Display panel packaging method

Abstract

The present embodiment discloses a method for encapsulating a display panel, comprising: step B1, providing a display panel; step B2, forming an encapsulation layer on the side of the display panel using one of transfer, dip coating, roller coating, and dispensing processes. Because the thickness of the encapsulation layer formed by a single transfer, dip coating, roller coating, and dispensing process is relatively thin, the encapsulation method of the present application employs at least one of the transfer, dip coating, roller coating, and dispensing processes to form an encapsulation layer with controllable thickness.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a packaging method for a display panel. Background Art

[0002] Display panels typically undergo secondary trimming, leaving some metal wires exposed on the sides. Moisture can enter along the edges and corrode the wires. Even when the metal wires are not exposed, moisture can slowly infiltrate the sides between the film layers, corroding the wires.

[0003] During the research and practice of the existing technology, the inventors of this application found that the existing process generally performs side encapsulation layer processing on the side of the display panel, but the coating thickness of the side encapsulation layer is greater than 100 microns, which makes the overall frame larger.

[0004] In addition, for small-sized splicing products, the thickness of the packaging layer greater than 100 microns also affects the size of the splicing seam. Summary of the Invention

[0005] The embodiments of the present application provide a method for packaging a display panel, which can more precisely control the thickness of the side packaging glue.

[0006] An embodiment of the present application provides a method for packaging a display panel, which includes:

[0007] Step B1, providing a display panel;

[0008] Step B2: forming an encapsulation layer on the side of the display panel by using one of the processes selected from the group consisting of transfer, dip coating, roller coating and dispensing.

[0009] Optionally, in some embodiments of the present application, at least one transfer process is used in step B2, and step B2 includes the following steps:

[0010] Step B21, forming a patterned adhesive layer on the template;

[0011] Step B22: Use a transfer head to print the adhesive layer and transfer it to the side of the display panel to form an encapsulation layer.

[0012] Optionally, in some embodiments of the present application, a groove is provided on the template, and step B21 includes the following steps:

[0013] Applying glue material on the template, so that the glue material fills the groove to form a glue layer;

[0014] The glue material outside the groove is removed.

[0015] Optionally, in some embodiments of the present application, step B22 includes the following steps:

[0016] Step B221, using a transfer head to contact the template so that the transfer head prints the adhesive layer;

[0017] Step B222, the transfer head is separated from the template, so that the adhesive layer is attached to the transfer head;

[0018] Step B223, leaving the transfer head at rest;

[0019] Step B224, moving the transfer head to one side of the display panel;

[0020] Step B225 , the transfer head transfers the adhesive layer to the side surface using a set pressure;

[0021] Step B226, pre-curing the adhesive layer to adhere the adhesive layer to the side surface;

[0022] Step B227, evacuating the transfer head;

[0023] Step B228: solidify the adhesive layer on the side surface to form an encapsulation layer.

[0024] Optionally, in some embodiments of the present application, there is a set duration from step B222 to completing step B224, and the set duration is greater than or equal to 5 seconds and less than or equal to 15 seconds.

[0025] Optionally, in some embodiments of the present application, in step B227, the transfer head is evacuated at a set speed, and the set speed is greater than or equal to 18 mm / s and less than or equal to 20 mm / s.

[0026] Optionally, in some embodiments of the present application, a multiple transfer process is used in step B2;

[0027] In step B22, the set pressure of the odd-numbered transfer process is a first set pressure, and the encapsulation layer is a first encapsulation layer with a first thickness; the set pressure of the even-numbered transfer process is a second set pressure, and the encapsulation layer is a second encapsulation layer with a second thickness;

[0028] The first set pressure is greater than the second set pressure, and the first thickness is less than the second thickness.

[0029] Optionally, in some embodiments of the present application, the packaging method further includes step B3:

[0030] The display panel is rotated, and step B2 is repeated until the encapsulation layer is formed on all four sides of the display panel.

[0031] Optionally, in some embodiments of the present application, at least one dipping process is used in step B2, and step B2 includes the following steps:

[0032] providing a protective layer on the front and back surfaces of the display panel;

[0033] Immersing the side surface of the display panel in a solution containing an encapsulation material, wherein the encapsulation material covers the side surface to form a material layer;

[0034] The display panel is lifted, and the material layer is solidified to form the encapsulation layer.

