Probe head of an ultrasound probe and ultrasound probe

Abstract

The application discloses a sound head of an ultrasonic probe and the ultrasonic probe. At least one side outer wall of an edge array element in the sound head is provided with a conductive layer formed by a conductive material. The conductive layer conducts a positive electrode and a negative electrode of the edge array element, so that the edge array element conducts a negative electrode lead-out piece with a flexible circuit board as an intermediate conductive piece, thereby realizing the connection between the negative electrode of the array element and the flexible circuit board. The structure utilizes the original edge array element of a wafer to realize the negative electrode lead-out, and the negative electrode lead-out piece and the flexible circuit board do not need to be additionally provided with a lead-out docking part, so that the sound head structure can be simplified, and the overall structure of the sound head is reduced.

Description

Technical Field

[0001] This application relates to the field of medical devices, specifically to the acoustic head structure of an ultrasound probe. Background Technology

[0002] An ultrasound probe is an important component of ultrasound equipment (such as ultrasound diagnostic imaging equipment). Its working principle is to use the piezoelectric effect to convert the excitation electrical pulse signal of the whole ultrasound machine into an ultrasonic signal that enters the patient's body, and then convert the ultrasonic echo signal reflected by the tissue into an electrical signal, thereby realizing the detection of the tissue.

[0003] A transesophageal ultrasound (TEE) probe is a device that can be inserted into a human body cavity to perform ultrasound examinations. Typically, this type of ultrasound probe includes a backing, a flexible circuit board, a wafer, copper foil, and a matching layer. The flexible circuit board covers the backing, the wafer sits on the flexible circuit board, the copper foil covers the wafer, and the matching layer sits on the copper foil. The outer side of the flexible circuit board is bent from the top wall of the backing to the outer side wall, and the outer side of the copper foil is bent from the top wall of the wafer onto the flexible circuit board and soldered to it, thereby leading the positive and negative electrodes of the wafer to the flexible circuit board.

[0004] Since this ultrasound probe is used to visualize the heart through the esophagus, the smaller the probe size, the better. However, although the size of existing ultrasound probes of this type has been reduced as much as possible, they can still cause discomfort to patients. Summary of the Invention

[0005] This application provides a novel acoustic head for an ultrasonic probe and an ultrasonic probe employing such an acoustic head.

[0006] To achieve the above objectives, one embodiment of this application provides an acoustic probe head, comprising:

[0007] Backing;

[0008] A flexible circuit board, which is mounted on the backing and has a first mating portion and a second mating portion;

[0009] The chip includes multiple array elements, each array element including edge array elements located on both sides and an inner array element located between the two edge array elements. The array elements are disposed on the flexible circuit board. The upper surface of the array element is a negative electrode, and the lower surface of the array element is a positive electrode. The positive electrode of the inner array element is electrically connected to the first mating part of the flexible circuit board.

[0010] A negative electrode lead-out component covers the wafer and is connected to the negative electrodes of the internal array elements and the edge array elements;

[0011] And a matching layer, which covers the wafer;

[0012] The edge array element has a conductive layer formed of conductive material on at least one outer side wall. The conductive layer conducts the positive and negative electrodes of the edge array element. The positive electrode of the edge array element is connected to the second mating part of the flexible circuit board, and the negative electrode lead-out member is connected to the flexible circuit board through the edge array element.

[0013] In one embodiment, the edge element has a long outer sidewall and short outer sidewalls located at both ends of the long outer sidewall, and the long outer sidewalls of the two edge elements are arranged opposite to each other, wherein only the outer sidewalls of the two edge elements are provided with conductive layers.

[0014] In one embodiment, the conductive layer is an electroplated conductive layer.

[0015] In one embodiment, the negative electrode lead is a copper foil.

[0016] In one embodiment, the matching layer, negative electrode lead, edge array element, flexible circuit board, and backing are stacked, and the conductive layer covers the same outer side wall of the negative electrode lead, flexible circuit board, and edge array element.

[0017] In one embodiment, the conductive layer covers the same outer sidewall of the matching layer, negative lead, edge array, flexible circuit board, and backing.

[0018] In one embodiment, the negative lead, edge array element, and flexible circuit board are bonded and fixed together.

