Semiconductor process equipment, lifting mechanism thereof and control method thereof

Abstract

This application discloses semiconductor processing equipment, its lifting mechanism, and its control method, belonging to the field of semiconductor equipment technology. The semiconductor processing equipment includes a reaction chamber, and the lifting mechanism is disposed below the reaction chamber. The lifting mechanism includes a servo motor, an ejector pin, and a tension and pressure detection member. One end of the tension and pressure detection member is connected to the drive end of the servo motor, and the other end of the tension and pressure detection member is connected to the ejector pin to detect the tension and pressure applied to the ejector pin. This solution can solve the problem of low accuracy in wafer sticking detection.

Description

Technical Field

[0001] The present application belongs to the field of semiconductor equipment technology, and specifically relates to a semiconductor process equipment, its lifting mechanism and its control method. Background Art

[0002] With the continuous development of the semiconductor industry, the etching materials in the field of semiconductor etching have been continuously enriched and diversified in recent years. Traditional Si etching has gradually covered the etching of materials such as GaAs, SiC, and sapphire. Due to the characteristics of the materials themselves, for example, GaAs and SiC are fragile and expensive, the phenomenon of wafer sticking often occurs during the etching process, which in turn brings relatively serious economic losses.

[0003] Currently, the back-He detection method and torque detection method can be used to determine whether wafer sticking occurs. Among them, the torque detection method uses the torque parameters output by the servo motor to detect the torque changes during the wafer lifting process, thereby determining whether wafer sticking occurs.

[0004] However, the degree of sticking varies. When sticking is severe, the relevant data will show obvious anomalies. The back-He detection method and the torque detection method can detect sticking in time. However, if the sticking is mild, the data changes are relatively small, and neither the back-He detection method nor the torque detection method can detect sticking in time. Therefore, traditional sticking detection methods have the problem of low accuracy. Summary of the Invention

[0005] The purpose of the embodiments of the present application is to provide a semiconductor process equipment, a lifting mechanism thereof and a control method thereof, which can solve the problem of low accuracy in chip sticking detection.

[0006] In order to solve the above technical problems, this application is implemented as follows:

[0007] In a first aspect, an embodiment of the present application provides a lifting mechanism for a semiconductor process equipment, the semiconductor process equipment including a reaction chamber, the lifting mechanism being disposed below the reaction chamber, the lifting mechanism including a servo motor, a ejector pin, and a tension and pressure detection member;

[0008] One end of the tension and pressure detection member is connected to the driving end of the servo motor, and the other end of the tension and pressure detection member is connected to the ejector pin, so as to detect the tension and pressure exerted on the ejector pin.

[0009] In a second aspect, an embodiment of the present application provides a semiconductor process equipment, which includes a reaction chamber, an electrostatic chuck and the above-mentioned lifting mechanism, wherein the electrostatic chuck is arranged in the reaction chamber, the lifting mechanism is arranged below the reaction chamber, and the lifting mechanism is connected to the electrostatic chuck.

[0010] In a third aspect, an embodiment of the present application provides a control method for semiconductor process equipment, which is applied to the above-mentioned semiconductor process equipment, and includes:

[0011] Obtaining the torque value output by the servo motor;

[0012] Obtaining the tension and pressure value of the tension and pressure detection component;

[0013] The degree of wafer adhesion is determined according to the torque value and the pulling force value.

[0014] In this embodiment of the present application, the servo motor monitors the torque applied to it during the process, while the tension and pressure sensing element simultaneously detects the tension and pressure applied to the ejector pin. Even if the sticking is mild, changes in torque and pressure values ​​can be combined to promptly detect sticking. This solution, by incorporating both torque and pressure values ​​into the determination of sticking, allows for more accurate identification of sticking, thereby improving sticking detection accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a schematic structural diagram of the lifting mechanism disclosed in an embodiment of the present application;

[0016] Figures 2 to 5 A schematic diagram of a partial structure of a lifting mechanism disclosed in an embodiment of the present application;

[0017] Figure 6 An exploded view of the first transmission member and the second transmission member disclosed in the embodiment of the present application;

[0018] Figure 7 A flow chart of the control method disclosed in the embodiment of the present application;

[0019] Figure 8 This is the relationship between the torque and the drive end position when there is no sticking phenomenon;

[0020] Figure 9 This is the relationship between the torque and the position of the driving end when the sticking phenomenon occurs;

[0021] Figure 10 This is the relationship between the pulling pressure and the driving end position when no sticking occurs;

[0022] Figure 11 This is a diagram showing the relationship between the pulling pressure and the position of the driving end when sticking occurs.