[0035] Optionally, in some embodiments of the present application, at least one roller coating process is used in step B2, and step B2 includes the following steps:

[0036] providing a protective layer on the front and back surfaces of the display panel;

[0037] Spraying packaging material on the side of the display panel to form a material layer;

[0038] The material layer is cured to form an encapsulation layer.

[0039] Optionally, in some embodiments of the present application, at least one dispensing process is used in step B2, and step B2 includes the following steps:

[0040] fixing the display panel;

[0041] Using a dispensing machine to apply the packaging material on the side of the display panel to form a material layer;

[0042] The material layer is cured to form an encapsulation layer.

[0043] In some embodiments of the present application, before step B2, the packaging method further includes: smoothing the side surfaces of the display panel.

[0044] In one embodiment of the present application, a method for encapsulating a display panel includes: step B1, providing a display panel; and step B2, forming an encapsulation layer on the side of the display panel using one of transfer, dip coating, roller coating, and dispensing processes. Because the encapsulation layer formed by a single transfer, dip coating, roller coating, and dispensing process is relatively thin, the encapsulation method of the present application employs at least one of the transfer, dip coating, roller coating, and dispensing processes to form an encapsulation layer with controllable thickness. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] In order to more clearly illustrate the technical methods in the embodiments of the present application, the following is a brief introduction to the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0046] Figure 1 1 is a flow chart of a method for packaging a display panel provided in the first embodiment of the present application;

[0047] Figure 2 is a schematic diagram of step B1 in the display panel packaging method provided in the first embodiment of the present application;

[0048] Figure 3 is a schematic diagram of step B21 in the display panel packaging method provided in the first embodiment of the present application;

[0049] Figure 4 is a schematic diagram of step B22 in the display panel packaging method provided in the first embodiment of the present application;

[0050] Figure 5 is a schematic diagram of step B3 in the display panel packaging method provided in the first embodiment of the present application;

[0051] Figure 6 1 is a flow chart of a method for packaging a display panel provided in a second embodiment of the present application;

[0052] Figure 7 is a schematic flow chart of a method for packaging a display panel provided in a third embodiment of the present application;

[0053] Figure 8 4 is a flow chart of a method for packaging a display panel provided in the fourth embodiment of the present application. DETAILED DESCRIPTION

[0054] The technical methods in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making creative work are within the scope of protection of the present application. In addition, it should be understood that the specific implementation methods described herein are only used to illustrate and explain the present application, and are not used to limit the present application. In the present application, unless otherwise specified, the directional words used, such as "upper" and "lower", generally refer to the upper and lower parts of the device in actual use or working state, specifically the drawing direction in the accompanying drawings; and "inside" and "outside" refer to the outline of the device.

[0055] The present application provides a method for packaging a display panel, which is described in detail below. It should be noted that the order in which the following embodiments are described is not intended to limit the preferred order of the embodiments.

[0056] Please refer to Figure 1 , an embodiment of the present application provides a method for packaging a display panel, which includes:

[0057] Step B1, providing a display panel;

[0058] Step B2: forming an encapsulation layer on the side of the display panel by using one of the processes selected from the group consisting of transfer, dip coating, roller coating and dispensing.

[0059] In the packaging method of the first embodiment of the present application, since the thickness of the packaging layer formed by the one-time transfer, dip coating, roller coating and dispensing process is relatively thin (greater than 1 micron and less than or equal to 100 microns), the packaging method of the present application uses one of the transfer, dip coating, roller coating and dispensing processes to perform at least one operation to achieve the formation of a packaging layer with controllable thickness.

[0060] The packaging method of the display panel according to the first embodiment is described below.

[0061] Optionally, the first embodiment forms the encapsulation layer by transfer printing.

[0062] Please refer to Figure 2 , step B1, providing a display panel 100.

[0063] Optionally, the display panel 100 may be a liquid crystal panel, an organic light emitting diode panel, a micro light emitting diode panel, a sub-millimeter light emitting diode panel, a quantum dot light emitting diode panel, an electrophoretic panel or other display panels.

