Head chip, liquid jet head, liquid jet recording device, and method for manufacturing head chip
By designing specific structures of the actuator plate, intermediate plate and injection orifice plate in the head chip, the problem of printing quality degradation caused by poor bonding between the nozzle plate and the intermediate plate is solved, and reliable detection of poor bonding is achieved, improving the printing quality and reliability of the manufacturing process.
Patent Information
- Application Number
- CN202111481745.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Priority Date
- 2020-12-07
- Filing Date
- 2021-12-07
- Publication Date
- 2025-04-08
- Estimated Expiration
- 2041-12-07
AI Technical Summary
In the prior art, poor bonding between the nozzle plate and the intermediate plate may cause the ejection channels to communicate with each other, causing the ejection direction of the ink to deflect, thereby reducing the printing quality. Moreover, due to the opaque material, it is difficult to detect the poor bonding by optically.
A head chip is designed, which includes an actuator plate, a middle plate and an injection orifice plate. The intermediate plate overlaps with the actuator plate to form a communication hole and a through hole, and the injection orifice plate blocks the through hole to ensure the connectivity of the injection channel and communicate with the outside through the non-jet passage to achieve detection of poor bonding.
By suppressing the reduction in printing quality caused by poor bonding, and achieving reliable detection of poor bonding through the communication of non-jet channels, the printing quality and reliability of the manufacturing process are improved.
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Figure CN114590029B_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to a head chip, a liquid ejecting head, a liquid ejecting recording device, and a method for manufacturing the head chip. Background Art
[0002] The inkjet head mounted on the inkjet printer ejects ink onto a recording medium through a head chip mounted on the inkjet head. The head chip includes: an actuator plate on which ejection channels and non-ejection channels are alternately formed; and a nozzle plate, which is joined to the actuator plate and has nozzle holes formed at positions corresponding to the ejection channels for ejecting ink contained in the ejection channels.
[0003] In recent years, the channels have gradually become thinner, so the permissible range of positional deviation of the actuator plate and the nozzle plate has become smaller. Specifically, if the position of the nozzle plate relative to the actuator plate is offset in the width direction of the channel, a portion of the opening on the channel side of the nozzle hole may be blocked by the wall between the channels. If a portion of the opening on the channel side of the nozzle hole is blocked, the supply of ink to the nozzle hole is hindered. As a result, the ejection characteristics of the ink may deteriorate.
[0004] Patent Documents 1 and 2 below disclose a structure in which an intermediate plate having a through hole connected to both the ejection channel and the nozzle hole is disposed between the actuator plate and the nozzle plate, and the through hole is formed larger than the ejection channel and the nozzle hole in the width direction of the ejection channel. According to this structure, the position of the actuator plate and the nozzle plate is allowed to shift within a range where the nozzle hole is not blocked by the intermediate plate, thereby preventing the supply of ink to the nozzle hole from being blocked.
[0005] Prior art literature
[0006] Patent Literature
[0007] Patent Document 1: Japanese Patent Application Publication No. 2019-42979;
[0008] Patent document 2: Japanese Patent Application Publication No. 2019-89234. Summary of the invention
[0009] (Problems to be solved by the invention)
[0010] However, if there is a poor joint at the joint portion between the intermediate plate and the nozzle plate, the ejection channels may be connected to each other through the poor joint portion. If the ejection channels are connected to each other, the pressure is transmitted through the poor joint portion when ejecting ink, sometimes causing the ink ejection direction to deflect. As a result, the printing quality may be reduced. However, in the case where the nozzle plate is formed of an opaque material such as a metal material, it is difficult to optically detect the poor joint between the nozzle plate and the intermediate plate.
[0011] Therefore, the present disclosure provides a head chip, a liquid jet head, a liquid jet recording apparatus, and a method for manufacturing a head chip, which suppress the reduction in printing quality due to poor bonding between an ejection orifice plate and an intermediate plate.
[0012] (Methods for solving problems)
[0013] In order to solve the above-mentioned problems, the present disclosure adopts the following aspects.
[0014] (1) A head chip according to one embodiment of the present disclosure comprises: an actuator plate having injection channels and non-injection channels extending in the first direction arranged alternately along a second direction intersecting the first direction; an intermediate plate superimposed on the actuator plate along a third direction orthogonal to the first direction and the second direction, and having a connecting hole connected to the injection channel and a through hole connected to the non-injection channel; and an injection hole plate superimposed on the intermediate plate on the side opposite to the actuator plate in the third direction in a state of blocking the through hole, and having an injection hole connected to the connecting hole and ejecting liquid contained in the injection channel at a position corresponding to the injection channel, the non-injection channel being connected to the outside, and the through hole being arranged on the inner side of the second direction relative to the inner surface of the non-injection channel extending in the first direction as viewed from the third direction.
[0015] According to this embodiment, the poorly joined portion between the middle plate and the ejection hole plate is connected to the through hole of the middle plate, so that the connecting hole of the middle plate and the through hole are connected via the poorly joined portion. Thus, the ejection channel and the non-ejection channel are connected. The non-ejection channel is connected to the outside of the head chip, so by detecting the leakage when the ejection hole is blocked and the ejection channel is evacuated, the existence of the poorly joined portion can be detected.
[0016] Here, an electrode film is generally provided on the inner surface of the non-ejection channel extending in the first direction. In this form, the through hole is provided on the inner side of the non-ejection channel extending in the first direction in the second direction as viewed from the third direction, so that when the actuator plate forms the through hole in a state where the intermediate plate is superimposed, interference between the means for forming the through hole and the electrode film can be suppressed.
[0017] As described above, the reliability degradation due to the cracking of the electrode film which may occur when forming the through hole in the intermediate plate is suppressed, and the bonding failure between the intermediate plate and the ejection orifice plate is detected, thereby suppressing the degradation of the printing quality caused by the bonding failure.
[0018] (2) In the head chip of the aspect (1), the injection channel may include a first injection channel and a second injection channel adjacent to each other in the second direction, and the through hole may be provided between the first injection channel and the second injection channel when viewed from the third direction.
[0019] According to this embodiment, the through hole is provided on a path extending linearly from one connecting hole to another connecting hole in the joint of the intermediate plate and the injection hole plate. Thus, it is possible to detect a poor joint between the intermediate plate and the injection hole plate, especially a poor joint that easily causes the injection channels to communicate with each other.
[0020] (3) In the head chip of the aspect of (2), the through hole may be provided on the inner side in the first direction than both ends of the first injection channel and the second injection channel when viewed from the third direction.
[0021] According to this aspect, compared with a configuration in which the through hole is provided from one outer side to the other outer side along the first direction relative to the injection channel, the processing time required to form the through hole can be shortened by reducing the formation range of the through hole.
