Detection structure for optoelectronic module, optical power detection system and method

Abstract

The application relates to a detection structure for optoelectronic modules, an optical power detection system and a method, wherein the detection structure is applied to one or more optoelectronic modules, each of which comprises one or more lasers. The detection structure comprises a connecting plate, one or more power supply lines for supplying power to each laser in the corresponding module, one or more communication lines for obtaining a corresponding control signal and one or more drive control circuits, the module is connected to the connecting plate, and the power supply line, the communication line and the drive control circuit are arranged on the connecting plate. Each drive control circuit is connected to the corresponding communication line, power supply line and each laser in the module, respectively, to convert the power supply into a current according to the control signal, and output the converted drive current to the corresponding laser in the corresponding module to make it emit a test optical signal. The scheme is simple in structure, accurate in detection result and high in detection efficiency.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of optical communication technology, and more particularly, to a detection structure for an optoelectronic module, an optical power detection system for an optoelectronic module, and an optical power detection method. BACKGROUND

[0002] Currently, optical power detection of a laser is required in some application scenarios, so that corresponding operations can be performed based on the detection results. For example, in an active AOC scenario, aging treatment of the laser is required, and through the aging treatment, early failure of the laser can be screened out, so as to achieve the purpose of improving product reliability. One of the screening methods is to detect the change of optical power of the laser before and after aging, and to determine whether the laser is failed based on the change. Currently, optical power detection of the laser can be performed at different stages of the laser, for example, after the semi-finished product is coupled with a lens and other optical components, at the wafer stage, and after the laser is packaged into a semi-finished IC.

[0003] When optical power detection is performed after the semi-finished product is coupled with the lens and other optical components, since the optical components themselves have tolerances, the optical power detection using the optical components is easily affected by the coupling accuracy, so that the optical fiber cannot accurately receive the optical signal emitted by the laser, and thus the optical power detection result is inaccurate. In addition, the installation error of the optical components and the device for fixing the optical fiber at this stage, and the error caused by the wear of the device for fixing the optical fiber caused by multiple uses, also cause the above-mentioned problem of inaccurate detection result. The error of the detection result will inevitably lead to inaccurate detection result of the failure of the laser, and thus misjudgment.

[0004] In addition, the structure of the above-mentioned detection device is complex, so that the cost is high. Further, since the optical fiber needs to be coupled for each laser when optical power detection is performed, the testing process is relatively complicated, and thus the efficiency is low when a large number of lasers are subjected to optical power detection.

[0005] When optical power detection is performed at the wafer stage, the detection device needs to occupy a large area of the wafer, which will inevitably reduce the yield of the laser, and thus increase the production cost of the laser. In order to solve this problem, currently, the optical power detection is usually performed by sampling inspection, but this method obviously cannot guarantee that all lasers are long-term stable and qualified.

[0006] In addition, when the laser is packaged into a semi-finished IC, since the TO packaging structure formed has a large size, the cable and the like which currently pursue miniaturization of AOC cannot be applied, and thus the testing cannot be performed. SUMMARY

[0007] At least in view of the defects in the prior art, the embodiments of the present application provide a detection structure for an optoelectronic module, an optical power detection system for an optoelectronic module, and an optical power detection method.

[0008] In a first aspect, the present application provides a detection structure for an optoelectronic module, which is applied to one or more optoelectronic modules, and each of the optoelectronic modules includes one or more lasers; the detection structure includes: a connection plate, one or more modules are connected on the connection plate; one or more power supply lines are arranged on the connection plate and each of the power supply lines is used to provide power supply for each laser in the corresponding module through an external power supply; one or more communication lines are arranged on the connection plate and each of the communication lines is used to obtain a corresponding control signal from an external control device; and one or more drive control circuits are arranged on the connection plate and each of the drive control circuits is electrically connected with the corresponding communication line, the corresponding power supply line, and each laser in the corresponding module, respectively, to: obtain the control signal from the corresponding communication line; obtain the power supply from the corresponding power supply line; and convert the power supply into a drive current according to the control signal, and output the drive current generated by the conversion to the corresponding laser in the corresponding module, so that the laser emits a test optical signal for optical power detection according to the drive current.

