Component crimping device and component crimping method

Abstract

The present disclosure provides a component crimping device and a component crimping method capable of improving installation accuracy. The component crimping device (100) includes a substrate moving mechanism (31), a crimping tool (34), an imaging unit (39), an imaging moving mechanism (38), and a control unit (2a). The control unit causes the imaging unit to image an end edge of a component (5), causes the imaging moving mechanism to move the imaging range of the imaging unit after imaging the end edge of the component, causes the imaging unit to image a second alignment mark (Mc) of the component, generates and outputs relationship information indicating the positional relationship between the end edge of the component and the second alignment mark based on the imaging results of the end edge of the component and the second alignment mark, causes the substrate moving mechanism to move the substrate (3), causes the imaging unit to image a first alignment mark (Mb) of the substrate, and controls the crimping of the component to the substrate based on the imaging results of the first alignment mark and the second alignment mark.

Description

Technical Field

[0001] This disclosure relates to a component pressing apparatus for pressing components onto a substrate, etc. Background Technology

[0002] Conventionally, as an electronic component mounting apparatus, a component pressing device has been provided for pressing electronic components (hereinafter referred to as "components") onto a substrate such as a liquid crystal panel (see Patent Document 1). This component pressing device includes a punching device for punching components from a film carrier, and presses the components obtained by feeding and punching the film carrier at a certain interval onto the liquid crystal panel. Thus, a substrate with the pressed components is produced, namely a mounting substrate.

[0003] Prior art literature

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 7-106796

[0006] However, in the component crimping device of the aforementioned Patent Document 1, there is a problem that the installation accuracy may decrease. Summary of the Invention

[0007] The problem that the invention aims to solve

[0008] Therefore, this disclosure provides a component crimping device or the like that can improve installation accuracy.

[0009] Methods for solving problems

[0010] One aspect of this disclosure relates to a component crimping apparatus comprising: a substrate moving mechanism for holding and moving a substrate having a first alignment mark formed thereon; a crimping tool for holding and crimping a component having a second alignment mark formed thereon onto the substrate; an imaging unit for imaging a subject included within an imaging range; an imaging moving mechanism for moving the imaging range of the imaging unit; and a control unit that controls the imaging moving mechanism to move the imaging range such that the end edge of the component held by the crimping tool enters the imaging range, the imaging unit to image the end edge of the component included within the imaging range as the subject, and, if the second alignment mark is not included within the imaging range, after imagering the end edge of the component, to... The moving mechanism moves the camera range so that the second alignment mark enters the camera range, and the camera unit takes the second alignment mark included in the camera range as the subject for imaging. Based on the imaging results of the end edge of the component and the second alignment mark, relationship information indicating the positional relationship between the end edge of the component and the second alignment mark is generated and output. The substrate moving mechanism moves the substrate so that the first alignment mark enters the camera range, and the camera unit takes the first alignment mark included in the camera range as the subject for imaging. Based on the imaging results of the first alignment mark and the second alignment mark, the pressing of the component onto the substrate performed by the substrate moving mechanism and the pressing tool is controlled.

[0011] Furthermore, these general or specific methods can be implemented as systems, methods, integrated circuits, computer programs, or computer-readable recording media such as CD-ROMs, or as any combination of systems, methods, integrated circuits, computer programs, and recording media. In addition, the recording medium can also be a non-volatile recording medium.

[0012] Invention Effects

[0013] The component crimping device disclosed herein can improve installation accuracy.

[0014] Further advantages and effects of one aspect of this disclosure will become clear from the description and accompanying drawings. These advantages and / or effects are provided by various embodiments and features described in the description and accompanying drawings, but it is not necessary to provide all of them in order to obtain one or more of the same features. Attached Figure Description

[0015] Figure 1 This is a diagram showing a schematic structure of the component mounting line in the embodiment.

[0016] Figure 2 This is a top view of the component mounting line in the implementation method.

[0017] Figure 3 This is a diagram showing the computer included in the component assembly line of the embodiment and the various components controlled by the computer.

[0018] Figure 4 This is a block diagram illustrating the structure of the component crimping device in the embodiment.

[0019] Figure 5 This is a diagram illustrating an example of a strip member and a portion of a substrate, each having multiple components in the embodiment.

[0020] Figure 6 This is a diagram illustrating an example of the structure of the punching section of the component supply unit in the embodiment.

[0021] Figure 7 This is a diagram illustrating the flow of components from the component supply section in the embodiment to the crimping tool via the component moving section.

[0022] Figure 8 This is a diagram illustrating an example of the component crimping process performed by the crimping tool and the worktable of the substrate moving mechanism in the embodiment.

[0023] Figure 9 This is a diagram illustrating an example of relational information in an implementation scheme.

[0024] Figure 10 This is a diagram showing an example of each of the first camera, the second camera, and the camera movement mechanism included in the imaging unit of the embodiment.

[0025] Figure 11 This is a diagram showing the state of the first camera and the component when the component is photographed from the X-axis direction in the embodiment.

[0026] Figure 12A This is a diagram illustrating an example of the first camera's imaging capabilities in an embodiment.

[0027] Figure 12B This is a diagram illustrating an example of the second camera in the embodiment.

[0028] Figure 13A This is a diagram illustrating an example of imaging in an embodiment where the end edge of a component is used as the subject.

[0029] Figure 13B This is a diagram illustrating an example of photographing a subject using the second alignment mark in an embodiment.

[0030] Figure 14AThis is a diagram illustrating another example of imaging in an embodiment where the end edge of a component is used as the subject.

[0031] Figure 14B This is a diagram illustrating another example of imaging using the second alignment mark as the subject in an embodiment.

[0032] Figure 15 This is a flowchart illustrating the overall processing steps of the component crimping device in the embodiment.

[0033] Figure 16 It is shown Figure 15 The flowchart details the process of determining the positional relationship in step S13.

[0034] Figure 17 This diagram illustrates the camera unit and the timing of camera range movement in the implementation method.

[0035] Figure 18 This is a diagram illustrating a structural example of a portion of the camera movement mechanism in a modified embodiment.

[0036] Symbol Explanation

[0037] 1. Component Assembly Line

[0038] 2 Computers

[0039] 2a Control Department

[0040] 2b Storage Section

[0041] 2c Display Unit

[0042] 3 substrate

[0043] 4 Electrode section

[0044] 5 components

[0045] 6 Electrode section

[0046] 10 Board loading department

[0047] 20. Attachment section

[0048] 30 Pre-compression joint

[0049] 31. Substrate moving mechanism

[0050] 32-component mounting mechanism

[0051] 33 Component Supply Department

[0052] 33a Supply Reel

[0053] 33b Punching Section

[0054] 33c Movable Worktable

[0055] 33d orbit

[0056] 34 Crimping tools

[0057] 35. Moving parts

[0058] 35a Transfer Head

[0059] 35b Transfer worktable

[0060] 36 Lower bearing section

[0061] 37 workbenches

[0062] 37a Adsorption pores

[0063] 38 Camera Movement Mechanism

[0064] 38a Optical components

[0065] 39. Camera Department

[0066] 39L Camera 1

[0067] 39R Second Camera

[0068] 40 Formal crimping section

[0069] 50 Board unloading section

[0070] 60. Transport Department

[0071] 70 with components

[0072] 91 ACF

[0073] 100-part crimping device

[0074] DL camera range

[0075] DR camera range

[0076] Mb First Alignment Marker

[0077] Mc Second Alignment Marker Detailed Implementation

[0078] (The insights that form the basis of this disclosure)

[0079] Regarding the component crimping device of Patent Document 1 described in the "Background Art" section, the inventors have discovered the following problems.

[0080] With the recent trend towards narrower bezels in LCD panels, there is a demand for improved die-cutting accuracy. Furthermore, die-cutting accuracy encompasses the precision of the component's position and state as it is die-cut from the film carrier. However, as in Patent Document 1, maintaining the required precision solely through the mechanical precision of the die-cutting apparatus is insufficient. Moreover, if a sensor for confirming the die-cutting state is installed in the die-cutting apparatus to maintain accuracy, the apparatus may become larger. Therefore, using a camera for aligning the component with the substrate as the sensor for confirming the die-cutting state can prevent the need for larger die-cutting apparatuses. However, in this case, it is sometimes necessary to move the camera to align the component with the substrate. As a result, the alignment accuracy between the component and the substrate cannot be adequately obtained due to camera movement, potentially leading to a decrease in mounting accuracy.

