A heat dissipation system, a mobile terminal and a control circuit

Abstract

The present invention relates to the field of terminal heat dissipation technology, and in particular to a heat dissipation system, a mobile terminal and a control circuit. It includes a housing, a heat dissipation component and a control board; the housing includes a first component, a second component and a third component; one end of the second component is connected to one end of the first component, one end of the third component is connected to the other end of the first component, and the other ends of the second component and the third component are not connected, so that the first component, the second component and the third component are surrounded to form a heat dissipation space with an opening; the heat dissipation component and the control board are arranged in the heat dissipation space; the heat dissipation component includes a heat sink and a refrigeration component composed of at least two semiconductor refrigeration chips; one side of the heat sink is connected to one side of the refrigeration component, and when the heat dissipation component is arranged in the heat dissipation space, the other side of the refrigeration component faces the opening of the heat dissipation space, and contacts a mobile terminal that needs to be cooled to dissipate heat to the mobile terminal. A heat dissipation system with a higher temperature reduction range is provided.

Description

Technical Field

[0001] The present invention relates to the technical field of terminal heat dissipation, and in particular to a heat dissipation system, a mobile terminal and a control circuit. Background Art

[0002] With the advancement of science and technology, mobile terminals have become a must-have tool for almost every adult. However, mobile terminals or chips of mobile terminals will generate some heat during operation. If the mobile terminal or the chip of the mobile terminal cannot dissipate the heat in time after the mobile terminal or the chip of the mobile terminal generates some heat, the temperature of the mobile terminal and the chip of the mobile terminal will become higher and higher during the continuous use of the mobile terminal. The excessively high temperature of the mobile terminal and the chip of the mobile terminal will seriously affect the operation speed of the mobile terminal and the chip of the mobile terminal. Therefore, in order to overcome the influence of the excessively high temperature of the mobile terminal and the chip of the mobile terminal, the prior art proposes a heat dissipation system. The heat dissipation system in the prior art includes a shell, and the shell forms a heat dissipation space. A semiconductor refrigeration chip and a heat sink are arranged in the heat dissipation space. One end of the semiconductor refrigeration chip is connected to the mobile terminal or the chip of the mobile terminal to be dissipated, and the other end is connected to one end of the heat sink. The other end of the heat sink realizes the contact area with the air through teeth. The working principle is heat transfer and heat dissipation. The temperature transferred to the heat sink can be taken away by the air faster by increasing the contact area between the heat sink and the air, and the heat dissipation space of the shell is sent out to keep the mobile terminal and the chip of the mobile terminal at a lower temperature. However, the existing heat dissipation systems only include one semiconductor refrigeration chip, so the heat dissipation efficiency of the existing heat dissipation systems is low, and the temperature reduction range is not high. Therefore, some heat will remain on the mobile terminal or the chip of the mobile terminal being cooled, and the cooling efficiency cannot be regulated.

[0003] In summary, the technical problem actually solved by the present invention is how to provide a heat dissipation system with a higher temperature reduction range. Summary of the invention

[0004] In order to overcome the above technical defects, the purpose of the present invention is to provide a heat dissipation system, a mobile terminal and a control circuit, and to provide a heat dissipation system with a higher temperature reduction range.

[0005] The invention discloses a heat dissipation system, which is applied to a mobile terminal and comprises a shell, a heat dissipation component and a control board; wherein the shell comprises a first component, a second component and a third component; one end of the second component is connected to one end of the first component, one end of the third component is connected to the other end of the first component, and the other ends of the second component and the third component are not connected, so that the first component, the second component and the third component are surrounded to form a heat dissipation space with an opening; the heat dissipation component and the control board are arranged in the heat dissipation space; the heat dissipation component comprises a heat sink and a refrigeration component composed of at least two semiconductor refrigeration chips; one side of the heat sink is connected to one side of the refrigeration component, and when the heat dissipation component is arranged in the heat dissipation space, the other side of the refrigeration component faces the opening of the heat dissipation space, and contacts a mobile terminal that needs to be refrigerated to dissipate heat for the mobile terminal.