[0009] In an embodiment, the drive control circuit includes: an MCU electrically connected with the corresponding communication line to obtain the control signal from the communication line; and a driver electrically connected with the MCU, the corresponding power supply line, and each laser in the corresponding module, respectively, to: obtain the control signal from the MCU; obtain the power supply from the corresponding power supply line; and convert the power supply into a drive current according to the control signal, and output the drive current generated by the conversion to the corresponding laser in the corresponding module, so that the laser emits the test optical signal according to the drive current.

[0010] In an embodiment, the connection plate is provided with one or more single plates, each of the modules and the corresponding drive control circuit is arranged on the corresponding single plate, and the connection plate is further provided with: one or more slots, wherein one or more slots are arranged on one side or more sides of each single plate, so that the power supply line and the communication line connected with the drive control circuit on the single plate pass through the slots.

[0011] In an embodiment, the slot is an elliptical slot.

[0012] In an embodiment, the slot is arranged on the surface or inside of the connection plate.

[0013] In one embodiment, the connecting plate is further provided with a plurality of cutting lines, each single board is provided with at least one cutting line on each side, and the cutting line is arranged on the surface of the connecting plate for separating the single board from the connecting plate through the cutting line, wherein the distance between the lowest end of the slot hole and the surface of the connecting plate is greater than the distance between the lowest end of the cutting line and the surface of the connecting plate.

[0014] In one embodiment, for the slot hole and the cutting line arranged on the same side of the single board, the vertical distance between the center of the slot hole and the center line of the single board is greater than the vertical distance between the cutting line and the center line of the single board, wherein the center of the slot hole is the center of the slot hole in the direction perpendicular to the cutting line, and the center line of the single board is the center line of the single board in the direction perpendicular to the cutting line.

[0015] In a second aspect, the present application further provides an optical power detection system for an optoelectronic module, comprising: one or more detection structures according to any of the preceding embodiments; and an optical power detector comprising a light-sensitive surface and configured to: receive a test optical signal emitted by a corresponding laser in one or more modules through the light-sensitive surface; and detect the optical power of the laser according to the test optical signal.

[0016] In one embodiment, the optical power detection system further comprises: a power supply electrically connected to the one or more power supply lines and configured to supply power to the laser in the corresponding module through the corresponding power supply line; and a controller electrically connected to the one or more communication lines and configured to transmit a control signal to the one or more communication lines.

[0017] In a third aspect, the present application further provides an optical power detection method applied to the optical power detection system of the preceding embodiments. The optical power detection method comprises: receiving a test optical signal emitted by a corresponding laser in one or more modules through the light-sensitive surface of the optical power detector; and detecting the optical power of the corresponding laser according to the test optical signal.

[0018] Based on the above description of the present application, those skilled in the art can understand that the present application can detect early without coupling the optical assembly, and thus the detection structure is simple in structure and low in cost. In addition, the detection structure of the present application does not need to occupy the area of the wafer for producing the laser, and thus the production cost of the laser can be reduced. Furthermore, the present application can directly receive (generally in a wireless receiving mode) the test light signal emitted by the laser through the light power detector whose light sensitive surface area is much larger than the light emitting surface area of the light emitting element of the laser, and thus the test light signal can be accurately received, and thus the accuracy of the light power detection result can be ensured, and thus the accuracy of the detection result such as the failure detection of the laser can be ensured. In addition, the present application only needs to control the driving current of the laser in the module, and then the light power detection can be performed by receiving the test light signal emitted by the laser through the light power detector, and thus the efficiency of the light power detection is improved compared with the prior art. BRIEF DESCRIPTION OF DRAWINGS

[0019] The above and other objects, features and advantages of the present application will become more apparent from the following detailed description read in conjunction with the accompanying drawings. In the drawings, several embodiments of the present application are illustrated by way of example and not limitation in which like reference numerals refer to like elements throughout:

[0020] Figure 1 is a schematic diagram of a prior art light power detection system;

[0021] Figure 2 is a schematic diagram of a detection structure for an optoelectronic module according to an embodiment of the present application;

[0022] Figure 3 is a schematic diagram of the connection relationship between the driving control circuit, the power supply circuit, the communication circuit and the laser in the module according to an embodiment of the present application;

[0023] Figure 4 is a schematic diagram of the connection relationship between the driving control circuit, the power supply circuit, the communication circuit and the laser in the module according to another embodiment of the present application;

[0024] Figure 5 is Figure 2 is a side view of the connection plate in

[0025] Figure 6 is a schematic diagram of a light power detection system according to an embodiment of the present application;

[0026] Figure 7 is a schematic diagram of a light power detection system according to another embodiment of the present application;

[0027] Figure 8 This is a schematic flowchart of an optical power detection method provided in an embodiment of the present invention. Detailed Implementation

[0028] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0029] As mentioned in the background section, existing technologies allow for optical power detection after the laser has coupled optical components such as the lens. Figure 1 The image shows an optical power detection system 100 used in this stage. For example... Figure 1 As shown, the optical power detection system 100 can convert the optical signal output by the laser 101 into parallel light through the lens 102 and the reflective surface 103 in the optical component, and then couple the optical signal to the input end of the optical fiber 105 (such as a tapered optical fiber). The output end of the optical fiber 105 is connected to an optical modulator (not shown in the figure), so that the continuous light output by the optical fiber 105 can be converted into optical pulses with different frequencies.

[0030] In this system, each optical modulator is connected to a multiplexer (not shown in the figure) via a pigtail, which mixes optical pulses of different frequencies. The pigtail is connected to an optical power meter (not shown in the figure), which converts the mixed optical pulses into electrical pulses. The electrical pulses of different frequencies are then split into multi-channel pulse outputs and demodulated, allowing for the simultaneous acquisition of optical power test data from a dozen or dozens of lasers.

[0031] As described in the background section, tolerances in the optical components themselves and installation errors during coupling can prevent the optical fiber from accurately receiving the light signal emitted by the laser, leading to inaccurate detection results. Furthermore, the area difference between the lens 102 and the cross-sectional area of ​​the optical fiber 105 is relatively small (lens 102 diameter is approximately 127µm, and optical fiber 105 cross-sectional diameter is approximately 50µm). Therefore, when the aforementioned errors occur, the optical fiber 105 often fails to accurately receive the light signal emitted by the laser 101, resulting in inaccurate optical power detection results (generally producing an error exceeding 5%). Inaccurate detection results lead to inaccurate failure detection of the laser 101, and consequently, misjudgment.

[0032] In addition, the optical power detection system 100 has a complex structure, and thus has a high cost. Further, since the optical fiber 105 needs to be coupled to each laser 101 when the optical power is detected, the testing process is tedious and inefficient.

[0033] When the optical power is detected at the wafer stage, the positive and negative electrodes of each laser on the wafer need to be connected by a thin probe, which makes the detection cost relatively high and the process complex. In addition, this testing method also needs to use multiple positive and negative lead wires to connect the positive and negative electrodes of the laser with the probe, which requires a large space on the wafer for wiring, and these wirings greatly occupy the area of the wafer, thereby reducing the yield of the laser and increasing the production cost of the laser.

[0034] Therefore, the embodiments of the present application provide a detection structure for an optoelectronic module, an optical power detection system for an optoelectronic module, and an optical power detection method. The scheme has a simple structure and a low cost because the driving control circuit for emitting a test optical signal, the communication line, and the power supply line are arranged on the connection board where the laser is located, so that early detection can be performed without coupling the optical assembly. In addition, the optical power detector can accurately receive the test optical signal emitted by the laser, thereby ensuring the accuracy of the optical power detection result and the accuracy of the detection result such as laser failure detection. Further, the scheme only needs to control the driving current of the laser in the optoelectronic module, and then the optical power detector can receive the test optical signal emitted by the laser to perform optical power detection, thereby improving the efficiency of optical power detection.

