A movable inductive heating circuit board repair machine

Abstract

The application discloses a movable induction heating circuit board repair machine, which comprises a base, an X-axis beam, a feeding platform and an induction heating assembly; the feeding platform is laid on the base and connected with the base; the X-axis beam is arranged above the feeding platform and connected with the base; and the induction heating assembly is arranged on the X-axis beam and connected with the X-axis beam and moves on the X-axis beam in the X-axis direction. The movable induction heating circuit board repair machine provided by the applicant takes the induction heating assembly as a heat source for welding or de-welding in a repair process, and when applied to a specific circuit board repair process, the equipment itself has a simple structure, is convenient to manufacture, has low manufacturing cost, can flexibly adapt to circuit boards with different sizes, and has good de-welding or secondary welding effect, so that the movable induction heating circuit board repair machine can be conveniently applied to a wide circuit board repair scene.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of precision machining, and particularly relates to a circuit board repair machine. BACKGROUND

[0002] The circuit board is often composed of a substrate, solder and electronic components. After the circuit design is completed, the circuit line part is printed on the substrate, and the position of the electronic component in the circuit design is laid out. The solder pad is reserved on the substrate. During manufacturing, the specified component is moved to the corresponding position, and the metal pad of the component is corresponded to the solder pad on the substrate. After the solder is applied on the solder pad, the specified heat source is used to heat the solder to melt it. The melted solder connects the electronic component and the solder pad. The electronic component is thus connected to the substrate to complete the welding process of the circuit board.

[0003] With the development of electronic technology and the progress of packaging technology, the circuit scale is becoming larger and larger, the circuit layout is becoming more and more compact, and the volume of a single electronic component is becoming smaller and smaller. The number of electronic components to be welded on a single substrate is also increasing, and the distance between adjacent electronic components is also becoming smaller. The manufacturing process of the circuit board requires higher and higher processing precision. Due to the same reason, after the single circuit board is formed, the probability of damage, deviation, missing or falling of the component in the local area of the circuit board due to the failure of the component itself or the processing error is also multiplied. However, there is a lack of repair equipment for the circuit board formed at one time in the prior art, and there is no effective remedy for the defective products in the production process. Therefore, once one or more electronic components fail, the entire circuit board is completely scrapped, which not only greatly increases the production cost, but also causes waste of raw materials. Therefore, how to construct a circuit board repair equipment that can perform corresponding repair operations on the circuit board with local faults and individual electronic components that need to be repaired to repair the defective products in the production process is a technical problem that needs to be solved by those skilled in the art. SUMMARY

[0004] To solve the above problems, the purpose of the present application is to provide a circuit board repair machine. The repair machine uses an induction heating assembly as a heat source to accurately and efficiently disassemble the original damaged specified component of the circuit board that needs to be repaired, and replaces it with a new and functional component to complete the repair. Due to the flexible arrangement between different components, the repair machine has good adaptability when performing repair tasks. Not only does it have good mobility, but it also has lower manufacturing costs and can better adapt to circuit boards with different repair requirements, making it suitable for a wider range of circuit board processing scenarios.

[0005] To achieve the above purpose, the technical solution of the present application is as follows:

[0006] An active induction heating circuit board repair machine, the repair machine comprising:

[0007] Base: for providing installation foundation and structural support;

[0008] X-axis beam: for providing movement path along X-axis direction and controllable driving force;

[0009] Feeding platform: with freedom along Y-axis direction, for carrying the circuit board to be repaired;

[0010] and an induction heating assembly for making de-soldering or soldering heating on the circuit board based on the induction heating principle;

[0011] The feeding platform is laid on the base and connected with the base; the X-axis beam is arranged above the feeding platform and also connected with the base; the induction heating assembly is arranged on the X-axis beam and connected with the X-axis beam, and moves along the X-axis direction on the X-axis beam.

[0012] The induction heating technology is based on Faraday's electromagnetic induction principle, and is widely used in various industrial processes due to its fast heating speed, high thermal efficiency, and good controllability of the heating process.

