Temperature Testing Device for Vacuum Gas Phase Soldering Furnace

Abstract

The present invention relates to the technical field of vacuum vapor soldering, and discloses a temperature testing device for a vacuum vapor soldering furnace, comprising: a first housing fixed to the side wall of the vacuum vapor soldering furnace, a first heat insulation cavity being formed inside the first housing, and a temperature sensor and a vacuum sensor being provided on the first housing; a second housing detachably arranged in the first heat insulation cavity, a second heat insulation cavity being provided inside the second housing, and a vacuum sensor also being provided in the second heat insulation cavity; a circuit board arranged in the second heat insulation cavity, a transmission module being provided on the circuit board, and the transmission module being electrically connected to the temperature sensor and the vacuum sensor; a plug socket arranged on one side of the first housing, and a plug connecting the circuit board being arranged inside the plug socket. Through good heat insulation design, the device of the present application has both vacuum detection and temperature detection functions, has a high integration degree, a compact overall structure, occupies a small space, and saves the cost of the device.

Description

Technical Field

[0001] The present invention relates to the technical field of vacuum vapor soldering, and particularly to a temperature testing device for a vacuum vapor soldering furnace. Background Art

[0002] At present, when a vacuum vapor soldering furnace works, a vacuum environment and a stable temperature need to be ensured inside. Generally, a temperature measuring device and a vacuum measuring device need to be arranged inside the vacuum vapor soldering furnace. Traditional temperature testing devices and vacuum measuring devices only have measuring functions. And due to the overall high temperature of the device, traditional temperature testing devices or vacuum measuring devices generally can only be provided with simple transmission lines, and it is difficult to integrate more functions on one device. Therefore, multiple modules need to be arranged on the vacuum vapor soldering furnace, occupying a relatively large space and increasing the cost of the device. Summary of the Invention

[0003] The purpose of the present invention is to provide a temperature testing device for a vacuum vapor soldering furnace. Through good heat insulation design, the device simultaneously has vacuum detection and temperature detection functions, with a high integration degree, a compact overall structure, a small occupied space, and cost savings for the device.

[0004] To achieve the above purpose, the present invention provides a temperature testing device for a vacuum vapor soldering furnace, including:

[0005] A first housing, which is fixed on the side wall of the vacuum vapor soldering furnace. A first heat insulation cavity is formed inside the first housing. A first opening is provided on one side of the first heat insulation cavity. A temperature sensor and a vacuum sensor are arranged on the first housing.

[0006] A second housing, which is detachably arranged in the first heat insulation cavity. A second heat insulation cavity is provided inside the second housing, and the vacuum sensor is also arranged in the second heat insulation cavity.

[0007] A circuit board, which is arranged in the second heat insulation cavity. A transmission module is arranged on the circuit board, and the transmission module is electrically connected to the temperature sensor and the vacuum sensor.

[0008] A plug socket, which is arranged on one side of the first opening of the first housing to close the first heat insulation cavity. A plug connecting the circuit board is arranged inside the plug socket.

[0009] Compared with the prior art, the temperature testing device of the vacuum gas-phase soldering furnace in the embodiment of the present invention has the following beneficial effects: The temperature sensor can detect the temperature in the vacuum gas-phase soldering furnace, and the vacuum sensors in the first housing and the second heat insulation cavity can respectively detect the vacuum degrees in the vacuum gas-phase soldering furnace and at the circuit board, so as to ensure the stability of the vacuum degree and temperature in the vacuum gas-phase soldering furnace. The two-layer heat insulation design of the first housing and the second housing isolates the circuit board in the second heat insulation cavity from the high temperature in the vacuum gas-phase soldering furnace, enabling the circuit board to integrate more components, which are used to connect the temperature sensor and the vacuum sensor on the first housing. The plug socket is used for power supply and data transmission on the circuit board. Through the good heat insulation design of the present application, the device has both vacuum detection and temperature detection functions, with a high integration degree, a compact overall structure, a small occupied space, and cost savings for the device.

[0010] In the temperature testing device of the vacuum gas-phase soldering furnace in the embodiment of the present invention, a second opening is provided on one side of the second housing facing the first opening, and a connecting block for closing the second heat insulation cavity is detachably provided at the second opening.

[0011] In the temperature testing device of the vacuum gas-phase soldering furnace in the embodiment of the present invention, one end of the connecting block away from the second housing abuts against the plug socket, and a connecting line is provided inside the connecting block, and the connecting line is electrically connected to the circuit board and the plug.

