Lead frame with high bonding strength, manufacturing process of packaged device and product thereof

Abstract

This invention relates to the field of semiconductor packaging technology, and more particularly to a high-bonding-strength lead frame, a manufacturing process for packaged devices, and related products. A high-bonding-strength lead frame includes a frame body and frame units spaced apart from the frame body. Each frame unit includes a die-attach island, a first functional pin, a second functional pin, and a fixed pin. The first functional pins are symmetrically distributed on the left and right sides of the die-attach island, and one end of each first functional pin is connected to the frame body. This high-bonding-strength lead frame improves the interlocking effect between the functional pins, the die-attach island, and the molding compound. Furthermore, the die-attach island exhibits good stability, effectively preventing delamination. This solves the problems of existing lead frames, such as pins easily stretching and causing misalignment and delamination, die-attach islands easily lifting, poor soldering due to insecure soldering, and delamination on the frame surface.

Description

Technical Field

[0001] This invention relates to the field of semiconductor packaging technology, and in particular to a high bonding strength lead frame, a manufacturing process for packaging devices, and related products. Background Technology

[0002] Integrated semiconductor packaging technology is constantly evolving to meet the demands of miniaturization, lightweighting, and high performance in consumer electronics products. The semiconductor packaging process mainly involves physically fixing the main chip, frame, and leads using molding compound to provide mechanical protection and prevent physical structural damage and failure caused by water, electricity, or moisture during use.

[0003] The basic process of packaging includes: thinning the chip using grinding equipment and cutting it into a single package chip body; then bonding the chip to the die substrate island by applying die-attach materials such as silver paste, insulating glue, or solder paste; then connecting the chip to functional pins using leads to form a basic electrical connection; plastic encapsulation uses polymer molding compound to physically encapsulate the pre-wired unit body to form a packaged single unit; and finally, after passing electrical parameter testing, it becomes an integrated circuit device that meets specific requirements.

[0004] The current lead frame has the following problems:

[0005] 1. The functional pins of the traditional frame have a smooth inflection point. The functional pins and the molding compound do not form a mutual locking and interlocking. During the molding and punching process, under the action of external force, the pins are pulled loose and misaligned, which can easily lead to problems such as delamination between the pins and the molding compound and lead wire breakage.

[0006] 2. Traditional frame substrate islands have only one functional pin connected to each other. This unidirectional connection makes the substrate islands prone to warping. During the welding process, the bonding is not firm and loose, which leads to the loss of welding parameters or even welding abnormalities such as welding misalignment.

[0007] 3. Currently, conventional frame substrate islands, pin surfaces and molding compound are all planar bonded. After molding and curing, the molding compound and frame only form an adhesive on the surface. It is easy for the molding compound to peel off and delaminate at the bonding surface of the molding compound and frame during use due to heat expansion and moisture. In severe cases, it can cause the internal circuitry to break and cause failure. Summary of the Invention

[0008] In response to the problems raised in the background art, the purpose of this invention is to provide a lead frame with high bonding strength, which can improve the interlocking effect between functional pins and die substrate islands and molding compound, and the die substrate islands have good firmness, which can effectively prevent delamination. This solves the problems in existing lead frames, such as pins being prone to stretching and resulting in misalignment and delamination, die substrate islands being prone to lifting, poor soldering due to poor furnace adhesion, and delamination on the frame surface.

[0009] In response to the problems raised in the background art, another objective of the present invention is to propose a manufacturing process for a packaged device using the aforementioned high bonding strength lead frame, which results in a packaged device with high bonding strength between the die substrate islands and leads and the molding compound, effectively preventing delamination between the frame and the molding compound.

[0010] In response to the problems raised in the background art, another objective of the present invention is that the packaged device manufactured by the above-mentioned packaging device manufacturing process has a strong interlocking effect and high bonding strength between the die substrate islands and pins and the molding compound, effectively preventing the delamination of the frame and the molding compound.

[0011] To achieve this objective, the present invention adopts the following technical solution:

[0012] A high bonding strength lead frame includes a frame body and frame units spaced apart from the frame body, wherein the frame unit includes a die-attach base island, a first functional pin, a second functional pin, and a fixed pin.