[0019] In one embodiment, the flexible circuit board has at least two transition portions, the backing includes at least two backing blocks arranged side by side, and the transition portions extend from the gap between adjacent backing blocks to the outside of the backing.

[0020] In one embodiment, the backing includes at least three backing blocks, namely a first backing block, a second backing block, and a third backing block. The second backing block and the third backing block are located on both sides of the first backing block. There are two connecting parts, namely a first connecting part and a second connecting part. The first connecting part and the second connecting part are located on the top wall of the first backing block. The first connecting part extends out of the gap between the first backing block and the second backing block to the outside of the backing. The second connecting part extends out of the gap between the first backing block and the third backing block to the outside of the backing.

[0021] For the purposes described above, one embodiment of this application provides an ultrasonic probe, including a base and an acoustic head as described in any of the preceding claims, the acoustic head being mounted on the base via a backing.

[0022] According to the above embodiment, at least one outer wall of the edge array element in the sound head is provided with a conductive layer formed of conductive material. This conductive layer conducts the positive and negative electrodes of the edge array element, making the edge array element act as an intermediate conductive element to conduct the negative electrode lead-out to the flexible circuit board, thereby completing the connection between the negative electrode of the array element and the flexible circuit board. This structure utilizes the original edge array element of the wafer to realize the negative electrode lead-out, and there is no need to set additional lead-out docking parts on the negative electrode lead-out and the flexible circuit board, which simplifies the sound head structure and reduces the overall size of the sound head. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the structure of the sound head (before the wafer is cut) in one embodiment of this application;

[0024] Figure 2 This is an exploded view of the sound head in one embodiment of this application;

[0025] Figure 3 for Figure 2 Side view of the exploded diagram shown;

[0026] Figure 4 This is a schematic diagram of the structure of the sound head (before the wafer is cut) in another embodiment of this application;

[0027] Figure 5 This is a cross-sectional view of the sound head in one embodiment of this application;

[0028] Figure 6 This is a schematic diagram of the shape of the first backing block in one embodiment of this application. Detailed Implementation

[0029] The present invention will now be described in further detail with reference to specific embodiments and accompanying drawings. Similar elements in different embodiments are referred to by associated similar element reference numerals. In the following embodiments, many details are described to facilitate a better understanding of this application. However, those skilled in the art will readily recognize that some features may be omitted in different situations, or may be replaced by other elements, materials, or methods. In some cases, certain operations related to this application are not shown or described in the specification. This is to avoid obscuring the core parts of this application with excessive description. For those skilled in the art, detailed description of these related operations is not necessary; they can fully understand the related operations based on the description in the specification and general technical knowledge in the art.

[0030] Furthermore, the features, operations, or characteristics described in the specification can be combined in any suitable manner to form various embodiments. At the same time, the steps or actions in the method description can be rearranged or adjusted in a manner obvious to those skilled in the art. Therefore, the various orders in the specification and drawings are only for the clear description of a particular embodiment and do not imply a necessary order, unless otherwise stated that a particular order must be followed.

[0031] The serial numbers assigned to components in this document, such as "first" and "second," are used only to distinguish the described objects and have no sequential or technical meaning. The terms "connection" and "linkage" used in this application, unless otherwise specified, include both direct and indirect connections (linkages).

[0032] The ultrasonic probe and ultrasonic probe provided in this application can be used in humans and various animals.

[0033] This embodiment provides an acoustic head for an ultrasound probe, which can be applied to various types of ultrasound probes. The following description uses a transesophageal ultrasound (TEE) probe as an example. However, this invention is not limited to transesophageal ultrasound probes.

[0034] Please refer to Figures 1 to 5 The microphone includes a chip 100, a backing 200, a flexible circuit board 300, a negative lead 400, and a matching layer 500.

[0035] The chip 100 is cut into several strip-shaped array elements. These array elements can be used to transmit and receive ultrasonic signals. The upper surface of each array element is the negative electrode, and the lower surface is the positive electrode. Typically, the array elements include internal array elements 110 and edge array elements 120. (See reference...) Figure 2 The array elements located on the outer sides are generally edge array elements 120, and there can be more than one edge array element 120 on each side. The inner array element 110 is located between the two edge array elements 120. The backing 200 has a support platform, which serves as a placement platform for the flexible circuit board 300, the chip 100, and the matching layer 500. The matching layer 500 is an acoustic material layer laid on the radiating surface of the chip 100 to achieve acoustic impedance matching between the transducer chip 100 and the sound transmission medium, allowing sound energy to pass through well. The matching layer 500 covers the negative electrode lead 400.