[0023] Description of reference numerals:

[0024] 110-mounting bracket, 120-transmission device, 130-thimble, 140-tension and pressure detection part, 150-first transmission part, 151-limiting groove, 151a-first groove, 151b-second groove, 152-first limiting part, 160-second transmission part, 161-second limiting part, 161a-first column, 161b-second column, 170-rotating connection part, 180-mounting part, 190-adjusting assembly, 191-threaded adjustment part, 192-connecting seat, 192a-strip hole, 193-positioning part, 210-first position detection part, 220-second position detection part, 230-first block, 240-second block, 250-bellows, 260-bearing block, 270-first locking nut, 280-second locking nut, 310-detection block. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0026] The terms "first," "second," and the like in the specification and claims of this application are used to distinguish similar objects, and are not used to describe a specific order or precedence. It should be understood that the terms used in this manner are interchangeable where appropriate, so that the embodiments of this application can be implemented in an order other than that illustrated or described herein, and that the objects distinguished by "first," "second," and the like are generally of the same type, and do not limit the number of objects; for example, the first object can be one or more. In addition, the term "and / or" in the specification and claims refers to at least one of the connected objects, and the character " / " generally indicates that the objects connected are in an "or" relationship.

[0027] The semiconductor process equipment, its lifting mechanism and its control method provided by the embodiments of the present application are described in detail below with reference to the accompanying drawings through specific embodiments and their application scenarios.

[0028] like Figures 1 to 6As shown, an embodiment of the present application discloses a lifting mechanism for semiconductor process equipment. The semiconductor process equipment may include a reaction chamber. The lifting mechanism may be arranged below the reaction chamber, and includes a servo motor (not shown), a ejector pin 130, and a tension and pressure detection member 140. One end of the tension and pressure detection member 140 is connected to the driving end of the servo motor, and the other end of the tension and pressure detection member 140 is connected to the ejector pin 130, that is, the tension and pressure detection member 140 is located on the transmission path between the driving end of the servo motor and the ejector pin 130, and the tension and pressure detection member 140 is used to detect the tension and pressure exerted on the ejector pin 130. The driving end of the servo motor may be the part that outputs the driving force of the servo motor, for example, it may be the output shaft of the servo motor, or the part connected to the output shaft for outputting the driving force. Optionally, one end of the tension and pressure detection member 140 can be directly connected to the driving end of the servo motor, and the other end of the tension and pressure detection member 140 can be directly connected to the ejector pin 130. In this case, the tension and pressure detection member 140, the ejector pin 130 and the driving end of the servo motor can be coaxially arranged, so that the driving force output by the driving end of the servo motor is transmitted to the ejector pin 130 through the tension and pressure detection member 140. The moving direction of the ejector pin 130 can be defined as a first direction, and the ejector pin 130 can apply a force to the wafer. The number of the ejector pins 130 can be one, two, three or even more, and this embodiment of the application does not limit this. Optionally, the tension and pressure detection member 140 here can be a component such as a force sensor that can detect tension and pressure.

[0029] In this embodiment of the present application, the servo motor monitors the torque applied to it during the process. Simultaneously, the tension and pressure sensing element 140 detects the tension and pressure applied to the ejector pin 130. Even if the sticking is mild, changes in the torque and pressure values ​​can be combined to promptly detect the presence of sticking. This solution, by incorporating both torque and pressure values ​​into the determination of sticking, allows for more accurate identification of sticking, thereby improving sticking detection accuracy.

[0030] Optionally, the lifting mechanism may further include a mounting bracket 110 and a transmission device 120. The mounting bracket 110 may serve as the basic component of the entire lifting mechanism, which may provide a mounting base for other components, and the mounting bracket 110 may be connected to the bottom of the reaction chamber. A servo motor is provided on the mounting bracket 110, and the driving end of the servo motor is connected to the ejector pin 130 through the transmission device 120, and the servo motor can drive the ejector pin 130 to move through the transmission device 120. The transmission device 120 here can convert the rotational driving force output by the servo motor into a moving driving force, thereby realizing the lifting and lowering drive of the ejector pin 130. Optionally, the transmission device 120 may be an electric cylinder, which may include structures such as a ball screw. Further optionally, the lifting mechanism may further include a bellows 250, and the first transmission member 150 is connected to the ejector pin 130 through the bellows 250, and the bellows 250 can achieve vacuum sealing. At the same time, the transmission device 120 can be connected to the ejector pin 130 through the bellows 250, so that the ejector pin 130 can be lifted and lowered in a vacuum environment. The tensile and pressure detection member 140 is arranged on the transmission path between the transmission device 120 and the ejector pin 130 , that is, the force required to be transmitted by the transmission device 120 can be transmitted to the ejector pin 130 through the tensile and pressure detection member 140 , and the force from the ejector pin 130 can also act on the tensile and pressure detection member 140 .

[0031] In an optional embodiment, the lifting mechanism further includes a transmission assembly, which may include a first transmission member 150 and a second transmission member 160. The first transmission member 150 is connected to the ejector pin 130, and the second transmission member 160 is connected to the drive end of the servo motor. The first transmission member 150 and the second transmission member 160 provide a mounting base for the tension and pressure detection member 140, thereby facilitating installation of the tension and pressure detection member 140. Furthermore, the installation location of the tension and pressure detection member 140 is less restricted, thereby facilitating selection of the tension and pressure detection member 140.