[0006] Preferably, ventilation holes are respectively provided on the first component, the second component, the third component and the control panel.

[0007] Preferably, when the heat dissipation component is disposed in the heat dissipation space, the heat dissipation component does not contact the first component, the second component, and the third component respectively.

[0008] Preferably, when the heat dissipation component and the control board are arranged in the heat dissipation space, the heat dissipation component, the control board and the first component are stacked in sequence.

[0009] Preferably, the heat sink comprises a heat sink substrate and a plurality of heat sink fins, the plurality of heat sink fins are respectively arranged on the same surface of the heat sink substrate, and the surface of the heat sink substrate opposite to the surface on which the heat sink fins are arranged is connected to a surface of the refrigeration component.

[0010] Preferably, the refrigeration component includes: a first semiconductor refrigeration chip, a second semiconductor refrigeration chip, a first thermal conductive interface material, a second thermal conductive interface material, and a substrate; wherein one side of the first semiconductor refrigeration chip and one side of the second semiconductor refrigeration chip are connected through the substrate; the first thermal conductive interface material is arranged on the opposite side of the first semiconductor refrigeration chip connected to the second semiconductor refrigeration chip; the second thermal conductive interface material is arranged on the opposite side of the second semiconductor refrigeration chip connected to the first semiconductor refrigeration chip; the opposite side of the side on which the heat dissipation substrate is provided with heat dissipation teeth is connected to one side of the first semiconductor refrigeration chip through the first thermal conductive interface material; one side of the refrigeration contact plate is arranged on the other side of the second semiconductor refrigeration chip connected to the first semiconductor refrigeration chip through the second thermal conductive interface material, and the other side of the refrigeration contact plate is connected to the mobile terminal that needs to be cooled.

[0011] Preferably, it also includes an exhaust fan, which is arranged in the heat dissipation space, and the heat dissipation component, the control board, the exhaust fan, and the first component are stacked in sequence.

[0012] Preferably, the mobile terminal includes a mobile phone, a tablet or a computer.

[0013] In view of this, a second object of the present invention is to provide a mobile terminal, which is provided with at least one heat dissipation system as described above.

[0014] In view of this, the third object of the present invention is to provide a control circuit of the heat dissipation system as described above, including a Type-C socket, an OVP overvoltage protector, a first buck, a second buck, a third buck, a fourth buck, a protocol interaction unit, a toggle switch, and a Bluetooth MCU; wherein the output end of the Type-C socket is connected to the input end of the OVP overvoltage protector; the output end of the OVP overvoltage protector is respectively connected in parallel to the first buck, the second buck, the third buck, the fourth buck, and the input end of the protocol interaction unit; the protocol interaction unit is used to communicate with the adapter of the Type-C socket and obtain a high-power voltage, and the protocol interaction unit can communicate with the Bluetooth MCU. The output ends of the first voltage reducer and the protocol interaction unit and the toggle switch are connected to the Bluetooth MCU, and the Bluetooth MCU can communicate with the second voltage reducer, the third voltage reducer, and the fourth voltage reducer; the output ends of the second voltage reducer, the third voltage reducer, and the fourth voltage reducer are respectively connected to the first semiconductor refrigeration chip, the second semiconductor refrigeration chip, and the exhaust fan; when the toggle switch is toggled, the Bluetooth MCU communicates with the second voltage reducer, the third voltage reducer, and the fourth voltage reducer, and the Bluetooth MCU controls the output voltage values ​​of the second voltage reducer, the third voltage reducer, and the fourth voltage reducer according to the signal of the toggle switch to control the power of the first semiconductor refrigeration chip, the second semiconductor refrigeration chip, and the exhaust fan.