[0013] The first functional pins are symmetrically distributed on the left and right sides of the adhesive substrate island, and one end of the first functional pin is connected to the frame body, while the other end of the first functional pin is located on the upper or lower side of the adhesive substrate island.

[0014] One end of the second functional pin is connected to the frame body, and the other end of the second functional pin is connected to the rear end of the adhesive substrate island. One end of the fixed pin is connected to the frame body, and the other end of the fixed pin is connected to the front end of the adhesive substrate island.

[0015] The first functional pin includes a functional part for encapsulating within the molding compound and a bent part located outside the molding compound. The left and right sides of the functional part are respectively provided with barbed corners and protruding cap tips.

[0016] The surface of the adhesive substrate island and the back of the functional part of the first functional pin are both provided with a first feeding groove, and the back of the adhesive substrate island is provided with a second feeding groove.

[0017] To further explain, both the barb and the protruding tip are located on the side of the functional part closer to the bent part, and the barb is located on the side of the functional part away from the adhesive substrate island, while the protruding tip is located on the side of the functional part closer to the adhesive substrate island.

[0018] Furthermore, the functional part is provided with a recessed notch on the side away from the bending part, and the recessed notch is located on the side edge of the functional part away from the adhesive substrate island.

[0019] To further explain, the connection between the fixed pin and the adhesive substrate island is provided with a neck notch that is recessed toward the inside of the fixed pin.

[0020] To further explain, the surface of the functional part of the first functional pin and the surface of the junction between the adhesive substrate island and the fixed pin are both provided with a metal plating layer.

[0021] The surface of the adhesive substrate island is provided with the first feeding groove on the left and right sides of the metal plating layer, and the functional part of the first functional pin is provided with the first feeding groove on the back side of the metal plating layer.

[0022] To further explain, the first feed groove is spherical in shape, and the width of the opening of the first feed groove is less than the diameter of the first feed groove.

[0023] The depth of the first feed groove located on the adhesive substrate island is ≤ 2 / 3 of the thickness of the adhesive substrate island, and the depth of the first feed groove located on the functional part of the first functional pin is ≤ 2 / 3 of the thickness of the functional part of the first functional pin.

[0024] To further explain, the back side of the adhesive substrate island is symmetrically provided with the second feeding groove, and the second feeding groove is arranged in the left-right direction. The longitudinal section of the second feeding groove is inverted trapezoidal.

[0025] The depth of the second feed groove is ≤ 2 / 3 of the thickness of the adhesive substrate island.

[0026] To further explain, the inner surfaces of both the first and second feeding grooves are frosted.

[0027] A fabrication process for a packaged device, using a high bonding strength lead frame as described, includes the following steps:

[0028] Step S1, die bonding: Apply die bonding material to the die bonding base islands, place the chip on the die bonding material position corresponding to the frame unit, and cure after all frame units are bonded;

[0029] Step S2, Bonding: Use leads to connect the bonding area of ​​the chip to the corresponding pins of the frame unit;

[0030] Step S3, molding: The product to be produced in step S2 is encapsulated with a polymer molding compound, cured, and then demolded.

[0031] Step S4, Thermal Aging: The plastic-sealed product undergoes a thermal aging reaction;

[0032] Step S5, Deoxidation and Brightening: Deposit a tin layer on the pins;

[0033] Step S6, Forming / Separation: The electronic device products formed after the above steps are formed / separated under the stamping of a forming mold to obtain a single packaged device.

[0034] A packaged device, manufactured using the manufacturing process of the packaged device.

[0035] Compared with the prior art, the embodiments of the present invention have the following beneficial effects:

[0036] 1. By combining the barbed corners and the raised tips, a double-locking mechanism is formed to prevent stretching. After molding, the functional area of ​​the pins encapsulated in the molding compound forms a reverse locking action with the molding compound under the action of the outward-facing barbed corners and raised tips. Under the physical locking and interlocking action of action and reaction forces, a reverse force is provided during the molding and punching process to counteract the external force, protecting the product's primary functional pins from being loosened or misaligned by external forces. This effectively solves problems such as delamination between the pins and the molding compound and lead wire breakage.

