Electroluminescent display device

Abstract

The present disclosure relates to an electroluminescent display device having a robust structure that resists hydrogen particle penetration. The electroluminescent display device according to an embodiment of the present disclosure includes: a substrate; a drive layer disposed on the substrate; an emission layer disposed on the drive layer; an encapsulation layer disposed on the emission layer; and a dam portion surrounding a peripheral region of the emission layer, the dam portion including an organic layer and a hydrogen absorption layer.

Description

Technical Field

[0001] The present disclosure relates to an electroluminescent display device. More particularly, the present disclosure relates to an electroluminescent display device having a robust structure against hydrogen particle penetration. Background Art

[0002] Among display devices, electroluminescent displays are self-luminous devices and have advantages in terms of superior viewing angles and contrast compared to other display devices. Furthermore, since electroluminescent displays do not require a separate backlight, they are advantageously thin, lightweight, and have low power consumption. Furthermore, organic light-emitting displays, among electroluminescent displays, have the advantages of being driven with a low DC voltage, having a fast response speed, and having low manufacturing costs.

[0003] An electroluminescent display device includes multiple electroluminescent diodes. Each electroluminescent diode includes an anode electrode, a light-emitting layer formed on the anode electrode, and a cathode electrode formed on the light-emitting layer. When a high-potential voltage is applied to the anode electrode and a low-potential voltage is applied to the cathode electrode, holes in the anode electrode and electrons in the cathode electrode migrate toward the light-emitting layer, respectively. When holes and electrons combine in the light-emitting layer, excitons are formed during an excitation process, and the energy from the excitons generates light. An electroluminescent display device displays an image by electrically controlling the amount of light generated by the light-emitting layers of the multiple electroluminescent diodes separated by banks.

[0004] An encapsulation layer may be included to protect various components of the electroluminescent display device from the effects of oxygen or moisture intruding from the outside. The encapsulation layer may have a structure in which inorganic layers and organic layers are alternately stacked. In particular, since the organic layer of the encapsulation layer may have a relatively low viscosity, it is necessary to control the spreadability when it is disposed on the display panel. In order to control the spreadability of the organic layer of the encapsulation layer, a structural element such as a dam portion may be provided in the outer area of ​​the electroluminescent display.

[0005] The dam portion can be made of an organic material. However, there is a problem that organic materials cannot completely prevent moisture or hydrogen particles from penetrating from the outside. Various methods have been proposed. However, it is necessary to provide a structure and method for preventing hydrogen particles from penetrating and / or propagating into the display element. Summary of the Invention

[0006] An object of the present disclosure is to provide an electroluminescent display device including a dam structure for preventing moisture from intruding from the external environment. Another object of the present disclosure is to provide an electroluminescent display device including a structural element for preventing hydrogen particles from intruding from the external environment and propagating into a display element.

[0007] In order to achieve one of the above-mentioned purposes, an electroluminescent display device according to an embodiment of the present disclosure includes: a substrate; a driving layer arranged on the substrate; an emission layer arranged on the driving layer; an encapsulation layer arranged on the emission layer; and a dam portion surrounding a peripheral area of ​​the emission layer, the dam portion including an organic layer and a hydrogen absorption layer.

[0008] In one example, the organic layer includes: a first organic layer; a second organic layer on the first organic layer; and a third organic layer on the second organic layer. The hydrogen absorbing layer includes a first hydrogen absorbing layer contacting an inner wall side, a top side, and an outer wall side of the first organic layer.

[0009] In one example, the second organic layer covers the first organic layer and contacts the entire outer surface of the first hydrogen absorbing layer.

[0010] In one example, the hydrogen absorbing layer further includes a second hydrogen absorbing layer contacting the inner wall side, the top side, and the outer wall side of the second organic layer.

[0011] In one example, the hydrogen absorbing layer further includes a third hydrogen absorbing layer contacting the inner wall side, the top side, and the outer wall side of the third organic layer.

[0012] In one example, the organic layer includes: a first organic layer; a second organic layer on the first organic layer; and a third organic layer on the second organic layer. The hydrogen absorbing layer includes a first hydrogen absorbing layer disposed on the driving layer and covered by the first organic layer.

[0013] In one example, the hydrogen absorbing layer further includes a second hydrogen absorbing layer disposed on the first organic layer and covered by the second organic layer.

[0014] In one example, the hydrogen absorbing layer further includes a vertical hydrogen absorbing layer connecting the first hydrogen absorbing layer and the second hydrogen absorbing layer and penetrating the first organic layer.

[0015] In one example, the hydrogen absorbing layer further includes a third hydrogen absorbing layer disposed on the second organic layer and covered by the third organic layer.

[0016] In one example, the hydrogen absorbing layer further includes a vertical hydrogen absorbing layer connecting the first hydrogen absorbing layer and the third hydrogen absorbing layer and penetrating the first organic layer and the second organic layer.

[0017] In one example, the hydrogen absorbing layer further includes a second hydrogen absorbing layer contacting the inner wall side, the top side, and the outer wall side of the first organic layer.

[0018] In one example, the hydrogen absorbing layer includes a plurality of island shapes separated from each other.

[0019] In one example, the hydrogen absorbing layer further includes a second hydrogen absorbing layer disposed between the first inorganic layer and the second inorganic layer of the driving layer.

[0020] In one example, the hydrogen absorbing layer further includes a vertical hydrogen absorbing layer connecting the first hydrogen absorbing layer and the second hydrogen absorbing layer and penetrating the second inorganic layer.

[0021] In one example, the dam portion includes: an inner dam portion disposed near the display area; and an outer dam portion disposed outside the inner dam portion.

[0022] In one example, the organic layer includes: a bottom side in contact with the upper surface of the drive layer; a top side separated from the bottom side by a predetermined height; an inner wall side connecting the bottom side and the top side; and an outer wall side connecting the bottom side and the top side and facing the inner wall side. The hydrogen absorbing layer covers the inner wall side, the top side, and the outer wall side of the organic layer.

[0023] In one example, the organic layer includes: a bottom side in contact with the upper surface of the drive layer; a top side separated from the bottom side by a predetermined height; an inner wall side connecting the bottom side and the top side; and an outer wall side connecting the bottom side and the top side and facing the inner wall side. The hydrogen absorbing layer is disposed between the bottom side of the organic layer and the upper surface of the drive layer.

[0024] In one example, the organic layer includes: a bottom side in contact with the upper surface of the drive layer; a top side separated from the bottom side by a predetermined height; an inner wall side connecting the bottom side and the top side; and an outer wall side connecting the bottom side and the top side and facing the inner wall side. The hydrogen absorbing layer has a vertical wall shape that penetrates the organic layer from the top side to the bottom side and contacts the upper surface of the drive layer.

[0025] An electroluminescent display device according to one embodiment of the present disclosure may include a dam structure having a hydrogen absorption layer, which is used to block the intrusion of hydrogen particles and moisture from the external environment. In addition, even if hydrogen particles may invade the outermost surface of the display, the electroluminescent display device according to one embodiment of the present disclosure may also include a hydrogen absorption layer made of molybdenum, titanium or their alloy metals to prevent the hydrogen particles from propagating to the display element by absorbing the hydrogen particles. Therefore, the electroluminescent display device according to the present disclosure can prevent damage to the organic elements and oxide semiconductor elements due to the penetration and / or propagation of hydrogen particles and / or moisture from the external environment.

[0026] In addition to the above-mentioned effects of the present disclosure, other objects and features of the present disclosure will be clearly understood by those skilled in the art from the following description of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The accompanying drawings are included to provide a further understanding of the present disclosure and are incorporated in and constitute a part of this application. The accompanying drawings illustrate embodiments of the present disclosure and together with the description serve to explain the principles of the present disclosure. In the drawings:

[0028] Figure 1 is a plan view showing the structure of an electroluminescent display device according to the present disclosure.

[0029] Figure 2 It is along Figure 1 The cross-sectional view taken along the cutting line II' in FIG. 1 shows the structure of the electroluminescent display device according to the first embodiment of the present disclosure.

[0030] Figure 3 It is along Figure 1 The cross-sectional view taken along the cutting line II′ in FIG. 1 shows the structure of the electroluminescent display device according to the second embodiment of the present disclosure.

[0031] Figure 4 It is along Figure 1 The cross-sectional view taken along the cutting line II′ in FIG. 1 shows the structure of the electroluminescent display device according to the third embodiment of the present disclosure.

[0032] Figure 5 It is along Figure 1 A cross-sectional view taken along a cutting line II′ in FIG. 1 shows a structure of an electroluminescent display device according to a fourth embodiment of the present disclosure.

[0033] Figure 6 It is along Figure 1 A cross-sectional view taken along a cutting line II′ in FIG. 1 shows a structure of an electroluminescent display device according to a fifth embodiment of the present disclosure.

[0034] Figure 7 It is along Figure 1 A cross-sectional view taken along a cutting line II′ in FIG. 1 shows a structure of an electroluminescent display device according to a sixth embodiment of the present disclosure.

[0035] Figure 8 It is along Figure 1 The cross-sectional view taken along the cutting line II′ in FIG. 1 shows the structure of the electroluminescent display device according to the seventh embodiment of the present disclosure.

[0036] Figure 9 It is along Figure 1 The cross-sectional view taken along the cutting line II′ in FIG. 1 shows the structure of the electroluminescent display device according to the eighth embodiment of the present disclosure.

[0037] Figure 10 It is along Figure 1 A cross-sectional view taken along a cutting line II′ in FIG. 1 shows a structure of an electroluminescent display device according to a ninth embodiment of the present disclosure.

[0038] Figure 11 It is along Figure 1A cross-sectional view taken along a cutting line II′ in FIG. 1 shows a structure of an electroluminescent display device according to a tenth embodiment of the present disclosure.

[0039] Figure 12 It is along Figure 1 The cross-sectional view taken along the cutting line II′ in FIG. 1 shows the structure of the electroluminescent display device according to the eleventh embodiment of the present disclosure.

[0040] Figure 13 It is along Figure 1 A cross-sectional view taken along a cutting line II′ in FIG. 1 shows a structure of an electroluminescent display device according to a twelfth embodiment of the present disclosure.

[0041] Figure 14 It is along Figure 1 A cross-sectional view taken along a cutting line II′ in FIG. 1 shows a structure of an electroluminescent display device according to a thirteenth embodiment of the present disclosure. DETAILED DESCRIPTION

[0042] The advantages and features of the present disclosure and their implementation methods will be illustrated by the following embodiments described with reference to the accompanying drawings. However, the present disclosure may be implemented in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that the present disclosure is thorough and complete and fully conveys the scope of the present disclosure to those skilled in the art. Furthermore, the present disclosure is limited only by the scope of the claims.

[0043] The shapes, sizes, ratios, angles, and quantities disclosed in the accompanying drawings for describing the embodiments of the present disclosure are merely examples, and therefore, the present disclosure is not limited to the details shown. Throughout the specification, the same reference numerals refer to the same elements. In the following description, when it is determined that a detailed description of a related known function or configuration unnecessarily obscures the main points of the present disclosure, the detailed description will be omitted.

[0044] Where “including,” “having,” and “comprising” described in the present disclosure are used, other parts may be added unless “only—” is used. Terms in the singular form may include plural forms unless noted otherwise.

[0045] When explaining an element, although there is no explicit description, the element is interpreted as including an error range.

[0046] When describing a positional relationship, for example, when the positional relationship is described as "on," "over," "below," and "adjacent," one or more parts may be arranged between the two parts unless "just" or "directly" is used.

[0047] When describing a temporal relationship, for example, when a time sequence is described as "after," "subsequently," "next," and "before," discontinuous cases may be included unless "just" or "directly" is used.

[0048] It will be understood that although the terms "first," "second," etc., may be used herein to describe various elements, these elements should not be limited by these terms. These terms are merely used to distinguish one element from another. For example, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element, without departing from the scope of this disclosure.

