Local cavity package structure and packaging method

Abstract

Embodiments of the present application provide a local cavity packaging structure and a packaging method, and relate to the technical field of chip packaging. The local cavity packaging structure comprises a substrate, a first chip, a second chip and a protective film. The first chip and the second chip are arranged on the substrate in a spaced manner. The protective film is provided with a pre-cut mark. The second chip is provided with a piercing member at the periphery thereof. The protective film is arranged on the substrate to cover the first chip and the second chip. The piercing member is protruded on the substrate and arranged in correspondence with the pre-cut mark. In this way, a closed cavity structure can be formed at the bottom of the first chip. Meanwhile, the arrangement of the piercing member is conducive to piercing the protective film at the periphery of the second chip, so that the plastic encapsulation body can enter the bottom of the second chip during plastic encapsulation.

Description

Technical Field

[0001] This invention relates to the field of chip packaging technology, and more specifically, to a partial cavity packaging structure and packaging method. Background Technology

[0002] Surface acoustic wave (SAW) filters are widely used in receiver front-ends, duplexers, and receiver filters. The working principle of a SAW filter is that sound waves propagate on the surface of a chip. Utilizing the piezoelectric properties of piezoelectric materials, input and output transducers convert the input electromagnetic signal into mechanical energy. After processing, the mechanical energy is converted back into an electrical signal, thus filtering out unwanted signals and noise and improving reception quality.

[0003] To ensure proper filtering function, the functional area of ​​the filter chip must not come into contact with any material and must be designed as a cavity structure. Other non-filtering chips do not require a bottom cavity structure, and creating one at the bottom of a non-filtering chip can easily reduce product reliability. Traditional packaging methods often use a separator on the back of the filter chip to isolate the molding compound from the outside of the filter chip, thus creating a cavity structure at the bottom. This packaging method is prone to two types of failure: First, the separator may not be broken by the molding compound flow, resulting in cavities at the bottom of both the filter chip and non-filtering chips, leading to reduced product reliability. Second, the separator may be easily broken by the molding compound flow, causing contamination of the cavity structure at the bottom of the filter chip and impairing its filtering function. Summary of the Invention

[0004] The objectives of this invention include, for example, providing a partial cavity packaging structure and packaging method that can improve packaging quality, enhance product performance, and increase structural reliability.

[0005] The embodiments of the present invention can be implemented as follows:

[0006] In a first aspect, the present invention provides a partial cavity packaging structure, including a substrate, a first chip, a second chip, and a protective film. The first chip and the second chip are disposed at intervals on the substrate. The protective film has pre-cuts. The second chip has a piercing member on its periphery. The protective film is laid on the substrate to cover the first chip and the second chip. The piercing member protrudes from the substrate and is disposed corresponding to the pre-cuts.

[0007] In an optional embodiment, the end of the piercing member away from the substrate is tapered to facilitate piercing the protective film.

[0008] In an optional embodiment, the cone is located at the center of the pre-cut.

[0009] In an optional embodiment, the substrate is provided with adsorption holes located around the first chip and the second chip, for adsorbing the protective film.

[0010] In an optional embodiment, the substrate is provided with a cutting channel, and the adsorption hole is provided on the cutting channel.

[0011] In an optional embodiment, the number of second chips includes a plurality of second chips disposed around the periphery of the first chip, and the puncture element is disposed around the periphery of each second chip.

[0012] In an optional embodiment, four second chips are evenly distributed around the outer periphery of each first chip, and the puncture member is disposed between the first chip and the second chip, and is disposed close to the second chip.

[0013] In an optional embodiment, the first chip includes chip one, and the second chip includes chip two, chip three, chip four, and chip five. Chip two, chip three, chip four, and chip five are disposed on the outer periphery of chip one. Chip two and chip four are centrally symmetrical about chip one, and chip three and chip five are centrally symmetrical about chip one.

[0014] In an optional implementation, the first chip further includes chip six and chip seven, which are centrally symmetrical about chip one.

[0015] In a second aspect, the present invention provides a packaging method for packaging a partial cavity packaging structure as described in any of the foregoing embodiments, the method comprising:

[0016] Provide a substrate;

[0017] A first chip and a second chip are mounted on the substrate, and a piercing member is disposed on the substrate; wherein the piercing member is disposed between the first chip and the second chip and is close to the second chip;

[0018] A protective film is laid on the substrate; wherein the protective film has pre-cut marks, and the pre-cut marks are arranged opposite to the puncture member;

[0019] The protective film is adsorbed onto the surfaces of the first chip and the second chip, and the piercing element pierces the protective film;

[0020] The first chip and the second chip are encapsulated to form a closed cavity at the bottom of the first chip and to fill the bottom of the second chip with the encapsulant.

