Device for driving a compressor and method for installing the same

Abstract

The invention relates to a device (3) for driving a compressor of a vaporous fluid. The device (3) comprises a housing (2) having a cooling surface (2-1) and a power supply device (5), the housing having at least one switching element (11), at least one PCB (12) and at least one spring element (18) for applying a spring force on at least one switching element (11). The switching element (11) is connected to the PCB (12). The cooling surface (2-1) and the PCB (12) are arranged spaced relative to each other in a direction z. At least one switching element (11) is arranged so that it contacts the housing (2) with a first surface (11-1) in the region of the cooling surface (2-1), and so that at least one spring element (18) for pressing the switching element (11) against the cooling surface (2-1) contacts a second surface (11-2) of the switching element (11). The PCB (12) and the spring element (18) are manufactured so that they can be attached to the housing (2) independently of each other using fixings (16-1, 16-2). The spring element (18) can be arranged between the PCB (12) and the cooling surface (2-1) by means of at least one guide element (15a-1, 15b-1, 15c-1, 18-5) so that the spring element can move freely along the direction of movement (21). The invention also relates to a process for installing the device (3).

Description

Technical Field

[0001] The invention relates to a device, in particular an electric motor, for driving a compressor for compressing a vaporous fluid, in particular a refrigerant. The device is manufactured with a housing featuring a cooling surface and a power supply. The device comprises at least one switching element, a PCB and a spring element for applying a spring force to the switching element. The switching element is connected to the PCB. The compressor can be used in a refrigerant circuit of a motor vehicle air conditioning system. The invention also relates to a method for installing a device for driving a compressor for a vaporous fluid. Background Art

[0002] Compressors known from the prior art for mobile applications, in particular as air conditioning systems in motor vehicles, which compressors are used to convey refrigerant through a refrigerant circuit, also referred to as refrigerant compressors, are usually designed as piston compressors or scroll compressors with variable displacement, regardless of the refrigerant used. The compressors are driven via a pulley or electrically.

[0003] In addition to the electric motor for driving the corresponding compression mechanism, the electrically driven compressor also includes an inverter for driving the electric motor. The inverter is used to convert direct current (DC) supplied by the vehicle battery into alternating current (AC), which is then fed to the electric motor through an electrical connection.

[0004] The inverter comprises a PCB containing switching elements, such as power transistors, which together form the compressor switching device. The power transistors of the inverter, also called power switches, generate heat due to switching losses and conduction losses, which needs to be dissipated by the transistors. The dissipated heat, in particular the heat dissipated by the electrically driven refrigerant compressor, should ideally be transferred to the refrigerant. The power transistors are advantageously arranged on the outside of the compressor housing so that the power transistors are in contact with the housing and can therefore conduct heat. The power transistors should be connected to the housing in the part of the housing with the lowest temperature, which is usually located in the area of ​​the inlet port where the refrigerant flows into the compressor.

[0005] In the following, the part of the housing with the lowest temperature is also referred to as cooling surface / area of ​​the housing, in particular of the motor housing.The power transistor may be directly attached to the cooling surface such that the power transistor conducts heat.

[0006] In conventional modular inverter designs, the power transistors are arranged on an additional support element, which itself is subsequently attached together with the power transistors to the cooling surface of the housing. In this case, an additional wall of the support element is provided between the power transistor and the cooling surface of the housing. The surface of the wall on the support element is in contact with the cooling surface of the housing, which leads to a deterioration in the heat dissipation of the transistors compared to an arrangement in which the transistors are in direct contact with the cooling surface of the housing.

[0007] Each power transistor will be in thermal contact with a cooling surface of the housing or with a wall of the support element.

[0008] For example, matching surface roughnesses can be used to produce good thermal contact. Air pockets between the respective power transistor and the cooling surface of the housing or the wall of the support element must, however, be avoided in particular, since these reduce the heat transfer between the components.

[0009] In conventional units, thermal interface materials such as thermal paste or thermal foil are used to ensure good thermal contact and avoid the above-mentioned air pockets. In addition to this, a certain mounting pressure can be applied to the power transistor, which then also presses against the cooling surface of the housing or the wall of the supporting element. In addition to establishing good thermal contact, this pressure on the transistor also serves to attach the transistor or inverter to the housing in such a way that a vibration-resistant connection is formed.

[0010] The concept of applying a compressive force by direct screw connection or clamping connection, for example using a spring element, which acts in the direction of the cooling surface of the housing or the wall of the support element is known from the prior art. The power transistor can be screwed down to the cooling surface of the housing or the wall of the support element.

[0011] When mounting the power transistor directly to the cooling surface of the housing, the transistor is screwed down to the housing or clamped to the housing, as thermal interface material may be included between the power transistor and the cooling surface. The power transistor is usually screwed down to the cooling surface of the housing. However, screwing the individual power transistors to the cooling surface of the housing results in very high installation costs, especially since each screw needs to be equipped with a washer for force distribution and an insulating ring. The use of six power transistors, which are usually arranged in known inverters, results in a very large number of individual components.

[0012] In an alternative modular design of the inverter, the power transistors are attached to the wall of the support element. After the corresponding attachment of the power transistors, the PCB is then attached. The connections of the transistors are arranged so that the connections of the transistors are plated through the PCB and then soldered to the PCB.

[0013] Since the PCB is assembled as a final component with the power transistors arranged directly on the cooling surface of the housing during the manufacture of the electrically driven compressor, the selective soldering of the power transistors to the PCB is also carried out directly on the compressor housing. From a production point of view, the process of mounting and soldering the PCB to the already assembled housing is both complicated and time-consuming, for example, because the power transistors are connected to the PCB by soldering after being screwed down, which means that the entrance of the screws is covered. The screws are arranged below the PCB. In order to arrange the screws so that the screws also remain accessible when the PCB is assembled and to allow the power transistors to be screwed down above the PCB, each screw can be arranged so that the screw is fed through a sleeve, in particular a metal sleeve, which however results in additional costs and greater assembly expenses.

[0014] It is also known to use a plastic frame to press the power transistor against the cooling surface of the housing. The contact pressure is transmitted via the plastic frame and onto the power transistor. The power transistor is pre-mounted on the plastic frame, which means that the power transistor no longer needs to be soldered to the compressor housing. However, depending on time and temperature, the force characteristics on the inside of the plastic frame can lead to plastic deformation, which in turn reduces the force acting on the power transistor and means that the minimum contact pressure required to press the power transistor against the cooling surface of the housing may no longer be guaranteed. The contact pressure is directly related to the heat output transferred from the power transistor to the cooling surface of the housing. If the contact pressure is reduced too much, this may lead to overheating of one or more power transistors, resulting in failure of the electronics and therefore failure of the compressor.

[0015] Besides this, the welding points are manufactured in such a way that there is no mechanical tension in the welding points, unlike in the case of inverters pre-mounted using clamps and plastic frames.

[0016] However, for the dissipation of heat from the power transistors to the cooling surfaces of the housing, an alternative modular design of the inverter, in which the power transistors are mounted on the walls of the support element, which is generally preferred from a production point of view, requires an additional thermal path through the walls of the support element and an additional heat transfer section between the support element and the cooling surface of the housing, which impairs the heat transfer from the transistors to the cooling surface. Summary of the invention

[0017] Technical issues

[0018] The object of the invention is to provide and improve an inverter for an apparatus for driving an electrically driven compressor of a vaporous fluid, in particular an electric motor, which inverter can also be easily and therefore quickly assembled. The focus is on dissipating as much heat as possible from the power transistor by optimal heat transfer, in particular to the fluid to be compressed in the compressor. The apparatus should be of basic design and therefore easy to manufacture, so as to minimize manufacturing costs. This arrangement should facilitate safe operation and maximum service life of the apparatus.

