A high-precision fitting device for preparing organic semiconductor components

Abstract

The present invention provides a high-precision organic semiconductor component preparation and bonding device, which relates to the technical field of bonding devices and includes a base. An installation groove is formed on the upper surface of the base, and a guide rail installation frame is installed inside the installation groove. A guide rail is fixedly installed on the upper surface of the guide rail installation frame. A concave platform is arranged on one side of the guide rail. A pushing component is arranged on the upper surface of the base. The pushing component includes a roller and a push block. One side of the push block is fixedly installed on the surface of one end of a moving rod. In the present invention, since the two ends of the guide rail are triangularly arranged, the roller is not preset to contact the concave platform. As the second electric conveyor belt rotates, the roller crosses the triangular end of the guide rail and then rolls into contact with the middle position of the concave platform, and then separates from the guide rail again, completing the process of fixing and separating the bonding plate, thereby achieving the effect of automatically pressing and fixing the bonding plate and separating and discharging the material, further improving the production efficiency and providing convenience in use.

Description

Technical Field

[0001] The present invention relates to the technical field of laminating devices, and more particularly to a high-precision laminating device for preparing organic semiconductor components. Background Art

[0002] A semiconductor refers to a material whose electrical conductivity at room temperature is between that of a conductor and an insulator. Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion and other fields. For example, a diode is a device made of a semiconductor. From the perspective of both technology and economic development, the importance of semiconductors is extremely great. The core units of most electronic products, such as computers, mobile phones or digital recorders, are extremely closely related to semiconductors. Common semiconductor materials include silicon, germanium, gallium arsenide, etc. Silicon is the most influential among various semiconductor material applications. Its forms of existence are diverse, including solids, liquids, gases, plasmas, etc. We usually refer to materials with poor electrical conductivity, such as coal, artificial crystals, amber, ceramics, etc. as insulators.

[0003] And materials with relatively good electrical conductivity, such as gold, silver, copper, iron, tin, aluminum, etc. are called conductors. Materials between conductors and insulators can be simply called semiconductors. Compared with conductors and insulators, the discovery of semiconductor materials is the latest. Only after the improvement of material purification technology was the existence of semiconductors truly recognized by the academic community; currently, various forms of semiconductors have been prepared. During the preparation process, a laminating device is required to laminate some thin-film semiconductor components to meet the production requirements. However, most current laminating devices are not easily able to automatically complete the fixing and blanking of the laminating plate during use, resulting in a low overall production efficiency and inconvenience in use. Therefore, we propose a high-precision laminating device for preparing organic semiconductor components to solve the problems encountered above. Summary of the Invention

[0004] In view of the fact that most current laminating devices are not easily able to automatically complete the fixing and blanking of the laminating plate during use, resulting in a low overall production efficiency and inconvenience in use, the present invention provides a high-precision laminating device for preparing organic semiconductor components.

[0005] To achieve the above object, the technical solution adopted by the present invention is as follows:

[0006] A high-precision organic semiconductor component preparation and bonding device includes a base. A second mounting seat is fixedly installed on the upper surface of the base. A second electric conveyor belt is fixedly installed between the two second mounting seats. A connecting block is fixedly installed on the front side of the second electric conveyor belt. A stop block is fixedly installed on one side surface of the connecting block. One side of the stop block abuts against a bonding plate. An installation groove is formed on the upper surface of the base. A guide rail mounting frame is installed inside the installation groove. A guide rail is fixedly installed on the upper surface of the guide rail mounting frame. A concave platform is arranged on one side of the guide rail. A pushing component is arranged on the upper surface of the base. The pushing component includes a roller and a push block. One side of the push block is fixedly installed on the end surface of a moving rod. The other side of the push block abuts against the bonding plate. One end of the bonding plate abuts against a stop rod. The roller is rotatably installed at one end of a roller mounting rod through a roller mounting pin. The outer periphery of the roller is in rolling connection with the inner wall of the concave platform.

