Electronic device including camera module and manufacturing method thereof
By setting support members and adhesive members in the electronic device, adjusting the position of the camera module and performing visual alignment, the problem of inactive areas occupied by the camera module in the portable electronic device is solved, and the aesthetic appeal and manufacturing accuracy are improved.
Patent Information
- Application Number
- CN202080072835.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Priority Date
- 2019-10-18
- Filing Date
- 2020-08-24
- Publication Date
- 2025-01-10
- Estimated Expiration
- 2040-08-24
AI Technical Summary
In portable electronic devices, the camera module is arranged in the inactive area, resulting in a decrease in the surface area of the electronic device, reducing the aesthetic appeal.
By providing a support member between the front panel of the electronic device and the display, and fixing the camera module with the support member with the adhesive member, adjusting the position of the camera module to reduce the size of the inactive area, and pairing the lens axis through visual alignment It is the midpoint of the transparent area, reducing multiple tolerances.
Effectively reduce the inactive area size of the camera module, improve the aesthetic appeal of the electronic device, and improve the accuracy of the manufacturing process.
Smart Images

Figure CN114631302B_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to an electronic device including a camera module and a method of manufacturing the same. Background Art
[0002] The electronic device may output the stored information as sound or image. As the integration of electronic devices increases, and high-speed, high-capacity wireless communications are widely used, electronic devices (such as mobile communication terminals) may provide various functions. For example, the electronic device may provide communication functions as well as entertainment functions (such as games), multimedia functions (such as music / video playback), communication security functions for mobile banking, schedule management, and electronic wallets, to name a few.
[0003] Smaller electronic devices increase the portability of the electronic devices, while thinner electronic devices with displays covering a portion of the surface area of the electronic devices are pleasing to consumers. Summary of the invention
[0004] Technical issues
[0005] A portable electronic device may include an active area for displaying an image and an inactive area where no image is displayed. A touch screen panel for identifying a user's touch position may be disposed in the active area, and a camera, sensor, etc. may be disposed in the inactive area. A large inactive area reduces the portion of the surface area of the electronic device that is used for display. This may reduce the aesthetic appeal of the device.
[0006] Problem Solution
[0007] According to a specific embodiment, an electronic device includes: a front plate, including a transparent area and an opaque area; a display, arranged below the front plate and including a first opening corresponding to at least a portion of the transparent area; a supporting member, arranged below the display and including a first area and at least one second area protruding below the first area, wherein the first area includes a second opening corresponding to at least a portion of the first opening; a camera housing, including a first surface facing the first area and a second surface extending below the first surface and facing the at least one second area, at least one lens, arranged in at least one of the first opening and the second opening; and an adhesive member, arranged between the camera housing and the second area.
[0008] A manufacturing method of an electronic device according to a specific embodiment includes: joining a front panel having a transparent area and an opaque area and a display including a first opening corresponding to at least a portion of the transparent area to a supporting member; adjusting a position of a camera module relative to the supporting member by aligning a lens axis of the camera module to be substantially the same as a midpoint of the transparent area; setting an adhesive member between the camera module and the supporting member; and curing the adhesive member.
[0009] According to a specific embodiment, an electronic device includes: a front plate, including a transparent area and an opaque area; a display, arranged below the front plate and including a first opening corresponding to at least a portion of the transparent area; a supporting member, arranged below the display and including a first area and at least one second area protruding below the first area, wherein the first area includes a second opening corresponding to at least a portion of the first opening; a camera housing, including a first surface facing the first area and a second surface extending below the first surface and facing the at least one second area, at least one lens being arranged in at least one of the first opening and the second opening; and an adhesive member, arranged between the camera housing and the second area; and wherein the bottom portion of the camera housing is separated from a third area of the supporting member arranged below the camera housing by a gap.
[0010] Beneficial Effects of the Invention
[0011] An electronic device according to certain embodiments of the present disclosure has an adhesive member disposed between a camera housing and a support member, so that the size of an inactive area where a camera is disposed can be reduced.
[0012] The method for manufacturing an electronic device according to a certain embodiment of the present disclosure adjusts the position of the camera module relative to the inactive area through visual alignment, so that multiple tolerances considered when forming the inactive area and the size of the inactive area where the camera is disposed can be reduced.
[0013] These and other advantages of specific embodiments are described in further detail below. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] The above and other aspects, features and advantages of the present disclosure will become more apparent through the following detailed description in conjunction with the accompanying drawings, in which:
[0015] Figure 1 is a block diagram of an electronic device within a network environment according to certain embodiments of the present disclosure;
[0016] Figure 2 is a front perspective view of an electronic device according to certain embodiments of the present disclosure;
[0017] Figure 3 is a rear perspective view of an electronic device according to certain embodiments of the present disclosure;
[0018] Figure 4 is an exploded perspective view of an electronic device according to a certain embodiment of the present disclosure;
[0019] Figure 5 is a perspective view of an electronic device engaged with a camera module according to certain embodiments of the present disclosure;
[0020] Figure 6yes Figure 5 A cross-sectional view of the A-A' plane;
[0021] Figure 7 is a front view of an electronic device according to a certain embodiment of the present disclosure;
[0022] Figure 8 yes Figure 7 A cross-sectional view of the A-A' plane;
[0023] Fig. 9A is a diagram illustrating a method for manufacturing an electronic device according to a specific embodiment of the present disclosure, Fig. 9B is a diagram illustrating a method for manufacturing an electronic device according to a specific embodiment of the present disclosure, and Fig. 9C is a diagram illustrating a method for manufacturing an electronic device according to a specific embodiment of the present disclosure;
[0024] Fig.10 is a diagram illustrating a method of bonding a camera module to a supporting member according to a certain embodiment of the present disclosure; and
[0025] Fig.11 is a flowchart illustrating a method of manufacturing an electronic device according to a certain embodiment of the present disclosure. DETAILED DESCRIPTION
[0026] Figure 1 An electronic device 101 is described in which certain embodiments of the present disclosure may be practiced. Figure 2 and Figure 3 The exterior of a housing of an electronic device is described. Figure 4 The interior of a housing for an electronic device is described. As will be seen, certain embodiments include an electronic device that is substantially planar and thin. A majority of the surface area of the electronic device is used for display, which may be aesthetically appealing. However, it is also desirable for the electronic device to include a camera. Since the camera uses an open line of sight to the exterior of the electronic device, the surface includes an opening. In certain embodiments, the opening is an inactive area of the display that reduces the portion of the surface area used for display.
[0027] Figure 5-Figure 11 A camera within a housing of an electronic device is described.
[0028] Figure 1 is a block diagram illustrating an electronic device 101 in a network environment 100 according to certain embodiments.
[0029] Reference Figure 1, the electronic device 101 in the network environment 100 may communicate with the electronic device 102 via the first network 198 (e.g., a short-range wireless communication network), or communicate with the electronic device 104 or the server 108 via the second network 199 (e.g., a long-range wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 via the server 108. According to an embodiment, the electronic device 101 may include a processor 120, a memory 130, an input device 150, a sound output device 155, a display device 160, an audio module 170, a sensor module 176, an interface 177, a haptic module 179, a camera module 180, a power management module 188, a battery 189, a communication module 190, a user identification module (SIM) 196, or an antenna module 197. In some embodiments, at least one of the components (e.g., the display device 160 or the camera module 180) may be omitted from the electronic device 101, or one or more other components may be added to the electronic device 101. In some embodiments, some of the components may be implemented as a single integrated circuit.For example, the sensor module 176 (eg, a fingerprint sensor, an iris sensor, or an illumination sensor) may be implemented to be embedded in the display device 160 (eg, a display).