[0019] Solution to the problem

[0020] This object is achieved by the subject matter having the features of the independent patent claims. Further embodiments are provided in the dependent patent claims.

[0021] This object is solved by a device, in particular an electric motor, for driving a compressor of a vaporous fluid according to the invention. The device is manufactured with a housing characterized by a cooling surface and a power supply device, in particular an inverter. The device comprises at least one switching element, at least one PCB and at least one spring element for applying a spring force on the at least one switching element. The switching element is firmly connected to the PCB, in particular soldered to the PCB. The cooling surface and the PCB are arranged spaced relative to each other in the direction z.

[0022] According to the design of the present invention, the at least one switch element is arranged so that the first surface contacts the housing in the area of ​​the cooling surface, and the at least one spring element for pressing the switch element against the cooling surface contacts the switch element on the second surface. The PCB and the at least one spring element can be attached to the housing independently of each other using a fixing. The at least one spring element is arranged so that it can move freely between the PCB and the cooling surface in the direction along the at least one guide element.

[0023] The second surface of the switching element is advantageously manufactured such that it is positioned opposite the first surface of the switching element, which itself is aligned towards the cooling surface of the housing in direction z. The first and second surfaces of the switching element are preferably aligned parallel to each other.

[0024] In particular, the at least one spring element is arranged between the PCB and the at least one switching element.The switching element is preferably manufactured as a power transistor.

[0025] According to a further embodiment of the invention, the at least one guide element is manufactured as a component of a frame element arranged between the cooling surface of the housing and the PCB, or as a component of a spring element.

[0026] An advantage of the invention lies in the fact that the direction of movement of the at least one spring element is aligned substantially in a direction z perpendicular to the plane of the PCB and the plane of the cooling surface on the housing. The plane of the PCB and the plane of the cooling surface are aligned parallel to each other and spaced apart.

[0027] According to a preferred embodiment of the invention, the at least one guide element is elongated in direction z and has a first end and a second end. The guide element is preferably aligned in direction z. Two guide elements can be provided for the at least one spring element. In an embodiment with a plurality of spring elements, in particular at least two spring elements, two guide elements can be assigned to each spring element.

[0028] In a first alternative embodiment, a first end of the at least one guide element as part of the frame element is advantageously attached to the frame element.The guide element may comprise at least one snap-on element on its second end for engaging the spring element with the frame element.

[0029] In a second alternative embodiment of the guide element as part of the frame element, the first end of the guide element is preferably attached to the frame element.The guide element may comprise at least one snap-on element on its second end for engaging the spring element on the PCB.

[0030] In each case, the snap-on element is preferably made in the form of a barb which allows the spring element to be attached to the guide element or to allow the guide element to be inserted through an opening in the PCB, in particular makes it easier, allows movement of the spring element along the guide element or allows movement of the guide element in the opening in the PCB and prevents the spring element from being disengaged from the guide element or the PCB, which means that the spring element has a captive connection with the guide element or the PCB.

[0031] According to an advantageous embodiment of the invention, the at least one guide element has a rectangular or circular cross section, in particular a circular cross section, in a plane extending perpendicularly to the direction z, or has a U-shaped cross section with an open side at the second end in a plane extending in the directions x, z. The directions x, z are aligned orthogonally to each other.

[0032] According to another embodiment of the invention, the frame element is manufactured with a through opening for passing a fixing to attach to the housing. The through opening is preferably aligned in direction z. The fixing is advantageously manufactured as a screw, which means that the frame element, in particular together with the PCB, is attached to the housing using a screw connection.

[0033] The frame element is preferably manufactured with at least one mounting recess for mounting the at least one switching element. The mounting recess is arranged on the side of the frame element facing the cooling surface of the housing. In the case of arranging a plurality of switching elements, in particular at least two switching elements, preferably one mounting recess is manufactured for each switching element.

[0034] The frame element advantageously comprises a feed-through opening for passing a connection portion of the at least one switching element.The feed-through opening is arranged on a side of the frame element facing the PCB.

[0035] The frame element is produced, in particular, from plastic.

[0036] According to a further preferred embodiment of the invention, the at least one spring element is in the form of a small plate having at least one curved strip protruding from a base region. The curvature of the at least one strip is aligned in the direction of the at least one switching element with a contact region which is preferably made as a convex surface and contacts the switching element in the contact region. In an embodiment with a plurality of switching elements, in particular at least two switching elements, one strip of the spring element can be assigned to each switching element. The strips are preferably aligned in a common direction.

[0037] An advantage of the invention resides in the fact that the at least one spring element is manufactured with at least one mounting element for attachment to the at least one guide element or with at least one guide element for attachment to a PCB.

[0038] The mounting element and / or the guide element is preferably in the form of a strip having a first end and a second end. The first end is preferably attached to the base region of the spring element. In an embodiment having in particular two mounting elements or two guide elements, these elements are advantageously each arranged on opposite end faces of the spring element and can be aligned in a common direction, which in particular corresponds to the direction in which the curved strip is placed on the switch element.

[0039] According to a first alternative embodiment of the spring element with at least one mounting element for attachment to the guide element, the second end of the mounting element is preferably made as a free end with an opening for the guide element to pass through, the opening being in particular in the form of an eyelet, in particular a completely closed eyelet. The opening can have a circular or rectangular, in particular square, cross section, which matches the cross section of the guide element.

[0040] According to a second alternative embodiment of the spring element with at least one guide element for attachment to the PCB, the second end of the guide element is preferably made as a free end with a snap-in element for passing through an opening made in the PCB.

[0041] The spring element preferably comprises a through opening made in the base region for passing the attachment element through for attachment to the housing. The through opening is preferably aligned in direction z. The fixing is advantageously made as a screw, which means that the spring element is attached to the housing using a screw connection.

[0042] The spring element is preferably made of an elastically deformable material, in particular metal.

[0043] The object is also solved by using a method according to the invention for installing a device, in particular an electric motor, used to drive a compressor of a vaporous fluid. These methods comprise the following steps:

[0044] - The power supply device, in particular the inverter, is mounted on the housing of the device, or mounted as a module on a mounting device, wherein:

[0045] - arranging at least one switching element with a first surface on a cooling surface of the housing or on a mounting device, wherein a connection portion of the switching element protrudes from the switching element in a direction z and in a direction opposite to a second surface of the switching element facing the first surface, wherein the direction z extends substantially orthogonally to the cooling surface and to the surface of the switching element,

[0046] - at least one spring element is arranged on the frame element or the PCB, which means that the spring element can be moved in a guided manner in the direction z in a movement direction relative to the frame element or the PCB by means of at least one guide element,

[0047] - arranging the frame element or the PCB with the at least one spring element pointing in the direction z such that the switching element is arranged between the cooling surface and the frame element or the PCB, wherein the contact area of ​​the spring element contacts the second surface on the switching element and then slides along the guide element in the direction z without any elastic deformation,

[0048] - for an embodiment of the device having a frame element, the PCB is arranged on the frame element in direction z,

[0049] - inserting the connection part of the switching element through the opening made in the PCB,

[0050] - attaching the PCB to the housing, in particular to the cooling surface, or to the mounting device using a first attachment element,

[0051] - soldering the connections of the switching elements to the PCB without any mechanical tension and connecting the components to make the module,

[0052] - when mounting the device as a module on a mounting device, releasing the first attachment element and removing the module from the mounting device, and arranging the module on a housing with the first surface of the switching element being located on the cooling surface, and attaching the PCB to the housing using the first attachment element, and

[0053] - attaching the spring element with the base region to the cooling surface using a second attachment element, wherein the spring element deforms elastically and thereby generates a spring force or a compression force and applies the spring force or the compression force to the switching element so that the switching element is pressed flat against the cooling surface in direction z.