[0037] 2. By setting fixed pins that are connected to the substrate island, the firmness of the substrate island is better ensured, effectively solving the problem of substrate island warping and deformation during production and poor adhesion to the furnace, thus improving the welding performance of the product substrate island;

[0038] 3. By providing a first feeding groove on the surface of the adhesive substrate island and on the back of the functional part of the first functional pin, and a second feeding groove on the back of the adhesive substrate island, the bonding strength between the molding compound and the upper and lower surfaces of the frame can be increased, preventing delamination caused by thermal expansion and contraction during use, and improving product reliability. Attached Figure Description

[0039] Figure 1 This is a schematic diagram of the existing lead frame structure;

[0040] Figure 2 This is a schematic diagram of a high bonding strength lead frame according to an embodiment of the present invention;

[0041] Figure 3 yes Figure 2A magnified view of a portion of point F;

[0042] Figure 4 This is a schematic diagram of a high bonding strength lead frame according to an embodiment of the present invention;

[0043] Figure 5 yes Figure 4 A sectional view of section C-C;

[0044] Figure 6 yes Figure 4 Sectional view of section DD;

[0045] Figure 7 yes Figure 4 A sectional view of section EE;

[0046] The components include: frame body 1, frame unit 2, adhesive substrate island 3, substrate island ear 31, first functional pin 4, functional part 41, barb corner 411, protruding cap tip 412, recessed bayonet 413, bending part 42, second functional pin 5, fixing pin 6, neck bayonet 61, molding compound 7, first feed groove 8, second feed groove 9, metal plating layer 10, chip 20, and lead wire 30. Detailed Implementation

[0047] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0048] In the description of this invention, it should be understood that the terms "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, features defined with "first" and "second" may explicitly or implicitly include one or more of these features, used to distinguish and describe features, without any order or emphasis.

[0049] A high bonding strength lead frame includes a frame body 1 and frame units 2 spaced apart from the frame body 1. The frame unit 2 includes a substrate island 3, a first functional pin 4, a second functional pin 5, and a fixing pin 6.

[0050] The first functional pin 4 is symmetrically distributed on the left and right sides of the adhesive substrate island 3, and one end of the first functional pin 4 is connected to the frame body 1, while the other end of the first functional pin 4 is located on the upper or lower side of the adhesive substrate island 3.

[0051] One end of the second functional pin 5 is connected to the frame body 1, and the other end of the second functional pin 5 is connected to the rear end of the adhesive substrate island 3. One end of the fixing pin 6 is connected to the frame body 1, and the other end of the fixing pin 6 is connected to the front end of the adhesive substrate island 3.

[0052] The first functional pin 4 includes a functional part 41 for encapsulating in the molding compound 7 and a bent part 42 located outside the molding compound 7. The left and right sides of the functional part 41 are respectively provided with a barb corner 411 and a protruding cap tip 412.

[0053] The surface of the adhesive substrate island 3 and the back of the functional part 41 of the first functional pin 4 are both provided with a first feeding groove 8, and the back of the adhesive substrate island 3 is provided with a second feeding groove 9.

[0054] like Figure 1 As shown, Figure 1 The diagram shown is a partial schematic of the existing lead frame array structure, such as... Figure 1 As shown, the functional pins of the traditional frame have a smooth inflection point shape, and the functional pins and the molding compound do not form a mutual locking and interlocking. In addition, the die-attachment islands have only one functional pin connected to each other, and the unidirectional connection is prone to lifting. During the soldering process, it is easy to loosen due to insufficient pressing. Furthermore, the die-attachment islands, pin surfaces and molding compound are all planar, which can easily cause delamination between the molding compound and the frame.

[0055] like Figures 2 to 7 As shown, the first functional pin 4 is divided into two parts: the functional part 41 encapsulated within the molding compound 7 and the bent part 42 located outside the molding compound 7, as follows. Figure 2 As shown, the area encapsulated by the dashed box represents the area encapsulated by the molding compound 7. The functional part 41 encapsulated within the molding compound 7 has barbed corners 411 and raised tips 412 on its left and right sides, respectively. The barbed corners 411 and raised tips 412 work together to form a double-locking mechanism to prevent stretching. After molding, the functional part 41 encapsulated within the molding compound 7, under the action of the outward-facing barbed corners 411 and raised tips 412, forms a reverse locking action with the molding compound 7. This physical locking action of force and reaction provides a reverse force to counteract external forces during the molding and die-cutting process, protecting the first functional pin of the product from being loosened or misaligned by external forces. This effectively solves problems such as delamination between the pin and the molding compound 7, and lead wire breakage.