[0030] The processor 120 may run, for example, software (e.g., program 140) to control at least one other component (e.g., hardware component or software component) of the electronic device 101 connected to the processor 120, and may perform various data processing or calculations. According to one embodiment, as at least part of the data processing or calculation, the processor 120 may load a command or data received from another component (e.g., sensor module 176 or communication module 190) into the volatile memory 132, process the command or data stored in the volatile memory 132, and store the resultant data in the non-volatile memory 134. According to an embodiment, the processor 120 may include a main processor 121 (e.g., a central processing unit (CPU) or an application processor (AP)) and an auxiliary processor 123 (e.g., a graphics processing unit (GPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is independent of or combined with the main processor 121 in operation. Additionally or alternatively, the auxiliary processor 123 may be adapted to consume less power than the main processor 121, or adapted to be specifically used for a specified function. The auxiliary processor 123 may be implemented separately from the main processor 121 , or as part of the main processor 121 .
[0031] When the main processor 121 is in an inactive (e.g., sleep) state, the auxiliary processor 123 (rather than the main processor 121) may control, for example, at least some of the functions or states related to at least one component (e.g., display device 160, sensor module 176, or communication module 190) among the components of the electronic device 101, or when the main processor 121 is in an active (e.g., running an application) state, the auxiliary processor 123 may control at least some of the functions or states related to at least one component (e.g., display device 160, sensor module 176, or communication module 190) among the components of the electronic device 101 together with the main processor 121. According to an embodiment, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., camera module 180 or communication module 190) that is functionally related to the auxiliary processor 123.
[0032] The memory 130 may store various data used by at least one component of the electronic device 101 (e.g., the processor 120 or the sensor module 176). The various data may include, for example, software (e.g., the program 140) and input data or output data for commands related thereto. The memory 130 may include a volatile memory 132 or a nonvolatile memory 134.
[0033] The program 140 may be stored as software in the memory 130 , and may include, for example, an operating system (OS) 142 , middleware 144 , or applications 146 .
[0034] The input device 150 may receive commands or data to be used by components of the electronic device 101 (e.g., the processor 120) from outside the electronic device 101 (e.g., the user). The input device 150 may include, for example, a microphone, a mouse, a keyboard, or a digital pen (e.g., a stylus).
[0035] The sound output device 155 can output a sound signal to the outside of the electronic device 101. The sound output device 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or playing records, and the receiver can be used for incoming calls. Depending on the embodiment, the receiver can be implemented as a separate part from the speaker, or as a part of the speaker.
[0036] The display device 160 may visually provide information to the outside of the electronic device 101 (e.g., a user). The display device 160 may include, for example, a display, a holographic device, or a projector, and a control circuit for controlling a corresponding one of the display, the holographic device, and the projector. According to an embodiment, the display device 160 may include a touch circuit adapted to detect a touch or a sensor circuit (e.g., a pressure sensor) adapted to measure the strength of a force caused by a touch.
[0037] The audio module 170 may convert sound into an electrical signal, or vice versa. According to an embodiment, the audio module 170 may obtain sound via the input device 150, or output sound via the sound output device 155 or an external electronic device (e.g., electronic device 102 (e.g., speaker or earphone)) directly or wirelessly connected to the electronic device 101.
[0038] The sensor module 176 may detect an operating state (e.g., power or temperature) of the electronic device 101 or an environmental state (e.g., a state of a user) outside the electronic device 101, and then generate an electrical signal or data value corresponding to the detected state. According to an embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor.
[0039] The interface 177 may support one or more specific protocols to be used to directly or wirelessly connect the electronic device 101 to an external electronic device (e.g., the electronic device 102). According to an embodiment, the interface 177 may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface.
[0040] The connection end 178 may include a connector, wherein the electronic device 101 can be physically connected to an external electronic device (e.g., the electronic device 102) via the connector. According to an embodiment, the connection end 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).
[0041] The haptic module 179 may convert the electrical signal into mechanical stimulation (eg, vibration or motion) or electrical stimulation that can be recognized by the user via his sense of touch or kinesthetic sense. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.
[0042] The camera module 180 may capture still images or moving images. According to an embodiment, the camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.
[0043] The power management module 188 may manage power supply to the electronic device 101. According to an embodiment, the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).
[0044] The battery 189 may power at least one component of the electronic device 101. According to an embodiment, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.
[0045] The communication module 190 may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. The communication module 190 may include one or more communication processors capable of operating independently from the processor 120 (e.g., an application processor (AP)) and supporting direct (e.g., wired) communication or wireless communication. According to an embodiment, the communication module 190 may include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules can communicate with an external electronic device via a first network 198 (e.g., a short-range communication network such as Bluetooth, Wireless Fidelity (Wi-Fi) Direct, or Infrared Data Association (IrDA)) or a second network 199 (e.g., a long-range communication network such as a cellular network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN))). These various types of communication modules can be implemented as a single component (e.g., a single chip), or these various types of communication modules can be implemented as multiple components separated from each other (e.g., multiple chips). The wireless communication module 192 can identify and authenticate the electronic device 101 in a communication network (such as the first network 198 or the second network 199) using user information (e.g., an International Mobile Subscriber Identity (IMSI)) stored in the user identification module 196.
[0046] The antenna module 197 may transmit or receive a signal or power to or from the outside of the electronic device 101 (e.g., an external electronic device). According to an embodiment, the antenna module may include an antenna including a radiating element formed of a conductive material or a conductive pattern formed in or on a substrate (e.g., a PCB). According to an embodiment, the antenna module 197 may include a plurality of antennas. In this case, at least one antenna suitable for a communication scheme used in a communication network (such as the first network 198 or the second network 199) may be selected from the plurality of antennas by, for example, the communication module 190. A signal or power may then be transmitted or received between the communication module 190 and the external electronic device via the selected at least one antenna. According to an embodiment, another component (e.g., a radio frequency integrated circuit (RFIC)) other than the radiating element may be additionally formed as part of the antenna module 197.
[0047] At least some of the above components may be connected to each other via an inter-peripheral communication scheme (e.g., a bus, a general purpose input output (GPIO), a serial peripheral interface (SPI), or a mobile industry processor interface (MIPI)) and communicatively transmit signals (e.g., commands or data) therebetween.
[0048] According to an embodiment, a command or data may be sent or received between the electronic device 101 and the external electronic device 104 via the server 108 connected to the second network 199. Each of the electronic device 102 and the electronic device 104 may be a device of the same type as the electronic device 101, or a device of a different type from the electronic device 101. According to an embodiment, all or some operations to be executed in the electronic device 101 may be executed in one or more of the external electronic device 102, the external electronic device 104, or the server 108. For example, if the electronic device 101 should automatically execute a function or service or should execute a function or service in response to a request from a user or another device, the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service instead of executing the function or service, or the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service in addition to executing the function or service. The one or more external electronic devices that receive the request may execute the requested at least part of the function or service, or execute another function or another service related to the request, and transmit the result of the execution to the electronic device 101. The electronic device 101 may provide the result as at least a partial reply to the request with or without further processing the result. To this end, for example, cloud computing technology, distributed computing technology, or client-server computing technology may be used.
