A tin liquid dispensing machine suitable for assembling patch components

Abstract

The present invention relates to the field of patch component technology, and discloses a tin liquid dispensing machine suitable for assembling patch components, including a flux nozzle, a tin liquid nozzle is arranged on the periphery of the flux nozzle, a flux pushing plate and a tin liquid pushing plate are slidably connected on the inner walls of the flux nozzle and the tin liquid nozzle, respectively, a flux inlet and a tin liquid inlet are opened on the side walls of the flux nozzle and the tin liquid nozzle, a gas separation groove is installed on the top of the flux nozzle and the tin liquid nozzle, and a flux jet valve and a tin liquid jet valve are respectively arranged on the bottom surface of the gas separation groove. The present invention sprays flux and tin liquid respectively through the flux nozzle and the tin liquid nozzle, and wraps the tin liquid around the periphery of the flux, so as to prevent the flux from flowing when it melts and removing oxides outside the pad, thereby preventing the tin liquid from flowing outside the pad and contacting with the tin liquid on other pads, reducing the probability of short circuit, and improving the qualified rate of welding.

Description

Technical Field

[0001] The invention relates to the technical field of patch components, in particular to a tin liquid dispensing machine suitable for assembling patch components. Background Art

[0002] Surface mount technology, referred to as SMT, refers to the technology of printing and coating solder paste on the pads of printed circuit boards, accurately placing surface mount components on the pads coated with solder paste, heating the circuit boards according to a specific reflow temperature curve to melt the solder paste, and then forming solder joints between the components and the printed circuit boards after the alloy components cool and solidify to achieve metallurgical connection.

[0003] Solder paste is a new type of welding material that came into being with SMT. Solder paste is a complex system, mainly a paste made of a mixture of solder powder and flux. Solder paste has a certain viscosity at room temperature, which can initially stick electronic components to a predetermined position. At the welding temperature, as the solvent and some additives evaporate, the soldered components and printed circuit pads are welded together to form a permanent connection. However, tin liquid is not easy to adhere to the PCB board. This is because there is a metal oxide film on the PCB board. The metal oxide film prevents the tin liquid from infiltrating the PCB board. Therefore, the tin liquid cannot flow well on the metal oxide film, and usually forms dots due to its own tension. Therefore, flux is needed to remove the metal oxide film. Among them, the commonly used flux is rosin, which can remove the oxide on the pad, so that the molten tin can better penetrate the pad.

[0004] Generally, solder paste is a uniform mixture of tin powder and rosin. After this solder paste is applied to the pad, during the preheating stage of reflow soldering, the rosin on the outer layer of the solder paste spot melts and flows after being heated, thereby removing the oxides in the area outside the pad. The fluidity of the metal on the PCB board without oxides is enhanced, which leads to an expansion of the flow range of the molten tin liquid, which can easily cause the solder pastes of different pads to stick together and form a short circuit, reducing the qualified rate of welding. In addition, due to the uniform tin content in traditional solder points, when the solder paste collapses due to melting due to heat, it is easy to flow around, increasing the risk of short circuits. Summary of the invention

[0005] In view of the shortcomings of the existing paste dispensing machine mentioned in the background technology during use, the present invention provides a tin liquid paste dispensing machine suitable for assembling patch components, which has the advantages of preventing the melting and flow of rosin and expanding the range of tin liquid flow, and solves the problem mentioned in the above background technology that the oxide around the soldering pad is removed, making it easier for the tin liquid to flow out of the soldering pad and connect with the tin liquid on other soldering pads.

[0006] The present invention provides the following technical solution: a tin liquid dispensing machine suitable for assembling patch components, comprising a flux nozzle, a tin liquid nozzle is arranged on the outer periphery of the flux nozzle, a flux pushing plate and a tin liquid pushing plate are slidably connected on the inner walls of the flux nozzle and the tin liquid nozzle, respectively, a flux inlet and a tin liquid inlet are respectively opened on the side walls of the flux nozzle and the tin liquid nozzle, an air dividing groove is installed on the top of the flux nozzle and the tin liquid nozzle, a flux jet valve and a tin liquid jet valve are respectively arranged on the bottom surface of the air dividing groove, a spray press is fixedly installed on the top surface of the air dividing groove, a pin located on a vertical line thereof is arranged inside the flux nozzle, a paste liquid cooling box is arranged on the outer periphery of the tin liquid nozzle, a tin spraying monitoring structure is arranged in the inner wall of the tin liquid nozzle, a hydraulic rod is connected to the top of the spray press, the hydraulic rod is connected to the main controller, a water pump is connected to the inner cavity of the paste liquid cooling box, and the water pump is electrically connected to the main controller.