[0007] Preferably, a first mounting seat is fixedly installed on the upper surface of the base. A first electric conveyor belt is fixedly installed between the two first mounting seats.

[0008] Preferably, a manipulator mounting table is also fixedly installed on the upper surface of the base. A manipulator is fixedly installed on the upper surface of the manipulator mounting table. The output end of the manipulator is fixedly connected with a pneumatic suction nozzle. The pneumatic suction nozzle is located above the first electric conveyor belt.

[0009] Preferably, a servo motor is fixedly installed on the upper surface of the base. A lead screw is fixedly installed at the output end of the servo motor. The end of the lead screw away from the servo motor is rotatably installed inside a lead screw mounting block. The lower surface of the lead screw mounting block is fixedly connected with the base.

[0010] Preferably, a lead screw sleeve is installed on the lead screw. A moving plate is fixedly installed on the upper surface of the lead screw sleeve. A guide rail is fixedly installed on the upper surface of the moving plate. Fixed rods are fixedly installed on both sides of the moving plate. One end of each of the two fixed rods is fixedly connected with the lower surface of the guide rail. The two fixed rods are arranged obliquely.

[0011] Preferably, the two guide rail mounting frames are symmetrically arranged. Slide rods are fixedly installed at the lower ends of the two guide rails. Both ends of the two slide rods are slidably installed inside chutes. The two chutes are both formed inside the installation groove.

[0012] Preferably, the end of the roller mounting rod away from the roller is fixedly connected with a fixing piece. Both ends of the fixing piece are arranged in an arc shape.

[0013] Preferably, a moving rod is fixedly installed on the front side of the fixing piece. The two moving rods are symmetrically arranged. One end of each of the two moving rods away from the fixing piece passes through the moving rod mounting block. Springs are sleeved and installed on the two moving rods. One end of the spring is fixedly connected to the moving rod mounting block, and the other end of the spring is fixedly connected to the pressing block.

[0014] Preferably, several of the moving rod mounting blocks are symmetrically arranged up and down with respect to the second electric conveyor belt. The inner ends of several of the moving rod mounting blocks are fixedly connected to the surface of the second electric conveyor belt.

[0015] Preferably, square grooves are formed inside several of the moving rod mounting blocks. A screw mounting block is fixedly installed at the bottom of the square groove. A screw is installed inside the screw mounting block. One end of the screw is fixedly installed with a circular block. One side of the circular block abuts against the pressing block.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] In the present invention, the bonding plate is placed above the second electric conveyor belt so that the bonding plate is located between the pushing block and the blocking block. Since the two ends of the guide rail are triangularly arranged, the roller is not in contact with the concave platform by default. As the second electric conveyor belt rotates, it will drive the pushing assembly to move, causing the roller to cross the triangular end of the guide rail and then roll into contact with the middle position of the concave platform. After the roller rolls with the concave platform, the roller will be forced to move. Then, the fixing piece is used to push the two moving rods to move. The movement of the moving rods will cause the pushing block to move towards the blocking block, thereby tightly fixing the bonding plate. When the moving rods move, the springs will be compressed to generate a reaction force. After the roller moves from the middle of the guide rail to the triangular position at the other end, the roller is no longer in contact with the concave platform. At this time, the springs rebound to cause the moving rods to drive the pushing block to return to its original position, and then the bonding plate is no longer tightly fixed. The second electric conveyor belt rotates to separate the bonding plate from it, achieving the effects of automatically tightly fixing and separating and discharging the bonding plate, further improving the production efficiency and providing convenience in use. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 is a schematic diagram of the overall structure of a high-precision organic semiconductor component preparation bonding device of the present invention;

[0019] Figure 2 is a front view structure schematic diagram of a high-precision organic semiconductor component preparation bonding device of the present invention;

[0020] Figure 3 is a top view structure schematic diagram of a high-precision organic semiconductor component preparation bonding device of the present invention;

