laser

Abstract

The present application discloses a laser, which belongs to the field of optoelectronic technology. The laser includes: a base plate, and side walls, multiple light-emitting chips and multiple collimating lenses located on the base plate, the side walls surround the multiple light-emitting chips and the multiple collimating lenses; a light outlet is provided on the side wall, and a plurality of steps with increasing heights in the direction away from the light outlet are provided in the area surrounded by the side walls on the base plate, and the multiple light-emitting chips are respectively distributed on the surfaces of the multiple steps away from the base plate; the multiple light-emitting chips correspond one-to-one to the multiple collimating lenses, and each light-emitting chip and the corresponding collimating lens are located on the surface of the same step away from the base plate; the light-emitting chip is used to emit laser light to the corresponding collimating lens, and the laser light is collimated by the collimating lens and then emitted to the light outlet. The present application solves the problem that the preparation process of the laser is relatively complicated. The present application is used for emitting light.

Description

Technical Field

[0001] The present application relates to the field of optoelectronic technology, and in particular to a laser. Background Art

[0002] With the development of optoelectronic technology, lasers are widely used and the requirements for miniaturization of lasers are becoming increasingly higher.

[0003] like Figure 1 As shown, in the related art, a laser 00 includes a housing 001, multiple light-emitting components 002, a sealing cover 003, a light-transmitting sealing layer 004, and a collimating lens assembly 005. The collimating lens assembly 005 includes multiple collimating lenses T corresponding one-to-one with the multiple light-emitting components 002. Specifically, the housing 001 includes a base plate 0011 and an annular sidewall 0012 fixed to the base plate 0011. The light-emitting components 002 are located on the base plate 0011 and surrounded by the sidewall 0012. The sealing cover 003 is located on the side of the sidewall 0012 away from the base plate 0011. The light-transmitting sealing layer 004 and the collimating lens assembly 005 are located on the side of the sealing cover 003 away from the housing 001. Each light-emitting component 002 includes a light-emitting chip 0021, a heat sink 0022 and a reflective prism 0023. The heat sink 0022 is mounted on the base plate 0011, and the light-emitting chip 0021 is mounted on the heat sink 0022. The light-emitting chip 0021 emits a laser toward the reflective prism 0023. After being reflected on the reflective prism 0023, the laser passes through the light-transmitting sealing layer 004 and the collimating lens group 005 in sequence and is emitted, thereby realizing the light emission of the laser.

[0004] However, the laser in the related art includes many structures, and each structure needs to be fixed through a fixing process, so the preparation process of the laser is relatively complicated. Summary of the Invention

[0005] This application provides a laser that can solve the problem of a relatively complicated laser preparation process. The laser includes:

[0006] a bottom plate, and side walls, a plurality of light-emitting chips, and a plurality of collimating lenses located on the bottom plate, wherein the side walls surround the plurality of light-emitting chips and the plurality of collimating lenses;

[0007] The side wall is provided with a light outlet, and a plurality of steps with increasing heights in a direction away from the light outlet are provided in an area of ​​the base plate surrounded by the side wall, and the plurality of light-emitting chips are respectively distributed on the surfaces of the plurality of steps facing away from the base plate; the plurality of light-emitting chips correspond one-to-one to the plurality of collimating lenses, and each of the light-emitting chips and the corresponding collimating lens are located on the same step on the surface facing away from the base plate; the light-emitting chip is used to emit a laser to the corresponding collimating lens, and the laser is collimated by the collimating lens and then emitted toward the light outlet.

[0008] The beneficial effects of the technical solution provided by this application include at least:

[0009] In the laser provided in this application, a plurality of steps of increasing height are provided in the area of ​​the base plate surrounded by the sidewalls, moving away from the light outlet. The light-emitting chip and the corresponding collimating lens are located on the surface of the steps facing away from the base plate, and the laser light emitted by the light-emitting chip can be directly directed through the corresponding collimating lens toward the light outlet, thereby achieving laser light emission. Compared to lasers in related technologies, the laser in this application does not need to include a reflective prism, so the laser includes fewer structures, the laser structure fixing steps are fewer, and the laser manufacturing process is relatively simple. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0011] Figure 1 It is a structural diagram of a laser provided by related technology;

[0012] Figure 2 This is a schematic structural diagram of a laser provided in an embodiment of the present application;

[0013] Figure 3 is a schematic structural diagram of another laser provided in an embodiment of the present application;

[0014] Figure 4 1 is a schematic structural diagram of another laser provided in an embodiment of the present application;

[0015] Figure 5 This is a schematic structural diagram of another laser provided in an embodiment of the present application;

[0016] Figure 6 is a schematic structural diagram of a laser provided in another embodiment of the present application;

[0017] Figure 7 is a schematic structural diagram of another laser provided in another embodiment of the present application;

[0018] Figure 8 This is a schematic structural diagram of yet another laser provided in another embodiment of the present application. DETAILED DESCRIPTION

[0019] In order to make the objectives, technical solutions and advantages of this application clearer, the implementation methods of this application will be further described in detail below with reference to the accompanying drawings.