[0056] It should be noted that the first functional pin 4 is an independent pin. One end of the first functional pin 4 is connected to the frame body 1, and the other end of the first functional pin 4 is not connected to the adhesive substrate island 3. Therefore, it is easy to have problems such as delamination with the molding compound 7 and poor bonding strength with the molding compound 7. However, since one end of the second functional pin 5 is connected to the frame body 1 and the other end of the second functional pin 5 is connected to the rear end of the adhesive substrate island 3, this problem does not exist.

[0057] In addition, by setting the fixed pin 6, which is connected to the adhesive substrate island 3, the firmness of the adhesive substrate island 3 is better, effectively solving the problem of the adhesive substrate island 3 warping and deforming during the production process and not sticking firmly to the furnace, thus improving the welding performance of the product substrate island;

[0058] By providing the first feeding groove 8 on the surface of the adhesive base island 3 and the back of the functional part 41 of the first functional pin 4, and providing the second feeding groove 9 on the back of the adhesive base island 3, the bonding strength between the molding compound 7 and the upper and lower surfaces of the frame can be increased, preventing delamination caused by thermal expansion and contraction during use, and improving the reliability of the product.

[0059] The high bonding strength lead frame can improve the interlocking effect between the first functional pin 4, the die-attachment island 3 and the molding compound 7. The die-attachment island 3 has good firmness and can effectively prevent delamination. It solves the problems in the existing lead frame, such as the pin being easily stretched by external force and causing misalignment and delamination, the die-attachment island 3 being easily lifted, poor soldering due to poor soldering, and the delamination between the frame surface and the molding compound 7 during use.

[0060] To further explain, both the barb angle 411 and the protruding tip 412 are disposed on the side of the functional part 41 near the bending part 42, and the barb angle 411 is disposed on the side of the functional part 41 away from the adhesive substrate island 3, while the protruding tip 412 is disposed on the side of the functional part 41 near the adhesive substrate island 3.

[0061] The barb angle 411 and the protruding cap tip 412 cooperate to form a protective double latch door that is resistant to stretching. Specifically, the angle A between the edge of the barb angle 411 and the edge of the functional part 41 is 65°, and the angle B between the inclined side of the protruding cap tip 412 and the edge of the bent part 42 is 65°, which effectively enhances the buckling force.

[0062] To further explain, the functional part 41 is provided with a recessed slot 413 on the side away from the bending part 42, and the recessed slot 413 is located on the side edge of the functional part 41 away from the adhesive substrate island 3.

[0063] By setting the recessed slot 413, the functional part of the first functional pin 4 has a positioning point, which can enhance the molding strength between the functional part of the first functional pin 4 and the outer wall of the molding compound 7. Preferably, the recessed slot 413 is square in shape and the side length of the recessed slot 413 is 0.08mm. The rectangular slot design can effectively enhance the bonding strength with the molding compound 7. It should be noted that the shape of the recessed slot 413 can also be set as a triangle, a circle or other shapes, and is not limited to the above shapes.

[0064] To further explain, the connection between the fixed pin 6 and the adhesive substrate island 3 is provided with a neck retainer 61 that is recessed toward the interior of the fixed pin 6.

[0065] Specifically, the width of the fixing pin 6 at the neck slot 61 is 0.15mm, and the width of the fixing pin 6 is 0.35mm. By setting the fixing pin 6, the connection between the fixing pin 6 and the adhesive substrate island 3 is strong, effectively avoiding the problem of the adhesive substrate island 3 warping and deforming during the production process, thereby avoiding welding problems caused by unstable furnace mounting. At the same time, by setting the neck slot 61, which is located at the punching and cutting surface, the production efficiency of cutting can be improved while ensuring the firmness of the adhesive substrate island 3, making it easier to cut during forming and cutting, and effectively avoiding problems such as edge chipping and cutting burrs.

[0066] Specifically, a metal plating layer 10 is provided on the surface of the functional part 41 of the first functional pin 4 and the surface of the junction between the adhesive substrate island 3 and the fixed pin 6.