[0049] The electronic device according to a specific embodiment may be one of various types of electronic devices. The electronic device may include, for example, a portable communication device (e.g., a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a household appliance. According to an embodiment of the present disclosure, the electronic device is not limited to those electronic devices described above.
[0050] It should be understood that the specific embodiments of the present disclosure and the terms used therein are not intended to limit the technical features set forth herein to specific embodiments, but include various changes, equivalent forms or alternative forms for corresponding embodiments. For the description of the accompanying drawings, similar reference numerals may be used to refer to similar or related elements. It will be understood that the nouns in the singular form corresponding to the term may include one or more things unless the relevant context clearly indicates otherwise. As used herein, each of the phrases such as "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C" and "at least one of A, B or C" may include any one or all possible combinations of the items listed together with the corresponding one of the multiple phrases. As used herein, terms such as "1st" and "2nd" or "first" and "second" may be used to simply distinguish the corresponding component from another component, and do not limit the component in other aspects (e.g., importance or order). It will be understood that if an element (e.g., a first element) is referred to as being “combined with another element (e.g., the second element)”, “combined to another element (e.g., the second element)”, “connected with another element (e.g., the second element)”, or “connected to another element (e.g., the second element)” when the terms “operably” or “communicatively” are used or when the terms “operably” or “communicatively” are not used, it means that the element may be directly (e.g., wired) connected to the other element, wirelessly connected to the other element, or connected to the other element via a third element.
[0051] As used herein, the term "module" may include units implemented in hardware, software, or firmware, and may be used interchangeably with other terms (e.g., "logic," "logic block," "portion," or "circuit"). A module may be a single integrated component adapted to perform one or more functions or a minimum unit or portion of the single integrated component. For example, according to an embodiment, a module may be implemented in the form of an application specific integrated circuit (ASIC).
[0052] According to a specific embodiment, each component (e.g., module or program) in the above-mentioned components may include a single entity or multiple entities. According to various embodiments, one or more components in the above-mentioned components may be omitted, or one or more other components may be added. Alternatively or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, according to a specific embodiment, the integrated component may still perform the one or more functions of each component in the multiple components in the same or similar manner as a corresponding component in the multiple components before integration. According to a specific embodiment, the operations performed by a module, program or another component may be performed sequentially, in parallel, repeatedly or in a heuristic manner, or one or more operations in the operations may be run or omitted in different orders, or one or more other operations may be added.
[0053] The various components of the electronic device 101 provide a wide variety of functionality. A variety of information may be output using the display device 160. In certain embodiments, it may be aesthetically pleasing to have the display device display over a large portion of the surface area of the electronic device 100. However, the camera functionality provided by the camera module 180 is also desirable. The camera module 180 uses a line of sight to the exterior of the electronic device 100 through an opening in the surface of the electronic device.
[0054] Figure 2 is a front perspective view of an electronic device 101 according to certain embodiments of the present disclosure. Figure 3 is a rear perspective view of an electronic device 101 according to certain embodiments of the present disclosure.
[0055] Reference Figure 2 and Figure 3 , the electronic device 101 according to the embodiment may include a housing 310, the housing 310 including a first surface / front surface 310A, a second surface / rear surface 310B, and a side surface 310C surrounding a space between the first surface 310A and the second surface 310B. In another embodiment (not shown), the housing 310 may be referred to as a housing having a Figure 2The structure of some of the first surface 310A, the second surface 310B and the side surface 310C. According to an embodiment, the first surface 310A can be formed by a front plate 302 (e.g., a glass plate or a polymer plate including various coatings), and at least a portion of the front plate 302 is substantially transparent. The second surface 310B can be formed by a substantially opaque rear plate 111. The rear plate 111 can be formed by, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS) or magnesium) or a combination of at least two thereof. The side surface 310C can be joined to the front plate 302 and the rear plate 111, and can be formed by a side frame structure (or "side member") 318 including a metal and / or a polymer. In a specific embodiment, the rear plate 311 and the side frame structure 318 can be formed integrally and can include the same material (e.g., a metal material (such as aluminum)).
[0056] In the illustrated embodiment, the front plate 302 may include two first regions 310D, which are bent from the first surface 310A toward the rear plate 111 at the two long edges of the front plate 302 and extend seamlessly. Figure 3 ), the rear plate 111 may include two second areas 310E, which are bent from the second surface 310B toward the front plate 302 at their two long edges and extend seamlessly. In a specific embodiment, the front plate 302 (or the rear plate 111) may include only one of the first areas 310D (or the second areas 310E). In another embodiment, the front plate 302 (or the rear plate 111) may not include some of the first areas 310D or the second areas 310E. In an embodiment, when viewed from the side surface of the electronic device 101, the side frame structure 318 may have a first thickness (or width) on a side of the side surface that does not include the first area 310D or the second area 310E, and have a second thickness that is thinner than the first thickness on a side of the side surface that includes the first area 310D or the second area 310E.
[0057] According to an embodiment, the electronic device 101 may include at least one or more of the display 301, audio modules 303, 307, and 314, sensor modules 316 and 319, camera modules 305, 312, and 313, a key input device 317, and connector holes 308 and 309. In certain embodiments, the electronic device 101 may omit at least one of the constituent elements (e.g., the key input device 400), or additionally include another constituent element.
[0058] The display 301 may be exposed, for example, through a substantial portion of the front plate 302. In certain embodiments, at least a portion of the display 301 may be exposed through the first surface 310A and the front plate 302, wherein the first region 310D of the side surface 310C is disposed at the front plate 302. In certain embodiments, a corner of the display 301 may be formed to have substantially the same shape as an adjacent contour shape of the front plate 302. In another embodiment (not shown), in order to expand the area exposed by the display 301, the interval between the contour of the display 301 and the contour of the front plate 302 may be substantially uniformly formed.
[0059] In another embodiment, a recess or opening is formed in a portion of the screen display area of the display 301, and the display 301 may include at least one or more of a sensor module (not shown) and a camera module 305 aligned with the recess or opening. In another embodiment (not shown), at least one or more of the audio module 314, the sensor module (not shown), the camera module 305, the fingerprint sensor 316, and the light emitting element 306 may be disposed on the back of the screen display area of the display 301. In another embodiment (not shown), the display 301 may be combined with or disposed adjacent to a touch sensor circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer based on a magnetic field detection stylus. In a specific embodiment, at least a portion of the sensor modules 304 and 319 and / or at least a portion of the key input device 400 may be disposed in the first area 310D and / or the second area 310E.
[0060] The audio modules 303, 307, and 314 may include a microphone hole 303 and speaker holes 307 and 314. A microphone for obtaining external sound may be provided in the microphone hole 303, and in a specific embodiment, a plurality of microphones may be provided to be able to detect the direction of the sound. The speaker holes 307 and 314 may include an external speaker hole 307 and a receiver hole 314 for communication connection. In a specific embodiment, the speaker holes 307 and 314 and the microphone hole 303 may be implemented by one hole, or a speaker (e.g., a piezoelectric speaker) may be included without the speaker holes 307 and 314.
