Transfer method and display panel

Abstract

The present application provides a transfer method and a display panel, comprising: providing a transfer substrate, comprising a plurality of first adhesive blocks arranged at intervals and a second adhesive block arranged around the plurality of first adhesive blocks, the debonding temperature of the first adhesive block being lower than the debonding temperature of the second adhesive block, and the bonding temperature of the first adhesive block being lower than the bonding temperature of the second adhesive block; providing a temporary carrier plate, comprising a plurality of light emitting diodes; bonding the transfer substrate and the temporary carrier plate, and transferring the plurality of light emitting diodes to the transfer substrate; providing a circuit substrate, bonding the transfer substrate and the circuit substrate, and transferring the plurality of first adhesive blocks together with the plurality of light emitting diodes to the circuit substrate; heating and reflowing the circuit substrate, and melting the plurality of first adhesive blocks to cover the electrodes of the plurality of light emitting diodes and the plurality of receiving terminals; the debonding temperature of the first adhesive block being equal to the bonding temperature between the electrodes of the plurality of light emitting diodes and the plurality of receiving terminals on the circuit substrate; and the temperature of the heating and reflowing being lower than the bonding temperature.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor technology, and specifically relates to a transfer method and a display panel. Background Technology

[0002] Micro-LED is a new generation of display technology that offers higher photoelectric efficiency, higher brightness, higher contrast, and lower power consumption compared to existing LCD displays. It can also be combined with flexible panels to achieve flexible displays.

[0003] Micro-LEDs are transferred to a driver backplane using transfer technology to form a display panel. During the Micro-LED transfer process, a transfer module is often used to pick up the Micro-LED from the transient substrate and transfer it to the transfer module. Then, the Micro-LED is soldered to the circuit on the driver backplane.

[0004] The aforementioned transfer module uses polydimethylsiloxane (PDMS) bonding adhesive, which is extremely expensive and requires very high material properties. There are very few commercially available materials that meet these requirements, making them difficult to manufacture. Furthermore, transfer modules using bonding adhesive systems are generally limited to planar transfer modules due to the manufacturing process. Under the temperature conditions of the transferred Micro-LED and circuit soldering, the bonding adhesive softens and flows due to temperature intolerance, dripping onto the driver backplane side and hindering subsequent processes. Summary of the Invention

[0005] The purpose of this invention is to provide a transfer method and a display panel.

[0006] To address the above problems, the present invention provides a transfer method for transferring light-emitting diodes, the transfer method comprising:

[0007] A transfer substrate is provided, the transfer substrate including a plurality of first adhesive blocks spaced apart and a second adhesive block disposed around the plurality of adhesive blocks, wherein the debonding temperature of each first adhesive block is lower than the debonding temperature of the second adhesive block, and the bonding temperature of each first adhesive block is lower than the bonding temperature of the second adhesive block.

[0008] A temporary carrier board is provided, the temporary carrier board including a plurality of light-emitting diodes;

[0009] The transfer substrate and the temporary carrier are bonded together, the plurality of light-emitting diodes and the plurality of first adhesive blocks are bonded together, and the plurality of light-emitting diodes are transferred onto the transfer substrate;

[0010] providing a circuit substrate, bonding the transfer substrate and the circuit substrate, bonding electrodes of the plurality of light emitting diodes and a plurality of receiving terminals on the circuit substrate, and transferring the plurality of first adhesive blocks to the circuit substrate together with the plurality of light emitting diodes, and locating the plurality of first adhesive blocks on a side of the plurality of light emitting diodes away from the circuit substrate; and

[0011] re-flowing the circuit substrate to melt the plurality of first adhesive blocks and cover the electrodes of the plurality of light emitting diodes and the plurality of receiving terminals;

[0012] wherein a debonding temperature of each first adhesive block is equal to a bonding temperature between the electrodes of the plurality of light emitting diodes and the plurality of receiving terminals on the circuit substrate, and a re-flowing temperature is less than the bonding temperature.