[0022] (4) In the head chip according to the aspect of (3), the through hole may be provided between centers of the first injection channel and the second injection channel in the first direction when viewed from the third direction.
[0023] According to this aspect, the through hole is provided on the shortest path connecting the communication holes in the opposing portions of the intermediate plate and the injection orifice plate. Thus, a joint defect that may cause the injection channels to communicate with each other can be detected at the location where hydraulic pressure is most easily applied.
[0024] (5) In the head chip of the aspect (2) above, the through hole may be provided between the first injection channel and the second injection channel over the entire length in the first direction when viewed from the third direction.
[0025] According to this aspect, through holes are provided in the opposing portions of the intermediate plate and the injection hole plate along the entire path extending linearly from one communication hole to the other communication hole. This makes it possible to more reliably detect a poor connection that easily causes the injection channels to communicate with each other.
[0026] (6) In the head chip of the form of (2) above, the non-injection channel may include a first non-injection channel and a second non-injection channel adjacent to each other in the second direction, the through hole may include a first through hole connected to the first non-injection channel and a second through hole connected to the second non-injection channel, and a connecting groove connecting the first through hole and the second through hole is formed on the joint surface of the intermediate plate with the injection hole plate.
[0027] According to this embodiment, the connecting groove is formed in the same manner as the through hole without penetrating the middle plate, so that the first through hole, the connecting groove and the second through hole can be formed in series. Thus, compared with the case where the through hole communicating with the first non-injection channel and the through hole communicating with the second non-injection channel are formed separately, the processing time of the middle plate can be shortened.
[0028] (7) In the head chip according to any one of the aspects (1) to (6), a plurality of through holes communicating with one non-ejection channel may be formed in the intermediate plate.
[0029] According to this embodiment, a plurality of through holes connected to a non-injection channel are dispersedly formed, so that compared with a configuration in which a single through hole is formed, it is possible to suppress a reduction in the formation range of the through holes and ensure an area of the joint between the intermediate plate and the injection orifice plate. Therefore, it is possible to suppress a decrease in the joint strength between the intermediate plate and the injection orifice plate caused by the formation of the through holes.
[0030] (8) A liquid ejecting head according to one aspect of the present disclosure includes the head chip according to any one of the aspects (1) to (7).
[0031] According to this aspect, since the head chip according to any of the above aspects is provided, it is possible to provide a liquid ejecting head having excellent printing quality.
[0032] (9) A liquid jet recording apparatus according to one aspect of the present disclosure includes the liquid jet head according to the aspect of (8) above.
[0033] According to this aspect, since the liquid jet head according to the above aspect is provided, it is possible to provide a liquid jet recording apparatus having excellent printing quality.
[0034] (10) A method for manufacturing a head chip according to one embodiment of the present disclosure comprises: a through hole forming step of forming a through hole in an intermediate plate which is overlapped and joined to an actuator plate, wherein the actuator plate has injection channels and non-injection channels extending along the first direction arranged alternately along a second direction intersecting the first direction, the intermediate plate is overlapped and joined to the actuator plate along a third direction orthogonal to the first direction and the second direction, and the through hole is formed on the inner side of the second direction that is closer to the inner surface of the non-injection channel extending along the first direction when viewed from the third direction; and a joining step of overlapping and joining an injection hole plate having an injection hole for ejecting a liquid contained in the injection channel to the intermediate plate having a connecting hole connected to the injection channel and the injection hole on the side opposite to the actuator plate, thereby blocking the through hole.
[0035] According to this embodiment, regardless of the alignment accuracy of the actuator plate and the intermediate plate, a through hole can be formed at a desired position relative to the non-ejection channel by the through hole forming process. Therefore, in a head chip having an intermediate plate formed with a through hole connected to the non-ejection channel, it is possible to seek to improve the yield rate during manufacturing.
[0036] (Effects of the Invention)
[0037] According to one aspect of the present disclosure, it is possible to suppress a decrease in printing quality. BRIEF DESCRIPTION OF THE DRAWINGS
[0038] Figure 1 This is a schematic diagram of the structure of a printer according to the embodiment.
[0039] Figure 2 It is a schematic diagram of the structure of the inkjet head and the ink circulation mechanism according to the embodiment.
[0040] Figure 3 It is a perspective view of the head chip according to the first embodiment.
[0041] Figure 4 It is an exploded perspective view of the head chip according to the first embodiment.
[0042] Figure 5 It is a bottom view of the actuator plate of the first embodiment.
[0043] Figure 6 is equivalent to Figure 5 A cross-sectional view of the head chip along line VI-VI.
[0044] Figure 7 is equivalent to Figure 5 Cross-sectional view of the head chip along line VII-VII.
[0045] Figure 8 It is along Figure 4 Cross-sectional view along line VIII-VIII.
[0046] Fig. 9 It is a bottom view of the intermediate plate and the actuator plate of the first embodiment.
[0047] Fig.10 It is a diagram for explaining the method of manufacturing the head chip according to the first embodiment.
[0048] Fig.11 It is a diagram for explaining the method of manufacturing the head chip according to the first embodiment.
[0049] Fig.12 It is a diagram for explaining the method of manufacturing the head chip according to the first embodiment.
[0050] Fig.13 It is a bottom view of the actuator plate of the second embodiment.
[0051] Fig.14 It is a bottom view of the actuator plate of the third embodiment.
[0052] Fig.15 It is a bottom view of the actuator plate of the fourth embodiment. DETAILED DESCRIPTION
[0053] Hereinafter, the embodiments of the present disclosure will be described with reference to the accompanying drawings. In addition, in the following description, the same reference numerals are given to components having the same or similar functions. In addition, repeated descriptions of these components may be omitted.
[0054] [Implementation Method]
[0055] <Printer>
[0056] The printer 1 common to each embodiment will be described.
[0057] Figure 1 This is a schematic diagram of the structure of a printer according to the embodiment.
[0058] like Figure 1 As shown, a printer (liquid jet recording apparatus) 1 of the present embodiment includes a pair of transport mechanisms 2 and 3 , an ink tank 4 , an inkjet head (liquid jet head) 5 , an ink circulation mechanism 6 , and a scanning mechanism 7 .
[0059] In the following description, the X, Y, and Z orthogonal coordinate systems are used for description. In this case, the X direction (second direction) is consistent with the conveying direction (sub-scanning direction) of the recording medium P (for example, paper, etc.). The Y direction (first direction) is consistent with the scanning direction (main scanning direction) of the scanning mechanism 7. The Z direction (third direction) shows the height direction (vertical direction) orthogonal to the X direction and the Y direction. In the following description, the arrow side in the figure among the X direction, the Y direction, and the Z direction is set as the positive (+) side, and the side opposite to the arrow is set as the negative (-) side for description. In this embodiment, the +Z side is equivalent to the upper side in the vertical direction, and the -Z side is equivalent to the lower side in the vertical direction.