[0032] In a further optional embodiment, the transmission assembly further includes a first limiting member 152 and a second limiting member 161. One of the first limiting member 152 and the second limiting member 161 is disposed on a surface of the first transmission member 150 facing the second transmission member 160, and the other is disposed on a surface of the second transmission member 160 facing the first transmission member 150. The first limiting member 152 has a limiting groove 151 that cooperates with the second limiting member 161. The outer circumferential surface of the second limiting member 161 abuts against the inner circumferential surface of the limiting groove 151. In the first direction, a gap exists between the first limiting member 152 and the second limiting member 161, as well as between the first limiting member 152 and the first transmission member 150 or the second transmission member 160 on which the second limiting member 161 is disposed. This gap is used to prevent force transmission between the first transmission member 150 and the second transmission member 160 in the first direction. At this time, the force is not directly transmitted between the first transmission member 150 and the second transmission member 160 , but is transmitted between the two through the tension and pressure detection member 140 , thereby improving the detection accuracy of the tension and pressure detection member 140 .

[0033] In addition, the outer circumference of the second limit member 161 fits into the inner circumference of the limit groove 151, which can limit the relative rotation between the first transmission member 150 and the second transmission member 160, thereby preventing the tensile and pressure detection member 140 from being subjected to torque. Such a setting can further improve the detection accuracy of the tensile and pressure detection member 140.

[0034] When the lifting mechanism further includes the bellows 250 , the bellows 250 , the limiting groove 151 , the second limiting member 161 and the driving end of the servo motor are coaxially arranged, thereby improving the detection accuracy of the tension and pressure detection member 140 .

[0035] Optionally, the first transmission member 150 and the second transmission member 160 can be plates, and the two can be arranged in the first direction. Both can be set at a position close to the center of the ejector pin 130, and the tension and pressure detection member 140 can be set at a position away from the center of the ejector pin 130, so as to facilitate the installation of the tension and pressure detection member 140.

[0036] In an optional embodiment, the second limiting member 161 can be a cylindrical structure with a constant transverse dimension, and the limiting groove 151 can be a groove with a constant transverse dimension that is open on only one side. In this case, the first transmission member 150 and the second transmission member 160 will not generate an interaction force in the first direction. If the tension and pressure detection member 140 is damaged, the first transmission member 150 and the second transmission member 160 will separate, which may easily cause a safety accident. To solve this problem, the second limiting member 161 can optionally include a first column 161a and a second column 161b. The first column 161a is connected to the first transmission member 150 or the second transmission member 160 through the second column 161b. That is, when the first transmission member 150 is provided with the second limiting member 161, the first column 161a is connected to the first transmission member 150 through the second column 161b; when the second transmission member 160 is provided with the second limiting member 161, the first column 161a is connected to the second transmission member 160 through the second column 161b. The first column 161a protrudes relative to the outer circumference of the second column 161b. In other words, the lateral dimension of the first column 161a is greater than the lateral dimension of the second column 161b. In this case, the limiting groove 151 includes a first groove 151a and a second groove 151b that are connected. The first groove 151a is recessed relative to the second groove 151b. The first groove 151a and the second groove 151b each have a through-opening on the side facing the second limiting member 161. The second limiting member 161 can enter the limiting groove 151 through the through-opening. A gap is formed between the side of the first column 161a facing away from the second column 161b and the bottom surface of the first groove 151a. The outer circumference of the first column 161a is in contact with the inner circumference of the first groove 151a, and / or the outer circumference of the second column 161b is in contact with the inner circumference of the second groove 151b. When assembling the lifting mechanism, at least one of the first transmission member 150 and the second transmission member 160 can be pushed, so that the two can move relative to each other in a direction roughly perpendicular to the first direction, and the second limiting member 161 can enter the limiting groove 151 through the through opening to enable the second limiting member 161 to cooperate with the limiting groove 151.

[0037] In the above-described embodiment, the through-hole facilitates assembly of the first and second transmission members 150, 160 and adjustment of their relative positions to ensure coaxiality between the first and second stoppers 152, 161, further improving the detection accuracy of the tension and pressure sensing member 140. The outer circumference of the first column 161a abuts the inner circumference of the first groove 151a, and / or the outer circumference of the second column 161b abuts the inner circumference of the second groove 151b, thereby more reliably protecting the tension and pressure sensing member 140 from torque. This arrangement also improves the detection accuracy of the tension and pressure sensing member 140. Furthermore, if the tension and pressure sensing member 140 becomes damaged and cannot be connected to the first and second transmission members 150, 160 can remain connected by the stoppered engagement between the first column 161a and the first groove 151a, thereby providing a protective barrier. At the same time, when assembling the lifting mechanism, the first transmission member 150 and the second transmission member 160 can be connected to each other through the second limiting member 161 and the limiting groove 151, which makes it easier to install the tension and pressure detection member 140.