[0054] An advantage of the invention lies in the fact that the connection of the switching element is arranged so that it is plated through the PCB and then soldered to the PCB. In particular, modularity allows the PCB to be soldered to the switching element even without the presence of a housing.

[0055] According to another embodiment of the invention, when installing the device with the frame element, the spring element is attached to the guide element of the frame element in the direction of movement by means of a mounting element, in particular a mounting element made as an eye. The mounting element can be captively attached to the guide element of the frame element by snapping into place on the snap-in element.

[0056] According to a preferred embodiment of the present invention, the frame element is placed on the switching element so that the connecting portion of the switching element is guided through a feed-through opening made in the frame element along a direction z so as to protrude from the frame element, and the switching element is arranged so that the switching element is integrated inside a mounting recess made in the frame element.

[0057] When the device is mounted as a module on a mounting device, the base region of the spring element can be attached to the mounting device using a second attachment element before the step of soldering the connection on the switch element to the PCB. The spring element deforms elastically and generates a spring force or a compression force and applies the spring force or the compression force to the switch element, so that the switch element is pressed against the mounting device in the direction z. Before removing the module from the mounting device, the second attachment element is released again.

[0058] According to a further advantageous embodiment of the invention, the PCB and / or the spring element are screwed down to the housing and / or the mounting device using attachment elements.

[0059] When the device is mounted, the spring element is in contact with the switching element in an elastically deformed manner. Due to the pressure exerted on the switching element by the elastic deformation of the spring element, the switching element is pressed against the cooling surface of the housing, so that an optimal heat transfer from the switching element to the cooling surface is ensured. At least one thermal interface material such as thermal paste or thermal foil is preferably arranged between the switching element and the cooling surface of the housing.

[0060] An advantageous embodiment of the invention allows a device for driving a compressor for compressing a vaporous fluid, in particular an electric motor, for a compressor of a refrigerant in a refrigerant circuit of a motor vehicle air-conditioning system.

[0061] Through the fixed or modular arrangement, in particular the arrangement of an inverter for an electric motor of a refrigerant compressor, combined with the use of spring forces of metal spring elements, in particular thermal influences, in particular of switching elements or power transistors, are significantly reduced compared to devices known from the prior art.

[0062] Since the power transistor is in direct thermal contact with the cooling surface, this results in an increased cooling capacity of the power transistor.By arranging at least one thermal interface material between the power transistor and the cooling surface of the housing, the thermal contact and thus the heat transfer process are improved.

[0063] Advantageous Effects of the Invention

[0064] The device for driving a compressor of a vaporous fluid according to the invention and the method for installing the device together have various other advantages:

[0065] - optimal heat transfer, in particular with the fluid to be compressed in the compressor at the maximum thermal energy that can be dissipated by the power transistors,

[0066] - simple design and handling of the device, which allows for easy and therefore low-cost manufacturing,

[0067] - easy and time-saving assembly of the device and easy and time-saving mounting of the device to the housing,

[0068] - The soldering points on the power transistors are also not subjected to mechanical stress during the assembly process and are therefore free of any mechanical tension,

[0069] The spring element provides the force required to press the power transistor against the cooling surface of the housing at all temperatures over the entire service life and is therefore independent of temperature. BRIEF DESCRIPTION OF THE DRAWINGS

[0070] Further details, features and benefits of embodiments of the present invention are derived from the following description of embodiments with reference to the accompanying drawings. These drawings are listed below:

[0071] Figure 1a and Figure 1b : A cross-sectional view and a perspective view of an electrically driven compressor having a device for driving a compression mechanism, in particular an electric motor and an inverter device, the perspective view including an exploded view of the inverter device,

[0072] Figure 2a: 3D exploded view of the frame element and spring element of the inverter device,

[0073] Figure 2b and Figure 2c : Figure 2a A perspective view of a detailed view of the frame element and the spring element in FIG.

[0074] Figure 2d and Figure 2e : Figure 2a A three-dimensional diagram of the frame element and the spring element when assembled,

[0075] Figure 2f : Figure 2d or Figure 2e A perspective view of a detailed view of the frame element and the spring element in FIG.

[0076] Figure 3a : A perspective exploded view of a PCB of an inverter device, a frame element with pre-mounted spring elements and a power transistor, and a part of a mounting device or housing,

[0077] Figure 3b : A perspective view of a frame element of an inverter device with spring elements pre-mounted on a mounting device together with a PCB, and wherein power transistors are inserted into and soldered to the PCB,

[0078] Figure 3c : A perspective exploded view of the PCB, frame elements and power transistors of the inverter device and the housing with cooling surfaces of the electric motor and the compression mechanism during assembly,

[0079] Figures 4a to 4c : Side view of the arrangement of the power transistor on the cooling surface of the housing relative to the PCB, with the spring element in various mounting positions,

[0080] Figure 5a and Figure 5b : A perspective view and a cross-sectional view of a first alternative embodiment of a guide element produced on a frame element for guiding a spring element in connection with the spring element,

[0081] Figure 6a and Figure 6b : A perspective view and a cross-sectional view of a second alternative embodiment of a guide element produced on a frame element for guiding a spring element in connection with the spring element,

[0082] Figure 7a and Figure 7b : A perspective view and a cross-sectional view of a third alternative embodiment of a guide element for guiding a spring element in connection with the spring element. DETAILED DESCRIPTION

[0083] Figure 1a A cross-section of an electrically driven compressor 1 is shown with an electric motor 3 arranged in a housing 2 as a device 3 for driving a compression mechanism 4 and an inverter device 5. The electric motor 3 is supplied with power via a switching device 6 of the device 5.

[0084] The electric motor 3 includes a stator 7 having a substantially hollow cylindrical stator core and a coil wound on the stator core, and a rotor 8 arranged inside the stator 7. The rotor 8 is set to rotate when electric energy is supplied to the coil of the stator 7 via a connection device 9. The connection device 9 is made on the end face of the stator 7 and includes a large number of electrical connections.

[0085] The rotor 8 is coaxially arranged inside the stator 7 and is arranged so that the rotor 8 can rotate about the rotation axis. The drive shaft 10 can be manufactured integrally with the rotor 8 or as a separate element.

[0086] The electric motor 3 and the compression mechanism 4 are arranged inside the volume enclosed by the housing 2. The compression mechanism 4 is manufactured in the form of a scroll compressor having a fixed scroll and a movable scroll. The housing 2 includes a first housing element for mounting the electric motor 3 and a second housing element for mounting the compression mechanism 4. The first housing element and the second housing element are preferably manufactured from metal, in particular aluminum.

