A thyristor device based on FOPLP advanced packaging

Abstract

The present invention discloses a thyristor device based on FOPLP advanced packaging, including a connection and storage mechanism, a stable placement mechanism, a packaging reinforcement mechanism and a sandwich protection mechanism, wherein the top of the connection and storage mechanism is provided with a stable placement mechanism, and the packaging reinforcement mechanism is provided above the stable placement mechanism, and the sandwich protection mechanism is provided around the inside of the packaging reinforcement mechanism. The external structure diagram of the thyristor device maintenance mechanism based on FOPLP advanced packaging, when the thyristor device is packaged and enters storage or use, the carrying shaft can be rotated, and at the same time, the three groups of pins fixedly connected to the outer wall on one side thereof are driven to rotate, so that the three groups of pins enter the storage grooves provided on the bottom surface of the base during the rotation and folding process, and the pins are recovered and stored when not installed and used, so as to prevent the pins from being damaged before the thyristor is installed or moved and affecting the normal use, thereby playing a protective role.

Description

Technical Field

[0001] The present invention relates to the technical field of thyristors, and in particular to a thyristor device based on FOPLP advanced packaging. Background Art

[0002] Silicon controlled rectifier (SCR) is a high-power electrical component, also known as thyristor, which has the advantages of small size, high efficiency and long life. In automatic control systems, it can be used as a high-power driver to control high-power equipment with small-power controls. It has been widely used in AC and DC motor speed regulation systems, power regulation systems and follow-up systems. FOPLP is a chip semiconductor packaging process. The shell used to install semiconductor integrated circuit chips plays the role of placing, fixing, sealing, protecting the chip and enhancing the electrical and thermal performance. It is also a bridge between the internal world of the chip and the external circuit.

[0003] The thyristor devices on the market are often damaged during use and installation because the connection between the internal chip and the external pins is mostly fixed during the packaging process, and most of the pins are equidistantly arranged on the edge of the packaging shell. This greatly affects the use of the thyristor devices. To this end, we propose a thyristor device based on FOPLP advanced packaging. Summary of the invention

[0004] The purpose of the present invention is to provide a thyristor device based on FOPLP advanced packaging to solve the problem raised in the above background technology that during use and installation, since the connection between the internal chip and the external pins during the packaging process is mostly fixed, and most of the pins are equidistantly arranged on the edge of the packaging shell, they may be damaged during transportation or use and installation, which greatly affects the use of the thyristor device.

[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a thyristor device based on FOPLP advanced packaging, comprising a connecting and storing mechanism, a stabilizing placement mechanism, a packaging reinforcement mechanism and a sandwich protection mechanism, wherein a stabilizing placement mechanism is arranged at the top of the connecting and storing mechanism, and a packaging reinforcement mechanism is arranged above the stabilizing placement mechanism, and a sandwich protection mechanism is arranged around the inside of the packaging reinforcement mechanism, the connecting and storing mechanism comprises a base, a storing groove, a rotating shaft, a mounting shaft, pins, a welding port, a connecting beam and a contact, and the bottom surface of the base is distributed with a storing groove, rotating shafts are embedded on both sides of one end of the base, and a mounting shaft is connected to the middle of the rotating shaft, pins are distributed on one side of the mounting shaft, and a welding port is arranged at the end of one end of the pin, connecting beams are arranged on both sides of the mounting shaft, and contacts are distributed on the outer wall of one side of the connecting beam.

[0006] Furthermore, the mounting shaft forms a rotating structure with the base through a rotating shaft, and the pin and the mounting shaft are fixedly connected.

[0007] Furthermore, the connecting beam is connected to the stable placement mechanism, and the contact points are evenly distributed along the outer wall of one side of the connecting beam.