[0020] With the development of optoelectronic technology, the application of lasers is becoming more and more extensive. For example, lasers can be used in welding processes, cutting processes, and laser projection. Currently, the requirements for miniaturization and luminous efficiency of lasers are also increasing. The embodiments of the present application provide a laser that can be small in size and has high luminous efficiency.

[0021] Figure 2 is a schematic structural diagram of a laser provided in an embodiment of the present application, Figure 3 is a schematic diagram of the structure of another laser provided in an embodiment of the present application, Figure 2 Can be Figure 3 Schematic diagram of the cross section a-a' in the laser shown. Figure 2 and Figure 3 As shown, the laser 10 may include a base plate 101, a sidewall 102 located on the base plate 101, a plurality of light-emitting chips 103, and a plurality of collimating lenses 104. The sidewall 102 may surround the plurality of light-emitting chips 103 and the plurality of collimating lenses 104, and the sidewall 102 has an opening on a side away from the base plate 101. The structure composed of the base plate 101 and the sidewall 102 may be referred to as a tube shell.

[0022] The side wall 102 has a light outlet K. The area on the bottom plate 101 surrounded by the side wall 102 is provided with a direction away from the light outlet K (i.e. Figure 2 The height direction of the step J is also the direction perpendicular to the bottom plate 101 (e.g., the direction opposite to the x direction in FIG. 1 ). Figure 2 The height of step J refers to the distance between the base plate 101 and the surface of step J facing away from the base plate 101. The light-emitting chips 103 in the laser 10 can be respectively distributed on the surface of the multiple steps J facing away from the base plate 101. The multiple light-emitting chips 103 in the laser 10 can correspond one to one with the multiple collimating lenses 104. Each light-emitting chip 103 and the corresponding collimating lens 104 can be located on the surface of the same step J facing away from the base plate 101. The arrangement direction of each light-emitting chip 103 and the corresponding collimating lens 104 can be parallel to the arrangement direction of each step (that is, the x direction). The surface of step J facing away from the base plate 101 is also the upper surface of step J. The light-emitting direction of the light-emitting chip 103 is parallel to the x-direction. The light-emitting chip 103 is used to emit a laser to the corresponding collimating lens 104. The laser is collimated by the collimating lens 104 and then emitted toward the light outlet K, and then emitted through the light outlet K to realize the light emission of the laser. It should be noted that collimating the laser means converging the laser to a certain extent, so that the divergence angle of the light becomes smaller and closer to parallel light.

[0023] Please continue to refer to Figure 2The collimating lens 104 has a convex surface on the side away from the corresponding light-emitting chip 103. The convex surface is used to realize the collimating function of the collimating lens 104. For example, the collimating lens 104 can have a flat surface and a convex surface, the flat surface is opposite to the convex surface, and the flat surface is closer to the light-emitting chip 103 relative to the convex surface. The light-emitting chip 103 can first emit laser light to the flat surface in the collimating lens 104, and then the laser light can pass through the flat surface to the convex surface. The convex surface can adjust the angle of the incident laser light before emitting it, so that the divergence angle of the laser light emitted from the convex surface is smaller, close to parallel light.

[0024] It should be noted that since the laser emitted by the light-emitting chip is conical light with a certain divergence angle, the longer the optical path of the laser (that is, the distance the laser propagates), the larger the laser spot formed, and the larger the divergence angle of the laser. In the related art, the laser emitted by the light-emitting chip is first reflected on the reflective prism, then passes through the light-transmitting sealing layer, and then is emitted to the collimating lens; the optical path of the laser from the light-emitting chip to the collimating lens is long, the spot formed by the laser on the collimating lens is larger, and the divergence angle of the laser emitted to the collimating lens is larger. Furthermore, in order to improve the luminous efficiency of the laser and realize that all the lasers emitted to the collimating lens are collimated into nearly parallel light, the size of the collimating lens needs to be greater than or equal to the size of the spot formed by the laser on the collimating lens. Therefore, the size of the collimating lens is larger, and therefore the size of the laser will be further increased. For example, in Figure 2 The size of the laser in the x-direction is large. In addition, the reflectivity of the reflecting prism to the laser is less than 1, so in the related art, there will be some loss when the laser is reflected on the reflecting prism, so the luminous efficiency of the laser is low. In addition, in the related art, when the laser provides laser light to the optical system, such as when the laser is used as the light source of the projection device, since the light spot formed by the laser light emitted by the laser is large, the optical system needs to use larger optical elements (such as lenses and reflectors, etc.) to perform subsequent optical path adjustments on the laser light emitted by the laser, so the size of the projection device where the laser is located is large.