[0087] The orbiting scroll of the compression mechanism 4, in which a vaporous fluid, in particular a refrigerant, is compressed, is driven via a drive shaft 10 connected to a rotor 8 of an electric motor 3. According to an embodiment not shown, the compression mechanism can also be manufactured, for example, with a wobble plate.

[0088] The switch device 6 for controlling the operation of the electric motor 3 comprises a PCB 12 fabricated with various switch elements 11. Various control circuits and components are pre-mounted on the PCB 12 through electrical connectors and are powered by an external power source via a power cable.

[0089] The PCB 12 with the switching element 11 is arranged inside the support element 13 of the inverter device 5 and is fixed to the support element 13. The device 5 is sealed by a cover element 14.

[0090] Figure 1b A stereoscopic view of an electrically driven compressor 1 with an electric motor 3 and an inverter device 5 as a device 3 for driving a compression mechanism 4 and an exploded view of a standard device 5 or an open device 5 of the inverter (without covering elements) are shown. The electric motor 3 is arranged in a housing 2 as a device 3 for driving a compression mechanism 4.

[0091] The device 5 is manufactured with a frame element 15 which is configured to mount the switch element 11 and a spring element 18 (not shown) and is arranged between the switch element 11 and the PCB 12. The PCB 12 and the frame element 15 are attached to the housing 2 or the support element 13 using attachment elements 16, preferably made as screw connections, in particular screwed down to the housing 2 or the support element 13. The attachment elements 16 enter and engage in mounting holes 17 provided in the housing 2 or the support element 13.

[0092] The support element 13 made as a mounting element and housing element comprises a through opening which, when the compressor 1 is mounted, is arranged and aligned in the direction of the cooling surface on the housing 2. The support element 13, preferably made of metal, is in contact with the housing 2.

[0093] The support element 13 further comprises a peripheral wall which is aligned substantially orthogonal to the plane of the through opening and which is in contact with the housing 2 via a first end face. On a second end face of the peripheral wall which is aligned distally to the first end face, the device 5 can be sealed by a covering element (not shown) which is in contact with the peripheral wall of the support element 13 when the device 5 is fitted. A sealing element can be arranged between the second end face of the peripheral wall of the support element 13 and the covering element to seal the device 5. The shape of the sealing element is the contour of the second end face of the peripheral wall of the support element 13, which means that the shape of the sealing element and the end face of the peripheral wall of the support element 13 match each other.

[0094] The cover element (not shown) is attached to the support element 13 using attachment elements 16, wherein the sealing element is arranged between the cover element and the support element 13. The PCB 12 arranged in the volume enclosed by the support element 13 and the cover element (not shown) is also firmly attached to the support element 13 using attachment elements 16. The attachment elements 16 are each introduced and arranged in a mounting hole 17 made in the support element 13. The attachment elements 16 are preferably made as screw connections associated with the mounting holes 17.

[0095] The PCB 12 is intended for mounting a switching element 11, in particular a switching element made as a power transistor, which is firmly connected to the PCB 12 via a connection and is arranged in a through opening of the support element 13 and on a cooling surface of the housing 2 when the device 5 is assembled. A spring element (not shown) held in place by a frame element 15 is arranged between the PCB 12 and the power transistor. The connection of the power transistor is guided through a feed-through opening provided in the frame element 15.

[0096] Figure 2a to Figure 2f A perspective view of a frame element 15 , which is preferably made of plastic, and a spring element 18 of an inverter device 5 are each shown. Figure 2a The frame element 15 and the spring element 18 are shown in an exploded view, and Figure 2d and Figure 2e A frame element 15 is shown, wherein a spring element 18 is attached to a guide element 15 a - 1 of the frame element 15 . Figure 2b and Figure 2c Each shows the Figure 2a A detailed view of the frame element 15 or the spring element 18, and Figure 2f Shows Figure 2d or Figure 2e Detailed view of one of the frame elements 15 of FIG. 1 , wherein the spring element 18 is arranged on the guide element 15 a - 1 .

[0097] The frame element 15 comprises four guide elements 15a-1 for mounting and guiding two spring elements 18 and through openings 15-3 for attaching the frame element 15 to a housing or a mounting device, in particular a plate-shaped mounting device, for example. Two guide elements 15a-1 are assigned to each spring element 18. The through openings 15-3 serve for guiding through attachment elements, which can be made in particular as bolts or screws.

[0098] The frame element 15 also includes a mounting formation 15-4 for mounting six power transistors (not shown) and a feedthrough opening 15-5 for guiding the connection parts of the power transistors through the frame element 15. During the process of mounting the inverter device 5, the power transistors are placed in the mounting recesses 15-4, and the positions of the power transistors are set thereby. One power transistor is assigned to each mounting recess 15-4. The connection parts of the power transistors are inserted through the feedthrough openings 15-5.

[0099] The guide elements 15a-1 are each manufactured in the form of an elongated shape or in the shape of a pin. The guide elements 15a-1 are firmly and inseparably, in particular non-destructively attached to the frame element 15 on the first end. On the free second end manufactured on the far side of the first end, the guide elements 15a-1 each include a snap-on element 15a-2. The snap-on element 15a-2 is manufactured in a shape similar to a barb and allows the spring element 18 to be attached to the second end along a first direction of movement extending opposite to the direction z, wherein the process of attaching the spring element 18 is simplified by using a cross-sectional area that narrows toward the second end, and after attachment via the snap-on element 15a-2, any movement beyond a predetermined range along the second direction of movement is prevented, the second direction of movement extending in the direction z and the second direction of movement being the direction opposite to the first direction of movement. After attachment via the snap-on element 15a-2, the spring element 18 is then arranged on the guide element 15a-1 so that the spring element 18 is captured and can move along the guide element 15a-1.

[0100] The spring elements 18, preferably made of metal, each comprise a strip-shaped mounting element 18-1 on two end faces aligned distally to one another. The mounting element 18-1 is attached to a base region 18-2 on a first end in each case, while a second free end, made distally of the first end, is made in the form of an eyelet, in particular a closed eyelet with a completely enclosed opening. The opening is preferably of circular cross-section.

[0101] The spring element 18 can be attached to a housing or a mounting device, in particular a plate-shaped mounting device, for example using a through opening 18-3 provided in the base region 18-2 for guiding through the attachment element.The base region 18-2 is arranged on a plane extending in directions x and y.

[0102] Each spring element 18 is manufactured with a bent strip, which is aligned on the frame element 15 in the direction of the mounting recess 15-4, or is arranged so that the bent strip protrudes into the mounting recess 15-4. The strip is attached to the base area 18-2 at a first end, and the second free end manufactured on the far side of the first end each includes a contact area 18-4. The contact area 18-4 is manufactured with a convex surface in the direction of the power transistor (not shown) and contacts the power transistor when the inverter device 5 is assembled to apply a spring force to the power transistor. One strip of the spring element 18 is assigned to each power transistor.

[0103] The second end of the mounting element 18-1 made as an eyelet or the second end of the bent strip made with the contact area 18-4 is each deflected in direction z relative to the base area 18-2 and aligned in a plane defined by directions x and y.