[0021] The beneficial effects of the embodiments of the present invention include, for example:

[0022] The partial cavity encapsulation structure provided in this invention, by setting a protective film, can form a closed cavity at the bottom of the first chip, ensuring that the function of the first chip is not affected and improving product performance. Simultaneously, pre-cut marks and puncture elements are set on the protective film, with the puncture elements corresponding to the pre-cut marks and located on the periphery of the second chip. This facilitates the puncture elements to pierce the protective film during the vacuum lamination process, thereby allowing the encapsulant to smoothly enter the bottom of the second chip during molding, ensuring that the bottom of the second chip is completely filled with the encapsulant, resulting in a more reliable structure.

[0023] The packaging method provided in this invention is simple in process, has undemanding process conditions, is highly operable, has a reliable structure, and is conducive to improving packaging quality, product performance, and structural reliability. Attached Figure Description

[0024] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 This is a schematic diagram of a partial cavity encapsulation structure provided in an embodiment of the present invention;

[0026] Figure 2 A schematic diagram illustrating the protective film configuration of the partial cavity encapsulation structure provided in an embodiment of the present invention;

[0027] Figure 3 This is another structural schematic diagram of the partial cavity encapsulation structure provided in the embodiment of the present invention;

[0028] Figure 4 This is a schematic diagram of another structure of the substrate for the partial cavity packaging structure provided in an embodiment of the present invention;

[0029] Figure 5 A schematic diagram of a chip distribution structure provided by an embodiment of the present invention for a partial cavity packaging structure;

[0030] Figure 6 A flowchart illustrating the steps of a method for fabricating a partial cavity encapsulation structure according to an embodiment of the present invention;

[0031] Figure 7 This is a schematic diagram of the manufacturing process of the partial cavity packaging structure provided in an embodiment of the present invention.

[0032] Icons: 100 - Partial cavity packaging structure; 110 - Substrate; 111 - First pad; 113 - Second pad; 115 - Green paint layer; 117 - Adsorption hole; 120 - First chip; 121 - Closed cavity; 123 - Chip one; 125 - Chip six; 127 - Chip seven; 130 - Second chip; 131 - Chip two; 133 - Chip three; 135 - Chip four; 137 - Chip five; 140 - Protective film; 141 - Pre-cut; 150 - Puncture element; 160 - Molded body. Detailed Implementation

[0033] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The components of the embodiments of the present invention described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0034] Therefore, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the invention without inventive effort are within the scope of protection of the invention.

[0035] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0036] In the description of this invention, it should be noted that if terms such as "upper," "lower," "inner," or "outer" are used to indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the product of this invention is usually placed, they are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this invention.

[0037] Furthermore, the terms "first" and "second" are used only to distinguish descriptions and should not be interpreted as indicating or implying relative importance.

[0038] It should be noted that, where there is no conflict, the features in the embodiments of the present invention can be combined with each other.

[0039] Please refer to Figure 1 and Figure 2This embodiment provides a partial cavity encapsulation structure 100, which can be used in electronic products such as surface acoustic wave filters. The partial cavity encapsulation structure 100 includes a substrate 110, a first chip 120, a second chip 130, and a protective film 140. The first chip 120 and the second chip 130 are spaced apart on the substrate 110. The protective film 140 has pre-cuts 141, and the second chip 130 has piercing elements 150 around its periphery. The protective film 140 is laid on the substrate 110 to cover the first chip 120 and the second chip 130. The piercing elements 150 protrude from the substrate 110 and are correspondingly arranged to the pre-cuts 141. Because of the protective film 140, the molding flow of the encapsulant 160 can be blocked, forming a closed cavity 121 at the bottom of the first chip 120, ensuring that the function of the first chip 120 is not affected and improving product performance. Meanwhile, a piercing element 150 is provided around the second chip 130. The piercing element 150 is used to pierce the protective film 140, thereby allowing the encapsulant 160 to enter the bottom of the second chip 130 and completely fill the space between the second chip 130 and the substrate 110. By setting a pre-cut 141 on the protective film 140 around the second chip 130 and setting the piercing element 150 corresponding to the pre-cut 141, the difficulty of the piercing element 150 piercing the protective film 140 is reduced, which helps to ensure that the piercing element 150 pierces the protective film 140, thereby allowing the encapsulant 160 to fill the bottom of the second chip 130, making the structure more reliable and improving product reliability.