[0035] Figure 2 Fig. 1 is a schematic diagram of a detection structure for an optoelectronic module provided by an embodiment of the present application. In an embodiment, the detection structure can be applied to one or more optoelectronic modules, and each module in the optoelectronic module can include one or more lasers. The number of modules can be specifically set according to requirements, for example, 1, 2, or 3, etc. Figure 2 For example, three modules, i.e., modules 202, 203, and 204, are exemplarily shown in Fig. 1. Each module can include, for example, 1, 2, 3, or 4 lasers according to requirements, Figure 2 For example, four lasers are exemplarily shown in each module in Fig. 1. In an embodiment, the laser can be a vertical cavity surface emitting laser (VCSEL).

[0036] As shown in Figure 2 The detection structure 200 can include a connection board 201, one or more power supply lines, one or more communication lines, and one or more drive control circuits.

[0037] In an embodiment, the one or more modules can be connected to the connection board 201. In an implementation scenario, the connection board 201 can be provided with a plurality of notches, and each module can be connected to the connection board through one or more connection positions in the corresponding notch (e.g., the notches 205a, 206a, and 207a in Figure 2 Such a connection relationship can facilitate the separation of the modules from the connection board 201.

[0038] When a plurality of modules are included, the plurality of modules can be distributed on different connection boards, and the different connection boards can be arranged in the form of, for example, one row and multiple columns or one column and multiple rows to form a connection board. For example, when 6 modules are included, two connection boards can be used, and each 3 modules are arranged on one connection board, and the two connection boards are arranged in the form of one column and two rows to form a connection board. It can be understood that the number of modules arranged on each connection board can not be limited to the number listed above, and can be determined according to the size of the module and the connection board. In addition, the number of modules arranged on each connection board can be equal or not equal. Figure 2 The connection board in

[0039] In an embodiment, the one or more power supply lines can be provided on the connection board, and each power supply line is used to provide power supply for each laser in the corresponding module through an external power supply.

[0040] In the embodiment shown in Figure 2 The detection structure 200 can include three power supply lines, each power supply line includes a power supply line and a ground line, and the plurality of power supply lines can share one ground line. Figure 2 The case where three modules use one power supply line is shown in Figure 2 As shown in

[0041] Figure 2The power contact b and the ground contact c in the power supply contact group can be connected to an external power supply providing a second voltage (for example, 3.3V), so that different power supply lines can be connected to different power supply contacts when three modules 202, 203 and 204 require different voltages. For example, when the lasers in the module 202 and the module 203 require a 5V voltage, and the lasers in the module 204 require a 3.3V voltage, the power supply lines corresponding to the module 202 and the module 203 can be connected to the power supply contact a, and the power supply line corresponding to the module 204 can be connected to the power supply contact b.

[0042] In one embodiment, the one or more communication lines described above can be arranged on the connection board and each of the communication lines is configured to obtain a corresponding control signal from an external control device. The communication line can be, for example, a line for transmitting serial port data, and the external control device can include a PC host device, which can be, for example, a computer.

[0043] In Figure 2 In the embodiment shown in FIG. 2, the detection structure 200 can include three communication lines, each of which includes a communication line. Figure 2 The case where three modules use one communication line is shown in FIG. 2. As shown in FIG. 2, the communication line L3 is connected at one end to a communication contact d arranged on one side of the connection board 201, and the communication contact d is connected to an external control device, so that a control signal can be obtained from the external control device and provided to the lasers. Figure 2

[0044] Specifically, the control signal obtained by each communication line can include a plurality of control sub-signals, each of which corresponds to a different laser in the corresponding module, so that the corresponding laser can be controlled. Specifically, the control sub-signals can correspond to the identities of the respective lasers. Still taking the module 202 in FIG. 2 as an example, the control signal can include four control sub-signals corresponding to the identities of the four lasers 2021, 2022, 2023 and 2024 in the module 202, respectively. Figure 2

[0045] In one embodiment, the one or more drive control circuits described above can be arranged on the connection board and each of the drive control circuits is electrically connected to a corresponding communication line, a corresponding power supply line and each laser in a corresponding module, so as to obtain the control signal from the corresponding communication line and obtain power from the corresponding power supply line.