[0104] When the inverter device 5 is installed by the mounting element 18-1, in particular, Figure 2e and Figure 2f As shown, the spring element 18 is attached to the guide element 15a-1 via a snap-in element 15a-2 made as an eye in a direction opposite to the direction z. The spring element 18 is snapped or clipped into the frame element 15 in the region of the guide element 15a-1 via a mounting element 18-1.

[0105] The fact that the snap-on element 15a-2 is in the shape of a barb having a cross-sectional area that narrows as the barb moves in the direction of movement of the spring element 18 makes it easier to attach the snap-on element 15a-2 while preventing the spring element 18 from moving in the direction z beyond a predetermined range, which would also cause the spring element 18 to be pulled away from the guide element 15a-1. The spring elements 18, which are captively attached to the guide elements 15a-1, each of which is made in pairs, are arranged so that the spring elements 18 can move along the guide elements 15a-1 upwards in the direction z to a stop on the snap-on element 15a-2 and in the direction opposite to the direction z. The diameter of the opening inside the mounting element 18-1 is greater than the maximum diameter of the cross section of the guide element 15a-1 in a plane extending in the directions x and y, which means that the free movement of the mounting element 18-1 enclosing the guide element 15a-1 is guaranteed.

[0106] Figure 3a A perspective exploded view of the PCB 12 of the inverter device 5, a frame element 15 with pre-installed spring elements 18 and power transistors, and a mounting device 19 is shown, the mounting device 19 being manufactured as a plate and comprising a first attachment element 16-1 for attaching the PCB 12 and a second attachment element 16-2 for attaching each of the spring elements 18 to the housing 2 or the mounting device 19. Figure 3b A perspective view of a frame element 15 of an inverter device 5 with spring elements 18 premounted on a mounting device 19 to a PCB 12 is shown, wherein power transistors are each inserted into the PCB 12 and soldered to the PCB 12 .

[0107] During the process of mounting the device 5, the power transistor, the frame element 15 with the already pre-mounted spring element 18 and the PCB 12 are all placed onto the mounting device 19, wherein the mounting of the components can be performed one after the other in a specified order, or the frame element 15 with the already pre-mounted spring element 18 and the PCB 12 can be positioned against each other, then the power transistor is inserted, and finally the mounting device 19 is moved into position. The spring element 18 is clamped in place and attached to the frame element 15, so that a relative movement of the spring element 18 in the direction z and thereby in the direction of the force acting on the power transistor during assembly is ensured until the spring element 18 is attached to the mounting device 19, in particular screwed down to the mounting device 19. The spring element 18 does not deform elastically until the spring element 18 is screwed down to the mounting device 19, which means that no spring force is generated.

[0108] After placing the power transistor on the mounting device 19, the frame element 15 is placed on the power transistor so that the connection portion of the power transistor is guided through the feedthrough opening 15-5 in the direction z, thereby protruding out of the frame element 15, and the power transistor is arranged so that the power transistor is integrated inside the mounting recess 15-4. The spring element 18 slides along the guide element in the direction z.

[0109] The connection parts of the power transistor that protrude out of the frame element 15 are then inserted without any mechanical tension through the openings made in the PCB 12. The PCB 12 is attached to the mounting device 19, in particular screwed down to the mounting device 19, using the first attachment element 16-1, wherein the frame element 15 is arranged between the PCB 12 and the mounting device 19 and between the spring element 18 and the power transistor. The connection parts of the power transistor are then plated through the PCB 12 and soldered to the PCB 12.

[0110] After soldering the power transistor to the PCB 12 and thus connecting the individual components, the pre-mounted module is removed from the mounting device 19, wherein the first attachment element 16-1 in particular is released. Figure 3c As shown in , the pre-assembled module is attached to the housing 2 . Figure 3c An exploded perspective view of the PCB 12, frame element 15 and power transistors of the inverter device 5 and the housing 2 with cooling surface 2-1 of the electric motor 3 and the compression mechanism 4 are shown when the pre-mounted module is assembled. The pre-mounted module is attached to the housing 2, in particular screwed down to the housing 2, using a first attachment element 16-1, which is guided through an opening made in the PCB 12 and inserted into a mounting hole 17 provided in the housing 2.

[0111] Due to its modular design, the device 5 represents an integral unit comprising the listed components, which integral unit can then be directly connected to the compressor 1, in particular to the housing 2 of the compressor 1. The frame element 15 is pre-mounted, the frame element 15 is aligned with the power transistor - the power transistor itself is aligned with the cooling surface 2-1 of the housing 2 and soldered to the PCB 12 - and is attached to the spring element 18 and the PCB 12.

[0112] In an alternative process for mounting the device 5 on the housing 2, all assembly steps are performed directly on the housing 2, in particular on the cooling surface 2-1 of the housing 2, instead of on the mounting device 19, as also shown. Figure 3a and Figure 3b as shown in .

[0113] In the final step of the corresponding assembly process, the spring element 18 is always attached to the cooling surface 2-1 of the housing 2 using the second attachment element 16-2, in particular screwed down to the housing 2, so that the spring element 18 is elastically deformed and generates and applies a spring force to the power transistor to press the power transistor against the cooling surface 2-1 of the housing 2. The spring element 18 is attached to the cooling surface 2-1 using the second attachment element 16-2, in particular screwed down to the cooling surface 2-1, and the second attachment element 16-2 is guided through the through openings 18-3 respectively made in the spring element 18 and inserted into the mounting hole 20 provided in the cooling surface 2-1 of the housing 2.

[0114] Figures 4a to 4c Each shows a side view of a power transistor arrangement on a cooling surface 2 - 1 of a housing 2 relative to a PCB 12 , with a spring element 18 in various mounting positions.

[0115] The spring element 18 is arranged so that the mounting element 18-1 is placed on the snap-on element 15a-2 and on the guide element 15a-1 on the frame element. The first surface 11-1 of the power transistor is in contact with the cooling surface 2-1 of the housing 2. The second surface 11-2 of the power transistor, which is made on the far side of the first surface 11-1, is aligned in the direction of the PCB 12.

[0116] Figure 4a A comparative arrangement of a non-elastically deformed spring element 18 and a power transistor is shown, with the base region 18-2 of the spring element 18 in contact with the cooling surface 2-1. Based on the distance S aligned in the direction z, the overlap of the contact region 18-4 of the spring element 18 relative to the second surface 11-2 of the power transistor can be clearly seen here.

[0117] During the process of soldering the connection of the power transistor to the PCB 12, the spring element 18 which is not elastically deformed is Figure 4b The arrangement is such that the spring element 18 slides along the guide element 15a-1 in a movement direction 21 aligned in the direction z, which means that the soldering point is free of any mechanical tension. The base region 18-2 of the spring element 18 is lifted away from the cooling surface 2-1 by a distance S, and the contact region 18-4 of the spring element 18 is in contact with the second surface 11-2 of the power transistor.

[0118] By bringing the base area 18-2 into contact with the cooling surface 2-1 and thereby moving the base area 18-2 in the movement direction 21, and attaching the spring element 18 to the housing 2 using the second attachment element 16-2, in particular screwing the spring element 18 down to the housing 2, according to the steps Figure 4c, the spring element 18 is elastically deformed and thereby generates a spring force and applies this spring force to the power transistor. The spring force is applied via the contact area 18-4 and acts on the second surface 11-2, which means that the first surface 11-1 of the power transistor - the first surface 11-1 is also called a heat transfer surface, in particular a surface for heat dissipation - is pressed against the cooling surface 2-1 of the housing 2 over its entire area.