[0061] The sensor modules 316 and 319 may generate an electrical signal or data value corresponding to an internal operating state or an external environmental state of the electronic device 101. The sensor modules 316 and 319 may include, for example, a first sensor module 304 (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on the first surface 310A of the housing 310, and / or a third sensor module 319 (e.g., an HRM sensor) and / or a fourth sensor module 316 (e.g., a fingerprint sensor) disposed on the second surface 310B of the housing 310. The fingerprint sensor may be disposed on the first surface 310A (e.g., the display 310) and the second surface 310B of the housing 310. The electronic device 101 may further include at least one of the sensor modules (not shown), for example, a gesture sensor, a gyroscope sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor 304.
[0062] The camera modules 305, 312 and 313 may include a first camera module 305 disposed on a first surface 310A of the electronic device 101, and a second camera module 312 and / or a flash 313 disposed on a second surface 310B. The camera modules 305 and 312 may include one or more lenses, image sensors and / or image signal processors. The flash 313 may include, for example, a light emitting diode or a xenon lamp. In a particular embodiment, two or more lenses (an IR camera, and a wide-angle lens and a long-distance lens) and an image sensor may be disposed on one surface of the electronic device 101.
[0063] The connector holes 308 and 309 may include a first connector hole 308 and / or a second connector hole (or headphone jack) 309, wherein the first connector hole 308 may accommodate a connector (e.g., a USB connector) for sending power and / or data to / receiving power and / or data from an external electronic device, and the second connector hole 309 may accommodate a connector for sending audio signals to / receiving audio signals from an external electronic device.
[0064] In certain embodiments, it may be aesthetically pleasing to have the display 301 display items on a majority of the first surface 310A. However, it is also desirable to have the camera functionality provided by the camera module 305. The camera module 305 uses a line of sight to the exterior of the electronic device 101 through an opening in the display 301 of the electronic device 101.
[0065] Figure 4 is an exploded perspective view of an electronic device 101 according to certain embodiments of the present disclosure.
[0066] Reference Figure 4 , the electronic device 101 (eg, Figures 1 to 3 The electronic device 101 may include a side frame structure 331, a first support member 332 (e.g., a bracket), a front panel 320, a display 330, a printed circuit board 340, a battery 350, a second support member 360 (e.g., a back cover), an antenna 370, and a back panel 380. In certain embodiments, the electronic device 101 may omit at least one of the constituent elements (e.g., the first support member 332 or the second support member 360), or additionally include another constituent element. At least one constituent element of the electronic device 101 may be different from the other constituent elements. Figure 2 or Figure 3 At least one constituent element of the electronic device 101 is the same or similar, and a repeated description thereof will be omitted below.
[0067] The first support member 332 may be disposed inside the electronic device 101 and connected to the side frame structure 331, or may be formed integrally with the side frame structure 331. The first support member 332 may be formed of, for example, a metal material and / or a non-metal material (e.g., a polymer material). The first support member 332 may be engaged with the display 330 on one surface thereof and engaged with the printed circuit board 340 on another surface thereof. The processor, memory, and / or interface may be mounted on the printed circuit board 340. The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.
[0068] The memory may include, for example, volatile memory or non-volatile memory.
[0069] The interface may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. For example, the interface may electrically or physically connect the electronic device 101 to an external electronic device and include a USB connector, an SD card / MMC connector, or an audio connector.
[0070] The battery 350 is a unit for supplying power to at least one constituent element of the electronic device 101, and may include, for example, a non-rechargeable (primary) battery, a rechargeable (secondary) battery, or a fuel cell. For example, at least a portion of the battery 350 may be disposed in substantially the same plane as the printed circuit board 340. The battery 350 may be integrally disposed inside the electronic device 101, or may be disposed to be attachable to / detachable from the electronic device 101.
[0071] The antenna 370 may be disposed between the back plate 380 and the battery 350. The antenna 370 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. For example, the antenna 370 may perform near field communication with an external electronic device, or may wirelessly send / receive power required for charging. In another embodiment, the antenna structure may be obtained by some or a combination of the side frame structure 331 and / or the first support member 332.
[0072] According to a specific embodiment of the present disclosure, the electronic device may include a plurality of communication units 390. For example, for the purpose of multiple input multiple output (MIMO) implementation, some of the plurality of communication units 390 may be implemented to send / receive radio waves with different characteristics from each other (temporarily referred to as radio waves of A band and B band). As another example, for the purpose of diversity implementation, some of the plurality of communication units 390 may be set to, for example, simultaneously send / receive radio waves with the same characteristics as each other (temporarily referred to as radio waves of A1 frequency and A2 frequency in A band). As another example, for the purpose of diversity implementation, some of the plurality of communication units 390 may be set to, for example, simultaneously send / receive radio waves with the same characteristics as each other (temporarily referred to as radio waves of B1 frequency and B2 frequency in B band). In an embodiment of the present disclosure, the electronic device may include two communication units. However, in another embodiment of the present disclosure, the electronic device 101 may include four communication units and implement both MIMO and diversity. In yet another embodiment, the electronic device 101 may include only one of the communication units 390.
[0073] According to the embodiment, in the case where one of the communication units is disposed at a first position of the printed circuit board 340 in consideration of the transmission / reception characteristics of radio waves, the other communication unit may be disposed at a second position separated from the first position of the printed circuit board 340. As another example, one communication unit and the other communication unit may be disposed in consideration of a distance spaced apart from each other according to diversity characteristics.
[0074] According to an embodiment, at least one of the communication units 390 may include a wireless communication circuit that processes radio waves sent / received in an extremely high frequency band (e.g., between 6 GHz and 300 GHz). The radiating conductor of at least one communication unit 390 may include, for example, a patch-type radiating conductor or a radiating conductor having a dipole structure extending in one direction, and a plurality of radiating conductors may be arranged to obtain an antenna array. A chip (e.g., an integrated circuit chip) or the like that implements a portion of the wireless communication circuit may be disposed on one side of an area where a radiating conductor is disposed or on a surface facing in the opposite direction of a surface where a radiating conductor is disposed, and may be electrically connected to the radiating conductor (e.g., wiring formed by a printed circuit pattern).
[0075] As can be seen, the side bezel includes a camera module 440. The camera module uses a line of sight to the exterior of the electronic device 101. In certain embodiments, the line of sight includes an opening in the display 330. The opening can potentially reduce the ratio of surface area to the surface 310A used for display.
[0076] Figure 5 is a perspective view of an electronic device to which a camera module is coupled according to certain embodiments of the present disclosure.
[0077] Figure 6 yes Figure 5 Cross-sectional view of the A-A' plane.
[0078] according to Figure 5 and Figure 6 , the electronic device 101 may include a supporting member 410 , a front panel 420 , a display 430 , a camera module 440 , an adhesive member 450 , and a sealing member 460 . Figure 5 and Figure 6 The configurations of the support member 410, the front panel 420, the display 430 and the camera module 440 may be similar to Figures 1 to 4 The configurations of the first supporting member 332, the front panel 320, the display 330 and the camera module 180 or 305 are all or partially the same.