[0064] Before step B2 , the packaging method further includes: smoothing the side surfaces of the display panel 100 .

[0065] The display panel 100 is placed on a carrier zt, which is provided with a plurality of vacuum adsorption holes for adsorbing and fixing the display panel 100. The side surfaces of the display panel 100 are then smoothed using a grinding wheel.

[0066] Then go to step B2.

[0067] In step B2, a packaging layer 200 is formed on the side of the display panel 100 by using one of the processes selected from the group consisting of transfer, dip coating, roller coating and dispensing.

[0068] Optionally, in step B2 of the first embodiment, at least one transfer process is used to form the encapsulation layer 200 .

[0069] Step B2 includes the following steps:

[0070] Step B21, forming a patterned adhesive layer 302 on the template 301;

[0071] In step B22 , the transfer head 303 is used to print the adhesive layer 302 , and the transfer is performed to the side surface of the display panel 100 to form the encapsulation layer 200 .

[0072] Please refer to Figure 3 In step B21, a groove 304 is provided on the template 301. The material of the template 301 is a hard material, such as steel.

[0073] Step B21 includes the following steps:

[0074] In step B211 , adhesive material is applied on the template 301 , and the adhesive material fills the groove 304 to form an adhesive layer 302 .

[0075] Optionally, the adhesive material may be a UV curable adhesive or a heat curable adhesive, etc. The viscosity of the adhesive material is between 1000 cps and 10000 cps, for example, 1000 cps, 2000 cps, 3000 cps, 4000 cps, 5000 cps, 6000 cps, 7000 cps, 8000 cps, 9000 cps or 10000 cps.

[0076] It should be understood that if the viscosity of the adhesive material is less than 1000 cps, the adhesive material is thinner and not easy to adhere to the template 301; if the viscosity of the adhesive material is greater than 10000 cps, the adhesive material is too viscous and may easily cause wire drawing when removing the adhesive layer 302.

[0077] In step B211 , the adhesive material is coated on the template 301 , with most of the adhesive material covering and filling the groove 304 , and part of the adhesive material being located outside the groove 304 . The adhesive material located in the groove 304 is the adhesive layer 302 .

[0078] Then go to step B212.

[0079] Step B212: removing the adhesive material outside the groove 304.

[0080] Optionally, a scraper is used to sweep the template 301. During the sweeping process of the template 301, in addition to removing excess glue material on the surface of the template 301, the scraper will also scrape some of the glue material on the template 301 into the groove 304, thereby increasing the thickness and viscosity of the glue layer 302.

[0081] Optionally, the number of times the template 301 is scraped is between 3 and 7 times, such as 3, 4, 5, 6 or 7 times.

[0082] Then go to step B22.

[0083] Please refer to Figure 4 In step B22, the adhesive layer 302 is printed by a transfer head 303 and transferred to the side of the display panel 100 to form the encapsulation layer 200. Step B22 includes the following steps:

[0084] In step B221 , the transfer head 303 is brought into contact with the template 301 so as to print the adhesive layer 302 .

[0085] Optionally, the material of the transfer head 303 includes flexible materials such as silicone. The flexible transfer head 303 is used to abut the template 301, so that the transfer head 303 can fully contact the template 301, and the deformation performance of the transfer head 303 is utilized to allow the transfer head 303 to fully contact the glue layer 302, thereby facilitating the removal of the glue layer 302.

[0086] Then go to step B222.

[0087] In step B222 , the transfer head 303 is separated from the template 301 , so that the adhesive layer 302 is attached to the transfer head 303 .

[0088] It should be noted that the adhesive force between the adhesive layer 302 and the transfer head 303 is greater than the adhesive force between the adhesive layer 302 and the template 301 , which makes it easier for the transfer head 303 to remove the adhesive layer 302 .

[0089] Then go to step B223.

[0090] Step B223: let the transfer head 303 stand still.

[0091] The purpose of leaving the transfer head 303 stationary is to allow some of the diluent in the adhesive layer 302 to volatilize, thereby achieving the effect of preliminarily solidifying the adhesive layer 302. Then, the process proceeds to step 224.