[0046] Figure 2 The connection relationship between the power supply line 301, the communication line 302 corresponding to the module 202 in FIG. 2 and the four lasers 2021, 2022, 2023 and 2024 in the module 202 and the drive control circuit 303 is shown in FIG. 2. Figure 3 Figure 2 ​​​As shown in FIG. 3, the driving control circuit 303 is electrically connected with the communication line 302, the power supply line 301, and the four lasers 2021, 2022, 2023, and 2024 in the module 202, respectively, so that the driving control circuit 303 can obtain the control signals of the module 202, i.e., the control sub-signals of the four lasers, from the communication line 302 and the power supply from the power supply line 301.

[0047] Based on the structure of the power supply line and the communication line described above, the driving control circuit 303 can be electrically connected with the other end of the communication line in the communication line 302 (the other end relative to the communication contact d connected with the communication line) to realize the connection of the driving control circuit 303 with the communication line 302. In addition, the driving control circuit 303 can also be electrically connected with the other end of the power supply line and the ground line in the power supply line 301 (the other end relative to the power supply contact a connected with the power supply line and the other end relative to the ground contact c connected with the ground line) to realize the connection of the driving control circuit 303 with the power supply line 301.

[0048] After obtaining the control signals and the power supply, each driving control circuit can convert the power supply into a driving current according to the control signals and output the driving current generated by the conversion to the corresponding laser in the corresponding module, so that the laser emits a test optical signal for optical power detection according to the driving current.

[0049] In some application scenarios, the current size of the power supply provided by the power supply line is different from the current size required for emitting the test optical signal, for example, the current size of the power supply provided by the power supply line can be greater than the current size required for emitting the test optical signal, so that different sizes of currents can be provided for the lasers in different stages before and after the conversion.

[0050] For example, in the failure detection of the laser, the current required for the laser to emit the test optical signal is smaller than the current during aging. Based on this, the current before the conversion can be used as the current during the aging of the laser, and the power supply after the conversion can be used as the current provided for the laser to perform the optical power detection.

[0051] When the module includes multiple lasers, in order to make different lasers emit test optical signals at different times for detection, the driving control circuit can transmit control sub-signals to different lasers in the module at different times. For example, for the module 202 shown in FIG. 3, the control sub-signal can be transmitted to the laser 2021 at t1, to the laser 2022 at t2, to the laser 2023 at t3, and to the laser 2024 at t4, so that the four lasers can emit test optical signals at different times, and then the optical power detection can be performed one by one. Figure 3

[0052] ​As can be seen from the above description, the scheme can detect early when the laser is not coupled with the optical assembly, and thus the detection structure is simple in structure and low in cost. In addition, the scheme can directly receive (generally in a wireless receiving mode) the test light signal emitted by the laser through the optical power detector (the diameter of the light-sensitive surface is about 10 mm, and the diameter of the light-emitting surface of the laser is about 10 μm), and thus the test light signal can be accurately received, so as to ensure the accuracy of the optical power detection result, and further ensure the accuracy of the detection result such as laser failure detection.

[0053] Further, the scheme only needs to control the driving current of the laser in the module, and then the optical power detector can receive the test light signal emitted thereby to perform optical power detection. Compared with the prior art in which each laser needs to be coupled with an optical assembly, the efficiency of optical power detection is improved. Based on the structure, when the laser is aged, all the lasers can be powered on to emit light signals at the same time, so that aging can be performed at the same time, and thus the efficiency of laser failure detection is improved.

