Display panel and packaging method thereof

Abstract

The embodiment of the present application discloses a display panel and its packaging method, wherein the display panel includes: a substrate layer, a source / drain layer, and a packaging layer. The source / drain layer is arranged on the top surface of the substrate layer, and the source / drain layer includes an electrode layer and a plurality of structural layers arranged on the same layer. The plurality of structural layers are arranged on one side of the electrode layer, with a gap between them and the electrode layer, and are spaced apart along a first direction, wherein the first direction is a direction away from the electrode layer; the packaging layer is bonded and connected to the top and side surfaces of the electrode layer, the top and side surfaces of each structural layer, and the top surface of the substrate layer. The present application increases the contact area between the source / drain layer and the packaging layer within a unit width by adding a structural layer for increasing the packaging contact area to the source / drain layer, thereby ensuring the reliability of the packaging structure within a narrower width, and solving the technical problem of high risk of packaging failure of display panels with narrow borders in the prior art.

Description

Technical Field

[0001] The present application relates to the field of display, and in particular to a display panel and a packaging method thereof. Background Art

[0002] With the advancement of display technology, more and more display devices are adopting narrow bezel designs to increase the overall screen-to-body ratio. However, as the bezel shrinks, the package width within the display panel also needs to be narrowed. However, excessively narrow package widths increase the risk of package failure, affecting the reliability of display panel manufacturing. Summary of the Invention

[0003] The embodiments of the present application provide a display panel and a packaging method thereof, which can solve the technical problem in the prior art of high risk of packaging failure of display panels with narrow borders.

[0004] An embodiment of the present application provides a display panel, comprising:

[0005] substrate layer;

[0006] a source / drain layer disposed on a top surface of the substrate layer, the source / drain layer including an electrode layer and a plurality of structural layers disposed on the same layer, wherein the plurality of structural layers are disposed on one side of the electrode layer, with a gap between them and the electrode layer, and are spaced apart along a first direction, the first direction being a direction away from the electrode layer;

[0007] The packaging layer is bonded and connected to the top surface and side surfaces of the electrode layer, the top surfaces and side surfaces of each of the structural layers, and the top surface of the substrate layer.

[0008] Optionally, the structural layer includes a plurality of structural blocks spaced apart along a second direction, the structural blocks are arranged along the second direction, and the second direction intersects with the first direction.

[0009] Optionally, the structural blocks of the structural layers in two adjacent columns are arranged alternately.

[0010] Optionally, the structural block is in the shape of a hexagonal prism.

[0011] Optionally, the width of each column of the structural layers is less than 10 microns.

[0012] Optionally, the interval between the structural layers in two adjacent columns is less than 10 microns.

[0013] Optionally, the structural layer includes multiple metal layers stacked together.

[0014] Optionally, the structural layer includes:

[0015] a first metal layer, disposed on a top surface of the substrate layer;

[0016] a second metal layer, disposed on a top surface of the first metal layer, wherein a column width of the second metal layer is smaller than a column width of the first metal layer;

[0017] The third metal layer is disposed on the top surface of the second metal layer, and the column width of the third metal layer is greater than the column width of the second metal layer.

[0018] Optionally, at least one groove is provided on a side surface of the structural layer.

[0019] Accordingly, an embodiment of the present application further provides a display panel packaging method, the method comprising:

[0020] Providing a source-drain layer on the top surface of the substrate layer;

[0021] Etching the source / drain layer according to a predetermined pattern to form an electrode layer and a plurality of structural layers;

[0022] A packaging layer is provided on the outer surface of the electrode layer, the outer surface of each of the structural layers and the top surface of the substrate layer to package the electrode layer and the structural layer.

[0023] In an embodiment of the present application, a structural layer for increasing the packaging contact area is added to the source and drain layer, thereby increasing the contact area between the source and drain layer and the packaging layer per unit width, thereby ensuring the reliability of the packaging structure within a narrower width and solving the technical problem of high risk of packaging failure of display panels with narrow borders in the prior art. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0025] Figure 1 It is a schematic diagram of the process of display panel packaging in the prior art.

[0026] Figure 2 This is a schematic diagram of the packaging process of the display panel proposed in this application.