[0092] Step B224 , moving the transfer head 303 to one side of the display panel 100 .

[0093] There is a set time length from step B222 to completing step B224, and the set time length is greater than 5 seconds and less than 15 seconds.

[0094] That is, the time between removing the adhesive layer 302 and transferring it to the side of the display panel 100 is greater than or equal to 5 seconds and less than or equal to 15 seconds. If this time is less than 5 seconds, the initial curing effect of the adhesive layer 302 is poor, the viscosity of the adhesive layer 302 is low, and the adhesive layer 302 is prone to flow during transfer. If this time is greater than 15 seconds, the viscosity of the side adhesive layer 302 is high, and stringing is likely to occur during the transfer process.

[0095] Optionally, in the set time length, the time length for the transfer head 303 to be stationary is longer than the time length for the transfer head 303 to move, so as to better control the viscosity of the adhesive layer 302 .

[0096] Then go to step B225.

[0097] In step B225 , the transfer head 303 transfers the adhesive layer 302 to the side surface using a set pressure.

[0098] It should be noted that the greater the pressure applied by the transfer head 303, the greater the force exerted on the adhesive layer 302, and the thinner the adhesive layer 302, the more likely it is to break. The lower the pressure applied by the transfer head 303, the less force exerted on the adhesive layer 302, and the thicker the adhesive layer 302, the easier it is to flow. Therefore, selecting an appropriate set pressure facilitates the formation of the encapsulation layer 200. The process then proceeds to step B226.

[0099] Step B226: pre-curing the adhesive layer 302 so that the adhesive layer 302 adheres to the side surface.

[0100] Optionally, ultraviolet light is used to irradiate the adhesive layer 302 to pre-cure the adhesive layer 302. Pre-curing the adhesive layer 302 prevents the adhesive layer 302 from having too low a bond with the side surface, which would affect the quality of the transfer. The process then proceeds to step B227.

[0101] Step B227 , evacuating the transfer head 303 .

[0102] Optionally, the transfer head 303 is evacuated at a set speed, wherein the set speed is greater than 18 mm / s and less than 20 mm / s. For example, the set speed may be 18 mm / s, 19 mm / s, or 20 mm / s.

[0103] It is understood that due to the pre-curing of the adhesive layer 302, the adhesive layer 302 is not fully cured, which can easily cause stringing and burrs if the speed is set too fast. If the speed is set too slow, the adhesive layer 302 dries on the transfer head 303, resulting in an incomplete encapsulation layer 200. Therefore, the above-mentioned speed setting can reduce or avoid the occurrence of these problems, resulting in a higher-quality encapsulation layer 200. The process then proceeds to step B228.

[0104] Step B228 , curing the adhesive layer 302 on the side surface to form the encapsulation layer 200 .

[0105] The adhesive layer 302 is completely cured by ultraviolet light to form the encapsulation layer 200 .

[0106] The thickness of the encapsulation layer 200 formed in one transfer process is between 1 and 100 micrometers, for example, 1 micrometer, 2 micrometers, 3 micrometers, 5 micrometers, 10 micrometers, 50 micrometers, 80 micrometers or 100 micrometers.

[0107] This completes the process of the primary transfer process.

[0108] If the thickness of the encapsulation layer 200 formed by a single transfer process cannot meet the preset requirement, a multi-layer encapsulation layer 200 may be formed by a multiple transfer process.

[0109] Optionally, a multiple transfer process is used in step B2.

[0110] In step B22, the set pressure of the odd-numbered transfer process is a first set pressure, and the encapsulation layer is a first encapsulation layer with a first thickness; the set pressure of the even-numbered transfer process is a second set pressure, and the encapsulation layer is a second encapsulation layer with a second thickness;

[0111] The first set pressure is greater than the second set pressure, and the first thickness is less than the second thickness.

[0112] During the transfer process, the set pressure of the transfer head 303 determines the thickness and coverage length of the encapsulation layer 200. Therefore, alternating between the first and second set pressures to form the encapsulation layer 200 complements each other. Specifically, the high first set pressure ensures the coverage length of the encapsulation layer 200, ensuring that the encapsulation layer 200 fully covers one side of the display panel 100, while the low second set pressure fills any gaps in the encapsulation layer 200 formed by the first set pressure.