[0025] In the embodiment of the present application, the laser light emitted by the light emitting chip can be directly directed to the corresponding collimating lens, and then collimated by the collimating lens before being emitted. Therefore, the distance between the light emitting chip and the collimating lens is shorter. In this way, the spot of the laser light emitted by the light emitting chip on the collimating lens is smaller, and the collimating lens only needs to be smaller in size to ensure that all the laser light emitted by the light emitting chip is collimated before being emitted. The size of the laser can be smaller, such as the laser in Figure 2The dimensions in the x-direction and in the directions perpendicular to the x-direction and y-direction can be smaller. Furthermore, the laser light emitted by the light-emitting chip is emitted directly after passing through the collimating lens, without being reflected on the reflective prism. This avoids the loss of laser light when it is reflected on the reflective prism, avoids waste of laser light, and ensures high optical efficiency of the laser. Furthermore, in the related art, when a laser is used as a light source in a projection device, the spot formed by the laser light emitted by the laser is smaller, so the size of the optical element in the projection device that performs subsequent optical path adjustment of the laser light is smaller, and therefore the size of the projection device in which the laser is located is smaller.

[0026] Optionally, the aperture of the collimating lens in the embodiment of the present application can range from 0.6 mm to 1 mm. The aperture of the collimating lens can be the maximum dimension of the collimating lens in a direction perpendicular to the base plate (e.g., the y-direction), that is, the distance between the end of the collimating lens away from the step on which it is located and the end of the collimating lens closer to the step. If the cross-section of the collimating lens is circular, the aperture of the collimating lens refers to the diameter of the circle, and the cross-section can be perpendicular to the surface of the step on which the collimating lens is located that is away from the base plate.

[0027] In summary, in the laser provided by the embodiments of the present application, a plurality of steps of increasing height are provided in the area surrounded by the sidewalls on the bottom plate, with the height increasing in the direction away from the light outlet. The light-emitting chip and the corresponding collimating lens are located on the surface of the steps facing away from the bottom plate, and the laser light emitted by the light-emitting chip can be directly directed through the corresponding collimating lens toward the light outlet, thereby achieving laser light emission. Compared to lasers in related arts, the laser in the present application does not need to include a reflective prism, so the laser includes fewer structures, the laser structure fixing steps are fewer, and the laser preparation process is relatively simple.

[0028] In the first optional implementation of the side wall, please continue to refer to Figure 3 The sidewall 102 may be a semi-enclosed structure, and the opening of the semi-enclosed structure may be a light outlet of the sidewall 102. The sidewall 102 may semi-enclose each step J in the base plate 101, as well as the light-emitting chip 103 and the collimating lens 104 in the laser. For example, the sidewall 102 may be U-shaped, such that the orthographic projection of the sidewall 102 on the base plate 101 is U-shaped.

[0029] In a second alternative implementation of the sidewall, Figure 4 This is a schematic diagram of the structure of another laser provided in an embodiment of the present application. Figure 2 Can be Figure 4 Schematic diagram of the cross section a-a' in the laser shown. Please refer to Figure 4The side wall 102 may be annular, for example, its orthographic projection on the bottom plate 101 may be annular. For example, the side wall 102 may be a square ring. The side wall 102 may be composed of four walls connected in sequence, three of which are plate-like structures, and the other wall is a structure formed by providing an opening in the central region of the plate-like structure. The opening in the central region of the other wall serves as the light outlet of the side wall 102.

[0030] Please continue to refer to Figures 2 to 4 The laser 10 may further include a plurality of heat sinks 105, wherein the plurality of heat sinks 102 correspond one to one with the plurality of light-emitting chips 103. Each light-emitting chip 103 may be mounted on each step on the base plate 101 through the corresponding heat sink 105, that is, the heat sink 105 is mounted on the step, and the light-emitting chip 103 is mounted on the surface of the heat sink 105 away from the step. Optionally, the thermal conductivity of the heat sink may be relatively large, so that when the light-emitting chip generates heat, the heat can be quickly conducted away, thereby avoiding damage to the light-emitting chip caused by the heat. For example, the material of the heat sink may include one or more of aluminum nitride and silicon carbide. Optionally, the material of the base plate may include one or more of oxygen-free copper and Kovar material. When the material of the base plate includes oxygen-free copper, since the thermal conductivity of oxygen-free copper is also relatively large, the base plate can assist the heat sink in conducting the heat generated by the light-emitting chip.