[0012] In the temperature testing device of the vacuum gas-phase soldering furnace in the embodiment of the present invention, positioning posts are provided on one side end face of the connecting block facing the plug socket, and slots corresponding to the positions of the positioning posts are provided on one side end face of the plug socket facing the connecting block, and the sizes of the positioning posts and the slots are matched.

[0013] In the temperature testing device of the vacuum gas-phase soldering furnace in the embodiment of the present invention, a first sealing gasket is provided between the connecting block and the second housing.

[0014] In the temperature testing device of the vacuum gas-phase soldering furnace in the embodiment of the present invention, the first heat insulation cavity is provided in a stepped shape, and the shape of the first heat insulation cavity is matched with the shapes of the second housing and the connecting block.

[0015] In the temperature testing device of the vacuum gas-phase soldering furnace in the embodiment of the present invention, a second sealing gasket is provided between the plug socket and the first housing, and the second sealing gasket is fixed to the first housing by screws.

[0016] In the temperature testing device of the vacuum gas-phase soldering furnace in the embodiment of the present invention, clamping blocks are rotatably provided on both sides of the first housing at the first opening, fixing pieces are provided at the ends of the clamping blocks, and clamping grooves matching the sizes of the clamping blocks are correspondingly provided on both sides of the plug socket.

[0017] The temperature testing device of the vacuum gas-phase soldering furnace according to the embodiment of the present invention, the plug socket includes a plug socket housing and a plug socket bottom plate, a first plug for connecting an external remote controller is arranged on the plug socket housing, and a second plug for connecting the remaining components is arranged on the plug socket bottom plate.

[0018] The temperature testing device of the vacuum gas-phase soldering furnace according to the embodiment of the present invention, a wireless communication module is further arranged in the plug socket, and the wireless communication module is electrically connected to the circuit board.

[0019] Additional aspects and advantages of the present invention will be given in part in the following description, become apparent in part from the following description, or be learned through the practice of the present invention. Description of the Drawings

[0020] Figure 1 is an exploded view of a temperature testing device of a vacuum gas-phase soldering furnace according to an embodiment of the present invention;

[0021] Figure 2 is an exploded view at the second housing of a temperature testing device of a vacuum gas-phase soldering furnace according to an embodiment of the present invention;

[0022] Figure 3 is an exploded view of a plug socket of a temperature testing device of a vacuum gas-phase soldering furnace according to an embodiment of the present invention.

[0023] In the figure, 1, the first housing; 11, the first opening; 12, the second sealing gasket; 13, the clamping block; 14, the fixing piece; 2, the second housing; 21, the second opening; 22, the connecting block; 23, the positioning post; 24, the first sealing gasket; 3, the circuit board; 4, the plug socket; 41, the slot; 42, the fixing block; 43, the plug socket housing; 44, the plug socket bottom plate; 45, the first plug; 46, the second plug; 47, the wireless communication module; 48, the wifi booster; 5, the remote controller; 6, the remote control plug. Detailed Embodiments

[0024] The embodiments of the present invention will be described in detail below. The examples of the embodiments are shown in the drawings, where the same or similar reference numerals denote the same or similar elements or elements with the same or similar functions from beginning to end. The embodiments described below by referring to the drawings are exemplary and are only used to explain the present invention, and should not be construed as a limitation to the present invention.

[0025] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by terms such as up, down, front, back, left, right, etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present invention.

[0026] In the description of the present invention, "several" means one or more, "multiple" means more than two, and understandings such as "greater than", "less than", "exceeding", etc. do not include the present number, while understandings such as "above", "below", "within", etc. include the present number. If there is a description of "first" and "second", it is only for the purpose of distinguishing technical features and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features or implicitly indicating the sequence relationship of the indicated technical features.

[0027] In the description of the present invention, unless otherwise clearly defined, words such as "set", "installed", "connected", etc. should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above words in the present invention in combination with the specific content of the technical solution.

[0028] As Figure 1 shown, a temperature testing device for a vacuum vapor soldering furnace according to a preferred embodiment of the present invention includes a first housing 1, and the first housing 1 is made of a heat-insulating material. The first housing 1 is fixed on the side wall of the vacuum vapor soldering furnace, one end of which extends into the vacuum vapor soldering furnace, and the other end communicates with the outside of the vacuum vapor soldering furnace. A first heat-insulating cavity is formed inside the first housing 1, and a first opening 11 is provided on one side of the first heat-insulating cavity. The objects in the first heat-insulating cavity enter and exit through the first opening 11, and the first opening 11 is set to be strip-shaped. A temperature sensor and a vacuum sensor are provided on the first housing 1, and the temperature sensor and the vacuum sensor are arranged on the outer edge of the first housing 1 to facilitate accurately measuring the temperature and vacuum degree in the vacuum vapor soldering furnace.

