Transfer device and method of making the same

Abstract

The present application discloses a transfer device and a method for making the same. The transfer device includes a substrate and a transfer layer. The transfer layer includes a plurality of transfer tips arranged at intervals. The material of the transfer tip includes a substrate and a magnetic material. The roughness range of the transfer tip is Ra17μm-Ra23μm. The present application mixes the substrate and the magnetic material as the material of the transfer tip. In the method for making the transfer device, the transfer tip is formed by controlling the magnetic field and utilizing the influence of the magnetic field on the material of the transfer tip, thereby avoiding the use of a mold to make the transfer tip. The roughness range of the surface of the transfer tip is within Ra17μm-Ra23μm, which effectively improves the transfer efficiency of the transfer tip.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a transfer device and a method for manufacturing the same. Background Art

[0002] With the development of the display industry, micro light emitting diodes (Micro LED) as a new generation of display technology have the advantages of higher brightness, lower power consumption, better luminous efficiency and longer life compared to existing OLED and LCD technologies.

[0003] In order to improve the existing mass transfer of Micro LEDs, patterned polydimethylsiloxane (PDMS) can be used to make transfer heads. PDMS is a viscous organic material. When in liquid state, polydimethylsiloxane is a viscous liquid. When used, PDMS is generally obtained by mixing a main agent and a hardener in a certain mass ratio. Since the production of PDMS transfer tips is usually made by mold production, the roughness of the contact surface between the PDMS transfer tip and the LED is too large, affecting the transfer efficiency. Summary of the invention

[0004] The embodiments of the present application provide a transfer device and a manufacturing method thereof, which can effectively reduce the roughness of the surface of the transfer tip and effectively improve the transfer efficiency of the LED device.

[0005] The present application provides a transfer device, characterized in that it includes:

[0006] substrate;

[0007] A transfer layer, which is disposed on one side of the substrate, and the transfer layer includes a plurality of transfer tips disposed at intervals;

[0008] The material of the transfer head includes a base material and a magnetic material, the transfer head includes a transfer working surface located on a side of the transfer head away from the substrate, and the roughness range of the transfer working surface of the transfer head is Ra17μm-Ra23μm.

[0009] Optionally, the substrate includes polydimethylsiloxane, and the magnetic material includes nano ferrite.

[0010] Optionally, the weight ratio of the magnetic material to the substrate is 1:1-4.

[0011] Optionally, the transfer tip is in the shape of a truncated cone or a column.

[0012] Optionally, the substrate includes one of a temporary substrate and a glass substrate.

[0013] The present application also provides a method for manufacturing a transfer device, comprising the following steps:

[0014] providing a substrate;

[0015] forming a liquid magnetic fluid layer on the substrate, wherein the liquid magnetic fluid layer comprises a base material and a magnetic material;

[0016] Applying a magnetic field to the liquid fluid layer, wherein the magnetic field direction of the magnetic field forms a certain angle with the substrate, so that the liquid magnetic fluid layer is dispersed on the substrate to form a plurality of uncured transfer tips arranged at intervals;

[0017] The uncured transfer tip is cured to form a plurality of the transfer tips.

[0018] Optionally, the uncured transfer tip is cured by heating, and the temperature at which the uncured transfer tip is heated is 85-110°C.

[0019] Optionally, before the step of applying a magnetic field to the liquid fluid layer, wherein the magnetic field direction of the magnetic field forms a certain angle with the substrate so that the liquid magnetic fluid layer is dispersed on the substrate to form a plurality of uncured transfer tips arranged at intervals, the step further includes:

[0020] A baffle parallel to the substrate is arranged on a side of the liquid magnetic fluid layer away from the substrate;

[0021] Forming an adhesive on a side of the substrate close to the baffle, the baffle and the substrate are connected by the adhesive, and the thickness of the adhesive is greater than the thickness of the liquid magnetic fluid layer on the substrate;

[0022] After curing the uncured transfer tips to form a plurality of transfer tips, the method further comprises:

[0023] The adhesive is cut to separate the baffle and the substrate.