[0081] To address this issue, one aspect of the present disclosure relates to a component crimping apparatus comprising: a substrate moving mechanism for holding and moving a substrate having a first alignment mark formed thereon; a crimping tool for holding and crimping a component having a second alignment mark formed thereon onto the substrate; an imaging unit for imaging a subject included within an imaging range; an imaging moving mechanism for moving the imaging range of the imaging unit; and a control unit that controls the imaging moving mechanism to move the imaging range such that the end edge of the component held by the crimping tool enters the imaging range, and the imaging unit to image the end edge of the component included within the imaging range as the subject, wherein, if the second alignment mark is not included within the imaging range, after imaging the end edge of the component... The camera movement mechanism moves the camera range so that the second alignment mark enters the camera range, and the camera unit takes the second alignment mark included in the camera range as the subject for imaging. Based on the imaging results of the end edge of the component and the second alignment mark, relationship information indicating the positional relationship between the end edge of the component and the second alignment mark is generated and output. The substrate movement mechanism moves the substrate so that the first alignment mark enters the camera range, and the camera unit takes the first alignment mark included in the camera range as the subject for imaging. Based on the imaging results of the first alignment mark and the second alignment mark, the pressing of the component onto the substrate by the substrate movement mechanism and the pressing tool is controlled. For example, the component pressing device may also include: a punching section that sequentially punches each of the plurality of components from a strip member provided with a plurality of components, and the pressing tool holding the component punched by the punching section and pressing it onto the substrate.

[0082] Therefore, it is unnecessary to install a sensor for confirming the blanking state of the component in the blanking section, thus suppressing the enlargement of the blanking section. That is, in the component pressing apparatus according to one aspect of this disclosure, the camera unit can also be used as a sensor for confirming the blanking state of the component, thereby suppressing the enlargement of the blanking section. Specifically, the camera unit is used to control the pressing of the component onto the substrate by the substrate moving mechanism and the pressing tool. For example, the camera unit is used in capturing images of the first alignment mark and the second alignment mark used to control the alignment of the component with the substrate. In the component pressing apparatus according to one aspect of this disclosure, such a camera unit also captures images of the end edges of the component and generates and outputs relational information, thereby also enabling the camera unit to be used as a sensor for confirming the blanking state of the component. Therefore, since it is not necessary to specifically install a sensor for confirming the blanking state of the component in the blanking section, the enlargement of the blanking section can be suppressed.

[0083] Here, to confirm the punching state of the component, it is necessary to photograph the end edge of the component and the second alignment mark separately. However, if they cannot be photographed simultaneously, the camera range needs to be moved to photograph them individually. In such a case, for example, if the second alignment mark is photographed first, and then the camera range is moved to photograph the end edge of the component, the camera range must be moved further back to its original position for the subsequent alignment of the component with the substrate. In this alignment, the first alignment mark needs to be photographed. In photographing the first and second alignment marks, it is desirable that the camera range be in the same position to ensure the accuracy of the alignment. However, if the reproducibility of this position is insufficient even after the camera range is returned to its original position, the accuracy of the alignment between the component and the substrate decreases.

[0084] Therefore, in the component crimping apparatus according to one aspect of this disclosure, when it is not possible to simultaneously image the end edge of the component and the second alignment mark, the end edge of the component is imaged first, followed by the second alignment mark. As a result, it is not necessary to move the imaging range when imaging the second alignment mark; the first alignment mark of the substrate can be imaged by moving the substrate so that it enters the imaging range. Therefore, the imaging ranges are equal in both the imaging of the first and second alignment marks, thus ensuring sufficient accuracy in the alignment of the component with the substrate. That is, improved mounting accuracy can be achieved. Consequently, the enlargement of the punched portion can be suppressed, the punching state of the component can be confirmed, and improved mounting accuracy can be achieved.

[0085] Alternatively, the control unit may further control the punching of the component from the tapered member by the punching unit through the output of the relational information.

[0086] Therefore, the positional relationship between the end edge of the component and the second alignment mark can be automatically maintained in a fixed manner, and the punching accuracy of the component can be easily improved.

[0087] Alternatively, the control unit may further generate relationship information that represents the distance between the end edge of the component and the second alignment mark as the positional relationship, and notify the punching unit that a defect has occurred if the distance is not within a predetermined allowable range.

[0088] This allows operators to be prompted to inspect and repair the blanking section, thereby improving blanking accuracy.

[0089] Alternatively, the camera movement mechanism may not move the camera range of the camera unit during the period from capturing the second alignment mark to capturing the first alignment mark.

[0090] Therefore, in the imaging of the first alignment mark and the second alignment mark, the imaging range is equal, thus ensuring sufficient accuracy in the alignment of the component with the substrate. In other words, it is possible to improve the mounting accuracy.

[0091] The following is a reference to the appendix. Figure 1 The implementation method will be described in detail below.

[0092] Furthermore, the embodiments described below are all general or specific examples. The values, shapes, materials, constituent elements, arrangement positions of constituent elements, connection methods, steps, and order of steps shown in the following embodiments are examples and are not intended to limit this disclosure. In addition, constituent elements in the following embodiments that are not described as independent technical solutions representing the highest-level concept are described as arbitrary constituent elements. Furthermore, the figures are schematic diagrams and are not necessarily strictly illustrated. Furthermore, in the figures, the same symbols are used to label the same structural members. Furthermore, in the following embodiments, expressions such as "approximately the same" are used. For example, "approximately the same" means not only completely identical but also substantially identical, i.e., including, for example, a few percent degree of error. Furthermore, "approximately the same" means identical within the scope that enables the effects based on this disclosure to be achieved. The same applies to other expressions using "approximately".

[0093] (Implementation Method)

[0094] [Simplified structure of component mounting line]

[0095] Figure 1 This is a diagram showing a schematic structure of the component mounting line in this embodiment.

[0096] In this embodiment, the component mounting line 1 is a system for producing mounting substrates by mounting components 5 onto substrates 3, which are display panels such as liquid crystal panels or organic EL (electro-Luminescence) panels. Furthermore, the components 5 are, for example, electronic components such as drive circuits. Specifically, such as... Figure 1 As shown, the component mounting line 1 has a substrate loading section 10, an attachment section 20, a pre-pressing section 30, a final pressing section 40, and a substrate unloading section 50. The substrate loading section 10, the attachment section 20, the pre-pressing section 30, the final pressing section 40, and the substrate unloading section 50 are connected in this order.

[0097] The substrate loading section 10 accepts a rectangular substrate 3 that is loaded from the operator or other equipment on the upstream side. Then, the substrate 3 is loaded onto the attachment section 20 on the downstream side.

[0098] The attachment section 20 receives the substrate 3 transported from the substrate loading section 10 and attaches adhesive members to the plurality of electrode sections 4 located at the periphery of the substrate 3. Then, the substrate 3 with the adhesive members attached is transported to the pre-pressing section 30. In addition, the plurality of electrode sections 4 are each composed of a plurality of electrodes, for example.

[0099] The pre-pressing section 30 receives the substrate 3 taken from the attachment section 20, and mounts and presses the member 5 onto the portion of the substrate 3 where the adhesive member is attached. Then, the substrate 3 with the member 5 pressed on is moved to the formal pressing section 40. In addition, the pressing performed by the pre-pressing section 30 is also referred to as pre-pressing.

[0100] The formal pressing section 40 receives the substrate 3 taken out from the pre-pressing section 30 and performs formal pressing (also known as hot pressing) on ​​the component 5 that was pre-pressed onto the substrate 3. Then, the substrate 3 that has undergone formal pressing is moved out to the substrate removal section 50.

[0101] The substrate removal section 50 receives the substrate 3 removed from the formal pressing section 40. The substrate 3 received by the substrate removal section 50 is then moved downstream.

[0102] Thus, the component mounting line 1 performs a component mounting operation on the multiple electrode sections 4 respectively provided on the periphery of the transported substrate 3, and removes the substrate 3 as a mounting substrate on which the component 5 is mounted from the substrate removal section 50.

[0103] [Detailed Structure of Component Mounting Lines]

[0104] Figure 2 This is a top view of component mounting line 1 in this embodiment. Specifically, Figure 2The structure of component mounting line 1 as viewed from above is shown. In this embodiment, the substrate transport direction is referred to as the X-axis direction, the vertical direction as the Z-axis direction, and the direction perpendicular to both the X-axis and Z-axis directions, i.e., the depth direction, as the Y-axis direction. Furthermore, the negative and positive sides of the X-axis direction correspond to the upstream and downstream sides of the substrate transport direction, respectively; the negative and positive sides of the Z-axis direction correspond to the lower and upper sides of the vertical direction, respectively; and the negative and positive sides of the Y-axis direction correspond to the near-front and inner sides, or the front and rear sides, respectively, of the depth direction.

[0105] The substrate loading section 10 includes a base 1a for placing the loaded substrate 3. A worktable 11 for placing the substrate 3 is provided on the base 1a of the substrate loading section 10. The worktable 11 moves up and down relative to the base 1a in the Z-axis direction. In addition, a plurality of suction holes 11a are provided on the upper surface of the worktable 11. The worktable 11 is used to vacuum-adsorb and hold the substrate 3 that is loaded onto the worktable 11 from the operator or other upstream device through the suction holes 11a by a suction device such as a pump (not shown).

[0106] The attachment unit 20 is equipped with a function to perform an attachment operation (in other words, an attachment process) to attach an ACF (Anisotropic Conductive Film) as an adhesive member to the electrode portion 4 of the substrate 3. ACF, also known as anisotropic conductive adhesive, is a component used to electrically connect the electrode portion 4 of the substrate 3 and the component 5. The attachment unit 20 includes a substrate moving mechanism 21 and an attachment mechanism 22.