[0007] Preferably, the tin spray monitoring structure includes a ball groove, a capillary, a slider, a movable trigger end and a fixed trigger end, the ball groove is located at the lower end of the tin liquid nozzle and part of the outer wall of the ball groove is in contact with the inner side of the tin liquid nozzle, the capillary is connected to the inner cavity of the ball groove, the slider is slidably connected in the capillary, the movable trigger end is fixedly connected to the top of the slider, the fixed trigger end is fixedly installed on the top of the capillary, and the fixed trigger end is electrically connected to the main controller.

[0008] Preferably, the paste cooling box has the same shape as the tin liquid nozzle, and the tin liquid nozzle can be slidably connected along the inner wall of the paste cooling box. A partition layer is provided in the middle of the paste cooling box, and the partition layer divides the inner cavity of the paste cooling box into a liquid inlet cavity away from the tin liquid nozzle and a liquid outlet cavity close to the tin liquid nozzle. The liquid inlet cavity and the liquid outlet cavity are connected from the bottom end of the partition layer, the outer wall of the tin liquid nozzle is in contact with the inner wall of the paste cooling box, and the outlet end and the inlet end of the water pump are respectively connected to the liquid inlet cavity and the liquid outlet cavity.

[0009] Preferably, a temperature insulating layer is provided on the inner wall of the paste cooling box, and there is a distance between the temperature insulating layer and the bottom end of the paste cooling box, and the distance is a distance that the tin liquid nozzle can slide relative to the paste cooling box.

[0010] Preferably, the main controller includes a rod extension controller, a tin spray controller and a pump body controller, the rod extension controller is electrically connected to the hydraulic rod, the tin spray controller is electrically connected to the fixed trigger end, the pump body controller is electrically connected to the water pump, and the rod extension controller, the tin spray controller and the pump body controller are interconnected.

[0011] Preferably, the number of the tin spray monitoring structures is four and they are distributed at four mutually symmetrical positions of the tin liquid nozzle, and the fixed trigger ends of the four tin spray monitoring structures are electrically connected to the tin spray controller using an AND gate circuit.

[0012] Preferably, the pin extends from the outlet at the bottom end of the flux nozzle to the outside, the downward extension length of the tin liquid nozzle is slightly greater than the length of the flux nozzle, and the bottom end of the pin is flush with the bottom end of the tin liquid nozzle.

[0013] The present invention has the following beneficial effects:

[0014] 1. The present invention sprays flux and tin liquid respectively through a flux nozzle and a tin liquid nozzle, and wraps the tin liquid around the periphery of the flux to prevent the flux from flowing when it melts and removing the oxide outside the pad, thereby preventing the tin liquid from flowing outside the pad and contacting the tin liquid on other pads, reducing the probability of short circuit and improving the qualified rate of welding.

[0015] 2. The present invention opens a small hole at the top of the solder paste point through a pin, so that the vapor after the flux is melted can flow upward through the small hole, reducing the flow of flux liquid to the periphery of the pad point through the tin liquid, and preventing the flux from removing oxides outside the pad. In addition, the tapered solder paste point allows the tin liquid layer to collapse to the middle vacancy when it collapses due to heat, preventing the tin liquid from flowing outside the pad, and further preventing the tin liquid from flowing and causing a short circuit.

[0016] 3. The present invention sprays the flux first and then the tin liquid, so that the flux can remove the oxide at the contact point between the tin liquid and the pad, improve the wetting effect of the tin liquid point and the pad, cooperate with the coolant in the paste cooling box to quickly cool the solder paste point, so that the solder paste point is quickly solidified and formed, avoiding the solder paste from flowing on the PCB board, so that the tin liquid can be firmly welded on the pad, preventing the solder paste point from falling off during the transportation of the PCB board, and improving the stability of the solder paste point. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a structural schematic diagram of the present invention;

[0018] Figure 2 It is a schematic diagram of the movement of the flux nozzle and the tin liquid nozzle relative to the paste liquid cooling box of the present invention;

[0019] Figure 3 It is a partial top view of the present invention;

[0020] Figure 4 It is a bottom view of the gas distribution groove of the present invention.

