Abnormality determination system and abnormality determination method for plasma processing

Abstract

The disclosed abnormality determination system comprises: a plasma processing device, which is capable of processing multiple workpieces at a time based on a process; a sensor, which obtains at least one monitoring data related to the workpieces and the plasma processing device during plasma processing; a storage unit, which stores a threshold value set according to a first processing method including the number and type of workpieces; and a determination unit, which determines whether there is an abnormality in the plasma processing based on the monitoring data and the threshold value.

Description

Technical Field

[0001] The present invention relates to an abnormality determination system and an abnormality determination method for plasma processing. Background Art

[0002] In the semiconductor manufacturing process, plasma processing technology is known to use plasma to modify and clean the surface of wafers and substrates. In order to perform appropriate plasma processing, Patent Document 1 teaches monitoring the potential change induced by the change of plasma discharge and determining whether there is abnormal discharge based on the potential change.

[0003] Prior Art Literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2009-135253 Summary of the invention

[0006] -Problems to be solved by the invention-

[0007] In plasma processing for the purpose of surface modification and cleaning of wafers and substrates, multiple or multiple types of workpieces are sometimes processed at one time in order to improve productivity. Depending on the number and type of workpieces, the impedance in the high-frequency circuit of the plasma processing device changes. Furthermore, in the abnormality occurrence mechanism of plasma processing, various factors such as the material, shape, moisture absorption state of the workpiece, and contamination of the plasma processing device will be affected. Therefore, it is extremely difficult to determine the abnormality of plasma processing with high accuracy.

[0008] -Methods for solving the problem-

[0009] One aspect of the present invention relates to an abnormality determination system for plasma processing, comprising: a plasma processing device capable of processing multiple workpieces at a time based on a process; a sensor that obtains at least one monitoring data related to the workpieces and the plasma processing device during plasma processing; a storage unit that stores a threshold value set based on a first processing method including the number and type of the workpieces; and a determination unit that determines whether there is an abnormality in the plasma processing based on the monitoring data and the threshold value.

[0010] Another aspect of the present invention relates to an abnormality determination system for plasma processing, comprising: a plasma processing device capable of processing multiple workpieces at a time based on a process; a sensor that obtains at least one monitoring data related to the workpieces and the plasma processing device during plasma processing; a storage unit that stores a monitoring history corresponding to the monitoring data and obtained by the sensor during plasma processing performed in the past in the same processing method as a first processing method including the number and type of the workpieces subjected to plasma processing; and a determination unit that determines whether there is an abnormality in the plasma processing based on a difference between the monitoring data and the monitoring history.

[0011] Another aspect of the present invention relates to a method for determining an abnormality in plasma processing, comprising: a plasma processing step, performing plasma processing on a workpiece using a plasma processing device capable of processing multiple workpieces at a time; a monitoring data acquisition step, acquiring at least one monitoring data related to the workpiece and the plasma processing device during plasma processing; and a determination step, determining whether there is an abnormality in the plasma processing based on the monitoring data and a threshold value set according to a first processing method including the number and type of the workpiece.

[0012] Another aspect of the present invention relates to a method for determining an abnormality in plasma processing, comprising: a plasma processing step of performing plasma processing on a workpiece using a plasma processing device capable of processing multiple workpieces at a time; a monitoring data acquisition step of acquiring at least one monitoring data related to the workpiece and the plasma processing device during the plasma processing; a calculation step of calculating a difference between monitoring histories corresponding to the monitoring data and obtained in a plasma processing performed in the past in the same processing method as a first processing method including the monitoring data and the number and type of the workpieces subjected to the plasma processing; and a determination step of determining whether there is an abnormality in the plasma processing based on the difference.

[0013] -Effects of the Invention-

[0014] According to the present invention, the accuracy of abnormality determination is improved.

[0015] Although the novel features of the present invention are described in the appended claims, the present invention both in terms of structure and content will be further understood through the following detailed description together with other objects and features of the present invention and with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a flowchart showing the relationship between the flow of plasma processing according to the embodiment of the present invention and the types of acquired monitoring data.

[0017] Figure 2 This is a block diagram showing an example of the configuration of a first abnormality determination system according to an embodiment of the present invention.

[0018] Figure 3 This is a flowchart showing an example of a first abnormality determination method according to an embodiment of the present invention.

[0019] Figure 4 This is a flowchart showing another example of the first abnormality determination method according to the embodiment of the present invention.

[0020] Figure 5 This is a flowchart showing still another example of the first abnormality determination method according to the embodiment of the present invention.

[0021] Figure 6 This is a flowchart showing still another example of the first abnormality determination method according to the embodiment of the present invention.

[0022] Figure 7 This is a flowchart showing an example of the second abnormality determination method according to the embodiment of the present invention.

[0023] Figure 8 This is a flowchart showing another example of the second abnormality determination method according to the embodiment of the present invention.

[0024] Fig. 9 This is a flowchart showing still another example of the second abnormality determination method according to the embodiment of the present invention.

[0025] Fig.10 This is a flowchart showing still another example of the second abnormality determination method according to the embodiment of the present invention. DETAILED DESCRIPTION

[0026] In this embodiment, a threshold value set by a processing method specified by considering the number of workpieces and their types, or data (monitoring history) obtained in plasma processing performed in the past in the same processing method is used in the abnormality determination of the plasma processing. By using a benchmark corresponding to the processing method, the accuracy of determining whether there is an abnormality in the plasma processing (hereinafter sometimes referred to as a processing abnormality) is improved. As a result, the quality of the plasma processing is stabilized and the generation of defective products is suppressed. Moreover, based on this determination, it is easy to grasp the period for maintenance such as cleaning, replacement or repair of components of the plasma processing device. Therefore, the operating rate of the plasma processing device can be improved.

[0027] That is, the first abnormality judgment system of the present embodiment comprises: a plasma processing device, which is capable of processing multiple workpieces at a time based on a process; a sensor, which obtains at least one monitoring data related to the workpiece and the plasma processing device during plasma processing; a storage unit, which stores a threshold value set according to a first processing method including the number and type of workpieces; and a judgment unit, which judges whether there is an abnormality in the plasma processing based on the monitoring data and the threshold value.

[0028] The first abnormality determination method of the present embodiment comprises: a plasma processing step, in which a workpiece is subjected to plasma treatment using a plasma processing device capable of processing a plurality of workpieces at a time; a monitoring data acquisition step, in which at least one monitoring data related to the workpiece and the plasma processing device during the plasma treatment is acquired; and a determination step, in which, based on the monitoring data and a threshold value set according to a first processing method including the number and type of workpieces, a determination is made as to whether there is an abnormality in the plasma treatment.