[0107] The substrate moving mechanism 21 is a mechanism for moving the substrate 3. The substrate moving mechanism 21 includes, for example, an X-axis stage movable in the X-axis direction, a Y-axis stage movable in the Y-axis direction, a Z-axis stage movable in the Z-axis direction, and a worktable 23. In the substrate moving mechanism 21, the X-axis stage, Y-axis stage, Z-axis stage, and worktable 23 are arranged sequentially and overlappingly from below on the base 1b.

[0108] The Y-axis stage extends along the Y-axis direction and moves freely along the X-axis direction on the X-axis stage. The Z-axis stage moves freely along the Y-axis direction on the Y-axis stage, causing the upper worktable 23 to rise and fall along the Z-axis direction and rotate around the Z-axis.

[0109] Furthermore, multiple adsorption holes 23a are provided on the upper surface of the worktable 23, and the worktable 23 uses vacuum adsorption to hold the substrate 3 placed on its upper surface. In this way, the substrate moving mechanism 21 adsorbs and holds the substrate 3 and moves it in the horizontal plane (specifically in the X-axis and Y-axis directions), raises and lowers it in the vertical direction (specifically in the Z-axis direction) and rotates it around the Z-axis.

[0110] The attachment mechanism 22 has, for example, two attachment heads arranged along the X-axis direction above the base 1b. Each attachment head has a supply section for supplying ACF and an attachment tool for attaching ACF to the substrate 3. The two attachment heads attach ACF at positions corresponding to the plurality of electrode sections 4 on the substrate 3. Furthermore, an attachment support stage is provided below each of the two attachment heads.

[0111] The pre-pressing section 30 performs a pre-pressing process, in which the component 5 is mounted on the area of ​​the substrate 3 where the ACF is attached (i.e., the pressing target area) to perform pre-pressing. The pre-pressing section 30 includes a substrate moving mechanism 31, a component mounting mechanism 32, a component supply section 33, and a component moving section 35.

[0112] The substrate moving mechanism 31 has the same structure as the substrate moving mechanism 21 of the attachment part 20. Specifically, the substrate moving mechanism 31 has a worktable 37 for holding the substrate 3. A plurality of adsorption holes 37a are provided on the upper surface of the worktable 37. The substrate moving mechanism 31 holds the substrate 3 placed on the worktable 37 by vacuum adsorption through the plurality of adsorption holes 37a. In addition, the substrate moving mechanism 31 has the function of moving the worktable 37 for adsorbing and holding the substrate 3 in the horizontal plane, raising and lowering it in the vertical direction, and rotating it about the Z-axis. By moving and rotating the worktable 37, the substrate moving mechanism 31 positions the area of ​​the substrate 3 held by adsorption with ACF attached above the lower receiving part 36 of the component mounting mechanism 32, which serves as a spare worktable. In addition, a first alignment mark, which will be described later, is formed on the substrate 3. That is, the substrate moving mechanism 31 in this embodiment holds the substrate 3 with the first alignment mark formed thereon and moves the substrate 3.

[0113] The component supply unit 33 is provided protruding from the rear of the base 1b on the inner side (i.e., the positive side in the Y-axis direction) of the component mounting mechanism 32. For example, the component supply unit 33 includes a supply reel 33a with a tape component wound with a TCP (Tape carrier package) or the like, a punching unit 33b, a movable worktable 33c, and a track 33d. Such a component supply unit 33 supplies components 5 sequentially from the tape component by moving these components.

[0114] The component moving part 35 holds the component 5 supplied from the component supply part 33 and moves it toward the crimping tool 34 included in the component mounting mechanism 32.

[0115] The component mounting mechanism 32 is mounted on the base 1b and includes a crimping tool 34 and a lower bearing part 36.

[0116] The lower support portion 36 supports the crimping target area from below, which is a predetermined location on the substrate 3 held in the worktable 37. Furthermore, this crimping target area is the portion of the substrate 3 where ACF is attached. That is, the lower support portion 36 supports the edge of the substrate 3 to which the crimping member 5 is to be crimped from below.

[0117] The crimping tool 34 holds the component 5 and crimps the substrate 3 held on the worktable 37. A second alignment mark, described later, is formed on this component 5. That is, in this embodiment, the crimping tool 34 holds the component 5 with the second alignment mark and crimps the component 5 onto the substrate 3. Specifically, the crimping tool 34 moves up and down along the Z-axis, adsorbing (i.e., picking up) the component 5 moved by the component moving part 35 from above. Furthermore, the crimping tool 34 mounts the adsorbed component 5 onto the ACF and presses it down together with the substrate 3 onto the receiving part 36, thereby pre-crimping the component 5 onto the substrate 3. For example, the crimping tool 34 crimps the component 5 onto the substrate 3 while heated to approximately 80°C. Additionally, the pre-crimping part 30 may also include a mechanism that rotates the direction of the substrate 3 held by the substrate moving mechanism 31 by 90 degrees.

[0118] The formal pressing section 40 performs a formal pressing process (i.e., a hot pressing process), in which the component 5, which has been pre-pressed onto the substrate 3 by the pre-pressing section 30, is formally pressed (i.e., hot-pressed) onto the substrate 3. Thus, the electrode portion 4 formed on the substrate 3 and the component 5 are electrically connected via an ACF (Acoustic Coefficient of Form). This formal pressing section 40 includes a substrate moving mechanism 41 and a pressing mechanism 42.

[0119] The substrate moving mechanism 41 has the same structure as the substrate moving mechanism 21 of the attachment part 20. Specifically, the substrate moving mechanism 41 has a worktable 49. A plurality of adsorption holes 49a are provided on the upper surface of the worktable 49. The substrate moving mechanism 41 holds the substrate 3 placed on the worktable 49 by vacuum adsorption through the plurality of adsorption holes 49a. In addition, the substrate moving mechanism 41 has the function of moving the worktable 49, which holds the substrate 3 by adsorption, in the horizontal plane, moving up and down in the vertical direction, and rotating about the Z-axis. By moving and rotating the worktable 49, the substrate moving mechanism 41 positions the area of ​​the pre-pressed component 5 of the adsorbed and held substrate 3 above the lower receiving part 46 of the pressing mechanism 42.

[0120] The crimping mechanism 42 is mounted on the base 1b and includes a crimping tool 43 and a lower bearing part 46.

[0121] The crimping tool 43 is heated and presses the component 5 of the substrate 3, which is supported by the lower receiving portion 46, against the lower receiving portion 46. For example, the crimping tool 43 presses the component 5 while it is heated to about 200°C. As a result, the component 5 is formally crimped, and the electrode portion 4 formed on the substrate 3 and the component 5 are electrically connected via ACF.

[0122] The substrate removal unit 50 has the function of vacuum adsorbing the substrate 3 transported from the formal pressing unit 40 and holding it on the worktable 51. The substrate 3 held in the substrate removal unit 50 is moved to other devices downstream, or removed from the worktable 51 by an operator.

[0123] The worktable 51 moves up and down along the Z-axis relative to the base 1c. In addition, a plurality of adsorption holes 51a are provided on the upper surface of the worktable 51, and the worktable 51 holds the substrate 3 transferred from the formal pressing section 40 by vacuum adsorption on its upper surface.

[0124] The transport unit 60 is a device for transporting the substrate 3. Specifically, the transport unit 60 has the function of transferring (transferring) the substrate 3, which has been transported into the substrate loading unit 10, to the attachment unit 20, the pre-pressing unit 30, the final pressing unit 40, and the substrate unloading unit 50 in that order. The transport unit 60 is disposed in the area in front of the attachment unit 20, the pre-pressing unit 30, and the final pressing unit 40 (i.e., the negative side in the Y-axis direction).

[0125] The transport unit 60 has a substrate transport mechanism 62A, substrate transport mechanism 62B, substrate transport mechanism 62C and substrate transport mechanism 62D arranged sequentially from the upstream side on a movable base 61 that spans base 1a, base 1b and base 1c.

[0126] The substrate handling mechanisms 62A to 62D each have a base 63 and one or more arm units 64. In this embodiment, an example is shown where each of the substrate handling mechanisms 62A to 62D has two arm units 64.

[0127] The base 63 is mounted on the movable platform 61 and can move freely along the X-axis. Two arm units 64 are arranged on the base 63 along the X-axis. The arm units 64 vacuum-adsorb the substrate 3 from above.

[0128] Substrate transport mechanisms 62A to 62D move to the substrate transfer positions of the substrates 3 held by the upper vacuum adsorption stages 11, 23, 37, 49, and 51, respectively, to receive or deliver the substrates 3 from the lifting stages 11, 23, 37, 49, and 51. For example, substrate transport mechanism 62A receives the substrate 3 placed on stage 11 of the substrate loading section 10 and delivers it to stage 23 of the attachment section 20. Furthermore, for example, substrate transport mechanism 62B receives the substrate 3 from stage 23 of the attachment section 20 and delivers it to stage 37 of the pre-pressing section 30. Furthermore, for example, substrate transport mechanism 62C receives the substrate 3 from stage 37 of the pre-pressing section 30 and delivers it to stage 49 of the formal pressing section 40. Furthermore, for example, substrate transport mechanism 62D receives the substrate 3 from stage 49 of the formal pressing section 40 and delivers it to stage 51 of the substrate unloading section 50.