[0113] Optional, please refer to Figure 5 In the first embodiment, the packaging method further includes step B3:

[0114] The display panel 100 is rotated, and step B2 is repeated until the encapsulation layer 200 is formed on all four sides of the display panel 100 .

[0115] In step B3 , the display panel 100 may be placed on a carrier zt. The carrier zt is provided with a plurality of vacuum adsorption holes for adsorbing and fixing the display panel 100 .

[0116] After the encapsulation layer 200 is formed on one side of the display panel 100, the carrier zt can be rotated, and the display panel 100 can also rotate with the carrier, so that another side of the display panel 100 faces the transfer station, and then the transfer process is performed again to form the encapsulation layer 200; this cycle is repeated until the encapsulation layer 200 is formed on all four sides of the display panel 100.

[0117] This completes the packaging process of the display panel of the first embodiment.

[0118] The display panel packaging method of the second embodiment differs from that of the first embodiment in that the second embodiment adopts a dip coating process, that is, at least one dip coating process is adopted in step B2.

[0119] Please refer to Figure 6 , the step B2 comprises the following steps:

[0120] Step B2a1: providing a protective layer on the front and back surfaces of the display panel.

[0121] The protective layer is provided on the front and back of the display panel to prevent the encapsulation material from covering the front and back of the display panel. It is understood that the front of the display panel is the light-emitting surface. Then, the process proceeds to step B2a2.

[0122] Step B2a2: immersing the side surface of the display panel in a solution containing an encapsulation material, wherein the encapsulation material covers the side surface to form a material layer.

[0123] Optionally, the packaging material may include one of fluorine nanoparticles, acrylates, silicones and polyurethanes.

[0124] Step B2a3: lift the display panel and solidify the material layer to form the encapsulation layer.

[0125] Optionally, the material layer may be cured by heating to form the encapsulation layer. The heating temperature may be between 100 degrees Celsius and 150 degrees Celsius, for example, 100 degrees Celsius, 120 degrees Celsius, 130 degrees Celsius, 140 degrees Celsius, or 150 degrees Celsius.

[0126] In some embodiments, the material layer may be cured by standing at room temperature to form the encapsulation layer.

[0127] Step B2a4, removing the protective layer.

[0128] In one dip coating process, the thickness of the encapsulation layer is greater than or equal to 1 micron and less than or equal to 5 microns, such as 1 micron, 2 microns, 3 microns, 4 microns or 5 microns.

[0129] This completes the packaging process of the second embodiment.

[0130] Please refer to Figure 7 The display panel packaging method of the third embodiment differs from that of the first embodiment in that the third embodiment adopts a roller coating process. The step B2 adopts at least one roller coating process, and the step B2 includes the following steps:

[0131] Step B2b1: providing a protective layer on the front and back surfaces of the display panel.

[0132] The protective layer is provided on the front and back of the display panel to prevent the encapsulation material from covering the front and back of the display panel. It is understood that the front of the display panel is the light-emitting surface. Then proceed to step B2b2.

[0133] Step B2b2: spraying packaging material on the side of the display panel to form a material layer.

[0134] Optionally, the packaging material may include one of fluorine nanoparticles, acrylates, silicones and polyurethanes.

[0135] Step B2b3: solidifying the material layer to form an encapsulation layer.

[0136] Optionally, the material layer may be cured by heating to form the encapsulation layer. The heating temperature may be between 100 degrees Celsius and 150 degrees Celsius, for example, 100 degrees Celsius, 120 degrees Celsius, 130 degrees Celsius, 140 degrees Celsius, or 150 degrees Celsius.

[0137] In some embodiments, the material layer may be cured by standing at room temperature to form the encapsulation layer.

[0138] Step B2b4, removing the protective layer.

[0139] In one roll coating process, the thickness of the encapsulation layer is greater than or equal to 1 micron and less than or equal to 10 microns, such as 1 micron, 2 microns, 3 microns, 4 microns, 5 microns, 6 microns, 7 microns, 8 microns, 9 microns or 10 microns.

[0140] This completes the packaging process of the third embodiment.