[0040] It is understood that the first chip 120 in this embodiment is, but is not limited to, a surface acoustic wave filter chip, which needs to implement the filtering function in the enclosed cavity 121 structure; the second chip 130 is a non-filter chip, including but not limited to an antenna switch, a low-noise amplifier, a capacitor, an inductor or other chips.

[0041] The end of the piercing member 150 furthest from the substrate 110 is tapered and has spikes to facilitate piercing the protective film 140. In this embodiment, the piercing member 150 can be a protrusion on the substrate 110, and the material can be metal or laminated resin, such as a copper pillar or resin. To make it easier for the piercing member 150 to pierce the protective film 140 and ensure that the molding compound 160 can smoothly enter the bottom of the second chip 130, the tapered part of the piercing member 150 is located in the middle of the pre-cut 141. This allows for a larger piercing opening and a better piercing effect, ensuring that the bottom of the second chip 130 is completely filled. It is easy to understand that the protrusion height of the piercing member 150 should be sufficient to pierce the protective film 140. It should be noted that the pre-cut 141 can be set on the inner or outer surface of the protective film 140. The pre-cut 141 can be pre-set before film application or cut after film application. The cutting process includes, but is not limited to, laser cutting or other cutting technologies, and is not limited here.

[0042] Optionally, the substrate 110 is provided with a first pad 111 for electrical connection with the first chip 120. A green paint layer 115 is coated on the substrate 110 to surround the first pad 111. After the first chip 120 is soldered to the first pad 111, the first chip 120, the first pad 111, and the green paint layer 115 are tightly bonded together. The green paint layer 115 can block mold flow and support the protective film 140, ensuring that a closed cavity 121 is formed at the bottom of the first chip 120, improving the sealing performance of the cavity structure at the bottom of the first chip 120, ensuring that the functional areas of the first chip 120 are not contaminated, and improving reception quality and product performance. It is understood that the green paint layer 115 can be applied to the entire substrate 110, that is, the green paint layer 115 is provided in the area corresponding to the first chip 120 and the area corresponding to the second chip 130. The piercing member 150 can be disposed on the green paint layer 115 or on the substrate 110. The height of the green paint layer 115 and the height of the piercing member 150 are designed to match each other to ensure that the piercing member 150 can pierce the protective film 140 and play the role of separating and cutting the protective film 140 around the second chip 130.

[0043] Optionally, a second pad 113 is provided on the substrate 110. Since a green paint layer 115 is provided, the second pad 113 is led out and raised onto the green paint layer 115. That is, the plane height of the second pad 113 is higher than the plane height of the first pad 111. This can increase the space height at the bottom of the second chip 130, making it easier for the molding compound 160 to enter and fully fill the bottom of the second chip 130, thereby improving the packaging quality and structural reliability.

[0044] Optionally, the protective film 140 is attached to the side of the first chip 120 and the second chip 130 away from the substrate 110 by vacuum adsorption. Under the action of vacuum adsorption force, the protective film 140 is adsorbed towards the side closer to the substrate 110, and the protective film 140 is recessed towards the side closer to the substrate 110. During the adsorption process, the protective film 140 touches the piercing element 150, and under the combined action of vacuum adsorption force and the conical shape of the piercing element 150, the protective film 140 is punctured. Furthermore, the protective film 140 is provided with pre-cut marks 141, which can ensure that the protective film 140 is better separated during the adsorption process, and the encapsulator 160 fully enters the bottom of the second chip 130.

[0045] Please combine Figure 3 and Figure 4The substrate 110 has adsorption holes 117 located around the first chip 120 and the second chip 130, used to adsorb the protective film 140. During the vacuum adsorption process of the protective film 140, adsorbing the protective film 140 into the adsorption holes 117 on the substrate 110 can improve the adhesion between the protective film 140 and the substrate 110, and increase the surface tension of the protective film 140 at the edge of the second chip 130, thereby facilitating better separation of the protective film 140 by the piercing member 150. In this embodiment, the adsorption holes 117 are located at the edge of the substrate 110, where no chip is mounted; this is an ineffective area and does not affect the normal use of the substrate 110. Optionally, the substrate 110 has dicing channels, which can be located at the edge or ineffective area of ​​the substrate 110, with the adsorption holes 117 located on these channels. During the cutting process, the adsorption hole 117 structure can be removed along with the product, so that the cut individual product does not include the adsorption hole 117 structure. This improves the packaging quality without increasing the size and weight of the product, and does not affect the product's shape. It should be noted that the adsorption hole 117 can be a blind hole or a through hole; no specific limitation is made here.