[0013] The induction heating assembly is provided in the circuit board repair machine provided in the present application. The essence of the induction heating assembly is to apply induction heating technology. The induction heating assembly is connected with an external alternating power supply. When the induction heating assembly is connected with the external alternating power supply, the alternating current provided by the external alternating power supply flows into the induction heating assembly. The induction heating assembly converts the alternating current into an alternating magnetic field and radiates it to the surrounding space. In this way, the induction heating assembly and the circuit board to be repaired are moved, and the part of the circuit board to be repaired is moved to the range of the alternating magnetic field. The alternating magnetic field will inductively heat the metal devices in its range. For the circuit board, most of the circuit boards are made of non-metal materials as the substrate, and specific metal materials are used to make the circuit, pad, solder, and the pad of the element. Therefore, after the part of the circuit board to be repaired is moved to the magnetic field range of the induction heating assembly, the alternating magnetic field generated at the induction heating assembly can accurately inductively heat the pad, solder, and the pad of the element in the magnetic field range without damaging the substrate, melt the solder, help the element to be disassembled or re-solder a new element. For the case where the substrate itself is also made of metal material, since the heating efficiency of the induction heating assembly on the pad, solder, and the pad of the element is very high, the solder can be melted in a short time. By controlling the heat processing time and the spatial distribution of the alternating magnetic field, the influence of the induction heating process on the substrate can be minimized. After the solder is melted by single power supply, the heat processing process of disassembly or welding is completed. At this time, the external alternating power supply is turned off, which can avoid the influence of the induction heating assembly on other processes. That is, the induction heating assembly has excellent instantaneity and controllability in specific application. Since for the induction heating assembly, once powered on, it will convert the alternating current flowing into it into an alternating magnetic field radiating to the surrounding space. Once powered off, the alternating magnetic field will also disappear. Therefore, the technician only needs to control the conduction of the induction heating assembly and the external alternating power supply, control the power-on and power-off of the induction heating assembly at the expected time point, and complete the cooperation with the feeding platform. Since the induction heating technology has good controllability, a given induction heating assembly, after connecting with an external alternating power supply with certain parameters, the heating effect of the induction heating assembly on the specified heating object at the specified position is also determined and can be calculated in advance. Therefore, in actual application, the technician can set the related parameters of the induction heating assembly reasonably, so as to obtain stable and expected heating effect in the final heating process, and the controllability of the whole repair process is good.

[0014] In the technical scheme provided in the application, the induction heating assembly is arranged on the X-axis beam and can reciprocate along the X-axis beam, and the feeding platform has the freedom along the Y-axis direction, so that the construction range of the induction heating assembly can cover the movable range covered by the X-axis beam and the feeding platform, and the induction heating assembly can adapt to more size parameters of the circuit board to be repaired, and the induction heating assembly in the movable state can also cooperate with the feeding platform to change the position more flexibly, so that the heating efficiency is improved and each possible repair site can be reached more conveniently.

[0015] Further, the feeding platform comprises a Y-axis guide rail and a loading platform; the Y-axis guide rail is laid on the base and connected with the base; the loading platform is arranged on the Y-axis guide rail and connected with the Y-axis guide rail in a sliding manner; the loading platform has a space for placing the circuit board to be repaired.

[0016] Further, the induction heating assembly comprises a heating head motor and an induction heating head; the body of the heating head motor is arranged on the X-axis beam and connected with the X-axis beam and moves along the X-axis direction on the X-axis beam; the motor output shaft of the heating head motor extends and retracts along the Z-axis direction; the induction heating head is connected with the motor output shaft of the heating head motor.

[0017] Further, the induction heating head comprises a heating cone and an element suction pipe; the heating cone comprises a cone body and an induction groove; the induction groove is arranged on the cone body along a direction perpendicular to the top of the cone and the bottom of the cone; the induction heating head further comprises an element suction pipe; one end of the element suction pipe is laid along the induction groove, extends to one side of the top of the cone body, and extends out from a position where the induction groove intersects with the top of the cone body; the other end of the element suction pipe is connected with an external air source in communication. The induction groove is arranged on the cone body of the heating cone, so that the cone body is divided into a part close to one side of the groove wall, a part close to the groove bottom, and a part close to the other side of the groove wall. When the external alternating power is connected in communication, the control current flows along the part of the cone body close to one side of the groove wall, the part of the cone body close to the groove bottom, and the part of the cone body close to the other side of the groove wall, and is affected by the proximity effect of alternating current. Therefore, the alternating current tends to flow along the vicinity of the induction groove in the cone body, and the alternating magnetic field converted from the alternating current also concentrates in the vicinity of the induction groove. The cone body further restricts the spatial distribution of the alternating magnetic field, so that when the heating cone is driven to move downward, the small-range alternating magnetic field in the vicinity of the top of the cone body covers the specified area of the circuit board to be repaired, the pads, solders, and metal pads in the covered area generate heat correspondingly, the solders melt, and thus the small-range active heating of the fault area of the circuit board to be repaired is realized.