[0008] Furthermore, the stable placement mechanism includes a bottom shell, a semiconductor, a reinforcing rib, an embedding groove, a placement gasket, a glue strip and a mounting hole, and a semiconductor is arranged inside the top of the bottom shell, reinforcing ribs are distributed on the inner walls on both sides of the bottom shell, and an embedding groove is opened on the inner wall of one end of the bottom shell, a placement gasket is embedded in the inner wall around the embedding groove, and a glue strip is adhered to the outer wall around the placement gasket, and a mounting hole is arranged inside the placement gasket.

[0009] Furthermore, the placement gasket is fixedly connected to the bottom shell and the semiconductor, and the reinforcing ribs are evenly distributed along the inner walls on both sides of the bottom shell.

[0010] Furthermore, the packaging reinforcement mechanism includes an upper shell, a packaging line, an opening, a reserved groove, a top column, a diagonal bracing beam, a soft rubber pad and a vent, and a packaging line is arranged around the bottom end of the upper shell, a reserved groove is opened on one side of the bottom end of the upper shell, and a top column is arranged inside the bottom end of the upper shell, the outer walls on both sides of the top column are connected with diagonal bracing beams, and the outer wall of the bottom end of the top column is arranged with a soft rubber pad, and vents are distributed on both sides of the inside of the soft rubber pad.

[0011] Furthermore, the upper shell is fixedly connected to the stable placement mechanism, and the diagonal support beams are symmetrically distributed along the outer walls on both sides of the top column.

[0012] Furthermore, the top column is fixedly connected to the upper shell and the soft rubber pad, and the ventilation holes are symmetrically distributed along both sides of the inside of the soft rubber pad.

[0013] Furthermore, the interlayer protection mechanism includes a copper layer, a hot melt adhesive, an insulating layer, an edge strip, a packaging layer and a frosted layer, and the hot melt adhesive is distributed on the outer walls around the copper layer, the insulating layer is distributed on the outer walls around the hot melt adhesive, and the edge strip is attached to the bottom of the insulating layer, the packaging layer is arranged on the outer walls around the edge strip, and the frosted layer is distributed on the outer walls on both sides of the packaging layer.

[0014] Furthermore, the copper layer, the insulating layer and the hot melt adhesive are bonded together, and the encapsulation layer is evenly distributed along the outer wall around the insulating layer.

[0015] Compared with the prior art, the beneficial effects of the present invention are as follows: the external structure diagram of the thyristor device maintenance mechanism based on FOPLP advanced packaging, when the thyristor device is packaged and enters storage or use, the carrying shaft can be rotated through the rotating structure formed by the rotating shaft and the base through the carrying shaft, and at the same time, the three groups of pins fixedly connected to the outer wall on one side are driven to rotate, so that the three groups of pins enter the storage grooves opened on the bottom surface of the base during the rotation and folding process, and the pins are recovered and stored when they are not installed and used, so as to prevent the pins from being damaged before the installation or movement of the thyristor and affecting the normal use, and play a protective role. When the user needs to use this device, he only needs to rotate the carrying shaft again to let the pins fold in place, and at the same time, the contacts on the other side of the carrying shaft are in contact with the contacts equidistantly distributed along the outer wall on one side of the connecting beam, and then cooperate with the connection between the connecting beam and the semiconductor in the stable placement mechanism to complete the connection and fixation. At this time, the user can normally perform the placement operation of the thyristor device.

[0016] 1. In the present invention, during the use of the semiconductor, the reinforcing ribs are evenly distributed along the inner walls on both sides of the bottom shell, which can not only strengthen the overall structure of the bottom shell, but also strengthen and stabilize the semiconductor placed inside it, so that even if the electronic equipment placed therein is impacted, it will not affect the normal use of the internal thyristor device. During installation, the user can fix the placement gasket to the installation position by fixing the connection between the placement gasket and the bottom shell and the semiconductor, and passing the screws through the installation hole. At the same time, the glue strip on the edge of the placement gasket has a certain insulation effect, which can prevent abnormal situations such as short circuit caused by conflict between the contact surfaces at the placement position, and then the pins are welded and fixed to complete a convenient and stable overall installation process.