[0031] In the embodiment of the present application, the base plate 101 and each step J can be integrally formed, and the step J can be a part of the base plate 101. For example, the cubic structure can be machined to obtain the integrally formed base plate and steps. This can ensure the firmness of the base plate 101, prevent the steps J from falling off, and thus ensure the reliability of the laser. Please continue to refer to Figures 2 to 4 The bottom plate 101 may have a bottom surface M, which is the surface of the bottom plate 101 where the sidewall 102 is provided. Each step J protrudes from the bottom surface M. The surface of the step J facing away from the bottom plate 101 may refer to the surface of the step J facing away from the bottom surface M. It should be noted that the two objects are integrally formed, which means that the two objects can be obtained by processing a whole piece of starting material in a single process, the two objects are fixedly connected, and both are partial areas of the starting material.

[0032] Alternatively, the bottom plate 101 and the step J may be independent structures. For example, if the bottom plate 101 is a plate-shaped structure having two parallel larger bottom surfaces and a plurality of smaller side surfaces connecting the two surfaces, the step J may be provided on one bottom surface of the bottom plate, for example, by gluing or welding the step J to the bottom plate 101.

[0033] In an embodiment of the present application, the conditions satisfied by each step in the laser can be that the height difference between two adjacent steps is greater than the height of the light-emitting chip and greater than the height of the collimating lens, so as to avoid the collimating lens and the light-emitting chip on the step close to the light outlet from blocking the laser emitted by the light-emitting chip on the step away from the light outlet. Optionally, the height difference between any two adjacent steps can be equal, or the height difference between adjacent steps can be unequal, which is not limited in the embodiment of the present application. For example, the height difference between any two adjacent steps in the laser can range from 1 mm to 2 mm. Optionally, since there is no other structure between the step closest to the light outlet and the light outlet, there is no other structure that can block the emission of the laser emitted by the light-emitting chip on the step, and the height of the step closest to the light outlet can be less than the height difference between adjacent steps.

[0034] Figure 5 is a schematic structural diagram of another laser provided in an embodiment of the present application, and Figure 5 Can be Figure 2 The top view of the laser is shown rotated 90 degrees counterclockwise. Figure 2 Can be Figure 5 The laser 10 in the embodiment of the present application can be a multi-chip laser diode (MCL) type laser. Figures 2 to 5 , each step J in the laser can be provided with a plurality of light emitting chips 103 and corresponding collimating lenses 104. The plurality of light emitting chips 103 can be arranged in a row, and the plurality of collimating lenses 104 can also be arranged in a row. Optionally, the distance between adjacent light emitting chips on each step can be less than 2.4 mm, for example, the distance range can be 1.5 mm to 2.4 mm, such as 2 mm. The distance between adjacent light emitting chips on each step is also the distance between adjacent light emitting chips in the z direction, which is perpendicular to the z direction. Figure 2 The x-direction and y-direction in the diagram. It should be noted that the light-emitting chip has a light-emitting surface, and the laser emitted by the light-emitting chip is emitted from the light-emitting surface. The center point of the light-emitting surface is the light-emitting center of the light-emitting chip. The distance between the two light-emitting chips described in the embodiment of the present application may refer to the distance between the light-emitting centers of the two light-emitting chips. In the embodiment of the present application, the light-emitting chips and the collimating lenses on each step are arranged in a row as an example. Optionally, the light-emitting chips and the corresponding collimating lenses can also be arranged randomly, or in any other manner, which is not limited in the embodiment of the present application.

[0035] It should be noted that in the related art, since the optical path of the laser from the light-emitting chip to the collimating lens is long and the size of the collimating lens is large, the distance between the light-emitting chips corresponding to each collimating lens is also large. For example, in the related art, the distance between adjacent light-emitting chips in the z direction ranges from 2.4 mm to 3.5 mm, and the distance between adjacent light-emitting chips in the x direction is also large. However, in the embodiment of the present application, the optical path of the laser from the light-emitting chip to the collimating lens is short, and there is basically no need to consider the limitation of the size of the collimating lens on the distance between adjacent light-emitting chips; therefore, the distance between adjacent light-emitting chips in the z direction in the present application (that is, the distance between adjacent light-emitting chips on each step) is smaller than the distance between adjacent light-emitting chips in the z direction in the related art, and the distance between light-emitting chips on adjacent steps in the x direction can also be smaller than the distance between adjacent light-emitting chips in the x direction in the related art. Therefore, the size of the tube shell in the embodiment of the present application can be smaller, which is conducive to the miniaturization of the laser.