[0079] According to certain embodiments, the front plate 420 may form the exterior of the electronic device 101. For example, one surface of the front plate 420 may form a first surface of the electronic device 101 (eg, Figure 2 The first surface 310A of the front panel 420 may be provided on the electronic device 101, and the other surface of the front panel 420 may be in contact with the display 430. In the case where the display 430 outputs a display screen, the electronic device 101 may output the display screen from the display 430 through the front panel 420.
[0080] The display 430 may be disposed below the front panel 420. For example, the display 430 may be disposed in the second direction (-X direction) of the front panel 420, and a screen output from the display 430 may be provided to the user through the front panel 420.
[0081] The display 430 may include various configurations in order to output a screen and detect a user's input to the electronic device 101. For example, the display 430 may include a pixel layer 434 for outputting a screen, a touch screen panel 436 for detecting a user's input, a first adhesive layer 438a for bonding the pixel layer 434 to the front plate 420, and a second adhesive layer 438b for bonding the touch screen panel 436 to the support member 410. According to an embodiment, the pixel layer 434 and the touch screen panel 436 may have a first opening (e.g., Fig. 9AAccording to another embodiment, the pixel layer 434 may have a shape including the first opening 432, and the touch screen panel 436 may have a shape not including the opening.
[0082] According to certain embodiments, in addition to the first adhesive layer 438a and the second adhesive layer 438b, the display 430 may further include an additional adhesive layer for bonding the pixel layer 434 and the touch screen panel 346 to the electronic device 101. For example, the display 430 may be bonded to the support member 410 through the third adhesive layer 470.
[0083] According to certain embodiments, the support member 410 may support various configurations of the electronic device 101. For example, at least one of the display 430 and the camera module 440 may be coupled to the support member 410 so that vibration may be prevented.
[0084] According to certain embodiments, the support member 410 may be formed in various shapes. For example, the support member 410 may include a first area 412 and at least one second area 414 disposed below the display 430. According to an embodiment, the first area 412 may be an area of the support member 410 substantially parallel to the display 430. According to an embodiment, the second area 414 may be an area protruding from the first area 412 in the second direction (-X direction). For example, the second area 414 may include at least one of a rib, a protruding area, or a separator protruding from the first area 412.
[0085] According to a specific embodiment, the second area 414 of the support member 410 may be formed in various shapes so as to engage with the camera module 440. According to an embodiment, the second area 414 may be formed in a stepped shape. For example, the second area 414 may include a third surface 414a facing the second surface 444b of the camera module 440, a fourth surface 414b extending from the third surface 414a in a direction different from the direction of the third surface 414a, and a protrusion 414c protruding from the fourth surface in the second direction (-X direction) below the fourth surface 414b. The fourth surface 414b may be formed to face various directions. According to an embodiment, the fourth surface 414b may be formed in a direction substantially parallel to the first surface 444a. According to another embodiment, the fourth surface 414b may be formed to extend from the third surface 414a in a direction between the second direction (-X direction) and the third direction (+Y direction). The fourth surface 414b may be formed in various shapes. For example, the fourth surface 414b may be formed as a flat or curved surface. According to certain embodiments, the protrusion 414c protruding from the fourth surface 414b in the second direction (-X direction) can be formed in various shapes. According to embodiments, the protrusion 414c can be formed in a stepped shape. For example, the protrusion 414c may include at least one surface facing the second direction (-X direction) and at least one surface facing the third direction (+Y direction). The protrusion 414c may be formed as a cuboid including a rib facing the second surface 444b of the camera housing 444.
[0086] According to a specific embodiment, the second area 414 may be formed in various shapes in order to support the camera module 440. For example, the second area 414 may face at least one surface of the camera module 440 formed in a hexahedral shape. A plurality of second areas 414 may be formed, and the plurality of second areas 414 face the second surface 444b of the camera module 440 at a plurality of points. According to another embodiment, the second area 414 may face the second surface 444b on one surface. According to yet another embodiment, the second area 414 may be formed in a shape surrounding the second surface 444b of the camera module 440.
[0087] According to certain embodiments, the camera module 440 disposed inside the electronic device 101 may obtain an image outside the electronic device 101. For example, the camera module 440 may be disposed on the support member 410 and obtain an image outside through the first transparent area 424a.
[0088] According to certain embodiments, the camera module 440 may include at least one lens 442. According to embodiments, the at least one lens 442 may adjust the focus of the image sensor 448 facing the first direction (+X direction). For example, the camera module 440 may adjust the focus of the image sensor 448 using a first lens 442a and a second lens 442b forming the same virtual axis.
[0089] According to certain embodiments, the camera module 440 may obtain an image of the outside of the first transparent area 424a of the front plate 420 through at least one lens 442. The at least one lens 442 may be disposed in the camera housing 444 corresponding to at least one of the first opening 432 and the second opening 418. For example, the at least one lens 442 may be disposed in the body tube 446.
[0090] According to certain embodiments, the camera module 440 may include a camera housing 444. The camera housing 444 forms the exterior of the camera module 440, and components of the camera module 440 are disposed in the camera housing 444. The camera housing 444 may be formed in various shapes. According to embodiments, the camera housing 444 may include a first surface 444a facing the first area and a second surface 444b formed to extend below the first surface 444a and facing the second area 414. The direction below the first surface 444a may be defined as a second direction (-X direction).
[0091] According to certain embodiments, the camera housing 444 may include a body tube 446. The body tube 446 may be formed to extend from the first surface 444a in the first direction (+X direction) and be disposed in the first opening 432 and the second opening 418. For example, the body tube 446 may be formed to extend from the first surface 444a to the front plate 420 through the first opening 432 and the second opening 418. According to embodiments, the body tube 446 may be in contact with the first transparent area 424a of the front plate 420. The body tube 446 may be disposed to be separated from the first transparent area 424a of the front plate 420 by a given distance.
[0092] According to a specific embodiment, the adhesive member 450 may adhere the support member 410 to the camera module 440. The adhesive member 450 may be cured to contact the second area 414 of the support member 410 and the second surface 444b of the camera housing 444, and may bond the camera module 440 to the support member 410. According to another embodiment, the adhesive member 450 may be cured to contact the third surface 414a, the fourth surface 414b, and the protrusion 414c of the support member 410, and may bond the camera module 440 to the support member 410. As the area where the adhesive member 450 contacts the support member 414 increases, the adhesive force between the camera module 400 and the support member 410 may be increased.
[0093] According to certain embodiments, the adhesive member 450 may include various materials. According to embodiments, the adhesive member 450 may include a curable material when a predetermined condition is met. For example, the adhesive member 450 may change from a liquid state to a solid state when a predetermined condition is met. The adhesive member 450 may include at least one of polyurethane, silicone, or epoxy. The predetermined condition may be a condition regarding applying ultraviolet curing, natural curing, or hot air curing to the liquid adhesive member 450.
[0094] According to certain embodiments, the electronic device 101 may include a sealing member 460. The sealing member 460 may be disposed between the support member 410 and the camera housing 444 so as to prevent the adhesive member 450 from penetrating into the viewing angle A of the camera module 440. For example, the sealing member 460 may be formed in a shape surrounding the second opening 418. According to an embodiment, the sealing member 460 may be disposed in the shape of a closed curve between the first region 412 of the support member 410 and the first surface 444a of the camera housing 444. According to another embodiment, the sealing member 460 may be disposed in the shape of a closed curve between the second region 414 of the support member 410 and the second surface 444b of the camera housing 444.