[0046] Optionally, for a single product, the number of the first chip 120 and the number of the second chip 130 can be one or more. For example, in one embodiment, the number of the first chip 120 is one, and the number of the second chips 130 includes multiple second chips 130, which are disposed around the first chip 120, and each second chip 130 is provided with a piercing element 150 around its periphery. In this embodiment, the number of the second chips 130 includes four, and the four second chips 130 are respectively disposed around the first chip 120. The protective film 140 is provided with a pre-cut 141 on the outer side of each second chip 130, and a piercing element 150 is provided between each second chip 130 and the first chip 120 and on the side closer to the second chip 130, to ensure that the protective film 140 on the outer side of each second chip 130 is cut, so that the encapsulant 160 can flow into the bottom of each second chip 130.

[0047] As is easily understood, four second chips 130 are evenly distributed around the periphery of each first chip 120, and the piercing element 150 is located between the first chip 120 and the second chip 130, and close to the second chip 130. With the multiple second chips 130 and the multiple piercing elements 150 evenly spaced, the protective film 140 experiences more uniform force during vacuum adsorption, which facilitates better cutting and separation of the protective film 140 by the piercing element 150, resulting in a better effect of piercing and separating the protective film 140.

[0048] Please combine Figure 5Optionally, in another embodiment, the first chip 120 includes chip one 123, and the second chip 130 includes chip two 131, chip three 133, chip four 135, and chip five 137. Chips two 131, chip three 133, chip four 135, and chip five 137 are disposed on the outer periphery of chip one 123. Chips two 131 and chip four 135 are centrally symmetrical about chip one 123, and chips three 133 and chip five 137 are centrally symmetrical about chip one 123. Figure 5 As shown, chips 3 (133) and 5 (137) are located on the extension of a diagonal line of chip 1 (123), while chips 2 (131) and 4 (135) are located on the extension of a center line of chip 1 (123). Each second chip 130 has a piercing element 150 located between it and chip 1 (123), near the side of the second chip 130, to ensure that the protective film 140 on the outside of each second chip 130 is cut, allowing the molding compound 160 to flow into the bottom of each second chip 130. This arrangement allows for better utilization of the pre-cut marks 141, enabling more second chips 130 to be arranged around chip 1 (123), increasing the chip density and thus improving the chip integration of a single product, allowing for richer product functionality. It can be understood that the protective film 140 is located on the side of the first chip 120 and second chip 130 away from the substrate 110, meaning that the first chip 120 and second chip 130 support the protective film 140. Chips 2 (131) and 4 (135) are centrally symmetrical (i.e., rotationally symmetrical), and chips 3 (133) and 5 (137) are centrally symmetrical (i.e., rotationally symmetrical). This rotationally symmetrical staggered distribution can achieve more uniform pressure on the protective film 140, and can make full use of the effective area of ​​the substrate 110 to mount more chips, increase the chip distribution density, and improve the effective utilization rate of the substrate 110. It is understandable that, since the pre-cut marks 141 on the protective film 140 are set according to the distribution of the second chip 130, the pre-cut marks 141 can be set as a "I" shape, a "+" shape, a "well" shape, a "rice" shape, or other grid-like shapes. When the second chip 130 is distributed in a rotating and staggered manner, the pre-cut marks 141 on the protective film 140 are also staggered. After the pre-cut marks 141 are cut and separated by the piercing member 150, they form staggered channels. During molding, the molding compound 160 can fill to the bottom of each second chip 130 through these channels. The molding compound 160 can flow into the bottom of the second chip 130 from multiple directions, making the bottom of the second chip 130 more completely filled, with higher filling efficiency and better filling effect, which is conducive to improving the reliability of the packaging structure.