[0038] Due to errors such as production errors and assembly errors, the relative position between the first transmission member 150 and the second transmission member 160 is prone to errors. Therefore, when installing the tensile and pressure detection member 140, if the tensile and pressure detection member 140 is forcibly installed between the first transmission member 150 and the second transmission member 160, it is easy for the tensile and pressure detection member 140 to be subjected to force in a direction other than the first direction, thereby reducing its detection accuracy. Based on this, in an optional embodiment, the transmission assembly further includes a rotating connection member 170, one of the first transmission member 150 and the second transmission member 160 is fixedly connected to one end of the tensile and pressure detection member 140, and the other is provided with a rotating connection member 170. The other end of the tensile and pressure detection member 140 is floatingly connected via the rotating connection member 170, that is, the tensile and pressure detection member 140 is connected to the rotating connection member 170, so that the tensile and pressure detection member 140 can swing relative to one of the first transmission member 150 and the second transmission member 160 to ensure that the tensile and pressure detection member 140 extends along the first direction. With this arrangement, during installation of the tension and pressure detection member 140, the tension and pressure detection member 140 can swing relative to one of the first transmission member 150 and the second transmission member 160. Therefore, even if there is an error in the relative position between the first transmission member 150 and the second transmission member 160, the tension and pressure detection member 140 can be prevented from being subjected to forces in directions other than the first direction. This solution can improve the detection accuracy of the tension and pressure detection member 140. Furthermore, during operation of the lifting mechanism, if one of the first transmission member 150 and the second transmission member 160 swings unexpectedly, the tension and pressure detection member 140 will not swing with the first transmission member 150 or the second transmission member 160, thereby preventing the tension and pressure detection member 140 from being subjected to lateral forces, thereby improving the detection accuracy of the tension and pressure detection member 140 and preventing damage to the tension and pressure detection member 140.

[0039] In an optional embodiment, the rotating connecting member 170 can adopt a spherical structure, so that the tensile and compressive force detection member 140 can swing in multiple directions relative to one of the first transmission member 150 and the second transmission member 160, and can even achieve universal swing, so as to more reliably avoid various errors from having adverse effects on the detection accuracy of the tensile and compressive force detection member 140.

[0040] In one embodiment, the rotating connector 170 can be sleeved onto the tension and pressure detection member 140. One of the first transmission member 150 and the second transmission member 160 can be provided with a spherical groove, and the rotating connector 170 can cooperate with the spherical groove to achieve a floating connection. In another embodiment, one of the first transmission member 150 and the second transmission member 160 can be provided with a ball bearing, and the inner ring of the ball bearing can serve as the rotating connector 170. The tension and pressure detection member 140 can pass through the inner ring of the ball bearing. At the same time, the tension and pressure detection member 140 can be connected to one of the first transmission member 150 and the second transmission member 160 via a bearing stopper 260, thereby achieving a reliable floating connection.

[0041] Optionally, through the above-mentioned rotating connecting member 170, during the installation of the tensile and compressive force detection member 140 and the operation of the lifting mechanism, the tensile and compressive force detection member 140 can swing about 18° relative to one of the first transmission member 150 and the second transmission member 160, thereby realizing a floating connection. Of course, the swing range described here can also be other values, and the embodiment of the present application does not limit this.

[0042] The tensile and compressive force detection member 140 can be directly connected to the first transmission member 150 and the second transmission member 160. In this case, the specifications of the tensile and compressive force detection member 140 must be adapted to the space between the first transmission member 150 and the second transmission member 160, which limits the selection of the tensile and compressive force detection member 140. In view of this, the transmission assembly optionally further includes a mounting member 180, with one of the first transmission member 150 and the second transmission member 160 connected to one end of the tensile and compressive force detection member 140, and the other connected to the tensile and compressive force detection member 140 via the mounting member 180. In this embodiment, the tensile and pressure detection member 140 is connected to one of the first transmission member 150 and the second transmission member 160 through the mounting member 180. On the one hand, this arrangement facilitates the installation of the tensile and pressure detection member 140. On the other hand, the total length of the mounting member 180 and the tensile and pressure detection member 140 after being installed together is larger. By selecting the specifications of the mounting member 180, the connection requirements between the tensile and pressure detection member 140, the first transmission member 150 and the second transmission member 160 can be met without bringing any restrictions to the selection of the tensile and pressure detection member 140.

[0043] When the transmission assembly includes both a rotating connector 170 and a mounting member 180 , one end of the mounting member 180 is connected to the tension and pressure detection member 140 , and the other end is connected to the rotating connector 170 , thereby facilitating the connection between the tension and pressure detection member 140 and the rotating connector 170 .

