least one central bonding pin. The at least one central bonding pin includes a first end and a second end. The first width of the first end is set to a. The second width of the second end is set to b. a and b satisfy the relationship 0

[0132] For example, see Figures 2 to 7 , multiple first pins 110 and multiple second pins 220 are joined to form at least one central joining pin 410 at the center of the joining area in the electronic device 100, and at least two first joining pins 450 that are mirror-symmetrical to the at least one central joining pin 410 are formed at the farthest point from the at least one central joining pin 410. The at least one central joining pin 410 includes a first end (upper end in the figure) and a second end (lower end in the figure). The first width of the first end is set to a. The second width of the second end is set to b. a and b satisfy the relationship 0

[0133] In some embodiments, the step 730 includes the following operations: pre-bonding a plurality of first pins and a plurality of second pins. The plurality of second pins expand and contract during the pre-bonding process.

[0134] For example, see Fig. 6A , Figure 6C and Fig. 6E The first pins and the second pins are respectively produced in the pre-bonding process as follows Fig. 6A The expansion and contraction amount α1 or Figure 6C Medium expansion α2 or Fig. 6E Medium expansion and contraction amount α3.

[0135] In some embodiments, the step 730 further includes the following operation: adjusting the plurality of first pins and the plurality of second pins according to the expansion and contraction amount to form at least one central bonding pin and at least two first bonding pins.

[0136] For example, see 6A to 6F , use the Y direction adjustment translation technique, according to Fig. 6A The expansion and contraction amount α1 can be adjusted in the Y direction as follows Figure 6B The displacement β1 in Figure 6C The expansion and contraction amount α2 can be adjusted by adjusting the Y direction as follows Fig.6D The displacement β2 in Fig. 6E ​​The expansion and contraction amount α3 is adjusted by adjusting the Y direction as follows Fig. 6F The displacement β3 in .

[0137] In some embodiments, the expansion amount α1 is 0.5‰ and the displacement β1 is adjusted to 17μm. In some other embodiments, the expansion amount α2 is 1‰ and the displacement β2 is adjusted to 35μm. In other embodiments, the expansion amount α3 is 2‰ and the displacement β3 is adjusted to 70μm. The above is a specific practice of the Y-axis translation adjustment technique.

[0138] In some embodiments, the above step 730 includes the following operations: joining a plurality of first pins and a plurality of second pins to form at least one central joining pin at the center of the joining area in the electronic device, forming at least two first joining pins that are mirror-symmetrical to the at least one central joining pin at the farthest distance from the at least one central joining pin, and forming at least two second joining pins that are mirror-symmetrical to the at least one central joining pin between the at least one central joining pin and the at least two first joining pins. One of the at least two second joining pins includes a third end and a fourth end. The third width of the third end is set to c, and the fourth width of the fourth end is set to d, and c and d satisfy the relationship 0 <c / d≦1。

[0139] For example, see Figures 2 to 7 , multiple first pins 110 and multiple second pins 210 are joined to form at least one central joining pin 410 at the center of the joining area in the electronic device 100, at least two first joining pins 450 that are mirror-symmetrical to the pins of at least one central joining pin 410 are formed at the position farthest from the at least one central joining pin 410, and at least two second joining pins 420 that are mirror-symmetrical to the at least one central joining pin 410 are formed between the at least one central joining pin 410 and the at least two first joining pins 450. One of the at least one second joining pin 420 includes a third end (the upper end in the figure) and a fourth end (the lower end in the figure). The third width of the third end is set to c, and the fourth width of the fourth end is set to d, and c and d satisfy the relationship 0 <c / d≦1。

[0140] In some embodiments, see Figure 4 and Figure 5 When the actual width Z of the bonding area and the length L of the bonding area remain unchanged, it can be known from the above-mentioned embodiment that the relationship between the spacing and the width of the bonding pins is such that the design length L1 of the bonding area and the above-mentioned inclination angle θ are changed as follows:

[0141]

[0142] Table 1

[0143] It can be seen from Table 1 that the optimal inclination angle of the joint pin is 80°, and the actual overlap area is increased by 29%.