[0021] Figure 4Schematic diagram of the connection structure between the guide rail mounting frame and the guide rail of a high-precision organic semiconductor component preparation and bonding device of the present invention;

[0022] Figure 5 Schematic diagram of the pushing component structure of a high-precision organic semiconductor component preparation and bonding device of the present invention;

[0023] Figure 6 Schematic diagram of the enlarged structure at position a of a high-precision organic semiconductor component preparation and bonding device of the present invention;

[0024] Figure 7 Schematic diagram of the enlarged structure at position b of a high-precision organic semiconductor component preparation and bonding device of the present invention;

[0025] Figure 8 Schematic diagram of the enlarged structure at position c of a high-precision organic semiconductor component preparation and bonding device of the present invention.

[0026] In the figure: 1, base; 2, first mounting seat; 3, second mounting seat; 4, first electric conveyor belt; 5, manipulator mounting table; 6, manipulator; 7, guide rail mounting frame; 8, guide rail; 9, pushing component; 901, roller; 902, roller mounting pin; 903, roller mounting rod; 904, fixing piece; 905, moving rod; 906, abutting block; 907, spring; 908, moving rod mounting block; 909, pushing block; 910, square groove; 911, screw mounting block; 912, screw; 913, circular block; 10, second electric conveyor belt; 11, servo motor; 12, lead screw; 13, lead screw mounting block; 14, lead screw sleeve; 15, moving plate; 16, fixed rod; 17, slide bar; 18, chute; 19, mounting groove; 20, pneumatic suction nozzle; 21, concave platform; 22, retaining bar; 23, bonding plate; 24, connecting block; 25, stop block. Detailed implementation manners

[0027] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0028] Embodiment

[0029] As Figure 1-8As shown in the figure, a high-precision organic semiconductor component preparation and fitting device includes a base 1. A second mounting seat 3 is fixedly installed on the upper surface of the base 1. A second electric conveyor belt 10 is fixedly installed between the two second mounting seats 3. A connecting block 24 is fixedly installed on the front side of the second electric conveyor belt 10. A stop block 25 is fixedly installed on one side surface of the connecting block 24. One side of the stop block 25 is in tight contact with the fitting plate 23. An installation groove 19 is formed on the upper surface of the base 1. A guide rail mounting frame 7 is installed inside the installation groove 19. A guide rail 8 is fixedly installed on the upper surface of the guide rail mounting frame 7. A concave platform 21 is arranged on one side of the guide rail 8. A pushing component 9 is arranged on the upper surface of the base 1. The pushing component 9 includes a roller 901 and a push block 909. One side of the push block 909 is fixedly installed on the end surface of a moving rod 905. The other side of the push block 909 is in tight contact with the fitting plate 23. One end of the fitting plate 23 is in tight contact with a stop rod 22. The roller 901 is rotatably installed at one end of a roller mounting rod 903 through a roller mounting pin 902. The outer periphery of the roller 901 is in rolling connection with the inner wall of the concave platform 21.

[0030] In this application, a first mounting seat 2 is fixedly installed on the upper surface of the base 1. A first electric conveyor belt 4 is fixedly installed between the two first mounting seats 2. A manipulator mounting platform 5 is also fixedly installed on the upper surface of the base 1. A manipulator 6 is fixedly installed on the upper surface of the manipulator mounting platform 5. The output end of the manipulator 6 is fixedly connected with a pneumatic suction nozzle 20. The pneumatic suction nozzle 20 is located above the first electric conveyor belt 4.

[0031] It should be noted that the air inlet end of the pneumatic suction nozzle 20 is communicated with the air inlet system through an air inlet pipe. The manipulator 6 is selected according to the actual environment as an existing technology.