[0067] The surface of the adhesive substrate island 3 is provided with the first feeding groove 8 on the left and right sides of the metal plating layer 10, and the functional part of the first functional pin 4 is provided with the first feeding groove 8 on the back side of the metal plating layer 10.

[0068] Specifically, the surface of the functional part 41 of the first functional pin 4 refers to the upper end surface of the first functional pin 4, and the surface of the junction between the adhesive substrate island 3 and the fixed pin 6 refers to the upper end surface of the junction between the adhesive substrate island 3 and the fixed pin 6.

[0069] On the adhesive substrate island 3, protective metal (generally silver or nickel-palladium-gold plating, etc.) is selectively plated in localized areas according to product output characteristics and structural layout, forming the metal plating layer 10, such as... Figure 2 The shaded area shown is the area where the metal plating layer 10 is applied; it can effectively increase the solderability of the base island soldering area, while retaining the adhesion between other areas and the molding compound. The other areas use bare copper metal planes, and the thickness of the metal plating layer 10 is 0.002-0.01mm; preferably, the left and right sides of the die-attach base island 3 are also provided with base island ears 31, which are located between the front and rear two first functional pins 4. The surface of the base island ears 31 is also provided with the metal plating layer 10. By providing the protection of the metal plating layer 10, it is convenient for the internal lead layout of the product, while avoiding the risk of delamination between the molding compound 7 and the die-attach base island 3, as the die-attach base island 3 is fully silver-plated.

[0070] Furthermore, by providing the first feeding groove 8 on the left and right sides of the metal plating layer 10 on the surface of the adhesive substrate island 3, after injection molding, the molding compound forms a strong connection at the first feeding groove 8, effectively preventing delamination in the plating area and causing product failure, and effectively preventing the molding compound 7 from expanding and detaching from the surface of the adhesive substrate island 3, thus preventing the lead wire solder joint from breaking.

[0071] Furthermore, by providing the first feeding groove 8 on the back side of the functional part 41 of the first functional pin 4 corresponding to the metal plating layer 10, the effective bonding between the functional part 41 of the first functional pin 4 and the molding compound 7 can be enhanced. At the same time, the combination of the barb angle 411, the protruding cap tip 412 and the recessed bayonet 413 can further strengthen the bonding strength of the first functional pin 4.

[0072] The depth of the first feed groove 8 located on the adhesive substrate island 3 is ≤ 2 / 3 of the thickness of the adhesive substrate island 3, and the depth of the first feed groove 8 located on the functional part 41 of the first functional pin 4 is ≤ 2 / 3 of the thickness of the functional part 41 of the first functional pin 4.

[0073] Specifically, the width of the opening of the first feeding groove 8 is less than the diameter of the first feeding groove 8, forming a tapered shape. By limiting the depth of the first feeding groove 8, it is ensured that the molding compound 7 forms a golf club shape in the first feeding groove 8 after curing, forming a traction and locking position, thus avoiding the problem of delamination between the molding compound 7 and the frame surface.

[0074] Preferably, the width of the opening of the first feeding groove 8 is >0.07mm, which facilitates the smooth injection of the molding compound during injection molding; the width of the opening of the first feeding groove 8 is preferably 0.08mm, the diameter of the first feeding groove 8 is preferably 0.1mm, and the depth of the first feeding groove 8 is preferably 0.08mm.

[0075] Specifically, the back side of the adhesive substrate island 3 is symmetrically provided with the second feeding groove 9, and the second feeding groove 9 is arranged in the left-right direction. The longitudinal section of the second feeding groove 9 is inverted trapezoidal.

[0076] The depth of the second feed groove 9 is ≤ 2 / 3 of the thickness of the adhesive substrate island 3.

[0077] Specifically, the back side of the adhesive substrate island 3 refers to its lower end face. Preferably, the back side of the adhesive substrate island 3 is provided with two second feeding grooves 9, which are symmetrically arranged. By arranging the second feeding grooves 9 along the left-right direction, the direction of the second feeding grooves 9 is consistent with the injection direction of the molding compound 7, which can effectively improve the filling speed and fullness of the molding compound 7. Furthermore, since the longitudinal section of the second feeding groove 9 is an inverted trapezoid, that is, the width of the groove opening of the second feeding groove 9 is narrower than the internal width, the molding compound 7 entering the second feeding groove 9 forms a constricted shape, effectively enhancing the bonding strength between the back side of the adhesive substrate island 3 and the molding compound 7, preventing delamination caused by thermal expansion and contraction during use, and improving product reliability. It should be noted that the number of second feeding grooves 9 can be one or more, and is not limited to the above-mentioned number.