[0049] The term "at least one" should be understood to include any and all combinations of one or more of the associated listed items. For example, the meaning of "at least one of the first, second, and third items" means all combinations of items listed from two or more of the first, second, and third items, as well as the first, second, or third item.

[0050] As will be fully appreciated by those skilled in the art, the features of the various embodiments of the present disclosure may be coupled or combined with each other in part or in whole, and may interoperate with each other and be driven technically in a variety of ways. The embodiments of the present disclosure may be performed independently of each other, or may be performed together in a mutually dependent relationship.

[0051] Hereinafter, an example of an electroluminescent display device according to the present disclosure will be described in detail with reference to the accompanying drawings. Throughout the drawings, the same reference numerals will be used wherever possible to refer to the same or like parts.

[0052] Figure 1 : is a plan view showing the structure of an electroluminescent display device according to the present disclosure. Figure 1 , the electroluminescent display device according to the present disclosure may include a substrate SUB, pixels P, a common power line CPL, a gate driving circuit 200 , a dam portion DM, and a driving integrated circuit 300 .

[0053] The substrate SUB is a base substrate (or base layer) and includes a plastic material or a glass material. In view of the characteristics of the display device, it is preferred that the substrate SUB is transparent. According to an example, the substrate SUB may have a rectangular shape, a rounded rectangular shape, or a non-rectangular shape in a plane, wherein each corner portion of the rounded rectangular shape is rounded with a certain curvature radius, and the non-rectangular shape has at least six sides. In this case, the substrate SUB having a non-rectangular shape may include at least one protrusion or at least one recessed portion.

[0054] According to one example, a substrate SUB can be divided into a display area AA and a non-display area IA. The display area AA is located in the majority of the central portion of the substrate SUB and can be defined as an area for displaying an image. According to one example, the display area AA can have a rectangular shape in plan view, a rounded rectangular shape with each corner portion rounded with a certain radius of curvature, or a non-rectangular shape having at least six sides. In this case, the non-rectangular display area AA may include at least one protrusion or at least one recessed portion.

[0055] The non-display area IA is provided on an edge region of the substrate SUB to surround the display area AA and may be defined as an area or peripheral area where an image is not displayed. According to an example, the non-display area IA may include a first non-display area IA1 provided on a first edge of the substrate SUB, a second non-display area IA2 provided on a second edge of the substrate SUB in parallel with the first non-display area IA1, a third non-display area IA3 provided on a third edge of the substrate SUB, and a fourth non-display area IA4 provided on a fourth edge of the substrate SUB in parallel with the third non-display area IA3. For example, the first non-display area IA1 may be, but is not limited to, an upper (or lower) edge region of the substrate SUB, the second non-display area IA2 may be, but is not limited to, a lower (or upper) edge region of the substrate SUB, the third non-display area IA3 may be, but is not limited to, a left (or right) edge region of the substrate SUB, and the fourth non-display area IA4 may be, but is not limited to, a right (or left) edge region of the substrate SUB.

[0056] A plurality of pixels P may be provided on the display area AA of the substrate SUB. The pixels P according to one example may be a plurality of pixels arranged in a matrix arrangement and may be arranged in the display area AA of the substrate SUB. The pixels P may be defined by scan lines SL, data lines DL, and pixel driving power lines PL.

[0057] The scan lines SL extend transversely along a first direction X and are arranged at regular intervals along a second direction Y intersecting the first direction X. The display area AA of the substrate SUB includes a plurality of scan lines SL spaced apart from one another along a second direction Y parallel to the first direction X. In this case, the first direction X may be defined as a horizontal direction of the substrate SUB, and the second direction Y may be defined as a vertical direction of the substrate SUB, or vice versa, without limitation.

[0058] The data lines DL extend longitudinally along the second direction Y and are arranged at intervals along the first direction X. The display area AA of the substrate SUB includes a plurality of data lines DL spaced apart from each other along the first direction X in parallel with the second direction Y.

[0059] The pixel driving power lines PL may be arranged on the substrate SUB to be parallel to the data lines DL. The display area AA of the substrate SUB includes a plurality of pixel driving power lines PL parallel to the data lines DL. Alternatively, the pixel driving power lines PL may be arranged to be parallel to the scan lines SL.

[0060] According to an example, the pixels P may be arranged on the display area AA to have a stripe structure. In this case, a unit pixel may include a red sub-pixel, a green sub-pixel, and a blue sub-pixel. In addition, a unit pixel may also include a white sub-pixel.

[0061] According to another example, the pixel P may be arranged on the display area AA to have a pentile structure. In this case, a unit pixel may include at least one red sub-pixel, at least two green sub-pixels, and at least one blue pixel arranged in a polygonal shape in two dimensions. For example, a unit pixel having a pentile structure may be arranged such that one red sub-pixel, two green sub-pixels, and one blue sub-pixel have an octagonal shape in two dimensions. In this case, the blue sub-pixel may have a relatively large opening area (or light-emitting area), while the green sub-pixel may have a relatively small opening area.

[0062] The pixel P may include a pixel circuit PC and a light emitting diode ED electrically connected to the pixel circuit PC. The pixel circuit PC is electrically connected to the scan line SL, the data line DL, and the driving power line PL adjacent thereto.

[0063] The pixel circuit PC controls the current Ied flowing from the pixel driving power line PL to the light emitting diode ED based on the data voltage supplied from the adjacent data line DL in response to the scan signal supplied from at least one scan line SL adjacent thereto.

[0064] According to one example, the pixel circuit PC may include at least two thin film transistors and a capacitor. For example, the pixel circuit PC may include a driving thin film transistor that supplies a data current Ied based on a data voltage to the light emitting diode ED, a switching thin film transistor that supplies a data voltage supplied from the data line DL to the driving thin film transistor, and a capacitor that stores a gate-source voltage of the driving thin film transistor.

[0065] According to another example, the pixel circuit PC may include at least three thin film transistors and at least one capacitor. For example, according to the operation (or function) of each of the at least three thin film transistors, the pixel circuit PC according to another example may include a current supply circuit, a data supply circuit, and a compensation circuit. In this case, the current supply circuit may include a driving thin film transistor that supplies a data current Ied based on a data voltage to the light emitting diode ED. The data supply circuit may include at least one switching thin film transistor that supplies a data voltage supplied from the data line DL to the current supply circuit in response to at least one scan signal. The compensation circuit may include at least one compensation thin film transistor that compensates for changes in the characteristic value (threshold voltage and / or mobility) of the driving thin film transistor in response to at least one scan signal.

[0066] The light emitting diode ED emits light with a brightness corresponding to the data current Ied supplied from the pixel circuit PC. In this case, the data current Ied may flow from the driving power line PL to the common power line CPL through the driving thin film transistor and the light emitting diode ED.

[0067] According to one example, the light emitting diode ED may include a pixel driving electrode (not shown) (or a first electrode or anode) electrically connected to the pixel circuit PC, a light emitting layer (not shown) formed on the pixel driving electrode, and a common electrode CE (or a second electrode or cathode) electrically connected to the light emitting layer.

[0068] The common power line CPL is arranged on the non-display area IA of the substrate SUB and is electrically connected to the common electrode CE arranged on the display area AA. According to one example, the common power line CPL has a certain line width and is arranged along the second to fourth non-display areas IA2, IA3, and IA4 adjacent to the display area AA of the substrate SUB, and surrounds all portions except the portion of the display area AA adjacent to the first non-display area IA1 of the substrate SUB. One end of the common power line CPL can be arranged on one side of the first non-display area IA1, and the other end of the common power line CPL can be arranged on the other side of the first non-display area IA1. One end and the other end of the common power line CPL can be arranged to surround the second to fourth non-display areas IA2, IA3, and IA4. Therefore, according to one example, the common power line CPL can have a two-dimensional "∩" shape, with one side of the "∩" shape corresponding to the first non-display area IA1 of the substrate SUB being open.

[0069] An encapsulation layer may be formed on the substrate SUB to surround the upper surface and side surfaces of the display area AA and the common power line CPL. The encapsulation layer may also expose one end and the other end of the common power line CPL in the first non-display area IA1. The encapsulation layer may prevent oxygen or water from penetrating into the light-emitting diodes ED disposed in the display area AA. According to one example, the encapsulation layer may include at least one inorganic film. According to another example, the encapsulation layer may include multiple inorganic films and an organic film interposed between the multiple inorganic films.

[0070] The electroluminescent display device according to one embodiment of the present disclosure may include a pad portion PP, a gate driving circuit 200 , and a driving integrated circuit 300 .

[0071] The pad portion PP may include a plurality of pads disposed in the non-display area IA of the substrate SUB. According to one example, the pad portion may include a plurality of common power supply pads, a plurality of data input pads, a plurality of power supply pads, and a plurality of control signal input pads disposed in the first non-display area IA1 of the substrate SUB.

[0072] The gate driver circuit 200 is disposed in the third non-display area IA3 and / or the fourth non-display area IA4 of the substrate SUB and is connected one-to-one with the scan lines SL disposed in the display area AA. The gate driver circuit 200 can be integrated with the third non-display area IA3 and / or the fourth non-display area IA4 of the substrate SUB using the manufacturing process of the pixel P (i.e., the manufacturing process of the thin film transistor). The gate driver circuit 200 generates scan signals based on gate control signals supplied from the driver integrated circuit 300 and outputs the scan signals in a given sequence, thereby driving each of the plurality of scan lines SL in the given sequence. The gate driver circuit 200 according to one example may include a shift register.

[0073] The dam portion DM may have a closed curve structure, wherein the dam portion DM is disposed in the first non-display area IA1, the second non-display area IA2, the third non-display area IA3, and the fourth non-display area IA4 of the substrate SUB to surround the periphery of the display area AA. For example, the dam portion DM may be disposed outside the common power line CPL and thus located at the outermost portion above the substrate SUB. Preferably, the pad portion PP and the driver integrated circuit 300 are disposed in the area outside the dam portion DM.

[0074] although Figure 1 The weir portion DM is shown to be arranged at the outermost portion, but the weir portion DM is not limited to Figure 1As another example, the dam portion DM may be disposed between the common power line CPL and the gate driving circuit 200. As another example, the dam portion DM may be disposed between the display area AA and the gate driving circuit 200. The dam portion DM may have a closed curve shape that completely surrounds the display area AA from the outside of the display area AA.

[0075] The driver integrated circuit 300 is packaged in a chip packaging area defined in the first non-display area IA1 of the substrate SUB through a chip packaging (bonding) process. The input terminals of the driver integrated circuit 300 are electrically connected to the pad portion PP and, therefore, to the plurality of data lines DL and the plurality of pixel drive power lines PL provided in the display area AA. The driver integrated circuit 300 receives various power supplies, timing synchronization signals, and digital image data input from the display driver circuit portion (or host circuit) via the pad portion PP. The driver integrated circuit 300 controls the driving of the gate driver circuit 200 by generating gate control signals based on the timing synchronization signals. Furthermore, the driver integrated circuit 300 converts the digital image data into analog pixel data voltages, supplying the converted data voltages to the corresponding data lines DL.

[0076] <First embodiment>

[0077] Reference Figure 2 , an electroluminescent display device according to a first embodiment of the present disclosure will be described. Figure 2 It is along Figure 1 The cross-sectional view taken along the cutting line II' in FIG. 1 shows the structure of the electroluminescent display device according to the first embodiment of the present disclosure.

[0078] The electroluminescent display device according to the first embodiment of the present disclosure may include a substrate SUB, a pixel array layer 120 , a spacer SP, and an encapsulation layer 130 .

[0079] The substrate SUB is a base layer and includes a plastic material or a glass material. According to one example, the substrate SUB may include an opaque or colored polyimide material. According to another example, the electroluminescent display device may include a backplane attached to the rear surface of the substrate SUB. The backplane may be an element for maintaining the substrate SUB in a flat state. The backplane may be made of a plastic material such as a polyethylene terephthalate material.

[0080] According to another embodiment of the present disclosure, the substrate SUB may be a flexible glass substrate. For example, the flexible glass substrate SUB may be a thin glass substrate having a thickness of 100 μm or less, or a glass substrate etched to a thickness of 100 μm or less by a substrate etching process.