[0029] The second abnormality determination system of the present embodiment comprises: a plasma processing device that can process multiple workpieces at a time based on a process; a sensor that obtains at least one monitoring data related to the workpieces and the plasma processing device during plasma processing; a storage unit that stores a monitoring history corresponding to the monitoring data and obtained by the sensor in plasma processing performed in the past in the same processing method as the first processing method including the number and type of workpieces subjected to plasma processing; and a determination unit that determines whether there is an abnormality in the plasma processing based on the difference between the monitoring data and the monitoring history.

[0030] The second abnormality determination method of the present embodiment comprises: a plasma processing step, in which a workpiece is subjected to plasma treatment using a plasma processing device capable of processing a plurality of workpieces at a time; a monitoring data acquisition step, in which at least one monitoring data related to the workpiece and the plasma processing device during the plasma treatment is acquired; a calculation step, in which a difference is calculated between the monitoring data and a monitoring history corresponding to the monitoring data, which was acquired in a past plasma treatment performed in the same processing method as a first processing method including the number and type of workpieces subjected to the plasma treatment; and a determination step, in which, based on the difference, a determination is made as to whether there is an abnormality in the plasma treatment.

[0031] (A1) First abnormality determination system

[0032] The abnormality determination system involved in this embodiment includes a plasma processing device, a sensor, a storage unit and a determination unit. The storage unit and the determination unit are, for example, located in a server. The administrator who owns the server and the owner of the plasma processing device (hereinafter sometimes referred to as the device) may be different. The above-mentioned server and the device are connected via a computer network. The server also includes a storage unit, a computing unit, etc. described later.

[0033] (Plasma processing device)

[0034] There is no particular limitation on the plasma processing apparatus as long as it can perform plasma processing on a workpiece. The plasma processing apparatus includes, for example: a reaction chamber; a plasma generating unit that generates plasma in the reaction chamber; a workbench that is disposed inside the reaction chamber and on which a substrate is placed; and a conveying rail that carries the workpiece in and out of the reaction chamber. The plasma generating unit is composed of, for example, electrodes disposed at the upper and lower parts of the reaction chamber, respectively, and a process gas source that supplies a plasma generating gas (process gas) into the reaction chamber. While the process gas is supplied to the reaction chamber, high-frequency power is supplied to each electrode, thereby generating plasma in the reaction chamber.

[0035] In a recipe used in plasma processing, the pressure in a reaction chamber, the type and flow rate of process gas, the output of high-frequency power, the frequency of high-frequency power, processing time, etc. are defined. The recipe is stored in a storage unit.

[0036] (sensor)

[0037] The sensor acquires various data (monitoring data) related to the workpiece and the device during plasma processing. The sensor is installed inside and / or outside the device. The monitoring data related to the workpiece is acquired in real time during the plasma processing, or acquired after the plasma processing. The monitoring data related to the device is acquired in real time during the plasma processing. The monitoring data is stored in the storage unit.

[0038] The monitoring data is not particularly limited, and examples thereof include data related to the transport, such as the driving torque of the transport arm, the load applied to the transport arm, and the moving speed of the transport arm; data related to exhaust characteristics, such as the pressure reached in the reaction chamber, the pressure reduction rate and the time required to reach a given pressure from atmospheric pressure, the pressure increase rate and the time required to reach atmospheric pressure from a given pressure, the flow rate of process gas supplied to the reaction chamber during processing, the pressure in the reaction chamber during processing, and the opening degree of the pressure regulating valve during processing; data related to the discharge state, such as the output of the high-frequency power supply, the processing time, the matching position of the matching device, the load impedance of the matching device, the RF reflected wave and / or incident wave, the self-bias voltage (Vdc), the amplitude of the high-frequency voltage (Vpp), the emission spectrum, and the potential change between the probe electrodes arranged in the reaction chamber (hereinafter sometimes referred to as the plasma monitor waveform).

[0039] The monitoring data also includes data that can be calculated based on data acquired in real time or data acquired after plasma processing. For example, the frequency of voltage changes associated with micro-arc discharges appearing in the plasma monitor waveform is also included in the monitoring data related to the discharge state. The etching rate calculated based on the film thickness of the workpiece measured before and after the plasma treatment is also included in the monitoring data related to the discharge state. The film thickness of the workpiece is measured, for example, by an optical interference film thickness measuring device or a fluorescent X-ray film thickness meter.

[0040] It is sufficient to obtain at least one monitoring data, preferably a plurality of monitoring data. It is preferred to obtain at least data related to the discharge state. As data related to the discharge state, it is preferred to obtain a plasma monitor waveform. It is particularly preferred to obtain at least one data related to the discharge state, and at least one data related to the exhaust characteristics and / or data related to the transport. This is because the accuracy of abnormality determination is further improved, and it is easy to determine the cause of the abnormality.

[0041] (Workpiece)

[0042] The workpiece to be etched is not particularly limited. For example, it may be a substrate used in the manufacture of electronic equipment, a circuit substrate on which a circuit is formed, a mounting substrate on which electronic components are mounted, a wafer, etc. The workpiece is pressed by a transport arm, for example, and slides on a transport rail to be carried into or out of a reaction chamber.

[0043] The number of workpieces processed at one time in the plasma processing device is not particularly limited. One or more workpieces are placed on the workbench. In order to obtain the reference history described later, the plasma processing device is sometimes operated when no workpiece is placed on the workbench. That is, the reference history also includes monitoring data when there are 0 workpieces.

[0044] (First treatment method)

[0045] The first processing method indicates the state of plasma processing on a workpiece (hereinafter referred to as an actual workpiece), including the number and type of the actual workpiece. The number and type of the actual workpiece have a great influence on the above-mentioned monitoring data. Therefore, by using the threshold value set according to the processing method as a reference, the accuracy of abnormality judgment is improved. The first processing method is acquired by the first acquisition unit.

[0046] As a processing method, in addition to the number and type of actual workpieces, the size of the actual workpiece, the batch number, the processing conditions performed before plasma treatment, etc. can also be cited. In the case where a barcode or a two-dimensional code indicating the processing method is attached to the actual workpiece, the above code is read automatically or by an operator in the process of entering or transporting into the plasma processing device. The read code is obtained as a first processing method in the first acquisition unit. The first processing method can be input into the first acquisition unit by the operator, or it can be pre-stored in the storage medium. The first processing method obtained by the first acquisition unit is stored in the storage unit.

[0047] (Storage Department)

[0048] The storage unit stores a threshold value set according to the processing method. The threshold value is set for each monitoring data and is a criterion for determining whether there is a processing abnormality. When the monitoring data deviates from the threshold value, it is determined that there is a processing abnormality.