[0129] Figure 3 This is a diagram showing the computer included in component assembly line 1 and the various components controlled by that computer.

[0130] like Figure 3 As shown, the component mounting line 1 includes a computer 2. This computer 2 is communicatively connected to, for example, the attachment unit 20, the pre-pressing unit 30, the final pressing unit 40, and the transport unit 60 via control lines, and controls these components. The computer 2 includes a control unit 2a, a storage unit 2b, and a display unit 2c.

[0131] The display unit 2c displays images and text, and may be composed of, for example, a liquid crystal display, a plasma display, or an organic EL (electro-Luminescence) display. However, the display unit 2c is not limited to these types of displays.

[0132] The storage unit 2b stores various data required for component installation operations, such as the size of the storage substrate 3, the types of components 5 mounted on the substrate 3, their mounting positions, mounting directions, and the timing of transferring the substrate 3, as well as the control program executed by the control unit 2a. The storage unit 2b is implemented, for example, by ROM (Read Only Memory) or RAM (Random Access Memory).

[0133] The control unit 2a controls the substrate moving mechanism 21 of the attachment unit 20, the substrate moving mechanism 31 of the pre-pressing unit 30, the substrate moving mechanism 41 of the formal pressing unit 40, and the transport unit 60 to perform a substrate transfer operation that moves the substrate 3 between each part to the next process. The transfer of the substrate 3 from the upstream side to the downstream side in the substrate transfer operation is carried out synchronously between each part.

[0134] For example, the control unit 2a controls the attachment unit 20 to change the orientation and position of the substrate 3 held by the substrate moving mechanism 21, changes the spacing of multiple attachment heads by the head moving motor, and causes the attachment unit 20 to perform the attachment operation of attaching ACF to the substrate 3 by the attachment mechanism 22.

[0135] Furthermore, for example, the control unit 2a controls the pre-pressing unit 30. That is, the control unit 2a changes the orientation and position of the substrate 3 held by the substrate moving mechanism 31, causing the component mounting mechanism 32 to perform pre-pressing of the component 5 onto the substrate 3. At this time, the control unit 2a can also correct or change the position of the substrate 3 based on the image captured by the camera unit 39 provided in the pre-pressing unit 30. The imaging range of the camera unit 39 is moved by the camera moving mechanism 38. In addition, the control unit 2a moves the component 5 supplied from the component supply unit 33 toward the component mounting mechanism 32 by controlling the component supply unit 33 and the component moving unit 35.

[0136] In addition, for example, the control unit 2a changes the orientation and position of the substrate 3 held by the substrate moving mechanism 41 by controlling the formal pressing unit 40, so that the pressing mechanism 42 performs formal pressing on the component 5 that has been pre-pressed onto the substrate 3.

[0137] Furthermore, the control unit 2a controls the display unit 2c to display images and text, etc.

[0138] Such a control unit 2a is implemented, for example, by a control program stored in a storage unit 2b for controlling the various parts and mechanisms of the component mounting line 1, and a processor such as a CPU (Central Processing Unit) that executes the control program.

[0139] [Structure of the component crimping device]

[0140] Figure 4 This is a block diagram showing the structure of the component crimping device 100 in this embodiment.

[0141] The component crimping device 100 consists of a pre-crimping section 30 in the component mounting line 1 and a control section 2a of the computer 2.

[0142] Specifically, the component crimping device 100 includes a control unit 2a, a component supply unit 33, a component moving unit 35, a crimping tool 34, a lower receiving unit 36, a substrate moving mechanism 31, a camera moving mechanism 38, a first camera 39L, and a second camera 39R.

[0143] The aforementioned camera unit 39 comprises a first camera 39L and a second camera 39R. The first camera 39L and the second camera 39R respectively capture images of a subject contained within their respective camera ranges. A camera movement mechanism 38 moves the camera ranges of both the first camera 39L and the second camera 39R. By moving the camera ranges of the first camera 39L and the second camera 39R, the camera movement mechanism 38 adjusts the distance between their respective camera ranges. Furthermore, the camera movement mechanism 38 moves the camera ranges of the first camera 39L and the second camera 39R along the Y-axis. The distance between their camera ranges is also referred to as the optical system spacing or camera spacing. For example, in this embodiment, the camera movement mechanism 38 moves the camera ranges of the first camera 39L and the second camera 39R by moving them.

[0144] The control unit 2a controls the board moving mechanism 31, the component supply unit 33, the crimping tool 34, the component moving unit 35, the camera moving mechanism 38, the first camera 39L, and the second camera 39R.

[0145] [Component Supply]

[0146] Figure 5 This is a diagram showing an example of a strip member and a portion of a substrate 3 each having multiple components 5.

[0147] like Figure 5 As shown in (a), the belt member 70 includes a plurality of components 5. These plurality of components 5 are arranged along the long side of the belt member 70 and positioned at given intervals between each other. Such a belt member 70 is a component in which a plurality of components 5 are mounted on a flexible resin membrane, and is also referred to as a membrane carrier. For example, the belt member 70 is a TCP. A single TCP or COF (Chip on Film) in a monolithic state is punched out from the belt member 70 to serve as the component 5. A plurality of sprocket tooth holes 71 are formed at both ends of the belt member 70 in the width direction, arranged in a row along the long side of the belt member 70.

[0148] The component 5 has an electrode portion 6 consisting of multiple electrodes and a pair of second alignment marks Mc. The material constituting the component 5 is not particularly limited, but may be, for example, a resin such as polyimide.

[0149] Each electrode included in the electrode section 6 is a conductive component such as metal disposed on the surface of the component 5. Multiple electrodes are arranged, for example, along the width direction of the strip component 70.

[0150] The pair of second alignment marks Mc are marks used to obtain the positional relationship between the substrate 3 and the component 5. For example, the pair of second alignment marks Mc are cross-shaped marks, configured to clamp the electrode portion 6 along the width direction of the strip member 70.

[0151] like Figure 5 As shown in (b), an electrode section 4 consisting of multiple electrodes and a pair of first alignment marks Mb are formed on the substrate 3. Each electrode included in the electrode section 4 is a conductive component such as metal disposed on the surface of the substrate 3. The multiple electrodes are arranged, for example, along the X-axis direction.

[0152] The pair of first alignment marks Mb are marks used to determine the positional relationship between the substrate 3 and the component 5. For example, the pair of first alignment marks Mb are cross-shaped marks configured to clamp the electrode portion 4 along the X-axis direction. In addition, the aforementioned ACF 91 is attached to the electrode portion 4.

[0153] Figure 6 This diagram shows a structural example of the punching section 33b of the component supply section 33. The punching section 33b conveys the belt member 70 at fixed intervals while sequentially punching multiple components 5 from the belt member 70. For example, the punching section 33b includes sprocket teeth 331 that engage with sprocket tooth holes 71 provided in the belt member 70, a motor 332 that drives the sprocket teeth 331 to rotate, a punch 333 that punches the components 5 from the belt member 70, and a die 334. The motor 332 is controlled by the control unit 2a and drives the sprocket teeth 331 to convey the belt member 70 at fixed intervals. Furthermore, the motor 332 can finely adjust the conveying amount of the belt member 70. The components 5 punched from the belt member 70 by the punching section 33b are placed on a movable worktable 33c.

[0154] Figure 7 This is a diagram showing the flow of component 5 from component supply section 33 to crimping tool 34 via component moving section 35.

[0155] The component supply unit 33 includes a punching unit 33b, a supply reel 33a, a cover tape recovery unit 336, a winding unit 335, a movable worktable 33c, and a track 33d.

[0156] A strip member 70 is wound on a supply reel 33a. The front end of the strip member 70 is tensioned and drawn out from the supply reel 33a by a punching section 33b. A cover strip recovery section 336 recovers the cover strip 72 stripped from the strip member 70. A winding section 335 winds the remaining portion of the strip member 70 for recovery. The remaining portion of the strip member 70 is the portion remaining after the cover strip 72 has been stripped from the strip member 70 and the component 5 has been punched. A movable worktable 33c receives and holds the component 5 punched by the punching section 33b from the punching section 33b and moves along the track 33d.

[0157] The component moving part 35 includes a transfer head 35a and a transfer table 35b. The transfer head 35a receives the component 5 held on the movable table 33c, which moves along the track 33d. Then, the transfer head 35a moves toward the crimping tool 34 while holding the component 5 in place. The transfer table 35b receives the component 5 held by the transfer head 35a after it has moved to the crimping tool 34. The transfer table 35b, having received the component 5, moves below the crimping tool 34.