[0081] The substrate SUB may include a display area AA and a non-display area IA surrounding the display area AA. Figure 2 The non-display area IA shown in FIG may correspond to Figure 1 The fourth non-display area IA4 is shown in FIG.

[0082] A buffer film (not shown) may be formed on the upper surface of the substrate SUB. The buffer film is formed on one surface of the substrate SUB to prevent water from penetrating into the pixel array layer 120 through the substrate SUB, which is susceptible to water penetration. The buffer film according to one example may be made of a plurality of inorganic films deposited alternately. For example, the buffer film may be formed of a multilayer film of one or more inorganic films of a silicon oxide film (SiOx), a silicon nitride film (SiNx), and SiON deposited alternately. In the drawings, the buffer film is omitted for convenience.

[0083] The pixel array layer 120 may include a driving layer 100 and an emission layer 110. The driving layer 100 may include a plurality of thin film transistors T, and the emission layer 110 may include a plurality of light emitting diodes ED. The pixel array layer 120 may include a thin film transistor layer, a planarization layer PLN, a bank pattern BN, and light emitting diodes ED.

[0084] According to an example, the driving layer 100 may include a thin film transistor T, a gate insulating film GI, and an intermediate insulating layer ILD. In this case, Figure 2 The thin film transistor T shown in FIG. 5 may be a driving thin film transistor electrically connected to the light emitting diode ED.

[0085] The thin film transistor T includes a semiconductor A, a gate electrode G, a source electrode S, and a drain electrode D formed on a substrate SUB or a buffer film. Figure 2 The thin film transistor T is shown but not limited to a top-gate structure in which the gate electrode G is arranged above the semiconductor layer A. For another example, the thin film transistor T may have a bottom-gate structure in which the gate electrode G is arranged below the semiconductor layer A, or a dual-gate structure in which the gate electrode G is arranged above and below the semiconductor layer A.

[0086] The semiconductor layer A may be formed on the substrate SUB or the buffer film. The semiconductor layer A may include a silicon-based semiconductor material, an oxide-based semiconductor material, or an organic-based semiconductor material, and may have a single-layer structure or a multi-layer structure. A light shielding layer may be further formed between the buffer film and the semiconductor layer A to shield the semiconductor layer A from external light.

[0087] A gate insulating film GI may be formed on the entire substrate SUB to cover the semiconductor layer A. The gate insulating film GI may be formed of an inorganic film such as a silicon oxide (SiOx) film, a silicon nitride (SiNx) film, or a multilayer film of SiOx and SiNx.

[0088] A gate electrode G may be formed on the gate insulating film GI to overlap the semiconductor layer A. The gate electrode G may be formed together with the scan line SL. The gate electrode G according to one example may be formed of a single layer or multiple layers of any one of Mo, Al, Cr, Au, Ti, Ni, Nd, and Cu, or an alloy thereof.

[0089] An intermediate insulating layer ILD may be formed on the entire substrate SUB to cover the gate electrode G and the gate insulating film GI. The intermediate insulating layer ILD provides a planarized surface on the gate electrode G and the gate insulating film GI.

[0090] A source electrode S and a drain electrode D may be formed on the intermediate insulating layer ILD to overlap the semiconductor layer A. A gate electrode G is disposed between the source electrode S and the drain electrode D. The source electrode S and the drain electrode D may be formed together with the data line DL, the driving power line PL, and the common power line CPL. For example, the source electrode S, the drain electrode D, the data line DL, the driving power line PL, and the common power line CPL may be formed separately by simultaneously patterning the source-drain electrode materials.

[0091] Each of the source electrode S and the drain electrode D can be connected to the semiconductor layer A through an electrode contact hole that passes through the intermediate insulating layer ILD and the gate insulating film GI. The source electrode S and the drain electrode D can be formed of a single layer or multiple layers of any one of Mo, Al, Cr, Au, Ti, Ni, Nd, and Cu, or an alloy thereof. In this case, Figure 2 The source electrode S of the thin film transistor T shown in FIG may be electrically connected to the pixel driving power line PL.

[0092] As described above, the thin film transistor T provided in the pixel P of the substrate SUB constitutes the pixel circuit PC. Figure 1 The gate driving circuit 200 arranged in the fourth non-display area IA4 of the substrate SUB shown in FIG may include a thin film transistor T (such as Figure 2 ) the same or similar thin film transistor as shown in .

[0093] A planarization layer PLN is formed on the entire substrate SUB to cover the driving layer 100. The planarization layer PLN provides a planarized surface on the driving layer 100. According to one example, the planarization layer PLN may be formed of an organic film or an inorganic film. In the case of an inorganic film, the planarization layer PLN may include silicon oxide (SiOx), silicon nitride (SiNx) or a multilayer thereof. In the case of an organic film, the planarization layer PLN may include an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin or a polyimide resin. In another case, the planarization layer PLN may have a structure in which organic films and inorganic films are alternately stacked. According to another example, the planarization layer PLN may include a pixel contact hole PH for exposing a drain electrode D of a driving thin film transistor provided in the pixel P.

[0094] The bank pattern BN is disposed on the planarization layer PLN and defines an opening area (or a light emitting area) inside the pixel P of the display area AA. The bank pattern BN may be denoted as a pixel defining film.

[0095] The light-emitting diode ED may include a pixel drive electrode AE, a light-emitting layer EL, and a common electrode CE. The pixel drive electrode AE ​​is formed on the planarization layer PLN and is electrically connected to the drain electrode D of the drive thin film transistor through a pixel contact hole PH provided in the planarization layer PLN. In this case, the edge portions of the pixel drive electrode AE, excluding the central portion, that overlap with the opening area of ​​the pixel P may be covered by a bank pattern BN. The bank pattern BN may define the opening area of ​​the pixel P by covering the edge portions of the pixel drive electrode AE.

[0096] According to one example, the pixel driving electrode AE ​​may include a metal material with high reflectivity. For example, the pixel driving electrode AE ​​may be formed of a multilayer structure such as a deposition structure of aluminum (Al) and titanium (Ti) (Ti / Al / Ti), a deposition structure of Al and ITO (ITO / Al / ITO), an APC (Ag / Pd / Cu) alloy, and a deposition structure of an APC alloy and ITO (ITO / APC / ITO), or may include a single-layer structure made of any one material selected from Ag, Al, Mo, Au, Mg, Ca, and Ba, or an alloy material of two or more thereof.

[0097] A light-emitting layer EL is formed entirely on the display area AA of the substrate SUB to cover the pixel driving electrode AE ​​and the bank pattern BN. According to one example, the light-emitting layer EL may include two or more light-emitting portions vertically deposited to emit white light. For example, according to one example, the light-emitting layer EL may include a first light-emitting portion and a second light-emitting portion that emit white light by combining the first light and the second light.

[0098] The light emitting layer EL according to another example may include any one of a blue light emitting portion, a green light emitting portion, and a red light emitting portion to emit color light corresponding to the color set in the pixel P. For example, the light emitting layer EL may include any one of an organic light emitting layer, an inorganic light emitting layer, and a quantum dot light emitting layer, or may include a deposition structure or a combined structure of an organic light emitting layer (or an inorganic light emitting layer) and a quantum dot light emitting layer.

[0099] In addition, the light emitting diode ED according to one example may further include a functional layer for improving the light emitting efficiency and / or lifespan of the light emitting layer EL.

[0100] The common electrode CE is formed to be electrically connected to the light emitting layer EL. The common electrode CE is formed on the entire display area AA of the substrate SUB and is thus commonly connected to the light emitting layer EL provided in each pixel P.

[0101] According to one example, the common electrode CE includes a transparent conductive material or a semi-transmissive conductive material that can transmit light. When the common electrode CE is formed of a semi-transmissive conductive material, the luminous efficiency of light emitted from the light-emitting diode ED can be enhanced through a microcavity structure. According to one example, the semi-transmissive conductive material may include Mg, Ag, or an alloy of Mg and Ag. In addition, a cap layer may be formed on the common electrode CE to improve the light emission efficiency by controlling the refractive index of light emitted from the light-emitting diode ED.

[0102] Spacers SP may be arranged to be distributed in the opening region within the display area AA, i.e., in a region where no light-emitting diodes ED are arranged. The spacers SP are intended to prevent the screen mask and the substrate from contacting each other during the process of depositing the light-emitting layer EL. The spacers SP are arranged on the bank pattern BN and may be deposited to allow the light-emitting layer EL and the common electrode CE to span / cover the spacers SP arranged within the display area AA.

[0103] Depending on circumstances, the light emitting layer EL and / or the common electrode CE may not cross the spacer SP. Since the spacer SP is arranged only in a portion of the bank pattern BN inside the display area AA, even if the common electrode CE does not cross the spacer SP, the common electrode CE has a structure connected to the display area AA while completely covering the display area AA.

[0104] The encapsulation layer 130 is formed to surround the upper surface and side surfaces of the emission layer 110. The encapsulation layer 130 serves to prevent oxygen or water from penetrating into the light emitting diode ED.

[0105] The encapsulation layer 130 according to an example may include a first inorganic encapsulation layer PAS1, an organic encapsulation layer PCL on the first inorganic encapsulation layer PAS1, and a second inorganic encapsulation layer PAS2 on the organic encapsulation layer PCL. The first inorganic encapsulation layer PAS1 and the second inorganic encapsulation layer PAS2 are used to prevent water or oxygen from penetrating into the light emitting diode ED. Each of the first inorganic encapsulation layer PAS1 and the second inorganic encapsulation layer PAS2 may be formed of an inorganic material such as silicon nitride, aluminum nitride, zirconium nitride, titanium nitride, hafnium nitride, tantalum nitride, silicon oxide, aluminum oxide, or titanium oxide. The first inorganic encapsulation layer PAS1 and the second inorganic encapsulation layer PAS2 may be formed by a chemical vapor deposition (CVD) process or an atomic layer deposition (ALD) process.

[0106] The organic encapsulation layer PCL is surrounded by the first inorganic encapsulation layer PAS1 and the second inorganic encapsulation layer PAS2. The organic encapsulation layer PCL can be formed to be relatively thicker than the first inorganic encapsulation layer PAS1 and / or the second inorganic encapsulation layer PAS2 to adsorb and / or shield particles that may appear during the manufacturing process. The organic encapsulation layer PCL can be made of an organic material such as SiOCx (silicon oxygen carbon) acrylic or epoxy resin. The organic encapsulation layer PCL can be formed by a coating process (e.g., an inkjet coating process or a slit coating process).

[0107] The electroluminescent display device according to the first embodiment of the present disclosure may further include a dam portion (or dam structure) DM. The dam portion DM is arranged in the non-display area IA of the substrate SUB to prevent the organic encapsulation layer PCL from overflowing. In addition, the dam portion DM can prevent the penetration of hydrogen gas or hydrogen particles that may be introduced from the lower surface side of the encapsulation layer 130.

[0108] According to one example, the dam portion DM may be arranged outside the display area AA, the gate driver circuit 200 arranged outside the display area AA, and the common power line CPL arranged outside the gate driver circuit 200. Depending on the situation, the dam portion DM may be arranged to overlap the outer side of the common power line CPL. In this case, the width of the non-display area IA where the gate driver circuit 200 and the common power line CPL are arranged can be reduced to reduce the bezel width.

[0109] The dam portion DM may include an organic layer OM and a hydrogen absorbing layer MT. For example, the organic layer OM may be formed on the intermediate insulating layer ILD of the drive layer 100. As another example, a buffer layer may be deposited before the planarization layer PLN is deposited on the drive layer 100. In this case, the organic layer OM may be formed on the buffer layer. Here, the organic layer OM may be made of the same material as the spacer SP formed in the display area AA. Otherwise, the organic layer OM may be made of the same material as the planarization layer PLN and / or the dam portion BN.