[0024] Optionally, the material of the baffle includes polytetrafluoroethylene, and the substrate includes polydimethylsiloxane.

[0025] Optionally, the adhesive is disposed close to an edge of the substrate.

[0026] The beneficial effects of the present invention include at least:

[0027] The present application mixes a substrate and a magnetic material as the material of the transfer tip, avoiding the use of a mold to make the transfer tip, so that the roughness range of the transfer tip surface is Ra17μm-Ra23μm, effectively improving the transfer efficiency of the transfer tip for a large number of LED devices. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0029] Figure 1 It is a structural schematic diagram of a transfer device provided in an embodiment of the present application;

[0030] Figure 2 It is a schematic diagram of the manufacturing process of a transfer device provided in an embodiment of the present application;

[0031] Figure 3 is a structural top view of a transfer device provided in an embodiment of the present application;

[0032] Figure 4 is a manufacturing flow chart of a transfer device provided in an embodiment of the present application;

[0033] Figure 5 This is another manufacturing process intention of a transfer device provided in an embodiment of the present application;

[0034] Figure 6 This is a production flow chart of another transfer device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0035] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of this application.

[0036] The embodiments of the present application provide a display panel, a method for manufacturing a display panel, and a mobile terminal. The following is a detailed description. It should be noted that the order of description of the following embodiments is not intended to limit the preferred order of the embodiments. In addition, in the description of the present application, the term "including" means "including but not limited to". The terms first, second, third, etc. are used only as labels, and no numerical requirements or order is imposed. Various embodiments of the present invention may exist in the form of a range; it should be understood that the description in the form of a range is only for convenience and simplicity, and should not be understood as a rigid limitation on the scope of the present invention; therefore, it should be considered that the range description has specifically disclosed all possible sub-ranges and single values ​​within the range. For example, it should be considered that the range description from 1 to 6 has specifically disclosed sub-ranges, such as from 1 to 3, from 1 to 4, from 1 to 5, from 2 to 4, from 2 to 6, from 3 to 6, etc., as well as single numbers within the range, such as 1, 2, 3, 4, 5 and 6, which are applicable regardless of the range. In addition, whenever a numerical range is indicated in this article, it is meant to include any quoted numbers (fractions or integers) within the indicated range.

[0037] With the development of the display industry, micro light emitting diodes (Micro LED) as a new generation of display technology have the advantages of higher brightness, lower power consumption, better luminous efficiency and longer life compared to existing OLED and LCD technologies.

[0038] In order to improve the existing mass transfer of Micro LEDs, patterned polydimethylsiloxane (PDMS) can be used to make transfer heads. PDMS is a viscous organic material. Liquid polydimethylsiloxane is viscous. When used, PDMS is generally obtained by mixing a main agent and a hardener in a certain mass ratio. Since the production of PDMS transfer tips is usually made of molds, the roughness of the contact surface between the PDMS transfer tip and the LED is too large, which seriously affects the transfer efficiency.

[0039] At present, in the process of making PDMS transfer tips, some solutions will spin-coat PDMS on the photoresist surface. At this time, if the PDMS is not baked (cured) and directly bonded, the PDMS material will overflow the substrate and flow to the back of the substrate due to its high fluidity, which will affect the uniformity of the PDMS layer thickness during baking.

[0040] In another solution, if the PDMS is baked (cured) before bonding, the PDMS will adhere to the photoresist and cannot be effectively separated from the photoresist.

[0041] In another solution, if the PDMS is directly spin-coated on the substrate of the transfer tip and then baked, the baking time is too long and the PDMS solidifies, making subsequent patterning impossible, thereby failing to achieve the purpose of making the transfer tip.