[0018] Since one of the tube openings of the component suction pipe extends from the position where the induction groove intersects with the top part of the cone of the heating cone, it will also be aligned with the faulty component at the position to be repaired during the downward movement of the heating cone. After the solder is melted, the external air source is controlled to change the air pressure inside the component suction pipe, so that the loosened faulty component can be sucked away and recycled through the component suction pipe, facilitating the removal of the faulty component.

[0019] Further, the repair machine also includes a positioning camera for shooting the actual pose of the circuit board to be repaired, and the positioning camera is arranged on the X-axis beam and connected with the X-axis beam and reciprocally moves along the X-axis beam.

[0020] Further, the repair machine also includes a soldering aid assembly, and the soldering aid assembly includes a tin head and / or a soldering flux head. The tin head is arranged on the X-axis beam and detachably connected with the X-axis beam, and after the tin head is connected with the X-axis beam, the tin head reciprocally moves along the X-axis beam. The soldering flux head is arranged on the X-axis beam and detachably connected with the X-axis beam, and after the soldering flux head is connected with the X-axis beam, the soldering flux head reciprocally moves along the X-axis beam.

[0021] Further, the repair machine also includes a component storage assembly for storing new components and a component manipulator for grabbing or releasing specified new components according to repair requirements. The component storage assembly is arranged below the X-axis beam and connected with the base. The component manipulator is arranged on the X-axis beam and connected with the X-axis beam and reciprocally moves along the X-axis beam. For a given circuit board, the specific model, specification parameters, appearance size, specific installation position of each component and the total number of the components on the entire circuit board are known. The component storage assembly is provided for new components, which can store all possible required new components and prepare for the circuit board to be repaired.

[0022] Furthermore, the rework machine also includes an auxiliary camera for working with the positioning camera to photograph the circuit board to be reworked, helping to obtain the actual position and orientation of the circuit board, or for photographing new components stored in the component storage assembly. The auxiliary camera is mounted on the X-axis beam, connected to the X-axis beam, and moves back and forth along the X-axis beam. The auxiliary camera is mainly used for two purposes: Firstly, in the rework machine provided in this application, a positioning camera and an auxiliary camera are set up to know the actual position and orientation of the current circuit board. Both the positioning camera and the auxiliary camera are mounted on the X-axis beam and can move closer or further apart along the X-axis. For the same circuit board to be reworked, the camera can simultaneously photograph the circuit board placed on the stage from both the left and right sides. By analyzing the captured images, the camera can obtain information such as the appearance size of the circuit board, its actual placement angle, and the position of the pre-marked points on its surface, thus obtaining images of the circuit board from two angles and different focal areas, providing more reliable support for analyzing the position and orientation of the current circuit board. On the other hand, since there are a large number of new components prepared, similar new components are often neatly stored in the storage component in a regular layout. Since the component storage component is set below the X-axis beam and the auxiliary camera is set on the X-axis beam and suspended above the component storage component, the new components stored in the component storage component will also be exposed to the shooting field of the auxiliary camera. The auxiliary camera can move along the X-axis beam to above the component storage component, take an image of the expected storage location, and locate the required individual new component based on the captured image. This provides detailed coordinates for selecting the individual new component and for the component robot to grasp the selected new component, making it convenient for the component robot to grasp accurately.

[0023] Furthermore, the rework machine also includes a component camera for capturing the actual position of the component grasped by the component robot. The component camera is positioned below the X-axis beam and connected to the base. By setting the component camera on the base and taking an upward-facing shot of the grasped component, the machine can identify the metal pads of the new component. This allows the component robot to further adjust the orientation of the grasped component during subsequent processing, aligning it with the existing pads on the circuit board for direct soldering. This avoids subsequent circuit failures and unsatisfactory rework results due to misalignment between the pads on the new component and the original pads on the circuit board substrate.

[0024] The advantages of this invention are as follows: The active induction heating circuit board rework machine provided by the applicant uses an induction heating component as the heat source for soldering or desoldering during the rework process. When applied to specific circuit board rework processes, the equipment itself is not only simple in structure, easy to manufacture, and has low manufacturing cost, but it can also flexibly adapt to circuit boards of different sizes and achieve good desoldering or secondary soldering effects, making it convenient to be applied in a wide range of circuit board rework scenarios. Attached Figure Description

[0025] Figure 1 is the overall structure schematic diagram of the active induction heating wafer repair machine provided in the specific embodiment for providing repair service for the failed R, G and B chips in the Mini LED or Micro LED display circuit board.