[0158] The crimping tool 34 holds the component 5 placed on the transfer stage 35b by adsorption. Here, the imaging unit 39, which consists of the first camera 39L and the second camera 39R, captures images of the component 5 held by the crimping tool 34 via the lower receiving part 36. Further, the imaging unit 39 captures images of the edge of the substrate 3 held on the stage 37 of the substrate moving mechanism 31 via the lower receiving part 36. Based on the results of the images of the component 5 and the edge of the substrate 3, the stage 37 aligns the component 5 with the substrate 3. Then, the crimping tool 34 crimps the component 5 relative to the aligned substrate 3.

[0159] Thus, the component supply section 33 of the component crimping apparatus 100 in this embodiment includes a punching section 33b that sequentially punches out each component of the plurality of components 5 from the strip member 70 on which the plurality of components 5 are provided. Furthermore, the crimping tool 34 holds the component 5 punched out by the punching section 33b and crimps the component 5 onto the substrate 3.

[0160] [Crimping of components]

[0161] Figure 8 This is a diagram illustrating an example of the pressing process of component 5 performed by the pressing tool 34 and the worktable 37 of the substrate moving mechanism 31.

[0162] First, such as Figure 8 As shown in (a), the transfer table 35b transports the component 5 towards the crimping tool 34 and the lower support portion 36. Next, as... Figure 8 As shown in (b), the transfer table 35b stops below the crimping tool 34, that is, between the crimping tool 34 and the lower receiving part 36. Next, as... Figure 8 As shown in (c), the crimping tool 34 descends and holds the component 5. Thus, the component 5 is transferred from the transfer table 35b to the crimping tool 34. Then, as... Figure 8 As shown in (d), the crimping tool 34 rises while holding the component 5.

[0163] Next, as Figure 8 As shown in (e), the transfer table 35b, which has transferred component 5, retracts from below the crimping tool 34. Then, as... Figure 8 As shown in (f), the imaging unit 39 captures an image of the component 5. During this imaging, the edge of the component 5 and the second alignment mark Mc are captured. The imaging result is used to confirm the blanking accuracy of the component 5 by the blanking unit 33b. Furthermore, the imaging result of the second alignment mark Mc is used to align the component 5 with the substrate 3. Additionally, the crimping tool 34 can lower the component 5 to the focal position of the imaging unit 39 or its vicinity. Furthermore, the imaging unit 39 can also change the focal position. Next, as... Figure 8 As shown in (g), when the crimping tool 34 descends, the crimping tool 34 rises, and the worktable 37 holding the substrate 3 moves. Figure 8 As shown in (h), if the edge of the substrate 3 reaches below the crimping tool 34 through the movement of the worktable 37, the worktable 37 descends. Thus, the edge of the substrate 3 is supported from below by the lower bearing portion 36. At this time, the imaging unit 39 captures an image of the first alignment mark Mb formed on the substrate 3. Then, based on the imaging results of the first alignment mark Mb and the second alignment mark Mc, the worktable 37 adjusts the position of the substrate 3. That is, the position of the component 5 is aligned with that of the substrate 3.

[0164] Next, as Figure 8 As shown in (i), the crimping tool 34 begins to descend in order to mount the component 5 onto the edge of the substrate 3. Then, as... Figure 8 As shown in (j), the crimping tool 34 presses the member 5 against the edge of the substrate 3. As a result, the member 5 is pre-pressed to the substrate 3, and through the ACF 91 mounted on the substrate 3, the electrode portion 6 of the member 5 is electrically connected to the electrode portion 4 of the substrate 3. Then, as... Figure 8 As shown in (k), the crimping tool 34 rises, and the substrate 3 with the pre-crimped component 5 is removed by the movement of the worktable 37.

[0165] [Relationship Information]

[0166] The control unit 2a in this embodiment is based on Figure 8 The imaging results of the camera unit 39 on the component 5 under the condition shown in (f) generate and output relationship information representing the punching accuracy of the component 5.

[0167] Figure 9 This is a diagram illustrating an example of relational information.

[0168] In the relational information, for each pair of second alignment marks Mc, the positional relationship between the second alignment mark Mc and the end edge of the component 5 surrounding the second alignment mark Mc is represented as the punching accuracy of the component 5. Specifically, the relational information represents the positional relationship as the distance between the end edge of the component 5 and the second alignment mark Mc. More specifically, the relational information represents the distances XL and YL of the second alignment mark Mc on the positive side of the X-axis direction and the distances XR and YR of the second alignment mark Mc on the negative side of the X-axis direction.

[0169] Distance XL is the distance between the second alignment mark Mc on the positive side of the X-axis and the cutting line of the component 5 along the Y-axis that is closest to the second alignment mark Mc. Distance YL is the distance between the second alignment mark Mc on the positive side of the X-axis and the cutting line of the component 5 along the X-axis that is closest to the second alignment mark Mc.

[0170] Furthermore, the cutting line is an edge of component 5 formed by the punching of component 5 by the punching part 33b. In addition, the end edge of component 5 around the second alignment mark Mc located on the positive side of the X-axis direction is formed by a cutting line located on the negative side of the Y-axis direction and along the X-axis direction and a cutting line located on the positive side of the X-axis direction and along the Y-axis direction.

[0171] Similarly, distance XR is the distance between the second alignment mark Mc on the negative side of the X-axis direction and the cutting line of the component 5 closest to the second alignment mark Mc along the Y-axis direction. Distance YR is the distance between the second alignment mark Mc on the negative side of the X-axis direction and the cutting line of the component 5 closest to the second alignment mark Mc along the X-axis direction. Furthermore, the end edge of the component 5 surrounding the second alignment mark Mc on the negative side of the X-axis direction is formed by a cutting line located on the negative side of the Y-axis direction and along the X-axis direction, and a cutting line located on the negative side of the X-axis direction and along the Y-axis direction.

[0172] Such relational information is fed back to the blanking unit 33b, for example. That is, in this embodiment, the control unit 2a controls the blanking of the component 5 from the tape member 70 by the blanking unit 33b through the output of this relational information.

[0173] For example, if the distances YL and YR deviate from the reference distance, the blanking section 33b shifts the blanking position of the component 5 along the long side direction of the strip member 70 so that these distances are closer to the reference distance. Alternatively, the blanking section 33b adjusts the blanking interval of the component 5. Furthermore, if either the distance XL or XR is shorter than the reference distance and the other is longer than the reference distance, the blanking section 33b shifts the blanking position of the component 5 along the width direction of the strip member 70 so that these distances are closer to the reference distance.

[0174] [Details of the camera footage from the camera department]

[0175] Figure 10 This diagram shows an example of each of the first camera 39L, the second camera 39R, and the camera movement mechanism 38 included in the camera unit 39 of this embodiment.

[0176] The first camera 39L and the second camera 39R are positioned on the underside of the lower support portion 36 to capture images in the Z-axis direction. Furthermore, the first camera 39L and the second camera 39R are arranged along the X-axis direction.

[0177] The camera movement mechanism 38 moves the imaging range of the first camera 39L and the second camera 39R, for example, by moving them respectively. The camera movement mechanism 38 changes the distance between these cameras, i.e., changes the camera spacing, by moving the first camera 39L and the second camera 39R along the X-axis. Furthermore, the camera movement mechanism 38 moves the first camera 39L and the second camera 39R along the Y-axis.

[0178] When photographing component 5, the crimping tool 34 holds component 5 in a state where the electrode portion 6, which is composed of a plurality of electrodes formed on component 5, and a pair of second alignment marks Mc, which are arranged to clamp the electrode portion 6, are facing downwards. Moreover, the pair of second alignment marks Mc are arranged to face the lower receiving portion 36.

[0179] The first camera 39L and the second camera 39R capture images of a pair of second alignment marks Mc on the component 5 and the two end edges of the component 5 from below via two through-holes h1 in the lower receiving portion 36. The two through-holes h1 are, for example, holes arranged along the X-axis direction with openings on the upper surface of the lower receiving portion 36, and extending through the lower receiving portion 36 along the Z-axis direction. The first camera 39L captures images of the second alignment marks Mc on the positive side of the X-axis direction of the component 5 and the end edges of the component 5 surrounding the second alignment marks Mc via the through-hole h1 on the positive side of the X-axis direction. The second camera 39R captures images of the second alignment marks Mc on the negative side of the X-axis direction of the component 5 and the end edges of the component 5 surrounding the second alignment marks Mc via the through-hole h1 on the negative side of the X-axis direction. In addition, although the through portion h1 in this embodiment is a hole, it can also be a groove recessed to the positive side in the Y-axis direction, or it can be made of a component such as glass that is translucent.

[0180] When photographing the substrate 3, the edge of the substrate 3 held on the stage 37 is positioned above the lower support portion 36. Furthermore, on the upper surface of this edge, an electrode portion 4 composed of multiple electrodes and a pair of first alignment marks Mb configured to clamp the electrode portion 4 are formed. Further, an ACF91 is attached to the upper surface of this edge in a manner that covers the electrode portion 4.