[0054] In addition, the detection structure of the scheme does not need to occupy the area of the wafer for producing the laser, and thus the production cost of the laser can be reduced. Based on the above reasons, optical power detection can be performed on all the lasers, so as to ensure the effectiveness of all the lasers, and thus the reliability of the product can be improved.

[0055] In one embodiment, the driving control circuit can include an MCU and a driver. The MCU can be electrically connected with the corresponding communication line to obtain the control signal from the communication line. Figure 3 The specific structure of the driving control circuit 303 is shown in Figure 4 As shown in Figure 3 As shown in the figure, the MCU 401 included in the driving control circuit 303 can obtain the control signal of the module 202. Specifically, the MCU 401 can be electrically connected with the other end of the communication line in the communication line 302 to realize the connection with the communication line 302.

[0056] Further, to realize the purpose that different lasers in the module 202 emit test light signals at different times, the MCU 401 can transmit control sub-signals to different lasers 2021, 2022, 2023 and 2024 in the module 202 at different times.

[0057] As can be seen from the above description, the scheme can detect early when the laser is not coupled with the optical assembly, and thus the detection structure is simple in structure and low in cost. In addition, the scheme can directly receive (generally in a wireless receiving mode) the test light signal emitted by the laser through the optical power detector (the diameter of the light-sensitive surface is about 10 mm, and the diameter of the light-emitting surface of the laser is about 10 μm), and thus the test light signal can be accurately received, so as to ensure the accuracy of the optical power detection result, and further ensure the accuracy of the detection result such as laser failure detection. Figure 4It can also be seen that the above driver 402 can be electrically connected with the MCU 401, the power supply circuit 301, and the plurality of lasers 2021, 2022, 2023, and 2024 in the module 202, respectively, to obtain the control signal from the MCU 401 and the power supply from the power supply circuit 301. For example, the driver 402 can obtain the control signal of the module 202 from the MCU 401 and the power supply of the module 202 from the power supply circuit 301. Specifically, the driver 402 can be electrically connected with the other ends of the power supply line and the ground line of the power supply circuit 301 to realize the connection with the power supply circuit 301.

[0058] After obtaining the control signal and the power supply, the driver 402 can convert the power supply into a driving current according to the control signal and output the driving current generated by the conversion to the corresponding laser in the corresponding module, so that the laser emits a test optical signal according to the driving current. For example, after receiving the control signal of the module 202, the driver 402 can convert the power supply into a small current according to the control sub-signal corresponding to the identification of each laser 2021, 2022, 2023, and 2024, and output the converted small current to the lasers 2021, 2022, 2023, and 2024 according to the identification of the lasers, so that the lasers emit a test optical signal. The size of the converted driving current can be determined according to the needs of the specific laser, so as to meet the needs of different lasers.

[0059] In an embodiment, one or more single boards can be arranged on the connection board 201, and each module and the corresponding driving control circuit can be arranged on the corresponding single board. Figure 4 In an embodiment, the three modules 202, 203, and 204 and the corresponding driving control circuits in the module 202 can be arranged on the three single boards 205, 206, and 207, respectively. Specifically, the three single boards 205, 206, and 207 can be arranged at the corresponding notches 205a, 206a, and 207a of the connection board 201, and each single board can be connected with the connection board 201 on the left and right sides through smaller connection positions. This kind of connection structure can facilitate the separation of the single board from the connection board.

[0060] In an embodiment, one or more slots can also be arranged on the connection board 201. The slots can be arranged below the cutting lines (to be described later) reserved on both sides of the single board (in the depth direction of the connection board as the reference direction) and have a depth greater than that of the cutting lines. This kind of arrangement makes the lines (power supply lines and communication lines) passing through the cutting lines pass through the slots below without affecting the cutting lines above.