[0060] The transport mechanisms 2 and 3 transport the recording medium P to the +X side. The transport mechanisms 2 and 3 each include a pair of rollers 11 and 12 extending in the Y direction, for example.
[0061] The ink tanks 4 contain, for example, four colors of ink, i.e., yellow, magenta, cyan, and black. Each inkjet head 5 is configured to eject the four colors of ink, i.e., yellow, magenta, cyan, and black, corresponding to the connected ink tanks 4. In addition, the ink contained in the ink tanks 4 may be conductive ink or non-conductive ink.
[0062] Figure 2It is a schematic diagram of the structure of the inkjet head and the ink circulation mechanism according to the embodiment.
[0063] like Figure 1 and Figure 2 As shown, the ink circulation mechanism 6 circulates the ink between the ink tank 4 and the inkjet head 5. Specifically, the ink circulation mechanism 6 includes: a circulation flow path 23 having an ink supply tube 21 and an ink discharge tube 22, a pressure pump 24 connected to the ink supply tube 21, and a suction pump 25 connected to the ink discharge tube 22.
[0064] The pressure pump 24 pressurizes the inside of the ink supply tube 21, and delivers the ink to the inkjet head 5 through the ink supply tube 21. Thus, the ink supply tube 21 side has a positive pressure relative to the inkjet head 5.
[0065] The suction pump 25 decompresses the ink discharge tube 22, and sucks ink from the inkjet head 5 through the ink discharge tube 22. As a result, the ink discharge tube 22 side becomes negative pressure relative to the inkjet head 5. By driving the pressure pump 24 and the suction pump 25, the ink can circulate between the inkjet head 5 and the ink tank 4 through the circulation flow path 23.
[0066] The scanning mechanism 7 reciprocates and scans the inkjet head 5 in the Y direction. The scanning mechanism 7 includes a guide rail 28 extending in the Y direction and a carriage 29 supported by the guide rail 28 so as to be movably supported.
[0067] like Figure 1 As shown, the inkjet head 5 is mounted on the carriage 29. In the example shown in the figure, a plurality of inkjet heads 5 are mounted side by side in the Y direction on one carriage 29. The inkjet head 5 includes: a head chip 50 (see Figure 3 ); an ink supply unit (not shown) connecting the ink circulation mechanism 6 and the head chip 50; and a control unit (not shown) applying a driving voltage to the head chip 50.
[0068] [First embodiment]
[0069] <Head chip>
[0070] The head chip 50 according to the first embodiment will be described.
[0071] Figure 3 This is a perspective view of the head chip according to the first embodiment viewed from the -Z side in a state where the nozzle plate is removed. Figure 4 It is an exploded perspective view of the head chip according to the first embodiment.
[0072] Figure 3 and Figure 4 The head chip 50 shown is a so-called circulation type side shoot type head chip that circulates ink between the ink tank 4 and ejects ink from the center of the extension direction (Y direction) of the ejection channel 75 described later. The head chip 50 includes: a nozzle plate (ejection hole plate) 51 (see Figure 4 ); intermediate plate 52; actuator plate 53; and cover plate 54. The head chip 50 is a structure in which the nozzle plate 51, the intermediate plate 52, the actuator plate 53, and the cover plate 54 are stacked in sequence along the Z direction. In the following description, the direction from the nozzle plate 51 toward the cover plate 54 (+Z side) in the Z direction is sometimes described as the back side, and the direction from the cover plate 54 toward the nozzle plate 51 (-Z side) is sometimes described as the front side.
[0073] The actuator plate 53 is formed of a piezoelectric material such as PZT (lead zirconate titanate). The actuator plate 53 is, for example, a so-called herringbone substrate formed by laminating two piezoelectric plates having different polarization directions in the Z direction. However, the actuator plate 53 may also be a so-called unipolar substrate in which the polarization direction is in one direction over the entire region in the Z direction.
[0074] Figure 5 It is a bottom view of the actuator plate of the first embodiment.
[0075] like Figure 4 and Figure 5 As shown in FIG. 1 , a plurality of (for example, two) channel columns 61 and 62 are formed on the actuator plate 53. Each channel column 61 and 62 extends in the X direction and is arranged at intervals in the Y direction. In the present embodiment, the channel columns 61 and 62 are channel A columns 61 and channel B columns 62. The channel A columns 61 and the channel B columns 62 constitute a channel group 66. Hereinafter, the configuration of the channel columns 61 and 62 will be described by taking the channel A column 61 as an example.
[0076] like Figure 5 As shown, the channel A row 61 includes an ejection channel (ejection channel) 75 filled with ink and a non-ejection channel (non-ejection channel) 76 not filled with ink. In a plan view from the Z direction, each channel 75 and 76 extends in a straight line in the Y direction and is alternately arranged at intervals in the X direction. The portion of the actuator plate 53 located between the ejection channel 75 and the non-ejection channel 76 constitutes a driving wall 70 that separates the ejection channel 75 and the non-ejection channel 76 in the X direction (see FIG. 1 ). Figure 4 ). In addition, in this embodiment, the channel extension direction is consistent with the Y direction, but the channel extension direction may also intersect with the Y direction.
[0077] Figure 6 is equivalent to Figure 5 A cross-sectional view of the head chip along line VI-VI.
[0078] like Figure 6As shown in FIG. 1 , the discharge channel 75 is formed into a curved shape convex toward the surface side in a side view observed from the X direction. The discharge channel 75 is formed by, for example, allowing a disk-shaped cutter to enter from the back side (+Z side) of the actuator plate 53. Specifically, the discharge channel 75 has upper cut portions 75a located at both ends in the Y direction and a through portion 75b located between the upper cut portions 75a.
[0079] The upper cut portion 75a is, for example, an arc shape with the same curvature radius extending in accordance with the curvature radius of the cutter when viewed from the X direction. The upper cut portion 75a extends while being curved toward the back side as it moves away from the through portion 75b in the Y direction.
[0080] The penetration portion 75 b penetrates the actuator plate 53 in the Z direction.
[0081] Figure 7 is equivalent to Figure 5 Cross-sectional view of the head chip along line VII-VII.
[0082] like Figure 7 As shown, the non-ejection channel 76 is adjacent to the ejection channel 75 in the X direction, sandwiching the drive wall 70. The non-ejection channel 76 is formed by, for example, inserting a disk-shaped cutter from the back side (+Z side) of the actuator plate 53. The non-ejection channel 76 includes a through portion 76a and an upper cut portion 76b.
[0083] The through portion 76a penetrates the actuator plate 53 in the Z direction. That is, the through portion 76a is formed so that the groove depth in the Z direction is uniform. The through portion 76a constitutes a portion of the non-ejection channel 76 other than the +Y side end portion.