[0095] According to an embodiment, the sealing member 460 may include a porous material. For example, the sealing member 460 may include a sponge.
[0096] Figure 7 is a front view of an electronic device according to certain embodiments of the present disclosure. Figure 8 yes Figure 7 Cross-sectional view of the A-A' plane.
[0097] according to Figure 7 and Figure 8 , the electronic device 101 may include a supporting member 410 , a front panel 420 , a display 430 , a camera module 440 , and an adhesive member 450 . Figure 7 and Figure 8 The configurations of the support member 410, the front panel 420, the display 430, the camera module 440, and the adhesive member 450 may be similar to Figure 5 and Figure 6 The configurations of the supporting member 410, the front panel 420, the display 430, the camera module 440, and the adhesive member 450 are all or partially the same.
[0098] According to certain embodiments, the front plate 420 may include a substantially transparent region 424 and a substantially opaque region 426. For example, the front plate 420 may be formed of tempered glass. According to embodiments, the opaque region 426 may be defined as a region where a coating of an opaque material is applied to the front plate 420, and the transparent region 424 may be defined as a region of the front plate 420 having a higher light transmittance than the opaque region 426.
[0099] According to certain embodiments, the transparent area 424 may be formed in various shapes. For example, the transparent area 424 may include a first transparent area 424a facing the camera module 440 and a second transparent area 424b facing the display 430 for outputting the screen. The opaque area 426 may be formed in a shape surrounding the first transparent area 424a.
[0100] According to certain embodiments, at least one of the first transparent region 424a or the opaque region 426 may be substantially the same as that configured to be displayed on a display (eg, Figure 6 Icons 560 on display 430) are formed in a similar size to provide aesthetic appeal.
[0101] According to certain embodiments, a first opening 432 may be formed in the display 430, and at least a portion of the first opening 432 may correspond to the transparent region 424. For example, at least a portion of the first opening 432 may correspond to the first transparent region 424a. According to embodiments, the first opening 432 corresponding to the first transparent region 424a may represent an opening formed separately from the first transparent region 424a in the second direction (-X direction).
[0102] According to certain embodiments, a second opening 418 corresponding to at least a portion of the first opening 432 may be formed in the first region 412 of the support member 410. For example, the second opening 418 may be formed in the first opening 432 and the first region 412 of the support member 410 corresponding to the second transparent region 424b. The camera module 440 disposed on the support member 410 may obtain an external image through the second opening 418. According to embodiments, the second opening 418 corresponding to the first opening 432 may be an opening spaced apart from the first opening 432 in the second direction (-X direction) and formed in the support member 410.
[0103] According to certain embodiments, the camera module 440 may include an image sensor 448 oriented in a first direction (+X direction) facing the outside of the electronic device 101. The image sensor 448 may obtain an image within a viewing angle A through the first transparent area 424a. The viewing angle A may be located within the first transparent area 424a and may not overlap with the opaque area 426.
[0104] According to certain embodiments, the support member 410 and the camera module 440 may be formed in various shapes in order to cure the adhesive member 450. The first length L1 of the second region 414 in the first direction (+X direction) may be shorter than the second length L2 of the second surface 444b of the camera housing 444 in the first direction (+X direction).
[0105] According to certain embodiments, the amount of light absorbed by the adhesive member 450 may be changed based on the shape of the support member 410. For example, the amount of light (e.g., ultraviolet light) absorbed by the adhesive member 450 when the first length L1 is shorter than the second length L2 may be greater than the amount of light absorbed by the adhesive member 450 when the first length L1 is longer than the second length L2. The amount of light may be defined as at least one of a luminous flux or a luminous intensity. The time for the adhesive member 450 to cure may be changed based on the amount of light absorbed by the adhesive member 450. For example, the curing time of the adhesive member 450 located at the support member 410 where the first length L1 is shorter than the second length L2 forming the second region 414 may be shorter than the curing time of the adhesive member 450 located at the support member 410 where the first length L1 is longer than the second length L2 forming the second region 414.
[0106] According to certain embodiments, the support member 410 may further include a third region 416 substantially parallel to the first region 412. The camera housing 444 may be disposed in a space defined by the first region 412, the second region 414, and the third region 416.
[0107] According to certain embodiments, the camera housing 444 may include a fifth surface 444c facing the third region 416. The fifth surface 444c may be provided separately from the third region 416. The adhesive member 450 may not be provided between the fifth surface 444c and the third region 416. Because an empty space having a thickness of the third length L3 is formed between the fifth surface 444c and the third region 416, there is a wider tolerance for inserting the camera module 440 when manufacturing the electronic device 101.
[0108] According to certain embodiments, the adhesive member 450 may be provided between the support member 410 and the camera module 440 in various shapes. For example, the adhesive member 450 may be formed to correspond to the shapes of the support member 410 and the camera housing 444. In the case where the second region 414 of the support member 410 is formed in a stepped shape, the first adhesive member 450a may contact the third surface 414a, the fourth surface 414b, and the protrusion 414c of the second region 414 and the camera housing 444. According to another embodiment, in the case where the second region 414 of the support member 410 is formed to protrude in the second direction (-X direction), the second adhesive member 450b may contact the second region 414 and the camera housing 444.
[0109] Fig. 9A is a diagram illustrating a method for manufacturing an electronic device according to a specific embodiment of the present disclosure, Fig. 9B is a diagram illustrating a method for manufacturing an electronic device according to a specific embodiment of the present disclosure, and Fig. 9C is a diagram illustrating a method of manufacturing an electronic device according to a certain embodiment of the present disclosure. Fig.10 is a diagram illustrating a method of bonding a camera module to a supporting member according to certain embodiments of the present disclosure. Fig.11 is a flowchart illustrating a method of manufacturing an electronic device according to a certain embodiment of the present disclosure.
[0110] according to FIG. 9A to FIG. 11 , the manufacturing method of the electronic device 101 may include bonding the front panel 420 and the display 430 to the support member 410 (S110), adjusting the position of the camera module 440 relative to the support member 410 (S120), disposing the adhesive member 450 between the camera module 440 and the support member 410 (S130), and curing the adhesive member 450 (S140). Fig.11 The configuration of the electronic device 101, the support member 410, the front plate 420, the display 430, the camera module 440 and the adhesive member 450 may be similar to Figure 5 and Figure 6 The configurations of the electronic device 101, the supporting member 410, the front panel 420, the display 430 and the camera module 440 are all or partially the same.
[0111] According to certain embodiments, a method of manufacturing the electronic device 101 may include forming a substantially transparent region (eg, Figure 7 transparent areas 424) and substantially opaque areas (e.g., Figure 7 The front plate 420 having an opaque area 426 and a first opening (eg, Figure 8 The display 430 is bonded to the supporting member 410 through a first process ( S110 ) of forming a first opening 432 of the display 430 , wherein at least a portion of the first opening corresponds to the transparent area 424 .