[0021] In the figure: 1. flux nozzle; 101. flux pushing plate; 102. flux inlet; 2. tin liquid nozzle; 201. tin liquid pushing plate; 202. tin liquid inlet; 3. gas distribution groove; 4. sprayer; 5. flux jet valve; 501. tin liquid jet valve; 6. pin; 7. paste liquid cooling box; 701. partition layer; 710. liquid inlet cavity; 711. liquid outlet cavity; 702. temperature insulation layer; 8. tin spray monitoring structure; 801. ball groove; 802. capillary; 803. slider; 804. mobile trigger end; 805. fixed trigger end; 9. hydraulic rod; 10. water pump; 11. main controller; 1101. rod extension controller; 1102. tin spray controller; 1103. pump body controller. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0023] See also Figure 1A tin liquid dispensing machine suitable for assembling patch components comprises a flux nozzle 1, a tin liquid nozzle 2 is arranged on the periphery of the flux nozzle 1, a tin liquid cavity is formed between the flux nozzle 1 and the tin liquid nozzle 2, a flux pushing plate 101 and a tin liquid pushing plate 201 are slidably connected to the inner walls of the flux nozzle 1 and the tin liquid nozzle 2, respectively, when the flux pushing plate 101 and the tin liquid pushing plate 201 move downward, the flux liquid in the flux nozzle 1 and the flux nozzle 1 are pushed to the tin liquid cavity. The tin liquid in the tin liquid cavity between the tin liquid nozzles 2 is sprayed downward onto the PCB board. The side walls of the flux nozzle 1 and the tin liquid nozzle 2 are respectively provided with a flux inlet 102 and a tin liquid inlet 202. The outlet of the flux conveying mechanism conveys the flux to the flux nozzle 1 from the flux inlet 102, and the outlet of the tin liquid conveying mechanism conveys the tin liquid to the tin liquid cavity between the flux nozzle 1 and the tin liquid nozzle 2 from the tin liquid inlet 202. The flux conveying mechanism and the tin liquid conveying mechanism The structure is the prior art and can be a spiral conveying mechanism; the top of the flux nozzle 1 and the tin liquid nozzle 2 are equipped with a gas distribution groove 3, and the bottom surface of the gas distribution groove 3 is respectively provided with a flux injection valve 5 and a tin liquid injection valve 501 corresponding to the positions of the flux pushing plate 101 and the tin liquid pushing plate 201, and the top surface of the gas distribution groove 3 is fixedly installed with a spray press 4. When the spray press 4 is started, the gas is transported to the flux injection valve 5 and the tin liquid injection valve 501 through the gas distribution groove 3, and the gas is discharged from the flux injection valve 5. 5 and tin liquid jet valve 501 flow out and spray on the flux pushing plate 101 and tin liquid pushing plate 201, so that the flux liquid and tin liquid located below the flux pushing plate 101 and the tin liquid pushing plate 201 are sprayed on the PCB board. At the same time, the flux jet valve 5 and the tin liquid jet valve 501 are electrically controlled valves, and the opening and closing of the flux jet valve 5 or the tin liquid jet valve 501 can be controlled separately by switches to adapt to different time points and durations of spraying the flux and tin liquid; and refer to the attached Figure 4 The tin liquid injection valves 501 are evenly distributed along the tin liquid pushing plate 201, so that the tin liquid pushing plate 201 squeezes the tin liquid relatively evenly; the interior of the flux nozzle 1 is provided with a pin 6 located on the vertical line thereof, and the pin 6 is used to reserve a through hole on the tin point after injection; the periphery of the tin liquid nozzle 2 is provided with a paste cooling box 7, and coolant can be passed into the paste cooling box 7 to cool the solder paste; the inner wall of the tin liquid nozzle 2 is provided with a tin spraying monitoring structure 8, and the tin spraying monitoring structure 8 is used to determine when to spray the tin liquid, and to control the flux nozzle 1 and the tin liquid nozzle 2 to move upward relative to the paste cooling box 7.

[0024] The top of the sprayer 4 is connected to a hydraulic rod 9 , which is connected to a main controller 11 . The inner cavity of the paste cooling box 7 is connected to a water pump 10 , which is electrically connected to the main controller 11 .