[0015] After adopting the above technical scheme, compared with the prior art, the beneficial effect of the present invention is that by superimposing the first semiconductor refrigeration chip and the second semiconductor refrigeration chip, a heat dissipation terminal with a higher temperature reduction range is provided, and the first semiconductor refrigeration chip, the second semiconductor refrigeration chip and the exhaust fan are respectively controlled by the intelligent chip, thereby realizing multiple temperature control and multiple noise levels; if a lower cooling environment is required, a semiconductor refrigeration chip can be added to achieve it; the operating speed and service life of the mobile terminal and the chip of the mobile terminal are improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 A schematic diagram of a heat dissipation system, a mobile terminal and a heat dissipation system of a control circuit of the present invention;

[0017] Figure 2 A schematic diagram of a heat dissipation system, a mobile terminal and a housing of a heat dissipation system of a control circuit of the present invention;

[0018] Figure 3 A schematic diagram of a heat dissipation system, a mobile terminal, and a heat dissipation component of a heat dissipation system of a control circuit of the present invention;

[0019] Figure 4A schematic diagram of a heat sink of a heat dissipation component of a heat dissipation system, a mobile terminal, and a control circuit of the present invention;

[0020] Figure 5 A schematic diagram of a cooling component of a cooling system, a mobile terminal and a cooling system of a control circuit of the present invention;

[0021] Figure 6 The present invention is a schematic diagram of a heat dissipation system, a mobile terminal and a control circuit of the heat dissipation system of the control circuit.

[0022] Reference numerals:

[0023] 1 is a housing, 101 is a first component, 102 is a second component, 103 is a third component, 104 is a vent, 2 is a heat dissipation component, 21 is a heat sink, 211 is a heat dissipation substrate, 212 is a heat dissipation fin, 22 is a refrigeration component, 221 is a first semiconductor refrigeration chip, 222 is a second semiconductor refrigeration chip, 223 is a first thermal interface material, 224 is a second thermal interface material, 225 is a substrate, 226 is a refrigeration contact plate, 3 is a control board, 4 is an exhaust fan, 501 is a Type-C socket, 502 is an OVP overvoltage protector, 503 is a first voltage reducer, 504 is a second voltage reducer, 505 is a third voltage reducer, 506 is a fourth voltage reducer, 507 is a protocol interaction unit, 508 is a toggle switch, and 509 is a Bluetooth MCU. DETAILED DESCRIPTION

[0024] The advantages of the present invention are further described below in conjunction with the accompanying drawings and specific embodiments.

[0025] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present disclosure. Instead, they are merely examples of devices and methods consistent with some aspects of the present disclosure as detailed in the appended claims.

[0026] The terms used in this disclosure are for the purpose of describing specific embodiments only and are not intended to limit the disclosure. The singular forms of "a", "said" and "the" used in this disclosure and the appended claims are also intended to include plural forms unless the context clearly indicates otherwise. It should also be understood that the term "and / or" used herein refers to and includes any or all possible combinations of one or more associated listed items.

[0027] It should be understood that although the terms first, second, third, etc. may be used in the present disclosure to describe various information, such information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other. For example, without departing from the scope of the present disclosure, the first information may also be referred to as the second information, and similarly, the second information may also be referred to as the first information. Depending on the context, the word "if" as used herein may be interpreted as "at the time of" or "when" or "in response to determining".

[0028] In the description of the present invention, it is necessary to understand that the terms "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0029] In the description of the present invention, unless otherwise specified and limited, it should be noted that the terms "installed", "connected" and "connected" should be understood in a broad sense. For example, it can be a mechanical connection or an electrical connection, or it can be the internal connection between two components. It can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to the specific circumstances.

[0030] In the following description, the suffixes such as "module", "component" or "unit" used to represent elements are only used to facilitate the description of the present invention, and have no specific meanings. Therefore, "module" and "component" can be used interchangeably.