[0049] The threshold value is set based on data (monitoring history) related to the apparatus and the workpiece acquired when plasma processing was performed in the past using the same first processing method as the actual workpiece, taking into consideration the process evaluation of whether the plasma processing of the workpiece is appropriate.

[0050] The threshold value may also be calculated in the calculation unit. In this case, the monitoring history is stored in the storage unit. When the first processing method is obtained, the calculation unit reads the monitoring history corresponding to the first processing method from the storage unit, and calculates the threshold value using a given algorithm set in consideration of the processing evaluation. The calculated threshold value is stored in the storage unit.

[0051] (Judgment Department)

[0052] The determination unit determines whether or not there is a process abnormality based on the monitoring data and the threshold value. By comparing current data processed in the same processing method with past data, a highly accurate abnormality determination can be made.

[0053] The monitoring data is acquired from the time when the actual workpiece loading operation starts to the time when the actual workpiece unloading operation ends. Figure 1 The process shown is carried out. Figure 1 This is a flowchart showing the relationship between the flow of plasma processing and the types of acquired monitoring data.

[0054] First, the actual workpiece carrying-in action is started (S01). After the actual workpiece is transferred from an external rail disposed outside the plasma processing device to a transport rail disposed inside the plasma processing device, it is pressed and moved by a transport arm on the transport rail. When the actual workpiece is configured at a given position, the carrying-in action is completed (S02), and exhaust in the reaction chamber is started (S03). The reaction chamber is sealed after the actual workpiece is transferred to the transport rail. Exhaust is performed until the actual workpiece carrying-out action begins, and the reaction chamber is depressurized during the plasma processing.

[0055] When the reaction chamber is at a given pressure, the process gas is supplied into the reaction chamber (S04). Then, the high-frequency power supply (S05) is entered to generate plasma. Thus, the actual workpiece is subjected to plasma treatment. After a given period of time, the high-frequency power supply is cut off (S06) and the supply of process gas is stopped (S07). Then, the exhaust is stopped (S08) to raise the pressure in the reaction chamber to atmospheric pressure. Finally, the actual workpiece is started to be carried out (S09). The actual workpiece is pressed and moved on the transport rail by the transport arm in the same manner as when it was carried in. When the actual workpiece is carried out of the plasma processing device, the carrying out action is completed (S10) and the plasma processing is ended.

[0056] During the period from the start (S01) to the end (S02) of the actual workpiece loading operation, the monitoring data related to the above-mentioned transport is acquired. When the reaction chamber is sealed, the pressure in the reaction chamber is acquired. When the exhaust starts (S03), the monitoring data related to the above-mentioned exhaust characteristics is acquired.

[0057] During the period from the start of exhaust ( S03 ) to the stop ( S08 ), in addition to the exhaust characteristics, monitoring data related to the above-mentioned discharge state is acquired.

[0058] Furthermore, from just before the high-frequency power source is turned on ( S05 ) to after it is turned off ( S06 ), a plasma monitor waveform is acquired as monitoring data related to the discharge state.

[0059] The monitoring data related to the above exhaust characteristics are obtained from before the high frequency power is turned off (S06) to when the reaction chamber is opened to the atmosphere. Similarly, the monitoring data related to the above transport is obtained from the start (S09) to the end (S10) of the actual workpiece removal operation.

[0060] The determination unit can also determine whether the cause of the process abnormality is the plasma processing device, the workpiece, or the process. Thus, it is easy to take appropriate measures to deal with the process abnormality, the operating rate is improved, and the quality of the plasma processing is improved.

[0061] The cause of the process abnormality is determined based on the type of monitoring data (hereinafter referred to as NG data) that deviates from the threshold. For example, when the NG data relates to the exhaust characteristics, it is suspected that there is a malfunction of the exhaust pump, a poor sealing of the reaction chamber, contamination in the reaction chamber, etc. Therefore, the cause of the process abnormality in this case is determined to be in the plasma processing device.

[0062] In the case where the NG data is related to the discharge state, it is suspected that the process is not suitable, the inside of the reaction chamber (especially the electrode) is contaminated, the high-frequency power supply is faulty, and the shape and / or condition (for example, the contamination state, the moisture absorption state) of the actual workpiece changes. Therefore, the cause of the processing abnormality in this case is determined to be in the process, a specific part of the plasma processing device (specifically, the high-frequency circuit or the parts inside the reaction chamber) or the actual workpiece.

[0063] When NG data is related to transport, positional deviation of the transport rail, deformation of the workpiece, positional deviation, excessive moisture absorption of the workpiece, contamination of the workpiece sliding surface, etc. are considered. Therefore, the cause of the process abnormality in this case can be determined to be the device or the workpiece.

[0064] By referring to a variety of NG data, the cause of the process abnormality can be further narrowed down. For example, when both the data related to the discharge state and the data related to the exhaust characteristics include NG data, it is highly likely that the cause of the process abnormality is not a malfunction of the device but contamination in the reaction chamber.

[0065] By referring to the monitoring data (hereinafter referred to as OK data) that converges within the threshold value based on the NG data, the cause of the process abnormality can be further narrowed down. For example, when the data related to the discharge state includes NG data, and the data related to the exhaust characteristics includes OK data, it is highly likely that the cause of the process abnormality is not contamination in the reaction chamber, but a failure of a component constituting a device such as a high-frequency power supply or a change in the actual workpiece condition.

[0066] In determining the cause of the process abnormality, in addition to the type of NG data, monitoring data (reference history) obtained from plasma processing in the past performed in a second processing method with the same type of workpiece as the actual workpiece and only a different number of processed pieces can also be used. In this way, it can be determined whether the cause of the process abnormality lies in the workpiece. The reference history is stored in a storage unit, for example.

[0067] In the NG data, when the frequency and degree of abnormalities in the monitoring data are not significantly different from the frequency and degree of abnormalities in the reference history, it can be said that the processing abnormality does not depend on the number of workpieces. In other words, it can be determined that the cause of the processing abnormality lies in the plasma processing device or the process. On the other hand, in the NG data, when the frequency and degree of abnormalities in the monitoring data are significantly different from the frequency and degree of abnormalities in the reference history, it can be said that the processing abnormality depends on the number of workpieces. In other words, it can be determined that the cause of the processing abnormality lies in the workpiece. The determination criterion of whether the processing abnormality depends on the number of workpieces is appropriately set according to the NG data.