[0144] Figure 8 FIG. 5 is a schematic diagram illustrating bonding pins according to some embodiments of the present invention. Figure 8 To illustrate Figure 5 In some embodiments, the bonding pins of the variant embodiments are: Figure 5 The embodiment is a trapezoidal joint pin design with a smaller upper base and a larger lower base. Figure 8 The embodiment is a trapezoidal bonding pin design with a larger upper base and a smaller lower base. Figure 8 The plurality of bonding pins include a bonding area length L' and a design length L2 of the bonding area.

[0145] In addition, the plurality of bonding pins include at least one central bonding pin 410A and at least two first bonding pins 450A. The at least one central bonding pin 410A is located at the center of the plurality of bonding pins. The at least two first bonding pins 450A are farthest from the at least one central bonding pin 410A and are mirror-symmetrical with respect to the at least one central bonding pin 410A. The first bonding pin 450A is closest to the first side M1 and the second side M2, and the angle between the first bonding pin 450A and one side of the substrate 120 (such as the upper side in the figure) is an inclination angle As the mating pins get closer to the center, the tilt angle The closer to 90°.

[0146] In addition, the first width of the first end is set to a'. The second width of the second end is set to b'. a' and b' satisfy the relationship a' / b'≧1. At least one of the two first bonding pins 450A and one side of the substrate 120 (such as the upper side in the figure) include an inclination angle The relationship 0<φ≦90 is satisfied.

[0147] In some embodiments, the plurality of bonding pins further include at least two second bonding pins 420A, which are located between the at least one central bonding pin 410A and the at least two first bonding pins 450A and are mirror-symmetric with the at least one central bonding pin 410A. The at least two second bonding pins 420A include a third end and a fourth end. The third width of the third end is set to c'. The fourth width of the fourth end is set to d'. 'c' and d' satisfy the relationship c' / d'≧1.

[0148] In some embodiments, according to the aforementioned embodiments, each bonding pin (such as the central bonding pin 410A, the second bonding pin 420A, the third bonding pin 430A, the fourth bonding pin 440A and the first bonding pin 450A from the center to the first side M1 in the figure) has its own upper base (such as the upper end of the figure) width and lower base (such as the lower end of the figure) width. Adjacent bonding pins have an upper spacing and a lower spacing respectively.

[0149] In addition, from the central bonding pin 410A to the first side M1, there are respectively the first width a' of the first end, the first spacing e', the third width c' of the third end, the third spacing i', the fifth width g' of the fifth end, the upper spacing o', the upper width r', the upper spacing t' and the upper width v'. The upper base width and the upper spacing of the aforementioned bonding pins are equal.

[0150] Furthermore, from the central bonding pin 410A to the first side M1, the second width b' of the second end, the second spacing f', the fourth width d' of the fourth end, the fourth spacing j', the sixth width h' of the sixth end, the lower spacing q', the lower width s', the lower spacing u' and the lower width w' of the sixth end are respectively shown. The lower width and the lower spacing of the aforementioned bonding pins are equal.

[0151] In some embodiments, the length L' of the joint region may be the same as or different from the length L of the joint region. In some embodiments, the designed length L1 of the joint region may be the same as or different from the designed length L2 of the joint region.

[0152] According to the aforementioned embodiments, the present invention provides a bonding pad structure for an electronic device and a method for manufacturing the bonding pad structure for an electronic device, so as to improve the problem of the pin material on the ultra-thin flexible substrate being offset during bonding due to thermal expansion and contraction.

[0153] Although the present invention is disclosed in detail with reference to the embodiments above, the present invention does not exclude other feasible implementations. Therefore, the protection scope of the present invention shall be subject to the scope defined in the appended claims, rather than being limited by the aforementioned embodiments.

[0154] For those skilled in the art, various changes and modifications can be made to the present invention without departing from the spirit and scope of the present invention. Based on the above embodiments, all changes and modifications made to the present invention are also included in the protection scope of the present invention.