[0036] In the embodiment of the present application, four steps J are provided on the base plate 101, and each step is provided with five light-emitting chips 103 and corresponding collimating lenses 104. Optionally, the base plate may be provided with two steps, three steps, five steps, or more steps, and the number of light-emitting chips on each step may be three, four, six, or more. The embodiment of the present application does not limit the number of steps provided on the base plate or the number of light-emitting chips on each step.

[0037] In the embodiment of this application, Figure 5 As shown, the collimating lenses 104 corresponding to the respective light-emitting chips 103 can be independent of each other. Each light-emitting chip and the corresponding collimating lens are fixed at a pre-set position, thereby achieving a good collimating effect of the collimating lens on the laser light emitted by the corresponding light-emitting chip. Therefore, the collimating lens can be directly positioned and fixed to a specified position on the base plate using a chip placement machine. This eliminates the need for a collimating lens coupling process, reduces the number of laser manufacturing steps, and further simplifies the laser manufacturing process.

[0038] Optionally, Figure 6 This is a schematic diagram of the structure of a laser provided by another embodiment of the present application. Figure 6As shown, the multiple collimating lenses 104 on each step J can also be integrally formed. For example, the multiple collimating lenses formed integrally can be a strip structure, and one side of the strip structure has multiple convex curved surfaces, and the portion where each convex curved surface is located in the strip structure can be used as a collimating lens. In this way, it is only necessary to fix the collimating lens once on each step, and align the position of the light-emitting chip and the collimating lens once. There is no need to align the collimating lens corresponding to each light-emitting chip separately, nor is there a need to perform a separate fixing process for each collimating lens. This can reduce the preparation process of the collimating lens and reduce the complexity of laser preparation. The area used for fixing in the integrally formed collimating lens can be larger, thereby increasing the fixing firmness of the collimating lens. In addition, in the embodiment of the present application, the corresponding collimating lens can be directly positioned for a smaller number of light-emitting chips (such as each light-emitting chip or each row of light-emitting chips). This ensures that each collimating lens has a better collimating effect on the incident light-emitting chip laser. Compared with the related art of using an integrally formed collimating lens group to couple the optical path and then achieve laser collimation, the optical efficiency of the laser is improved and the preparation process of the laser is reduced.

[0039] Optionally, the distance between each light-emitting chip 103 and the corresponding collimating lens 104 is relatively small, such as in the range of 0.1 mm to 0.2 mm. This ensures that each step only needs a relatively small width to accommodate the arrangement of the light-emitting chip and the collimating lens, thereby reducing the size of the base plate and further facilitating the miniaturization of the laser. It should be noted that the width of the step described in the embodiment of the present application refers to the size of the step in the x-direction.

[0040] In an embodiment of the present application, each light-emitting chip in the laser may include a first light-emitting chip and a second light-emitting chip. In the embodiment of the present application, the first light-emitting chip and the second light-emitting chip refer to two different types of chips. For example, the divergence angle of the laser emitted by the first light-emitting chip is greater than the divergence angle of the laser emitted by the second light-emitting chip. In an embodiment of the present application, the aperture of the collimating lens corresponding to the first light-emitting chip may be greater than the aperture of the collimating lens corresponding to the second light-emitting chip. The curvature of the collimating lens corresponding to the first light-emitting chip may be greater than the curvature of the collimating lens corresponding to the second light-emitting chip. The curvature of the collimating lens may refer to the curvature of the convex surface in the collimating lens.

[0041] Since the spot formed by the laser with a larger divergence angle after transmitting the same distance is larger than the spot formed by the laser with a smaller divergence angle, the spot size formed by the laser emitted by the first light-emitting chip on the corresponding collimating lens is larger than the spot size formed by the laser emitted by the second light-emitting chip on the corresponding collimating lens. In the embodiment of the present application, the aperture of the collimating lens corresponding to the first light-emitting chip is larger than the aperture of the collimating lens corresponding to the second light-emitting chip, which can ensure that each collimating lens completely collects the laser emitted by the corresponding light-emitting chip, avoids the waste of laser, and improves the optical efficiency of the laser. Since the greater the curvature in the collimating lens, the better the collimation effect of the light, in the embodiment of the present application, the curvature of the convex arc surface in the collimating lens corresponding to the first light-emitting chip is larger than the curvature of the convex arc surface in the collimating lens corresponding to the second light-emitting chip, which can ensure that the difference in the divergence angle of the laser emitted by each collimating lens is small, thereby ensuring the uniformity of the laser emitted by the laser.

