Heat dissipation device and electronic device
By setting strip-shaped capillary structures and adjacent spaces in the heat dissipation device, the liquid heat dissipation medium evaporates rapidly to form a gaseous state, which solves the problem of insufficient heat dissipation capacity of existing heat dissipation devices and achieves a more efficient heat dissipation effect.
Patent Information
- Application Number
- CN202210114090.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2022-01-30
- Publication Date
- 2025-12-19
- Estimated Expiration
- 2042-01-30
AI Technical Summary
The existing heat dissipation devices are insufficient in heat dissipation capacity.
A heat dissipation device is designed, comprising a body with a receiving cavity and a strip-shaped first capillary structure arranged along the flow direction of the heat dissipation medium. Spaces are formed between adjacent capillary structures, and the liquid heat dissipation medium can evaporate into a gaseous state in these spaces and flow rapidly to enhance the heat dissipation effect.
By reducing the travel and time required for the liquid heat dissipation medium to form a gaseous state, the heat dissipation capacity of the heat dissipation device is significantly improved.
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Figure CN114521094B_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to a heat dissipation device and an electronic device. BACKGROUND
[0002] The heat dissipation device is a device frequently used by people; however, the heat dissipation capacity of the current heat dissipation device is poor. SUMMARY
[0003] Therefore, the embodiments of the present application aim to provide a heat dissipation device and an electronic device.
[0004] To achieve the above-mentioned purpose, the technical solution of the present application is as follows:
[0005] The embodiments of the present application provide a heat dissipation device, which comprises:
[0006] A body having a containing cavity; the containing cavity contains a heat dissipation medium;
[0007] At least two first capillary structures in a strip shape, which are arranged in the containing cavity along the flow direction of the heat dissipation medium; a first space is formed between adjacent two first capillary structures;
[0008] The liquid heat dissipation medium in adjacent two first capillary structures can evaporate to the first space.
[0009] In some optional implementation manners, the at least two first capillary structures are arranged side by side in a first direction on the working wall side of the body, the working wall is the wall body on the side of the body connected with the heat generating member; wherein the first direction and the flow direction of the heat dissipation medium satisfy the vertical condition.
[0010] In some optional implementation manners, the two ends of the at least two first capillary structures form a second space with the side wall of the body in the first direction, and the liquid heat dissipation medium in the first capillary structure at the two ends of the at least two first capillary structures can evaporate to the second space.
[0011] In some optional implementation manners, adjacent two first capillary structures are in contact; or,
[0012] A first gap is formed between adjacent two first capillary structures.
[0013] In some optional implementation manners, the first capillary structure comprises:
[0014] A first strip part,
[0015] A second strip part, which is different from the cross section of the first strip part and forms the first capillary structure with the first strip part staggered.
[0016] In some optional implementations, the first capillary structure further comprises:
[0017] A third strip-shaped portion, staggered with the first strip-shaped portion and the second strip-shaped portion to form the first capillary structure.
[0018] The third strip-shaped portion, the first strip-shaped portion and the second strip-shaped portion are all in a columnar shape, and at least two of the first strip-shaped portion, the second strip-shaped portion and the third strip-shaped portion are different in diameter.
[0019] In some optional implementations, a first portion of the at least two first capillary structures is arranged in a first direction on a working wall side of the body, and a second portion of the at least two first capillary structures is arranged in a second direction; the working wall is a wall on a side of the body connected with the heat-generating component; the first direction and the flow direction of the heat-dissipating medium satisfy a perpendicular condition, and the second direction and the first direction satisfy a perpendicular condition.
[0020] In some optional implementations, the thickness of the at least two first capillary structures in the evaporation area is greater than the thickness of the at least two first capillary structures in the condensation area.
[0021] In some optional implementations, the heat-dissipating device further comprises:
[0022] A second capillary structure arranged on an inner surface of the accommodating cavity, and the gaseous heat-dissipating medium can be condensed into a liquid state in the second capillary structure.
[0023] The second capillary structure is a metal mesh structure, and the first capillary structure is a non-metal structure.