Claims

1. A bonding pad structure for an electronic device, characterized in that: Include: A substrate comprising: A plurality of first pins are disposed on the substrate; and A flexible printed circuit board, comprising: A plurality of second pins are disposed on the flexible printed circuit board; The plurality of first pins and the plurality of second pins are joined together to form a plurality of joining pins, and the plurality of joining pins include: at least one central bonding pin located at a center of the plurality of bonding pins; At least two first bonding pins are farthest from the at least one central bonding pin and are mirror-symmetrical with the at least one central bonding pin; and At least two second bonding pins include a third end; The at least one central bonding pin comprises: A first end and a second end, a first width of the first end is set to a, a second width of the second end is set to b, a and b satisfy the relationship 0, wherein one of the at least two first bonding pins comprises an inclination angle with one side of the substrate, the inclination angle is set to θ, θ satisfies the relationship 0<θ<90, wherein a first spacing is comprised between the first end of the at least one central bonding pin and the third end of one of the at least two second bonding pins, the first spacing, the first width of the first end and a third width of the third end are all the same, wherein each of the plurality of bonding pins comprises an upper end and a lower end, the upper ends of each of the plurality of bonding pins comprise an upper spacing, the lower ends of each of the plurality of bonding pins comprise a lower spacing, each of the plurality of upper spacings, the width of each of the plurality of upper ends, the first width, the third width and the first spacing are all the same, and each of the plurality of lower spacings and the width of each of the plurality of lower ends and the second width are all the same. The plurality of bonding pins further include:

2. The bonding pad structure according to claim 1, characterized in that: The at least two second bonding pins are located between the at least one central bonding pin and the at least two first bonding pins and are mirror-symmetrical with the at least one central bonding pin; The at least two second bonding pins include: a fourth end, the third width of the third end is set to c, the fourth width of the fourth end is set to d, and c and d satisfy the relationship 0 <c / d≦1。 The first width of the first end of the at least one central bonding pin is the same as the third width of the third end of one of the at least two second bonding pins.

3. The bonding pad structure according to claim 2, characterized in that: The second width of the second end of the at least one central bonding pin is the same as the fourth width of the fourth end of one of the at least two second bonding pins.

4. The bonding pad structure according to claim 3, characterized in that: A second spacing is included between the second end of the at least one central joining pin and the fourth end of one of the at least two second joining pins, the second spacing, the second width of the second end and the fourth width of the fourth end are all the same, wherein the first spacing is smaller than the second spacing.

5. The bonding pad structure according to claim 4, characterized in that: The plurality of bonding pins are located in a bonding area of ​​the electronic device, wherein the second spacing, the second width of the second end, the fourth width of the fourth end, and the length of the bonding area are related as follows:

6. The bonding pad structure according to claim 5, characterized in that: b=d=f=L / (x+y) ​ Wherein b is the second width of the second end, d is the fourth width of the fourth end, f is the second spacing, L is the length of the bonding area, x is the number of the plurality of bonding pins, and y is the number of intervals between the plurality of bonding pins.

7. The bonding pad structure according to any one of claims 1 to 6, characterized in that: The at least one central bonding pin comprises a trapezoid, wherein the at least two first bonding pins comprise a trapezoid, wherein the at least two second bonding pins comprise a trapezoid.

8. The bonding pad structure according to any one of claims 1 to 6, characterized in that: The at least one central bonding pin, the at least two first bonding pins and the at least two second bonding pins are arranged on the same straight line.

9. The bonding pad structure according to claim 5, characterized in that: The plurality of bonding pins further include: At least two third bonding pins are located between the at least two first bonding pins and the at least two second bonding pins and are mirror-symmetrical with the at least one central bonding pin. Wherein one of the at least two third bonding pins comprises: a fifth end and a sixth end, a fifth width of the fifth end is set to g, a sixth width of the sixth end is set to h, g and h satisfy the relation 0 <g / h≦1。 10. The bonding pad structure according to claim 9, characterized in that: The third end of one of the at least two second bonding pins and the fifth end of one of the at least two third bonding pins include a third spacing, wherein the fourth end of one of the at least two second bonding pins and the sixth end of one of the at least two third bonding pins include a fourth spacing, wherein the third spacing is smaller than the fourth spacing.

11. The bonding pad structure according to claim 10, characterized in that: The first spacing, the third spacing, the first width, the third width and the fifth width are equal, and the second spacing, the fourth spacing, the second width, the fourth width and the sixth width are equal.

12. The bonding pad structure according to any one of claims 9 to 11, characterized in that: The at least one central bonding pin, the at least two first bonding pins, the at least two second bonding pins and the at least two third bonding pins are arranged on the same straight line.

13. The bonding pad structure according to claim 4, characterized in that During a pre-bonding process of the bonding pins, one of the first pins and the second pins has an expansion and contraction amount.