[0061] Alternatively or additionally, one or more slots can be arranged on one side or more sides of each single board according to the wiring needs. For example, in the embodiment shown in FIG. 2, the single board 205 can be arranged on the left side of the connection board 201, and the single board 206 can be arranged on the right side of the connection board 201. Figure 2In the shown embodiment, wiring is required in four directions (up, down, left and right) of each single board, and each slot hole can only allow one line to pass through, so that slot holes can be arranged around each single board. The power line of the power supply line can pass through the two slot holes above the single board and the slot hole on the right side, and finally connect with the drive control circuit in the single board. The ground line of the power supply line can pass through the two slot holes below the single board and the slot hole on the left side, and finally connect with the drive control circuit in the single board. In addition, the communication line of the communication line can pass through the two slot holes below the single board and the other slot hole on the left side, and finally connect with the drive control circuit in the single board.

[0062] The arrangement of the slot holes and the correspondence between the slot holes and the lines will be described below with reference to the single board 205 shown in FIG. 2B. Figure 2 The arrangement of the slot holes and the correspondence between the slot holes and the lines will be described below with reference to the single board 205 shown in FIG. 2B. The power line L1 of the power supply line corresponding to the module 202 passes through the two slot holes Q7 and Q8 above the single board 205 and the slot hole Q9 on the right side, and finally connects with the drive control circuit in the single board 205. The ground line D of the power supply line corresponding to the module 202 passes through the two slot holes Q5 and Q6 below the single board 205 and the slot hole Q1 on the left side, and finally connects with the drive control circuit in the single board 205. In addition, the communication line L3 of the communication line corresponding to the module 202 passes through the two slot holes Q3 and Q4 below the single board 205 and the other slot hole Q2 on the left side, and finally connects with the drive control circuit in the single board 205.

[0063] As can be seen from the figure, since the slot holes are arranged on the left and right sides of the single board 205, the power supply line and the communication line passing through the cutting lines P1 and P2 on both sides of the single board 205 can pass through the slot holes Q1, Q2 and Q9, so as not to affect the cutting lines P1 and P2 above the slot holes Q1, Q2 and Q9.

[0064] Based on different application scenarios, the above-mentioned slot holes can be arranged on the surface or inside of the connecting plate 201, and the slot holes can be, for example, elliptical slot holes. As shown in FIG. 2D, Figure 2 As shown, the center line of the elliptical slot hole and the cutting line form a non-zero angle, so there is enough space below the cutting line for the line to pass through. It can be understood that the shape of the slot hole is not limited to an ellipse, but can also be a rectangle or a circle, etc. In addition, the angle between the center line of the slot hole and the cutting line can be 60°, 80° or 90°, etc. The present embodiment does not limit this.

[0065] As described in the above embodiments, multiple cutting lines can be provided on the connecting plate 201. Specifically, at least one cutting line can be provided on each of at least two sides of each single plate. For example, for Figure 2 In the case where the long side of the single board corresponds to the short side of the connecting plate 201, a cutting line P1 and P2 parallel to or at other preset angles to each of the two long sides of each single board can be provided on both sides. Cutting lines P1 and P2 can penetrate the short side of the connecting plate 201, so that when separating the single board, the single board 205 and the connecting plate portion between the two cutting lines can be separated from the entire connecting plate 201. Besides providing cutting lines on both sides, cutting lines can also be provided at other locations on the connecting plate, such as one cutting line around each of the single board's four sides, with the four cutting lines connected end-to-end to form a closed loop, so that the board within this closed loop can be separated from the connecting plate 201 during separation.

[0066] In one implementation scenario, the aforementioned cutting line can be provided on the surface of the connecting plate 201. In another implementation scenario, the cutting line can be provided only on one side of the connecting plate 201, thereby simplifying the processing technology of the cutting line. Alternatively, it can also be as follows: Figure 2 As shown, a cutting line is set at corresponding positions on the upper and lower sides of the connecting plate 201, such as cutting line 501 and cutting line 502 in the figure, which makes it easier to separate the single board.