[0029] As Figure 1 shown, a temperature testing device for a vacuum vapor soldering furnace according to a preferred embodiment of the present invention further includes a second housing 2, and the second housing 2 is also made of a heat-insulating material. The second housing 2 is detachably arranged in the first heat-insulating cavity, and the shape of the second heat-insulating cavity matches that of the second housing 2. The inner wall of the heat-insulating cavity abuts against the outside of the second housing 2, which can stably fix the second housing 2 in the first heat-insulating cavity. The second housing 2 enters and exits the first heat-insulating cavity through the first opening 11 to replace or repair the components in the second housing 2. A second heat-insulating cavity is formed inside the second housing 2, and electronic components are arranged in the second heat-insulating cavity. The electronic components are double-insulated by the first housing 1 and the second housing 2, which can reduce the influence of the high temperature of the vacuum vapor soldering furnace. A vacuum sensor is also arranged in the second heat-insulating cavity to detect the vacuum degree at the position of the electronic components and prevent the vacuum degree in the second heat-insulating cavity from affecting the vacuum degree in the vacuum vapor soldering furnace.

[0030] As Figure 1 and Figure 2As shown in the figure, a temperature testing device for a vacuum vapor soldering furnace according to a preferred embodiment of the present invention further includes a circuit board 3, which is horizontally arranged in the second heat insulation cavity. The second heat insulation cavity is arranged in a cuboid shape to accommodate the circuit board 3. A transmission module is arranged on the circuit board 3. The transmission module is electrically connected to a temperature sensor and a vacuum sensor. The vacuum sensor and the temperature sensor transmit the measured information to the transmission module, and the information is integrated on the circuit board 3 and then sent to the outside through the circuit board 3. The temperature sensor can detect the temperature in the vacuum vapor soldering furnace, and the vacuum sensors in the first housing 1 and the second heat insulation cavity can respectively detect the vacuum degree in the vacuum vapor soldering furnace and at the circuit board 3 to ensure the stability of the vacuum degree and temperature in the vacuum vapor soldering furnace. The two-layer heat insulation design of the first housing 1 and the second housing 2 isolates the circuit board 3 in the second heat insulation cavity from the high temperature in the vacuum vapor soldering furnace, enabling the circuit board 3 to integrate more components to connect the temperature sensor and the vacuum sensor on the first housing 1. The plug socket is used for power supply and data transmission on the circuit board 3.

[0031] As Figure 1 shown in the figure, a temperature testing device for a vacuum vapor soldering furnace according to a preferred embodiment of the present invention further includes a plug socket 4. The plug socket 4 is located outside the vacuum vapor soldering furnace, and is specifically arranged outside the first opening 11 of the first housing 1 to seal the first heat insulation cavity, so that a sealed environment is formed inside the first heat insulation cavity and does not communicate with the external air during operation to prevent affecting the vacuum degree inside the vacuum vapor soldering furnace. A plug for connecting the circuit board 3 is arranged inside the plug socket 4, and the plug is used to connect an external power supply or other control components. An indicator light is also arranged on the plug to display the working state of the plug socket 4 and the circuit board 3.

[0032] As Figure 2 shown in the figure, in some embodiments of the present invention, a second opening 21 is arranged on one side of the second housing 2 facing the first opening 11. The second opening 21 is arranged in a long and narrow strip shape. The circuit board 3 is assembled into the second heat insulation cavity through the second opening 21. A connecting block 22 for sealing the second heat insulation cavity is detachably arranged at the second opening 21. The connecting block 22 is used to seal the second heat insulation cavity, so that a sealed environment is formed inside the second heat insulation cavity and does not communicate with the external air during operation to prevent affecting the vacuum degree inside the vacuum vapor soldering furnace.