[0013] As an optional technical solution, the bonding between the electrodes of the plurality of light emitting diodes and the plurality of receiving terminals on the circuit substrate is a gold-indium eutectic bonding, and a bonding temperature of the gold-indium eutectic bonding is 160 °C.

[0014] As an optional technical solution, the method further comprises: providing a quartz substrate, the quartz substrate comprising a plurality of first regions arranged at intervals and a second region surrounding the plurality of first regions;

[0015] printing or coating a first adhesive resin into the corresponding plurality of first regions to form a plurality of first adhesive blocks; and

[0016] printing or coating a second adhesive resin into the corresponding second region to form a second adhesive block.

[0017] As an optional technical solution, the first adhesive resin and the second adhesive resin are homologous resins, and a molecular weight of the first adhesive resin and a molecular weight of the second adhesive resin are different.

[0018] As an optional technical solution, the first adhesive resin and the second adhesive resin are polymethyl methacrylate resin, polycarbonate resin, polyethylene resin, polyacrylic acid resin, polysiloxane resin, or polyurethane resin.

[0019] As an optional technical solution, a film layer thickness of the first adhesive block is equal to a film layer thickness of the second adhesive block.

[0020] As an optional technical solution, the method further comprises:

[0021] providing a first mask plate, the first mask plate comprising a plurality of first openings corresponding to the plurality of first regions;

[0022] stacking the first mask plate above the quartz substrate; and

[0023] printing or coating the first adhesive resin into the plurality of first openings, and curing to form a plurality of first adhesive blocks.

[0024] As an optional technical solution, the method further comprises:

[0025] providing a second mask plate, wherein the second mask plate comprises second openings corresponding to the second regions;

[0026] stacking the second mask plate above the quartz substrate; and

[0027] printing or coating the second adhesive resin into the second openings, and curing to form a second adhesive block;

[0028] wherein the second adhesive block is an integral adhesive layer arranged around the plurality of first adhesive blocks.

[0029] As an optional technical solution, the bonding temperature of each first adhesive block is 130 DEG C, and the debonding temperature of each first adhesive block is 160 DEG C; the bonding temperature of the second adhesive block is 160 DEG C, and the debonding temperature of the second adhesive block is greater than 190 DEG C.

[0030] The application also provides a display panel, which comprises a circuit substrate and a plurality of light emitting diodes transferred onto the circuit substrate, wherein the plurality of light emitting diodes are transferred onto the circuit substrate by using the above-mentioned transfer method.

[0031] Compared with the prior art, the application provides a transfer method and a display panel, wherein adhesive blocks with different temperature tolerances are prepared on a quartz substrate, and through the partition design of the adhesive blocks, on one hand, the adhesive blocks are limited from flowing and dropping due to the temperature in the mass soldering process; on the other hand, after the chips are transferred by using the adhesive blocks with low bonding temperature and debonding temperature, the temperature of the adhesive blocks with low bonding temperature and debonding temperature is not affected in the mass soldering process, so that the light emitting diodes are transferred to the back plate side, and the packaging of the light emitting diodes is realized at the same time; and through multiple hot pressing, the flatness of the adhesive blocks above the light emitting diodes is very high.

[0032] The application will be described in detail below with reference to the drawings and specific embodiments, but is not limited to the application. BRIEF DESCRIPTION OF DRAWINGS

[0033] In order to more clearly illustrate the specific embodiments of the application or the technical solutions in the prior art, the drawings needed to be used in the specific embodiments or the prior art description will be briefly introduced below. Obviously, the drawings in the following description are some embodiments of the application, and other drawings can be obtained by those skilled in the art without creative labor.

[0034] Figure 1 A flowchart of a transfer method provided in an embodiment of the present invention.

[0035] Figure 2 This is a top view schematic diagram of a transfer substrate provided in an embodiment of the present invention.

[0036] Figure 3 for Figure 2 A cross-sectional schematic diagram of the transfer substrate fabrication process.

[0037] Figure 4 This is a top view schematic diagram of a transfer substrate provided in another embodiment of the present invention.

[0038] Figure 5 This is a cross-sectional schematic diagram of the fabrication process of transferring a light-emitting diode to a driving backplane according to an embodiment of the present invention.