[0025] See attached Figure 1 and attached Figure 3The tin liquid nozzle 2 is covered on the outside of the flux nozzle 1, and the downward extension length of the tin liquid nozzle 2 is slightly greater than the length of the flux nozzle 1, that is, when the flux liquid in the flux nozzle 1 is sprayed downward, the flux liquid flows around along the outlet center of the flux nozzle 1 on the PCB board, and the tin liquid nozzle 2 is close to the PCB board to block the flux from continuing to flow around. The shape of the tin liquid nozzle 2 is consistent with the soldering point, so that the flux can be prevented from flowing to the outside of the soldering point. When the flux is blocked by the inner wall of the tin liquid nozzle 2, it accumulates upward to form a flux layer, and then it is located on the inner wall of the tin liquid nozzle 2. The tin spray monitoring structure 8 is in contact with a certain height, and the tin spray monitoring structure 8 includes a ball groove 801, a capillary 802, a slider 803, a movable trigger end 804 and a fixed trigger end 805. The ball groove 801 is located at the lower end of the tin liquid nozzle 2 and part of the outer wall of the tin spray monitoring structure 8 is in contact with the inner side of the tin liquid nozzle 2. Therefore, when the flux accumulates along the inner wall of the tin liquid nozzle 2, it can contact the ball groove 801 and transfer heat to the heat-conducting material in the ball groove 801. The capillary 802 is connected to the inner cavity of the ball groove 801, and the heat-conducting material flows upward along the capillary 802 when heated. The slider 803 The movable trigger end 804 is fixedly connected to the top of the slider 803. As the heat-conducting material flows upward, the slider 803 drives the movable trigger end 804 to move upward. The fixed trigger end 805 is fixedly installed on the top of the capillary 802. Then the movable trigger end 804 contacts the fixed trigger end 805. The fixed trigger end 805 is electrically connected to the main controller 11. The contact between the movable trigger end 804 and the fixed trigger end 805 triggers the main controller 11 to operate. The main controller 11 includes a rod extension controller 1101, a tin spraying controller 1102 and a pump body controller. The rod extension controller 1101 is electrically connected to the hydraulic rod 9, the tin spraying controller 1102 is electrically connected to the fixed trigger end 805, and the pump body controller 1103 is electrically connected to the water pump 10. The rod extension controller 1101, the tin spraying controller 1102 and the pump body controller 1103 are connected to each other; therefore, when the mobile trigger end 804 contacts the fixed trigger end 805, the tin liquid injection valve 501 opens, and the tin liquid is sprayed downward onto the flux layer, and then the rod extension controller 1101 controls the hydraulic rod 9 to start, and the flux nozzle 1 and the tin liquid nozzle 2 are pulled up, see the attached Figure 2 , is a schematic diagram of the soldering flux nozzle 1 and the tin liquid nozzle 2 moving upward relative to the paste liquid cooling box 7. At this time, the soldering flux liquid and the tin liquid flow downward along the inner wall of the soldering flux nozzle 1 and the inner wall of the tin liquid nozzle 2 respectively and form a conical solder paste point;

[0026] See attached Figure 3In order to ensure that the soldering pad is covered with the flux layer as much as possible, the four tin spray monitoring structures 8 are distributed at four symmetrical positions of the tin liquid nozzle 2. The fixed trigger ends 805 of the four tin spray monitoring structures 8 are electrically connected to the tin spray controller 1102 using an AND gate circuit. Only when the four mobile trigger ends 804 are in contact with the four fixed trigger ends 805, the tin spray controller 1102 controls the hydraulic rod 9 to retract upward through the rod extension controller 1101 to move the flux nozzle 1 and the tin liquid nozzle 2 upward, so that the solder paste with flux on the inside and tin liquid on the outside is dripped on the soldering pad of the PCB board, and a conical solder paste point can be formed according to the conical outlets of the flux nozzle 1 and the tin liquid nozzle 2.