[0110] The organic layer OM may have a trapezoidal shape, with a cross-sectional shape including a bottom side, a top side, an inner wall side, and an outer wall side. For example, the bottom side may contact the upper surface of the drive layer 100. The top side may be parallel to the bottom side and separated from the bottom side by a predetermined height. The distance between the bottom side and the top side may correspond to the height of the organic layer OM. The inner wall side may connect the bottom side to the top side and face the display area AA. The outer wall side may connect the bottom side to the top side and be arranged to face outward symmetrically with the inner wall side.

[0111] The hydrogen absorbing layer MT may be a thin film layer covering the organic layer OM. For example, the hydrogen absorbing layer MT may be stacked and in contact with the organic layer OM to cover the inner wall, top side, and outer wall side. The hydrogen absorbing layer MT is used to prevent hydrogen particles from penetrating from the outside and may preferably be made of a material having excellent properties for absorbing hydrogen particles. For example, the hydrogen absorbing layer MT may be made of molybdenum (Mo), titanium (Ti), or an alloy metal of molybdenum and titanium.

[0112] The dam portion DM may be covered by the first inorganic encapsulation layer PAS1 and / or the second inorganic encapsulation layer PAS2 of the encapsulation layer 130. The organic encapsulation layer PCL may be provided to a certain height on the inner wall side of the dam portion DM. For example, the height of the organic encapsulation layer PCL in the outermost region may be lower than the top side of the organic layer OM of the dam portion DM. Therefore, at the top side and outer wall side of the dam portion DM, the first inorganic encapsulation layer PAS1 and the second inorganic encapsulation layer PAS2 may be in contact with each other facing each other.

[0113] The dam portion DM according to the first embodiment of the present disclosure may include a hydrogen absorption layer MT for preventing hydrogen particles from propagating to the display area AA by absorbing hydrogen particles that may penetrate from the outside. Therefore, the emission layer EL and / or the semiconductor layer A including an oxide semiconductor material provided on the display area AA can be protected from the effects of hydrogen particles. Therefore, the electroluminescent display device according to the first embodiment of the present disclosure can have a long service life and high quality for a long service life.

[0114] <Second embodiment>

[0115] In the following, reference is made to Figure 3 , an electroluminescent display device according to a second embodiment of the present disclosure will be described. Figure 3 It is along Figure 1 The cross-sectional view taken along the cutting line II′ in FIG. 1 shows the structure of the electroluminescent display device according to the second embodiment of the present disclosure.

[0116] The electroluminescent display device according to the second embodiment can have a structure very similar to that of the first embodiment. The structure and / or shape of the weir portion DM may differ. Therefore, the description will focus on the structure and / or shape of the weir portion DM, but the same description may not be repeated. Reference can be made to the description of the first embodiment when necessary.

[0117] Reference Figure 3 The dam portion DM according to the second embodiment of the present disclosure may include an organic layer OM and a hydrogen absorbing layer MT. For example, the organic layer OM may be made of the same material as the spacer SP formed in the display area AA. For another example, the organic layer OM may be made of the same material as the planarization layer PLN and / or the bank BN.

[0118] The organic layer OM may have a trapezoidal shape, with a cross-sectional shape including a bottom side, a top side, an inner wall side, and an outer wall side. For example, the bottom side may contact the upper surface of the drive layer 100. The top side may be parallel to the bottom side and separated from the bottom side by a predetermined height. The distance between the bottom side and the top side may correspond to the height of the organic layer OM. The inner wall side may connect the bottom side to the top side and face the display area AA. The outer wall side may connect the bottom side to the top side and be arranged to face outward symmetrically with the inner wall side.

[0119] The hydrogen absorbing layer MT may be a thin film layer disposed and / or stacked between the organic layer OM and the driving layer 100. For example, the hydrogen absorbing layer MT may be disposed between the bottom side of the organic layer OM and the upper surface of the driving layer 100, and may be completely covered by the organic layer OM. In other words, the bottom surface of the organic layer OM may be in contact with the upper surface of the hydrogen absorbing layer MT and the upper surface of the driving layer 100. The hydrogen absorbing layer MT is used to prevent hydrogen particles from penetrating from the outside, and preferably, the hydrogen absorbing layer MT may include a material having excellent properties for absorbing hydrogen particles. For example, the hydrogen absorbing layer MT may be made of molybdenum (Mo) or titanium (Ti) or an alloy metal of molybdenum and titanium.

[0120] The dam portion DM according to the second embodiment of the present disclosure may include a hydrogen absorbing layer MT disposed below the organic layer OM. This layer prevents hydrogen particles from propagating into the display area AA by absorbing them. Specifically, gaseous foreign matter invading the display device may primarily penetrate from the side of the interface between the intermediate insulating layer ILD and the organic layer OM. Therefore, disposing the hydrogen absorbing layer MT at a location where hydrogen particles are likely to penetrate is preferred, effectively absorbing the permeated hydrogen particles and thereby protecting the display elements arranged in the display area AA.

[0121] <Third embodiment>

[0122] In the following, reference is made to Figure 4, an electroluminescent display device according to a third embodiment of the present disclosure will be described. Figure 4 It is along Figure 1 The cross-sectional view taken along the cutting line II′ in FIG. 1 shows the structure of the electroluminescent display device according to the third embodiment of the present disclosure.

[0123] The electroluminescent display device according to the third embodiment can have a structure very similar to that of the first embodiment. The structure and / or shape of the weir portion DM may differ. Therefore, the description will focus on the structure and / or shape of the weir portion DM, but the same description may not be repeated. Reference can be made to the description of the first embodiment when necessary.

[0124] Reference Figure 4 , the dam portion DM according to the third embodiment of the present disclosure may include an organic layer OM and a hydrogen absorbing layer MT. The organic layer OM may have a trapezoidal shape, and its cross-sectional shape includes a bottom side, a top side, an inner wall side, and an outer wall side. For example, the bottom side may contact the upper surface of the driving layer 100. The top side may be parallel to the bottom side and separated from the bottom side by a predetermined height. The distance between the bottom side and the top side may correspond to the height of the organic layer OM. The inner wall side may connect the bottom side to the top side and face the display area AA. The outer wall side may connect the bottom side to the top side and be arranged to face the outside so as to be symmetrical with the inner wall side.

[0125] The hydrogen absorbing layer MT may have a vertical wall shape that penetrates the middle portion of the organic layer OM. For example, the hydrogen absorbing layer MT may be a thin film wall sheet that fills a vertical through hole extending from the top to the bottom of the organic layer OM. The hydrogen absorbing layer MT is used to prevent hydrogen particles from penetrating from the outside and may preferably be made of a material having excellent properties for absorbing hydrogen particles. For example, the hydrogen absorbing layer MT may be made of molybdenum (Mo), titanium (Ti), or an alloy metal of molybdenum and titanium.

[0126] The dam portion DM according to the third embodiment of the present disclosure may include a hydrogen absorbing layer MT having a vertical wall shape vertically passing through the middle of the organic layer OM.

[0127] <Fourth embodiment>

[0128] In the following, reference is made to Figure 5 , an electroluminescent display device according to a fourth embodiment of the present disclosure will be described. Figure 5 It is along Figure 1 A cross-sectional view taken along a cutting line II′ in FIG. 1 shows a structure of an electroluminescent display device according to a fourth embodiment of the present disclosure.

[0129] The electroluminescent display device according to the fourth embodiment can have a structure very similar to that of the first embodiment. The structure and / or shape of the weir portion DM may differ. Therefore, the description will focus on the structure and / or shape of the weir portion DM, but the same description may not be repeated. Reference can be made to the description of the first embodiment when necessary.

[0130] The dam portion DM according to the fourth embodiment of the present disclosure may have a multilayer structure in which a plurality of thin film layers are vertically stacked on a substrate SUB. For example, the dam portion DM according to the fourth embodiment may include a first organic layer OM1, a second organic layer OM2, a third organic layer OM3, and a hydrogen absorbing layer MT.

[0131] The first organic layer OM1 may be made of the same material as the planarization layer PLN while the planarization layer PLN is formed. The first organic layer OM1 may have a trapezoidal shape, and its cross-sectional shape includes a bottom side, a top side, an inner wall side, and an outer wall side. For example, the bottom side may contact the upper surface of the driving layer 100. The top side may be parallel to the bottom side and separated from the bottom side by a predetermined height. The distance between the bottom side and the top side may correspond to the height of the first organic layer OM1. The inner wall side may connect the bottom side to the top side and face the display area AA. The outer wall side may connect the bottom side to the top side and be arranged to face outward so as to be symmetrical with the inner wall side.

[0132] The hydrogen absorbing layer MT may be stacked on the first organic layer OM1, covering the inner wall side, the top side, and the outer wall side. The hydrogen absorbing layer MT is used to prevent hydrogen particles from penetrating from the outside, and preferably, the hydrogen absorbing layer MT may include a material having excellent properties for absorbing hydrogen particles. For example, the hydrogen absorbing layer MT may be made of molybdenum (Mo) or titanium (Ti), or an alloy metal of molybdenum and titanium.

[0133] The second organic layer OM2 may be formed of the same material as the embankment pattern BN at the same time as the embankment pattern BN is formed. The second organic layer OM2 may have a trapezoidal shape, and its cross-sectional shape includes a bottom side, a top side, an inner wall side, and an outer wall side. For example, the bottom side may be in contact with the upper surface of the hydrogen absorbing layer MT. The top side of the second organic layer OM2 may be parallel to the bottom side of the second organic layer OM2 and separated from the bottom side by a predetermined height. The distance between the bottom side and the top side may correspond to the height of the second organic layer OM2. The inner wall side may connect the bottom side to the top side and face the display area AA. The outer wall side may connect the bottom side to the top side and be arranged to face outward so as to be symmetrical with the inner wall side.

[0134] The third organic layer OM3 may be formed from the same material as the spacer SP at the same time as the spacer SP is formed. The third organic layer OM3 may have a trapezoidal shape, and its cross-sectional shape includes a bottom side, a top side, an inner wall side, and an outer wall side. For example, the bottom side may be in contact with the top side of the second organic layer OM2. The top side of the third organic layer OM3 may be parallel to the bottom side of the third organic layer OM3 and separated from the bottom side by a predetermined height. The distance between the bottom side and the top side may correspond to the height of the third organic layer OM3. The inner wall side may connect the bottom side to the top side and face the display area AA. The outer wall side may connect the bottom side to the top side and be arranged to face outward so as to be symmetrical with the inner wall side.

[0135] The first, second, and third organic layers OM1, OM2, and OM3 forming the dam portion DM according to the fourth embodiment may have successively smaller cross-sectional areas such that a cross-sectional area of ​​an organic layer disposed at a lower position may be wider than a cross-sectional area of ​​an organic layer disposed at an upper position.

[0136] All of the dam portion DM may be covered by the first inorganic encapsulation layer PAS1 and / or the second inorganic encapsulation layer PAS2. For example, the height of the organic encapsulation layer PCL in the outermost region may be higher than the first organic layer OM1 of the dam portion DM and lower than the height of the second organic layer OM2 of the dam portion DM. In addition, the height of the organic encapsulation layer PCL in the outermost region may be higher than the second organic layer OM2 of the dam portion DM and lower than the height of the third organic layer OM3 of the dam portion DM.

[0137] When the thickness of the organic encapsulation layer PCL is relatively thin so that the spreadability of the organic encapsulation layer PCL can be easily controlled, the height of the dam portion DM may not be very high. In this case, the third organic layer OM3 may be omitted.

[0138] <Fifth embodiment>

[0139] In the following, reference is made to Figure 6 , an electroluminescent display device according to a fifth embodiment of the present disclosure will be described. Figure 6 It is along Figure 1 A cross-sectional view taken along a cutting line II′ in FIG. 1 shows a structure of an electroluminescent display device according to a fifth embodiment of the present disclosure.

[0140] The electroluminescent display device according to the fifth embodiment can have a structure very similar to that of the first embodiment. The structure and / or shape of the weir portion DM may differ. Therefore, the description will focus on the structure and / or shape of the weir portion DM, but the same description may not be repeated. Reference can be made to the description of the first embodiment when necessary.