[0017] 2. In the present invention, during the production process of the thyristor, the upper shell is fixedly connected to the stable placement mechanism so that the bottom edge of the upper shell is fitted with the top edge of the bottom shell to complete the packaging and fixing. During the placement or use of the single body, the design of the diagonal bracing beams symmetrically distributed along the outer walls on both sides of the top column can enable the main body to mitigate the impact and bear the load when it is impacted, thereby reducing the damage to the inside of the device. When the device is impacted or falls, the top column fixedly connected to the upper shell will cooperate with the soft rubber pad to buffer and protect the semiconductor in contact with the bottom, and at the same time cooperate with multiple groups of diagonal bracing beams to evenly distribute the force, so as to prevent local damage from affecting the overall use. At the same time, during the buffering and decompression process, the vents arranged inside the soft rubber pad can discharge the internal air and excess heat in cooperation with the multiple groups of openings on the top of the upper shell when in use, thereby reducing the internal heat and forming a cooling effect, making the thyristor device more stable to use.

[0018] 3. In the present invention, the internal material of the device shell is connected by bonding between the copper layer, the insulating layer and the hot melt adhesive to make them fit and fix. The copper layer can not only improve the structural stability of the overall package, but also have a good heat conduction effect to prevent internal heat accumulation from affecting the use. The insulating layer is distributed inside to play a role of electrostatic protection within the scope of the package to avoid cross-circuit short-circuiting inside and outside the device. The frosted layer on both sides of the packaging layer has an anti-slip effect to avoid falling off due to operating errors during installation, thereby improving safety. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a schematic diagram of the explosion structure of a thyristor device based on FOPLP advanced packaging of the present invention;

[0020] Figure 2 This is a schematic diagram of the bottom structure of a thyristor device based on FOPLP advanced packaging of the present invention;

[0021] Figure 3 It is a schematic diagram of the three-dimensional structure of a stable placement mechanism for a thyristor device based on FOPLP advanced packaging of the present invention;

[0022] Figure 4 This is a schematic diagram of the front structure of a thyristor device stable placement mechanism based on FOPLP advanced packaging of the present invention;

[0023] Figure 5 A schematic diagram of the three-dimensional structure of a thyristor device packaging reinforcement mechanism based on FOPLP advanced packaging of the present invention;

[0024] Figure 6 This is a schematic diagram of the internal structure of a thyristor device packaging reinforcement mechanism based on FOPLP advanced packaging of the present invention;

[0025] Figure 7 The figure is a schematic diagram of the internal structure of a sandwich protection mechanism for a thyristor device based on FOPLP advanced packaging of the present invention.

[0026] In the figure: 1. Connecting and storing mechanism; 101. Base; 102. Storage slot; 103. Rotating shaft; 104. Carrying shaft; 105. Pin; 106. Welding port; 107. Connecting beam; 108. Contact; 2. Stable placement mechanism; 201. Bottom shell; 202. Semiconductor; 203. Reinforcement rib; 204. Embedding slot; 205. Placement gasket; 206. Glue strip; 207. Mounting hole; 3. Packaging reinforcement mechanism; 301. Upper shell; 302. Packaging line; 303. Opening; 304. Reserved slot; 305. Top column; 306. Diagonal support beam; 307. Soft rubber pad; 308. Vent; 4. Interlayer protection mechanism; 401. Copper layer; 402. Hot melt adhesive; 403. Insulating layer; 404. Edge strip; 405. Packaging layer; 406. Frosted layer. DETAILED DESCRIPTION