[0112] according to Fig. 9A , the front plate 420 and the display 430 may be joined to one surface of the support member 410 in a joined state. For example, the front plate 420 may be joined to the display 430 so that the first transparent area (eg, Figure 7 The first transparent area 424a of the front panel 420 corresponds to the first opening 432. The assembly in which the front panel 420 and the display 430 are joined may be joined so that the first opening 432 corresponds to the second opening 418 of the support member 410. According to an embodiment, the front panel 420 and the display 430 may be joined via a first adhesive layer (e.g., Figure 6According to an embodiment, the joined front panel 420 and the display 430 may be bonded via a third bonding layer (eg, Figure 6 The third adhesive layer 470) is bonded to the first region (eg, Figure 6 According to another embodiment, the front panel 420 and the display 430 may be bonded to the support member 410. For example, the display 430 may be bonded to one surface of the support member 410, and the front panel 420 may be bonded to one surface of the display 430.
[0113] According to certain embodiments, the display 430 and the support member 410 may be arranged such that the first opening 432 formed in the display 430 overlaps at least a portion of the second opening 418 formed in the support member 410. According to embodiments, the area of the second opening 418 may be formed to be larger than the area of the first opening 432. For example, when viewed in the second direction (-X direction), the first opening 432 may overlap the second opening 418.
[0114] According to certain embodiments, the method of manufacturing the electronic device 101 may include adjusting the position of the camera module 440 relative to the support member 410 by visual alignment so as to align the lens (eg, Figure 6 The axis of the lens 442 is aligned with the transparent area (e.g., Figure 7 According to an embodiment, the lens axis may be defined as the axis formed by the first lens (eg, Figure 6 The first lens 442a and the second lens (eg, Figure 6 According to another embodiment, the lens axis may be defined as a virtual lens axis formed by a main body tube (e.g., Figure 6 The midpoint of the transparent area can be defined as the first transparent area (e.g., Figure 7 For example, the first transparent area 424a may be formed in a circular shape, and the origin of the first transparent area 424a may be defined as the midpoint of the first transparent area 424a.
[0115] according to Fig. 9B and Fig.10 , the position of the camera module 440 can be adjusted relative to the support member 410 by visual alignment. According to an embodiment, the shape of the sixth surface 446a of the body tube 446, which is the surface facing the front plate 420, and the first transparent area (e.g., Figure 7 The shape of the first transparent area 424a).
[0116] According to certain embodiments, the camera module 440 may be disposed on the support member 410, wherein the front panel 420 and the display 430 are coupled to the support member 410 by the jig 520. For example, the jig 520 for adjusting the position of the camera module 440 may be configured to adjust the lens (e.g., Figure 6 The axis of the lens 442 is aligned to be substantially the same as the axis of the first transparent region 424a. According to an embodiment, since the first transparent region 424a is defined by an opaque region (e.g., Figure 7 The transparent area (eg, Figure 7 The camera module 440 may be arranged so that the axis of the lens 442 and the axis of the opaque region 426 are substantially the same as each other. The camera module 440 may be engaged with the jig 520 using vacuum suction, and its position may be adjusted relative to the support member.
[0117] According to certain embodiments, the manufacturing method of the electronic device 101 may include a third process (S130) of disposing the adhesive member 450 between the camera module 440 and the support member 410. For example, the adhesive member 450 may be disposed between the second region 414 of the support member 410 and the camera housing (e.g., Figure 6 A second surface of the camera housing 444 (eg, Figure 6 According to an embodiment, the adhesive member 450 may be disposed between the second region 414 and the second surface 444b in a fluid state.
[0118] according to Fig. 9C and Fig.10 , the adhesive member 450 may be disposed between the camera module 440 and the support member 410 by various methods. For example, the adhesive member 450 may be disposed between the camera module 440 and the support member 410 based on at least one of application, injection, or spraying. According to an embodiment, the adhesive member 450 may be supplied by the external coating unit 550 and disposed on the support member 410.
[0119] According to certain embodiments, the adhesive member 450 may be disposed at various positions in the space between the camera module 440 and the support member 410. According to an embodiment, the adhesive member 450 may be disposed to surround the camera module 440 and the support member 410 in the shape of a closed curve. For example, the adhesive member 450 may be disposed in a shape surrounding the second surface 444b of the camera housing 444. According to another embodiment, the adhesive member 450 may be disposed in a shape surrounding a portion of the camera module 440. For example, the adhesive member 450 may be disposed at a portion of the second surface 444b of the camera module 440.
[0120] According to certain embodiments, the method of manufacturing the electronic device 101 may include a fourth process (S140) of curing the adhesive member 450. The adhesive member 450 provided in the fluid state in the third process S130 may be changed into a solid state in the fourth process S140.
[0121] According to a specific embodiment, the adhesive member 450 may be cured by various methods. For example, the adhesive member 450 may be cured by at least one of ultraviolet curing, natural curing, or hot air curing. According to an embodiment, the adhesive member 450 may be formed of a material that is cured when absorbing ultraviolet light, and is cured by absorbing ultraviolet light that irradiates the electronic device 101. According to another embodiment, the adhesive member 450 may be formed of a material that is cured at room temperature, and is cured after a given time has passed after the adhesive member 450 is set. According to yet another embodiment, the adhesive member 450 may be formed of a material that is cured when a given amount of heat is absorbed, and the adhesive member 450 disposed between the support member 410 and the camera module 440 may be cured when a given amount of heat is absorbed.
[0122] According to a specific embodiment of the present disclosure, an electronic device includes: a front panel (eg, Figure 6 420), formed with a substantially transparent area (e.g., Figure 7 transparent areas 424) and substantially opaque areas (e.g., Figure 7 Opaque area 426); display (e.g., Figure 6 The display 430 is disposed below the front plate and has a first opening (eg, Figure 8 a first opening 432 of the support member (eg, Figure 6 The support member 410 is disposed below the display and includes a first area (eg, Figure 6 a first region 412) and at least one second region (e.g., Figure 6 The first region includes a second opening (eg, Figure 8The second opening 418 of the camera module (eg, Figure 5 The camera module 440 includes a camera housing (eg, Figure 6 camera housing 444) and at least one lens (e.g., Figure 6 442), wherein the camera housing includes a first surface facing the first area (eg, Figure 6 The first surface 444a of the embodiment of the present invention and the second surface (eg, Figure 6 a second surface 444b of the camera housing, at least one lens disposed in at least one of the first opening and the second opening; and an adhesive member (eg, Figure 6 Adhesive member 450).
[0123] According to certain embodiments, the electronic device may further include a sealing member (eg, Figure 6 Sealing member 460).
[0124] According to certain embodiments, the camera housing may include a body tube (eg, Figure 8 Main body tube 446).
[0125] According to certain embodiments, at least one lens may be disposed in the body tube and facing the transparent area.
[0126] According to certain embodiments, the bonding member may be formed of at least one of polyurethane, silicone, or epoxy.
[0127] According to certain embodiments, the second area may be formed to surround at least a portion of the camera module.
[0128] According to certain embodiments, the second region may include a third surface (eg, Figure 6 A third surface 414a formed substantially parallel to the first surface (eg, Figure 6 The fourth surface 414b) and a protrusion (eg, Figure 6 protrusion 414c).
[0129] According to certain embodiments, the adhesive member may contact the second surface, the third surface, and the fourth surface and couple the camera housing to the support member.
[0130] According to certain embodiments, the transparent region may include a first transparent region (eg, Figure 7A first transparent area 424a) and a second transparent area located above the display (eg, Figure 7 The second transparent area 424b), and the opaque area can be formed in a shape surrounding the first transparent area.