[0049] Optionally, the number of first chips 120 can also be multiple, and the first chip 120 may also include a sixth chip 125 and a seventh chip 127, wherein the sixth chip 125 and the seventh chip 127 are centrally symmetrical about the first chip 123. In this embodiment, as Figure 5As shown, chip six 125 and chip seven 127 are located on the extension of the other diagonal line of chip one 123. Chips two 131, three 133, four 135, five 137, six 125 and seven 127 are evenly distributed on the outer periphery of chip one 123. While improving the chip integration, it is also beneficial for the plastic package 160 at the bottom of the second chip 130 to be filled more completely.

[0050] Please combine Figure 6 and Figure 7 This invention also provides a packaging method for packaging the partial cavity packaging structure 100 as described in any of the foregoing embodiments. The packaging method mainly includes:

[0051] S100: A substrate 110 is provided. The substrate 110 is provided with a first pad 111 and a second pad 113. The first pad 111 is used to connect with the first chip 120, and the second pad 113 is used to connect with the second chip 130.

[0052] S200: A first chip 120 and a second chip 130 are mounted on a substrate 110, and a piercing member 150 is provided on the substrate 110. The piercing member 150 is located between the first chip 120 and the second chip 130 and is close to the second chip 130.

[0053] S300: A protective film 140 is laid on the substrate 110. The protective film 140 is provided with a pre-cut 141, which is disposed opposite to the piercing member 150.

[0054] S400: The protective film 140 is adsorbed onto the surface of the first chip 120 and the second chip 130, and the piercing element 150 pierces the protective film 140.

[0055] S500: Molding a first chip 120 and a second chip 130 to form a closed cavity 121 at the bottom of the first chip 120 and to fill the bottom of the second chip 130 with a molding compound 160.

[0056] Optionally, in the step of setting the piercing element 150 on the substrate 110, a conical bump structure can be formed on the substrate 110, with the cone angle located at the end away from the substrate 110, thus forming the piercing element 150. The piercing element 150 can be made of copper pillar or laminated resin material. A green paint layer 115 is coated on the substrate 110, which surrounds the first pad 111, providing protection for the first pad 111 and supporting and blocking the protective film 140. This prevents the molding flow of the molding compound 160 from breaking through the protective film 140 and entering the bottom of the first chip 120, contaminating the sealed cavity 121. The green paint layer 115 helps to improve the sealing performance of the sealed cavity 121. To facilitate the application of the green paint layer 115, a green paint layer 115 can also be applied around the second pad 113, ensuring that the height of the green paint layer 115 at the mounting positions of the first chip 120 and the second chip 130 is consistent. This avoids creating an uneven, stepped structure on the surface of the substrate 110 and prevents issues with the refilling of the molding compound 160. After mounting the first chip 120 and the second chip 130, the chip leads, the pads on the substrate 110, and the green paint layer 115 are tightly bonded together. The height of the green paint layer 115 is matched with the height of the piercing element 150 to ensure that the piercing element 150 can pierce the protective film 140, thereby separating and cutting the protective film 140 on the outside of the second chip 130.

[0057] In steps S300 and S400, a protective film 140 with pre-cut marks 141 is first attached to the substrate 110, located on the side of the first chip 120 and the second chip 130 away from the substrate 110. The first chip 120 and the second chip 130 support the protective film 140. Using a vacuum machine, the protective film 140 is adsorbed close to the substrate 110. The protective film 140 is indented towards the substrate 110 due to the adsorption force. The protective film 140 on the outer side of the first chip 120 remains intact, allowing a closed cavity 121 to be formed at the bottom of the first chip 120. The pre-cut marks 141 on the protective film 140 on the outer side of the second chip 130 are punctured by the piercing member 150. It should be noted that the pre-cut marks 141 can also be formed after the protective film 140 is attached. The pre-cut marks 141 can be set on the inner or outer surface of the protective film 140.

[0058] In step S500, during molding, the molded body 160 is blocked by the protective film 140 and cannot enter the closed cavity 121 at the bottom of the first chip 120. However, since the protective film 140 on the outside of the second chip 130 is punctured, the molded body 160 passes through the protective film 140 and enters the bottom of the second chip 130, filling the space at the bottom of the second chip 130 and improving the reliability of the packaging structure.