[0027] In the description of the present invention, unless otherwise specified, "plurality" means two or more than two; the orientations or positional relationships indicated by the terms "upper", "lower", "left", "right", "inner", "outer", "front end", "rear end", "head", "tail", etc. are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", "third", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0028] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "connected" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0029] like Figure 1-2As shown, the present invention provides a technical solution: a thyristor device based on FOPLP advanced packaging, comprising: a connecting and storing mechanism 1; a stabilizing placement mechanism 2 is arranged on the top of the connecting and storing mechanism 1, and a packaging reinforcement mechanism 3 is arranged above the stabilizing placement mechanism 2, and a sandwich protection mechanism 4 is arranged around the inside of the packaging reinforcement mechanism 3; the connecting and storing mechanism 1 comprises a base 101, a storage groove 102, a rotating shaft 103, a mounting shaft 104, a pin 105, a welding port 106, a connecting beam 107 and a contact 108, and the bottom surface of the base 101 is distributed with a storage The base 101 has a groove 102, a rotating shaft 103 is embedded on both sides of one end of the base 101, and a carrying shaft 104 is connected to the middle of the rotating shaft 103, a pin 105 is distributed on one side of the carrying shaft 104, and a welding port 106 is provided at one end of the pin 105, a connecting beam 107 is provided on both sides of the carrying shaft 104, and a contact 108 is distributed on one side of the outer wall of the connecting beam 107, the carrying shaft 104 forms a rotating structure with the base 101 through the rotating shaft 103, and the pin 105 is fixedly connected to the carrying shaft 104, and the thyristor device is packaged and stored or used. When the mounting shaft 104 is rotated through the rotating structure formed by the rotating shaft 103 and the base 101, the mounting shaft 104 can be rotated, and at the same time, the three groups of pins 105 fixedly connected to the outer wall of one side thereof can be driven to rotate, so that the three groups of pins 105 enter the storage groove 102 provided on the bottom surface of the base 101 during the rotation and folding process, and the pins 105 are recovered and stored when they are not installed and used, so as to prevent the pins 105 from being damaged before the installation or during the movement of the thyristor and affecting the normal use, and play a protective role, and the connecting beam 107 and the stabilizing beam 107 are connected. The placement mechanisms 2 are connected, and the contacts 108 are evenly distributed along the outer wall of one side of the connecting beam 107. When the user needs to use this device, he only needs to rotate the mounting shaft 104 to let its pin 105 fold back to its original position. At the same time, the contacts 108 on the other side of the mounting shaft 104 are in contact with the contacts 108 evenly distributed along the outer wall of one side of the connecting beam 107. The connection between the connecting beam 107 and the semiconductor 202 in the stable placement mechanism 2 can complete the connection and fixation. At this time, the user can normally perform the placement operation of this thyristor device.

[0030] like Figure 3-4As shown, the present invention provides a technical solution: a thyristor device based on FOPLP advanced packaging, the stable placement mechanism 2 includes a bottom shell 201, a semiconductor 202, a reinforcing rib 203, an embedding groove 204, a placement gasket 205, a glue strip 206 and a mounting hole 207, and the semiconductor 202 is arranged inside the top of the bottom shell 201, and the inner walls on both sides of the bottom shell 201 are distributed with reinforcing ribs 203, and the inner wall at one end of the bottom shell 201 is provided with an embedding groove 204, and the placement gasket 205 is embedded in the inner wall around the embedding groove 204, and the outer wall around the placement gasket 205 is attached with a glue strip 206, and the inside of the placement gasket 205 is provided with a mounting hole 207, and the placement gasket 205 is fixedly connected to the bottom shell 201 and the semiconductor 202, and the reinforcing rib 203 is arranged along the inner walls on both sides of the bottom shell 201. Uniform distribution. During the use of the semiconductor 202, the reinforcing ribs 203 evenly distributed along the inner walls on both sides of the bottom shell 201 can not only strengthen the overall structure of the bottom shell 201, but also strengthen and stabilize the semiconductor 202 placed inside it, so that even if the electronic equipment placed therein is impacted, it will not affect the normal use of the internal thyristor device. During installation, the user can fix the gasket 205 to the installation position by placing a fixed connection between the gasket 205 and the bottom shell 201 and the semiconductor 202, and pass the screws through the mounting hole 207. At the same time, the rubber strip 206 on the edge of the gasket 205 has a certain insulating effect, which can prevent abnormal situations such as short circuits caused by conflicts between the contact surfaces at the installation position. The pin 105 is then welded and fixed to complete a convenient and stable overall installation process.