[0044] Optionally, the mounting member 180 may be connected to the tension and pressure detection member 140 by means of snap connection, bonding, etc., and the mounting member 180 may be connected to the rotating connection member 170 by means of snap connection, bonding, etc. The rotating connection member 170 cooperates with one of the first transmission member 150 and the second transmission member 160 to achieve a floating connection of the tension and pressure detection member 140, and the tension and pressure detection member 140 may be fixedly connected to the other of the first transmission member 150 and the second transmission member 160 by means of snap connection, bonding, etc. In another optional embodiment, one end of the tension and pressure detection member 140 is provided with a first threaded section, and the other end of the tension and pressure detection member 140 is provided with a second threaded section. The mounting member 180 is provided with a mounting hole, which may be provided with an internal thread. The first threaded section cooperates with the mounting hole. One of the first transmission member 150 and the second transmission member 160 is connected to the mounting member 180, and the other is connected to the tension and pressure detection member 140 via the second threaded section. The provision of the first thread segment and the second thread segment also makes the installation position of the tension and pressure detection member 140 adjustable, thereby making it easier to assemble the tension and pressure detection member 140, the first transmission member 150 and the second transmission member 160.

[0045] Furthermore, the first thread segment can cooperate with the first locking nut 270, and the second thread segment can cooperate with the second locking nut 280. The first locking nut 270 and the second locking nut 280 can be used to lock the tension and pressure detection component 140, thereby improving the connection strength.

[0046] During the assembly of the lifting mechanism and the operation of the semiconductor processing equipment, it may be necessary to adjust the gap between the first transmission member 150 and the second transmission member 160. To this end, the lifting mechanism may further include an adjustment assembly 190, which includes a threaded adjustment member 191. The threaded adjustment member 191 is connected to one of the first transmission member 150 and the second transmission member 160. The threaded adjustment member 191 can rotate relative to the first transmission member 150 and the second transmission member 160 to adjust the gap between the first transmission member 150 and the second transmission member 160. Optionally, when the threaded adjustment member 191 rotates, it can apply a force to one of the first transmission member 150 and the second transmission member 160, thereby driving the one of the first transmission member 150 and the second transmission member 160 to move, thereby achieving the purpose of adjusting the gap between the first transmission member 150 and the second transmission member 160.

[0047] Alternatively, the threaded adjustment member 191 can be rotatably connected to one of the first transmission member 150 and the second transmission member 160, with its end portion resting against the other of the first transmission member 150 and the second transmission member 160, thereby achieving gap adjustment. With this structure, once the gap between the first transmission member 150 and the second transmission member 160 changes, the installation position of the tension and pressure detection member 140 also needs to be adjusted accordingly, which makes the operation of the lifting mechanism more complicated. Therefore, in other optional embodiments, the adjustment assembly 190 further includes a connecting seat 192 and a positioning member 193. The connecting seat 192 is provided with a strip hole 192a and a threaded hole. The connecting seat 192 is connected to the second transmission member 160 via the strip hole 192a. One end of the tension and pressure detection member 140 is fixedly connected to the connecting seat 192. The positioning member 193 is connected to the second transmission member 160. The threaded adjustment member 191 is rotatably connected to the positioning member 193 and can rotate relative to the threaded hole to drive the connecting seat 192 to move along the first direction. That is, the threaded hole cooperates with the threaded adjustment member 191, and the threaded adjustment member 191 can rotate relative to the positioning member 193. The positioning member 193 can limit the movement of the threaded adjustment member 191, thereby driving the connecting seat 192 to move in the first direction. When the gap between the first transmission member 150 and the second transmission member 160 needs to be adjusted, the threaded adjustment member 191 is turned, and the portion of the threaded adjustment member 191 located within the second threaded hole changes, causing the connecting seat 192 to move in the first direction, thereby driving the first transmission member 150 to move through the tension and pressure detection member 140, while the second transmission member 160 can remain stationary. The connecting seat 192 can move relative to the second transmission member 160 through the strip hole 192a, thereby changing the gap between the first transmission member 150 and the second transmission member 160. It can be seen that when the gap between the first transmission member 150 and the second transmission member 160 changes, there is no need to additionally adjust the position of the tension and pressure detection member 140. Therefore, this embodiment facilitates the operation of the lifting mechanism.

[0048] Of course, in other embodiments, an internal thread can also be provided on the positioning member 193, and the threaded adjustment member 191 can be threadably engaged with the positioning member 193 through the internal thread of the positioning member 193. The end of the threaded adjustment member 191 can be resting on the connecting seat 192. When the threaded adjustment member 191 is screwed, the threaded adjustment member 191 moves relative to the positioning member 193, thereby driving the first transmission member 150 to move through the connecting seat 192, thereby realizing gap adjustment.

[0049] Unexpected situations may occur during the operation of the lifting mechanism, causing the ejector pin 130 to move out of control. In order to improve the safety of the lifting mechanism, the lifting mechanism also includes a first position detection member 210, a second position detection member 220, a first stop block 230, and a second stop block 240 provided on the mounting bracket 110. Optionally, the first position detection member 210, the second position detection member 220, the first stop block 230, and the second stop block 240 can all be fixed to the mounting bracket 110 by screws. A detection block 310 can be provided on the second transmission member 160, and the detection block 310 is used to cooperate with the first position detection member 210 and the second position detection member 220.

[0050] The first and second position detectors 210, 220 are spaced apart along the first direction. The first and second position detectors 210, 220 are used to detect the position of the second transmission member 160, thereby controlling the operating state of components such as the servo motor based on their detected values. Alternatively, the first and second position detectors 210, 220 may be photoelectric sensors or other components. The first and second stoppers 230, 240 are spaced apart along the first direction, with at least a portion of the second transmission member 160 positioned between the first and second stoppers 230, 240.