[0084] The upper cut portion 76b constitutes the +Y side end portion of the non-discharge channel 76. When viewed from the X direction, the upper cut portion 76b is, for example, an arc shape with the same curvature radius as the curvature radius of the cutter. The upper cut portion 76b extends while bending toward the back side as it moves away from the through portion 76a in the Y direction.
[0085] like Figure 5As shown, the channel B column 62 is arranged on the +Y side of the channel A column 61 in the actuator plate 53. The channel B column 62 is similar to the channel A column 61, and is composed of ejection channels (injection channels) 75 and non-ejection channels (non-injection channels) 76 alternately arranged in the X direction. Specifically, the ejection channels 75 and non-ejection channels 76 of the channel B column 62 are arranged at a half pitch offset relative to the arrangement pitch of the ejection channels 75 and non-ejection channels 76 of the channel A column 61. Therefore, in the inkjet head 5 of the present embodiment, the ejection channels 75 of the channel A column 61 and the channel B column 62, and the non-ejection channels 76 of the channel A column 61 and the channel B column 62 are arranged in a staggered manner (different from each other). That is, between the adjacent channel columns 61 and 62, the ejection channels 75 and the non-ejection channels 76 are facing each other in the Y direction. However, between the channel rows 61 and 62 , the ejection channels 75 and the non-ejection channels 76 may be arranged to face each other in the Y direction.
[0086] The portion of the actuator plate 53 located on the −Y side relative to the discharge channels 75 (through portions 75 b ) of the channel A row 61 constitutes the first region 81 . The portion of the actuator plate 53 located on the +Y side relative to the discharge channels 75 of the channel B row 62 constitutes the second region 86 .
[0087] like Figure 7 As shown, in the channel A column 61, the through portion 76a of the non-ejection channel 76 penetrates the first region 81 in the Y direction and the Z direction, and opens at the side facing the -Y side of the actuator plate 53. In the channel B column 62, the through portion 76a of the non-ejection channel 76 penetrates the second region 86 in the Y direction and the Z direction, and opens at the side facing the +Y side of the actuator plate 53. Thus, the non-ejection channel 76 communicates with the outside of the head chip 50.
[0088] Figure 8 It is along Figure 4 Cross-sectional view along line VIII-VIII.
[0089] like Figure 8 As shown, common electrodes 95 are formed on the inner surfaces of the ejection channels 75 extending in the Y direction (the inner surfaces of the drive wall 70 facing the ejection channels 75). The common electrodes 95 are formed on the inner surfaces of the ejection channels 75 over the entire area in the Z direction. The length of the common electrode 95 in the Y direction is equal to the through portion 75b of the ejection channel 75 (equal to the opening length of the ejection channel 75 on the surface of the actuator plate 53).
[0090] Individual electrodes 97 are formed on inner surfaces 76c of the non-ejection channels 76 extending in the Y direction (inner surfaces of the drive wall 70 facing the non-ejection channels 76). The individual electrodes 97 are formed on the inner surfaces of the non-ejection channels 76 over the entire area in the Z direction.
[0091] like Figure 5 As shown, a plurality of common terminals 96 are formed on the surface of the actuator plate 53. The common terminals 96 are in the form of strips extending parallel to each other along the Y direction. Each common terminal 96 is connected to a pair of common electrodes 95 at the opening edge of the corresponding discharge channel 75. Each common terminal 96 terminates in the corresponding area 81, 86.
[0092] On the surface of the regions 81 and 86, individual terminals 98 are formed in portions located further outward in the Y direction than the common terminal 96. The individual terminals 98 are in the shape of a band extending in the X direction. At the opening edges of the non-ejection channels 76 that are opposed in the X direction with the ejection channels 75 sandwiched therebetween, the individual terminals 98 connect individual electrodes 97 that are opposed in the X direction with the ejection channels 75 sandwiched therebetween. Furthermore, in the regions 81 and 86, dividing grooves 99 are formed in portions located between the common terminals 96 and the individual terminals 98. The dividing grooves 99 extend in the X direction in each region 81 and 86. The dividing grooves 99 separate the common terminals 96 from the individual terminals 98. Furthermore, for Figure 3 , Figure 4 etc., and only a portion of each electrode 95, 97 and each terminal 96, 98 is shown.
[0093] like Figure 6 As shown, a first flexible printed substrate 100 is pressed against the surface of the first region 81. The first flexible printed substrate 100 is connected to the common terminals 96 and the individual terminals 98 corresponding to the channel A column 61 on the surface of the first region 81. The first flexible printed substrate 100 passes through the -Y side of the actuator plate 53 and extends to the +Z side.
[0094] A second flexible printed substrate 101 is pressed against the surface of the second region 86. The second flexible printed substrate 101 is connected to the common terminals 96 and the individual terminals 98 corresponding to the channel B column 62 on the surface of the second region 86. The second flexible printed substrate 101 passes through the +Y side of the actuator plate 53 and extends to the +Z side.
[0095] like Figure 3 and Figure 4 As shown, the cover plate 54 is bonded to the back side of the actuator plate 53 so as to block the channel group 66. In the cover plate 54, an inlet common ink chamber 120 and an outlet common ink chamber 121 are formed at positions corresponding to the channel rows 61 and 62, respectively.
[0096] The inlet common ink chamber 120 is formed, for example, at a position overlapping the +Y side end of the discharge channel 75 in a plan view in the channel A row 61. The inlet common ink chamber 120 extends in the X direction to a length across the channel A row 61 and opens on the back surface of the cover plate 54.
[0097] The outlet common ink chamber 121 is formed, for example, at a position overlapping the −Y side end of the discharge channel 75 in a plan view in the channel A row 61. The outlet common ink chamber 121 extends in the X direction over a length spanning the channel A row 61 and opens on the back surface of the cover plate 54.
[0098] In the inlet common ink chamber 120 , inlet slits 125 are formed at positions corresponding to the discharge channels 75 of the channel A row 61 . The inlet slits 125 communicate between the +Y side ends of the discharge channels 75 and the inside of the inlet common ink chamber 120 .
[0099] In the outlet common ink chamber 121, the outlet slit 126 is formed at a position corresponding to the ejection channel 75 of the channel A row 61. The outlet slit 126 connects the -Y side end of each ejection channel 75 with the inside of the outlet common ink chamber 121. Therefore, the inlet slit 125 and the outlet slit 126 are connected to each ejection channel 75, but are not connected to the non-ejection channel 76.