[0039] Figure 6 This is a cross-sectional schematic diagram of a display panel provided in one embodiment of the present invention. Detailed Implementation

[0040] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to embodiments and accompanying drawings. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0041] In the description of this invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0042] like Figure 1 As shown, one of the objectives of this invention is to provide a transfer method 100 for transferring micro-light-emitting diodes, comprising:

[0043] A transfer substrate is provided, the transfer substrate including a plurality of first adhesive blocks spaced apart and a second adhesive block disposed around the plurality of adhesive blocks, wherein the debonding temperature of each first adhesive block is lower than the debonding temperature of the second adhesive block, and the bonding temperature of each first adhesive block is lower than the bonding temperature of the second adhesive block.

[0044] A temporary carrier board is provided, the temporary carrier board comprising a plurality of light-emitting diodes;

[0045] bonding the transfer substrate and the temporary carrier, bonding the plurality of light emitting diodes and the plurality of first adhesive blocks, transferring the plurality of light emitting diodes to the transfer substrate;

[0046] providing a circuit substrate, bonding the transfer substrate and the circuit substrate, bonding the electrodes of the plurality of light emitting diodes and a plurality of receiving terminals on the circuit substrate, and transferring the plurality of first adhesive blocks along with the plurality of light emitting diodes to the circuit substrate on a side of the plurality of light emitting diodes away from the circuit substrate; and

[0047] reflowing the circuit substrate to melt the plurality of first adhesive blocks and coat the electrodes of the plurality of light emitting diodes and the plurality of receiving terminals;

[0048] wherein the debonding temperature of each first adhesive block is equal to a bonding temperature between the electrodes of the plurality of light emitting diodes and the plurality of receiving terminals on the circuit substrate, and the reflowing temperature is less than the bonding temperature.

[0049] In the transfer method 100, the bonding temperature corresponding to the first adhesive block refers to that when the external temperature reaches the corresponding bonding temperature, the first adhesive block softens and exhibits adhesion, and the transfer substrate and the micro light emitting diode are adhered; wherein when the external temperature is lower than the bonding temperature, the first adhesive block does not soften and does not exhibit adhesion.

[0050] The debonding temperature corresponding to the first adhesive block refers to that when the temperature is greater than the debonding temperature, the first adhesive block softens and exhibits reduced adhesion, and the transfer substrate is separated; wherein when the debonding temperature of the first adhesive block decreases to the bonding temperature of the first adhesive block, the first adhesive block re-adheres to the light emitting diode.

[0051] It should be noted that the debonding temperature corresponding to the first adhesive block is higher than the bonding temperature, and the debonding temperature of the first adhesive block is close to the bonding temperature of the electrodes and the receiving terminals of the light emitting diode, about 160°C; wherein the bonding temperature is, for example, 130°C.

[0052] In addition, the bonding temperature corresponding to the second adhesive block refers to that when the external temperature reaches the corresponding bonding temperature, the second adhesive block softens and exhibits adhesion, and the transfer substrate is adhered; wherein when the external temperature is lower than the bonding temperature, the second adhesive block does not soften and does not exhibit adhesion.

[0053] The debonding temperature corresponding to the second adhesive block refers to that when the temperature is greater than the debonding temperature, the second adhesive block softens and exhibits reduced adhesion, and the transfer substrate is separated.

[0054] It is to be noted that the debonding temperature of the second adhesive block is higher than the bonding temperature. Preferably, the bonding temperature of the second adhesive block is 160°C, and the corresponding debonding temperature of the second adhesive block is 190°C. During the bonding of the electrode of the light emitting diode and the receiving terminal, the second adhesive block exhibits adhesion and adheres to the transfer substrate without falling off the surface of the circuit substrate, thereby avoiding affecting the subsequent process.

[0055] Further, the glass transition temperature of the first adhesive block is 60.8°C, the decomposition temperature is 350°C, and the viscosity is 2.0 pa.s; the glass transition temperature of the second adhesive block is 78°C, the decomposition temperature is 475°C, and the viscosity is 3.2 pa.s.