[0032] In this application, a servo motor 11 is fixedly installed on the upper surface of the base 1. The output end of the servo motor 11 is fixedly installed with a lead screw 12. The end of the lead screw 12 far from the servo motor 11 is rotatably installed inside a lead screw mounting block 13. The lower surface of the lead screw mounting block 13 is fixedly connected with the base 1. A lead screw sleeve 14 is installed on the lead screw 12. The upper surface of the lead screw sleeve 14 is fixedly installed with a moving plate 15. The upper surface of the moving plate 15 is fixedly installed with a guide rail 8. Fixed rods 16 are fixedly installed on both sides of the moving plate 15. One end of the two fixed rods 16 is fixedly connected with the lower surface of the guide rail 8. The two fixed rods 16 are arranged obliquely. The two guide rail mounting frames 7 are symmetrically arranged. The lower ends of the two guide rails 8 are both fixedly installed with slide rods 17. Both ends of the two slide rods 17 are slidably installed inside a chute 18. The two chutes 18 are both formed inside the installation groove 19.

[0033] It should be noted that before use, by starting the servo motor 11 to drive the lead screw 12 to rotate, the lead screw sleeve 14 drives the moving plate 15 to move, and then the guide rail 8 moves, so as to control the contact distance between the guide rail 8 and the roller 901.

[0034] In the present application, one end of the roller mounting rod 903 away from the roller 901 is fixedly connected to the fixing piece 904, and both ends of the fixing piece 904 are arranged in an arc shape. A moving rod 905 is fixedly installed on the front side of the fixing piece 904. The two moving rods 905 are symmetrically arranged. One ends of the two moving rods 905 away from the fixing piece 904 both pass through the moving rod mounting block 908. Springs 907 are sleeved and installed on the two moving rods 905. One end of the spring 907 is fixedly connected to the moving rod mounting block 908, and the other end of the spring 907 is fixedly connected to the abutting block 906. A plurality of moving rod mounting blocks 908 are symmetrically arranged up and down with respect to the second electric conveyor belt 10. The inner ends of the plurality of moving rod mounting blocks 908 are all fixedly connected to the surface of the second electric conveyor belt 10. Square grooves 910 are formed inside the plurality of moving rod mounting blocks 908. A screw mounting block 911 is fixedly installed at the bottom of the square groove 910. A screw 912 is installed inside the screw mounting block 911. One end of the screw 912 is fixedly installed with a circular block 913, and one side of the circular block 913 abuts against the abutting block 906.

[0035] It should be noted that the staff starts the second electric conveyor belt 10 and places the laminating plate 23 above the second electric conveyor belt 10, so that the laminating plate 23 is between the push block 909 and the stop block 25. Since the two ends of the guide rail 8 are triangularly arranged, the preset rollers 901 will not contact the concave platform 21. As the second electric conveyor belt 10 rotates, it will drive the pushing assembly 9 to move, so that the rollers 901 cross the triangular ends of the guide rail 8 and then roll and contact the middle position of the concave platform 21. After the rollers 901 roll with the concave platform 21, the rollers 901 will be driven to move passively. Then, through the fixing piece 904, the two moving rods 905 are pushed to move. The movement of the moving rods 905 will cause the push block 909 to move towards the stop block 25, thereby tightly fixing the laminating plate 23. When the moving rods 905 move, the spring 907 will be compressed to generate a reaction force. After the rollers 901 move from the middle of the guide rail 8 to the triangular position at the other end, the rollers 901 will no longer contact the concave platform 21. At this time, the spring 907 rebounds to make the moving rods 905 drive the push block 909 to return to its original position, and then the laminating plate 23 is no longer tightly fixed. The second electric conveyor belt 10 rotates to separate it from the laminating plate 23, achieving the effect of automatically tightly fixing and separating and discharging the laminating plate 23. It also needs to be explained that the push block 909 and the stop block 25 are made of rubber and have a certain flexibility to prevent damage to the laminating plate 23. The stop rod 22 is used to prevent the laminating plate 23 from moving forward too much to ensure the stability of the laminating plate 23. During use, the circular block 913 can be moved by turning the screw rod 912, pushing the pressing block 906 to move, so that the pressing block 906 drives the two moving rods 905 to move, and finally the rollers 901 move. Conversely, turning the screw rod 912 makes the rollers 901 move in the opposite direction, so as to better control the initial position of the rollers 901 and better carry out installation adjustment. If the rollers 901 are worn after long-term use and the distance from the guide rail 8 changes slightly, this method can be used to fine-tune the rollers 901 to improve the fixing effect on the laminating plate 23. The rollers 901 can be made of rubber to reduce a certain amount of rolling noise. The first electric conveyor belt 4, the second electric conveyor belt 10, the servo motor 11, and the manipulator 6 are all electrically connected to the plc control board through existing technologies. There is a certain distance between the mounting frame of the second electric conveyor belt 10 and the second electric conveyor belt 10, so that the second electric conveyor belt 10 will not block the rollers 901 when driving the pushing assembly 9 to rotate.