[0078] Specifically, the width of the opening of the second feeding groove 9 is greater than 0.07 mm to facilitate the smooth injection of the molding compound during injection molding. At the same time, the depth of the second feeding groove 9 is less than or equal to 2 / 3 of the thickness of the adhesive substrate island 3 to ensure the bonding strength between the back of the adhesive substrate island 3 and the molding compound 7. The opening width of the second feeding groove 9 is preferably set to 0.1 mm, the bottom width of the second feeding groove 9 is preferably 0.2 mm, and the depth of the second feeding groove 9 is preferably 0.08 mm.

[0079] Preferably, the inner surfaces of the first feeding groove 8 and the second feeding groove 9 are both frosted surfaces.

[0080] By setting the inner surfaces of both the first feed groove 8 and the second feed groove 9 to rough frosted surfaces, the bonding strength between the molding compound 7 and the first feed groove 8 and the second feed groove 9 can be enhanced after the molding compound 7 enters the first feed groove 8 and the second feed groove 9 and is cured.

[0081] A fabrication process for a packaged device, using the aforementioned high-bonding-strength lead frame, includes the following steps:

[0082] Step S1, die bonding: Apply die bonding material to the die bonding base islands, place the chip on the die bonding material position corresponding to the frame unit, and cure after all frame units are bonded;

[0083] Step S2, Bonding: Use leads to connect the bonding area of ​​the chip to the corresponding pins of the frame unit;

[0084] Step S3, molding: The product to be produced in step S2 is encapsulated with a polymer molding compound, cured, and then demolded.

[0085] Step S4, Thermal Aging: The plastic-sealed product undergoes a thermal aging reaction;

[0086] Step S5, Deoxidation and Brightening: Deposit a tin layer on the pins;

[0087] Step S6, Forming / Separation: The electronic device products formed after the above steps are formed / separated under the stamping of a forming mold to obtain a single packaged device.

[0088] Specifically, the fabrication process of the packaged device is as follows:

[0089] like Figure 2 As shown, in step S1, die bonding: using a die bonding machine, die bonding material (such as die bonding silver paste, insulating glue, or solder paste) is applied to the die bonding base island 3 by extrusion or dipping. The die bonding machine picks up the chip 20 from the blue film and places the chip 20 on the corresponding die bonding material position in the frame unit 2. After the entire batch of die bonding is completed, high-temperature continuous curing is carried out in the oven. The curing temperature is set to a maximum of 160℃-180℃, the optimal temperature is set to 175±5℃, and the curing time is 3 hours±10 minutes.

[0090] Step S2, Bonding: According to the design output and connection method, use leads 30 (such as gold wire, copper wire, or palladium-copper alloy wire) to connect the bonding area of ​​chip 20 to the corresponding pins of frame unit 2. The connection of leads 30 is as follows: Figure 2 As shown, the welding method can specifically adopt the normal mode, the BSOB mode, the reverse mode, the reinforcement line and other connection modes;

[0091] Step S3, Molding: Using an injection mold, the pressure, temperature and injection time of the injection molding equipment are controlled to melt the polymer molding compound cylinder at a high temperature. The molding compound 7 is injected into the molding cavity by injection pressure to encapsulate the product to be produced in step S2 with polymer molding compound. After curing, it is demolded.

[0092] Step S4, Thermal Aging: The molded product is subjected to a thermal aging reaction to more effectively cure the internal molding compound and release the internal molding stress. The thermal aging temperature is 170±5℃ and the thermal aging time is 300±10 minutes.

[0093] Step S5, Deoxidation and Brightening: Using chemical replacement, a uniform and dense tin layer is deposited on the pins. The thickness of the tin layer is controlled at 7-15μm, so that the functional pins of the product have good solderability and conductivity after molding.