[0056] The transfer method 100 uses a transfer substrate including two different adhesive blocks, which can selectively transfer the light emitting diode to the circuit substrate. During the transfer process, the first adhesive block with a low debonding temperature is transferred to the circuit substrate together with the light emitting diode as the electrode of the light emitting diode is bonded to the receiving terminal of the circuit substrate. Subsequently, the first adhesive block is used to realize the encapsulation of the electrode of the light emitting diode and the receiving terminal of the circuit substrate by reflowing at a high temperature.

[0057] The transfer method 100 will be described in detail below in conjunction with Figures 2 to 5 Detailed description Figure 1

[0058] As shown in Figure 2 and Figure 3 The transfer substrate 200 includes a quartz substrate 210, which includes a plurality of first regions arranged at intervals and a second region surrounding the outside of the plurality of first regions. The plurality of first regions are provided with a plurality of first adhesive blocks 220, and the second region is provided with a second adhesive block 230. The second adhesive block 230, for example, covers the entire side surface of the quartz substrate 210, and the plurality of first adhesive blocks 220 are arranged at intervals.

[0059] The plurality of first adhesive blocks 220 and the second adhesive block 230 are formed in the plurality of first regions and the second region of the quartz substrate 210, for example, by printing or coating.

[0060] Specifically, a first mask 300 is provided, which includes a plurality of first openings 310 arranged at intervals, and the plurality of first openings 310 correspond to the plurality of first regions. The first mask 300 is laminated to the side surface of the quartz substrate 210. A first nozzle 500 is provided to spray the first adhesive resin into the first openings 310. After the first adhesive resin is cured, the plurality of first adhesive blocks 220 are formed.

[0061] ​The second mask 400 is provided, which comprises a plurality of second openings 410 arranged at intervals, the second openings 410 corresponding to the second regions; the second mask 400 is laminated to one side surface of the quartz substrate 210, and the second openings 410 are staggered with the plurality of first adhesive blocks 220; the second nozzle 600 is provided to spray the second adhesive resin into the second openings 410, and the second adhesive blocks 230 are formed after the second adhesive resin is cured.

[0062] It can be understood that the orthographic projection of the plurality of first openings 310 on the quartz substrate 210 defines a plurality of first regions; similarly, the orthographic projection of the second openings 410 on the quartz substrate 210 defines second regions.

[0063] In some embodiments of the present application, the first adhesive resin and the second adhesive resin are preferably homologous resins, wherein the molecular weight of the first adhesive resin and the molecular weight of the second adhesive resin are different, and further, the partial functional groups of the first adhesive resin and the partial functional groups of the second adhesive resin can also be different, so that the first adhesive resin and the second adhesive resin have obvious differences in bonding temperature and debonding temperature, meeting the needs of transferring light emitting diodes.

[0064] Preferably, the bonding temperature of the first adhesive block 220 is 130℃, and the debonding temperature of the first adhesive block 220 is 160℃; the bonding temperature of the second adhesive block 230 is 160℃, and the debonding temperature of the second adhesive block 230 is greater than 190℃.

[0065] When the first adhesive resin and the second adhesive resin are homologous resins, there is no obvious cross-sectional separation between the first adhesive block 220 and the second adhesive block 230, and in particular, the side surface of the first adhesive block 220 and the second adhesive block 230 away from the quartz substrate 210 can still obtain a relatively flat surface, which has obvious beneficial effects on the combination and picking up of the light emitting diode in the process of transferring the light emitting diode.

[0066] Preferably, the film thickness of the first adhesive block 220 is equal to the film thickness of the second adhesive block 230, forming the above-mentioned flat surface.

[0067] Preferably, the first adhesive resin and the second adhesive resin are polymethyl methacrylate resin, polycarbonate resin, polyethylene resin, polyacrylic acid resin, polysiloxane resin or polyurethane resin.

[0068] It should be noted that, Figure 3 The spraying order of the first adhesive resin and the second adhesive resin shown in the figure can be selected according to actual needs. Preferably, the first nozzle 500 and the second nozzle 600 can be two switchable nozzles provided on one spraying device.