[0036] The working principle of the high-precision organic semiconductor component preparation laminating device:

[0037] First, the staff starts the second electric conveyor belt 10 and places the laminating plate 23 above the second electric conveyor belt 10, so that the laminating plate 23 is between the push block 909 and the stop block 25. Since the two ends of the guide rail 8 are triangularly arranged, the roller 901 is preset not to contact the concave platform 21. As the second electric conveyor belt 10 rotates, it will drive the pushing assembly 9 to move, so that the roller 901 crosses the triangular end of the guide rail 8 and then rolls into contact with the middle position of the concave platform 21. After the roller 901 and the concave platform 21 roll, the roller 901 will be driven to move passively. After that, the fixing piece 904 is used to push the two moving rods 905 to move. The movement of the moving rods 905 will cause the push block 909 to move towards the stop block 25, thereby tightly fixing the laminating plate 23.

[0038] When the moving rod 905 moves, it will compress the spring 907 to generate a reaction force. After the roller 901 moves from the middle of the guide rail 8 to the triangular position at the other end, the roller 901 no longer contacts the concave platform 21. At this time, the spring 907 rebounds to make the moving rod 905 drive the push block 909 to return to its original position. Then the laminating plate 23 is no longer tightly fixed. The rotation of the second electric conveyor belt 10 separates the laminating plate 23 from it, achieving the effect of automatically tightly fixing and separating and discharging the laminating plate 23, further improving the production efficiency and providing convenience in use. When the first electric conveyor belt 4 is started, some semiconductors are transported. Under the action of the start of the manipulator 6, it cooperates with the pneumatic suction nozzle 20 to attach the semiconductor material to the upper surface of the laminating plate 23, completing the laminating process.

[0039] Obviously, the above embodiments of the present invention are merely examples for clearly explaining the present invention, rather than limitations on the implementation manners of the present invention. For those of ordinary skill in the art, based on the above description, other different forms of changes or variations can be made. It is impossible to list all the implementation manners here. Any obvious changes or variations derived from the technical solutions of the present invention still fall within the protection scope of the present invention.