[0141] The dam portion DM according to the fifth embodiment of the present disclosure may have a multilayer structure in which a plurality of thin film layers are vertically stacked on a substrate SUB. For example, the dam portion DM according to the fifth embodiment may include a first organic layer OM1, a second organic layer OM2, a third organic layer OM3, a first hydrogen absorbing layer MT1, a second hydrogen absorbing layer MT2, and a third hydrogen absorbing layer MT3.

[0142] The first organic layer OM1 may be made of the same material as the planarization layer PLN while the planarization layer PLN is formed. The first organic layer OM1 may have a trapezoidal shape, and its cross-sectional shape includes a bottom side, a top side, an inner wall side, and an outer wall side. For example, the bottom side may contact the upper surface of the driving layer 100. The top side may be parallel to the bottom side and separated from the bottom side by a predetermined height. The distance between the bottom side and the top side may correspond to the height of the first organic layer OM1. The inner wall side may connect the bottom side to the top side and face the display area AA. The outer wall side may connect the bottom side to the top side and be arranged to face outward so as to be symmetrical with the inner wall side.

[0143] The first hydrogen absorbing layer MT1 may be stacked on the first organic layer OM1, covering the inner wall side, the top side, and the outer wall side. The first hydrogen absorbing layer MT1 is used to prevent hydrogen particles from penetrating from the outside, and preferably, the first hydrogen absorbing layer MT1 may include a material having excellent properties for absorbing hydrogen particles. For example, the first hydrogen absorbing layer MT1 may be made of molybdenum (Mo) or titanium (Ti), or an alloy metal of molybdenum and titanium.

[0144] The second organic layer OM2 may be made of the same material as the embankment pattern BN while forming the embankment pattern BN. The second organic layer OM2 may have a trapezoidal shape, and its cross-sectional shape includes a bottom side, a top side, an inner wall side, and an outer wall side. For example, the bottom side may be in contact with the upper surface of the first hydrogen absorbing layer MT1. The top side of the second organic layer OM2 may be parallel to the bottom side of the second organic layer OM2 and separated from the bottom side by a predetermined height. The distance between the bottom side and the top side may correspond to the height of the second organic layer OM2. The inner wall side may connect the bottom side to the top side and face the display area AA. The outer wall side may connect the bottom side to the top side and be arranged to face outward so as to be symmetrical with the inner wall side.

[0145] The second hydrogen absorbing layer MT2 may be stacked on the second organic layer OM2, covering the inner wall side, the top side, and the outer wall side of the second organic layer OM2. The second hydrogen absorbing layer MT2 is used to prevent hydrogen particles from penetrating from the outside, and preferably, the second hydrogen absorbing layer MT2 may include a material having excellent properties for absorbing hydrogen particles. For example, the second hydrogen absorbing layer MT2 may be made of molybdenum (Mo) or titanium (Ti), or an alloy metal of molybdenum and titanium.

[0146] The third organic layer OM3 may be formed of the same material as the spacer SP at the same time as the spacer SP is formed. The third organic layer OM3 may have a trapezoidal shape, and its cross-sectional shape includes a bottom side, a top side, an inner wall side, and an outer wall side. For example, the bottom side of the third organic layer OM3 may be in contact with the upper surface of the second hydrogen absorbing layer MT2. The top side of the third organic layer OM3 may be parallel to the bottom side of the third organic layer OM3 and separated from the bottom side by a predetermined height. The distance between the bottom side and the top side may correspond to the height of the third organic layer OM3. The inner wall side may connect the bottom side to the top side and face the display area AA. The outer wall side may connect the bottom side to the top side and be arranged to face outward so as to be symmetrical with the inner wall side.

[0147] The third hydrogen absorbing layer MT3 may be stacked on the third organic layer OM3, covering the inner wall side, the top side, and the outer wall side of the third organic layer OM3. The third hydrogen absorbing layer MT3 is used to prevent hydrogen particles from penetrating from the outside, and preferably, the third hydrogen absorbing layer MT3 may include a material having excellent properties for absorbing hydrogen particles. For example, the third hydrogen absorbing layer MT3 may be made of molybdenum (Mo) or titanium (Ti), or an alloy metal of molybdenum and titanium.

[0148] For another example, any one of the second hydrogen absorbing layer MT2 and the third hydrogen absorbing layer MT3 may be omitted. In these cases, the second organic layer OM2 and the third organic layer OM3 may be included in the dam portion DM.

[0149] <Sixth embodiment>

[0150] In the following, reference is made to Figure 7 , an electroluminescent display device according to a sixth embodiment of the present disclosure will be described. Figure 7 It is along Figure 1 A cross-sectional view taken along a cutting line II′ in FIG. 1 shows a structure of an electroluminescent display device according to a sixth embodiment of the present disclosure.

[0151] The electroluminescent display device according to the sixth embodiment can have a structure very similar to that of the first embodiment. The structure and / or shape of the weir portion DM may differ. Therefore, the description will focus on the structure and / or shape of the weir portion DM, but the same description may not be repeated. Reference can be made to the description of the first embodiment when necessary.

[0152] The dam portion DM according to the sixth embodiment may include a first organic layer OM1 , a second organic layer OM2 , a third organic layer OM3 , a first hydrogen absorbing layer MT1 , and a second hydrogen absorbing layer MT2 .

[0153] The first organic layer OM1 may be made of the same material as the planarization layer PLN while the planarization layer PLN is formed. The first organic layer OM1 may have a trapezoidal shape, and its cross-sectional shape includes a bottom side, a top side, an inner wall side, and an outer wall side. For example, the bottom side may contact the upper surface of the driving layer 100. The top side may be parallel to the bottom side and separated from the bottom side by a predetermined height. The distance between the bottom side and the top side may correspond to the height of the first organic layer OM1. The inner wall side may connect the bottom side to the top side and face the display area AA. The outer wall side may connect the bottom side to the top side and be arranged to face outward so as to be symmetrical with the inner wall side.

[0154] The first hydrogen absorbing layer MT1 may be a thin film stacked between the first organic layer OM1 and the driving layer 100. For example, the first hydrogen absorbing layer MT1 may be disposed between the bottom surface of the first organic layer OM1 and the top surface of the driving layer 100 and may be completely covered by the first organic layer OM1. In other words, the bottom surface of the first organic layer OM1 may be in contact with the top surface of the first hydrogen absorbing layer MT1 and the top surface of the driving layer 100.

[0155] The second hydrogen absorbing layer MT2 may be stacked on the first organic layer OM1, covering the inner wall side, the top side, and the outer wall side of the first organic layer OM1. The first hydrogen absorbing layer MT1 and the second hydrogen absorbing layer MT2 are used to prevent hydrogen particles from penetrating from the outside. Preferably, the first hydrogen absorbing layer MT1 and the second hydrogen absorbing layer MT2 may include a material having excellent properties for absorbing hydrogen particles. For example, the first hydrogen absorbing layer MT1 and the second hydrogen absorbing layer MT2 may be made of molybdenum (Mo) or titanium (Ti), or an alloy metal of molybdenum and titanium.

[0156] The second organic layer OM2 may be made of the same material as the embankment pattern BN while forming the embankment pattern BN. The second organic layer OM2 may have a trapezoidal shape, and its cross-sectional shape includes a bottom side, a top side, an inner wall side, and an outer wall side. For example, the bottom side of the second organic layer OM2 may be in contact with the upper surface of the second hydrogen absorbing layer MT2. The top side of the second organic layer OM2 may be parallel to the bottom side of the second organic layer OM2 and separated from the bottom side by a predetermined height. The distance between the bottom side and the top side may correspond to the height of the second organic layer OM2. The inner wall side may connect the bottom side to the top side and face the display area AA. The outer wall side may connect the bottom side to the top side and be arranged to face outward so as to be symmetrical with the inner wall side.

[0157] The third organic layer OM3 may be formed from the same material as the spacer SP at the same time as the spacer SP is formed. The third organic layer OM3 may have a trapezoidal shape, and its cross-sectional shape includes a bottom side, a top side, an inner wall side, and an outer wall side. For example, the bottom side of the third organic layer OM3 may be in contact with the top side of the second organic layer OM2. The top side of the third organic layer OM3 may be parallel to the bottom side of the third organic layer OM3 and separated from the bottom side by a predetermined height. The distance between the bottom side and the top side may correspond to the height of the third organic layer OM3. The inner wall side may connect the bottom side to the top side and face the display area AA. The outer wall side may connect the bottom side to the top side and be arranged to face outward so as to be symmetrical with the inner wall side.

[0158] <Seventh embodiment>

[0159] In the following, reference is made to Figure 8 , an electroluminescent display device according to a seventh embodiment of the present disclosure will be described. Figure 8 It is along Figure 1 The cross-sectional view taken along the cutting line II′ in FIG. 1 shows the structure of the electroluminescent display device according to the seventh embodiment of the present disclosure.

[0160] The electroluminescent display device according to the seventh embodiment can have a structure very similar to that of the first embodiment. The structure and / or shape of the weir portion DM may differ. Therefore, the description will focus on the structure and / or shape of the weir portion DM, but the same description may not be repeated. Reference can be made to the description of the first embodiment when necessary.

[0161] The dam portion DM according to the seventh embodiment of the present disclosure may have a multilayer structure in which a plurality of thin film layers are vertically stacked on a substrate SUB. For example, the dam portion DM according to the seventh embodiment may include a first organic layer OM1, a second organic layer OM2, a third organic layer OM3, and a hydrogen absorbing layer MT.

[0162] The first organic layer OM1 may be made of the same material as the planarization layer PLN while the planarization layer PLN is formed. The first organic layer OM1 may have a trapezoidal shape, and its cross-sectional shape includes a bottom side, a top side, an inner wall side, and an outer wall side. For example, the bottom side may contact the upper surface of the driving layer 100. The top side may be parallel to the bottom side and separated from the bottom side by a predetermined height. The distance between the bottom side and the top side may correspond to the height of the first organic layer OM1. The inner wall side may connect the bottom side to the top side and face the display area AA. The outer wall side may connect the bottom side to the top side and be arranged to face outward so as to be symmetrical with the inner wall side.

[0163] The hydrogen absorbing layer MT may be stacked on the first organic layer OM1, covering the inner wall side, the top side, and the outer wall side. The hydrogen absorbing layer MT is used to prevent hydrogen particles from penetrating from the outside, and preferably, the hydrogen absorbing layer MT may include a material having excellent properties for absorbing hydrogen particles. For example, the hydrogen absorbing layer MT may be made of molybdenum (Mo) or titanium (Ti), or an alloy metal of molybdenum and titanium.

[0164] The second organic layer OM2 may be made of the same material as the embankment pattern BN while forming the embankment pattern BN. The second organic layer OM2 may have a trapezoidal shape, and its cross-sectional shape includes a bottom side, a top side, an inner wall side, and an outer wall side. For example, the second organic layer OM2 may have a shape that completely covers the hydrogen absorbing layer MT. The second organic layer OM2 may be stacked on the hydrogen absorbing layer MT, covering the inner wall side, the top side, and the outer wall side of the first organic layer OM1, and directly contacting the entire outer surface of the hydrogen absorbing layer MT. The bottom side of the second organic layer OM2 may be in contact with the upper surface of the driving layer 100. The top side of the second organic layer OM2 may be parallel to the bottom side of the second organic layer OM2 and separated from the bottom side by a predetermined height. The distance between the bottom side and the top side may correspond to the height of the second organic layer OM2. The inner wall side may connect the bottom side to the top side and face the display area AA. The outer wall side may connect the bottom side to the top side and be arranged to face outward so as to be symmetrical with the inner wall side.

[0165] The third organic layer OM3 may be formed from the same material as the spacer SP at the same time as the spacer SP is formed. The third organic layer OM3 may have a trapezoidal shape, and its cross-sectional shape includes a bottom side, a top side, an inner wall side, and an outer wall side. For example, the bottom side may be in contact with the top side of the second organic layer OM2. The top side of the third organic layer OM3 may be parallel to the bottom side of the third organic layer OM3 and separated from the bottom side by a predetermined height. The distance between the bottom side and the top side may correspond to the height of the third organic layer OM3. The inner wall side may connect the bottom side to the top side and face the display area AA. The outer wall side may connect the bottom side to the top side and be arranged to face outward so as to be symmetrical with the inner wall side.