[0100] The intermediate plate 52 is bonded to the surface of the actuator plate 53 in such a manner as to block the channel group 66. The intermediate plate 52 is formed of a piezoelectric material such as PZT, similarly to the actuator plate 53. The thickness of the intermediate plate 52 in the Z direction is thinner than that of the actuator plate 53. The dimension of the intermediate plate 52 in the Y direction is shorter than that of the actuator plate 53. Therefore, for the intermediate plate 52, both ends of the actuator plate 53 in the Y direction (for example, the first area 81) are exposed on both sides of the Y direction. The portions exposed from the intermediate plate 52 at both ends of the actuator plate 53 in the Y direction function as the pressure-bonding areas of the flexible printed circuit boards 100 and 101. In addition, the intermediate plate 52 may be formed of a material other than a piezoelectric material (for example, a non-conductive material such as polyimide or alumina). The connecting hole 130 and the through hole 150 are formed in the intermediate plate 52.
[0101] The communicating hole 130 overlaps with the through-portion 75b of each discharge channel 75 when viewed from above. The communicating hole 130 is connected to the through-portion 75b of the corresponding discharge channel 75 on the surface side of the actuator plate 53. The communicating hole 130 is formed in an oblong shape with the Y direction as the length direction. The dimension of the communicating hole 130 in the X direction is wider than the through-portion 75b. However, the dimension of the communicating hole 130 in the X direction may be shorter than the through-portion 75b.
[0102] The through holes 150 overlap with the through portions 76a of the non-ejection channels 76 in a plan view. The through holes 150 communicate with the inside of the through portions 76a of the corresponding non-ejection channels 76 on the surface side of the actuator plate 53.
[0103] Fig. 9 It is a bottom view of the intermediate plate and the actuator plate of the first embodiment.
[0104] like Fig. 9 As shown, the through hole 150 is arranged on the inner side of the non-ejection channel 76 in the X direction in a plan view than the inner surface 76c extending in the Y direction. The through hole 150 as a whole overlaps with the non-ejection channel 76 in a plan view. The through hole 150 is arranged between the through portions 75b of each of a pair of ejection channels 75 (the first ejection channel and the second ejection channel) adjacent to each other in the X direction. The through hole 150 is arranged on the inner side of the Y direction than both ends of the through portions 75b of each of a pair of ejection channels 75 adjacent to each other in the X direction. In the present embodiment, the through hole 150 is formed into a rectangular shape in a plan view that is smaller than the non-ejection channel 76 in the X direction and smaller than the through portion 75b of the ejection channel 75 in the Y direction. The through hole 150 is arranged between the centers of each of the pair of ejection channels 75 in the Y direction in a plan view.
[0105] like Figure 3 and Figure 4 As shown, in the middle plate 52, the area where the communication holes 130 are arranged in the X direction constitutes the communication areas 135 and 136. In the present embodiment, the communication areas 135 and 136 are the communication A area 135 overlapping with the channel A column 61 and the communication B area 136 overlapping with the channel B column. The communication areas 135 and 136 are arranged at intervals in the Y direction.
[0106] like Figure 4 As shown in FIG. 1 , the nozzle plate 51 is bonded to the surface of the intermediate plate 52. The width of the nozzle plate 51 in the Y direction is equal to that of the intermediate plate 52. In the present embodiment, the nozzle plate 51 is formed of a stainless metal material (stainless steel or Ni-Pd, etc.). However, in addition to metal materials, the nozzle plate 51 may also be a single-layer structure or a laminated structure using a resin material such as polyimide, or glass, silicon, etc.
[0107] Two nozzle rows (a nozzle A row 141 and a nozzle B row 142 ) extending in the X direction are formed in the nozzle plate 51 at intervals in the Y direction.
[0108] Each nozzle row 141, 142 has a plurality of nozzle holes (nozzle A hole 145 and nozzle B hole 146) that penetrate the nozzle plate 51 in the Z direction. Each nozzle hole 145, 146 is arranged at intervals in the X direction. Each nozzle hole 145, 146 is formed in a tapered shape, for example, in which the inner diameter gradually decreases from the back side toward the front side. The maximum inner diameter of each nozzle hole 145, 146 is larger than the width of the ejection channel 75 in the Y direction, and smaller than the width of the communication hole 130 in the Y direction.
[0109] like Figure 6 and Figure 7As shown, the nozzle A holes 145 are connected to the central parts of the ejection channels 75 of the channel A row 61 in the Y direction through the connecting holes 130 connected to the A region 135. The nozzle B holes 146 are connected to the central parts of the ejection channels 75 of the channel B row 62 in the Y direction through the connecting holes 130 connected to the B region 136. The nozzle plate 51 does not have a hole connected to the through hole 150 of the intermediate plate 52, and the through hole 150 is blocked from the surface side.
[0110] <Head chip manufacturing method>
[0111] A method for manufacturing the head chip 50 of the present embodiment will be described. The method for manufacturing the head chip of the present embodiment includes a first bonding step, a first inspection step, a through-hole forming step, a second bonding step, and a second inspection step.
[0112] Figures 10 to 12 is a diagram for explaining a method for manufacturing a head chip according to a first embodiment, Figure 8 A fairly cross-sectional view.
[0113] like Fig.10 As shown in FIG. 1 , in the first joining step, the intermediate plate 52 is overlapped with the actuator plate 53 in the Z direction and joined. For example, the actuator plate 53 and the intermediate plate 52 are joined by an adhesive. In the first joining step, the intermediate plate 52 joined to the actuator plate 53 does not have both the communication hole 130 and the through hole 150. Figures 10 to 12 In each of the drawings, illustration of the individual electrodes 97 formed on the inner surface 76c of the non-ejection channel 76 is omitted.
[0114] Next, in the first inspection process, a poor joint at the joint portion between the actuator plate 53 and the intermediate plate 52 is detected. The poor joint to be detected is a leakage path connecting the ejection channel 75 and the non-ejection channel 76. In the first inspection process, each ejection channel 75 is evacuated to determine whether there is a leak at this time. If there is a leakage path connecting the ejection channel 75 and the non-ejection channel 76, gas flows from the non-ejection channel 76 opened on the side of the actuator plate 53 through the leakage path into the ejection channel 75, so that the poor joint can be detected.
[0115] Then, if Fig.11 As shown, in the through hole forming step, the communicating hole 130 and the through hole 150 are formed in the intermediate plate 52 with the object having undergone the first inspection step as the object. At this time, the through hole 150 is formed on the inner side in the X direction of the inner surface 76c extending in the Y direction of the non-discharge channel 76. For example, in the through hole forming step, the communicating hole 130 and the through hole 150 are formed in the intermediate plate 52 using a laser.
[0116] Then, if Fig.12As shown, in the second bonding step, the nozzle plate 51 formed with the nozzle holes 145 and 146 is overlapped and bonded to the middle plate 52 on the side opposite to the actuator plate 53. For example, the middle plate 52 and the nozzle plate 51 are bonded by an adhesive. By bonding the nozzle plate 51 to the middle plate 52, the nozzle holes 145 and 146 are connected to the communication hole 130, and the through hole 150 is blocked by the nozzle plate 51.