[0141] Please refer to Figure 8 The packaging method of the display panel of the fourth embodiment is different from that of the first embodiment in that the second embodiment adopts a dispensing process. Step B2 adopts at least one dispensing process, and the step B2 includes the following steps:

[0142] Step B2c1, fixing the display panel.

[0143] Step B2c2: Use a dispensing machine to apply the packaging material on the side of the display panel to form a material layer.

[0144] Optionally, the packaging material may include one of fluorine nanoparticles, acrylates, silicones and polyurethanes.

[0145] Step B2c3: solidifying the material layer to form an encapsulation layer.

[0146] Optionally, the material layer may be cured by heating to form the encapsulation layer. The heating temperature may be between 100 degrees Celsius and 150 degrees Celsius, for example, 100 degrees Celsius, 120 degrees Celsius, 130 degrees Celsius, 140 degrees Celsius, or 150 degrees Celsius.

[0147] In some embodiments, the material layer may be cured by standing at room temperature to form the encapsulation layer.

[0148] In one dispensing process, the thickness of the encapsulation layer is greater than or equal to 1 micron and less than or equal to 10 microns, such as 1 micron, 2 microns, 3 microns, 4 microns, 5 microns, 6 microns, 7 microns, 8 microns, 9 microns or 10 microns.

[0149] This completes the packaging process of the third embodiment.

[0150] The above is a detailed introduction to a display panel packaging method provided in an embodiment of the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea. At the same time, for technical personnel in this field, based on the ideas of the present application, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A method for packaging a display panel, characterized in that: include: Step B1, providing a display panel; Step B2: forming an encapsulation layer on the side of the display panel using a transfer process, wherein the thickness of the encapsulation layer is greater than 1 micron and less than or equal to 100 microns; At least one transfer process is used in step B2, and step B2 includes the following steps: Step B21, forming a patterned adhesive layer on the template; Step B22, removing the adhesive layer from the template using a transfer head, and transferring it to the side of the display panel to form an encapsulation layer; The step B22 includes the following steps: Step B221, using a flexible transfer head to abut against the template, so that the transfer head prints the adhesive layer, and the adhesive force between the adhesive layer and the transfer head is greater than the adhesive force between the adhesive layer and the template; Step B222, the transfer head is separated from the template, so that the adhesive layer is attached to the transfer head; Step B223, leaving the transfer head to stand to volatilize the diluent; Step B224, moving the transfer head to one side of the display panel; Step B225 , the transfer head transfers the adhesive layer to the side surface using a set pressure; Step B226, pre-curing the adhesive layer to adhere the adhesive layer to the side surface; Step B227, evacuating the transfer head; Step B228: solidify the adhesive layer on the side surface to form an encapsulation layer.

2. The method for packaging a display panel according to claim 1, wherein: The template is provided with a groove, and the step B21 includes the following steps: Applying glue material on the template, so that the glue material fills the groove to form a glue layer; The glue material outside the groove is removed.

3. The method for packaging a display panel according to claim 1, wherein: There is a set time length from step B222 to completing step B224, and the set time length is greater than or equal to 5 seconds and less than or equal to 15 seconds.

4. The method for packaging a display panel according to claim 3, wherein: In the set time period, the time period for which the transfer head is stationary is greater than the time period for which the transfer head is moved.

5. The method for packaging a display panel according to claim 3, wherein: In step B227, the transfer head is evacuated at a set speed, where the set speed is greater than or equal to 18 mm / s and less than or equal to 20 mm / s.

6. The method for packaging a display panel according to claim 1, wherein: In step B2, a multiple transfer process is used; In step B22, the set pressure of the odd-numbered transfer process is a first set pressure, and the encapsulation layer is a first encapsulation layer with a first thickness; the set pressure of the even-numbered transfer process is a second set pressure, and the encapsulation layer is a second encapsulation layer with a second thickness; The first set pressure is greater than the second set pressure, and the first thickness is less than the second thickness.

7. The method for packaging a display panel according to any one of claims 2 to 6, wherein: The packaging method further comprises step B3: The display panel is rotated, and step B2 is repeated until the encapsulation layer is formed on all four sides of the display panel.

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