[0027] Figure 3 This is a schematic diagram of the arrangement of the source and drain layers shown in one embodiment of the present application.

[0028] Figure 4 This is a schematic diagram of the arrangement of the source and drain layers shown in another embodiment of the present application.

[0029] Figure 5 This is a schematic diagram of the arrangement of the source and drain layers shown in another embodiment of the present application.

[0030] Figure 6 It is a structural diagram of a structural layer shown in an embodiment of the present application.

[0031] Figure 7 This is a schematic structural diagram of a structural layer shown in yet another embodiment of the present application.

[0032] Figure 8 This is a flow chart of the display panel packaging method proposed in this application.

[0033] Description of reference numerals:

[0034] 100, substrate layer; 200, source and drain layer; 300, encapsulation layer; 210, electrode layer; 220, structural layer; 221, structural block; 201, first metal layer; 202, second metal layer; 203, third metal layer; 204, groove. DETAILED DESCRIPTION

[0035] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making creative work are within the scope of protection of the present application. In addition, it should be understood that the specific implementation methods described herein are only used to illustrate and explain the present application, and are not used to limit the present application. In the present application, unless otherwise specified, the directional words used, such as "upper" and "lower", generally refer to the upper and lower parts of the device in actual use or working state, specifically the drawing direction in the accompanying drawings; and "inside" and "outside" refer to the outline of the device.

[0036] The present invention provides a display panel and a packaging method thereof. Detailed descriptions are given below. It should be noted that the order in which the following embodiments are described does not limit the preferred order of the embodiments.

[0037] The present application provides a display panel that can be installed in various products with display functions. For example, electronic products may include smart terminals, laptops, photographic equipment, wearable devices, electronic scales, in-vehicle displays, and televisions. The display panel can be of various types, such as liquid crystal display panels and organic light emitting diode (OLED) panels.

[0038] See also Figure 1In the prior art, a display panel includes a substrate layer 100, a source / drain layer 200, and an encapsulation layer 300, which are stacked in sequence. However, the source / drain layer 200 only includes a source electrode, a drain electrode, and conductive lines connected to the source and drain electrodes, that is, it only includes an electrode layer 210 for communication. Outside the electrode layer 210, the encapsulation layer 300 only contacts the top surface of the substrate layer 100, requiring a large contact area to ensure the robustness of the encapsulation.

[0039] Please refer to Figure 2 In an embodiment of the present application, the display panel includes a substrate layer 100, a source / drain layer 200, and an encapsulation layer 300, which are sequentially stacked. The source / drain layer 200 is disposed on the top surface of the substrate layer 100, and the encapsulation layer 300 is disposed on the top surface of the source / drain layer 200 to encapsulate the source / drain layer 200.

[0040] The substrate layer 100 serves as the base of the display panel, and other devices are arranged on the substrate layer 100. The shape of the substrate layer 100 determines the shape of the display panel. It can be square, circular or other shapes. It can also be a flexible substrate layer 100 to be used to make a flexible display panel. It can be a quartz substrate, PI film, etc.

[0041] The encapsulation layer 300 is generally made of organic materials such as resin, and is arranged on the side of the substrate layer 100 facing the source and drain layer 200. Its main function is to encapsulate the source and drain layer 200 on the substrate layer 100 to completely isolate the source and drain layer 200 from the outside world, and prevent the intrusion of external water and oxygen from causing the electrode circuit in the source and drain layer 200 to be corroded and short-circuited, causing damage to the panel.

[0042] The source / drain layer 200 includes an electrode layer 210 and multiple structural layers 220 disposed in the same layer. The multiple structural layers 220 are disposed on one side of the electrode layer 210, with a gap between them. The multiple structural layers 220 are spaced apart from one side of the electrode layer 210 along a first direction, i.e., a direction away from the electrode layer 210. The encapsulation layer 300 is bonded to the top and side surfaces of the electrode layer 210, the top and side surfaces of each structural layer 220, and the top surface of the substrate layer 100 to securely encapsulate the electrode layer 210 and each structural layer 220. Because the encapsulation layer 300 not only contacts the top surfaces of the electrode layer 210, the structural layer 220, and the substrate layer 100, but also contacts the side surfaces of both the electrode layer 210 and the structural layer 220, the contact area per unit length between the encapsulation layer 300 and the source / drain layer 200 and the substrate layer 100 is increased, thereby increasing the encapsulation area per unit length. This allows the required encapsulation area to be achieved within a shorter encapsulation width, ensuring the robustness of the encapsulation layer 300. This also shortens the encapsulation width, making it suitable for display panels with narrow and ultra-narrow bezels, thereby resolving the high risk of encapsulation failure in narrow-bezel display panels in the prior art. Furthermore, the provision of the structural layer 220 also extends the intrusion path for water and oxygen, thereby further effectively blocking the intrusion of water and oxygen from the outside.