[0024] The electronic device comprises the heat-dissipating device and the heat-generating component.
[0025] The heat-dissipating device is used for dissipating heat for the heat-generating component.
[0026] The heat-dissipating device comprises a body having an accommodating cavity, the accommodating cavity containing a heat-dissipating medium, at least two first capillary structures in a strip-shaped structure arranged in the accommodating cavity along the flow direction of the heat-dissipating medium, a first space formed between adjacent two first capillary structures, and liquid heat-dissipating medium in adjacent two first capillary structures capable of evaporating into the first space. BRIEF DESCRIPTION OF DRAWINGS
[0027] Figure 1 An optional structural schematic view of the heat dissipation device in the embodiment of the present application is shown in FIG. 6.
[0028] Figure 2 An optional structural schematic view of the heat dissipation device in the embodiment of the present application is shown in FIG. 6.
[0029] Figure 3 An optional structural schematic view of the heat dissipation device in the embodiment of the present application is shown in FIG. 6.
[0030] Figure 4 An optional structural schematic view of the heat dissipation device in the embodiment of the present application is shown in FIG. 6.
[0031] Reference signs: 110, body; 111, accommodating cavity; 112, first space; 113, working wall; 114, second space; 115, third space; 120, first capillary structure; 121, groove; 130, second capillary structure. DETAILED DESCRIPTION
[0032] The technical solutions of the present application are further described in detail below in combination with the drawings and specific embodiments of the present application.
[0033] In the embodiment of the present application, it should be noted that unless otherwise stated and limited, the term "connection" should be understood broadly, for example, it can be an electrical connection, or a connection between two elements, it can be directly connected, or indirectly connected through an intermediate medium. For those skilled in the art, the specific meaning of the above-mentioned term can be understood according to the specific circumstances.
[0034] It should be noted that the terms "first, second, third" involved in the embodiments of the present application are only to distinguish similar objects, and do not represent a specific order of the objects. Understandably, "first, second, third" can be interchanged in specific order or sequence as allowed. It should be understood that the objects distinguished by "first, second, third" can be interchanged under appropriate circumstances, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein.
[0035] The technical solutions of the present application are further described in detail below in combination with the drawings and specific embodiments of the present application. Figures 1 to 4 The electronic device described in the embodiments of the present application is described in detail.
[0036] The heat dissipation device comprises a body 110 and at least two first capillary structures 120. The body 110 has a containing cavity 111 containing a heat dissipation medium; the at least two first capillary structures 120 are in the form of strips; the at least two first capillary structures 120 are arranged in the containing cavity 111 along the flow direction of the heat dissipation medium; a first space 112 is formed between two adjacent first capillary structures 120; the liquid heat dissipation medium in the two adjacent first capillary structures 120 can evaporate into the first space 112; the first space 112 forms a flow channel for the gaseous heat dissipation medium, and the liquid heat dissipation medium in the two adjacent first capillary structures 120 can quickly form gaseous heat dissipation medium in the first space 112 and flow, greatly reducing the distance and time for the liquid heat dissipation medium to form gaseous heat dissipation medium, and improving the heat dissipation capacity of the heat dissipation device.
[0037] In the embodiments of the present application, the structure of the body 110 is not limited. For example, the body 110 can be in the form of a cuboid structure. For another example, the body 110 can be in the form of a tubular structure.
[0038] Here, the type of the heat dissipation medium is not limited as long as it can be converted between gaseous and liquid states. For example, the heat dissipation medium can be water.
[0039] Here, the flow direction of the heat dissipation medium is the direction formed by the flow of the heat dissipation medium between the evaporation end of the body 110 and the condensation end of the body 110. For example, when the body 110 is in the form of a tubular structure, the flow direction of the heat dissipation medium can be the length direction of the tubular structure.
[0040] In the embodiments of the present application, the structure of the first capillary structure 120 is not limited.
[0041] For example, the first capillary structure 120 can comprise a first strip portion and a second strip portion. The second strip portion and the first strip portion are staggered to form the first capillary structure 120.