[0181] The first camera 39L and the second camera 39R capture images of a pair of first alignment marks Mb on the substrate 3 from below via two through-holes h1 in the lower receiving portion 36. Furthermore, the portion of the substrate 3 where the pair of first alignment marks Mb are formed is light-transmitting. Therefore, the first alignment marks Mb formed on the upper surface of the substrate 3 are captured through this light-transmitting portion. The first camera 39L captures images of the first alignment marks Mb on the positive side of the X-axis direction of the substrate 3 via the through-hole h1 on the positive side of the X-axis direction. The second camera 39R captures images of the first alignment marks Mb on the negative side of the X-axis direction of the substrate 3 via the through-hole h1 on the negative side of the X-axis direction.

[0182] Figure 11 This is a diagram showing the state of the first camera 39L and component 5 when viewed from the X-axis direction while taking a picture of component 5.

[0183] like Figure 11 As shown, the first camera 39L captures images of the component 5 located above the lower support portion 36 from below the lower support portion 36 via the through portion h1 of the lower support portion 36. The second camera 39R also captures images of the component 5 via the through portion h1 of the lower support portion 36.

[0184] Figure 12A as well as Figure 12B This is a diagram showing the imaging examples of the first camera 39L and the second camera 39R.

[0185] exist Figure 12A In the examples shown in (a) and (b), within the imaging range DL of the first camera 39L, the second alignment mark Mc on the positive side of the X-axis direction of component 5 and the end edge of component 5 located around the second alignment mark Mc are included. In this case, the first camera 39L simultaneously images the second alignment mark Mc and the end edge of component 5. Through this imaging, imaging data is generated as an image capturing the second alignment mark Mc and the end edge of component 5. Then, as... Figure 12A As shown in (a), the control unit 2a identifies the position of the end edge of the component 5 based on the camera data, and further as follows: Figure 12A As shown in (b), the position of the second alignment mark Mc is identified.

[0186] Similarly, in Figure 12B In the examples shown in (a) and (b), within the imaging range DR of the second camera 39R, the second alignment mark Mc on the negative X-axis direction of component 5 and the end edge of component 5 located around the second alignment mark Mc are included. In this case, the second camera 39R simultaneously images the second alignment mark Mc and the end edge of component 5. Through this imaging, imaging data is generated as an image of the second alignment mark Mc and the end edge of component 5. Then, as... Figure 12B As shown in (a), the control unit 2a identifies the position of the end edge of the component 5 based on the camera data, and further as follows: Figure 12B As shown in (b), the position of the second alignment mark Mc is identified.

[0187] Here, sometimes the second alignment mark Mc and the end edge of component 5 are not included within each of the imaging ranges DL and DR. For example, when the distance between the end edge of component 5 and the second alignment mark Mc is long, the second alignment mark Mc and the end edge of component 5 cannot be included within each of the imaging ranges DL and DR. In such cases, the camera movement mechanism 38 in this embodiment moves the imaging range DL of the first camera 39L and the imaging range DR of the second camera 39R. Then, the control unit 2a first causes the first camera 39L and the second camera 39R to capture images of the two end edges of component 5, and then causes the first camera 39L and the second camera 39R to capture images of a pair of second alignment marks Mc.

[0188] Figure 13A This is a diagram illustrating an example of capturing an image using the end edge of component 5 as the subject. Figure 13B This is a diagram illustrating an example of photographing a subject with the second alignment mark Mc as the subject.

[0189] As mentioned above, there are cases where both the second alignment mark Mc and the end edge of component 5 cannot be included within the imaging range DL of the first camera 39L. In such cases, firstly, as... Figure 13A As shown in (a), the control unit 2a controls the camera movement mechanism 38 to move the camera range DL so that the edge of the component 5 enters the camera range DL. Then, as... Figure 13A As shown in (b), before the control unit 2a takes a picture of the second alignment mark Mc, it first causes the first camera 39L to take a picture of the end edge of the component 5. As a result, the first camera 39L generates image data as an image of the end edge of the component 5.

[0190] After photographing the edge of component 5, such as Figure 13B As shown in (a), the control unit 2a moves the imaging range DL towards the negative side in the X-axis direction by controlling the camera movement mechanism 38. As a result, the second alignment mark Mc of component 5 is included within the imaging range DL. Then, as... Figure 13B As shown in (b), the control unit 2a causes the first camera 39L to capture an image of the second alignment mark Mc. As a result, the first camera 39L generates video data as an image of the second alignment mark Mc.

[0191] Control unit 2a according to Figure 13AThe position of the end edge of component 5 within the imaging range DL is identified by the imaging data of the end edge of component 5 shown in (b). Further, the control unit 2a... Figure 13B The position of the second alignment mark Mc within the imaging range DL is identified using the imaging data of the second alignment mark Mc shown in (b). Then, the control unit 2a determines the positional relationship between the end edge of the component 5 and the second alignment mark Mc based on the position of the end edge of the component 5, the position of the second alignment mark Mc, and the movement direction and distance of the imaging range DL. The control unit 2a generates relationship information (XL, YL) representing this positional relationship.

[0192] Control unit 2a also performs DR for the imaging range of the second camera 39R. Figure 13A as well as Figure 13B The same processing is applied to the camera footage. This generates relational information (XR, YR).

[0193] Figure 14A This is another example of imaging using the end edge of component 5 as the subject. Figure 14B This is another example of photographing a subject with the second alignment mark Mc as the subject.

[0194] and Figure 13A Similarly, in the example shown, where both the second alignment mark Mc and the end edge of component 5 cannot be included within the camera range DL, firstly, as... Figure 14A As shown in (a), the control unit 2a causes the edge of the component 5 to enter the imaging range DL. Next, as... Figure 14A As shown in (b), the control unit 2a causes the first camera 39L to capture an image of the end edge of the component 5. As a result, the first camera 39L generates image data as an image of the end edge of the component 5.

[0195] After capturing an image of the edge of component 5, the control unit 2a controls the camera movement mechanism 38, such as... Figure 14B As shown in (a), the imaging range DL is moved to the positive side in the Y-axis direction. Therefore, the second alignment mark Mc of component 5 is included within the imaging range DL. Then, as... Figure 14B As shown in (b), the control unit 2a causes the first camera 39L to capture an image of the second alignment mark Mc. As a result, the first camera 39L generates video data as an image of the second alignment mark Mc.

[0196] [Processing flow of component crimping device]

[0197] Figure 15 This is a flowchart illustrating the overall processing steps of the component crimping device 100 in this embodiment.

[0198] The part supply section 33b of the part crimping device 100 performs a punching process (step S11) to punch the part 5 from the belt member 70. The part 5 obtained by punching is moved to the crimping tool 34 side by the part moving section 35.

[0199] Next, the crimping tool 34 holds the component 5 supplied from the component supply unit 33 (step S12). Then, the control unit 2a performs a positional relationship determination process, in which the imaging unit 39 captures an image of the component 5 held by the crimping tool 34 to determine the positional relationship between the end edge of the component 5 and the second alignment mark Mc (step S13). In this step S13, the imaging unit 39 captures an image of the component 5, generating image data of a pair of second alignment marks Mc formed on the component 5.

[0200] Then, the control unit 2a determines whether the positional relationship is within the allowable range (step S14). If it is determined that the positional relationship is within the allowable range (yes in step S14), the control unit 2a feeds back the positional relationship to the punching process (step S15). That is, the control unit 2a outputs the relationship information representing the positional relationship to the punching unit 33b of the component supply unit 33, causing the punching unit 33b to adjust the position where the punching unit 33b punches the component 5.

[0201] Then, without changing the positions of the imaging range DL and imaging range DR of the imaging unit 39 as set in the last step S13, the control unit 2a moves the substrate 3 towards the downward bearing portion 36 by controlling the substrate moving mechanism 31. Through this movement of the substrate 3, the control unit 2a causes a pair of first alignment marks Mb on the substrate 3 to enter the imaging range DL and imaging range DR respectively (step S16). That is, the control unit 2a causes the substrate moving mechanism 31 to move the substrate 3 so that a pair of first alignment marks Mb enter the imaging range DL and imaging range DR respectively.

[0202] Next, the control unit 2a instructs the camera unit 39 to capture images of a pair of first alignment marks Mb contained in the camera range DL and the camera range DR, respectively, as subjects (step S17). That is, the first camera 39L captures images of the first alignment marks Mb contained in the camera range DL, and the second camera 39R captures images of the first alignment marks Mb contained in the camera range DR. As a result, image data of the pair of first alignment marks Mb captured are generated.

[0203] Next, the control unit 2a, based on the pair of second alignment marks Mc of component 5 and the pair of first alignment marks Mb of substrate 3, causes the substrate moving mechanism 31 to perform position adjustment of substrate 3 (step S18). That is, the control unit 2a identifies the position of the first alignment mark Mb based on the image data of the first alignment mark Mb, and identifies the position of the second alignment mark Mc based on the image data of the second alignment mark Mc. Then, the worktable 37 of the substrate moving mechanism 31 holding substrate 3 adjusts the position of substrate 3 under the control of the control unit 2a, so that the pair of second alignment marks Mc overlaps with the pair of first alignment marks Mb. Thus, the position of component 5 and substrate 3 is aligned. Then, the control unit 2a lowers the pressing tool 34 to press component 5 onto the edge of substrate 3 supported by the lower bearing part 36 (step S19). That is, the control unit 2a controls the pressing of component 5 onto substrate 3 by substrate moving mechanism 31 and pressing tool 34 based on the image results of the pair of first alignment marks Mb and the pair of second alignment marks Mc.