[0051] When the detection baffle 310 moves to the first position detection member 210, the first position detection member 210 is triggered and sends an alarm signal. At this time, the servo motor can be controlled to stop. If the servo motor does not stop due to a malfunction or other reasons and continues to work, the second transmission member 160 will continue to approach the first stopper 230. When the second transmission member 160 contacts the first stopper 230, the first stopper 230 can prevent the second transmission member 160 from continuing to move, thereby more reliably limiting the position of the ejector pin 130. Similarly, when the detection block 310 moves to the second position detection member 220, the second position detection member 220 is triggered, thereby issuing an alarm signal, which can then control the servo motor to stop. If the servo motor continues to operate due to a fault or other reasons and does not stop, the second transmission member 160 will continue to approach the second stopper 240. When the second transmission member 160 contacts the second stopper 240, the second stopper 240 can prevent the second transmission member 160 from moving further, thereby limiting the range of movement of the second transmission member 160 and more reliably limiting the position of the ejector pin 130. This embodiment limits the position of the second transmission member 160 through both electrical control and mechanical limiters, thereby more precisely controlling the range of movement of the ejector pin 130 and preventing damage to components caused by excessive movement of the ejector pin 130.

[0052] An embodiment of the present application also discloses a semiconductor process equipment, which includes a reaction chamber, an electrostatic chuck and the lifting mechanism described in any of the above embodiments. The electrostatic chuck is arranged in the reaction chamber to carry the wafer, and the lifting mechanism is arranged below the reaction chamber. The lifting mechanism is connected to the electrostatic chuck, thereby applying a force to the wafer placed on the electrostatic chuck to drive the wafer to rise and fall.

[0053] like Figure 7 As shown, refer to Figures 8 to 11 The present application also discloses a control method for semiconductor process equipment. The control method is applied to the semiconductor process equipment described in any of the above embodiments, and includes:

[0054] S100. Obtain the torque value output by the servo motor.

[0055] When the chip sticks, the torque on the servo motor will change. The servo motor itself has the function of detecting the torque it is subjected to, so the change of the torque on the servo motor can be obtained through the servo motor.

[0056] S200 , obtaining the tension and pressure value of the tension and pressure detection component 140 .

[0057] When wafer sticking occurs, the tensile pressure applied to the ejector pin 130 will change. The change in tensile pressure can be obtained by the tensile pressure detection member 140. Specifically, since the reaction chamber is a vacuum environment, when the ejector pin 130 is not in contact with the wafer, the ejector pin 130 is close to the wafer under the action of atmospheric pressure. At this time, the force detected by the tensile pressure detection member 140 is tensile force; when the ejector pin 130 contacts the wafer, the ejector pin 130 is under pressure. Once wafer sticking occurs, the tensile force detected by the tensile pressure detection member 140 suddenly decreases. In the case of more serious wafer sticking, the pressure applied to the ejector pin 130 by the tensile pressure detection member 140 will be greater than the tensile force applied to the ejector pin 130. The tensile pressure detection member 140 can measure that the resultant force applied to the ejector pin 130 at this time is pressure. The tensile pressure detection member 140 can detect whether the force applied to the ejector pin 130 is tensile, compressive, or compressive, and can detect the magnitude of the force.

[0058] S300 , determining the degree of wafer bonding according to the torque value and the pulling and pressing force value.

[0059] Optionally, the aforementioned degree of wafer adhesion may include both non-adhesive and adherent wafers. When the wafer is not adhered, the pull pressure value and the torque value both change linearly, and the change value of both will not exceed the threshold value, so no alarm is required. When the wafer is adhered, the pull pressure value and the torque value fluctuate greatly, and an alarm is required to facilitate the operator to perform corresponding processing. For example, the operator can control the servo motor to stop and brake, and perform a desorption operation on the wafer at the same time, thereby achieving control of the semiconductor process equipment. Of course, other control operations can also be used after step S300, and the embodiments of the present application are not limited to this.

[0060] The control method described above can determine the degree of sticking by analyzing the changes in torque and tension / compression values, thereby determining whether sticking has occurred. Even if the sticking is mild, the changes in torque and tension / compression values ​​can be combined to more promptly detect sticking. This approach, by incorporating both torque and tension / compression values ​​into the determination of sticking, can more accurately identify sticking, thereby improving sticking detection accuracy.

[0061] In order to more accurately perform corresponding operations according to the wafer sticking degree, the sticking degree can be divided into light sticking, medium sticking and heavy sticking according to the residual voltage formed by the residual charge.