[0069] In addition, the quartz substrate 210 can be surface treated before spraying the first adhesive resin and the second adhesive resin to increase the roughness of the surface of the quartz substrate 210, so that the first adhesive resin and the second adhesive resin can better contact the quartz substrate 210.

[0070] As shown in FIG. 2, in another embodiment of the present application, a transfer substrate 200' is provided, which is different from the transfer substrate 200 only in that each first adhesive block 210' has a larger size and is combined with a plurality of light emitting diodes, such as a pixel unit including red, green and blue light emitting diodes, and then is transferred to a circuit substrate. Figure 4 As shown in FIG. 3, the transfer substrate 200 is used to pick up a plurality of light emitting diodes 2000 on the temporary substrate 1000, and the light emitting diodes 2000 are, for example, micro / mini light emitting diodes. The process is as follows. Figure 5

[0071] The transfer substrate 200 and the temporary substrate 1000 are bonded, the transfer substrate 200 is heated by a transfer module to 130°C, the first adhesive block 220 becomes soft and exhibits adhesion, and then the first adhesive block 220 and the light emitting diodes 2000 are combined and adhered to each other, wherein the side of the first adhesive block 220 and the light emitting diodes 2000 without the electrode 2100 is adhered; the temporary substrate 1000 and the light emitting diodes 2000 are peeled off, and the light emitting diodes 2000 are transferred to the transfer substrate 200.

[0072] A circuit substrate 3000 is provided, which includes a plurality of receiving terminals 3100; the circuit substrate 3000 and the transfer substrate 200 are bonded; the plurality of receiving terminals 3100 and the plurality of electrodes 2100 on the light emitting diodes 2000 are one-to-one corresponding, and the receiving terminals 3100 and the electrodes 2100 are bonded by soldering and form electrical connection.

[0073] In this embodiment, gold-indium eutectic bonding is used between the receiving terminals 3100 and the electrodes 2100, and the bonding temperature of the gold-indium eutectic bonding is 160°C. The solder can be pre-applied on the side of the receiving terminals 3100, the electrodes 2100 and the solder and the receiving terminals 3100 are in contact with each other, the solder is heated to melt, and then the solder is cooled to solidify, so that the gold-indium eutectic bonding between the electrodes 2100 and the receiving terminals 3100 is achieved.

[0074] ​In the process of heating the electrode 2100 and the receiving terminal 3100 gold-indium eutectic bonding, since the bonding temperature of the first adhesive block 220 is 130℃, the debonding temperature is 160℃, and the bonding temperature of the second adhesive block 230 is 160℃, and the debonding temperature is 190℃; therefore, in the process of heating to the bonding temperature 160℃ of the gold-indium eutectic bonding, first, the first adhesive block 220 gradually softens to show viscosity near the corresponding bonding temperature 130℃, and forms a good adhesion between the light-emitting diode 2000 and the quartz substrate 210; second, the viscosity of the first adhesive block 220 decreases near the corresponding debonding temperature 160℃, and the adhesion between the light-emitting diode 2000 and the quartz substrate 210 decreases; finally, after the gold-indium eutectic bonding is completed, the temperature gradually decreases, and the first adhesive block 220 shows viscosity again near the corresponding bonding temperature 130℃, at this time, the surface energy of the first adhesive block 220 and the surface energy of the gallium nitride (GaN) on the side of the light-emitting diode 2000 without the electrode 2100 are closer, showing that the first adhesive block 220 and the light-emitting diode 2000 have strong adhesion, and the surface energy of the first adhesive block 220 and the surface energy of the quartz substrate 210 are obviously different, showing that the first adhesive block 220 and the quartz substrate 210 have weak adhesion, therefore, as the temperature continues to decrease after the gold-indium eutectic bonding is completed, the first adhesive block 220 is transferred together with the light-emitting diode 2000 to the circuit substrate 3000.