[0042] Here, the cross section of the second strip portion can be the same as or different from the cross section of the first strip portion. As an example, the cross section of the second strip portion and the cross section of the first strip portion are both circular or elliptical, and the diameter of the second strip portion and the diameter of the first strip portion are different.
[0043] Here, the first capillary structure 120 can further comprise a third strip portion, and the third strip portion and the first strip portion and the second strip portion are staggered to form the first capillary structure 120.
[0044] The carrying surface of the third strip-shaped portion, the cross section of the second strip-shaped portion, and the cross section of the first strip-shaped portion can be the same or different. As an example, the third strip-shaped portion, the first strip-shaped portion, and the second strip-shaped portion are all columnar, and the diameters of at least two of the first strip-shaped portion, the second strip-shaped portion, and the third strip-shaped portion are different.
[0045] In the embodiments of the present application, the material of the first capillary structure 120 is not limited. For example, the first capillary structure 120 can be a non-metal structure, in which case the first capillary structure 120 has adsorptive properties and can retain liquid heat dissipation medium within the first capillary structure 120.
[0046] Here, the manner in which the first space 112 is formed between two adjacent first capillary structures 120 is not limited. For example, as shown in FIG. 1, the two adjacent first capillary structures 120 are in contact, and the ends of the two adjacent first capillary structures 120 in contact are non-planar, in which case the first space 112 is formed by the ends of the two adjacent first capillary structures 120 in contact. Figure 1 For another example, as shown in FIG. 2, a first gap is formed between the two adjacent first capillary structures 120. Figure 3
[0047] Here, the arrangement of the at least two first capillary structures 120 is not limited.
[0048] For example, the at least two first capillary structures 120 can be arranged side by side in a first direction, and the first direction and the flow direction of the heat dissipation medium satisfy a perpendicular condition.
[0049] Here, the first direction is not limited. For example, the flow direction of the heat dissipation medium can be the length direction of the body 110, and the first direction can be the width direction of the body 110. Here, the perpendicular condition means perpendicular or substantially perpendicular.
[0050] For another example, the at least two first capillary structures 120 can be arranged side by side in a second direction, and the second direction and the flow direction of the heat dissipation medium satisfy a perpendicular condition.
[0051] Here, the second direction is not limited. For example, the flow direction of the heat dissipation medium can be the length direction of the body 110, and the second direction can be the thickness direction of the body 110. The second direction and the first direction can satisfy a perpendicular condition.
[0052] Here, the cross section of the first capillary structure 120 in the flow direction of the heat dissipation medium can remain unchanged or can vary. As an example, the thickness of the at least two first capillary structures 120 in the evaporation region is greater than the thickness of the at least two first capillary structures 120 in the condensation region; at this time, the width of the at least two first capillary structures 120 in the flow direction of the heat dissipation medium can remain unchanged, so that more liquid heat dissipation medium is stored in the first capillary structure 120 with a larger cross section in the evaporation region, so that more liquid heat dissipation medium absorbs heat and evaporates; in the condensation region, the first capillary structure 120 is mainly used to transfer the liquid heat dissipation medium, so that the liquid heat dissipation medium flows back to the evaporation region, and the cross section of the first capillary structure 120 in the condensation region is set to be smaller, which can increase the space of the gaseous heat dissipation medium in the condensation region, so that more gaseous heat dissipation medium is quickly condensed to form liquid heat dissipation medium in the larger space, and the thickness of the at least two first capillary structures 120 in the evaporation region is greater than the thickness of the at least two first capillary structures 120 in the condensation region, which can greatly improve the heat dissipation capacity of the heat dissipation device.
[0053] In some optional implementations of the embodiments of the present application, as shown in Figure 1 and Figure 3 The at least two first capillary structures 120 are arranged side by side in the first direction on the working wall 113 of the body 110, and the working wall 113 is the wall on the side of the body 110 connected to the heat generating component. The at least two first capillary structures 120 can greatly improve the heat dissipation capacity of the heat dissipation device for the heat generating component.