[0131] According to certain embodiments, a display may include a layer of pixels (e.g., Figure 6 The pixel layer 434), the first adhesive layer (eg, Figure 6 a first adhesive layer 438a), a touch screen panel for detecting a user's input (eg, Figure 6 A touch screen panel 436) and a second adhesive layer (eg, Figure 6 A second adhesive layer 438b may be formed, and a first opening may be formed to pass through at least a portion of the pixel layer and at least a portion of the touch screen panel.
[0132] According to certain embodiments, the camera module may include a first direction oriented toward the exterior of the electronic device (eg, Figure 6 The image sensor (for example, Figure 8 of the image sensor 480), and a first length (eg, Figure 8 The first length L1) may be greater than the second length (eg, Figure 8 The second length L2) is shorter.
[0133] According to certain embodiments, the support member may include a third region (eg, Figure 8 The camera housing may include a fifth surface (eg, Figure 8 The fifth surface 444c), and the fifth surface can be configured to be separated from the third area.
[0134] According to certain embodiments, the adhesive member may not be in contact with the fifth surface of the camera housing.
[0135] According to a specific embodiment of the present disclosure, a method for manufacturing an electronic device includes: a first process of joining a front panel having a substantially transparent area and a substantially opaque area and a display having a first opening corresponding to at least a portion of the transparent area to a supporting member; a second process of adjusting a position of a camera module relative to the supporting member by visual alignment so as to align a lens axis of the camera module to be substantially the same as a midpoint of the transparent area; a third process of setting an adhesive member between the camera module and the supporting member; and a fourth process of curing the adhesive member.
[0136] According to certain embodiments, visual alignment can be achieved when the lens of the camera module faces the light (e.g. Fig.10 The first direction of the light L) is performed, wherein the external camera (for example, Fig.10 The visual camera 510) is in a second direction (eg, Figure 6 The light is emitted in a second direction (-X direction).
[0137] According to certain embodiments, in the second process, the position of the camera module may be adjusted relative to the supporting member based on a jig for adjusting the position of the camera module.
[0138] According to certain embodiments, in the third process, the adhesive member may be disposed between the camera module and the supporting member in a fluid state.
[0139] According to certain embodiments, in the third process, the adhesive member may be disposed between the camera module and the support member based on at least one of applying, injecting, or spraying.
[0140] According to certain embodiments, in the fourth process, the bonding member may be cured by at least one of ultraviolet curing, natural curing, or hot air curing.
[0141] According to a specific embodiment, an electronic device includes: a front plate, including a transparent area and an opaque area; a display, arranged below the front plate and including a first opening corresponding to at least a portion of the transparent area; a supporting member, arranged below the display and including a first area and at least one second area protruding below the first area, the first area including a second opening corresponding to at least a portion of the first opening; a camera housing, including a first surface facing the first area and a second surface extending below the first surface and facing the at least one second area, at least one lens, arranged in at least one of the first opening and the second opening; and an adhesive member, arranged between the camera housing and the second area; and wherein the bottom portion of the camera housing is separated from a third area of the supporting member arranged below the camera housing by a gap.
[0142] It is obvious to those skilled in the art that the electronic device including the camera module of the specific embodiment of the present disclosure described above is not limited to the above embodiments and drawings, and various substitutions, modifications and changes may be made within the technical scope of the present disclosure.
Claims
1. An electronic device, comprising: a front plate, including a transparent area and an opaque area; a display disposed below the front plate and including a first opening corresponding to at least a portion of the transparent area; a support member disposed below the display and comprising a first region and at least one second region protruding below the first region, wherein the first region comprises a second opening corresponding to at least a portion of the first opening; a camera housing including a first surface facing the first area and a second surface extending below the first surface and facing the at least one second area; at least one lens disposed in at least one of the first opening and the second opening; and an adhesive member disposed between the camera housing and the second region, The second area includes: a third surface facing the second surface of the camera housing; a fourth surface extending from the third surface and extending in a direction away from the camera housing; and a protrusion that protrudes below the fourth surface and includes a surface facing the second surface of the camera housing, wherein the adhesive member contacts the second surface of the camera housing, the one surface of the protrusion, the third surface of the second area, and the fourth surface of the second area to join the camera housing to the supporting member, wherein the bottom portion of the camera housing is separated from the third area of the supporting member disposed below the camera housing by a gap.
2. The electronic device as claimed in claim 1, further comprising: The sealing member is provided between the first area and the camera housing in the shape of a closed curve.
3. The electronic device according to claim 1, wherein: The camera housing includes a main body tube extending from the first surface and disposed in the first opening and the second opening.
4. The electronic device as claimed in claim 3, wherein: The at least one lens is disposed in the main body tube facing the transparent area.
5. The electronic device as claimed in claim 1, wherein: The adhesive member includes at least one of polyurethane, silicone, or epoxy.
6. The electronic device as claimed in claim 1, wherein: The second region surrounds at least a portion of the camera housing.
7. The electronic device as claimed in claim 1, wherein: The fourth surface is formed substantially parallel to the first surface.
8. The electronic device as claimed in claim 1, wherein: The transparent area includes a first transparent area located at a position corresponding to the first opening and a second transparent area located above the display; as well as The opaque area is formed in a shape surrounding the first transparent area.
9. The electronic device as claimed in claim 1, wherein: The display includes a pixel layer forming a screen, a first adhesive layer bonding the pixel layer to a front plate, a touch screen panel configured to detect a user's input, and a second adhesive layer bonding the touch screen panel to a supporting member; as well as The first opening passes through at least a portion of the pixel layer and at least a portion of the touch screen panel.
10. The electronic device of claim 1, wherein: The camera housing includes an image sensor oriented in a first direction facing the exterior of the electronic device; as well as The length of the second area in the first direction is shorter than the length of the second surface of the camera housing in the first direction.
11. The electronic device of claim 1, wherein: The support member includes a third region substantially parallel to the first region; The camera housing includes a fifth surface facing the third area; as well as The fifth surface is disposed separately from the third area.
12. The electronic device according to claim 11, wherein: The adhesive member is spaced apart from the fifth surface of the camera housing.
13. A method for manufacturing the electronic device according to claim 1, comprising: bonding a front plate having a transparent area and an opaque area and a display including a first opening corresponding to at least a portion of the transparent area to a support member; adjusting the position of the camera module relative to the support member by aligning a lens axis of the camera module to be substantially the same as a midpoint of the transparent area; providing an adhesive member between the camera module and the supporting member; and Curing the bonded components, The supporting member includes a first region and at least one second region protruding below the first region, the first region includes a second opening corresponding to at least a portion of the first opening, The camera housing includes a first surface facing the first area and a second surface extending below the first surface and facing the at least one second area. The second area includes: a third surface facing the second surface of the camera housing; a fourth surface extending from the third surface and extending in a direction away from the camera housing; and a protrusion that protrudes below the fourth surface and includes a surface facing the second surface of the camera housing, wherein the adhesive member contacts the second surface of the camera housing, the one surface of the protrusion, the third surface of the second area, and the fourth surface of the second area to join the camera housing to the supporting member, wherein the bottom portion of the camera housing is separated from the third area of the supporting member disposed below the camera housing by a gap.
Citation Information
Patent Citations
Portable electronic device
CN208956052U