[0031] like Figure 5-6As shown, the present invention provides a technical solution: a thyristor device based on FOPLP advanced packaging, the packaging reinforcement mechanism 3 includes an upper shell 301, a packaging line 302, an opening 303, a reserved groove 304, a top column 305, a diagonal support beam 306, a soft rubber pad 307 and a vent 308, and the bottom end of the upper shell 301 is surrounded by a packaging line 302, a side of the bottom end of the upper shell 301 is provided with a reserved groove 304, and the bottom end of the upper shell 301 is provided with a top column 305, and the top column The outer walls on both sides of 305 are connected with diagonal bracing beams 306, and the outer wall at the bottom end of the top column 305 is provided with a soft rubber pad 307, and the inner sides of the soft rubber pad 307 are provided with vent holes 308. The upper shell 301 and the stable placement mechanism 2 are fixedly connected, and the diagonal bracing beams 306 are symmetrically distributed along the outer walls on both sides of the top column 305. In the production process of the thyristor, the bottom edge of the upper shell 301 is fitted with the top edge of the bottom shell 201 through the fixed connection between the upper shell 301 and the stable placement mechanism 2. The package is fixed, and during the placement or use of the single body, the design of the diagonal bracing beams 306 symmetrically distributed along the outer walls on both sides of the top column 305 can enable the body to reduce the impact and bear the load when it is impacted, thereby reducing the damage to the internal part of the device. The top column 305 is fixedly connected to the upper shell 301 and the soft rubber pad 307, and the vents 308 are symmetrically distributed along the two sides of the soft rubber pad 307. When the device is impacted or falls, the top column 305 fixedly connected to the upper shell 301 will cooperate with the soft rubber pad 307 to buffer and protect the semiconductor 202 in contact with the bottom, and at the same time cooperate with multiple groups of diagonal bracing beams 306 to evenly distribute the force, so as to prevent local damage from affecting the overall use. At the same time, during the buffering and decompression process, the vents 308 arranged inside the soft rubber pad 307 can discharge the internal air and excess heat in conjunction with the multiple groups of openings 303 on the top of the upper shell 301 when in use, thereby reducing the internal heat and forming a cooling effect, making the use of the thyristor device more stable.

[0032] like Figure 7As shown, the present invention provides a technical solution: a thyristor device based on FOPLP advanced packaging, the interlayer protection mechanism 4 includes a copper layer 401, a hot melt adhesive 402, an insulating layer 403, an edge strip 404, a packaging layer 405 and a frosted layer 406, and the hot melt adhesive 402 is distributed on the outer wall around the copper layer 401, the insulating layer 403 is distributed on the outer wall around the hot melt adhesive 402, and the edge strip 404 is attached to the bottom of the insulating layer 403, the packaging layer 405 is arranged on the outer wall around the edge strip 404, and the frosted layer 406 is distributed on the outer walls on both sides of the packaging layer 405, and the copper layer 401, the insulating layer 403 and the hot melt adhesive 402 are bonded. , and the packaging layer 405 is evenly distributed along the outer wall around the insulating layer 403. The internal material of the device shell is bonded and fixed by the copper layer 401, the insulating layer 403 and the hot melt adhesive 402. The copper layer 401 improves the structural stability of the overall package while also having a good heat conduction effect to prevent internal heat accumulation from affecting use. The insulating layer 403 is distributed inside to allow the scope of this package to play an electrostatic protection role, avoiding cross-current short circuits inside and outside the device. The frosted layers 406 on both sides of the packaging layer 405 have an anti-slip effect, avoiding operating errors and falling off during installation, thereby improving safety.