[0166] <Eighth Embodiment>

[0167] In the following, reference is made to Figure 9 , an electroluminescent display device according to an eighth embodiment of the present disclosure will be described. Figure 9 It is along Figure 1 The cross-sectional view taken along the cutting line II′ in FIG. 1 shows the structure of the electroluminescent display device according to the eighth embodiment of the present disclosure.

[0168] The electroluminescent display device according to the eighth embodiment can have a structure very similar to that of the first embodiment. The structure and / or shape of the weir portion DM may differ. Therefore, the description will focus on the structure and / or shape of the weir portion DM, but the same description may not be repeated. Reference can be made to the description of the first embodiment when necessary.

[0169] The dam portion DM according to the eighth embodiment of the present disclosure may have a multilayer structure in which a plurality of thin film layers are vertically stacked on a substrate SUB. For example, the dam portion DM according to the eighth embodiment may include a first organic layer OM1, a second organic layer OM2, a third organic layer OM3, and a hydrogen absorbing layer MT.

[0170] The first organic layer OM1 may be made of the same material as the planarization layer PLN while the planarization layer PLN is formed. The first organic layer OM1 may have a trapezoidal shape, and its cross-sectional shape includes a bottom side, a top side, an inner wall side, and an outer wall side. For example, the bottom side may contact the upper surface of the driving layer 100. The top side may be parallel to the bottom side and separated from the bottom side by a predetermined height. The distance between the bottom side and the top side may correspond to the height of the first organic layer OM1. The inner wall side may connect the bottom side to the top side and face the display area AA. The outer wall side may connect the bottom side to the top side and be arranged to face outward so as to be symmetrical with the inner wall side.

[0171] The hydrogen absorbing layer MT may be a thin film stacked between the first organic layer OM1 and the drive layer 100. Specifically, the hydrogen absorbing layer MT may be formed in a structure of multiple islands separated from each other. The hydrogen absorbing layer MT may include multiple island shapes in cross-sectional and plan views. For example, the hydrogen absorbing layer MT may be disposed between the bottom surface of the first organic layer OM1 and the top surface of the drive layer 100 and may be completely covered by the first organic layer OM1. In other words, the bottom surface of the first organic layer OM1 may be in contact with the top surface of the hydrogen absorbing layer MT and the top surface of the drive layer 100.

[0172] When the hydrogen absorbing layer MT has a plurality of island shapes, the interface formed by the contact between the hydrogen absorbing layer MT and the first organic layer OM1 can be extended. When hydrogen particles invade the interface surface between the driving layer 100 and the first organic layer OM1 and propagate along the interface surface, the propagation path of the hydrogen particles can have a zigzag (or embossed) shape, so the length of the path can be extended. Therefore, the propagation speed of the hydrogen particles may be slowed down. In addition, compared with the case where the hydrogen absorbing layer MT is made of one body, the surface area of ​​the hydrogen absorbing layer MT in contact with the hydrogen particles can be further wider. Therefore, when hydrogen particles propagate through the interface between the hydrogen absorbing layer MT and the first organic layer OM1, the amount of hydrogen particles can be gradually absorbed by the plurality of island shapes of the hydrogen absorbing layer MT, and then all the hydrogen particles can be completely eliminated.

[0173] The hydrogen absorbing layer MT is used to prevent hydrogen particles from penetrating from the outside, and preferably, the hydrogen absorbing layer MT may include a material having excellent properties of absorbing hydrogen particles. For example, the hydrogen absorbing layer MT may be made of molybdenum (Mo) or titanium (Ti) or an alloy metal of molybdenum and titanium.

[0174] The second organic layer OM2 may be formed from the same material as the embankment pattern BN at the same time as the embankment pattern BN is formed. The second organic layer OM2 may have a trapezoidal shape, and its cross-sectional shape includes a bottom side, a top side, an inner wall side, and an outer wall side. For example, the bottom side of the second organic layer OM2 may be in contact with the top side of the first organic layer OM1. The top side of the second organic layer OM2 may be parallel to the bottom side of the second organic layer OM2 and separated from the bottom side by a predetermined height. The distance between the bottom side and the top side may correspond to the height of the second organic layer OM2. The inner wall side may connect the bottom side to the top side and face the display area AA. The outer wall side may connect the bottom side to the top side and be arranged to face outward so as to be symmetrical with the inner wall side.

[0175] The third organic layer OM3 may be formed from the same material as the spacer SP at the same time as the spacer SP is formed. The third organic layer OM3 may have a trapezoidal shape, and its cross-sectional shape includes a bottom side, a top side, an inner wall side, and an outer wall side. For example, the bottom side may be in contact with the top side of the second organic layer OM2. The top side of the third organic layer OM3 may be parallel to the bottom side of the third organic layer OM3 and separated from the bottom side by a predetermined height. The distance between the bottom side and the top side may correspond to the height of the third organic layer OM3. The inner wall side may connect the bottom side to the top side and face the display area AA. The outer wall side may connect the bottom side to the top side and be arranged to face outward so as to be symmetrical with the inner wall side.

[0176] The hydrogen absorbing layer MT having a plurality of islands according to the eighth embodiment may be further disposed between the first organic layer OM1 and the second organic layer OM2. For another example, the hydrogen absorbing layer MT having a plurality of islands according to the eighth embodiment may be further disposed between the second organic layer OM2 and the third organic layer OM3. For yet another example, the hydrogen absorbing layer MT having a plurality of islands according to the eighth embodiment may be further disposed on the top side of the third organic layer OM3.

[0177] <Ninth embodiment>

[0178] In the following, reference is made to Figure 10 , an electroluminescent display device according to a ninth embodiment of the present disclosure will be described. Figure 10 It is along Figure 1 A cross-sectional view taken along a cutting line II′ in FIG. 1 shows a structure of an electroluminescent display device according to a ninth embodiment of the present disclosure.

[0179] The electroluminescent display device according to the ninth embodiment can have a structure very similar to that of the first embodiment. The structure and / or shape of the weir portion DM may differ. Therefore, the description will focus on the structure and / or shape of the weir portion DM, but the same description may not be repeated. Reference can be made to the description of the first embodiment when necessary.

[0180] The dam portion DM according to the ninth embodiment may include a first organic layer OM1 , a second organic layer OM2 , a third organic layer OM3 , a first hydrogen absorbing layer MT1 , a second hydrogen absorbing layer MT2 , and a third hydrogen absorbing layer MT3 .

[0181] The first organic layer OM1 may be made of the same material as the planarization layer PLN while the planarization layer PLN is formed. The first organic layer OM1 may have a trapezoidal shape, and its cross-sectional shape includes a bottom side, a top side, an inner wall side, and an outer wall side. For example, the bottom side may contact the upper surface of the driving layer 100. The top side may be parallel to the bottom side and separated from the bottom side by a predetermined height. The distance between the bottom side and the top side may correspond to the height of the first organic layer OM1. The inner wall side may connect the bottom side to the top side and face the display area AA. The outer wall side may connect the bottom side to the top side and be arranged to face outward so as to be symmetrical with the inner wall side.

[0182] The first hydrogen absorbing layer MT1 may be a thin film stacked between the first organic layer OM1 and the driving layer 100. For example, the first hydrogen absorbing layer MT1 may be disposed between the bottom surface of the first organic layer OM1 and the top surface of the driving layer 100 and may be completely covered by the first organic layer OM1. In other words, the bottom surface of the first organic layer OM1 may be in contact with the top surface of the first hydrogen absorbing layer MT1 and the top surface of the driving layer 100.

[0183] The second organic layer OM2 may be formed from the same material as the embankment pattern BN at the same time as the embankment pattern BN is formed. The second organic layer OM2 may have a trapezoidal shape, and its cross-sectional shape includes a bottom side, a top side, an inner wall side, and an outer wall side. For example, the bottom side of the second organic layer OM2 may be in contact with the top side of the first organic layer OM1. The top side of the second organic layer OM2 may be parallel to the bottom side of the second organic layer OM2 and separated from the bottom side by a predetermined height. The distance between the bottom side and the top side may correspond to the height of the second organic layer OM2. The inner wall side may connect the bottom side to the top side and face the display area AA. The outer wall side may connect the bottom side to the top side and be arranged to face outward so as to be symmetrical with the inner wall side.

[0184] The second hydrogen absorbing layer MT2 may be a thin film stacked between the first organic layer OM1 and the second organic layer OM2. For example, the second hydrogen absorbing layer MT2 may be disposed between the bottom side of the second organic layer OM2 and the top side of the first organic layer OM1 and be completely covered by the second organic layer OM2.

[0185] The third organic layer OM3 may be formed from the same material as the spacer SP at the same time as the spacer SP is formed. The third organic layer OM3 may have a trapezoidal shape, and its cross-sectional shape includes a bottom side, a top side, an inner wall side, and an outer wall side. For example, the bottom side of the third organic layer OM3 may be in contact with the top side of the second organic layer OM2. The top side of the third organic layer OM3 may be parallel to the bottom side of the third organic layer OM3 and separated from the bottom side by a predetermined height. The distance between the bottom side and the top side may correspond to the height of the third organic layer OM3. The inner wall side may connect the bottom side to the top side and face the display area AA. The outer wall side may connect the bottom side to the top side and be arranged to face outward so as to be symmetrical with the inner wall side.

[0186] The third hydrogen absorbing layer MT3 may be a thin film stacked between the second organic layer OM2 and the third organic layer OM3. For example, the third hydrogen absorbing layer MT3 may be disposed between the bottom side of the third organic layer OM3 and the top side of the second organic layer OM2 and be completely covered by the third organic layer OM3.

[0187] Alternatively, in the ninth embodiment, the hydrogen absorbing layer may include only any two selected from the first hydrogen absorbing layer MT1, the second hydrogen absorbing layer MT2, and the third hydrogen absorbing layer MT3. For example, the hydrogen absorbing layer may include only the first hydrogen absorbing layer MT1 and the third hydrogen absorbing layer MT3. In addition, the hydrogen absorbing layer may include only the second hydrogen absorbing layer MT2 and the third hydrogen absorbing layer MT3.

[0188] <Tenth embodiment>

[0189] In the following, reference is made to Figure 11 , an electroluminescent display device according to a tenth embodiment of the present disclosure will be described. Figure 11 It is along Figure 1 A cross-sectional view taken along a cutting line II′ in FIG. 1 shows a structure of an electroluminescent display device according to a tenth embodiment of the present disclosure.

[0190] The electroluminescent display device according to the tenth embodiment can have a structure very similar to that of the first embodiment. The structure and / or shape of the weir portion DM may differ. Therefore, the description will focus on the structure and / or shape of the weir portion DM, but the same description may not be repeated. Reference can be made to the description of the first embodiment when necessary.

[0191] The dam portion DM according to the tenth embodiment may include a first organic layer OM1 , a second organic layer OM2 , a third organic layer OM3 , a first hydrogen absorbing layer MT1 , a second hydrogen absorbing layer MT2 , a third hydrogen absorbing layer MT3 , and a vertical hydrogen absorbing layer MTV.

[0192] The first organic layer OM1 may be made of the same material as the planarization layer PLN while the planarization layer PLN is formed. The first organic layer OM1 may have a trapezoidal shape, and its cross-sectional shape includes a bottom side, a top side, an inner wall side, and an outer wall side. For example, the bottom side may contact the upper surface of the driving layer 100. The top side may be parallel to the bottom side and separated from the bottom side by a predetermined height. The distance between the bottom side and the top side may correspond to the height of the first organic layer OM1. The inner wall side may connect the bottom side to the top side and face the display area AA. The outer wall side may connect the bottom side to the top side and be arranged to face outward so as to be symmetrical with the inner wall side.