[0054] In the implementation, as shown in Figure 1 and Figure 2As shown, in the case of the same structure of the body 110, if a first capillary structure 120 is arranged in the accommodating cavity 111, at this time, the width of the first capillary structure 120 in the first direction needs to be set larger to make the heat dissipation device have larger heat dissipation capacity; the two ends of the first capillary structure 120 form a third space 115 with the side wall of the body 110 in the first direction A; the liquid heat dissipation medium in the two ends of the first capillary structure 120 can evaporate into the third space 115 to form gaseous heat dissipation medium flow; if the width of the first capillary structure 120 in the first direction is set too large, the distance between part of the liquid heat dissipation medium in the first capillary structure 120 and the third space 115 is too large to evaporate into the third space 115 to form gaseous heat dissipation medium, which greatly reduces the heat dissipation capacity of the heat dissipation device; therefore, if a first capillary structure 120 is arranged in the accommodating cavity 111, the width of the first capillary structure 120 in the first direction A is limited; even if the width of the first capillary structure 120 in the first direction A is set larger, since part of the liquid heat dissipation medium in the first capillary structure 120 cannot evaporate to form gaseous heat dissipation medium, the heat dissipation capacity of the heat dissipation device is lower; at the same time, the gaseous heat dissipation medium will condense on the inner wall forming the accommodating cavity 111 to form liquid heat dissipation medium, and the liquid heat dissipation medium will flow back to the first capillary structure 120 along the inner wall of the accommodating cavity 111; since the width of a first capillary structure 120 in the first direction A cannot be set larger, at this time, the third space 115 is larger, and the travel of the liquid heat dissipation medium back to the first capillary structure 120 along the inner wall of the accommodating cavity 111 through the third space 115 becomes longer, which greatly increases the time of the liquid heat dissipation medium flowing back to the first capillary structure 120, increases the period of the liquid heat dissipation medium evaporating again to form gaseous heat dissipation medium, and greatly reduces the heat dissipation efficiency of the heat dissipation medium and the heat dissipation capacity of the heat dissipation device. As shown in Figure 1 As shown, at least two first capillary structures 120 are arranged in the first direction, and a first space 112 is formed between the two adjacent first capillary structures 120; at this time, the liquid heat dissipation medium in the two adjacent first capillary structures 120 can quickly evaporate into the first space 112 to form gaseous heat dissipation medium and flow; and since at least two first capillary structures 120 are arranged, the width of a single first capillary structure 120 in the first direction is greatly reduced, so that the liquid heat dissipation medium in the first capillary structure 120 can all quickly be converted into gaseous heat dissipation medium; the width of the at least two first capillary structures 120 in the first direction can be set larger, the travel of the liquid heat dissipation medium back to the first capillary structure 120 along the inner wall of the accommodating cavity 111 becomes shorter, which greatly reduces the time of the liquid heat dissipation medium flowing back to the first capillary structure 120, shortens the period of the liquid heat dissipation medium evaporating again to form gaseous heat dissipation medium, and greatly improves the heat dissipation efficiency of the heat dissipation medium and the heat dissipation capacity of the heat dissipation device.
[0055] In the present embodiment, the two ends of the at least two first capillary structures 120 form a second space 114 with the sidewall of the body 110 in the first direction, and the liquid heat dissipation medium in the first capillary structure 120 at the two ends of the at least two first capillary structures 120 can evaporate into the second space 114, so that the liquid heat dissipation medium in the first capillary structure 120 at the two ends of the at least two first capillary structures 120 can quickly flow into the second space 114 to form gaseous heat dissipation medium.
[0056] Here, the two ends of the at least two first capillary structures 120 refer to the two ends of the at least two first capillary structures 120 as a whole.