[0042] In order to solve the above technical problems, the present application provides the following technical solutions. Specifically referring to the following embodiments, the present application provides a transfer device, such as Figure 1 As shown, including:

[0043] substrate 10;

[0044] A transfer layer 20 is disposed on one side of the substrate 10, and the transfer layer 20 includes a plurality of transfer tips 201 disposed at intervals;

[0045] The material of the transfer tip 201 includes a substrate and a magnetic material, and the roughness range of the transfer tip 201 is Ra17 μm-Ra23 μm.

[0046] Specifically, the substrate 10 may be a temporary substrate or a glass substrate.

[0047] Specifically, the transfer layer 20 includes a plurality of transfer tips 201 arranged at intervals, and the arrangement of the plurality of transfer tips 201 can be adjusted according to actual production conditions.

[0048] Specifically, the plurality of transfer heads 201 may be evenly spaced and arranged, and the transfer heads 201 may be cylindrical, truncated cone or convex structures on the substrate 10 .

[0049] Specifically, the material of the transfer tip 201 includes a substrate and a magnetic material, the substrate may include polydimethylsiloxane, the magnetic material may be nanoferrite, the substrate includes a hardener in addition to polydimethylsiloxane, the hardener includes a platinum-containing catalyst, for example, it may be commercially available Dow Corning Sylgard 184, wherein the mass ratio of polydimethylsiloxane to the hardener may be 10 to 1:1.

[0050] Specifically, the weight ratio of the magnetic material to the substrate is 1:1-4.

[0051] Specifically, the roughness range of the transfer tip 201 is Ra17 μm-Ra23 μm, for example, the roughness of the transfer tip 201 is one of Ra17 μm, Ra18 μm, Ra19 μm, Ra20 μm, Ra21 μm, Ra22 μm, and Ra23 μm.

[0052] It can be understood that this embodiment mixes the substrate and the magnetic material as the material of the transfer tip 201, avoiding the use of a mold to make the transfer tip 201, so that the roughness range of the surface of the transfer tip 201 is Ra17μm-Ra23μm, effectively improving the transfer efficiency of the transfer tip 201 for a large number of LED devices.

[0053] In one embodiment, the substrate includes polydimethylsiloxane, and the magnetic material includes nano ferrite.

[0054] Specifically, the chemical state of polydimethylsiloxane is dimethyl silicone oil, and its appearance varies from colorless transparent volatile liquid to extremely high viscosity liquid or silica gel, depending on the relative molecular mass. The liquid with a relatively high viscosity is used in this embodiment, and the material can be further cured within the range of 85-110°C.

[0055] Specifically, polydimethylsiloxane is odorless, highly transparent, has low surface tension, a thermal conductivity of 0.134-0.159 W / (m·K), and a light transmittance of 100%. Dimethyl silicone oil is non-toxic and odorless, has physiological inertness, good chemical stability, electrical insulation and weather resistance, good hydrophobicity, and has high shear resistance.

[0056] Specifically, the magnetic material may include nano ferrite or other magnetic materials.

[0057] It can be understood that by setting the material of the transfer tip 201 to polydimethylsiloxane and nano-ferrite, the transfer tip 201 can have a certain adsorption force and can be manufactured through a certain magnetic field 30, and a template can be omitted, thereby effectively reducing the surface roughness of the transfer tip 201 and making the transfer efficiency of the transfer tip 201 higher.

[0058] In one embodiment, the weight ratio of the magnetic material to the substrate is 1:1-4.

[0059] Specifically, the weight ratio of the magnetic material to the substrate may be one of 1:4, 1:3, 1:2 or 1:1, and may be selected according to actual production conditions.

[0060] It can be understood that by setting a suitable weight ratio of the magnetic material to the substrate, the liquid magnetic fluid obtained by mixing the magnetic material and the substrate can be used to make the transfer tip 201 according to the preset magnetic field 30 so that the upper surface roughness of the transfer tip 201 is maintained within a suitable range, and on the other hand, it does not affect the adhesion of the transfer tip 201 when transferring the LED device.

[0061] In one embodiment, the transfer tip 201 is in a truncated cone or column shape.