[0068] The determination unit can further determine whether to stop the plasma processing based on the type of NG data. For example, if the NG data includes data related to transport, if the plasma processing is continued, the plasma processing device or the workpiece may be damaged. Therefore, in such a case, the plasma processing is stopped.

[0069] In other cases, even if it is determined that there is a process abnormality, the plasma treatment can be continued. However, the process change is studied so that the desired plasma treatment can be performed. In the case where the plasma treatment can be normalized by changing the process, the determination unit determines that the process change is necessary. For example, in the case where the NG data is the decompression speed in the reaction chamber, the calculation unit generates a new process with different set values ​​of the exhaust time and the pressure when the high-frequency power is turned on. A given algorithm is used in the generation of the process.

[0070] The new recipe is stored in the storage unit and fed back to the plasma processing device. The actual workpiece is processed based on the new recipe.

[0071] Whether the process needs to be changed can also be determined by considering the tracking results (evaluation information) of whether the actual workpiece has been properly subjected to plasma treatment. As a result, the accuracy of the determination of whether a process change is needed is improved. In the case where the actual treatment is evaluated to be appropriate, even if it is determined that there is a process abnormality, it is determined that there is no need to change the process. On the other hand, in the case where the actual treatment is evaluated to be inappropriate and the plasma treatment is normalized by changing the process, it is determined that the process needs to be changed. In the latter case, a new process is generated and fed back to the plasma processing device.

[0072] When the plasma processing cannot be normalized by changing the process, or the changed process is out of the changeable range, it is determined that the process change is not necessary. In this case, the determination unit can determine whether the plasma processing device needs maintenance. Whether maintenance is required is also determined based on the type of NG data. For example, when the NG data includes data related to the discharge state, the determination unit determines that maintenance is required.

[0073] Whether maintenance is required can also be determined by considering the above-mentioned evaluation information. As a result, the accuracy of determining whether maintenance is required is improved. In the case where it is evaluated that the actual processing is appropriate, even if it is determined that there is a processing abnormality, it is determined that maintenance is not required. As a result, the maintenance frequency can be reduced and the operating rate can be improved. On the other hand, in the case where it is evaluated that the actual processing is inappropriate, it is determined that maintenance is required. In the latter case, the operation unit calculates the maintenance period or the progress of the adverse condition, and then specifies the component that has caused the abnormality (hereinafter referred to as the replacement component). A given algorithm is used in the calculation of the maintenance period, etc. As a result, maintenance can be performed at the optimal time, which can improve the operating rate.

[0074] The determination unit may also be made to determine whether a threshold value needs to be changed. Whether the threshold value needs to be changed is determined based on the above-mentioned evaluation information. For example, although it is determined that there is no processing abnormality, in a case where the actual processing is evaluated to be inappropriate, the threshold value is changed to make a stricter condition. On the contrary, in a case where the actual processing is evaluated to be appropriate although it is determined that there is a processing abnormality, the threshold value is changed to relax the condition. As a result, the frequency of the device stopping due to abnormal determination is reduced, the operating rate is improved, and the accuracy of abnormal determination is further improved. The new threshold value is generated by the operation unit and stored in the storage unit. The determination of the processing abnormality is performed based on the new threshold value.

[0075] (Notification Department)

[0076] The notification unit notifies that the plasma processing apparatus needs maintenance.

[0077] The notification unit, for example, includes a display unit for displaying the maintenance period, etc., or a signal output unit for transmitting the maintenance period, etc. to the upper system. The notification unit notifies the maintenance period, etc. to the server manager or the owner or operator of the device based on the display or output signal. The notification unit can be provided in the plasma processing device, or can be provided in a server provided with a determination unit. Upon receiving the maintenance notification, the owner or operator of the device cleans the reaction chamber, or replaces a component, etc. Thus, the plasma processing device can be maintained in advance, and the operation rate is improved.

[0078] (Order Department)

[0079] The abnormality determination system may also include an ordering unit for automatically ordering replacement parts. For example, the ordering unit notifies the maintenance period, etc., and orders replacement parts. This enables predictive maintenance of the plasma processing device, thereby improving the operating rate.

[0080] (Second acquisition part)

[0081] The above-mentioned evaluation information is obtained by the acquisition unit (second acquisition unit). The evaluation information can be obtained by analyzing the workpiece just after the plasma treatment, or by analyzing the workpiece after other processes are performed after the plasma treatment. The evaluation information can also be obtained by analyzing the frequency of defects caused by the workpiece after other processes (for example, poor wire bonding). As the process after the plasma treatment, for example, wire bonding, reflow, molding, and resin coating can be cited. The evaluation information is input into the second acquisition unit by an operator, for example. The input evaluation information is stored in the storage unit.

[0082] In the past, there was no specific benchmark for quantitatively evaluating the adverse conditions such as contamination and degradation of plasma processing equipment. Therefore, the quality management and maintenance of plasma processing equipment are carried out by regularly performing maintenance such as cleaning and component replacement. However, the contamination of plasma processing equipment depends largely on the workpiece being processed and the processing conditions, and the equipment will also change and deteriorate over the years. Therefore, there are cases where regular maintenance is not in time and processing abnormalities occur. Most of the processing abnormalities are discovered by the occurrence of adverse conditions in the subsequent processes such as those described above. That is, the period from the occurrence of the processing abnormality to the identification of the processing abnormality is long, and the yield rate is likely to decrease. In addition, the response is actually carried out after the adverse condition occurs in the device, so the maintenance cost increases, or the operation stop period is likely to be prolonged. On the other hand, by performing unnecessary regular maintenance, the operating rate of the device is sometimes reduced. According to this embodiment, since maintenance can be performed at an appropriate time, or replacement parts can be prepared at an appropriate time, it is easy to establish a production plan, and the cost and period are reduced.

[0083] Figure 2 This is a block diagram showing an example of the configuration of the abnormality determination system according to the present embodiment.

[0084] The first abnormality determination system 1000 includes a plasma processing apparatus 100, a sensor 200, a first acquisition unit 300, a server 400, a second acquisition unit 500, a notification unit 600, and an ordering unit 700. The server 400 includes a determination unit 401, a storage unit 402, and a calculation unit 403. The storage unit 402 includes a first database for storing processing methods, a second database for storing threshold values, a third database for storing processes, a fourth database for storing monitoring data, and a fifth database for storing evaluation information. The storage unit 402 may also include a sixth database for storing monitoring history and a seventh database for storing allowable values.