[0094] Step S6, Forming / Separation: The electronic device products formed after the above steps are formed / separated under the stamping of the forming mold. The first functional pin 4 and the second functional pin 5 are bent into solder leads by the mold; while the fixed pin 6 is cut off at the outer edge of the molding compound through the neck bayonet 61 to form a single electronic device.

[0095] Step S7: After the packaged devices have been molded and separated, test them according to the requirements of the FT test specifications, and separate qualified products from defective products according to the internal control standards. Then, print, tape, and package the usable products.

[0096] A packaged device, manufactured using the manufacturing process of the packaged device.

[0097] Although embodiments of the invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A high bonding strength lead frame, characterized by, It includes a frame body and frame units spaced apart from the frame body, the frame unit including a substrate island, a first functional pin, a second functional pin, and a fixed pin; The first functional pins are symmetrically distributed on the left and right sides of the adhesive substrate island, and one end of the first functional pin is connected to the frame body, while the other end of the first functional pin is located on the upper or lower side of the adhesive substrate island. One end of the second functional pin is connected to the frame body, and the other end of the second functional pin is connected to the rear end of the adhesive substrate island. One end of the fixed pin is connected to the frame body, and the other end of the fixed pin is connected to the front end of the adhesive substrate island. The first functional pin includes a functional part for encapsulating within the molding compound and a bent part located outside the molding compound. The left and right sides of the functional part are respectively provided with barbed corners and protruding cap tips. The surface of the adhesive substrate island and the back of the functional part of the first functional pin are both provided with a first feeding groove, and the back of the adhesive substrate island is provided with a second feeding groove; the inner surfaces of the first feeding groove and the second feeding groove are both frosted surfaces. Both the barb and the protruding tip are located on the side of the functional part closer to the bending part, and the barb is located on the side of the functional part away from the adhesive substrate island, while the protruding tip is located on the side of the functional part closer to the adhesive substrate island. The functional part is further provided with a recessed notch on the side away from the bending part, and the recessed notch is located on the side edge of the functional part away from the adhesive substrate island.

2. The high bonding strength lead frame according to claim 1, wherein, The connection between the fixed pin and the adhesive substrate island is provided with a neck retainer that is recessed towards the inside of the fixed pin.

3. The high bonding strength lead frame according to claim 1, characterized in that, The surface of the functional part of the first functional pin and the surface of the junction between the adhesive substrate island and the fixed pin are both provided with a metal plating layer; The surface of the adhesive substrate island is provided with the first feeding groove on the left and right sides of the metal plating layer, and the functional part of the first functional pin is provided with the first feeding groove on the back side of the metal plating layer.

4. The high bonding strength lead frame according to claim 3, characterized in that, The first feeding groove is spherical in shape, and the width of the opening of the first feeding groove is less than the diameter of the first feeding groove. The depth of the first feed groove located on the adhesive substrate island is ≤ 2 / 3 of the thickness of the adhesive substrate island, and the depth of the first feed groove located on the functional part of the first functional pin is ≤ 2 / 3 of the thickness of the functional part of the first functional pin.

5. The high bonding strength lead frame according to claim 1, characterized in that, The back side of the adhesive substrate island is symmetrically provided with the second feeding groove, and the second feeding groove is arranged in the left-right direction. The longitudinal section of the second feeding groove is inverted trapezoidal. The depth of the second feed groove is ≤ 2 / 3 of the thickness of the adhesive substrate island.

6. A fabrication process for a packaged device, characterized in that, Using the high bonding strength lead frame as described in any one of claims 1 to 5, the method includes the following steps: Step S1, die bonding: Apply die bonding material to the die bonding base islands, place the chip on the die bonding material position corresponding to the frame unit, and cure after all frame units are bonded; Step S2, Bonding: Use leads to connect the bonding area of ​​the chip to the corresponding pins of the frame unit; Step S3, molding: The product to be produced in step S2 is encapsulated with a polymer molding compound, cured, and then demolded. Step S4, Thermal Aging: The plastic-sealed product undergoes a thermal aging reaction; Step S5, Deoxidation and Brightening: Deposit a tin layer on the pins; Step S6, Forming / Separation: The electronic device products formed after the above steps are formed / separated under the stamping of a forming mold to obtain individual packaged devices.

7. A packaged device, characterized in that, It is manufactured using the packaging device fabrication process as described in claim 6.

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