Claims

1. A high-precision bonding device for preparing organic semiconductor components, comprising a base (1), characterized in that: On the upper surface of the base (1), a second mounting seat (3) is fixedly installed. Between the two second mounting seats (3), a second electric conveyor belt (10) is fixedly installed. On the front side of the second electric conveyor belt (10), a connecting block (24) is fixedly installed. On one side surface of the connecting block (24), a stop block (25) is fixedly installed. One side of the stop block (25) abuts against the fitting plate (23). An installation groove (19) is formed on the upper surface of the base (1). Inside the installation groove (19), a guide rail mounting frame (7) is installed. On the upper surface of the guide rail mounting frame (7), a guide rail (8) is fixedly installed. On one side of the guide rail (8), there is a concave platform (21). On the upper surface of the base (1), a pushing component (9) is arranged. The pushing component (9) includes a roller (901) and a pushing block (909). One side of the pushing block (909) is fixedly installed on the end surface of a moving rod (905). The other side of the pushing block (909) abuts against the fitting plate (23). One end of the fitting plate (23) abuts against the stop rod (22). The roller (901) is rotatably installed at one end of a roller mounting rod (903) through a roller mounting pin (902). The outer periphery of the roller (901) is in rolling connection with the inner wall of the concave platform (21). On the upper surface of the base (1), a servo motor (11) is fixedly installed. The output end of the servo motor (11) is fixedly installed with a lead screw (12). A lead screw sleeve (14) is installed on the lead screw (12). On the upper surface of the lead screw sleeve (14), a moving plate (15) is fixedly installed. On the upper surface of the moving plate (15), a guide rail (8) is fixedly installed. The two ends of the guide rail (8) are triangular ends. One end of the roller mounting rod (903) far from the roller (901) is fixedly connected to a fixing piece (904). The two ends of the fixing piece (904) are arranged in an arc shape. On the front side of the fixing piece (904), a moving rod (905) is fixedly installed. The two moving rods (905) are symmetrically arranged. One end of each of the two moving rods (905) far from the fixing piece (904) passes through a moving rod mounting block (908). Springs (907) are sleeved on the two moving rods (905). One end of each spring (907) is fixedly connected to the moving rod mounting block (908). The other end of each spring (907) is fixedly connected to a pressing block (906).

2. The high-precision organic semiconductor component preparation and bonding device according to claim 1, wherein: On the upper surface of the base (1), a first mounting seat (2) is fixedly installed. Between the two first mounting seats (2), a first electric conveyor belt (4) is fixedly installed.

3. The high-precision organic semiconductor component preparation and fitting device according to claim 1, wherein: On the upper surface of the base (1), a manipulator mounting table (5) is also fixedly installed. On the upper surface of the manipulator mounting table (5), a manipulator (6) is fixedly installed. The output end of the manipulator (6) is fixedly connected to a pneumatic suction nozzle (20). The pneumatic suction nozzle (20) is located above the first electric conveyor belt (4).

4. A high-precision organic semiconductor component preparation and bonding device according to claim 1, characterized in that: One end of the lead screw (12) far from the servo motor (11) is rotatably installed inside a lead screw mounting block (13). The lower surface of the lead screw mounting block (13) is fixedly connected to the base (1).

5. A high-precision organic semiconductor component preparation and bonding device according to claim 4, characterized in that: Fixing rods (16) are fixedly installed on both sides of the moving plate (15), one end of each of the two fixing rods (16) is fixedly connected to the lower surface of the guide rail (8), and the two fixing rods (16) are arranged obliquely.

6. The high-precision organic semiconductor component preparation and bonding device according to claim 1, characterized in that: The two guide rail mounting frames (7) are symmetrically arranged. Slide rods (17) are fixedly installed at the lower ends of the two guide rails (8). Both ends of the two slide rods (17) are slidably installed inside the sliding grooves (18), and the two sliding grooves (18) are both opened inside the installation groove (19).

7. A high-precision organic semiconductor component preparation and bonding device according to claim 1, characterized in that: A number of moving rod mounting blocks (908) are symmetrically arranged above and below the second electric conveyor belt (10), and the inner ends of the number of moving rod mounting blocks (908) are fixedly connected to the surface of the second electric conveyor belt (10).

8. A high-precision organic semiconductor component preparation and bonding device according to claim 7, characterized in that: Square grooves (910) are formed inside a number of the moving rod mounting blocks (908). A screw mounting block (911) is fixedly installed at the bottom of the square groove (910). A screw (912) is installed inside the screw mounting block (911). One end of the screw (912) is fixedly installed with a circular block (913), and one side of the circular block (913) is in tight contact with the abutting block (906).

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