[0057] Here, since the liquid heat dissipation medium in the adjacent two first capillary structures 120 can evaporate into the first space 112, the liquid heat dissipation medium in the first capillary structure 120 at the two ends of the at least two first capillary structures 120 can evaporate into the second space 114, and at this time, the two ends of each first capillary structure 120 form a gaseous heat dissipation medium space, which can make all the liquid heat dissipation medium in the at least two first capillary structures 120 quickly evaporate to form gaseous heat dissipation medium, greatly improving the heat dissipation capacity of the heat dissipation device.
[0058] In some optional implementations of the embodiments of the present application, as shown in Figure 4 The first part of the at least two first capillary structures 120 is arranged side by side on the working wall 113 of the body 110 in the first direction A, and the working wall 113 is the wall body on the side of the body 110 connected with the heat generating element; the second part of the at least two first capillary structures 120 is arranged side by side in the second direction B; wherein the first direction and the flow direction of the heat dissipation medium satisfy the perpendicular condition, and the second direction and the first direction satisfy the perpendicular condition, so that the cross-sectional area of a single first capillary structure 120 can be set smaller, and the first space 112 is formed between the adjacent two first capillary structures 120, so that the liquid heat dissipation medium in a single first capillary structure 120 can evaporate to form gaseous heat dissipation medium more quickly, greatly improving the heat dissipation capacity of the heat dissipation device.
[0059] In the present embodiment, the way of forming the first space 112 between the adjacent first capillary structures 120 in the first part of the first capillary structures 120 and the way of forming the first space 112 between the adjacent first capillary structures 120 in the second part of the first capillary structures 120 are similar to the way of forming the first space 112 between the adjacent two first capillary structures 120 described above, and will not be described here.
[0060] For example, first gaps are formed between adjacent first capillary structures 120 in the first part of the first capillary structures 120. End portions of the first capillary structures 120 in the second part of the first capillary structures 120 are in contact with each other and are non-planar.
[0061] As an example, as shown in FIG. 1, first gaps are formed between adjacent first capillary structures 120 in the first part of the first capillary structures 120, and first spaces 112 are formed through the first gaps. Part of the first capillary structures 120 in the second part of the first capillary structures 120 are provided with grooves 121 close to surfaces of adjacent first capillary structures 120, and the second part of the first capillary structures 120 forms the first spaces 112 through the grooves 121. Figure 4
[0062] Here, adjacent first capillary structures 120 in the second part of the first capillary structures 120 can be in surface-to-surface contact. The surface-to-surface contact between adjacent first capillary structures 120 in the second part of the first capillary structures 120 can enable heat of the heat-generating component to be transferred between the adjacent first capillary structures 120, and can enable liquid heat dissipation medium to be quickly formed into gaseous heat dissipation medium in the grooves 121, thereby greatly improving heat dissipation capacity of the heat dissipation device.
[0063] Here, a cross-sectional shape of the groove 121 is not limited. For example, the cross-section of the groove 121 can be semicircular or rectangular.
[0064] In some optional implementations of the embodiments, the heat dissipation device can further include second capillary structures 130 provided on inner surfaces of the accommodation cavity 111, and gaseous heat dissipation medium can be condensed into liquid in the second capillary structures 130. Liquid heat dissipation medium can flow to the first capillary structures 120 based on the second capillary structures 130 and evaporate again in the first capillary structures 120.
[0065] In the implementations, at least two first capillary structures 120 are in contact with the second capillary structures 130, and heat of the heat-generating component can be transferred to the first capillary structures 120 through the second capillary structures 130. Of course, when the heat dissipation device does not include the second capillary structures 130, the first capillary structures 120 can be directly in contact with the inner surfaces of the accommodation cavity 111.
[0066] In the present embodiment, the structure of the first capillary structure 120 and the second capillary structure 130 is not limited. For example, the second capillary structure 130 is a metal mesh structure, and the first capillary structure 120 is a non-metal structure; at this time, the first capillary structure 120 has adsorption capacity, and can adsorb the liquid heat dissipation medium into the first capillary structure 120, and the liquid heat dissipation medium adsorbed into the first capillary structure 120 is evaporated into the containing cavity 111 by absorbing heat, and the gaseous heat dissipation medium is condensed in the second capillary structure 130.