[0062] Specifically, the transfer head 201 forms a truncated cone or columnar structure on the substrate 10. When the transfer head 201 has a truncated cone structure, the end away from the substrate 10 has a smaller diameter.

[0063] It is understandable that the transfer nozzle 201 formed into a frustum or a column shape can more conveniently transfer the LED device and improve the transfer efficiency of the LED device.

[0064] In one embodiment, the substrate 10 includes one of a temporary substrate and a glass substrate.

[0065] Specifically, the substrate 10 includes a temporary substrate. The material of the temporary substrate does not affect the propagation of magnetic flux lines. The material of the temporary substrate can be an insulating and heat-resistant adhesive material or an organic polymer.

[0066] In addition, the present application embodiment provides a method for manufacturing a transfer device, such as Figure 2 , Figure 3 , Figure 4 As shown, the following steps are included:

[0067] S1, providing a substrate 10;

[0068] S2, forming a liquid magnetic fluid layer 2001 on the substrate 10, wherein the liquid magnetic fluid layer 2001 includes a base material and a magnetic material;

[0069] S3, applying a magnetic field 30 to the liquid magnetic fluid layer 2001, wherein the magnetic field direction of the magnetic field 30 forms a certain angle with the substrate 10, so that the liquid magnetic fluid layer 2001 is dispersed on the substrate 10 to form a plurality of uncured transfer tips arranged at intervals;

[0070] S4, curing the uncured transfer tips to form a plurality of transfer tips 201.

[0071] Specifically, the substrate 10 includes a temporary substrate, and the material of the temporary substrate is an insulating glue material.

[0072] Specifically, the substrate may include polydimethylsiloxane, the magnetic material may be nano ferrite, and the substrate may include a hardener in addition to polydimethylsiloxane, the hardener may include a platinum-containing catalyst, such as commercially available Dow Corning Sylgard 184, wherein the mass ratio of polydimethylsiloxane to the hardener may be 10 to 1:1.

[0073] Specifically, the weight ratio of the magnetic material to the substrate is 1:1-4, and specifically may be 1:4.

[0074] Specifically, the liquid magnetic fluid layer 2001 is formed by coating a mixture of polydimethylsiloxane and nano-ferrite (liquid fluid material) on the substrate 10 .

[0075] Specifically, the applied magnetic field 30 is a linear magnetic field, which can be perpendicular to the substrate 10. The applied magnetic field 30 can also be a point magnetic field. The magnetic field form that can disperse the liquid magnetic fluid layer 2001 to form a plurality of uncured transfer tips arranged at intervals is within the protection scope of the present application.

[0076] It can be understood that in this embodiment, the base material and the magnetic material are mixed as the material of the transfer tip 201, and the magnetic field 30 is controlled to form the transfer tip 201 by utilizing the influence of the magnetic field 30 on the material of the transfer tip 201, thereby avoiding the use of a mold to manufacture the transfer tip 201, so that the roughness range of the surface of the transfer tip 201 is within Ra17μm-Ra23μm, thereby effectively improving the transfer efficiency of the transfer tip 201.

[0077] In one embodiment, the uncured transfer tip is cured by heating, and the temperature at which the uncured transfer tip is heated is 85-110°C.

[0078] Specifically, the heating method may be baking, and the specific baking temperature may be 85°C, 90°C, 95°C, 100°C, 105°C or 110°C.

[0079] It is understandable that by using a suitable heating temperature, the uncured transfer tip is cured to form the transfer tip 201, avoiding the situation where excessive heating causes the methyl chains in the PDMS to break and the PDMS structure to rearrange, causing the transfer tip 201 to lose its adhesion when PDMS is used as the material.