[0033] Working principle: For this type of thyristor device maintenance mechanism based on FOPLP advanced packaging, the external structure diagram is as follows: first, after the thyristor device is packaged and put into storage or use, the carrying shaft 104 can be rotated through the rotating structure formed by the rotating shaft 103 and the base 101 through the carrying shaft 104, and at the same time, the three groups of pins 105 fixedly connected to the outer wall on one side are driven to rotate, so that the three groups of pins 105 enter the storage groove 102 opened on the bottom surface of the base 101 during the rotation and folding process, and the pins 105 are recovered and stored when they are not installed and used, so as to prevent the pins 105 from being damaged before the installation or movement of the thyristor and affecting the normal use, and play a protective role. When the user needs to perform maintenance on the device, When in use, it is only necessary to rotate the mounting shaft 104 to fold the pin 105 in place, and at the same time, the contact 108 on the other side of the mounting shaft 104 is fitted and contacted with the contact 108 evenly distributed along the outer wall of one side of the connecting beam 107, and then the connecting beam 107 is connected with the semiconductor 202 in the stable placement mechanism 2 to complete the connection and fixation. At this time, the user can normally perform the placement of the thyristor device. The reinforcing ribs 203 evenly distributed along the inner walls on both sides of the bottom shell 201 can not only strengthen the overall structure of the bottom shell 201, but also strengthen and stabilize the semiconductor 202 placed inside it, so that even if the electronic equipment placed therein is impacted, it will not affect the normal use of the internal thyristor device. When installing, use The user can fix the installation gasket 205 to the installation position by installing the fixed connection between the gasket 205 and the bottom shell 201 and the semiconductor 202, and pass the screw through the installation hole 207 to fix the installation gasket 205 to the installation position. At the same time, the glue strip 206 on the edge of the installation gasket 205 has a certain insulation effect, which can prevent abnormal conditions such as short circuit caused by conflict between the contact surfaces of the installation position, and then weld and fix the pin 105 to complete a convenient and stable overall installation process. When this device is impacted or dropped, the top column 305 fixedly connected to the upper shell 301 will cooperate with the soft rubber pad 307 to buffer and protect the semiconductor 202 in contact with the bottom, and at the same time cooperate with multiple groups of diagonal bracing beams 306 to evenly distribute the force, so as to prevent local damage from affecting the overall use. At the same time, during the buffering and decompression process, the soft rubber pad 307 The vent holes 308 provided in the upper part can discharge the internal air and excess heat together with the multiple groups of openings 303 on the top of the upper shell 301 when in use, thereby reducing the internal heat to form a cooling effect, making the thyristor device more stable to use. The internal material of the device shell is bonded and connected by the copper layer 401, the insulating layer 403 and the hot melt adhesive 402 to make them fit and fix. The copper layer 401 can improve the structural stability of the overall package while also having a good heat conduction effect to prevent internal heat accumulation from affecting use. The insulating layer 403 is distributed inside to allow the scope of this package to play a role in electrostatic protection, thereby avoiding cross-current short circuits inside and outside the device. The frosted layers 406 on both sides of the packaging layer 405 have an anti-slip effect.Avoid operating errors and falling off during installation, and improve safety.