[0033] As Figure 1 and 2As shown, in some embodiments of the present invention, the connection block 22 is located between the second housing 2 and the plug socket 4. One end of the connection block 22 away from the second housing 2 abuts against the plug socket 4. A connection line is provided inside the connection block 22, and the connection line is electrically connected to the circuit board 3 and the plug, so that the data collected by the circuit board 3 can be transmitted to the plug socket 4 through the connection line, and then transmitted to the host or server through wired or wireless transmission on the plug socket 4. Specifically, a cavity is formed inside the connection block 22, and the connection line is located in the cavity. The cavity can accommodate connection lines of different specifications and quantities, making the connection method of the circuit board 3 more flexible.

[0034] As Figure 1 and Figure 3 shown, in some embodiments of the present invention, positioning posts 23 are provided on one end face of the connection block 22 facing the plug socket 4, and the positioning posts 23 are provided at the four corners of the end face of the plug socket 4. On one end face of the plug socket 4 facing the connection block 22, slots 41 corresponding to the positions of the positioning posts 23 are provided, and the slots 41 are also located at the four corners of the end face of the plug socket 4. The sizes of the positioning posts 23 and the slots 41 are matched. When the connection block 22 abuts against the plug socket 4, the positioning posts 23 are inserted into the slots 41, so that the connection block 22 and the plug socket 4 are limited in the vertical direction, which is beneficial to the stable connection of the connection line and beneficial to the firm fixation of the connection block 22 and the plug socket 4.

[0035] As Figure 2 shown, in some embodiments of the present invention, a first sealing gasket 24 is provided between the connection block 22 and the second housing 2. The setting of the first sealing gasket 24 further strengthens the sealing degree of the second heat insulation cavity, prevents the second heat insulation cavity from leaking during operation, affects the airtightness of the first heat insulation cavity and the vacuum gas phase soldering furnace, and further ensures the vacuum degree of the vacuum gas phase soldering furnace.

[0036] In some embodiments of the present invention, the first heat insulation cavity is provided in a stepped shape. The height of the first heat insulation cavity at the end away from the first opening 11 is less than the height at the end close to the first opening 11, and the height of the second housing 2 is also less than the height of the second housing 2. Therefore, the shape of the first heat insulation cavity matches the shapes of the second housing 2 and the connection block 22, so that the first heat insulation cavity can relatively stably fix the second housing 2 and the connection block 22, and the second housing 2 and the connection block 22 will not slide in the first heat insulation cavity during operation, affecting data collection and transmission.

[0037] As Figure 1As shown, in some embodiments of the present invention, a second sealing gasket 12 is provided between the plug socket 4 and the first housing 1. The provision of the second sealing gasket 12 further enhances the sealing degree of the first heat insulation chamber, preventing leakage in the first heat insulation chamber during operation, which may affect the airtightness of the second heat insulation chamber and the vacuum gas phase soldering furnace, and further ensuring the vacuum degree of the vacuum gas phase soldering furnace. Specifically, the second sealing gasket 12 is fixed to the first housing 1 by screws, with reliable fixation and easy replacement.

[0038] As Figure 1 shown, in some embodiments of the present invention, vertical rotating shafts are fixed on both sides of the first opening 11 of the first housing 1. A clamping block 13 is rotatably connected to the rotating shafts. The clamping block 13 can rotate horizontally with the rotating shafts as the center. A fixing piece 14 is provided at the end of the clamping block 13; two symmetrically arranged fixing blocks 42 are provided on both sides of the plug socket 4 in the vertical direction. A clamping groove matching the size of the clamping block 13 is provided at the position corresponding to the clamping block 13 between the two fixing blocks 42. When the plug socket 4 and the first housing 1 are connected, the clamping block 13 is transmitted into the clamping groove and then fixed to the plug socket 4 through the fixing piece 14 at the end, completing the fixation between the first housing 1 and the fixing block 42.

[0039] As Figure 3 shown, in some embodiments of the present invention, the plug socket 4 includes a plug socket housing 43 and a plug socket bottom plate 44. The indicator light is located on the plug socket housing 43. The plug is connected to an external power supply, a remote control component, etc. on the side of the plug socket 4 facing away from the first housing 1. A first plug 45 for connecting to an external remote control 5 is provided on the plug socket housing 43. The first plug 45 is a male plug. The first plug 45 is connected to a remote control plug 6, and the other end of the remote control plug 6 is connected to the remote control 5. A second plug 46 for connecting to the remaining components is provided on the plug socket bottom plate 44. There are multiple groups of the second plugs 46, and the multiple groups of the second plugs 46 are neatly arranged on the end face of the plug socket 4 on the side facing away from the first housing 1. All the second plugs 46 are female plugs, and the second plugs 46 can be connected to external electronic components such as a power supply.