[0193] The first hydrogen absorbing layer MT1 may be a thin film stacked between the first organic layer OM1 and the driving layer 100. For example, the first hydrogen absorbing layer MT1 may be disposed between the bottom surface of the first organic layer OM1 and the top surface of the driving layer 100 and may be completely covered by the first organic layer OM1. In other words, the bottom surface of the first organic layer OM1 may be in contact with the top surface of the first hydrogen absorbing layer MT1 and the top surface of the driving layer 100.

[0194] The second organic layer OM2 may be formed from the same material as the embankment pattern BN at the same time as the embankment pattern BN is formed. The second organic layer OM2 may have a trapezoidal shape, and its cross-sectional shape includes a bottom side, a top side, an inner wall side, and an outer wall side. For example, the bottom side of the second organic layer OM2 may be in contact with the top side of the first organic layer OM1. The top side of the second organic layer OM2 may be parallel to the bottom side of the second organic layer OM2 and separated from the bottom side by a predetermined height. The distance between the bottom side and the top side may correspond to the height of the second organic layer OM2. The inner wall side may connect the bottom side to the top side and face the display area AA. The outer wall side may connect the bottom side to the top side and be arranged to face outward so as to be symmetrical with the inner wall side.

[0195] The second hydrogen absorbing layer MT2 may be a thin film stacked between the first organic layer OM1 and the second organic layer OM2. For example, the second hydrogen absorbing layer MT2 may be disposed between the bottom side of the second organic layer OM2 and the top side of the first organic layer OM1 and be completely covered by the second organic layer OM2.

[0196] The third organic layer OM3 may be formed from the same material as the spacer SP at the same time as the spacer SP is formed. The third organic layer OM3 may have a trapezoidal shape, and its cross-sectional shape includes a bottom side, a top side, an inner wall side, and an outer wall side. For example, the bottom side of the third organic layer OM3 may be in contact with the top side of the second organic layer OM2. The top side of the third organic layer OM3 may be parallel to the bottom side of the third organic layer OM3 and separated from the bottom side by a predetermined height. The distance between the bottom side and the top side may correspond to the height of the third organic layer OM3. The inner wall side may connect the bottom side to the top side and face the display area AA. The outer wall side may connect the bottom side to the top side and be arranged to face outward so as to be symmetrical with the inner wall side.

[0197] The third hydrogen absorbing layer MT3 may be a thin film stacked between the second organic layer OM2 and the third organic layer OM3. For example, the third hydrogen absorbing layer MT3 may be disposed between the bottom side of the third organic layer OM3 and the top side of the second organic layer OM2 and be completely covered by the third organic layer OM3.

[0198] The vertical hydrogen absorbing layer MTV may have a vertical wall shape that penetrates the middle portion of the first organic layer OM1 and the second organic layer OM2 between the first hydrogen absorbing layer MT1 and the third hydrogen absorbing layer MT3. For example, the vertical hydrogen absorbing layer MTV may be a thin film that fills a vertical through-hole that penetrates from the top side of the second organic layer OM2 to the bottom side of the first organic layer OM1. The first to third hydrogen absorbing layers MT1, MT2, and MT3 and the vertical hydrogen absorbing layer MTV may be formed to be connected to each other. For example, the vertical hydrogen absorbing layer MTV may include a lower vertical portion and an upper vertical portion. The lower vertical portion may connect the first hydrogen absorbing layer MT1 and the second hydrogen absorbing layer MT2. The upper vertical portion may connect the second hydrogen absorbing layer MT2 and the third hydrogen absorbing layer MT3.

[0199] The first to third hydrogen absorbing layers MT1, MT2, and MT3 and the vertical hydrogen absorbing layer MTV are used to prevent hydrogen particles from penetrating from the outside. Preferably, the first to third hydrogen absorbing layers MT1, MT2, and MT3 and the vertical hydrogen absorbing layer MTV may include a material having excellent properties for absorbing hydrogen particles. For example, the first to third hydrogen absorbing layers MT1, MT2, and MT3 and the vertical hydrogen absorbing layer MTV may be made of molybdenum (Mo) or titanium (Ti), or an alloy metal of molybdenum and titanium.

[0200] For another example of the tenth embodiment, the hydrogen absorbing layer may include only any two selected from the first to third hydrogen absorbing layers MT1, MT2, and MT3. In this case, the vertical hydrogen absorbing layer MTV may be provided between the selected two hydrogen absorbing layers.

[0201] <Eleventh Embodiment>

[0202] In the following, reference is made to Figure 12 , an electroluminescent display device according to an eleventh embodiment of the present disclosure will be described. Figure 12 It is along Figure 1 The cross-sectional view taken along the cutting line II′ in FIG. 1 shows the structure of the electroluminescent display device according to the eleventh embodiment of the present disclosure.

[0203] The electroluminescent display device according to the eleventh embodiment can have a structure very similar to that of the first embodiment. The structure and / or shape of the weir portion DM may differ. Therefore, the description will focus on the structure and / or shape of the weir portion DM, but the same description may not be repeated. Reference can be made to the description of the first embodiment when necessary.

[0204] The dam portion DM according to the eleventh embodiment may include first, second, and third organic layers OM1, OM2, and OM3, first, second, third, and fourth hydrogen absorbing layers MT1, MT2, MT3, and MT4.

[0205] The first organic layer OM1 may be made of the same material as the planarization layer PLN while the planarization layer PLN is formed. The first organic layer OM1 may have a trapezoidal shape, and its cross-sectional shape includes a bottom side, a top side, an inner wall side, and an outer wall side. For example, the bottom side may contact the upper surface of the driving layer 100. The top side may be parallel to the bottom side and separated from the bottom side by a predetermined height. The distance between the bottom side and the top side may correspond to the height of the first organic layer OM1. The inner wall side may connect the bottom side to the top side and face the display area AA. The outer wall side may connect the bottom side to the top side and be arranged to face outward so as to be symmetrical with the inner wall side.

[0206] The first hydrogen absorbing layer MT1 may be a thin film stacked between the first organic layer OM1 and the driving layer 100. For example, the first hydrogen absorbing layer MT1 may be disposed between the bottom surface of the first organic layer OM1 and the top surface of the driving layer 100 and may be completely covered by the first organic layer OM1. In other words, the bottom surface of the first organic layer OM1 may be in contact with the top surface of the first hydrogen absorbing layer MT1 and the top surface of the driving layer 100.

[0207] The second organic layer OM2 may be formed from the same material as the embankment pattern BN at the same time as the embankment pattern BN is formed. The second organic layer OM2 may have a trapezoidal shape, and its cross-sectional shape includes a bottom side, a top side, an inner wall side, and an outer wall side. For example, the bottom side of the second organic layer OM2 may be in contact with the top side of the first organic layer OM1. The top side of the second organic layer OM2 may be parallel to the bottom side of the second organic layer OM2 and separated from the bottom side by a predetermined height. The distance between the bottom side and the top side may correspond to the height of the second organic layer OM2. The inner wall side may connect the bottom side to the top side and face the display area AA. The outer wall side may connect the bottom side to the top side and be arranged to face outward so as to be symmetrical with the inner wall side.

[0208] The second hydrogen absorbing layer MT2 may be a thin film stacked between the first organic layer OM1 and the second organic layer OM2. For example, the second hydrogen absorbing layer MT2 may be disposed between the bottom side of the second organic layer OM2 and the top side of the first organic layer OM1 and be completely covered by the second organic layer OM2.

[0209] The third organic layer OM3 may be formed from the same material as the spacer SP at the same time as the spacer SP is formed. The third organic layer OM3 may have a trapezoidal shape, and its cross-sectional shape includes a bottom side, a top side, an inner wall side, and an outer wall side. For example, the bottom side of the third organic layer OM3 may be in contact with the top side of the second organic layer OM2. The top side of the third organic layer OM3 may be parallel to the bottom side of the third organic layer OM3 and separated from the bottom side by a predetermined height. The distance between the bottom side and the top side may correspond to the height of the third organic layer OM3. The inner wall side may connect the bottom side to the top side and face the display area AA. The outer wall side may connect the bottom side to the top side and be arranged to face outward so as to be symmetrical with the inner wall side.

[0210] The third hydrogen absorbing layer MT3 may be a thin film stacked between the second organic layer OM2 and the third organic layer OM3. For example, the third hydrogen absorbing layer MT3 may be disposed between the bottom side of the third organic layer OM3 and the top side of the second organic layer OM2 and be completely covered by the third organic layer OM3.

[0211] The fourth hydrogen absorbing layer MT4 may be disposed between two thin layers included in the driving layer 100. For example, the fourth hydrogen absorbing layer MT4 may be a thin film layer stacked between the gate insulating layer GI and the intermediate insulating layer ILD of the driving layer 100. In particular, it is preferred that the fourth hydrogen absorbing layer MT4 overlaps the first hydrogen absorbing layer MT1.

[0212] For another example of the eleventh embodiment, the hydrogen absorbing layer may include only any one selected from among the first hydrogen absorbing layer MT1, the second hydrogen absorbing layer MT2, and the third hydrogen absorbing layer MT3, and the fourth hydrogen absorbing layer MT4. For yet another example, the hydrogen absorbing layer may include only any two selected from among the first hydrogen absorbing layer MT1, the second hydrogen absorbing layer MT2, and the third hydrogen absorbing layer MT3, and the fourth hydrogen absorbing layer MT4.

[0213] <Twelfth embodiment>

[0214] In the following, reference is made to Figure 13 , an electroluminescent display device according to a twelfth embodiment of the present disclosure will be described. Figure 13 It is along Figure 1 A cross-sectional view taken along a cutting line II′ in FIG. 1 shows a structure of an electroluminescent display device according to a twelfth embodiment of the present disclosure.

[0215] The electroluminescent display device according to the twelfth embodiment can have a structure very similar to that of the first embodiment. The structure and / or shape of the weir portion DM may differ. Therefore, the description will focus on the structure and / or shape of the weir portion DM, but the same description may not be repeated. Reference can be made to the description of the first embodiment when necessary.

[0216] The dam portion DM according to the twelfth embodiment may include first, second, and third organic layers OM1, OM2, OM3, first, second, and third hydrogen absorbing layers MT1, MT2, MT3, fourth, and fifth hydrogen absorbing layers MT4, MT5, and vertical hydrogen absorbing layers MTV.

[0217] The first organic layer OM1 may be made of the same material as the planarization layer PLN while the planarization layer PLN is formed. The first organic layer OM1 may have a trapezoidal shape, and its cross-sectional shape includes a bottom side, a top side, an inner wall side, and an outer wall side. For example, the bottom side may contact the upper surface of the driving layer 100. The top side may be parallel to the bottom side and separated from the bottom side by a predetermined height. The distance between the bottom side and the top side may correspond to the height of the first organic layer OM1. The inner wall side may connect the bottom side to the top side and face the display area AA. The outer wall side may connect the bottom side to the top side and be arranged to face outward so as to be symmetrical with the inner wall side.

[0218] The first hydrogen absorbing layer MT1 may be a thin film stacked between the first organic layer OM1 and the driving layer 100. For example, the first hydrogen absorbing layer MT1 may be disposed between the bottom surface of the first organic layer OM1 and the top surface of the driving layer 100 and may be completely covered by the first organic layer OM1. In other words, the bottom surface of the first organic layer OM1 may be in contact with the top surface of the first hydrogen absorbing layer MT1 and the top surface of the driving layer 100.

[0219] The second organic layer OM2 may be made of the same material as the embankment pattern BN while forming the embankment pattern BN. The second organic layer OM2 may have a trapezoidal shape, and its cross-sectional shape includes a bottom side, a top side, an inner wall side, and an outer wall side. For example, the bottom side of the second organic layer OM2 may be in contact with the upper surface of the second hydrogen absorbing layer MT2 and the top side of the first organic layer OM1. The top side of the second organic layer OM2 may be parallel to the bottom side of the second organic layer OM2 and separated from the bottom side by a predetermined height. The distance between the bottom side and the top side may correspond to the height of the second organic layer OM2. The inner wall side may connect the bottom side to the top side and face the display area AA. The outer wall side may connect the bottom side to the top side and be arranged to face outward so as to be symmetrical with the inner wall side.