[0119] The spring elements 18, in particular with the contact areas 18-4, are each arranged between the PCB 12 and the power transistor, so that the spring elements 18 exert pressure on the power transistor. In particular, the strips of the spring elements 18 that are in contact with the power transistor via the contact areas 18-4 are elastically deformed. The compressive force generated by the spring elements 18 acts in a direction opposite to the direction z toward the level of the cooling surface 2-1. The connections of the power transistor to the PCB 12, in particular the soldering points, remain free of any mechanical tension.

[0120] The spring element 18 has a defined stiffness. When the inverter device 5 is mounted to the housing 2, a force, in particular a spring force, acting substantially in the axial direction of the device is generated between the corresponding spring element 18 and each power transistor and therefore also between the cooling surface 2-1 of the housing 2, so that each power transistor is pressed in the direction of the housing 2 due to the elastic properties of the spring element 18. When the power transistor is in contact with the housing 2 and the spring element 18 is elastically deformed, a force acts on the power transistor. Therefore, after the process of mounting the device 5 to the housing 2, a mechanical tension is generated via the elastic deformation of the spring element 18.

[0121] The spring element 18 is configured such that the power transistor is pressed against the cooling surface 2 - 1 with a sufficient and predetermined force during the entire service life of the device 1 , regardless of the ambient temperature inside the device 1 .

[0122] Figure 5a and Figure 5b as well as Figure 6a and Figure 6b A perspective view and a sectional view show alternative embodiments of guide elements 15 b - 1 , 15 c - 1 which are produced on the frame element 15 for guiding the spring element 18 in connection with the spring element 18 in the direction of movement 21 .

[0123] according to Figure 5a and Figure 5bA first alternative embodiment of the guide element 15b-1 is in the form of an elongate shape extending in the direction z and, compared to the guide element 15a-1 shown in the above figures, is made as an expansion element with two snap-on elements 15b-2. The guide element 15b-1 has a U-shape in a cross section of a plane defined by the directions x and z and is therefore made with two legs connected to each other at a first end via a bridge. The legs have a rectangular cross section in a plane defined by the directions x and y.

[0124] As a component of a frame element (not shown), the guide element 15b-1 is firmly and inseparablely, in particular non-destructively attached to the frame element via a bridge. The guide element 15b-1 includes a snap-on element 15b-2 on each of the free second ends made on the far side of the first end. The snap-on element 15b-2 itself is made to have a shape similar to a barb, so that the spring element 18 can be attached via the second end, and the process of attaching the spring element 18 is simplified due to the narrowing cross-sectional area towards the second end, and after being attached via the snap-on element 15b-2, any movement exceeding a predetermined range in the direction opposite to the direction of movement used when attaching the spring element 18 is prevented. The gap generated between the legs of the guide element 15b-1 also contributes to the elastic deformation of the legs along the direction x towards each other and together with the snap-on element 15b-2, which is also used to further support the process of attaching the spring element 18. After being attached via the snap-on element 15 b - 2 , the spring element 18 is then arranged on the guide element 15 b - 1 , such that the spring element 18 is captured and can move along the guide element 15 b - 1 .

[0125] Similar to the spring element 18 in the above figures, the strip-shaped mounting element 18-1 of the spring element 18 is attached to the base area 18-2 at its first end, while the second free end is in the shape of an eyelet, in particular a closed eyelet with a completely enclosed opening. However, in contrast to the spring element 18 in the above figures, the opening is preferably made with a substantially rectangular cross section.

[0126] according to Figure 6a and Figure 6b A second alternative embodiment of the guide element 15c-1 is in the form of an elongate shape extending in the direction z, in particular in the form of a pin, and in contrast to the guide element 15a-1 shown in the above figures, is made without snap-on elements. The guide element 15c-1 has a circular cross section in a plane defined by the directions x and y. As part of a frame element (not shown), the guide element 15c-1 is also firmly and inseparably attached to the frame element, in particular non-destructively.

[0127] While the free second ends of the guide elements 15a-1, 15b-1 in Figures 2 to 5 are preferably arranged below the PCB 12 in the direction z, the guide element 15c-1 protrudes with its free second end in the direction z beyond the PCB 12. The process of attaching the spring element 18 to the guide element 15c-1 is simplified due to the conical shape, wherein the cross-sectional area narrows towards the second end, and due to the arrangement of the PCB 12 as a stop for the spring element 18, any movement beyond a predetermined range in a direction opposite to the movement direction used when attaching the element is prevented. After being attached to the guide element 15c-1, the spring element 18 is then captured and arranged so that the spring element 18 can move along the guide element 15c-1.

[0128] A first end of the strip-like mounting element 18 - 1 of the spring element 18 is attached to the base region 18 - 2 , whereas its second free end is made in the form of an eyelet, in particular a closed eyelet with a completely enclosed opening, in particular with a circular cross section.

[0129] Figure 7a and Figure 7b A third alternative embodiment of a guide element 18 - 5 for guiding a spring element 18 in connection with the spring element 18 is shown in a perspective view and in a sectional view.

[0130] The guide elements 18-5 are each in the form of an elongate strip extending in the direction z and are manufactured on the spring element 18 in comparison with the guide elements 15a-1, 15b-1, 15c-1 in the above-mentioned figures. The guide elements 18-5 are attached to the spring element 18 at a first end, in particular to the base region 18-2 of the spring element 18. The guide elements 18-5 each include a snap-on element 18-6 at a free second end manufactured at the far side of the first end. The snap-on element 18-6 itself is manufactured to have a shape similar to a barb with elastic deformation capability, so that the spring element 18 is allowed to be inserted through a hole manufactured in the PCB 12 and thus pass through the PCB 12 with its second end in a first direction of movement extending in the direction z. The snap-on element 18-6 is preferably manufactured as a curved end of a strip, in particular a curved end of about 90°.

[0131] When the guide element 18-5 is inserted through the PCB 12 with the snap-in element 18-6 as the head, the guide element 18-5 is elastically deformed. The elastic deformation causes the snap-in element 18-6 to snap into place on the PCB 12, thereby preventing the snap-in element 18-6 from moving beyond a predetermined range in the second direction of motion, which extends opposite to the first direction of motion, and the second direction of motion itself extends opposite to the direction z. Therefore, the snap-in element 18-6 can only move in the direction of the second direction of motion until the snap-in element 18-6 rests against the PCB 12 used as a stop. After being captively attached to the PCB 12, the spring element 18 is then arranged so that the spring element 18 can move along the guide element 18-5 in the direction of motion 21.

[0132] When using an arrangement of the inverter with guide elements 18-5 made on spring elements 18, the frame element can be omitted. During the process of installing the inverter device, the power transistor and the PCB 12 with the already pre-installed spring elements 18 are placed one after another in a specified order on the mounting device 19 or the housing 2. The spring element 18 is fixed on the PCB 12 in such a way that the relative movement of the spring element 18 in the direction z is guaranteed, thereby ensuring the relative movement of the spring element 18 in the direction of the force that will act on the power transistor when assembled, until the spring element 18 is attached to the mounting device 19 or the housing 2, in particular screwed down to the mounting device 19 or the housing 2. The spring element 18 has no elastic deformation, which means that no spring force is generated until the spring element 18 is screwed down to the mounting device 19 or the housing 2.