[0040] As Figure 3 shown, in some embodiments of the present invention, a wireless communication module 47 is further provided in the plug socket 4. The wireless communication module 47 is electrically connected to the circuit board 3 and is used to transmit the data collected by the circuit board 3 and transmitted to the plug socket 4 to a host or a server through the wireless communication module 47. A wifi booster 48 is also provided in the wireless communication module 47 to enhance the wireless signal and improve the data transmission ability.

[0041] The working process of the present invention is as follows: The temperature sensor can detect the temperature in the vacuum vapor soldering furnace. The vacuum sensors in the first housing 1 and the second heat insulation chamber can respectively detect the vacuum degrees in the vacuum vapor soldering furnace and at the circuit board 3 to ensure the stability of the vacuum degree and temperature in the vacuum vapor soldering furnace. The two-layer heat insulation design of the first housing 1 and the second housing 2 isolates the circuit board 3 in the second heat insulation chamber from the high temperature in the vacuum vapor soldering furnace, enabling the circuit board 3 to integrate more components, which are used to connect the temperature sensor and the vacuum sensor on the first housing 1. The plug socket 4 is used for power supply and data transmission on the circuit board 3.

[0042] In summary, the embodiment of the present invention provides a temperature testing device for a vacuum vapor soldering furnace. Through a good heat insulation design, the device has both vacuum detection and temperature detection functions, with a high integration level, a compact overall structure, a small occupied space, and cost savings for the device.

[0043] The above is only the preferred embodiment of the present invention. It should be noted that for those of ordinary skill in the art, without departing from the technical principle of the present invention, several improvements and substitutions can be made, and these improvements and substitutions should also be regarded as the protection scope of the present invention.

Claims

1. A temperature testing device for a vacuum gas-phase soldering furnace, characterized in that, Comprising: A first housing fixed to the side wall of a vacuum vapor soldering furnace. A first heat insulation chamber is formed inside the first housing. A first opening is provided on one side of the first heat insulation chamber. A temperature sensor and a vacuum sensor are provided on the first housing. Clamping blocks are rotatably provided on both sides of the first opening of the first housing. Fixing pieces are provided at the ends of the clamping blocks. Claw slots matching the sizes of the clamping blocks are correspondingly provided on both sides of a plug socket. A second housing detachably arranged in the first heat insulation chamber. A second heat insulation chamber is provided inside the second housing. A vacuum sensor is also provided in the second heat insulation chamber. A second opening is provided on the side of the second housing facing the first opening. A connecting block for closing the second heat insulation chamber is detachably provided at the second opening. The first heat insulation chamber is arranged in a stepped shape, and the shape of the first heat insulation chamber matches the shapes of the second housing and the connecting block. A circuit board arranged in the second heat insulation chamber. A transmission module is provided on the circuit board. The transmission module is electrically connected to the temperature sensor and the vacuum sensor. A plug socket arranged on one side of the first opening of the first housing to close the first heat insulation chamber. A plug connecting the circuit board is provided inside the plug socket.

2. The temperature testing device of the vacuum gas-phase soldering furnace according to claim 1, characterized in that: One end of the connecting block away from the second housing abuts against the plug socket. A connecting line is provided inside the connecting block. The connecting line is electrically connected to the circuit board and the plug.

3. The temperature testing device of the vacuum gas-phase soldering furnace according to claim 2, wherein: Positioning posts are provided on the end face of the connecting block facing the plug socket. Claw slots corresponding to the positions of the positioning posts are provided on the end face of the plug socket facing the connecting block. The sizes of the positioning posts and the claw slots match.

4. The temperature testing device of the vacuum gas-phase soldering furnace according to claim 1, wherein: A first sealing gasket is provided between the connecting block and the second housing.

5. The temperature testing device of the vacuum gas-phase soldering furnace according to claim 1, characterized in that: A second sealing gasket is provided between the plug socket and the first housing. The second sealing gasket is fixed to the first housing by screws.

6. The temperature testing device of the vacuum gas-phase soldering furnace according to claim 1, characterized in that: The plug socket includes a plug socket housing and a plug socket bottom plate. A first plug for connecting an external remote controller is provided on the plug socket housing. A second plug for connecting the remaining components is provided on the plug socket bottom plate.

7. The temperature testing device of the vacuum gas phase soldering furnace according to claim 1, wherein: A wireless communication module is further provided inside the plug socket. The wireless communication module is electrically connected to the circuit board.

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