[0220] The second hydrogen absorbing layer MT2 may be a thin film stacked between the first organic layer OM1 and the second organic layer OM2. For example, the second hydrogen absorbing layer MT2 may be disposed between the bottom side of the second organic layer OM2 and the top side of the first organic layer OM1 and be completely covered by the second organic layer OM2.

[0221] The third organic layer OM3 may be formed from the same material as the spacer SP at the same time as the spacer SP is formed. The third organic layer OM3 may have a trapezoidal shape, and its cross-sectional shape includes a bottom side, a top side, an inner wall side, and an outer wall side. For example, the bottom side of the third organic layer OM3 may be in contact with the top side of the second organic layer OM2. The top side of the third organic layer OM3 may be parallel to the bottom side of the third organic layer OM3 and separated from the bottom side by a predetermined height. The distance between the bottom side and the top side may correspond to the height of the third organic layer OM3. The inner wall side may connect the bottom side to the top side and face the display area AA. The outer wall side may connect the bottom side to the top side and be arranged to face outward so as to be symmetrical with the inner wall side.

[0222] The third hydrogen absorbing layer MT3 may be a thin film stacked between the second organic layer OM2 and the third organic layer OM3. For example, the third hydrogen absorbing layer MT3 may be disposed between the bottom side of the third organic layer OM3 and the top side of the second organic layer OM2 and be completely covered by the third organic layer OM3.

[0223] The fourth hydrogen absorbing layer MT4 may be disposed between two thin layers included in the driving layer 100. For example, the fourth hydrogen absorbing layer MT4 may be a thin film layer stacked between the gate insulating layer GI and the intermediate insulating layer ILD of the driving layer 100. In particular, it is preferred that the fourth hydrogen absorbing layer MT4 overlaps the first hydrogen absorbing layer MT1.

[0224] The fifth hydrogen absorbing layer MT5 may be a thin film layer disposed on the top side of the third organic layer OM3 . For example, the fifth hydrogen absorbing layer MT5 may be disposed between the top side of the third organic layer OM3 and the first inorganic encapsulation layer PAS1 of the encapsulation layer 130 .

[0225] The vertical hydrogen absorbing layer MTV may have a vertical wall shape that penetrates the middle portion of the intermediate insulating layer ILD, the first organic layer OM1, the second organic layer OM2, and the third organic layer OM3 between the fifth hydrogen absorbing layer MT5 and the fourth hydrogen absorbing layer MT4. For example, the vertical hydrogen absorbing layer MTV may be a thin film that fills a vertical through-hole that penetrates from the top side of the third organic layer OM3 to the bottom surface of the intermediate insulating layer ILD.

[0226] The first to fifth hydrogen absorbing layers MT1, MT2, MT3, MT4, and MT5 and the vertical hydrogen absorbing layer MTV may be formed to be connected to each other. For example, the vertical hydrogen absorbing layer MTV may include a first vertical portion, a second vertical portion, a third vertical portion, and a fourth vertical portion. The first vertical portion may connect the first hydrogen absorbing layer MT1 and the second hydrogen absorbing layer MT2. The second vertical portion may connect the second hydrogen absorbing layer MT2 and the third hydrogen absorbing layer MT3. The third vertical portion may connect the third hydrogen absorbing layer MT3 and the fourth hydrogen absorbing layer MT4. The fourth vertical portion may connect the fourth hydrogen absorbing layer MT4 and the fifth hydrogen absorbing layer MT5. Alternatively, one or some of the first to fourth vertical portions may be omitted.

[0227] The first to fifth hydrogen absorbing layers MT1, MT2, MT3, MT4, and MT5 and the vertical hydrogen absorbing layer MTV are used to prevent hydrogen particles from penetrating from the outside. Preferably, the first to fifth hydrogen absorbing layers MT1, MT2, MT3, MT4, and MT5 and the vertical hydrogen absorbing layer MTV may include a material having excellent properties for absorbing hydrogen particles. For example, the first to fifth hydrogen absorbing layers MT1, MT2, MT3, MT4, and MT5 and the vertical hydrogen absorbing layer MTV may be made of molybdenum (Mo) or titanium (Ti), or an alloy metal of molybdenum and titanium.

[0228] In another example of the twelfth embodiment, the hydrogen absorbing layer may include only one selected from the first to third hydrogen absorbing layers MT1, MT2, and MT3, as well as the fourth hydrogen absorbing layer MT4 and the vertical hydrogen absorbing layer MTV. In this case, the vertical hydrogen absorbing layer MTV may have a connection structure between the fourth hydrogen absorbing layer MT4 and any selected from the first to third hydrogen absorbing layers MT1, MT2, and MT3. In yet another example, the hydrogen absorbing layer may include only two selected from the first to third hydrogen absorbing layers MT1, MT2, and MT3, as well as the fourth hydrogen absorbing layer MT4 and the vertical hydrogen absorbing layer MTV. In that case, the vertical hydrogen absorbing layer MTV may be connected between the fourth hydrogen absorbing layer MT4 and the topmost hydrogen absorbing layer.

[0229] <Thirteenth embodiment>

[0230] In the following, reference is made to Figure 14 , an electroluminescent display device according to a thirteenth embodiment of the present disclosure will be described. Figure 14 It is along Figure 1 A cross-sectional view taken along a cutting line II′ in FIG. 1 shows a structure of an electroluminescent display device according to a thirteenth embodiment of the present disclosure.

[0231] The electroluminescent display device according to the thirteenth embodiment can have a structure very similar to that of the first embodiment. The structure and / or shape of the weir portion DM may differ. Therefore, the description will focus on the structure and / or shape of the weir portion DM, but the same description may not be repeated. Reference can be made to the description of the first embodiment when necessary.

[0232] The dam portion DM according to the thirteenth embodiment of the present disclosure may include an inner dam portion DMI and an outer dam portion DMO. The inner dam portion DMI may be provided closer to the display area AA than the outer dam portion DMO and surround the display area AA. The outer dam portion DMO may be provided outside the inner dam portion DMI and surround the inner dam portion DMI.

[0233] Figure 14 Each of the inner weir DMI and the outer weir DMO shown in FIG. 1 is shown to have Figure 6 . However, it is not limited thereto, and each of the inner weir DM1 and the outer weir DM0 may have the same structure and the same shape as any one selected from the first to twelfth embodiments. Furthermore, the inner weir DM1 and the outer weir DM0 may have various structures in which any two selected structures from the first to twelfth embodiments are combined.

[0234] The features, structures, effects, etc. described in the above examples of the present disclosure are included in at least one example of the present disclosure and are not necessarily limited to one example. In addition, a person of ordinary skill in the art can implement the features, structures, effects, etc. illustrated in at least one example of the present disclosure by combining or modifying other examples. Therefore, the content related to such combinations and modifications should be interpreted as included within the scope of this application.

[0235] It will be apparent to those skilled in the art that various modifications and variations can be made in the present disclosure without departing from the spirit or scope of the present disclosure. Therefore, the present disclosure is intended to cover modifications and variations of the present disclosure as long as they fall within the scope of the appended claims and their equivalents. These and other changes can be made to the embodiments in light of the above detailed description. Generally, in the appended claims, the terms used should not be interpreted as limiting the claims to the specific embodiments disclosed in the specification and claims, but should be interpreted as including all possible embodiments and the full range of equivalents to which such claims are entitled. Therefore, the claims are not limited by the disclosure.

Claims

1. An electroluminescent display device comprising: substrate; a driving layer disposed on the substrate; an emission layer disposed on the driving layer; an encapsulation layer disposed on the emission layer; as well as a dam portion surrounding a peripheral region of the emission layer, the dam portion comprising an organic layer and a hydrogen absorbing layer, The hydrogen absorption layer is disposed on the driving layer and is covered by the organic layer.

2. The electroluminescent display device according to claim 1, wherein: The organic layer comprises: a first organic layer; a second organic layer on the first organic layer; and a third organic layer on the second organic layer, Wherein, the hydrogen absorbing layer comprises: A first hydrogen absorbing layer contacts the inner wall side, the top side, and the outer wall side of the first organic layer.

3. The electroluminescent display device according to claim 2, wherein: The second organic layer covers the first organic layer and contacts the entire outer surface of the first hydrogen absorbing layer.

4. The electroluminescent display device according to claim 2, wherein: The hydrogen absorbing layer further comprises: A second hydrogen absorbing layer contacts the inner wall side, the top side, and the outer wall side of the second organic layer.

5. The electroluminescent display device according to claim 2, wherein: The hydrogen absorbing layer further comprises: a third hydrogen absorbing layer contacting the inner wall side, the top side, and the outer wall side of the third organic layer.

6. The electroluminescent display device according to claim 1, wherein: The organic layer comprises: a first organic layer; a second organic layer on the first organic layer; and a third organic layer on the second organic layer, Wherein, the hydrogen absorbing layer comprises: A first hydrogen absorbing layer is disposed on the driving layer and is covered by the first organic layer.

7. The electroluminescent display device according to claim 6, wherein: The hydrogen absorbing layer further comprises: The second hydrogen absorbing layer is disposed on the first organic layer and covered by the second organic layer.

8. The electroluminescent display device according to claim 7, wherein: The hydrogen absorbing layer further comprises: A vertical hydrogen absorbing layer connects the first hydrogen absorbing layer and the second hydrogen absorbing layer and penetrates the first organic layer.

9. The electroluminescent display device according to claim 6, wherein: The hydrogen absorbing layer further comprises: a third hydrogen absorbing layer disposed on the second organic layer and covered by the third organic layer; 10. The electroluminescent display device according to claim 9, wherein: The hydrogen absorbing layer further comprises: A vertical hydrogen absorbing layer connects the first hydrogen absorbing layer and the third hydrogen absorbing layer and penetrates the first organic layer and the second organic layer.

11. The electroluminescent display device according to claim 6, wherein: The hydrogen absorbing layer further comprises: A second hydrogen absorbing layer contacts the inner wall side, the top side, and the outer wall side of the first organic layer.

12. The electroluminescent display device according to claim 6, wherein: The hydrogen absorbing layer comprises: Multiple island shapes separated from each other.

13. The electroluminescent display device according to claim 6, further comprising: Another hydrogen absorbing layer is disposed between the first inorganic layer and the second inorganic layer of the driving layer.

14. The electroluminescent display device according to claim 13, further comprising: A vertical hydrogen absorbing layer connects the first hydrogen absorbing layer and the another hydrogen absorbing layer and penetrates the second inorganic layer.

15. The electroluminescent display device according to claim 1, wherein: The weir portion includes: an inner weir portion disposed proximate to the display area; and An outer weir portion is provided outside the inner weir portion.

16. The electroluminescent display device according to claim 1, wherein: The organic layer comprises: a bottom side in contact with the upper surface of the driving layer; a top side separated from the bottom side by a predetermined height; an inner wall side connecting the bottom side and the top side; and An outer wall side connects the bottom side and the top side and faces the inner wall side.

17. The electroluminescent display device according to claim 1, wherein: The organic layer comprises: a bottom side in contact with the upper surface of the driving layer; a top side separated from the bottom side by a predetermined height; an inner wall side connecting the bottom side and the top side; and an outer wall side connecting the bottom side and the top side and facing the inner wall side, The hydrogen absorption layer is disposed between the bottom side of the organic layer and the upper surface of the driving layer.

18. The electroluminescent display device according to claim 1, wherein: The organic layer comprises: a bottom side in contact with the upper surface of the driving layer; a top side separated from the bottom side by a predetermined height; an inner wall side connecting the bottom side and the top side; and an outer wall side connecting the bottom side and the top side and facing the inner wall side, The hydrogen absorbing layer has a vertical wall shape, which penetrates the organic layer from the top side to the bottom side and contacts the upper surface of the driving layer.

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