[0133] After placing the power transistor on the cooling surface 2-1 of the mounting device 19 or housing 2, the PCB 12 with the spring element 18 is moved relative to the power transistor so that the connection of the power transistor is inserted through the opening made in the PCB 12 without any mechanical tension. The spring element 18 slides along the guide element 18-5 in the direction z. The PCB 12 is attached to the mounting device 19 or housing 2 using the first attachment element 16-1, in particular screwed down to the mounting device 19 or housing 2, wherein the spring element 18 and the power transistor are arranged between the PCB 12 and the mounting device 19 or housing 2. Then, the connection of the power transistor is plated through the PCB 12 and soldered to the PCB 12.

[0134] If the inverter device is pre-mounted using the mounting device 19, after soldering the power transistor to the PCB 12 and thereby connecting the individual components, the pre-mounted module is removed from the mounting device 19, wherein the first attachment element 16-1 is in particular released. The pre-mounted module is then attached to the housing 2. The pre-mounted module is attached to the housing 2, in particular screwed down to the housing 2, using the first attachment element 16-1, which is guided through an opening made in the PCB 12 and inserted into a mounting hole 17 provided in the housing 2.

[0135] Once this has been done, or if the inverter device is to be mounted directly to the housing 2, the spring element 18 is attached to the cooling surface 2-1 of the housing 2, in particular screwed down to the housing 2, using the second attachment element 16-2, so that the spring element 18 is elastically deformed and a spring force is generated and applied to the power transistor to press the power transistor against the cooling surface 2-1 on the housing 2. The spring element 18 is attached to the cooling surface 2-1, in particular screwed down to the cooling surface 2-1, using the second attachment element 16-2, which is guided through the through openings 18-3 each made in the spring element 18 and inserted into the mounting hole 20 provided in the cooling surface 2-1 of the housing 2.

[0136] Industrial Applicability

[0137] The invention relates to a device, in particular an electric motor, for driving a compressor for compressing a vaporous fluid, in particular a refrigerant. The device is manufactured with a housing featuring a cooling surface and a power supply. The device comprises at least one switching element, a PCB and a spring element for applying a spring force to the switching element. The switching element is connected to the PCB. The compressor can be used in a refrigerant circuit of a motor vehicle air conditioning system. The invention also relates to a method for installing a device for driving a compressor for a vaporous fluid.

Claims

1. A device (3) for driving a compressor of a vaporous fluid, the device (3) comprising a housing (2) and a power supply device (5), the housing (2) having a cooling surface (2-1), the power supply device (5) having at least one switching element (11), at least one PCB (12) and at least one spring element (18) for applying a spring force to at least one of the switching elements (11), wherein: The switch element (11) is connected to the PCB (12), and the cooling surface (2-1) and the PCB (12) are arranged relative to each other in a direction z with a spacing therebetween, characterized in that at least one of the switch elements (11) is arranged so that the switch element (11) is in contact with the housing (2) in the region of the cooling surface (2-1) with a first surface (11-1), and so that at least one of the spring elements (18) for pressing the switch element (11) against the cooling surface (2-1) is in contact with the switch element (11). ), wherein the PCB (12) and the spring element (18) are manufactured so that the PCB (12) and the spring element (18) can be attached to the housing (2) independently of each other using fixings, and the spring element (18) can be arranged between the PCB (12) and the cooling surface (2-1) by means of at least one guide element (15a-1; 15b-1; 15c-1; 18-5) so that the spring element (18) can move freely along the movement direction (21).

2. The device (3) according to claim 1, characterized in that The at least one guide element (15a-1; 15b-1; 15c-1; 18-5) is manufactured as a component of a frame element (15) arranged between the cooling surface (2-1) of the housing (2) and the PCB (12), or is manufactured as a component of the spring element (18).

3. The device (3) according to claim 1 or 2, characterized in that The movement direction (21) of at least one of the spring elements (18) is aligned along the direction z perpendicular to the plane of the PCB (12) and the plane of the cooling surface (2-1) on the housing (2), wherein the plane of the PCB (12) and the plane of the cooling surface (2-1) are aligned and arranged in parallel with each other.

4. The device (3) according to claim 2, characterized in that The at least one guiding element (15a-1; 15b-1; 15c-1; 18-5) is elongated in the direction z and has a first end and a second end.

5. The device (3) according to claim 4, characterized in that The at least one guide element (15a-1; 15b-1; 15c-1; 18-5) passes through the at least one guide element (15a-1; 15b-1; 18-5) when it is manufactured as a component of the frame element (15). 15c-1; 18-5) is connected to the frame element (15) at its first end, or to the at least one guide element (15a-1; 15b-1; 15c-1; 18-5) is connected to the spring element (18) via a first end of the at least one guide element (15a-1; 15b-1; 15c-1; 18-5) when it is manufactured as a component of the spring element (18).

6. The device (3) according to claim 4 or 5, characterized in that When the at least one guide element (15a-1; 15b-1; 18-5) is manufactured as a component of the frame element (15), at least one snap-in element (15a-2; 15b-2) is manufactured on the second end of the at least one guide element (15a-1; 15b-1; 18-5) for locking the spring element (18) to the frame element (15), or when the at least one guide element (15a-1; 15b-1; 18-5) is manufactured as a component of the spring element (18), at least one snap-in element (18-6) is manufactured on the second end of the at least one guide element (15a-1; 15b-1; 18-5) for locking the spring element (18) to the PCB (12).

7. The device (3) according to claim 4 or 5, characterized in that The at least one guide element (15a-1; 15b-1; 15c-1; 18-5) has a rectangular or circular cross-section in a plane formed perpendicular to the direction z, or has a U-shaped cross-section with an open side at the second end in a plane formed along one of the directions x, z.

8. The device (3) according to claim 2, characterized in that The frame element (15) is manufactured with a through opening (15-3) for guiding a fixing member through so as to be connected to the housing (2).

9. The device (3) according to claim 2, characterized in that The frame element (15) is manufactured with at least one mounting recess (15-4) for mounting at least one of the switch elements (11).

10. The device (3) according to claim 2, characterized in that The frame element (15) is manufactured with a feed-through opening (15-5) for inserting a connection portion of at least one of the switching elements (11).

11. The device (3) according to claim 2, characterized in that The frame element (15) consists of plastic.

12. The device (3) according to claim 1 or 2, characterized in that At least one of the spring elements (18) is in the form of a small plate having at least one curved strip protruding from a base region (18-2).

13. The device (3) according to claim 12, characterized in that The bent portion of at least one of the strips having a contact area (18-4) manufactured as a convex surface is aligned in the direction of at least one of the switching elements (11) and is arranged so that the bent portion contacts the switching element (11) with the contact area.

14. The device (3) according to claim 12, characterized in that When at least two switching elements (11) are produced, one strip of the spring element (18) is assigned to each switching element (11).

15. The device (3) according to claim 12, characterized in that At least one of the spring elements (18) is manufactured with at least one mounting element (18-1) for connection to a guide element (15a-1; 15b-1; 15c-1), or is manufactured with at least one guide element (18-5) for connection to the PCB (12).

16. The device (3) according to claim 15, characterized in that The mounting element (18-1) and / or the guide element (18-5) is in the shape of a strip having a first end and a second end, wherein the first end is connected to the base region (18-2).