[0204] Furthermore, in step S14, if it is determined that the positional relationship is not within the allowable range (No in step S14), the control unit 2a prohibits the pressing of the component 5 held by the pressing tool 34 onto the substrate 3 (step S20). At this time, the control unit 2a can stop the punching of the component 5 by the punching unit 33b. Moreover, the control unit 2a notifies that a defect has occurred in the punching unit 33b of the component supply unit 33 (step S21). For example, the control unit 2a notifies the occurrence of the defect by displaying a message or warning on the display unit 2c.

[0205] Specifically, if the distance represented by the relationship information is not within a predetermined allowable range, control unit 2a notifies that a defect has occurred in the punching unit 33b. More specifically, if the distances YL and YR represented by the relationship information are shorter or longer than the allowable range, control unit 2a notifies that a defect has occurred. Furthermore, control unit 2a may also notify that a defect has occurred if the difference between the distances YL and YR is not within the allowable range. Additionally, control unit 2a may also notify that a defect has occurred if either the distance XL or XR represented by the relationship information is shorter than the allowable range and the other is longer than the allowable range.

[0206] Figure 16 It is shown Figure 15 The flowchart details the process of determining the positional relationship in step S13.

[0207] The control unit 2a causes the first camera 39L and the second camera 39R to capture images of the component 5 respectively (step S131). As a result, the first camera 39L and the second camera 39R generate image data of the component 5 respectively. Then, based on this image data, the control unit 2a determines whether the edge of the determination component 5 and the second alignment mark Mc are both contained within the respective image range DL of the first camera 39L and the image range DR of the second camera 39R (step S132).

[0208] Here, if it is determined that both the edge of component 5 and the second alignment mark Mc are contained within the imaging range DL and the imaging range DR respectively (as determined in step S132), then the control unit 2a generates the aforementioned relationship information (step S133). That is, the control unit 2a determines the positional relationship (XL, YL) between the edge of component 5 and the second alignment mark Mc captured in the imaging data of the first camera 39L. Similarly, the control unit 2a determines the positional relationship (XR, YR) between the edge of component 5 and the second alignment mark Mc captured in the imaging data of the second camera 39R. Then, the control unit 2a generates relationship information (XL, YL), (XR, YR) representing the determined positional relationship.

[0209] On the other hand, if it is determined that neither the end edge of component 5 nor the second alignment mark Mc is contained within the respective camera ranges DL and DR (No in step S132), then the control unit 2a causes the camera movement mechanism 38 to move the camera ranges DL and DR (step S134). That is, the control unit 2a causes the camera movement mechanism 38 to move the camera ranges DL and DR so that the end edge of component 5 held by the crimping tool 34 enters the camera ranges DL and DR respectively. Then, the control unit 2a causes the first camera 39L and the second camera 39R to each capture images of the end edge of component 5 contained within the camera ranges DL and DR respectively (step S135). As a result, the first camera 39L and the second camera 39R each generate video data capturing the end edge of component 5.

[0210] Furthermore, in step S134, the first camera 39L and the second camera 39R can each continuously move their imaging range while capturing images until the edge of component 5 enters the imaging range DL and the imaging range DR, respectively. In this case, steps S134 and S135 are executed simultaneously. Moreover, while the processing of step S134 is executed immediately upon a negative determination in step S132, it may not be executed immediately. For example, if a negative determination is made in step S132, the control unit 2a controls the camera movement mechanism 38 to move the imaging range DL and the imaging range DR, thereby repeating the processing of steps S131 and S132. Furthermore, the processing of step S134 may be executed even if a predetermined number of repetitions in step S132 have not resulted in a positive determination in step S132. That is, the processing of step S134 may be executed even if the edge of component 5 and the second alignment mark Mc cannot enter the imaging range DL and the imaging range DR, respectively. Alternatively, if it is known in advance, based on the specifications of component 5, the first camera 39L and the second camera 39R, that it is not possible to simultaneously photograph the edge of component 5 and the second alignment mark Mc, then the processing of steps S131 and S132 can be skipped and the processing of step S134 can be performed.

[0211] Next, the control unit 2a moves the camera movement mechanism 38 to move the camera range DL and camera range DR (step S137). That is, the control unit 2a moves the camera range DL and camera range DR so that the second alignment mark Mc of component 5 enters the camera range DL and camera range DR respectively. In other words, when the pair of second alignment marks Mc are not respectively included in the camera range DL and camera range DR, after capturing the edge of component 5, the control unit 2a moves the camera movement mechanism 38 to move the camera range DL and camera range DR so that the pair of second alignment marks Mc enter the camera range DL and camera range DR respectively. Then, the control unit 2a causes the first camera 39L and the second camera 39R to capture images of the second alignment marks Mc, which are respectively included in the camera range DL and camera range DR, as subjects (step S138). As a result, the first camera 39L and the second camera 39R each generate video data capturing the second alignment mark Mc.

[0212] Additionally, in step S137, the first camera 39L and the second camera 39R can each continuously move their imaging range while recording images until the second alignment mark Mc enters the imaging range DL and the imaging range DR, respectively. In this case, steps S137 and S138 are executed simultaneously.

[0213] After the image capture in step S138, the control unit 2a generates the aforementioned relationship information (step S133). At this time, the control unit 2a uses the image data generated in step S135 showing the edge of component 5 and the image data generated in step S138 showing the second alignment mark Mc. For example, the control unit 2a identifies the position of the edge of component 5 captured by the first camera 39L in the image data generated in step S135, that is, identifies the position of the edge within the image range DL. Further, the control unit 2a identifies the position of the second alignment mark Mc captured by the first camera 39L in the image data generated in step S137, that is, identifies the position of the second alignment mark Mc within the image range DL. Then, based on the identified position of the edge of component 5, the position of the second alignment mark Mc, and the moving distance and direction of the image range DL moved in step S137, the control unit 2a determines the positional relationship between the edge of component 5 and the second alignment mark Mc.

[0214] Thus, in step S133, the control unit 2a generates and outputs relationship information indicating the positional relationship between the end edge of the component 5 and the second alignment mark Mc based on the imaging results of the end edge of the component 5 and the second alignment mark Mc, respectively. The relationship information generated in step S133 is used, for example, for feedback control of the blanking position of the component 5 by the blanking unit 33b or for notification of defects in the blanking unit 33b.

[0215] As described above, in this embodiment, it is not necessary to provide a sensor for confirming the blanking state of component 5 in the blanking section 33b, thus suppressing the enlargement of the blanking section 33b. That is, in the component pressing apparatus 100 of this embodiment, the camera unit 39 can be used as a sensor for confirming the blanking state of component 5, thereby suppressing the enlargement of the blanking section 33b. Specifically, the camera unit 39 is used to control the pressing of component 5 onto the substrate 3 by the substrate moving mechanism 31 and the pressing tool 34. For example, the camera unit 39 is used in capturing images of the first alignment mark Mb and the second alignment mark Mc used to control the alignment of component 5 with the substrate 3. In the component pressing apparatus 100 of this embodiment, by having such a camera unit 39 also capture images of the edge of component 5 and generate and output relational information, the camera unit 39 can be used as a sensor for confirming the blanking state of component 5. Therefore, it is not necessary to specifically install a sensor for confirming the blanking state of component 5 in the blanking section 33b, thus suppressing the enlargement of the blanking section 33b.

[0216] Here, to confirm the punching state of component 5, it is necessary to photograph the edge of component 5 and the second alignment mark Mc separately. However, if they cannot be photographed simultaneously, it is necessary to move the imaging ranges DL and DR to photograph them individually. In such a case, for example, it is conceivable to first photograph the second alignment mark Mc, and then move the imaging ranges DL and DR to photograph the edge of component 5. However, in this step, in order to align component 5 with the substrate 3 in the following step, the imaging ranges DL and DR must be further moved back to their original positions. In this alignment, the first alignment mark Mb needs to be photographed. Moreover, in photographing the first alignment mark Mb and the second alignment mark Mc, in order to ensure the accuracy of this alignment, it is desirable that the imaging ranges DL and DR are in the same position. However, if the reproducibility of the position is insufficient even when the imaging ranges DL and DR are each returned to their original positions, the accuracy of the alignment between component 5 and the substrate 3 will decrease.

[0217] However, in the component crimping device 100 of this embodiment, if it is not possible to simultaneously photograph the end edge of the component 5 and the second alignment mark Mc, the end edge of the component 5 is photographed first, and then the second alignment mark Mc is photographed.

[0218] Figure 17 This diagram illustrates the camera unit 39 in the component crimping device 100 of this embodiment and the timing of the camera range movement.