[0117] Next, in the second inspection process, the poor joining of the joint portion between the intermediate plate 52 and the nozzle plate 51 is detected. The poor joining to be detected is a leakage path connecting the connecting hole 130 and the through hole 150. In the second inspection process, each ejection channel 75 is evacuated with the nozzle holes 145 and 146 blocked, and it is determined whether there is leakage at this time. The nozzle holes 145 and 146 are blocked by overlapping a jig or the like not shown on the side opposite to the intermediate plate 52 with respect to the nozzle plate 51. If there is a leakage path connecting the connecting hole 130 and the through hole 150, the gas flows from the non-ejection channel 76 opened on the side of the actuator plate 53 through the through hole 150, the leakage path and the connecting hole 130 into the ejection channel 75, so that the poor joining can be detected.
[0118] Then, the flexible printed circuit boards 100 and 101 are crimped onto the object that has undergone the second inspection step, thereby completing the head chip 50 .
[0119] In addition, in the present embodiment, the intermediate plate 52 without the communication hole 130 is used in the first bonding step, but the present invention is not limited thereto. That is, the intermediate plate 52 with the communication hole 130 may also be used in the first bonding step. In this case, in the first inspection step, the communication hole 130 is blocked by using a jig in the same manner as in the second inspection step, so that the leakage path connecting the discharge channel 75 and the non-discharge channel 76 can be detected.
[0120] <Printer Operation>
[0121] Next, a case where characters, graphics, etc. are recorded on a recording medium P using the printer 1 configured as described above will be described below.
[0122] In addition, as the initial state, it is assumed that Figure 1 The four ink tanks 4 shown are filled with inks of different colors. The inks in the ink tanks 4 are filled into the inkjet head 5 via the ink circulation mechanism 6 .
[0123] When the printer 1 is operated in this initial state, the recording medium P is sandwiched by the rollers 11 and 12 of the transport mechanisms 2 and 3 and transported toward the +X side. At the same time, the carriage 29 moves in the Y direction, and the inkjet head 5 mounted on the carriage 29 reciprocates in the Y direction.
[0124] While the inkjet heads 5 are reciprocating, ink is appropriately ejected from each inkjet head 5 toward the recording medium P. Thus, characters, images, and the like can be recorded on the recording medium P.
[0125] Here, the operation of each inkjet head 5 will be described in detail below.
[0126] In the circulation type side-shooting inkjet head 5 of this embodiment, first, Figure 2 The pressure pump 24 and the suction pump 25 shown in the figure operate, so that the ink circulates in the circulation flow path 23. In this case, the ink circulating in the ink supply tube 21 is supplied to each ejection channel 75 through the inlet common ink chamber 120 and the inlet slit 125. The ink supplied to each ejection channel 75 flows in the Y direction in each ejection channel 75. Then, the ink is discharged to the outlet common ink chamber 121 through the outlet slit 126, and then returns to the ink tank 4 through the ink discharge tube 22. In this way, the ink can be circulated between the inkjet head 5 and the ink tank 4.
[0127] Then, if the slide 29 (refer to Figure 1 ) moves and the inkjet head 5 starts to reciprocate, then the driving voltage is applied to the electrodes 95 and 97 via the flexible printed substrates 100 and 101. At this time, the individual electrode 97 is set to the driving potential Vdd, and the common electrode 95 is set to the reference potential GND, and the driving voltage is applied between each electrode 95 and 97. In this way, thickness slip deformation occurs on the two driving walls 70 that define the ejection channel 75, so that the two driving walls 70 are deformed in a manner that protrudes toward the non-ejection channel 76 side. That is, by applying a voltage between each electrode 95 and 97, the driving wall 70 is bent and deformed in a V-shape with the middle part in the Z direction as the center. As a result, the volume of the ejection channel 75 increases. Then, due to the increase in the volume of the ejection channel 75, the ink stored in the inlet common ink chamber 120 is guided into the ejection channel 75 through the inlet slit 125. The ink guided into the inside of the ejection channel 75 becomes a pressure wave and propagates inside the ejection channel 75. When the pressure wave reaches the nozzle holes 145 and 146, the voltage applied between the electrodes 95 and 97 is set to zero. As a result, the drive wall 70 is restored, and the volume of the ejection channel 75 that has been temporarily increased returns to the original volume. Through this action, the pressure inside the ejection channel 75 increases, and the ink is pressurized. As a result, the droplet-shaped ink is ejected to the outside through the connecting hole 130 and the nozzle holes 145 and 146, so that characters or images can be recorded on the recording medium P as described above.
[0128] As described above, the head chip 50 of the present embodiment includes: the middle plate 52 having the communication hole 130 communicating with the ejection channel 75 and the through hole 150 communicating with the non-ejection channel 76; and the nozzle plate 51, which is superimposed on the middle plate 52 in a state where the through hole 150 is blocked, and has the nozzle holes 145 and 146 communicating with the communication hole 130 and ejecting the ink contained in the ejection channel 75 formed at the position corresponding to the ejection channel 75. Moreover, the non-ejection channel 76 is connected to the outside, and the through hole 150 is provided on the inner side of the X direction relative to the inner surface 76c of the non-ejection channel 76 extending in the Y direction in a plan view. According to this configuration, the poorly joined portion between the middle plate 52 and the nozzle plate 51 is connected to the through hole 150 of the middle plate 52, so that the communication hole 130 and the through hole 150 of the middle plate 52 are connected via the poorly joined portion. As a result, the ejection channel 75 and the non-ejection channel 76 are connected. Since the non-ejection channel 76 communicates with the outside of the head chip 50 , the presence of a defective bonding portion can be detected by detecting leakage when the nozzle holes 145 , 146 are blocked and the ejection channel 75 is evacuated.
[0129] Here, the individual electrode 97 is provided on the inner surface 76c extending in the Y direction of the non-ejection channel 76. In the present embodiment, the through hole 150 is provided on the inner side in the X direction relative to the inner surface 76c extending in the Y direction of the non-ejection channel 76 in a plan view, so that when the through hole 150 is formed in the state where the actuator plate 53 is superimposed with the intermediate plate 52, interference between the means such as a laser forming the through hole 150 and the individual electrode 97 can be suppressed.
[0130] By doing so, the reliability degradation caused by the cracks of the individual electrodes 97 that may occur when the through holes 150 are formed in the intermediate plate 52 is suppressed, and the bonding failure between the intermediate plate 52 and the nozzle plate 51 is detected, thereby suppressing the degradation of the printing quality caused by the bonding failure.