[0036] To extract the negative pole of internal array element 110, please refer to... Figures 1 to 5In one embodiment, the negative electrode lead 400 has a sheet-like structure capable of electrically connecting to at least all internal array elements 110. This sheet-like structure covers all internal array elements 110, as well as the edge array elements 120, allowing it to be electrically connected to both the internal and edge array elements 110. The negative electrode lead 400 is made of a conductive material, such as copper foil or a structure with the same function.

[0037] The flexible circuit board 300 has a first mating portion and a second mating portion. The positive electrode of the internal array element 110 is electrically connected to the first mating portion of the flexible circuit board 300. Please refer to... Figure 2 The first docking part can be located in the middle of all array elements, thus enabling it to make electrical connections with all array elements simultaneously with a relatively narrow width. The first docking part is mounted on a support platform and can be located on a portion of the support platform.

[0038] To extract the negative pole of internal array element 110, please refer to... Figure 1-5 At least one outer wall of the edge element 120 is provided with a conductive layer A formed of conductive material. This conductive layer A conducts electricity between the positive and negative electrodes of the edge element 120, making the edge element 120 an intermediate conductive element. The positive electrode of the edge element 120 is connected to the second mating portion of the flexible circuit board 300, so that the negative electrode lead-out member 400 is connected to the flexible circuit board 300 through the edge element 120. The second mating portion of the flexible circuit board 300 has a grounding point, so that the negative electrode of the internal element 110 is electrically connected to the grounding point. The flexible circuit board 300 has at least one transition portion 320. The transition portion 320 has a transition point for connecting to the control unit of the ultrasonic probe, and both the first and second mating portions are electrically connected to the transition point. Of course, in order to achieve these electrical connections, some circuits can also be provided on the flexible circuit board 300 to successfully lead out the positive and negative electrodes of the element. These circuits can be fully implemented by existing means and will not be elaborated here. Among them, these first docking parts, second docking parts, and various electrical connection terminals such as transition points can all be implemented using common electrical connection structures such as electrodes and connection terminals.

[0039] The conductive layer A can be formed by electroplating, or by coating or other processes to form other types of conductive layers. The material of conductive layer A can be gold or other materials that are easy to conduct electricity.

[0040] Please refer to Figure 1 and 4Since the original edge array element 120 of the chip 100 is not directly used for the emission and reception of ultrasonic waves, this embodiment utilizes the edge array element 120 (discarded array element) to achieve negative electrode lead-out. No additional lead-out docking part is needed on the negative electrode lead-out component 400 and the flexible circuit board 300, which simplifies the acoustic head structure and reduces the overall size of the acoustic head. The negative electrode lead-out component 400 and the flexible circuit board 300 can be basically the same width as the chip, further reducing the width of the acoustic head.

[0041] Furthermore, in existing receivers, copper foil is typically soldered to the flexible circuit board via corresponding lead-out mating parts, but the soldering process has the following problems:

[0042] 1) The small size of the sound head leads to poor welding operability;

[0043] 2) The welding position is very close to the array elements on both sides, and the high temperature can easily cause the array elements on the side to delaminate and fail.

[0044] 3) Poor consistency in the size of weld points affects the overall dimensions.

[0045] Since this application uses the aforementioned edge array element 120 as an intermediate conductive element, it is not necessary to weld the negative electrode lead 400 and the flexible circuit board 300 together. In one embodiment, the negative electrode lead 400, the edge array element 120, and the flexible circuit board 300 are bonded together to eliminate the defects caused by welding.

[0046] Further, please refer to Figure 2 The edge element 120 has a long outer wall 121 and short outer walls at both ends of the long outer wall 121 (not shown in the figure, but this does not affect the understanding of those skilled in the art). The long outer walls 121 of the two edge elements 120 are arranged opposite to each other. Since the area of ​​the long outer wall 121 is relatively larger than that of the short outer wall, in one embodiment, the conductive layer A can be provided only on the outer walls of the two edge elements 120, which is easier to process and can also ensure conductivity. Of course, in some embodiments, the conductive layer A can also be provided on the short outer wall.