[0075] In addition, due to the difference in surface energy, the first adhesive block 220 and the light-emitting diode 2000 have strong adhesion, and the first adhesive block 220 and the quartz substrate 210 have weak adhesion, part of the first adhesive block 220 is transferred together with the light-emitting diode 2000 to the side of the circuit substrate 3000, and the other part of the first adhesive block 220 forms adhesion with the second adhesive block 230 of the same system resin and remains on the side of the quartz substrate 210.

[0076] Further, the bonding temperature of the second adhesive block 230 is 160℃, and the debonding temperature is 190℃, when the temperature is heated to the corresponding bonding temperature 160℃ of the gold-indium eutectic bonding, the second adhesive block 230 softens to show viscosity and forms good adhesion with the quartz substrate 210, at the same time, the second adhesive block 230 softens and still maintains a certain shape, limiting the flow of the first adhesive block 220 due to the decrease in viscosity when reaching the corresponding debonding temperature. That is, the second adhesive block 230 acts as a barrier for the first adhesive block 220 at high temperature.

[0077] In some embodiments of the present application, the circuit substrate 3000 includes but is not limited to an array substrate, a PCB circuit board, etc.

[0078] As Figure 5As shown, the first adhesive block 220 on the circuit substrate 3000 is subjected to reflow process at a reflow temperature of 130-160°C, and the first adhesive block 220 is moved towards the electrode 2100 under the condition that the Au-In eutectic bond is not damaged, and is filled between the electrode 2100 and the receiving terminal 3100, and forms an encapsulation layer S after solidification, which encapsulates the electrode 2100 and the receiving terminal 3100.

[0079] In some embodiments of the present application, before the reflow process, a partition is arranged between any adjacent light emitting diodes 2000, the partition protrudes upwards from the surface of the circuit substrate 3000, and the upper surface of the partition is flush with or higher than the first adhesive block 220. During the reflow process, the partition limits the lateral movement of the liquid first adhesive block 220 on the surface of the circuit substrate 3000. Preferably, the partition is made of black or other opaque materials.

[0080] In some embodiments of the present application, the electrodes 2100 of the plurality of light emitting diodes 2000 on the temporary substrate 1000 are fixed to a bonding layer (not shown) such as an adhesive layer on the temporary substrate 1000. The temporary substrate 1000 is bonded to the original substrate including the plurality of light emitting diodes, and the plurality of light emitting diodes on the original substrate are transferred to the temporary substrate 1000.

[0081] As shown, Figure 6 The present application also provides a display panel including a circuit substrate 3000 and a plurality of light emitting diodes 2000 arranged on the circuit substrate 3000, which are transferred to the circuit substrate 3000 by the transfer method 100 described above. Figure 1

[0082] The display panel further includes a light absorbing layer 4000 arranged on the circuit substrate 3000, and the light absorbing layer 4000 includes a plurality of openings, and the plurality of light emitting diodes 2000 are arranged in the plurality of openings.

[0083] In summary, the present application provides a transfer method and a display panel, which uses a transfer substrate including two different adhesive blocks to selectively transfer light emitting diodes to a circuit substrate. During the transfer process, the first adhesive block with a low debonding temperature is transferred to the circuit substrate together with the light emitting diodes when the electrodes of the light emitting diodes are bonded to the receiving terminals of the circuit substrate. Then, the first adhesive block is used to encapsulate the electrodes of the light emitting diodes and the receiving terminals of the circuit substrate by reflowing.

[0084] ​Among them, different temperature resistance viscous blocks are prepared on the quartz substrate respectively, through the partition design of viscous blocks, on the one hand, the temperature of viscous blocks is limited from flowing and dropping in the mass soldering process; on the other hand, through the viscous blocks with low bonding temperature and debonding temperature, the chips are transferred, in the mass soldering process, the temperature of viscous blocks with low bonding temperature and debonding temperature is not affected, so the chips are transferred to the back plate side, and the packaging of light emitting diodes is realized; and through multiple hot pressing, the flatness of viscous blocks above the light emitting diodes is very high.