[0043] The electrode layer 210 includes a source electrode, a drain electrode, and conductive traces connected to the source and drain electrodes, through which current flows. The structural layer 220 is provided to increase the contact area with the encapsulation layer 300. It is not connected to the electrode layer 210, and no current flows through it. It only serves to strengthen the encapsulation structure.

[0044] The source and drain layer 200 is generally formed by etching in a predetermined pattern in the routing area. Therefore, in addition to including an electrode layer 210 and multiple structural layers 220 arranged on the same layer, the above-mentioned source and drain layer 200 can also include only one electrode layer 210 and one structural layer 220. A pattern consisting of various grooves 204 can be etched on the structural layer 220 to increase the contact area with the packaging layer 300, thereby increasing the packaging area, so as to further shorten the packaging width while ensuring the firmness of the packaging, and thus shorten the border width of the display panel as much as possible to achieve an ultra-narrow border.

[0045] Please refer to Figure 3In some embodiments of the present application, the structural layer 220 is strip-shaped and extends along a second direction that intersects the first direction. The spacing between adjacent structural layers 220 is equal to the spacing between the electrode layer 210 and the adjacent structural layer 220, both less than 10 microns. The shorter the spacing, the more side surfaces that can be contacted per unit length, the larger the contact area, and the larger the package area, which can further shorten the package width. At the same time, the width of each structural layer 220 is less than 10 microns. The width of the structural layer 220 refers to the distance between the two opposite side surfaces of the structural layer 220 facing the adjacent structural layers 220 on both sides. The shorter the width of each structural layer 220, the more side surfaces that can be contacted per unit length, the larger the contact area, and the larger the package area, which can further shorten the package width. Therefore, in some embodiments, the spacing is less than 5 microns, preferably 4 microns, and the width of the structural layer 220 is less than 5 microns, preferably 4 microns. This ensures a strong package while further shortening the package width, thereby minimizing the bezel width of the display panel and achieving an ultra-narrow bezel.

[0046] Please refer to Figure 4 and Figure 5 In other embodiments of the present application, each structural layer 220 is composed of multiple structural blocks 221. The multiple structural blocks 221 are spaced apart along the second direction to form a row. The sides of the metal block are in contact with the encapsulation layer 300, which can further increase the contact area with the encapsulation layer 300, thereby further increasing the encapsulation area. While ensuring a strong encapsulation, the encapsulation width can be further shortened, thereby minimizing the bezel width of the display panel and achieving an ultra-narrow bezel.

[0047] Please refer to Figure 4 In one embodiment of the present application, the top surfaces of the plurality of structural blocks 221 are rectangular, and each column of structural blocks 221 is spaced at a predetermined distance, so that the structural blocks 221 comprising each structural layer 220 collectively form a rectangular array of multiple rows and multiple columns. This arrangement is simple to manufacture and allows for rapid molding. It also increases the contact area with the encapsulation layer 300, further shortening the display panel's bezel width and enabling the realization of an ultra-narrow bezel.

[0048] Please refer to Figure 5 In another embodiment of the present application, the top surfaces of the above-mentioned multiple structural blocks 221 are hexagonal, and the structural blocks 221 of the structural layer 220 in two adjacent columns are staggered with each other, so that the six side surfaces of the structural block 221 are arranged opposite to one side surface of the adjacent structural block 221, forming a relatively tight hexagonal arrangement, so as to ensure that the contact area with the packaging layer 300 is increased as much as possible within a unit area, thereby further increasing the packaging area, so as to further shorten the packaging width while ensuring the firmness of the packaging.