[0062] When there is mild wafer sticking, the residual voltage is greater than 500V and less than 1000V, that is, the residual voltage is greater than 500V and less than 1000V, which is equivalent to the occurrence of mild wafer sticking. In the process of ejector pin 130 contacting the wafer, ejector pin 130 contacts the wafer and generates resistance, resulting in a corresponding increase in the torque value, but the change in the torque value is small and is submerged in normal fluctuations. The first change value of the torque value is less than or equal to the first set threshold value. At this time, only looking at the torque parameter cannot identify mild wafer sticking. At the same time, in the process of ejector pin 130 contacting the wafer, ejector pin 130 contacts the wafer and generates resistance. The pulling pressure on ejector pin 130 will tend to decrease, but the change in the pulling pressure value is relatively small. The second change value of the pulling pressure value is less than or equal to the second set threshold value. Therefore, only looking at the change in the pulling pressure value cannot identify mild wafer sticking. Statistics of a large number of experimental results show that in the case of mild wafer sticking, the torque tends to increase when the ejector pin 130 contacts the wafer, the first change value of the torque value is less than or equal to the first set threshold, the pulling pressure value tends to decrease when the ejector pin 130 contacts the wafer, and the second change value of the pulling pressure value is less than or equal to the second preset threshold. Based on this, it can be determined that mild wafer sticking has occurred.

[0063] When moderate wafer sticking occurs, the residual voltage is greater than 1000V and less than 2000V. In other words, a residual voltage greater than 1000V and less than 2000V is equivalent to moderate wafer sticking. In this case, the first change in the torque value is less than or equal to the first set threshold. The tensile force applied to ejector pin 130 decreases significantly when ejector pin 130 contacts the wafer. At this point, the second change in the tensile force value exceeds the second set threshold. This indicates that tensile force detection can identify all cases of moderate wafer sticking. If moderate wafer sticking cannot be identified using the torque value, the change in the tensile force value can be used to identify moderate wafer sticking.

[0064] When severe wafer sticking occurs, the residual voltage exceeds 2000V. In other words, a residual voltage greater than 2000V is equivalent to severe wafer sticking. At this point, the first change in torque value exceeds the first set threshold, triggering an alarm. Simultaneously, the tensile force applied to ejector pin 130 decreases significantly as ejector pin 130 contacts the wafer, and the second change in tensile force value exceeds the second set threshold. At this point, severe wafer sticking can be identified using both the torque and tensile force parameters.

[0065] Based on the above content, step S300 may specifically include:

[0066] S310: If the torque value increases and the first change value of the torque value is less than or equal to the first set threshold, and the pulling force value decreases and the second change value of the pulling force value is less than or equal to the second preset threshold, it is determined that light chip sticking occurs.

[0067] S320: If the first change value of the torque value is less than or equal to the first set threshold value, and the second change value of the pulling force value is greater than the second preset threshold value, it is determined that moderate chip sticking occurs.

[0068] S330: If the first change value of the torque value is greater than the first set threshold value, and the second change value of the pulling force value is greater than the second preset threshold value, it is determined that severe chip sticking occurs.

[0069] It should be noted that when the wafer is slightly stuck, moderately stuck or severely stuck, the operator can control the servo motor to stop and brake, and perform desorption operations on the wafer at the same time, such as applying different desorption voltages according to different degrees of sticking, thereby achieving control of the semiconductor process equipment.

[0070] The above control method can more accurately determine the degree of wafer sticking, and thus make corresponding responses according to different degrees of wafer sticking. Therefore, the control method can handle the wafer sticking phenomenon more specifically.

[0071] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of this application, ordinary technicians in this field can also make many forms without departing from the purpose of this application and the scope of protection of the claims, all of which are within the protection of this application.

Claims

1. A lifting mechanism for semiconductor process equipment, the semiconductor process equipment comprising a reaction chamber, characterized in that: The lifting mechanism is arranged below the reaction chamber, and comprises a servo motor, a thimble (130), and a tension and pressure detection member (140); One end of the tension and pressure detection member (140) is connected to the driving end of the servo motor, and the other end of the tension and pressure detection member (140) is connected to the ejector pin (130) for detecting the tension and pressure applied to the ejector pin (130); The moving direction of the ejector pin (130) is a first direction; The lifting mechanism further includes a transmission assembly, the transmission assembly including a first transmission member (150) and a second transmission member (160), the first transmission member (150) is connected to the ejector pin (130), and the second transmission member (160) is connected to the driving end; One end of the tension and pressure detection member (140) is connected to the first transmission member (150), and the other end of the tension and pressure detection member (140) is connected to the second transmission member (160); The transmission assembly further comprises a first limiting member (152) and a second limiting member (161), wherein one of the first limiting member (152) and the second limiting member (161) is arranged on a surface of the first transmission member (150) facing the second transmission member (160), and the other is arranged on a surface of the second transmission member (160) facing the first transmission member (150); In the first direction, there is a gap between the first limiting member (152) and the second limiting member (161), and between the first limiting member (152) and the first transmission member (150) or the second transmission member (160) for setting the second limiting member (161), and the gap is used to ensure that no force is transmitted between the first transmission member (150) and the second transmission member (160) in the first direction.