14. A method for manufacturing a bonding pad structure for an electronic device, characterized in that: Include: Disposing a plurality of first pins on a substrate; Disposing a plurality of second pins on a flexible printed circuit; and The plurality of first pins and the plurality of second pins are joined to form at least one central joining pin at the center of a joining area in an electronic device, and at least two first joining pins that are mirror-symmetrical to the at least one central joining pin are formed at a position farthest from the at least one central joining pin, and at least two second joining pins that are mirror-symmetrical to the at least one central joining pin are formed, wherein one of the at least two second joining pins includes a third end, wherein the at least one central joining pin includes a first end and a second end, a first width of the first end is set to a, a second width of the second end is set to b, and a and b satisfy the relationship 0. The step of joining the plurality of first pins and the plurality of second pins includes:

15. The method for manufacturing a bonding pad structure for an electronic device according to claim 14, wherein: The first pins and the second pins are pre-bonded, wherein the second pins generate an expansion and contraction amount during the pre-bonding process. The step of bonding the plurality of first pins and the plurality of second pins further comprises:

16. The method for manufacturing a bonding pad structure for an electronic device according to claim 15, wherein: The plurality of first pins and the plurality of second pins are adjusted according to the expansion and contraction amount to form at least one central connecting pin and the at least two first connecting pins. The step of bonding the plurality of first pins and the plurality of second pins comprises:

17. The method for manufacturing a bonding pad structure for an electronic device according to claim 14, wherein: The plurality of first pins and the plurality of second pins are joined to form the at least one central joining pin at the center of the joining area in the electronic device, the at least two first joining pins which are mirror-symmetrical to the at least one central joining pin are formed at the position farthest from the at least one central joining pin, and at least two second joining pins which are mirror-symmetrical to the at least one central joining pin are formed between the at least one central joining pin and the at least two first joining pins, wherein one of the at least two second joining pins includes a fourth end, the third width of the third end is set to c, the fourth width of the fourth end is set to d, and c and d satisfy the relationship 0 <c / d≦1。 Include:

18. A bonding pad structure for an electronic device, characterized in that: A substrate comprising: A plurality of first pins are disposed on the substrate; and A flexible printed circuit board, comprising: A plurality of second pins are disposed on the flexible printed circuit board; The plurality of first pins and the plurality of second pins are joined together to form a plurality of joining pins, and the plurality of joining pins include: at least one central bonding pin located at a center of the plurality of bonding pins; ​ At least two first bonding pins are farthest from the at least one central bonding pin and are mirror-symmetrical with the at least one central bonding pin; and At least two second bonding pins include a third end; The at least one central bonding pin comprises: a first end and a second end, a first width of the first end is set to a', a second width of the second end is set to b', and a' and b' satisfy the relationship a' / b'>1; One of the at least two first bonding pins and one side of the substrate include an inclination angle, and the inclination angle is set to φ, φ satisfies the relationship 0<φ<90, wherein a first spacing is included between the first end of the at least one central bonding pin and the third end of one of the at least two second bonding pins, and the first spacing, the first width of the first end and a third width of the third end are all the same, wherein each of the multiple bonding pins includes an upper end and a lower end, the upper ends of each of the multiple bonding pins include an upper spacing, and the lower ends of each of the multiple bonding pins include a lower spacing, each of the multiple upper spacings, the width of each of the multiple upper ends, the first width, the third width and the first spacing are all the same, and each of the multiple lower spacings and the width of each of the multiple lower ends and the second width are all the same.

19. The bonding pad structure according to claim 18, characterized in that The plurality of bonding pins further include: The at least two second bonding pins are located between the at least one central bonding pin and the at least two first bonding pins and are mirror-symmetrical with the at least one central bonding pin; The at least two second bonding pins include: a fourth end, the third width of the third end is set to c', the fourth width of the fourth end is set to d', and c' and d' satisfy the relationship c' / d'≧1.

20. The bonding pad structure according to claim 19, wherein: The first width of the first end of the at least one central bonding pin is the same as the third width of the third end of one of the at least two second bonding pins.

21. The bonding pad structure according to claim 20, characterized in that The second width of the second end of the at least one central bonding pin is the same as the fourth width of the fourth end of one of the at least two second bonding pins.

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