[0049] Please refer to Figure 6 In some embodiments of the present application, the structural layer 220 includes multiple metal layers stacked in a stacked manner. Specifically, in one embodiment, the structural layer 220 includes a first metal layer 201, a second metal layer 202, and a third metal layer 203 stacked in sequence. The first metal layer 201 is disposed on the top surface of the substrate layer 100, the second metal layer 202 is disposed on the top surface of the first metal layer 201, and the third metal layer 203 is disposed on the top surface of the second metal layer 202. The first metal layer 201 and the third metal layer 203 are both made of titanium alloy, and the second metal layer 202 is made of aluminum alloy, forming a titanium-aluminum-titanium structure similar to the electrode layer 210 to simplify the production steps. In this embodiment, the width of the second metal layer 202 is greater than the width of the first metal layer 201 and also greater than the width of the third metal layer 203, that is, a groove 204 is formed on the side of the structural layer 220 to further increase the contact area of the packaging layer 300, thereby further increasing the packaging area, thereby further shortening the packaging width while ensuring a strong package. At the same time, in this embodiment, the thickness of the second metal layer 202 is greater than the thickness of the first metal layer 201 and the thickness of the third metal layer 203, so as to ensure that the groove 204 has a sufficient groove width, so that the packaging layer 300 can be completely adhered to the groove wall of the groove 204.

[0050] Please refer to Figure 7 In some embodiments of the present application, at least one groove 204 is provided on the side of the structural layer 220. In this embodiment, two grooves 204 are provided on the side surfaces of both sides of the structural layer 220 along the extension direction of the structural layer 220, and the encapsulation layer 300 is in contact with the groove walls of the groove 204. The groove 204 structure can further increase the contact area between the source and drain layer 200 and the encapsulation layer 300, that is, increase the encapsulation area per unit length, so that within a shorter encapsulation width, the required encapsulation area can be achieved, ensuring the firmness of the encapsulation of the encapsulation layer 300, while also shortening the width of the encapsulation, making it suitable for display panels with narrow and ultra-narrow borders, solving the technical problem of high risk of encapsulation failure of display panels with narrow borders in the prior art. At the same time, the provision of the structural layer 220 also extends the intrusion path of water and oxygen, thereby further effectively blocking the entry of external water and oxygen.

[0051] Please refer to Figure 8 , a display panel packaging method, the method comprising:

[0052] Step S100, forming a source / drain layer on the top surface of the substrate layer;

[0053] Step S200, etching the source and drain layers according to a predetermined pattern to form an electrode layer and a plurality of structural layers;

[0054] In step S300 , a packaging layer is formed on the outer surface of the electrode layer, the outer surfaces of each of the structural layers, and the top surface of the substrate layer to encapsulate the electrode layer and the structural layer.

[0055] Please refer to Figure 2 In this embodiment, a source-drain layer 200 is firstly formed above the substrate layer 100, i.e., on the top surface. The source-drain layer 200 is then etched according to a predetermined pattern to obtain an electrode layer 210 and a structural layer 220 which is arranged on the same layer as the electrode layer 210 and is located on one side of the electrode layer 210. Finally, an encapsulation layer 300 is formed on the outer surface of the electrode layer 210, the outer surfaces of each of the structural layers 220, and the exposed portion of the top surface of the substrate layer 100 to encapsulate the electrode layer 210 and the structural layer 220, thereby completely isolating the source-drain layer 200 from the outside world and preventing the intrusion of water and oxygen from the outside, which may cause the electrode circuit in the source-drain layer 200 to be corroded and short-circuited, thereby damaging the panel.

[0056] Please refer to Figure 1 In the prior art, the packaging method of the display panel is generally as follows: first, a source-drain layer 200 is covered on the top surface of the substrate layer 100, and then the source-drain layer 200 is etched to leave only the source electrode, the drain electrode and the circuit layer connected to the source and drain electrodes, that is, the electrode layer 210 in this application; finally, the packaging layer 300 is covered on the outer surface of the electrode layer 210 and the area outside the electrode layer 210 on the top surface of the substrate layer 100 to package the electrode layer 210.