[0026] Figure 2 is the first perspective view partial structure schematic diagram of the active induction heating wafer repair machine provided in the specific embodiment for providing repair service for the failed R, G and B chips in the Mini LED or Micro LED display circuit board.

[0027] Figure 3 is the second perspective view partial structure schematic diagram of the active induction heating wafer repair machine provided in the specific embodiment for providing repair service for the failed R, G and B chips in the Mini LED or Micro LED display circuit board.

[0028] Figure 4 is the third perspective view partial structure schematic diagram of the active induction heating wafer repair machine provided in the specific embodiment for providing repair service for the failed R, G and B chips in the Mini LED or Micro LED display circuit board.

[0029] Figure 5 is the first perspective view structure schematic diagram of the heating head in the active induction heating wafer repair machine provided in the specific embodiment for providing repair service for the failed R, G and B chips in the Mini LED or Micro LED display circuit board.

[0030] Figure 6 is the second perspective view structure schematic diagram of the heating head in the active induction heating wafer repair machine provided in the specific embodiment for providing repair service for the failed R, G and B chips in the Mini LED or Micro LED display circuit board. DETAILED DESCRIPTION

[0031] In order to make the objectives, technical solutions and advantages of the present application clearer, the present application will be further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific examples described herein are only used to explain the present application and do not limit the present application.

[0032] To achieve the above-mentioned object, the technical solutions of the present application are as follows:

[0033] Reference is made to Figures 1-6 .

[0034] In the specific embodiment, an active heating wafer repair machine is provided, which is applied to the processing process of removing the failed single R, G, B chip and re-welding a new R, G, B chip with the same function as the original R, G, B chip when the local failure of the display circuit board occurs in the Mini LED or Micro LED display.

[0035] In the specific embodiment, an active heating wafer repair machine is provided, which includes:

[0036] Base 1: for providing installation foundation and structural support;

[0037] X-axis beam 2: for providing a moving path along the X-axis direction and a controllable driving force;

[0038] Loading platform 3: with freedom along the Y-axis direction, for carrying the circuit board to be repaired;

[0039] and an induction heating assembly 4 for making the circuit board to be repaired to be heated for welding or soldering based on the induction heating principle;

[0040] The loading platform 3 is laid on the base 1 and connected with the base 1; the X-axis beam 2 is arranged above the loading platform 3 and connected with the base 1; the induction heating assembly 4 is arranged on the X-axis beam 2 and movably connected with the X-axis beam 2, and moves along the X-axis direction on the X-axis beam 2.

[0041] Further, in the specific embodiment, the loading platform 3 includes a Y-axis guide rail 31 and a stage 32; the Y-axis guide rail 31 is laid on the base 1 and connected with the base 1; the stage 32 is arranged on the Y-axis guide rail 31 and slidably connected with the Y-axis guide rail 31; the stage 32 has a space for placing the circuit board to be repaired.

[0042] Further, in the specific embodiment, the induction heating assembly 4 includes a heating head motor 41 and an induction heating head 42; the body of the heating head motor 41 is arranged on the X-axis beam 2 and movably connected with the X-axis beam 2, and moves along the X-axis direction on the X-axis beam 2; the motor output shaft of the heating head motor 41 is extended and retracted along the Z-axis direction; the induction heating head 42 is connected with the motor output shaft of the heating head motor 41.

[0043] Further, in the specific embodiment, the induction heating head 42 comprises a heating cone 421 and a chip suction pipe (not shown in the figure) for sucking the R, G, B chips that have been loosened by the induction heating head.

[0044] Further, in the specific embodiment, the repair machine further comprises a positioning camera 5 for shooting the actual pose of the circuit board to be repaired, the positioning camera 5 is arranged on the X-axis beam 2 and movably connected with the X-axis beam 2, and reciprocally moves along the X-axis beam 2.

[0045] Further, in the specific embodiment, the repair machine further comprises a soldering assisting assembly 6, the soldering assisting assembly 6 comprises a soldering head 61, the soldering head 61 is arranged on the X-axis beam 2 and detachably connected with the X-axis beam 2, and after the soldering head 61 is connected with the X-axis beam 2, the soldering head 61 reciprocally moves along the X-axis beam 2.