Claims

1. A thyristor device based on FOPLP advanced packaging, comprising a connection and storage mechanism (1), a stabilization and placement mechanism (2), a packaging reinforcement mechanism (3) and a sandwich protection mechanism (4), characterized in that: The top of the connection and storage mechanism (1) is provided with a stabilizing placement mechanism (2), and the upper part of the stabilizing placement mechanism (2) is provided with a packaging reinforcement mechanism (3), and the inner periphery of the packaging reinforcement mechanism (3) is provided with an interlayer protection mechanism (4), and the connection and storage mechanism (1) comprises a base (101), a storage groove (102), a rotating shaft (103), a mounting shaft (104), a pin (105), a welding port (106), a connecting beam (107) and a contact point (108), and the base ( The bottom surface of the base (101) is provided with a storage groove (102), a rotating shaft (103) is embedded on both sides of one end of the base (101), and a carrying shaft (104) is connected to the middle of the rotating shaft (103), a pin (105) is distributed on one side of the carrying shaft (104), and a welding port (106) is provided at one end of the pin (105), a connecting beam (107) is provided on the other side of the carrying shaft (104), and a contact point (108) is distributed on the outer wall of one side of the connecting beam (107); The carrying shaft (104) forms a rotating structure with the base (101) through the rotating shaft (103), and the pin (105) and the carrying shaft (104) are fixedly connected; The connecting beam (107) is connected to the stable placement mechanism (2), and the contact points (108) are evenly distributed along the outer wall of one side of the connecting beam (107); The stable placement mechanism (2) comprises a bottom shell (201), a semiconductor (202), a reinforcing rib (203), an embedding groove (204), a placement gasket (205), a glue strip (206) and a mounting hole (207), wherein the top of the bottom shell (201) is provided with a semiconductor (202), the inner walls on both sides of the bottom shell (201) are provided with reinforcing ribs (203), and the inner wall at one end of the bottom shell (201) is provided with an embedding groove (204), the inner walls around the embedding groove (204) are embedded with a placement gasket (205), and the outer walls around the placement gasket (205) are bonded with glue strips (206), and the interior of the placement gasket (205) is provided with a mounting hole (207); The placement gasket (205) is fixedly connected to the bottom shell (201) and the semiconductor (202), and the reinforcing ribs (203) are evenly distributed along the inner walls on both sides of the bottom shell (201); The packaging reinforcement mechanism (3) comprises an upper shell (301), a packaging line (302), an opening (303), a reserved groove (304), a top column (305), a diagonal bracing beam (306), a soft rubber pad (307) and a vent (308), and the bottom end of the upper shell (301) is provided with a packaging line (302) around the periphery, a reserved groove (304) is provided on one side of the bottom end of the upper shell (301), and a top column (305) is provided inside the bottom end of the upper shell (301), the outer walls on both sides of the top column (305) are connected with the diagonal bracing beam (306), and the outer wall on the bottom end of the top column (305) is provided with a soft rubber pad (307), and the inside of the soft rubber pad (307) is provided with vents (308) on both sides; The top of the upper shell (301) is provided with a plurality of groups of openings (303); The interlayer protection mechanism (4) comprises a copper layer (401), a hot melt adhesive (402), an insulating layer (403), an edge strip (404), a packaging layer (405) and a frosted layer (406), wherein the hot melt adhesive (402) is distributed on the surrounding outer walls of the copper layer (401), the insulating layer (403) is distributed on the surrounding outer walls of the hot melt adhesive (402), and the bottom of the insulating layer (403) is attached with an edge strip (404), the packaging layer (405) is arranged on the surrounding outer walls of the edge strip (404), and the frosted layer (406) is distributed on the outer walls on both sides of the packaging layer (405); When in use, the carrying shaft (104) is rotated to allow its pin (105) to be folded back to its original position, and at the same time, the contact (108) on the other side of the carrying shaft (104) is fitted and contacted with the contact (108) distributed equidistantly along the outer wall of one side of the connecting beam (107), and then the connecting beam (107) is connected to the semiconductor (202) in the stable placement mechanism (2), so that the connection and fixation can be completed.

2. The thyristor device based on FOPLP advanced packaging according to claim 1, characterized in that: The upper shell (301) is fixedly connected to the stable placement mechanism (2), and the diagonal support beams (306) are symmetrically distributed along the outer walls on both sides of the top column (305).

3. The thyristor device based on FOPLP advanced packaging according to claim 2, characterized in that: The top column (305) is fixedly connected to the upper shell (301) and the soft rubber pad (307), and the vent holes (308) are symmetrically distributed along the inside of the soft rubber pad (307) on both sides.

4. The thyristor device based on FOPLP advanced packaging according to claim 3, characterized in that: The copper layer (401), the insulating layer (403) and the hot melt adhesive (402) are bonded together, and the encapsulation layer (405) is evenly distributed along the outer wall around the insulating layer (403).

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