[0047] Please refer to Figure 1-5 The matching layer 500, negative electrode lead-out element 400, edge array element 120, flexible circuit board 300, and backing 200 are stacked together. In one embodiment, as shown... Figure 4As shown, conductive layer A can cover the same outer side wall of the matching layer 500, negative electrode lead-out member 400, edge array element 120, flexible circuit board 300, and backing 200. That is, conductive layer A is provided on the same side of the matching layer 500, negative electrode lead-out member 400, edge array element 120, flexible circuit board 300, and backing 200. Since the outer side of the matching layer 500, negative electrode lead-out member 400, edge array element 120, flexible circuit board 300, and backing 200 has a large processing area, it is easier to process and form conductive layer A. Moreover, this large-area conductive layer A is also beneficial to increasing conductivity stability.

[0048] In other embodiments, the conductive layer A may also cover only the outer sidewall of the negative lead-out member 400, the flexible circuit board 300, and the edge array element 120.

[0049] Further, please refer to Figure 5 In one embodiment, the backing 200 includes at least two backing blocks (e.g., 210, 220, 230), which are arranged side by side and assembled to form a support platform. Typically, the top walls of the backing blocks are flush, forming a planar support platform. Of course, the specific shape of the top wall of the support platform, whether planar or other, can be determined according to the needs of the actual structure. It can also be curved, undulating, or irregularly shaped to adapt to the structure of other components.

[0050] This adapter 320 can be one or more, please refer to [the relevant documentation]. Figure 5 and 6 The figure shows two adapter sections 320. In some embodiments, one of these adapter sections 320 may be omitted. For example... Figure 5 and 6 As shown, the adapter 320 extends from the gap between adjacent backing blocks (e.g., between 210 and 220 and between 210 and 230) to the backing 200 so that the flexible circuit board 300 can be electrically connected to other components, such as the control unit of the ultrasonic probe, so as to control the operating state of the array element.

[0051] Please refer to Figure 5 and 6 In this embodiment, since the adapter portion 320 of the flexible circuit board 300 extends from the inside of the inner liner, by adjusting the size of each backing block, the width of the backing 200 can be kept consistent with the width of the chip 100. With the width of the chip 100 remaining unchanged, the final sound head is essentially the same size as the width of the chip 100. This avoids the additional volume increase caused by the flexible circuit board 300 bending from the outer wall of the backing 200, thus reducing the overall volume of the sound head. Furthermore, this structure ensures the consistency of the shape of the matching layer 500, the chip 100, and the backing 200.

[0052] Further, please refer to Figure 5 and 6 In one embodiment, the backing 200 includes at least three backing blocks, namely a first backing block 210, a second backing block 220, and a third backing block 230, with the second backing block 220 and the third backing block 230 located on either side of the first backing block 210. The flexible circuit board 300 has at least two transition portions 320, namely a first transition portion 320a and a second transition portion 320b (e.g., ...). Figure 3 and 5 As shown), the first mating part is located on the top wall of the first backing block 210, the first transition part 320a extends out of the backing 200 from the gap between the first backing block 210 and the second backing block 220, and the second transition part 320b extends out of the backing 200 from the gap between the first backing block 210 and the third backing block 230.

[0053] This structure allows the first mating portion of the flexible circuit board 300 to be positioned in the middle of the support platform, enabling it to mate with all array elements. The two adapter portions 320 improve the convenience and stability of connecting the flexible circuit board 300 to other components (such as control units), as both adapter portions 320 can be used to mate with the control unit. Of course, in some embodiments, one of the second backing block 220 and the third backing block 230 can be omitted, allowing the top wall of the first backing block 210 to extend outwards, replacing the omitted second backing block 220 or third backing block 230, thus forming a support platform of the same size. In this case, the adapter portion 320 located on the side of the omitted second backing block 220 or third backing block 230 can also be omitted.

[0054] Of course, the first backing block 210 can be configured in any possible shape, as long as it can meet the requirements for forming a support platform and allow the adapter portion 320 of the flexible circuit board 300 to be led out from between the two backing blocks. However, in terms of processing costs and assembly efficiency, please refer to... Figure 5 and 6 Typically, the two side walls 212 of the first backing block 210 are symmetrically arranged relative to the top wall 211. Correspondingly, the second backing block 220 and the third backing block 230 have side walls that can fit against the first backing block 210. In particular, in one embodiment, the second backing block 220 and the third backing block 230 have a symmetrical structure, which not only facilitates processing but also makes assembly easier.