[0085] The plasma processing device 100 performs plasma processing on the actual workpiece based on the process stored in the third database. The sensor 200 obtains the plasma processing device 100 and the monitoring data related to the workpiece during the plasma processing in real time. The monitoring data is stored in the fourth database. The first acquisition unit 300 obtains the first processing method including the number and type of actual workpieces. The first processing method is stored in the first database. Threshold values ​​corresponding to various processing methods are stored in the second database. The determination unit 401 reads the threshold value corresponding to the first processing method obtained from the second database, and determines whether there is an abnormality in the plasma processing based on the threshold value and the monitoring data.

[0086] The determination unit 401 also determines whether a process change, a threshold change, a maintenance notification, or a parts order is necessary. In these determinations, evaluation information related to the actual workpiece obtained by the second acquisition unit 500 is sometimes used. When a process change is required, a new process is generated by the operation unit 403. The new process is stored in the third database. When a threshold change is required, a new threshold is generated by the operation unit 403. The new threshold is stored in the second database. When maintenance is required, the operation unit 403 calculates the maintenance period or the progress of the malfunction and specifies replacement parts. The maintenance period, etc. are notified to the administrator of the server 400 or the owner or operator of the plasma processing device through the notification unit 600. The ordering unit 700 orders replacement parts from the manufacturer as needed.

[0087] (A2) First Abnormality Determination Method

[0088] The abnormality determination method according to the present embodiment includes a plasma processing step, a monitoring data acquisition step, and a determination step. The abnormality determination method according to the present embodiment is executed by the first abnormality determination system described above. However, the abnormality determination method according to the present embodiment is not limited thereto.

[0089] The abnormality determination method of this embodiment is described below by being divided into a method A2-1 of performing abnormality determination in real time, a method A2-2 of performing abnormality determination after the plasma processing is completed, a method A2-3 of further performing follow-up evaluation after abnormality determination, and a method A2-4.

[0090] [Method A2-1]

[0091] In this embodiment, abnormality determination is performed in real time during the processing of an actual workpiece, and the determination result is fed back to the plasma processing of the actual workpiece being processed. This improves the yield. Figure 3 This is a flowchart showing an example of the abnormality determination method according to the present embodiment.

[0092] (1) Plasma treatment process

[0093] First, the processing method related to the actual workpiece is obtained by the acquisition unit and stored in the first database. The determination unit reads the threshold value from the second database (S101). Then, the process corresponding to the processing method is read from the third database, and the plasma processing based on the process is started (S102). The plasma processing is performed according to, for example, Figure 1 The process shown is carried out.

[0094] (2) Monitoring data acquisition process

[0095] When the plasma treatment starts, the acquisition of monitoring data based on the sensor starts (S102). The monitoring data is stored in the fourth database. The type of monitoring data acquired and the timing of acquisition are, for example, Figure 1 The monitoring data is acquired until the plasma processing is completed.

[0096] (3) Determination process

[0097] The acquired monitoring data is compared with the threshold value in real time (S103). The comparison between the monitoring data and the threshold value is performed until the plasma processing is completed.

[0098] If the comparison between the monitoring data and the threshold value results in a determination that the plasma processing is normal, the plasma processing is continued. Then, after a given processing time set for the process has elapsed (S104), the plasma processing ends (S105). When the plasma processing ends, the acquisition of the monitoring data also ends (S105).

[0099] On the other hand, when it is determined that the plasma processing is abnormal, the determination unit further determines whether to continue the plasma processing (S106). When it is determined that the plasma processing is to be continued, the plasma processing is continued, and the monitoring data of the sensor is obtained (S102) and the obtained monitoring data is compared with the threshold value (S103) in the same manner as above.

[0100] When it is determined that the plasma processing is not to be continued, the plasma processing is terminated (S105). Thereafter, it may be determined whether the maintenance of the device is required.

[0101] For example, when the monitoring data is compared with the threshold value and the result is that the driving torque of the transport arm exceeds the threshold value, the determination unit determines to stop the plasma processing. After the plasma processing is stopped, the notification unit issues a maintenance notification so that the position of the transport rail is adjusted. The determination unit also determines to stop the plasma processing when the driving torque changes significantly. In this case, in addition to adjusting the position of the transport rail, a maintenance notification is also issued so that the size, deformation, contamination, etc. of the workpiece are checked.

[0102] [Method A2-2]

[0103] This embodiment is the same as the method A2-1 except that abnormality determination is performed after the plasma processing of the actual workpiece is completed and the determination result is fed back to the plasma processing of the workpiece after the actual workpiece. In this case, various processing abnormalities can be handled and the quality of the plasma processing is further improved. Figure 4 This is a flowchart showing an example of the abnormality determination method according to the present embodiment.

[0104] The acquired monitoring data is compared with the threshold value after the plasma treatment is completed (S104). As a result of comparing the monitoring data with the threshold value, when it is determined that there is no abnormality in the plasma treatment (the case where the determination in S104 is "No"), the plasma treatment is completed. On the other hand, when it is determined that there is a treatment abnormality (the case where the determination in S104 is "Yes"), then, it is determined in sequence whether the process needs to be changed (S105) and whether maintenance is required (S106). In the case of changing the process, feedback is provided so that the plasma treatment of the next workpiece is performed based on the new process. In the case of maintenance, a maintenance notification is made through the notification unit, and replacement parts are ordered as needed (S107).

[0105] For example, when the exhaust speed is lower than the threshold value as a result of comparing the monitoring data with the threshold value, the determination unit can determine a maintenance notification for the device. In this case, the maintenance notification is issued to clean the reaction chamber, confirm the operation of the exhaust pump, etc. In addition, when the monitoring data related to the discharge state deviates from the threshold value, the maintenance notification is issued to confirm the operation of components such as the high-frequency power supply and the matching device, etc.

[0106] [Method A2-3]

[0107] In this embodiment, the evaluation information is considered to verify whether the abnormality determination is appropriate. If the abnormality determination is inappropriate, the threshold is changed. This improves the accuracy of the abnormality determination. Figure 5 2 is a flowchart showing an example of an abnormality determination method according to the present embodiment. The steps until abnormality determination are the same as those of the method A2-2.

[0108] After the abnormality determination (S104), the evaluation information is obtained (S105). Next, it is determined whether the abnormality determination corresponds to the evaluation information (S106). In the case where the abnormality determination determines that there is a processing abnormality and the actual processing is also evaluated as inappropriate, the abnormality determination corresponds to the evaluation information and it is determined that the abnormality determination is appropriate.

[0109] On the other hand, in the case where the actual processing is evaluated as appropriate despite the fact that the processing is determined to be abnormal in the abnormality determination, or conversely, in the case where the actual processing is evaluated as inappropriate despite the fact that the processing is determined to be abnormal in the abnormality determination, the abnormality determination does not correspond to the evaluation information. That is, it is determined that the threshold used in the abnormality determination is inappropriate. In this case, the threshold is changed so that the abnormality determination corresponds to the evaluation information (S107). The changed threshold is fed back to the determination unit.