[0042] Optionally, the first light-emitting chip may be a light-emitting chip for emitting red laser light, and the second light-emitting chip may be a light-emitting chip for emitting blue laser light or green laser light, and the divergence angle of the red laser light emitted by the light-emitting chip may be greater than the divergence angle of the blue laser light and the green laser light. In the embodiment of the present application, the first light-emitting chip may be farther away from the light outlet of the side wall relative to the second light-emitting chip, that is, the first light-emitting chip may be located on a step farther away from the light outlet, and the second light-emitting chip may be located on a step closer to the light outlet. Since the first light-emitting chip generates more heat than the second light-emitting chip when emitting laser light, and the height of the step farther away from the light outlet is higher, the higher step has a better heat dissipation effect, and the heat emitted by the first light-emitting chip can be better dissipated through the step where the first light-emitting chip is located, thereby improving the heat dissipation effect of the first light-emitting chip and avoiding the influence of the heat not being able to dissipate quickly on the light-emitting chip. Optionally, in the embodiment of the present application, the light-emitting chips on the same step are used to emit laser light of the same color. As Figure 2 In the sequence from left to right, the light emitting chips 103 on the first two steps J are all used to emit red laser light, the light emitting chips 103 on the third step J are all used to emit blue laser light, and the light emitting chips 103 on the fourth step J are all used to emit green laser light.

[0043] Optionally, the number of first light-emitting chips can be equal to the number of second light-emitting chips. For example, in an embodiment of the present application, the laser may include 10 first light-emitting chips and 10 second light-emitting chips, and 5 of the 10 second light-emitting chips are used to emit blue laser light, and 5 second light-emitting chips are used to emit green laser light. Since laser light emitted by a laser usually requires light mixing to obtain white light, red laser light, green laser light, and blue laser light can be mixed in a ratio of 2:1:1 to obtain white light. Therefore, the number of light-emitting chips used to emit blue laser light can be equal to the number of light-emitting chips used to emit green laser light, and equal to half the number of light-emitting chips used to emit red laser light. Optionally, when the laser light emitted by the laser is required to meet other color requirements, the number of different light-emitting chips can be adjusted accordingly. For example, the number of light-emitting chips used to emit green laser light can be set to be equal to the number of light-emitting chips used to emit red laser light; or light-emitting chips used to emit laser light of other colors can be set. For example, the laser can also include a light-emitting chip used to emit yellow laser light. This is not limited in the embodiment of the present application. In the embodiment of the present application, different light-emitting chips in a laser are used to emit lasers of different colors, that is, the laser is a multi-color laser. Optionally, each light-emitting chip in the laser can also emit lasers of the same color, that is, the laser can be a monochromatic laser.

[0044] Figure 7 This is a schematic diagram of the structure of another laser provided by another embodiment of the present application. Figure 7 As shown, in Figure 2 Based on the laser shown, the laser 10 may further include a sealing assembly 106. The sealing assembly 106 may be L-shaped and may cover the light outlet of the side wall 102 and the opening on the side of the side wall 102 away from the base plate 101. The sealing assembly 106 and the tube shell may form a sealed space, and the light-emitting chip 103 and the collimating lens 104 in the laser 10 are located in the sealed space. Optionally, the sealed space may be filled with an inert gas, such as nitrogen, to protect the light-emitting chip, prevent oxidation of the light-emitting chip, and extend the life of the light-emitting chip.

[0045] In an alternative implementation of the sealing assembly, please continue to refer to Figure 7, the sealing assembly 106 may include an L-shaped sealing frame 1061 and a light-transmitting sealing layer 1062. The sealing frame 1061 may include a first part B1 and a second part B2 connected to each other, the second part B2 having a light-transmitting opening, and the light-transmitting sealing layer 1062 covers the light-transmitting opening. The first part B1 may cover the opening on the side of the side wall 102 away from the bottom plate 102, and the second part B2 and the light-transmitting sealing layer 1062 may cover the light outlet of the side wall 102. The laser emitted by the light-emitting chip 103 can be collimated by the collimating lens 104 and then emitted through the light-transmitting sealing layer 1062, thereby realizing the light emission of the laser. Optionally, the first part B1 and the second part B2 may be integrally formed.

[0046] For example, the edge of the first portion B1 is fixed to the surface of the side wall 102 away from the base plate 101, the edge of the second portion B2 is fixed to the edge of the light outlet in the side wall 102, and the edge of the light-transmitting sealing layer 1062 can be fixed to the edge of the light-transmitting opening of the second portion B2. Optionally, the sealing frame 1061 can be a sheet metal component, and the first portion B1 and the second portion B2 can be fixed to the side wall 102 by parallel sealing. Optionally, the edge of the light-transmitting opening in the second portion B2 can be recessed toward the housing space of the tube shell, and the edge of the light-transmitting sealing layer 1062 can be adhered to the recessed edge area of ​​the second portion B2.