[0027] The pump body controller 1103 controls the circulation of the coolant in the paste cooling box 7 through the water pump 10. The paste cooling box 7 has the same shape as the tin liquid nozzle 2. The tin liquid nozzle 2 can be slidably connected along the inner wall of the paste cooling box 7. When the flux nozzle 1 and the tin liquid nozzle 2 move upward to the highest point under the pull of the hydraulic rod 9, that is, after the solder paste point is formed, the pump body controller 1103 starts the water pump 10 to transport the coolant into the paste cooling box 7. A partition layer 701 is provided in the middle of the paste cooling box 7. The partition layer 701 divides the inner cavity of the paste cooling box 7 into a liquid inlet cavity 710 away from the tin liquid nozzle 2 and a liquid outlet cavity 711 close to the tin liquid nozzle 2. The liquid inlet cavity 710 and the liquid outlet cavity 711 are connected from the bottom end of the partition layer 701. The outer wall of the tin liquid nozzle 2 is in contact with the inner wall of the paste cooling box 7. The outlet end and the inlet end of the water pump 10 are respectively connected to the liquid inlet cavity 710 and the liquid outlet cavity 711, that is, the coolant flows from the inlet The top of the liquid cavity 710 flows downward, then enters the liquid outlet cavity 711 from the bottom of the partition layer 701, and then flows to the top of the liquid outlet cavity 711. When the temperature of the coolant is low, the distance between the coolant and the flux nozzle 1 and the tin liquid nozzle 2 is large, so that the tin liquid in the tin liquid cavity is prevented from being cooled; an insulation layer 702 is provided on the inner wall of the paste liquid cooling box 7, and there is a distance between the insulation layer 702 and the bottom of the paste liquid cooling box 7, and the distance is the distance that the tin liquid nozzle 2 can slide relative to the paste liquid cooling box 7. The insulation layer 702 can prevent the coolant from cooling the tin liquid in the tin liquid cavity and preventing it from being sprayed downward. At the same time, the coolant can absorb the temperature of the solder paste point conducted by the tin liquid nozzle 2 at the reserved place at the bottom of the paste liquid cooling box 7. The solder paste point is quickly cooled to prevent the solder paste from collapsing and flowing around the pad, thereby further preventing the two pads from being connected together to cause a short circuit;

[0028] The pin 6 extends from the outlet at the bottom end of the flux nozzle 1 to the outside, and the bottom end of the pin 6 is flush with the bottom end of the tin liquid nozzle 2. The pin 6 is used to reserve a small hole at the top of the outer tin liquid of the solder paste point. Since there is a flux layer below the tin liquid layer, when the flux nozzle 1 and the tin liquid nozzle 2 move upward to form a complete solder paste point on the PCB board, when the tin liquid nozzle 2 is separated from the solder paste point, the pin 6 is still in the solder paste point. Due to the rapid cooling of the solder paste point, a small hole can be reserved in the tin liquid layer at the top of the solder paste point. The small hole here is for the airflow to flow out when the flux melts and evaporates. At the same time, the flux liquid can flow upward from the small hole to remove the oxide on the solder joint of the patch component, so that the tin liquid can better infiltrate the patch component.

[0029] Therefore, since the melting point of the flux is lower than that of the tin liquid, when the flux melts during the preheating stage of reflow soldering, it cannot break through the unmelted tin liquid layer and flow out of the pad, and the oxides on the outside of the tin liquid layer will not be removed. Due to the presence of oxides, the fluidity and adhesion of the tin liquid are poor, thus reducing the connection of the tin liquid on different pads, and then reducing the short circuit.

[0030] The method of use of the present invention is as follows:

[0031] First, the flux push plate 101 is driven downward by the flux injection valve 5 to spray the flux liquid downward onto the PCB board. The flux gathers upward along the inner wall of the tin liquid nozzle 2 and contacts the ball groove 801, so that the heat-conducting material in the ball groove 801 absorbs heat and flows upward along the capillary 802, pushing the slider 803 and the movable trigger end 804 to move upward and contact the fixed trigger end 805. When the four movable trigger ends 804 are in contact with the fixed trigger end 805, the tin liquid injection valve 501 opens to spray the tin liquid downward. The tin liquid is sprayed on the flux layer between the flux nozzle 1 and the tin liquid nozzle 2, so that the tin liquid can adhere to the PCB board; at this time, the rod extension controller 1101 starts the hydraulic rod 9 to contract, driving the flux nozzle 1 and the tin liquid nozzle 2 to move upward, and when the hydraulic rod 9 moves to the highest point, the pin 6 is located in the solder paste point, and the pump body controller 1103 starts the water pump 10 to pass coolant into the paste cooling box 7, so that the solder paste point is cooled and solidified, and then the entire nozzle device is lifted upward, and a small hole is reserved at the top of the solder paste point.