[0055] Furthermore, the wafer 100 is typically cut after being placed on the backing 200 and the flexible circuit board 300. During the cutting of the wafer 100, the mating layer 500, the first mating portion of the flexible circuit board 300, and the backing 200 are also cut. The mating layer 500 may be cut into the same shape and structure as the wafer 100. The first mating portion of the flexible circuit board 300 is also cut into a strip-shaped structure consistent with that of the wafer 100. The backing 200, as a support structure, has a cutting groove on its top surface.

[0056] On the other hand, this embodiment also provides an ultrasonic probe, which includes an acoustic head as shown in any of the above embodiments. Please refer to... Figures 1 to 5 The ultrasonic probe also includes a base 600, on which the backing 200 is mounted and assembled to other components.

[0057] Of course, the ultrasonic probe also includes components such as a housing and a control unit for controlling the array elements. These structures can be implemented with reference to existing structures, and will not be described in detail in this embodiment.

[0058] The above examples illustrate this application only to aid in understanding and are not intended to limit its scope. Those skilled in the art can make variations to the specific embodiments described above based on the ideas presented in this application.

Claims

1. An ultrasonic probe's acoustic head, characterized in that, include: Backing; A flexible circuit board, which is mounted on the backing and has a first mating portion and a second mating portion; The chip includes multiple array elements, each array element including edge array elements located on both sides and an inner array element located between the two edge array elements. The array elements are disposed on the flexible circuit board. The upper surface of the array element is a negative electrode, and the lower surface of the array element is a positive electrode. The positive electrode of the inner array element is electrically connected to the first mating part of the flexible circuit board. A negative electrode lead-out component covers the wafer and is connected to the negative electrodes of the internal array elements and the edge array elements; And a matching layer, which covers the wafer; The edge array element has a conductive layer formed of conductive material on at least one outer side wall. The conductive layer conducts the positive and negative electrodes of the edge array element. The positive electrode of the edge array element is connected to the second mating part of the flexible circuit board, and the negative electrode lead-out member is connected to the flexible circuit board through the edge array element.

2. The sound head as described in claim 1, characterized in that, The edge array element has a long outer sidewall and short outer sidewalls located at both ends of the long outer sidewall. The long outer sidewalls of the two edge array elements are arranged opposite to each other. The two edge array elements have a conductive layer only on the outer sidewall.

3. The sound head as described in claim 1, characterized in that, The conductive layer is an electroplated conductive layer.

4. The sound head as described in claim 1, characterized in that, The negative electrode lead-out component is copper foil.

5. The acoustic head as described in claim 1, characterized in that, The matching layer, negative electrode lead, edge array element, flexible circuit board and backing are stacked, and the conductive layer covers the same outer side wall of the negative electrode lead, flexible circuit board and edge array element.

6. The sound head as described in claim 5, characterized in that, The conductive layer covers the same outer side wall of the matching layer, negative lead, edge array, flexible circuit board, and backing.

7. The acoustic head as described in claim 1, characterized in that, The negative lead, edge array element, and flexible circuit board are bonded and fixed together.

8. The acoustic head as described in any one of claims 1-7, characterized in that, The flexible circuit board has at least two transition portions, and the backing includes at least two backing blocks arranged side by side. The transition portions extend from the gap between adjacent backing blocks to the outside of the backing.

9. The sound head as described in claim 8, characterized in that, The backing includes at least three backing blocks, namely a first backing block, a second backing block, and a third backing block. The second backing block and the third backing block are located on both sides of the first backing block. There are two connecting parts, namely a first connecting part and a second connecting part. The first connecting part and the second connecting part are located on the top wall of the first backing block. The first connecting part extends out of the backing from the gap between the first backing block and the second backing block. The second connecting part extends out of the backing from the gap between the first backing block and the third backing block.

10. An ultrasonic probe, characterized in that, It includes a base and a sound head as described in any one of claims 1 to 9, the sound head being mounted on the base via a backing.

Images