[0046] Further, in the specific embodiment, the repair machine further comprises a chip storage assembly 7 for storing new R, G, B chips and a chip manipulator 8 for grabbing or releasing the specified new R, G, B chips according to the repair requirements, the chip storage assembly 7 is arranged below the X-axis beam 2 and connected with the base 1, and the chip manipulator 8 is arranged on the X-axis beam 2 and movably connected with the X-axis beam 2, and reciprocally moves along the X-axis beam 2.

[0047] Further, in the specific embodiment, the repair machine further comprises an auxiliary camera 9 for cooperating with the positioning camera 5 to jointly shoot the circuit board to be repaired and help obtain the actual pose of the circuit board to be repaired, the auxiliary camera 9 is arranged on the X-axis beam 2 and connected with the X-axis beam 2, and reciprocally moves along the X-axis beam 2.

[0048] Further, in the specific embodiment, the repair machine further comprises a chip camera 10 for shooting the actual pose of the R, G, B chips grabbed by the chip manipulator 8, the chip camera 10 is arranged below the X-axis beam 2 and connected with the base 1.

[0049] The above is only the preferred embodiment of the present application, and is not used to limit the present application, any modification, equivalent replacement and improvement made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A circuit board rework machine with active induction heating, characterized in that, The refurbished unit includes: Base: Used to provide an installation foundation and structural support; X-axis beam: used to provide a movement path and controllable driving force along the X-axis direction; Loading platform: It has a degree of freedom along the Y-axis and is used to carry circuit boards to be repaired; And an induction heating component for desoldering or soldering circuit boards based on the principle of induction heating; The loading platform is laid on the base and connected to the base; the X-axis beam spans above the loading platform and is also connected to the base; the induction heating component is disposed on the X-axis beam, is movably connected to the X-axis beam, and moves along the X-axis direction on the X-axis beam. The loading platform includes a Y-axis guide rail and a loading platform; the Y-axis guide rail is laid on the base and connected to the base; the loading platform is set on the Y-axis guide rail and slidably connected to the Y-axis guide rail; the loading platform has space for placing circuit boards to be repaired; The induction heating assembly includes a heating head motor and an induction heating head; the body of the heating head motor is mounted on the X-axis crossbeam and connected to the X-axis crossbeam, and moves along the X-axis direction on the X-axis crossbeam; the motor output shaft of the heating head motor extends out and extends and retracts along the Z-axis direction; the induction heating head is connected to the motor output shaft of the heating head motor. The induction heating head includes a heating cone and an element suction tube; the heating cone includes a cone body and an induction groove, the induction groove being formed on the cone body in a direction perpendicular to the cone bottom and passing through the cone apex; the induction heating head also includes an element suction tube; one end of the element suction tube is laid along the induction groove, extending towards the cone apex side of the cone body, and protruding from the position where the induction groove intersects with the cone apex portion; the other end of the element suction tube is connected to an external air source.

2. The circuit board rework machine with active induction heating as described in claim 1, characterized in that, The rework machine also includes a positioning camera for capturing the actual position of the circuit board to be reworked. The positioning camera is mounted on the X-axis beam and is movably connected to the X-axis beam, moving back and forth along the X-axis beam.

3. The circuit board rework machine with active induction heating as described in claim 2, characterized in that, The rework machine also includes a soldering assembly, which includes a soldering head and / or a flux head. The soldering head is disposed on the X-axis beam and is detachably connected to the X-axis beam. After being connected to the X-axis beam, the soldering head reciprocates along the X-axis beam. The flux head is disposed on the X-axis beam and is detachably connected to the X-axis beam. After being connected to the X-axis beam, the flux head reciprocates along the X-axis beam.

4. The circuit board rework machine with active induction heating as described in claim 3, characterized in that, The rework machine also includes a component storage assembly for classifying and storing new components, and a component robot for gripping or releasing specified new components according to rework requirements; the component storage assembly is located below the X-axis beam and is connected to the base; the component robot is mounted on the X-axis beam, movably connected to the X-axis beam, and reciprocates along the X-axis beam.

5. The circuit board rework machine with active induction heating as described in claim 4, characterized in that, The rework machine also includes an auxiliary camera for working with the positioning camera to photograph the circuit board to be reworked and help obtain the actual position of the circuit board. The auxiliary camera is mounted on the X-axis beam, connected to the X-axis beam, and moves back and forth along the X-axis beam.

6. The circuit board rework machine with active induction heating as described in claim 5, characterized in that, The rework machine also includes a component camera for photographing the actual pose of the component grasped by the component robot, or for photographing new components classified and stored in the component storage assembly. The component camera is located below the X-axis beam and is connected to the base.

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