[0131] In addition, the manufacturing method of the head chip 50 of the present embodiment includes: a through hole forming step of forming the through hole 150 on the inner side of the inner surface 76c of the non-ejection channel 76 extending in the Y direction in the middle plate 52 superimposed and bonded to the actuator plate 53 in the X direction in a plan view; and a second bonding step of superimposing and bonding the nozzle plate 51 on the side opposite to the actuator plate 53 with respect to the middle plate 52 to block the through hole 150. According to this manufacturing method, the through hole 150 can be formed at a desired position relative to the non-ejection channel 76 by the through hole forming step regardless of the alignment accuracy of the actuator plate 53 and the middle plate 52. Therefore, in the head chip 50 including the middle plate 52 in which the through hole 150 communicating with the non-ejection channel 76 is formed, it is possible to improve the yield rate during manufacturing.
[0132] In addition, the through hole 150 is provided between the through portions 75b of a pair of adjacent ejection channels 75 in a plan view. According to this configuration, the through hole 150 is provided on a path extending linearly from one communication hole 130 toward the other communication hole 130 in the joint portion between the intermediate plate 52 and the nozzle plate 51. Thus, it is possible to detect a poor joint between the intermediate plate 52 and the nozzle plate 51, particularly a poor joint that is likely to cause the ejection channels 75 to communicate with each other.
[0133] The through hole 150 is provided on the inner side in the Y direction than both ends of each through portion 75b of a pair of adjacent discharge channels 75 in a plan view. According to this configuration, compared with a configuration in which the through hole is provided from one outer side to the other outer side along the Y direction than the through portion 75b of the discharge channel 75, the formation range of the through hole 150 is reduced, and the processing time required to form the through hole 150 can be shortened.
[0134] The through hole 150 is provided between the centers of the through portions 75b of a pair of adjacent ejection channels 75 in the Y direction in a plan view. According to this configuration, the through hole 150 is provided on the shortest path connecting the communication holes 130 in the opposing portions of the intermediate plate 52 and the nozzle plate 51. Thus, a poor connection that may cause the ejection channels 75 to communicate with each other can be detected at a location where hydraulic pressure is most likely to be applied.
[0135] Furthermore, the inkjet head 5 and the printer 1 of the present embodiment include the head chip 50 that suppresses the reduction in printing quality due to bonding failure as described above, and thus it is possible to provide the inkjet head 5 and the printer 1 with excellent printing quality.
[0136] [Second Embodiment]
[0137] <Head chip>
[0138] A head chip 50 according to the second embodiment will be described.
[0139] Fig.13 It is a bottom view of the actuator plate of the second embodiment.
[0140] like Fig.13As shown, in this embodiment, the through hole 250 is provided between the through parts 75b of each of a pair of ejection channels 75 adjacent in the X direction, which is different from the first embodiment. The through hole 250 protrudes further outward in the Y direction than both ends of the through parts 75b of each of the pair of ejection channels 75 sandwiching the through hole 250 when viewed from above. In other words, the through hole 250 is arranged from one outer side to the other outer side in the Y direction than the through parts 75b of each of the pair of ejection channels 75. The through hole 250 is provided on the inner side of the X direction than the inner surface 76c of the non-ejection channel 76 extending in the Y direction when viewed from above. The through hole 250 as a whole overlaps with the non-ejection channel 76 when viewed from above. In this embodiment, the through hole 250 is formed into a rectangular shape when viewed from above, which is smaller than the non-ejection channel 76 in the X direction and larger than the through part 75b of the ejection channel 75 in the Y direction. In addition, the other configurations are the same as those of the first embodiment.
[0141] Thus, in the present embodiment, the through hole 250 is provided over the entire length in the Y direction between the through portions 75b of a pair of adjacent ejection channels 75 in a plan view. According to this configuration, the through hole 250 is provided over the entire path extending straightly from one communication hole 130 toward the other communication hole 130 in the opposing portions of the intermediate plate 52 and the nozzle plate 51. Thus, it is possible to more reliably detect a poor connection that easily causes the ejection channels 75 to communicate with each other.
[0142] [Third Embodiment]
[0143] <Head chip>
[0144] A head chip 50 according to the third embodiment will be described.
[0145] Fig.14 It is a bottom view of the actuator plate of the third embodiment.
[0146] like Fig.14 As shown, this embodiment is different from the second embodiment in that a connection groove 251 for connecting a pair of through holes 250 adjacent in the X direction is formed in the intermediate plate 52. The other configurations are the same as those of the second embodiment.
[0147] The connection groove 251 is formed on the surface of the middle plate 52. The connection groove 251 is formed in a manner that does not penetrate the middle plate 52. The connection groove 251 extends linearly along the X direction on the outer side of the Y direction relative to the through portion 75b of the ejection channel 75. The connection groove 251 extends in a manner that connects the ends of a pair of adjacent through holes 250 (the first through hole and the second through hole) to each other. One connection groove 251 is connected to each end of each through hole 250. As a result, the concave portion formed by the through hole 250 and the connection groove 251 extends in a zigzag shape when viewed from above so as to avoid the ejection channel 75 one by one. For example, the connection groove 251 is formed using a laser in the same manner as the through hole 250. In this case, the output of the laser when forming the connection groove 251 is made smaller than the output of the laser when forming the through hole 250, so that the connection groove 251 that does not penetrate the middle plate 52 can be formed.
[0148] Thus, in the present embodiment, the connection groove 251 connecting a pair of through holes 250 adjacent in the X direction is formed on the surface of the intermediate plate 52. According to this configuration, the connection groove 251 is formed in the same manner as the through hole 250 so as not to penetrate the intermediate plate 52, so that the pair of through holes 250 and the connection groove 251 can be formed in series. Thus, compared with the case where the through holes 250 communicating with the adjacent pair of non-discharge channels 76 are formed separately, the processing time of the intermediate plate 52 can be shortened.
[0149] [Fourth Embodiment]
[0150] <Head chip>
[0151] A head chip 50 according to the fourth embodiment will be described.
[0152] Fig.15 It is a bottom view of the actuator plate of the fourth embodiment.
[0153] like Fig.15 As shown, this embodiment is different from the first embodiment in that a plurality of through holes 350 communicating with one non-discharge passage 76 are formed in the intermediate plate 52. The other configurations are the same as those of the first embodiment.