2. The lifting mechanism according to claim 1, characterized in that: The first limiting member (152) has a limiting groove (151) that matches the second limiting member (161), and the outer peripheral surface of the second limiting member (161) is in contact with the inner peripheral surface of the limiting groove (151); The lifting mechanism further comprises a bellows (250), the first transmission member (150) is connected to the ejector pin (130) via the bellows (250), and the bellows (250), the limiting groove (151), the second limiting member (161) and the driving end are coaxially arranged.

3. The lifting mechanism according to claim 2, characterized in that: The second limiting member (161) comprises a first column (161a) and a second column (161b), the first column (161a) being connected to the first transmission member (150) or the second transmission member (160) via the second column (161b), and the first column (161a) protruding relative to the outer peripheral surface of the second column (161b); The limiting groove (151) includes a first groove (151a) and a second groove (151b) that are connected to each other, the first groove (151a) is recessed relative to the second groove (151b), and the first groove (151a) and the second groove (151b) both have through openings on the side facing the second limiting member (161), and the second limiting member (161) can enter the limiting groove (151) through the through openings, and a side of the first column (161a) facing away from the second column (161b) has a gap with the bottom surface of the first groove (151a); the outer peripheral surface of the first column (161a) is in contact with the inner peripheral surface of the first groove (151a), and / or the outer peripheral surface of the second column (161b) is in contact with the inner peripheral surface of the second groove (151b).

4. The lifting mechanism according to claim 1 or 2, characterized in that: The transmission assembly further includes a rotating connection member (170), one of the first transmission member (150) and the second transmission member (160) is fixedly connected to one end of the tension and pressure detection member (140), and the other is provided with the rotating connection member (170), and the other end of the tension and pressure detection member (140) is floatingly connected through the rotating connection member (170).

5. The lifting mechanism according to claim 4, characterized in that: The transmission assembly further comprises a mounting member (180), one of the first transmission member (150) and the second transmission member (160) is connected to one end of the tension and pressure detection member (140), and the other is connected to the tension and pressure detection member (140) via the mounting member (180).

6. The lifting mechanism according to claim 2, characterized in that: The lifting mechanism further includes an adjusting component (190), wherein the adjusting component (190) includes a threaded adjusting member (191), wherein the threaded adjusting member (191) is connected to one of the first transmission member (150) and the second transmission member (160), and the threaded adjusting member (191) can rotate relative to the first transmission member (150) and the second transmission member (160) to adjust the gap.

7. The lifting mechanism according to claim 6, characterized in that: The adjustment assembly also includes a connecting seat (192) and a positioning member (193), the connecting seat (192) is provided with a strip hole (192a) and a threaded hole, the connecting seat (192) is connected to the second transmission member (160) through the strip hole (192a), and one end of the tension and pressure detection member (140) is fixedly connected to the connecting seat (192); the positioning member (193) is connected to the second transmission member (160), and the threaded adjustment member (191) is rotatably connected to the positioning member (193) and can rotate relative to the threaded hole to drive the connecting seat (192) to move along the first direction.

8. The lifting mechanism according to claim 1, characterized in that: The lifting mechanism further comprises a mounting bracket (110), the mounting bracket (110) being connected to the bottom of the reaction chamber, the servo motor being arranged on the mounting bracket (110), and the mounting bracket (110) being provided with a first position detection member (210), a second position detection member (220), a first stopper (230), and a second stopper (240); The first position detection member (210) and the second position detection member (220) are arranged at intervals along the first direction, and the first position detection member (210) and the second position detection member (220) are used to detect the position of the second transmission member (160); The first stopper (230) and the second stopper (240) are arranged at intervals along the first direction, and at least a portion of the second transmission member (160) is located between the first stopper (230) and the second stopper (240).

9. A semiconductor process equipment, characterized in that: It comprises a reaction chamber, an electrostatic chuck and a lifting mechanism according to any one of claims 1 to 8, wherein the electrostatic chuck is arranged in the reaction chamber for carrying a wafer, the lifting mechanism is arranged below the reaction chamber, and the lifting mechanism is connected to the electrostatic chuck to drive the wafer to rise and fall.

10. A control method for semiconductor process equipment, applied to the semiconductor process equipment according to claim 9, characterized in that: include: Obtaining the torque value output by the servo motor; Obtaining the tension and pressure value of the tension and pressure detection component; The degree of wafer adhesion is determined according to the torque value and the pulling and pressing force value.

11. The control method according to claim 10, characterized in that: Determining the wafer adhesion degree according to the torque value and the pulling force value specifically includes: If the torque value increases and the first change value of the torque value is less than or equal to the first set threshold, and the pulling and pressing force value decreases and the second change value of the pulling and pressing force value is less than or equal to the second preset threshold, it is determined that slight chip sticking occurs; If the first change value of the torque value is less than or equal to the first set threshold value, and the second change value of the pulling force value is greater than the second preset threshold value, it is determined that moderate chip sticking occurs; If the first change value of the torque value is greater than the first set threshold value, and the second change value of the pulling force value is greater than the second preset threshold value, it is determined that severe chip sticking occurs.

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