[0110] [Method A2-4]

[0111] In this embodiment, when it is determined that there is a processing abnormality and the actual processing is also evaluated as inappropriate, it is determined in sequence whether a process change and maintenance notification are required. The steps until the abnormality determination are the same as those of Mode A2-2 and Mode A2-3. As a result, more appropriate treatment can be performed, and productivity is further improved. Figure 6 This is a flowchart showing an example of the abnormality determination method according to the present embodiment.

[0112] If it is determined that there is a processing abnormality (S104) and it is evaluated that the actual processing is also inappropriate (S105), it is determined in sequence whether the process needs to be changed (S106) and whether maintenance is required (S107). In the case of changing the process, feedback is given so that the plasma treatment of the next workpiece is performed based on the new process. In the case of maintenance, maintenance notification is issued through the notification unit, and parts are ordered as needed (S108).

[0113] (B1) Second abnormality determination system

[0114] The abnormality judgment system involved in this embodiment replaces the threshold value and uses the monitoring history of the plasma processing device and the workpiece obtained by the sensor to judge whether there is an abnormality in the plasma processing in the past plasma processing performed in the same manner as the first processing method. Other than this, it is the same as the first abnormality judgment system.

[0115] That is, the second abnormality determination system comprises: a plasma processing device that can process multiple workpieces at a time based on a process; a sensor that obtains at least one monitoring data related to the workpieces and the plasma processing device during plasma processing; a storage unit that stores a monitoring history corresponding to the monitoring data obtained by the sensor in a plasma processing performed in the past in the same processing method as the first processing method including the number and type of workpieces subjected to plasma processing; and a determination unit that determines whether there is an abnormality in the plasma processing based on the difference between the monitoring data and the monitoring history.

[0116] The storage unit stores monitoring histories corresponding to various processing methods. When the first processing method is obtained, the calculation unit reads the monitoring history corresponding to the first processing method from the storage unit and calculates the difference with the monitoring data. When the difference is within the range of a preset allowable value, the determination unit determines that there is no processing abnormality. On the other hand, when the above difference exceeds the preset allowable value, the determination unit determines that there is a processing abnormality. The allowable value is set in consideration of the evaluation history of whether the plasma processing in the first processing method in the past is appropriate. The allowable value can also be stored in the storage unit.

[0117] The determination unit is similar to the first abnormality determination system, and can further determine whether the cause of the processing abnormality is the plasma processing device, the workpiece, or the process. The determination is based on the type of monitoring data (hereinafter referred to as NG data) that exceeds the allowable value. The determination steps are the same as the first abnormality determination system.

[0118] The cause of the processing abnormality is further narrowed down by referring to NG data, monitoring data that converges within the allowable value (hereinafter referred to as OK data), or the reference history in the above-mentioned second processing method. The narrowing down procedure is the same as that of the first abnormality determination system.

[0119] In addition, the determination unit can further determine whether to stop the plasma processing, whether to change the process, and whether to issue a maintenance notice. These determinations are made based on the type of NG data and the evaluation information of the actual workpiece. If maintenance is required, the calculation unit calculates the maintenance period or the progress of the defect and specifies the replacement parts.

[0120] The determination unit can also determine whether to change the allowable value. Whether the allowable value needs to be changed is determined based on the evaluation information. For example, in a case where the actual processing is evaluated as inappropriate despite the determination that there is no processing abnormality, the allowable value is changed to be narrower. Conversely, in a case where the actual processing is evaluated as appropriate despite the determination that there is a processing abnormality, the allowable value is changed to be wider. As a result, the frequency of the device stopping due to abnormal determination is reduced, the operating rate is improved, and the accuracy of abnormal determination is further improved. The determination of processing abnormality is based on the new allowable value.

[0121] The second abnormality determination system has Figure 2 The second abnormality determination system 1000 has the same structure as the first abnormality determination system shown in FIG. That is, the second abnormality determination system 1000 includes a plasma processing device 100, a sensor 200, a first acquisition unit 300, a server 400, a second acquisition unit 500, a notification unit 600, and an ordering unit 700. The server 400 includes a determination unit 401, a storage unit 402, and a calculation unit 403. The storage unit 402 includes: a first database for storing processing methods; a third database for storing processes; a fourth database for storing monitoring data; a fifth database for storing evaluation information; a sixth database for storing monitoring history; and a seventh database for storing allowable values. The second abnormality determination system 1000 may also include a second database for storing threshold values.

[0122] The plasma processing device 100 performs plasma processing on the actual workpiece based on the process stored in the third database. The sensor 200 obtains monitoring data related to the plasma processing device 100 and the workpiece during the plasma processing in real time. The monitoring data is stored in the fourth database. The first acquisition unit 300 obtains the processing method including the number and type of the actual workpiece. The processing method is stored in the first database.

[0123] When the processing method and the monitoring data are obtained, the operation unit 403 reads the monitoring history corresponding to the first processing method obtained from the sixth database, and calculates the difference with the monitoring data. The determination unit 401 determines whether there is an abnormality in the plasma processing based on the calculated difference. The calculated difference is set with an allowable value that takes the evaluation history into consideration. When the difference is within the allowable value range, it is determined that there is no processing abnormality.

[0124] The determination unit 401 also determines whether a change in the process, a change in the allowable value, maintenance, or the ordering of parts is necessary. In these determinations, evaluation information related to the actual workpiece obtained by the second acquisition unit 500 is sometimes used. When a process change is required, a new process is generated by the operation unit 403. The new process is stored in the third database. When a change in the allowable value is required, a new allowable value is generated by the operation unit 403. The new allowable value is stored in the seventh database. When maintenance is required, the operation unit 403 calculates the maintenance period or the progress of the defect and specifies replacement parts. The maintenance period, etc. are notified to the administrator of the server 400 or the owner or operator of the plasma processing device through the notification unit 600. The ordering unit 700 orders replacement parts from the manufacturer as needed.

[0125] (B2) Second abnormality determination method

[0126] The abnormality determination method according to the present embodiment is the same as the first abnormality determination system except that abnormality determination is performed using data (monitoring history) related to the device and the workpiece obtained when plasma processing is performed in the first processing method similar to the actual workpiece, instead of the threshold value.