[0047] When the side wall is implemented using the second optional implementation method mentioned above, the sealing assembly may also have another optional implementation method. Figure 8 This is a schematic diagram of the structure of another laser provided by another embodiment of the present application. Figure 8 As shown, the sealing assembly 106 may include a first sealing member 106a, a second sealing member 106b, and a light-transmitting sealing layer 1062. The first sealing member 106a may be a plate-shaped structure, and the second sealing member 106b may be annular. The central region of the second sealing member 106b has a light-transmitting opening, which is covered by the light-transmitting sealing layer 1062. The first sealing member 106a may cover the opening on the side of the sidewall 102 away from the bottom plate 102, and the second sealing member 106b and the light-transmitting sealing layer 1062 may cover the light outlet of the sidewall 102. Optionally, the first sealing member 106a and the second sealing member 106b may be independent of each other.

[0048] For example, the edge of the first sealant 106a is fixed to the surface of the sidewall 102 away from the base plate 101, the outer edge of the annular second sealant 106b is fixed to the edge of the light outlet in the sidewall 102, and the inner edge of the light-transmitting sealing layer 1062 is fixed to the edge of the light-transmitting opening of the second sealant 106b. Optionally, both the first sealant 106a and the second sealant 106b may be sheet metal parts, and the first sealant 106a and the second sealant 106b may be fixed to the sidewall 102 by parallel sealing welding. Optionally, the inner edge of the second sealant 106b may be recessed toward the housing space of the tube shell, and the edge of the light-transmitting sealing layer 1062 may be bonded to the inner edge of the second sealant 106b.

[0049] In the embodiment of the present application, the material of the tube shell can be copper, such as oxygen-free copper, the material of the light-transmitting sealing layer can be glass, and the material of the sealing frame can be stainless steel. It should be noted that copper has a large thermal conductivity coefficient. In the embodiment of the present application, the material of the tube shell is copper, which can ensure that the heat generated by the light-emitting chip arranged on the bottom plate of the tube shell during operation can be quickly conducted through the tube shell, and then dissipated more quickly, avoiding damage to the light-emitting chip due to heat accumulation. Optionally, the material of the tube shell can also be one or more of aluminum, aluminum nitride and silicon carbide. In the embodiment of the present application, the material of the sealing frame can also be other Kovar materials, such as iron-nickel-cobalt alloy or other alloys. The material of the light-transmitting sealing layer can also be other light-transmitting and highly reliable materials, such as resin materials.

[0050] Please continue to refer to Figures 3 to 6 The sidewall 102 may have multiple openings on opposite sides. The laser 10 may also include a plurality of conductive pins 108. These conductive pins 108 may extend through the openings in the sidewall 102 into the housing and be secured to the sidewall 102. The conductive pins 108 may be electrically connected to electrodes of the light-emitting chip to transmit external power to the light-emitting chip, thereby stimulating the light-emitting chip to emit laser light. Optionally, the aperture of the opening may be 1.2 mm, and the diameter of the conductive pins 108 may be 0.55 mm.

[0051] Optionally, in the embodiment of the present application, when assembling the laser, a ring-shaped solder structure (such as a ring-shaped glass bead) can be placed in the opening on the side wall of the tube shell, and the conductive pin can be passed through the solder structure and the opening where the solder structure is located. Then, the side wall is placed on the bottom surface of the base plate, and a ring-shaped silver-copper solder is placed between the base plate and the tube shell. The structure of the base plate, side wall and conductive pin is then placed in a high-temperature furnace for sealing and sintering. After the sealing is sintered and solidified, the base plate, side wall, conductive pin and solder can be integrated into a whole, thereby achieving airtightness at the side wall opening. The light-transmitting sealing layer can also be fixed to the sealing frame, such as by adhering the edge of the light-transmitting sealing layer to the edge of the light-transmitting opening of the sealing frame to obtain a sealing assembly. The light-emitting chip and heat sink assembly, as well as the collimating lens, can then be welded to the step of the base plate. A wire bonding device can then be used to connect gold wires between the conductive pins and the electrodes of the light-emitting chip. After that, the sealing assembly is welded to the side wall using a parallel sealing technique, thus completing the assembly of the laser. It should be noted that the above-mentioned assembly process is only an exemplary process provided in the embodiment of the present application. The welding process used in each step can also be replaced by other processes, and the sequence of each step can also be adjusted accordingly. The embodiment of the present application does not limit this.

[0052] It should be noted that the above embodiments of this application are described using the base plate and side walls of the tube shell as two separate structures that need to be assembled. Optionally, the base plate and side walls can also be formed integrally. This can prevent wrinkles on the base plate due to the different thermal expansion coefficients of the base plate and side walls during high-temperature welding, thereby ensuring the flatness of the base plate, ensuring the reliable placement of the light-emitting chip on the base plate, and ensuring that the light emitted by the light-emitting chip is emitted according to the predetermined emission angle, thereby improving the light-emitting effect of the laser.