[0154] The middle plate 52 is formed with a through hole group 351. When viewed from the X direction, the through hole group 351 has a plurality of (two in the illustrated example) through holes 350 disposed between each of a pair of adjacent discharge channels 75. The through hole group 351 is formed in a region extending from one outer side to the other outer side in the Y direction than the through portion 75b of each of the pair of discharge channels 75. That is, when viewed from above, at least one pair of through holes 350 in the through hole group 351 is disposed on the outer side in the Y direction than both ends of the through portion 75b of each of the pair of discharge channels 75 sandwiching the through hole group 351. However, all the through holes in the through hole group may be disposed on the inner side in the Y direction than both ends of the through portion 75b of each of the pair of discharge channels 75 sandwiching the through hole group when viewed from above. Each through hole 350 is disposed on the inner side in the X direction than the inner surface 76c of the non-discharge channel 76 extending in the Y direction when viewed from above. In the present embodiment, the through hole 350 is formed in a rectangular shape in a plan view that is smaller than the non-discharge channel 76 in the X direction. In addition, in the example shown in the figure, the through hole 350 is formed to avoid the center of each of the pair of discharge channels 75 in the Y direction in a plan view, but the arrangement of the through hole 350 is not limited to this. That is, one through hole 350 of the through hole group 351 can also be set between the centers of each of the pair of discharge channels 75 in the Y direction in a plan view.
[0155] Thus, in the present embodiment, a plurality of through holes 350 communicating with one non-ejection channel 76 are formed in the middle plate 52. According to this configuration, a plurality of through holes 350 communicating with one non-ejection channel 76 are formed in a dispersed manner, so that, compared with a configuration in which a single through hole is formed, it is possible to suppress a reduction in the formation range of the through holes 350 and ensure an area of the joint portion between the middle plate 52 and the nozzle plate 51. Therefore, it is possible to suppress a decrease in the joint strength between the middle plate 52 and the nozzle plate 51 caused by forming the through holes 350.
[0156] In addition, the technical scope of the present disclosure is not limited to the above-mentioned embodiments, and various modifications can be added without departing from the spirit of the present disclosure.
[0157] For example, in the above-mentioned embodiment, the inkjet printer 1 is described as an example of the liquid jet recording apparatus, but it is not limited to a printer and may be, for example, a facsimile machine or a print-on-demand machine.
[0158] In the above embodiment, an example is given of a configuration in which the inkjet head moves relative to the recording medium during printing (so-called a shuttle machine), but the invention is not limited to this configuration. The configuration involved in the present disclosure may also be adopted in a configuration in which the recording medium moves relative to the inkjet head while the inkjet head is fixed (so-called a fixed head machine).
[0159] In the above-mentioned embodiment, the configuration in which the Z direction coincides with the vertical direction has been described, but the present invention is not limited to this configuration, and the Z direction may be arranged along the horizontal direction.
[0160] In the above embodiment, the side-shooting head chip is described, but the present invention is not limited thereto. For example, the present disclosure may be applied to a so-called edge-shooting head chip that ejects ink from the end of the ejection channel in the extending direction.
[0161] In the above embodiment, the recording medium P is described as paper, but the present invention is not limited to this configuration. The recording medium P is not limited to paper, but may be a metal material, a resin material, or a food material.
[0162] In the above embodiment, the configuration in which the liquid jet head is mounted on the liquid jet recording device is described, but the invention is not limited to this configuration. That is, the liquid ejected from the liquid jet head is not limited to the liquid falling on the recording medium, but may also be, for example, a liquid medicine mixed in a preparation, a food additive such as a seasoning or a fragrance added to food, or an aromatic sprayed into the air.
[0163] In the above embodiment, two channel columns are provided, but the number of channel columns is not particularly limited.
[0164] In the above embodiment, the through holes 150, 250, 350 of the intermediate plate 52 are formed in a rectangular shape in plan view, but the present invention is not limited thereto. For example, the through holes may be formed in a circular shape or an oval shape.
[0165] Furthermore, components in the above-described embodiments may be appropriately replaced with well-known components without departing from the spirit of the present disclosure, and the above-described embodiments may be appropriately combined.
[0166] [Explanation of symbols]
[0167] 1 printer (liquid jet recording device); 5 inkjet head (liquid jet head); 50 head chip; 51 nozzle plate (jet hole plate); 52 intermediate plate; 53 actuator plate; 75 ejection channel (jet channel); 76 non-ejection channel (non-jet channel); 76c inner surface; 130 connecting hole; 145, 146 nozzle hole (jet hole); 150, 250, 350 through hole; 251 connecting groove.
Claims
1. A head chip, comprising: an actuator plate having ejection channels and non-ejection channels alternately arranged along a second direction intersecting the first direction and extending along the first direction; an intermediate plate which is overlapped with respect to the actuator plate along a third direction orthogonal to the first direction and the second direction and is formed with a communication hole communicating with the injection channel and a through hole communicating with the non-injection channel; as well as an injection orifice plate, which is superposed on the side opposite to the actuator plate in the third direction with respect to the intermediate plate in a state of blocking the through hole, and has an injection hole formed at a position corresponding to the injection channel, which is connected to the communication hole and injects the liquid contained in the injection channel, The non-injection channel is communicated with the outside, The through hole is provided on the inner side in the second direction relative to the inner surface of the non-ejection channel extending in the first direction when viewed from the third direction.
2. The head chip according to claim 1, wherein: The injection channel includes a first injection channel and a second injection channel adjacent to each other in the second direction. The through hole is provided between the first injection channel and the second injection channel when viewed from the third direction.
3. The head chip according to claim 2, wherein: The through hole is provided on the inner side in the first direction relative to both ends of the first injection channel and the second injection channel when viewed from the third direction.
4. The head chip according to claim 3, wherein: The through hole is provided between centers of the first injection channel and the second injection channel in the first direction when viewed from the third direction.
5. The head chip according to claim 2, wherein: The through hole is provided over the entire length in the first direction between the first injection channel and the second injection channel when viewed from the third direction.
6. The head chip according to claim 2, wherein: The non-ejection channel includes a first non-ejection channel and a second non-ejection channel adjacent to each other in the second direction. The through hole has: a first through hole communicating with the first non-injection channel, and a second through hole communicating with the second non-injection channel, A connection groove connecting the first through hole and the second through hole is formed on a bonding surface of the intermediate plate with the injection hole plate.
7. The head chip according to any one of claims 1 to 6, wherein: The middle plate has a plurality of through holes formed therein that communicate with one of the non-injection passages. 8 . A liquid ejecting head comprising the head chip according to claim 1 . 9 . A liquid jet recording apparatus comprising the liquid jet head according to claim 8 .
10. A method for manufacturing a head chip, comprising: The through hole forming step is to form a through hole in the intermediate plate superimposed and bonded to the actuator plate, wherein: The actuator plate is provided with injection channels and non-injection channels extending in the first direction alternately arranged in a second direction intersecting the first direction, the intermediate plate is overlapped and joined with respect to the actuator plate in a third direction orthogonal to the first direction and the second direction, and the through hole is formed on the inner side of the non-injection channel extending in the first direction, as viewed from the third direction; as well as In the joining process, an injection hole plate having an injection hole for ejecting the liquid contained in the injection channel is overlapped and joined with the intermediate plate having a connecting hole connected to the injection channel and the injection hole on the side opposite to the actuator plate to block the through hole.
Citation Information
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