[0127] That is, the second abnormality determination method comprises: a plasma processing step, performing plasma treatment on a workpiece using a plasma processing device capable of processing a plurality of workpieces at a time; a monitoring data acquisition step, acquiring at least one monitoring data related to the workpiece and the plasma processing device during the plasma treatment; a calculation step, calculating the difference between the monitoring data and a monitoring history corresponding to the monitoring data obtained by a sensor during a plasma treatment performed in the past in the same processing method as a first processing method including the number and type of workpieces subjected to the plasma treatment; and a determination step, determining whether there is an abnormality in the plasma treatment based on the difference.

[0128] The abnormality determination method according to the present embodiment is executed by the second abnormality determination system described above. However, the abnormality determination method according to the present embodiment is not limited thereto.

[0129] Below, similarly to the first abnormality determination method, the second abnormality determination method is divided into method B2-1 for performing abnormality determination in real time, method B2-2 for performing abnormality determination after the plasma treatment is completed, method B2-3 for further follow-up evaluation after abnormality determination, and method B2-4 for explanation.

[0130] [Method B2-1]

[0131] In this embodiment, abnormality determination is performed in real time during the processing of an actual workpiece, and the determination result is fed back to the plasma processing of the actual workpiece being processed. This improves the yield. Figure 7 This is a flowchart showing an example of the abnormality determination method according to the present embodiment.

[0132] (1) Plasma treatment process

[0133] First, the first processing method related to the actual workpiece is acquired by the acquisition unit and stored in the first database. The monitoring history corresponding to the first processing method is read from the storage unit (S201). Then, the process corresponding to the processing method is read from the third database, and the plasma processing based on the process is started (S202). The plasma processing is performed according to, for example, Figure 1 The process shown is carried out.

[0134] (2) Monitoring data acquisition process

[0135] When the plasma treatment starts, the acquisition of monitoring data based on the sensor starts (S202). The monitoring data is stored in the fourth database. The type of monitoring data acquired and the timing of acquisition are, for example, Figure 1 The monitoring data is acquired until the plasma processing is completed.

[0136] (3) Calculation process

[0137] The difference between the monitoring data related to the actual workpiece and the monitoring history is calculated (S203).

[0138] (4) Determination process

[0139] It is verified in real time whether the difference between the monitoring data and the monitoring history is within a preset tolerance range. The above verification is performed until the plasma processing is completed.

[0140] If the difference between the monitoring data and the monitoring history is within the allowable range, it is determined that there is no abnormality in the plasma processing (determined as "No" in S204), and the plasma processing is directly continued. Then, after a given processing time set for the process has passed (S205), the plasma processing ends (S206). When the plasma processing ends, the acquisition of the monitoring data also ends (S206).

[0141] On the other hand, when it is determined that the plasma processing is abnormal ("Yes" in S204), the determination unit further determines whether to continue the plasma processing (S207). When it is determined that the plasma processing is to be continued, the plasma processing is continued, and the acquisition of the monitoring data of the sensor (S202) and the calculation of the difference between the acquired monitoring data and the monitoring history (S203) and the verification (S204) are performed in the same manner as described above.

[0142] When it is determined that the plasma processing is not to be continued, the plasma processing is terminated (S206). Thereafter, it may be determined whether the device needs maintenance.

[0143] [Method B2-2]

[0144] This embodiment is the same as mode B2-1 except that abnormality determination is performed after the plasma processing of the actual workpiece is completed and the determination result is fed back to the plasma processing of the workpiece after the actual workpiece. In this case, various processing abnormalities can be handled, and the quality of plasma processing is further improved. Figure 8 This is a flowchart showing an example of the abnormality determination method according to the present embodiment.

[0145] The difference between the acquired monitoring data and the monitoring history is calculated after the plasma treatment is completed (S204). If the difference between the monitoring data and the monitoring history is within the allowable value range, it is determined that there is no abnormality in the plasma treatment (if the determination in S205 is "No"), and the plasma treatment is completed. On the other hand, when it is determined that there is a treatment abnormality (if the determination in S205 is "Yes"), then, it is determined in turn whether the process needs to be changed (S206) and whether maintenance is required (S207). In the case of changing the process, feedback is provided so that the plasma treatment of the next workpiece is performed based on the new process. In the case of maintenance, maintenance notification is made through the notification unit, and replacement parts are ordered as needed (S208).

[0146] [Method B2-3]

[0147] In this embodiment, the evaluation information is considered to verify whether the abnormality determination is appropriate. If the abnormality determination is inappropriate, the allowable value is changed. As a result, the accuracy of the abnormality determination is improved. The steps until the abnormality determination are the same as those of mode B2-2. Fig. 9 This is a flowchart showing an example of the abnormality determination method according to the present embodiment.

[0148] After the abnormality determination (S205), the evaluation information is obtained (S206). Next, it is determined whether the abnormality determination corresponds to the evaluation information (S207). In the case where the abnormality determination determines that there is a processing abnormality and the actual processing is also evaluated as inappropriate, the abnormality determination corresponds to the evaluation information and is determined to be appropriate.

[0149] On the other hand, in the case where the actual processing is evaluated as appropriate despite the fact that the processing is determined to be abnormal in the abnormality determination, or conversely, in the case where the actual processing is evaluated as inappropriate despite the fact that the processing is determined to be abnormal in the abnormality determination, the abnormality determination does not correspond to the evaluation information. That is, it is determined that the allowable value used in the abnormality determination is inappropriate. In this case, the allowable value is changed so that the abnormality determination corresponds to the evaluation information (S208). The changed allowable value is fed back to the determination unit.

[0150] [Method B2-4]

[0151] In this embodiment, when it is determined that there is a processing abnormality and the actual processing is also evaluated as inappropriate, it is determined in sequence whether process changes and maintenance are required. In this way, more appropriate treatment can be performed and productivity is further improved. The steps until the abnormality determination are the same as those of Mode B2-2 and Mode B2-3. Fig.10 This is a flowchart showing an example of the abnormality determination method according to the present embodiment.

[0152] If it is determined that there is a processing abnormality (S205) and it is evaluated that the actual processing is also inappropriate (S206), it is determined in sequence whether the process needs to be changed (S207) and whether maintenance is required (S208). In the case of changing the process, feedback is given so that the plasma treatment of the next workpiece is performed based on the new process. In the case of maintenance, a maintenance notification is issued through the notification unit, and parts are ordered as needed (S209).

[0153] As mentioned above, although the abnormality determination system and the abnormality determination method according to the present embodiment have been described by citing specific aspects, the abnormality determination system and the abnormality determination method according to the present embodiment are not limited thereto.

[0154] Industrial Applicability

[0155] According to the abnormality determination system and the abnormality determination method of the present invention, the quality of plasma processing is improved, and therefore the abnormality determination system and the abnormality determination method of the present invention are suitable for use in various plasma processing apparatuses.