[0053] In summary, in the laser provided by the embodiments of the present application, a plurality of steps of increasing height are provided in the area surrounded by the sidewalls on the bottom plate, with the height increasing in the direction away from the light outlet. The light-emitting chip and the corresponding collimating lens are located on the surface of the steps facing away from the bottom plate, and the laser light emitted by the light-emitting chip can be directly directed through the corresponding collimating lens toward the light outlet, thereby achieving laser light emission. Compared to lasers in related arts, the laser in the present application does not need to include a reflective prism, so the laser includes fewer structures, the laser structure fixing steps are fewer, and the laser preparation process is relatively simple.

[0054] It should be noted that in the embodiments of this application, the term "and / or" is merely a description of the association relationship between associated objects, indicating that three possible relationships exist. For example, "A and / or B" can represent: A exists alone, A and B exist simultaneously, or B exists alone. Furthermore, the character " / " in this document generally indicates that the associated objects are in an "or" relationship. The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The term "plurality" refers to two or more, unless otherwise expressly defined. "Substantially" and "approximately" mean that within an acceptable range of error, a person skilled in the art can solve the desired technical problem and substantially achieve the desired technical effect. In the drawings, the dimensions of layers and regions may be exaggerated for clarity. It should be understood that when an element or layer is referred to as being "on" another element or layer, it can be directly on the other element or an intervening layer may exist. Similar reference numerals are used throughout to indicate similar elements.

[0055] The above description is merely an optional embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present application shall be included in the scope of protection of the present application.

Claims

1. A laser, characterized in that: The laser comprises: a bottom plate, and a side wall located on the bottom plate, a plurality of light-emitting chips and a plurality of collimating lenses, wherein the side wall surrounds the plurality of light-emitting chips and the plurality of collimating lenses; The side wall has a light outlet, and the bottom plate is provided with a plurality of steps of increasing height in a direction away from the light outlet in an area surrounded by the side wall, wherein the plurality of light-emitting chips are respectively distributed on surfaces of the plurality of steps facing away from the bottom plate; the plurality of light-emitting chips correspond one-to-one to the plurality of collimating lenses, and each light-emitting chip and the corresponding collimating lens are located on the same step facing away from the bottom plate; the light-emitting chip is used to emit a laser to the corresponding collimating lens, and the laser is collimated by the collimating lens and then emitted toward the light outlet; The plurality of light-emitting chips include: a first light-emitting chip for emitting red laser light, and a second light-emitting chip for emitting blue laser light or green laser light; the first light-emitting chip is farther away from the light outlet than the second light-emitting chip; The divergence angle of the laser light emitted by the first light-emitting chip is greater than the divergence angle of the laser light emitted by the second light-emitting chip; The collimating lens has a convex surface on a side away from the corresponding light-emitting chip, and the curvature of the convex surface of the collimating lens corresponding to the first light-emitting chip is greater than the curvature of the convex surface of the collimating lens corresponding to the second light-emitting chip; The aperture range of the collimating lens is 0.6 mm to 1 mm, and the distance between each light-emitting chip and the corresponding collimating lens is 0.1 mm to 0.2 mm.

2. The laser according to claim 1, characterized in that The side wall is a semi-enclosed structure, and the side wall semi-encloses the plurality of light-emitting chips and the plurality of collimating lenses. The light outlet is an opening of the semi-enclosed structure.

3. The laser according to claim 1 or 2, characterized in that A plurality of the light-emitting chips and the corresponding collimating lenses are arranged on each of the steps, and the plurality of collimating lenses on each of the steps are integrally formed.

4. The laser according to claim 3, characterized in that The distance between adjacent light-emitting chips on each step is less than 2.4 mm.

5. The laser according to claim 1 or 2, characterized in that The laser also includes an L-shaped sealing component; The side wall has an opening on a side away from the bottom plate, and the sealing component covers the light outlet of the side wall and the opening on the side wall away from the bottom plate.

6. The laser according to claim 5, characterized in that The sealing assembly includes: an L-shaped sealing frame and a light-transmitting sealing layer, the sealing frame includes a first portion and a second portion connected to each other, the second portion has a light-transmitting opening, and the light-transmitting sealing layer covers the light-transmitting opening; The first portion covers the opening of the side wall away from the bottom plate, and the second portion and the light-transmitting sealing layer cover the light outlet of the side wall.

7. The laser according to claim 6, characterized in that The edge of the first portion is fixed to a surface of the side wall away from the bottom plate, and the edge of the second portion is fixed to an edge of the light outlet in the side wall.

8. The laser according to claim 6 or 7, characterized in that The sealing frame is a sheet metal part.

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