[0219] like Figure 17As shown, in the component pressing apparatus 100 of this embodiment, the edge of component 5 is first imaged, and then the second alignment mark Mc is imaged. During their image capture, the first camera 39L and the second camera 39R, i.e., the image range DL and the image range DR, move. However, during the image capture of the second alignment mark Mc and the first alignment mark Mb, the position adjustment of the worktable 37 for aligning the component 5 with the substrate 3 can be performed without moving the first camera 39L and the second camera 39R. This is because the edge of component 5 is imaged before the second alignment mark Mc. That is, in this embodiment, the first alignment mark Mb can be imaged without moving the image range DL and the image range DR used for image capture of the second alignment mark Mc. Specifically, without moving the image range DL and the image range DR, the first alignment mark Mb of the substrate 3 can be brought into their image range by moving the substrate 3, so as to image the first alignment mark Mb. Therefore, in the imaging of the first alignment mark Mb and the second alignment mark Mc, the positions of the imaging range DL and the imaging range DR are equal. Thus, the accuracy of the alignment between component 5 and substrate 3 can be sufficiently ensured. That is, improved mounting accuracy can be achieved. As a result, the punching state of component 5 can be confirmed while suppressing the enlargement of the punched portion 33b, and improved mounting accuracy can be achieved.

[0220] Furthermore, in this embodiment, the control unit 2a controls the punching of the component 5 from the tape member 70 by the output of relational information. As a result, the positional relationship between the end edge of the component 5 and the second alignment mark Mc can be automatically maintained at a fixed position, and the punching accuracy of the component 5 can be easily improved.

[0221] Furthermore, in this embodiment, the control unit 2a generates relationship information that represents the positional relationship between the end edge of the component 5 and the second alignment mark Mc. If this distance is longer than a threshold, it notifies that a defect has occurred in the blanking unit 33b. This allows for operator-initiated inspection and repair of the blanking unit 33b, thereby improving blanking accuracy.

[0222] (Modified Example)

[0223] In the above embodiment, the camera movement mechanism 38 can move the first camera 39L and the second camera 39R to move the camera range DL and the camera range DR. However, the camera movement mechanism 38 can also move the camera range DL and the camera range DR without moving the first camera 39L and the second camera 39R.

[0224] Figure 18 This is a diagram illustrating a structural example of a portion of the camera movement mechanism 38 in this modified example.

[0225] like Figure 18 As shown in (a) and (b), the camera movement mechanism 38 in this modified example includes an optical component 38a, which is composed of a lens or a mirror. The camera movement mechanism 38 does not move the first camera 39L and the second camera 39R, but rather, for example... Figure 18 As shown in (a), the optical component 38a is moved upward. This causes the imaging range DL and imaging range DR to move in the X-axis direction, thus increasing the camera spacing. Alternatively, the camera movement mechanism 38 may not move the first camera 39L and the second camera 39R, but instead, for example, as shown in (a),... Figure 18 As shown in (b), the optical component 38a is moved downwards. As a result, the imaging range DL and the imaging range DR move in the X-axis direction, thus narrowing the camera spacing.

[0226] Thus, in this modified example, by moving the optical component 38a, the imaging range DL and the imaging range DR can be moved simultaneously and easily along the X-axis.

[0227] (Other variations)

[0228] The component crimping device involved in one or more methods has been described above based on the above embodiments and modifications, but this disclosure is not limited to these embodiments and modifications. As long as it does not depart from the spirit of this disclosure, various modifications conceived by those skilled in the art can be applied to the above embodiments and modifications, and ways of constructing by combining the constituent elements in the above embodiments and modifications can also be included within the scope of this disclosure.

[0229] For example, in the above embodiments and the modified examples, the first alignment mark Mb and the second alignment mark Mc are each cross-shaped, but are not limited to this shape and may be other shapes.

[0230] Furthermore, in the above embodiments and variations, the substrate 3 is a display panel, and the pre-pressing and formal pressing components 5 are attached to the display panel. However, the substrate 3 may also be a substrate other than a display panel.

[0231] Furthermore, in the above-described embodiment and its variation, the first alignment mark Mb is photographed after the second alignment mark Mc is photographed. However, it is also possible to photograph the first alignment mark Mb and the second alignment mark Mc simultaneously.

[0232] Furthermore, in the above-described embodiment and this modified example, the control unit 2a notifies the die-cutting unit 33b of the occurrence of a defect by displaying a message or warning on the display unit 2c. At this time, the control unit 2a may also display the distances XL, XR, YL, and YR represented by relational information on the display unit 2c, and may also display values ​​for adjusting the die-cutting unit 33b based on these distances.

[0233] Furthermore, in the above embodiments and variations, all or part of the components of computer 2 may be constructed by dedicated hardware, or may be implemented by executing software programs suitable for each component. Each component may also be implemented by a program execution unit such as a CPU (Central Processing Unit) or processor reading and executing software programs recorded on recording media such as HDD (Hard Disk Drive) or semiconductor memory. For example, the program execution unit causes the pre-pressing unit 30 to execute... Figure 15 as well as Figure 16 The flowchart shown contains the steps.

[0234] Furthermore, the components of computer 2 can consist of one or more electronic circuits. These electronic circuits can be either general-purpose or special-purpose circuits. For example, they may include semiconductor devices, integrated circuits (ICs), or large-scale integrated circuits (LSIs). ICs or LSIs can be integrated onto a single chip or multiple chips. While referred to as ICs or LSIs, the terminology varies depending on the degree of integration; they may also be called system LSIs, VLSIs (Very Large Scale Integration), or ULSIs (Ultra Large Scale Integration). Additionally, field-programmable gate arrays (FPGAs) programmed after LSI fabrication can also be used for the same purpose.

[0235] Industrial availability

[0236] This disclosure includes, for example, component crimping devices for component mounting lines used to mount components on display panels.

Claims

1. A component crimping device, comprising: A substrate moving mechanism holds and moves a substrate on which a first alignment mark is formed; A crimping tool is used to hold and crimp the component with the second alignment mark onto the substrate; The camera unit is responsible for filming subjects within its camera's field of view. The camera movement mechanism moves the camera range of the camera unit; and Control Department The control unit performs the following controls: The camera movement mechanism moves the camera range so that the end edge of the component held by the crimping tool enters the camera range. The camera unit captures images of the end edge of the component included within the camera's field of view as the subject. If the second alignment mark is not included in the camera's field of view After capturing an image of the end edge of the component, the camera movement mechanism moves the camera range so that the second alignment mark enters the camera range. The camera unit takes the second alignment mark, which is included in the camera range, as the subject and performs imaging. Based on the imaging results of the end edge of the component and the second alignment mark, relationship information representing the positional relationship between the end edge of the component and the second alignment mark is generated and output. The substrate moving mechanism moves the substrate so that the first alignment mark enters the imaging range. The camera unit takes the first alignment mark, which is included in the camera range, as the subject and performs imaging. Based on the imaging results of the first alignment mark and the second alignment mark, the pressing of the component onto the substrate by the substrate moving mechanism and the pressing tool is controlled. During the period from taking a picture of the second alignment mark to taking a picture of the first alignment mark, the camera movement mechanism does not move the camera range of the camera unit.

2. The component crimping device according to claim 1, wherein, The component pressing device further includes: a punching section, which sequentially punches each component of the plurality of components from a strip member having a plurality of components. The crimping tool holds the component punched by the punching section and crimps it onto the substrate.

3. The component crimping device according to claim 2, wherein, The control unit further controls the punching of the component from the tape member by the punching unit through the output of the relational information.

4. The component crimping device according to claim 2, wherein, The control unit further generates relationship information that represents the positional relationship as the distance between the end edge of the component and the second alignment mark, and notifies the punching unit that a defect has occurred if the distance is not within a predetermined allowable range.

5. A component pressing method, wherein a component pressing device presses a component onto a substrate. The component crimping device includes: A substrate moving mechanism holds and moves a substrate on which a first alignment mark is formed; A crimping tool is used to hold and crimp the component with the second alignment mark onto the substrate; The camera unit is responsible for filming subjects within its camera's field of view. The camera movement mechanism moves the camera range of the camera unit; and Control Department In the component crimping method described above. The camera movement mechanism moves the camera range so that the end edge of the component enters the camera range. The camera unit uses the end edge of the component included in the camera range as the subject for imaging. If the second alignment mark is not included in the camera's field of view After capturing an image of the end edge of the component, the camera movement mechanism moves the camera range so that the second alignment mark enters the camera range. The camera unit uses the second alignment mark, which is included in the camera range, as the subject for imaging. Based on the imaging results of the end edge of the component and the second alignment mark, the control unit generates and outputs relational information indicating the positional relationship between the end edge of the component and the second alignment mark. The substrate moving mechanism moves the substrate so that the first alignment mark enters the imaging range. The camera unit uses the first alignment mark, which is included in the camera range, as the subject for imaging. Based on the imaging results of the first alignment mark and the second alignment mark, the control unit controls the pressing of the component onto the substrate by the substrate moving mechanism and the pressing tool. During the period from taking a picture of the second alignment mark to taking a picture of the first alignment mark, the camera movement mechanism does not move the camera range of the camera unit.

Images