[0156] The preferred embodiments of the present invention at the present time are described, but such disclosure is not interpreted as limiting. By reading the above disclosure, a person skilled in the art in the art to which the present invention belongs can undoubtedly make various modifications and changes. Therefore, the scope of the attached claims should be interpreted as including all modifications and changes without departing from the actual spirit and scope of the present invention.

[0157] -Explanation of symbols-

[0158] 1000: First abnormality determination system, second abnormality determination system

[0159] 100: Plasma treatment device

[0160] 200: Sensor

[0161] 300: First Acquisition

[0162] 400: Server

[0163] 401: Judgment Department

[0164] 402: Storage

[0165] 403: Operation Department

[0166] 500: Second Acquisition Part

[0167] 600: Notification Department

[0168] 700: Order department.

Claims

1. A plasma processing abnormality determination system, comprising: Plasma processing devices that can process multiple workpieces at once based on the process; a sensor that acquires at least one monitoring data related to the workpiece and the plasma processing device during plasma processing; a storage unit that stores a threshold value set according to a first processing method including the number and type of the workpieces; and A determination unit determines whether or not an abnormality exists in the plasma processing based on the monitoring data and the threshold value.

2. The abnormality determination system for plasma processing according to claim 1, wherein: When it is determined that the plasma processing is abnormal, The determination unit further determines whether the process needs to be changed based on the monitoring data deviating from the threshold value.

3. The abnormality determination system for plasma processing according to claim 1, wherein: When it is determined that the plasma processing is abnormal, The determination unit further determines whether maintenance of the plasma processing apparatus is required based on the monitoring data that deviates from the threshold value.

4. The abnormality determination system for plasma processing according to claim 3, wherein: The abnormality determination system for plasma processing further comprises a notification unit. The notification unit notifies the plasma processing apparatus to perform maintenance when the maintenance is required.

5. The abnormality determination system for plasma processing according to claim 3, wherein: The abnormality determination system for plasma processing further comprises an ordering unit. When the maintenance is required, the ordering unit orders a component of the plasma processing device in which an abnormality has occurred.

6. The abnormality determination system for plasma processing according to claim 1, wherein: When it is determined that the plasma processing is abnormal, The determination unit further determines whether to stop the plasma processing based on the monitoring data deviating from the threshold value.

7. The abnormality determination system for plasma processing according to claim 1, wherein: When it is determined that the plasma processing is abnormal, The determination unit further determines whether the cause of the abnormality in the plasma processing is the workpiece based on the monitoring data deviating from the threshold and a reference history obtained by the sensor and corresponding to the monitoring data in a plasma processing performed in the past in a second processing method with a different number of workpieces compared to the first processing method.

8. The abnormality determination system for plasma processing according to any one of claims 1 to 7, wherein: The abnormality determination system for plasma processing further includes an acquisition unit that acquires evaluation information on whether the plasma processing on the workpiece is appropriate after the plasma processing.

9. The abnormality determination system for plasma processing according to claim 8, wherein: The determination unit further determines whether the threshold value needs to be changed based on the evaluation information.

10. A plasma processing abnormality determination system, comprising: Plasma processing devices that can process multiple workpieces at once based on the process; a sensor that acquires at least one monitoring data related to the workpiece and the plasma processing device during plasma processing; a storage unit storing a monitoring history corresponding to the monitoring data and acquired by the sensor in a plasma process performed in the past in the same processing method as the first processing method including the number and type of the workpieces subjected to the plasma process; and A determination unit determines whether or not an abnormality exists in the plasma process based on a difference between the monitoring data and the monitoring history.

11. The abnormality determination system for plasma processing according to claim 10, wherein: When it is determined that the plasma processing is abnormal, The determination unit further determines whether the process needs to be changed based on the monitoring data exceeding a preset allowable value for the difference.

12. The abnormality determination system for plasma processing according to claim 10, wherein: When it is determined that the plasma processing is abnormal, The determination unit further determines whether maintenance of the plasma processing apparatus is required based on the monitoring data exceeding a preset allowable value for the difference.

13. The abnormality determination system for plasma processing according to claim 12, wherein: The abnormality determination system for plasma processing further comprises a notification unit. The notification unit notifies the plasma processing apparatus to perform maintenance when the maintenance is required.

14. The abnormality determination system for plasma processing according to claim 12, wherein: The abnormality determination system for plasma processing further comprises an ordering unit. When the maintenance is required, the ordering unit orders a component of the plasma processing device in which an abnormality has occurred.

15. The abnormality determination system for plasma processing according to claim 10, wherein: When it is determined that the plasma processing is abnormal, The determination unit further determines whether to stop the plasma processing based on the monitoring data exceeding a preset allowable value for the difference.

16. The abnormality determination system for plasma processing according to claim 10, wherein: When it is determined that the plasma processing is abnormal, The determination unit further determines whether the cause of the abnormality in the plasma processing is the workpiece based on the monitoring data exceeding the pre-set allowable value for the difference and a reference history obtained by the sensor and corresponding to the monitoring data during a plasma processing in the past performed in a second processing method in which the number of workpieces is different from that in the first processing method.

17. The abnormality determination system for plasma processing according to any one of claims 10 to 16, wherein: The abnormality determination system for plasma processing further includes an acquisition unit that acquires evaluation information on whether the plasma processing on the workpiece is appropriate after the plasma processing.

18. The abnormality determination system for plasma processing according to claim 17, wherein: The determination unit further determines whether it is necessary to change the difference by a preset allowable value based on the evaluation information.

19. A method for determining abnormality in plasma processing, comprising: A plasma treatment process, wherein the workpieces are subjected to plasma treatment using a plasma treatment device capable of treating multiple workpieces at a time; a monitoring data acquisition step of acquiring at least one monitoring data related to the workpiece and the plasma processing apparatus during plasma processing; and The determination step determines whether or not an abnormality exists in the plasma processing based on the monitoring data and a threshold value set according to a first processing method including the number and type of the workpieces.

20. A method for determining abnormality in plasma processing, comprising: A plasma treatment process, wherein the workpieces are subjected to plasma treatment using a plasma treatment device capable of treating multiple workpieces at a time; A monitoring data acquisition step of acquiring at least one monitoring data related to the workpiece and the plasma processing device during plasma processing; a calculation step of calculating a difference between the monitoring data and a monitoring history corresponding to the monitoring data and obtained in a plasma process performed in the past in the same processing mode as the first processing mode including the number and type of the workpieces subjected to the plasma process; as well as The determining step determines whether or not an abnormality exists in the plasma processing based on the difference.

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