[0080] In one embodiment, if Figure 5 and Figure 6 As shown, before the step of applying a magnetic field 30 to the substrate 10, wherein the magnetic field direction of the magnetic field 30 forms a certain angle with the substrate 10, so that the material of the transfer layer 20 is dispersed on the substrate 10 to form a plurality of spaced uncured transfer tips, the step further includes:

[0081] A baffle 202 parallel to the substrate 10 is arranged on a side of the liquid magnetic fluid layer 2001 away from the substrate 10;

[0082] An adhesive 203 is formed on a side of the substrate 10 close to the baffle 202, the baffle 202 and the substrate 10 are connected by the adhesive 203, and the thickness of the adhesive 203 is greater than the thickness of the material of the transfer layer 20 coated on the substrate 10;

[0083] After the step of curing the uncured transfer tips to form a plurality of the transfer tips 201, the method further includes:

[0084] The adhesive 203 is cut to separate the baffle 202 and the substrate 10 .

[0085] Specifically, Figure 5 , Figure 6 As shown, the manufacturing method of the transfer device in this embodiment specifically includes the following steps:

[0086] S100, providing a substrate 10;

[0087] S200, forming a liquid magnetic fluid layer 2001 on the substrate 10, wherein the liquid magnetic fluid layer 2001 includes a base material and a magnetic material;

[0088] S300, providing a baffle 202 disposed opposite to the substrate 10, forming an adhesive 203 between the substrate 10 and the baffle 202, wherein the thickness of the adhesive 203 is greater than the thickness of the liquid magnetic fluid layer 2001 between the substrate 10 and the baffle 202;

[0089] S400, applying a magnetic field 30 to the liquid magnetic fluid layer 2001, wherein the direction of the magnetic field forms a certain angle with the substrate 10, so that the material of the transfer layer 20 is dispersed on the substrate 10 to form a plurality of uncured transfer tips arranged at intervals;

[0090] S500, curing the uncured transfer tips to form a plurality of transfer tips 201;

[0091] S600 , cutting the adhesive 203 to separate the baffle 202 and the substrate 10 .

[0092] Specifically, in step S300, the material of the baffle 202 is not bonded to the magnetic fluid layer, and the material of the baffle 202 may be polytetrafluoroethylene.

[0093] Specifically, in step S300, the thickness of the adhesive 203 is 1-3 mm greater than the thickness of the liquid magnetic fluid layer, so that the liquid magnetic fluid layer 2001 has a certain dispersion space.

[0094] Specifically, in step S600 , the adhesive 203 is cut by laser, and the thickness of the residual adhesive remaining after cutting is smaller than the thickness of the transfer tip 201 .

[0095] It can be understood that in this embodiment, the base material and the magnetic material are mixed as the material of the transfer tip 201, and the transfer tip 201 is formed by controlling the magnetic field 30 and utilizing the influence of the magnetic field 30 on the material of the transfer tip 201, so that the roughness range of the surface of the transfer tip 201 is within Ra17μm-Ra23μm, thereby avoiding the use of a mold to make the transfer tip 201, and effectively improving the transfer efficiency of the transfer tip 201. At the same time, a baffle 202 is formed on the side of the transfer layer 20 away from the substrate 10, and the baffle 202 is bonded to the substrate 10 with adhesive 203, which can effectively limit the height of multiple transfer tips 201, so that the upper surfaces of the multiple transfer tips 201 are on the same horizontal plane, thereby ensuring a high transfer efficiency of the transfer tip 201 and improving the transfer accuracy of the transfer tip 201.

[0096] In one embodiment, the material of the baffle 202 includes polytetrafluoroethylene, and the base material includes polydimethylsiloxane.

[0097] Specifically, there is no adhesion between polytetrafluoroethylene and polydimethylsiloxane, and after the frame glue is cut, the upper surface of the PDMS transfer tip 201 can be made flat and the roughness remains unchanged.

[0098] It can be understood that the present application mixes the substrate and the magnetic material as the material of the transfer tip 201, avoiding the use of a mold to make the transfer tip 201, so that the roughness range of the surface of the transfer tip 201 is Ra17μm-Ra23μm, effectively improving the transfer efficiency of the transfer tip 201 for a large number of LED devices.

[0099] In one embodiment, the adhesive 203 is disposed close to the edge of the substrate 10 .