[0085] The present application has been described by the above-mentioned related embodiments, however, the above-mentioned embodiments are only examples for implementing the present application. In addition, the technical features involved in the different embodiments of the present application described above can be combined with each other as long as they do not conflict with each other. It must be pointed out that the present application can also have other various embodiments, and those skilled in the art can make various corresponding changes and modifications according to the present application without departing from the spirit and essence of the present application. However, all these corresponding changes and modifications should belong to the protection scope of the claims attached to the present application.

Claims

1. A transfer method for transferring a light emitting diode, characterized by, The transfer method comprises: providing a transfer substrate, the transfer substrate comprising a plurality of first adhesive blocks arranged at intervals and a second adhesive block arranged around the plurality of first adhesive blocks, a debonding temperature of each first adhesive block being lower than a debonding temperature of the second adhesive block, and a bonding temperature of each first adhesive block being lower than a bonding temperature of the second adhesive block; the transfer substrate comprising a quartz substrate comprising a plurality of first regions arranged at intervals and a second region arranged outside the plurality of first regions, a first adhesive resin being printed or coated into the corresponding plurality of first regions, and solidified to form the plurality of first adhesive blocks; and a second adhesive resin being printed or coated into the corresponding second region, and solidified to form the second adhesive block; the first adhesive resin and the second adhesive resin being homologous resins, and a molecular weight of the first adhesive resin being different from a molecular weight of the second adhesive resin; a film layer thickness of the first adhesive blocks being equal to a film layer thickness of the second adhesive block; providing a temporary carrier, the temporary carrier comprising a plurality of light emitting diodes; bonding the transfer substrate and the temporary carrier, the plurality of light emitting diodes and the plurality of first adhesive blocks being bonded, and the plurality of light emitting diodes being transferred onto the transfer substrate; providing a circuit substrate, bonding the transfer substrate and the circuit substrate, electrodes of the plurality of light emitting diodes and a plurality of receiving terminals on the circuit substrate being bonded, and the plurality of first adhesive blocks being transferred together with the plurality of light emitting diodes onto the circuit substrate, and located on a side of the plurality of light emitting diodes away from the circuit substrate; and reflowing the circuit substrate to raise the temperature, the plurality of first adhesive blocks being melted and covering the electrodes of the plurality of light emitting diodes and the plurality of receiving terminals; wherein a debonding temperature of each first adhesive block is equal to a bonding temperature between the electrodes of the plurality of light emitting diodes and the plurality of receiving terminals on the circuit substrate; and a temperature of the reflowing is lower than the bonding temperature.

2. The transfer method according to claim 1, characterized by, The bonding between the electrodes of the plurality of light emitting diodes and the plurality of receiving terminals on the circuit substrate is gold-indium eutectic bonding, and a bonding temperature of the gold-indium eutectic bonding is 160°C.

3. The transfer method according to claim 2, characterized in that, A bonding temperature of each first adhesive block is 130°C, and a debonding temperature of each first adhesive block is 160°C; a bonding temperature of the second adhesive block is 160°C, and a debonding temperature of the second adhesive block is greater than 190°C.

4. The transfer method according to claim 1, characterized by, The first adhesive resin and the second adhesive resin are polymethyl methacrylate resin, polycarbonate resin, polyethylene resin, polyacrylic acid resin, polysiloxane resin, or polyurethane resin.

5. The transfer method according to claim 1, characterized by, Further comprising: providing a first mask, the first mask comprising a plurality of first openings corresponding to the plurality of first regions; stacking the first mask above the quartz substrate; and printing or coating the first adhesive resin into the plurality of first openings, and solidifying to form the plurality of first adhesive blocks.

6. The transfer method according to claim 1, characterized by, Further comprising: providing a second mask, the second mask comprising a second opening corresponding to the second region; stacking the second mask above the quartz substrate; and printing or coating the second adhesive resin into the second openings, and curing to form a second adhesive block; wherein the second adhesive block is an integral adhesive layer arranged around the plurality of first adhesive blocks.

7. A display panel, characterized by, The panel includes a circuit substrate and a plurality of light emitting diodes transferred onto the circuit substrate, the plurality of light emitting diodes being transferred onto the circuit substrate by the transfer method of any one of claims 1-6.

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