[0067] The heat dissipation device of the present embodiment comprises: a body 110 having a containing cavity 111; the containing cavity 111 contains heat dissipation medium; at least two first capillary structures 120 in strip shape are arranged in the containing cavity 111 along the flow direction of the heat dissipation medium; a first space 112 is formed between two adjacent first capillary structures 120; the liquid heat dissipation medium in the two adjacent first capillary structures 120 can evaporate into the first space 112; the first space 112 forms a flow channel of the gaseous heat dissipation medium, and the liquid heat dissipation medium in the two adjacent first capillary structures 120 can quickly form gaseous heat dissipation medium in the first space 112 and flow, greatly reducing the distance and time of the liquid heat dissipation medium forming gaseous heat dissipation medium, and improving the heat dissipation capacity of the heat dissipation device.
[0068] The present embodiment also discloses an electronic device, which comprises the heat dissipation device and a heat generating component of the present embodiment; the heat dissipation device is used for dissipating heat for the heat generating component.
[0069] Here, the structure of the electronic device is not limited. For example, the electronic device can be a computer or a mobile phone.
[0070] The above is only a specific embodiment of the present application, but the protection scope of the present application is not limited thereto, any person skilled in the art can easily think of changes or replacements within the technical range disclosed in the present application, which should be covered in the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.
Claims
1. A heat dissipation device, comprising: a body having a containing cavity; and a heat dissipation medium contained in the containing cavity; at least two first capillary structures in a strip shape arranged in the containing cavity along a flow direction of the heat dissipation medium; and a first space formed by an end of two adjacent first capillary structures in contact and an inner surface of the containing cavity; liquid heat dissipation medium in the two adjacent first capillary structures evaporates into the first space; the at least two first capillary structures are arranged on a working wall side of the body, and the first space is located on the working wall side; a wall opposite to the working wall of the body is spaced apart from the at least two first capillary structures.
2. The heat dissipating device according to claim 1, wherein the at least two first capillary structures are arranged side by side in a first direction on a working wall side of the body, the working wall being a wall on a side of the body to which a heat generating element is connected; and wherein, the first direction and the flow direction of the heat dissipation medium satisfy a vertical condition. 3.The heat dissipation device of claim 2, two ends of the at least two first capillary structures form a second space with a side wall of the body in the first direction, and liquid heat dissipation medium in a first capillary structure of the two ends of the at least two first capillary structures evaporates into the second space. 4.The heat dissipation device of claim 1, the first capillary structure comprises: a first strip portion, a second strip portion different from the first strip portion in cross section, and staggered with the first strip portion to form the first capillary structure. 5.The heat dissipation device of claim 4, the first capillary structure further comprises: a third strip portion staggered with the first strip portion and the second strip portion to form the first capillary structure; wherein the third strip portion, the first strip portion and the second strip portion are all in a column shape, and at least two of the first strip portion, the second strip portion and the third strip portion are different in diameter.
6. The heat dissipating device according to claim 1, wherein a first portion of the at least two first capillary structures are arranged side by side in a first direction on a working wall side of the body, the working wall being a wall on a side of the body to which a heat generating element is connected; and a second portion of the at least two first capillary structures are arranged side by side in a second direction; and wherein, the first direction and the flow direction of the heat dissipation medium satisfy a vertical condition, and the second direction and the first direction satisfy a vertical condition. 7.The heat dissipation device of claim 1, a thickness of the at least two first capillary structures in an evaporation area is greater than a thickness of the at least two first capillary structures in a condensation area. 8.The heat dissipation device of any one of claims 1 to 7, further comprising: a second capillary structure arranged on an inner surface forming the containing cavity, and gaseous heat dissipation medium can condense into liquid in the second capillary structure; wherein the second capillary structure is a metal mesh structure, and the first capillary structure is a non-metal structure. 9.An electronic device comprising the heat dissipation device of any one of claims 1 to 8 and a heat generating component: the heat dissipation device is used to dissipate heat for the heat generating component.
Citation Information
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