[0100] Specifically, the adhesive 203 may be made of optical adhesive, and the adhesive 203 may be disposed around the edge of the substrate 10 .

[0101] In summary, the present application mixes the substrate and the magnetic material as the material of the transfer tip 201, avoiding the use of a mold to manufacture the transfer tip 201, so that the roughness range of the surface of the transfer tip 201 is Ra17μm-Ra23μm, which effectively improves the transfer efficiency of the transfer tip 201 for a large number of LED devices;

[0102] In the manufacturing method of the transfer device of the present application, a base material and a magnetic material are mixed as the material of the transfer tip 201, and the transfer tip 201 is formed by controlling the magnetic field 30 and utilizing the influence of the magnetic field 30 on the material of the transfer tip 201, thereby avoiding the use of a mold to manufacture the transfer tip 201, so that the roughness range of the surface of the transfer tip 201 is within Ra17μm-Ra23μm, thereby effectively improving the transfer efficiency of the transfer tip 201.

[0103] The above is a detailed introduction to a transfer device and a manufacturing method thereof provided in an embodiment of the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea; at the same time, for technical personnel in this field, according to the idea of ​​the present application, there will be changes in the specific implementation method and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A method for manufacturing a transfer device, characterized in that: The transfer device is used for transferring a large number of LED devices, and the method comprises the following steps: providing a substrate; forming a liquid magnetic fluid layer on the substrate, wherein the liquid magnetic fluid layer comprises a base material and a magnetic material; Applying a magnetic field to the liquid fluid layer, wherein the magnetic field direction of the magnetic field forms a certain angle with the substrate, so that the liquid magnetic fluid layer is dispersed on the substrate to form a plurality of uncured transfer tips arranged at intervals; Curing the uncured transfer tips to form a plurality of transfer tips, wherein the roughness of the transfer working surface of the transfer tips ranges from Ra17 μm to Ra23 μm; Wherein, the substrate comprises polydimethylsiloxane, the magnetic material comprises nano ferrite, and the weight ratio of the magnetic material to the substrate is 1:1-4.

2. The method for manufacturing a transfer device according to claim 1, characterized in that: The uncured transfer tip is cured by heating, and the temperature at which the uncured transfer tip is heated is 85-110°C.

3. The method for manufacturing a transfer device according to claim 1, characterized in that: Before the step of applying a magnetic field to the liquid fluid layer, wherein the magnetic field direction of the magnetic field forms a certain angle with the substrate so that the liquid magnetic fluid layer is dispersed on the substrate to form a plurality of uncured transfer tips arranged at intervals, the step further includes: A baffle parallel to the substrate is arranged on a side of the liquid magnetic fluid layer away from the substrate; Forming an adhesive on a side of the substrate close to the baffle, the baffle and the substrate are connected by the adhesive, and the thickness of the adhesive is greater than the thickness of the liquid magnetic fluid layer on the substrate; After curing the uncured transfer tips to form a plurality of transfer tips, the method further comprises: The adhesive is cut to separate the baffle and the substrate.

4. The method for manufacturing the transfer device according to claim 3, characterized in that: The material of the baffle includes polytetrafluoroethylene.

5. The method for manufacturing the transfer device according to claim 3, characterized in that: The adhesive is arranged close to the edge of the substrate.

6. A transfer device, characterized in that: The transfer device is manufactured by the manufacturing method of any one of claims 1 to 5, wherein the transfer device comprises: substrate; A transfer layer, which is disposed on one side of the substrate, and the transfer layer includes a plurality of transfer tips disposed at intervals; The material of the transfer head includes a base material and a magnetic material, the transfer head includes a transfer working surface located on a side of the transfer head away from the substrate, and the roughness range of the transfer working surface of the transfer head is Ra17μm-Ra23μm.

7. The transfer device according to claim 6, characterized in that The transfer tip is in the shape of a truncated cone or a column.

8. The transfer device according to claim 6, characterized in that The substrate includes one of a temporary substrate and a glass substrate.

Images