[0059] In summary, the partial cavity encapsulation structure 100 and encapsulation method provided by the embodiments of the present invention have the following beneficial effects:

[0060] The partial cavity encapsulation structure 100 provided in this embodiment of the invention, by setting a protective film 140, can form a closed cavity 121 at the bottom of the first chip 120, ensuring that the function of the first chip 120 is not affected and improving product performance. Simultaneously, a pre-cut 141 and a puncture member 150 are set on the protective film 140, corresponding to the pre-cut 141 and located on the periphery of the second chip 130. This facilitates the puncture member 150 to pierce the protective film 140 during the vacuum lamination process, thereby allowing the encapsulant 160 to smoothly enter the bottom of the second chip 130 during molding, ensuring that the bottom of the second chip 130 is filled with the encapsulant 160, resulting in a more reliable structure. Furthermore, by providing adsorption holes 117 on the substrate 110, the bonding force between the protective film 140 and the substrate 110 is increased, and the surface tension of the protective film 140 is improved. This facilitates the puncture and separation of the protective film 140 on the outer side of the second chip 130, allowing more of the encapsulant 160 to pass through the protective film 140 and enter the bottom of the second chip 130, resulting in more complete filling of the space at the bottom of the second chip 130. The symmetrical distribution of multiple second chips 130 makes the protective film 140 more evenly stressed, which is beneficial for puncturing the protective film 140 on the outer side of the second chip 130. By rotating and staggering multiple second chips 130, the protective film 140 is subjected to more uniform force, which is conducive to increasing the chip distribution density and improving the utilization space of the substrate 110. At the same time, the staggered distribution of pre-cut marks 141 on the protective film 140 is conducive to the separation of the outer protective film 140 of the second chip 130, and facilitates more molding compounds 160 to enter the bottom of the second chip 130 faster and more smoothly, so that the space at the bottom of the second chip 130 is filled more completely by the molding compounds 160, thereby improving the reliability of the packaging structure.

[0061] The packaging method provided in this invention is simple in process, has undemanding process conditions, is highly operable, has a reliable structure, and is conducive to improving packaging quality, product performance, and structural reliability.

[0062] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A partial cavity encapsulation structure, characterized in that, The device includes a substrate, a first chip, a second chip, and a protective film. The first chip and the second chip are disposed on the substrate at intervals. The protective film has pre-cut marks. The second chip has a piercing element around its periphery. The protective film is laid on the substrate to cover the first chip and the second chip. The piercing element protrudes from the substrate and is disposed corresponding to the pre-cut marks. The substrate has a first pad that is electrically connected to the first chip.

2. The partial cavity encapsulation structure according to claim 1, characterized in that, The end of the puncture member away from the substrate is tapered to facilitate piercing the protective film.

3. The partial cavity encapsulation structure according to claim 2, characterized in that, The cone-shaped body is located in the middle of the pre-cut.

4. The partial cavity encapsulation structure according to claim 1, characterized in that, The substrate is provided with adsorption holes, which are located around the first chip and the second chip, and are used to adsorb the protective film.

5. The partial cavity encapsulation structure according to claim 4, characterized in that, The substrate has a cutting channel, and the adsorption hole is located on the cutting channel.

6. The partial cavity encapsulation structure according to claim 1, characterized in that, The number of the second chips includes multiple chips, which are disposed around the periphery of the first chip, and the puncture element is disposed around the periphery of each second chip.

7. The partial cavity encapsulation structure according to claim 6, characterized in that, Four second chips are evenly distributed around the outer periphery of each first chip, and the puncture member is disposed between the first chip and the second chip, and is positioned close to the second chip.

8. The partial cavity encapsulation structure according to claim 6, characterized in that, The first chip includes chip one, and the second chip includes chip two, chip three, chip four and chip five. Chip two, chip three, chip four and chip five are disposed on the outer periphery of chip one. Chip two and chip four are centrally symmetrical about chip one, and chip three and chip five are centrally symmetrical about chip one.

9. The partial cavity encapsulation structure according to claim 8, characterized in that, The first chip also includes chip six and chip seven, which are centrally symmetrical about chip one.

10. A packaging method, characterized in that, The method for encapsulating a partial cavity encapsulation structure as described in any one of claims 1 to 9 includes: Provide a substrate; A first chip and a second chip are mounted on the substrate, and a piercing member is disposed on the substrate; wherein the piercing member is disposed between the first chip and the second chip and is close to the second chip; A protective film is laid on the substrate; wherein the protective film has pre-cut marks, and the pre-cut marks are arranged opposite to the puncture member; The protective film is adsorbed onto the surfaces of the first chip and the second chip, and the piercing element pierces the protective film; The first chip and the second chip are encapsulated to form a closed cavity at the bottom of the first chip and to fill the bottom of the second chip with the encapsulant.

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