[0057] In the prior art, the encapsulation layer 300 only contacts the outer surface of the electrode layer 210 and the top surface of the substrate layer 100, requiring a large area to be reserved on the substrate layer 100 to ensure sufficient encapsulation area. However, in this embodiment, due to the presence of the structural layer 220, the encapsulation layer 300 not only contacts the top surface but also contacts the side surfaces of the structural layer 220. This increases the encapsulation area per unit length, allowing the required encapsulation area to be achieved within a shorter encapsulation width. This ensures the robustness of the encapsulation layer 300 and shortens the encapsulation width, making it suitable for display panels with narrow and ultra-narrow bezels. This addresses the high risk of encapsulation failure in display panels with narrow bezels in the prior art. Furthermore, the provision of the structural layer 220 extends the intrusion path for water and oxygen, thereby further effectively blocking the intrusion of water and oxygen from the outside.

[0058] In one embodiment of the present application, the source / drain layer 200 is deposited on the top surface of the substrate layer 100 by chemical vapor deposition (CVD), and is etched by a photolithography machine to form an electrode layer 210 and a plurality of structural layers 220 arranged in the same layer as the electrode layer 210 and arranged in a direction away from the electrode layer 210. The encapsulation layer 300 is also deposited on the outer surface of the electrode layer 210, the outer surface of each of the structural layers 220, and the top surface of the substrate layer 100 by CVD. CVD can deposit the encapsulation layer 300 on all exposed outer surfaces above the electrode layer 210, each of the structural layers 220, and the substrate layer 100, thereby achieving seamless bonding between the encapsulation layer 300 and the outer surfaces of each layer in the source / drain layer 200, and forming an integrated encapsulation film to ensure the tightness of the encapsulation structure and effectively block the entry of water and oxygen from the outside.

[0059] The above is a detailed introduction to a display panel and its packaging method provided in an embodiment of the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea. At the same time, for technical personnel in this field, based on the ideas of the present application, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A display panel, characterized in that: include: substrate layer; a source / drain layer disposed on a top surface of the substrate layer, the source / drain layer including an electrode layer and a plurality of structural layers disposed on the same layer, the plurality of structural layers being disposed on one side of the electrode layer, spaced apart from the electrode layer, and spaced apart along a first direction, the first direction being a direction away from the electrode layer; an encapsulation layer, being bonded and connected to the top surface and side surfaces of the electrode layer, the top surfaces and side surfaces of each of the structural layers, and the top surface of the substrate layer; Wherein, the structural layer includes: a first metal layer, disposed on a top surface of the substrate layer; a second metal layer, disposed on a top surface of the first metal layer; a third metal layer, disposed on a top surface of the second metal layer; The column width of the second metal layer is smaller than that of the first metal layer, and the column width of the third metal layer is larger than that of the second metal layer, so that at least one groove is formed on the side of the structural layer.

2. The display panel according to claim 1, wherein The structural layer includes a plurality of structural blocks spaced apart along a second direction, wherein the plurality of structural blocks are spaced apart along the second direction to form a column, and the second direction intersects with the first direction.

3. The display panel according to claim 1, wherein The structural blocks in two adjacent columns are staggered.

4. The display panel according to claim 3, wherein: The top surface of the structural block is hexagonal.

5. The display panel according to any one of claims 1 to 3, wherein: The width of each column of the structural layers is less than 10 microns.

6. The display panel according to any one of claims 1 to 3, wherein: The interval between the structural layers in two adjacent columns is less than 10 microns.

7. A display panel packaging method, characterized in that: The method comprises: Providing a source-drain layer on the top surface of the substrate layer; Etching the source / drain layer according to a predetermined pattern to form an electrode layer and a plurality of structural layers; Covering the outer surface of the electrode layer, the outer surface of each of the structural layers and the top surface of the substrate layer with an encapsulation layer to encapsulate the electrode layer and the structural layer; Wherein, the structural layer includes: a first metal layer, disposed on a top surface of the substrate layer; a second metal layer, disposed on a top surface of the first metal layer; a third metal layer, disposed on a top surface of the second metal layer; The column width of the second metal layer is smaller than that of the first metal layer, and the column width of the third metal layer is larger than that of the second metal layer, so that at least one groove is formed on the side of the structural layer.

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