[0031] See also Figures 1 to 5 As shown, this embodiment provides a heat dissipation system, including a housing 1, a heat dissipation component 2, and a control board 3; wherein, referring to Figure 1 or Figure 2As shown, the housing 1 includes a first component 101, a second component 102, and a third component 103; one end of the second component 102 is arranged at one end of the first component 101, and the third component 103 is arranged at the other end of the first component 101, and the other ends of the second component 102 and the third component 103 are respectively facing the same direction, and the other ends of the second component 102 and the third component 103 are not connected, and then the first component 101, the second component 102, and the third component 103 form a U-shaped structure, so that the first component 101, the second component 102, and the third component 103 are surrounded to form a heat dissipation space with an opening; the heat dissipation component 2 and the control board 3 are arranged in the heat dissipation space surrounded by the first component 101, the second component 102, and the third component 103. The heat dissipation component 2 includes a heat sink 21 and a refrigeration element 22 composed of a plurality of semiconductor refrigeration chips. Because the refrigeration element 22 can select a plurality of semiconductor refrigeration chips according to the actual heat dissipation effect to be achieved, the number of semiconductor refrigeration chips is large, and this embodiment is mainly described by setting two semiconductor refrigeration chips. One side of the heat sink 21 is connected to one side of the refrigeration component 22, and when the heat dissipation component 2 is arranged in the heat dissipation space, the other side of the side of the refrigeration component 22 connected to the heat sink 21 faces the opening of the heat dissipation space, and the other side of the side of the refrigeration component 22 connected to the heat sink 21 is connected to the mobile terminal or the chip of the mobile terminal to be cooled through the opening of the heat dissipation space surrounded by the first component 101, the second component 102, and the third component 103. The working principle is that the heat generated by the mobile terminal or the chip of the mobile terminal during operation is connected to the heat sink 21 through the mobile terminal or the chip of the mobile terminal and the refrigeration component 22 of the heat dissipation system. The heat generated by the mobile terminal or the chip of the mobile terminal during operation is transferred to the cooling element 22 by physical heat transfer, and the cooling element 22 will offset part of the received heat due to its own temperature, and part of the heat will be transferred to the heat sink 21 by heat transfer. The heat sink 21 is in direct contact with the air in the heat dissipation space formed by the first component 101, the second component 102, and the third component 103. Therefore, the air in the heat dissipation space will absorb the heat of the heat sink 21, thereby completing the heat dissipation process.

[0032] It should be noted that the first component 101, the second component 102, the third component 103, and the control board 3 are respectively provided with vents 104. When the heat sink 21 transfers heat to the air in the heat dissipation space, the temperature of the air in the heat dissipation space will gradually increase with the increase of time. When the temperature of the air in the heat dissipation space is greater than or equal to the temperature of the heat sink 21, the heat dissipation effect will not be achieved at this time, so the air in the heat dissipation space needs to be discharged from the heat dissipation space. Therefore, it is necessary to circulate the air in the heat dissipation space, so that the air with the heat transferred by the heat sink 21 in the heat dissipation space is discharged from the heat dissipation space through the vents on the first component 101 and / or the second component 102 and / or the third component 103, and the air outside the heat dissipation space is circulated into the heat dissipation space through the first component 101 and / or the second component 102 and / or the third component 103. Since the control board 3 is disposed in the heat dissipation space surrounded by the first component 101, the second component 102, and the third component 103, a vent 104 is also disposed on the control board 3 to prevent the control board from affecting the air circulation in the heat dissipation space.

[0033] It should be noted that when the heat dissipation component 2 is arranged in the heat dissipation space formed by the first component 101, the second component 102, and the third component 103, the heat dissipation component 2 does not contact the first component 101 and / or the second component 102 and / or the third component 103. Since the heat dissipation component 2 is used for heat dissipation, the heat dissipation component 2 will carry heat, and when there is too much heat to be dissipated, the temperature of the heat dissipation component 2 will also increase. If the heat dissipation component 2 contacts the first component 101 and / or the second component 102 and / or the third component 103, the high-temperature heat dissipation component 2 will affect the performance of the first component 101 and / or the second component 102 and / or the third component 103.

[0034] It should be noted that when the heat dissipation component 2 and the control board 3 are arranged in the heat dissipation space formed by the first component 101, the second component 102, and the third component 103, the heat dissipation component 2, the control board 3, and the first component 101 are stacked in sequence, and the two ends of the vent 104 on the control board 3 face the heat dissipation component 2 and the first component 101 respectively. Figure 1 In the figure, hatching lines (oblique lines) are drawn at the two ends of the control board 3, indicating that the two ends of the control board 3 are solid. Therefore, there is no hatching line in the middle part of the control board 3, which indicates the vent 104 on the control board 3.