17. The device (3) according to claim 16, characterized in that The second end of the mounting element (18-1) is manufactured as a free end having an opening for the guide element (15a-1; 15b-1; 15c-1) to pass through.

18. The device (3) according to claim 16, characterized in that The second end of the guide element (18-5) is manufactured to have a free end of a snap-on element (18-6) for passing through an opening manufactured in the PCB (12).

19. The device (3) according to claim 12, characterized in that The spring element (18) comprises a through opening (18-3) produced in the base region (18-2) for passing an attachment element (16-2) through for connection to the housing (2).

20. The device (3) according to claim 1 or 2, characterized in that At least one of the spring elements (18) is made of an elastically deformable material.

21. A method for installing a device (3) for driving a compressor for a vaporous fluid according to any one of claims 2 to 20, comprising the following steps: - installing the power supply device (5) on the housing (2) of the device (3), or installing the power supply device (5) as a module on the installation device (19), wherein: - arranging at least one switching element (11) with a first surface (11-1) on a cooling surface (2-1) of the housing (2) or on the mounting device (19), wherein a connection portion of the switching element (11) protrudes beyond the switching element (11) and beyond a second surface (11-2) of the switching element (11) pointing in a direction opposite to the first surface (11-1), wherein the direction z is aligned substantially orthogonally to the cooling surface (2-1) and to the surfaces (11-1, 11-2) of the switching element (11), - at least one spring element (18) is arranged on the frame element (15) so that the spring element (18) can be moved in a guided manner in the direction z in a movement direction (21) relative to the frame element (15) by means of at least one guide element (15a-1; 15b-1; 15c-1), - arranging the frame element (15) with at least one spring element (18) in the direction z such that the switch element (11) is arranged between the cooling surface (2-1) and the frame element (15), wherein the spring element (18) is placed in contact with the second surface (11-2) of the switch element (11) with a contact area (18-4) and moves in a sliding motion along the guide element (15a-1; 15b-1; 15c-1) in the direction z without any elastic deformation, - arranging the PCB (12) on the frame element (15) along the direction z, - inserting the connection portion of the switch element (11) through an opening made in the PCB (12), - fixing the PCB (12) to the housing (2) or to the mounting device (19) using a first attachment element (16-1), - soldering the connection of the switching element (11) to the PCB (12) without any mechanical tension and connecting the components to make a module, - when the power supply device (5) is mounted as a module on the mounting device (19), the first attachment element (16-1) is released and the module is removed from the mounting device (19), and the module is arranged on the housing (2), wherein the first surface (11-1) of the switch element (11) is located on the cooling surface (2-1), and the PCB (12) is fixed to the housing (2) using the first attachment element (16-1), and - The spring element (18) is fixed to the cooling surface (2-1) with a base area (18-2) using a second attachment element (16-2), wherein the spring element (18) is elastically deformed and generates a spring force acting on the switching element (11), so that the switching element (11) is pressed against the cooling surface (2-1) along the direction z.

22. The method according to claim 21, characterized in that The spring element (18) is attached to a guide element (15a-1; 15b-1; 15c-1) of the frame element (15) in the direction of movement (21) via a mounting element (18-1).

23. The method according to claim 22, characterized in that The mounting element (18-1) and the guide element (15a-1; 15b-1) of the frame element (15) are captively snapped into place by means of snap-in elements (15a-2; 15b-2).

24. The method according to any one of claims 21 to 23, characterized in that The frame element (15) is placed on the switch element (11) so that the connection portion of the switch element (11) is guided along the direction z through a feed-through opening (15-5) made in the frame element (15) so as to protrude from the frame element (15), and the switch element (11) is arranged and integrated on the inner side of a mounting recess (15-4) made in the frame element (15).

25. The method according to any one of claims 21 to 23, characterized in that When the power supply device (5) is mounted as a module on the mounting device (19), before the connection portion of the switch element (11) is soldered to the PCB (12), the spring element (18) is attached to the mounting device (19) on the base area (18-2) of the spring element (18) using the second attachment element (16-2), wherein the spring element (18) is elastically deformed and in this way generates a spring force and applies the spring force to the switch element (11), so that the switch element (11) is pressed against the mounting device (19) in the direction z and the second attachment element (16-2) is released before the module is removed from the mounting device (19).

26. The method according to any one of claims 21 to 23, characterized in that The PCB (12) and / or the spring element (18) are screwed down to the housing (2) and / or the mounting device (19) using attachment elements (16-1, 16-2).

27. A method for installing a device (3) for driving a compressor for a vaporous fluid according to any one of claims 2 to 20, the method comprising the following steps: - installing the power supply device (5) on the housing (2) of the device (3), or installing the power supply device (5) as a module on the installation device (19), wherein: - arranging at least one switching element (11) with a first surface (11-1) on a cooling surface (2-1) of the housing (2) or on the mounting device (19), wherein a connection portion of the switching element (11) protrudes beyond the switching element (11) and beyond a second surface (11-2) of the switching element (11) pointing in a direction opposite to the first surface (11-1), wherein the direction z is aligned substantially orthogonally to the cooling surface (2-1) and to the surfaces (11-1, 11-2) of the switching element (11), - at least one spring element (18) is arranged on the PCB (12) such that the spring element (18) can be moved in a guided manner along the direction z in a direction of movement (21) relative to the PCB (12) by means of at least one guide element (18-5), - aligning the PCB (12) having at least one spring element (18) in the direction z so that the switch element (11) is arranged between the cooling surface (2-1) and the PCB (12), wherein the spring element (18) is in contact with the second surface (11-2) of the switch element (11) at a contact area (18-4) and slides along the guide element (18-5) in the direction z without any elastic deformation, - inserting the connection portion of the switch element (11) through an opening made in the PCB (12), - fixing the PCB (12) to the housing (2) or to the mounting device (19) using a first attachment element (16-1), - soldering the connection of the switching element (11) to the PCB (12) without any mechanical tension and connecting the components to make a module, - when the power supply device (5) is mounted as a module on the mounting device (19), the first attachment element (16-1) is released and the module is removed from the mounting device (19), and the module is arranged on the housing (2), wherein the first surface (11-1) of the switch element (11) is located on the cooling surface (2-1), and the PCB (12) is fixed to the housing (2) using the first attachment element (16-1), - The spring element (18) is fixed to the cooling surface (2-1) with a base area (18-2) using a second attachment element (16-2), wherein the spring element (18) is elastically deformed and generates a spring force acting on the switching element (11), so that the switching element (11) is pressed against the cooling surface (2-1) along the direction z.

28. The method according to claim 27, characterized in that When the power supply device (5) is mounted as a module on the mounting device (19), before the connection portion of the switch element (11) is soldered to the PCB (12), the spring element (18) is attached to the mounting device (19) on the base area (18-2) of the spring element (18) using the second attachment element (16-2), wherein the spring element (18) is elastically deformed and in this way generates a spring force and applies the spring force to the switch element (11), so that the switch element (11) is pressed against the mounting device (19) in the direction z and the second attachment element (16-2) is released before the module is removed from the mounting device (19).

29. The method according to claim 27 or 28, characterized in that The PCB (12) and / or the spring element (18) are screwed down to the housing (2) and / or the mounting device (19) using attachment elements (16-1, 16-2).

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