[0032] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0033] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A tin liquid dispensing machine suitable for assembling surface mount components, comprising a flux nozzle (1), characterized in that: A tin liquid nozzle (2) is provided on the periphery of the flux nozzle (1); a flux pushing plate (101) and a tin liquid pushing plate (201) are slidably connected to the inner walls of the flux nozzle (1) and the tin liquid nozzle (2); a flux inlet (102) and a tin liquid inlet (202) are respectively provided on the side walls of the flux nozzle (1) and the tin liquid nozzle (2); a gas separation groove (3) is installed at the top of the flux nozzle (1) and the tin liquid nozzle (2); a flux jet valve (5) and a tin liquid jet valve (50) are respectively provided on the bottom surface of the gas separation groove (3). 1), a sprayer (4) is fixedly mounted on the top surface of the gas distribution groove (3), a pin (6) is provided inside the flux nozzle (1) and is located on a vertical line therein, a paste cooling box (7) is provided on the periphery of the tin liquid nozzle (2), a tin spray monitoring structure (8) is provided in the inner wall of the tin liquid nozzle (2), a hydraulic rod (9) is connected to the top of the sprayer (4), the hydraulic rod (9) is connected to a main controller (11), a water pump (10) is connected to the inner cavity of the paste cooling box (7), and the water pump (10) is electrically connected to the main controller (11); The tin spray monitoring structure (8) comprises a ball groove (801), a capillary (802), a slider (803), a movable trigger end (804) and a fixed trigger end (805), wherein the ball groove (801) is located at the lower end of the tin liquid nozzle (2) and a part of the outer wall of the ball groove (801) is in contact with the inner side surface of the tin liquid nozzle (2), the capillary (802) is connected to the inner cavity of the ball groove (801), the slider (803) is slidably connected in the capillary (802), the movable trigger end (804) is fixedly connected to the top of the slider (803), the fixed trigger end (805) is fixedly installed at the top of the capillary (802), and the fixed trigger end (805) is electrically connected to the main controller (11); The paste cooling box (7) has the same shape as the tin liquid nozzle (2); the tin liquid nozzle (2) can be slidably connected along the inner wall of the paste cooling box (7); a partition layer (701) is provided in the middle of the paste cooling box (7); the partition layer (701) divides the inner cavity of the paste cooling box (7) into a liquid inlet cavity (710) away from the tin liquid nozzle (2) and a liquid outlet cavity (711) close to the tin liquid nozzle (2); the liquid inlet cavity (710) and the liquid outlet cavity (711) are connected from the bottom end of the partition layer (701); the outer wall of the tin liquid nozzle (2) is in contact with the inner wall of the paste cooling box (7); and the outlet end and the inlet end of the water pump (10) are respectively connected to the liquid inlet cavity (710) and the liquid outlet cavity (711); The number of the tin spray monitoring structures (8) is four and they are distributed at four mutually symmetrical positions of the tin liquid nozzle (2). The fixed trigger ends (805) of the four tin spray monitoring structures (8) are electrically connected to the tin spray controller (1102) using an AND gate circuit.

2. A tin liquid dispensing machine suitable for assembling patch components according to claim 1, characterized in that: A temperature insulating layer (702) is provided on the inner wall of the paste cooling box (7), and a distance exists between the temperature insulating layer (702) and the bottom end of the paste cooling box (7), wherein the distance is a distance that the tin liquid nozzle (2) can slide relative to the paste cooling box (7).

3. The tin liquid dispensing machine suitable for assembling patch components according to claim 1, characterized in that: The main controller (11) comprises a rod extension controller (1101), a tin spraying controller (1102) and a pump body controller (1103); the rod extension controller (1101) is electrically connected to the hydraulic rod (9); the tin spraying controller (1102) is electrically connected to the fixed trigger end (805); the pump body controller (1103) is electrically connected to the water pump (10); and the rod extension controller (1101), the tin spraying controller (1102) and the pump body controller (1103) are interconnected.

4. The tin liquid dispensing machine suitable for assembling patch components according to claim 1, characterized in that: The insertion pin (6) extends from the outlet at the bottom end of the flux nozzle (1) to the outside, the downward extension length of the tin liquid nozzle (2) is slightly greater than the length of the flux nozzle (1), and the bottom end of the insertion pin (6) is flush with the bottom end of the tin liquid nozzle (2).

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