[0035] It should be noted that, see Figure 4As shown, the heat sink 21 includes a heat sink substrate 211 and a plurality of heat sink fins 212. The plurality of heat sink fins 212 are respectively on the same surface of the heat sink substrate 211. The surface opposite to the surface of the heat sink substrate 211 provided with the heat sink fins 212 is connected to the surface of the refrigeration element 22. It should be noted that since the heat sink 21 directly contacts the air in the heat sink space formed by the first component 101, the second component 102, and the third component 103 to dissipate heat, by providing a plurality of heat sink fins 212 on the heat sink substrate 211 of the heat sink 21, and each heat sink fin 212 is not in contact with each other and is relatively evenly distributed on the same surface of the heat sink substrate 211, the contact area between the heat sink 21 and the air in the heat sink space formed by the first component 101, the second component 102, and the third component 103 is increased, thereby increasing the efficiency of transferring the heat on the heat sink 21 to the air in the heat sink space, thereby increasing the heat dissipation efficiency and heat dissipation effect of the heat dissipation system.

[0036] It should be noted that, see Figure 5 As shown, the refrigeration element 22 includes a first semiconductor refrigeration chip 221, a second semiconductor refrigeration chip 222, a first thermal interface material 223, a second thermal interface material 224, a substrate 225, and a refrigeration contact plate 226; wherein, one side of the first semiconductor refrigeration chip 221 and one side of the second semiconductor refrigeration chip 222 are connected through the substrate 225, the first thermal interface material 223 is arranged on the opposite side of the first semiconductor refrigeration chip 221 connected to the second semiconductor refrigeration chip 222, the second thermal interface material 224 is arranged on the opposite side of the second semiconductor refrigeration chip 222 connected to the first semiconductor refrigeration chip 221, the heat dissipation substrate 211 is provided with a heat dissipation tooth plate 212, and the opposite side is connected to the first semiconductor refrigeration chip 221 through the first thermal interface material 223, and the system One side of the cold contact plate 226 is arranged on the second semiconductor refrigeration chip 222 through the second thermal interface material 224 to connect to the other side of the first semiconductor refrigeration chip 221, and the other side of the cooling contact plate 226 is connected to the mobile terminal that needs to be cooled, so that the cooling contact plate 226, the second thermal interface material 224, the second semiconductor refrigeration chip 222, the substrate 225, the first semiconductor refrigeration chip 221, the first thermal interface material 223, the heat dissipation substrate 211, the heat dissipation fins 212, the control board 3, and the first component 101 are stacked in sequence, and the cooling contact plate 226, the second thermal interface material 224, the second semiconductor refrigeration chip 222, the substrate 225, the first semiconductor refrigeration chip 221, the first thermal interface material 223, the heat dissipation substrate 211, the heat dissipation fins 212 are in contact and stacked in sequence.

[0037] It should be noted that, see Figure 1As shown, the heat dissipation system further includes an exhaust fan 4, which is arranged in the heat dissipation space, and the cooling contact plate 226, the second thermal interface material 224, the second semiconductor refrigeration chip 222, the substrate 225, the first semiconductor refrigeration chip 221, the first thermal interface material 223, the heat dissipation substrate 211, the heat dissipation fins 212, the control board 3, the exhaust fan 4, and the first component 101 are stacked in sequence. The exhaust fan 4 is used to accelerate the circulation of air in the heat dissipation space.

[0038] It should be noted that the mobile terminal may be a mobile phone, a tablet, a computer or other device.

[0039] The present invention further provides a mobile terminal, which includes at least one heat dissipation system as described in the above embodiment.

[0040] See also Figure 6 As shown, this embodiment also provides a control circuit applied to the above-mentioned heat dissipation system, which includes a Type-C female socket 501, an OVP overvoltage protector 502, a first buck 503, a second buck 504, a third buck 505, a fourth buck 506, a protocol interaction unit 507, a toggle switch 508, and a Bluetooth MCU 509; wherein, as Figure 6 The left side is the adapter. In the control circuit, the output end of the Type-C female socket 501 is connected to the input end of the OVP overvoltage protector 502, and the output end of the OVP overvoltage protector 502 is respectively connected to the input ends of the first buck 503, the second buck 504, the third buck 505, the fourth buck 506, and the protocol interaction unit 507. The protocol interaction unit 507 is used to obtain a high-power voltage after communicating with the adapter of the Type-C female socket 501, and the protocol interaction unit 507 can communicate with the Bluetooth MCU 509. The output ends of the first buck 503 and the protocol interaction unit 507 and the toggle switch 508 are connected to the Bluetooth MCU 509, and the Bluetooth MCU 509 can communicate with the second buck 504, the third buck 505, and the fourth buck 506. The output units of the second buck 504, the third buck 505, and the fourth buck 506 are respectively connected to the first semiconductor refrigeration chip 221, the second semiconductor refrigeration chip 222, and the exhaust fan 4.

[0041] It should be noted that the working principle of the control circuit is: the adapter and the Type-C socket 501 are connected through a data cable. At this time, the Type-C socket 501 is charged. After passing through the OVP overvoltage protector 502, the current flows to the first buck 503, the second buck 504, the third buck 505, and the fourth buck 506 respectively. The current passing through the first buck 503 is used to power the Bluetooth MCU 509, the current passing through the second buck 504 is used to power the first semiconductor refrigeration chip 221, the current passing through the third buck 505 is used to power the second semiconductor refrigeration chip 222, and the current passing through the fourth buck 506 is used to power the exhaust fan 4. When the toggle switch 508 is adjusted, the Bluetooth MCU 509 is adjusted according to the adjustment The signal of the toggle switch 508 of the section adjusts the resistance value of the second voltage drop 504, the third voltage drop 505, and the fourth voltage drop 506, thereby controlling the current size from the second voltage drop 504 to the first semiconductor refrigeration chip 221, the current size from the third voltage drop 505 to the second semiconductor refrigeration chip 222, and the current size from the fourth voltage drop 506 to the exhaust fan 4, so as to control the working efficiency of the first semiconductor refrigeration chip 221, the second semiconductor refrigeration chip 222, and the exhaust fan 4. When the first semiconductor refrigeration chip 221, the second semiconductor refrigeration chip 222, and the exhaust fan 4 require high power, the Bluetooth MCU 509 will communicate with the adapter through the protocol interaction module 507 to obtain high-power current.

[0042] The mobile terminal can be implemented in various forms. For example, the terminal described in the present invention may include a mobile terminal such as a mobile phone, a smart phone, a notebook computer, a PDA (personal digital assistant), a PAD (tablet computer), a PMP (portable multimedia player), a navigation device, etc., and a fixed terminal such as a digital TV, a desktop computer, etc. Below, it is assumed that the terminal is a mobile terminal. However, it will be appreciated by those skilled in the art that, in addition to the elements specifically used for mobile purposes, the construction according to the embodiments of the present invention can also be applied to fixed type terminals.

[0043] It should be noted that the embodiments of the present invention have better practicability and do not impose any form of limitation on the present invention. Any technician familiar with the field may use the technical content disclosed above to change or modify it into an equivalent effective embodiment. However, any modification or equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention are still within the scope of the technical solution of the present invention.

Claims

1. A control circuit for a heat dissipation system, applied to a mobile terminal, characterized in that: The heat dissipation system includes a housing, a heat dissipation component, and a control panel; wherein, The housing comprises a first component, a second component and a third component; one end of the second component is connected to one end of the first component, one end of the third component is connected to the other end of the first component, and the other ends of the second component and the third component are not connected, so that the first component, the second component and the third component are surrounded to form a heat dissipation space with an opening; The heat dissipation component and the control board are arranged in the heat dissipation space; The heat dissipation component includes a heat sink and a cooling element composed of at least two semiconductor cooling chips; one side of the heat sink is connected to one side of the cooling element, and when the heat dissipation component is arranged in the heat dissipation space, the other side of the cooling element faces the opening of the heat dissipation space and contacts the mobile terminal to be cooled to dissipate heat for the mobile terminal; The heat sink comprises a heat sink substrate and a plurality of heat sink teeth, wherein the plurality of heat sink teeth are respectively arranged on the same surface of the heat sink substrate, and a surface of the heat sink substrate opposite to a surface on which the heat sink teeth are arranged is connected to a surface of the refrigeration component; The refrigeration component includes: a first semiconductor refrigeration chip, a second semiconductor refrigeration chip, a first thermal interface material, a second thermal interface material, a substrate, and a refrigeration contact plate; wherein, One side of the first semiconductor refrigeration chip and one side of the second semiconductor refrigeration chip are connected via the substrate; The first thermal interface material is provided on a surface opposite to a surface of the first semiconductor refrigeration chip connected to the second semiconductor refrigeration chip; The second thermally conductive interface material is provided on a surface of the second semiconductor refrigeration chip opposite to a surface of the second semiconductor refrigeration chip connected to the first semiconductor refrigeration chip; The opposite surface of the heat dissipation substrate having the heat dissipation fins is connected to one surface of the first semiconductor refrigeration chip through the first thermal interface material; One side of the cooling contact plate is provided on the second semiconductor cooling chip through the second thermal interface material to connect to the other side of the first semiconductor cooling chip, and the other side of the cooling contact plate is connected to the mobile terminal that needs to be cooled; It also includes an exhaust fan, which is arranged in the heat dissipation space, and the heat dissipation component, the control board, the exhaust fan, and the first component are stacked in sequence; The control circuit includes a Type-C socket, an OVP overvoltage protector, a first buck, a second buck, a third buck, a fourth buck, a protocol interaction unit, a toggle switch, and a Bluetooth MCU; wherein, The output end of the Type-C socket is connected to the input end of the OVP overvoltage protector; The output end of the OVP overvoltage protector is respectively connected in parallel to the first buck, the second buck, the third buck, the fourth buck, and the input end of the protocol interaction unit; The protocol interaction unit is used to communicate with the adapter of the Type-C female socket and obtain high-power voltage, and the protocol interaction unit can communicate with the Bluetooth MCU; The output ends of the first voltage reducer, the protocol interaction unit and the toggle switch are connected to the Bluetooth MCU, and the Bluetooth MCU can communicate with the second voltage reducer, the third voltage reducer and the fourth voltage reducer; The output ends of the second voltage reducer, the third voltage reducer and the fourth voltage reducer are connected to the first semiconductor refrigeration chip, the second semiconductor refrigeration chip and the exhaust fan respectively; When the toggle switch is turned, the Bluetooth MCU communicates with the second voltage reducer, the third voltage reducer, and the fourth voltage reducer, and the Bluetooth MCU controls the output voltage values ​​of the second voltage reducer, the third voltage reducer, and the fourth voltage reducer according to the signal of the toggle switch to control the power of the first semiconductor refrigeration chip, the second semiconductor refrigeration chip, and the exhaust fan.

2. The control circuit according to claim 1, characterized in that: The first component, the second component, the third component and the control panel are respectively provided with ventilation holes.

3. The control circuit according to claim 1, characterized in that: When the heat dissipation component is disposed in the heat dissipation space, the heat dissipation component does not contact the first component, the second component, and the third component respectively.

4. The control circuit according to claim 1, characterized in that: When the heat dissipation component and the control board are arranged in the heat dissipation space, the heat dissipation component, the control board and the first component are stacked in sequence.

5. The control circuit according to claim 1, characterized in that: The mobile terminal includes a mobile phone, a tablet or a computer.

6. A mobile terminal, characterized in that: Comprising at least one control circuit according to any one of claims 1 to 5.

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