[0067] The cross-section of the cutting line can be Figure 5 The V-shape shown makes it easier to separate the veneer and the connecting plate. In addition to this shape, the cross-section of the cutting line can also be rectangular or trapezoidal, with the side wider near the connecting plate surface and the side narrower away from the connecting plate surface.

[0068] To prevent the cutting line and the lines in the slot below it from interfering with each other, the distance from the lowest point of the slot to the surface of the connecting plate 201 is greater than the distance from the lowest point of the cutting line to the surface of the connecting plate 201; that is, the depth of the slot is greater than the depth of the cutting line. For example, when the slot is located on one side of the connecting plate 201, if the depth of the cutting line is 1 / 3 of the thickness of the connecting plate 201, then the depth of the slot below it can be 2 / 3 of the thickness of the connecting plate 201. When the slot is located inside the connecting plate 201, the slot can be located at a distance of 2 / 3 * the thickness of the connecting plate from the surface of the connecting plate 201.

[0069] In order to make the single board more easily separated from the connecting plate 201 when force is applied, but also have a certain connection strength between the two when no force is applied, the total depth of the cutting lines at the same position of the connecting plate 201 should not be too large or too small, and generally can be greater than or equal to 1 / 3 of the thickness of the connecting plate 201 and less than or equal to 2 / 3 of the thickness of the connecting plate 201. For example, when the cutting lines are arranged on only one side of the connecting plate 201, the depth thereof can be 1 / 2 or 2 / 3 of the thickness of the connecting plate 201, etc.; and when the cutting lines are arranged on both sides of the connecting plate 201, the depth of each cutting line on the upper and lower sides of the connecting plate can be 1 / 4 or 1 / 3 of the thickness of the connecting plate 201, etc.

[0070] In order to ensure the separation effect of the single board, the cutting lines are often arranged along the edge of the single board, but in some scenarios, the arrangement position thereof can be deviated. In order to make the wiring under the cutting line not be affected by the arrangement position of the cutting line above (not overlap in the thickness direction of the connecting plate), for the slot hole and the cutting line arranged on the same side of the single board (such as the slot hole Q9 and the cutting line P2 in Figure 5 , the vertical distance between the center of the slot hole and the center line of the single board can be greater than the vertical distance between the cutting line and the center line of the single board (that is, the slot hole deviates from the cutting line as far as possible in the direction away from the single board), wherein the center of the slot hole is the center of the slot hole in the direction perpendicular to the cutting line, and the center line of the single board is the center line of the single board in the direction perpendicular to the cutting line. As shown in the slot hole Q9 and the cutting line P2 in Figure 2 , the center of the slot hole Q9 deviates from the cutting line P2 in the direction away from the single board 205, thereby preventing the wiring under the cutting line P2 from being affected when the cutting line P2 is far away from the single board.

[0071] The detection structure based on the optoelectronic module is described above in combination with multiple embodiments. Those skilled in the art can understand that the detection structure described above can be applied not only to the optoelectronic module, but also to other components to be detected, such as chips, so as to realize the corresponding detection function, which will not be described herein.

[0072] Figure 2 is a schematic diagram of an optical power detection system 600 for an optoelectronic module provided by an embodiment of the present application. The optical power detection system 600 can include one or more detection structures according to the foregoing embodiments and an optical power detector. The number of modules can be specifically set as required, for example, can be 1, 2 or 3, etc., and the number of lasers in each module can be specifically set as required, which is not limited herein. Figure 6 is exemplarily shown as including one module 601, and the module 601 includes 7 lasers 602.

[0073] As shown in Figure 6As shown in the figure, the above-mentioned optical power detector can include a light-sensitive surface 604 and be used to receive the test optical signal emitted by the laser 602 through the light-sensitive surface 604 and detect the optical power of the laser 602 according to the test optical signal. In order to facilitate accurate reception of the test optical signal emitted by the laser 602, thereby ensuring the accuracy of the optical power detection result, the diameter of the light-sensitive surface 604 can be 1000 to 2000 times the diameter of the light-emitting surface of the light-emitting element 603 of the laser 602. For example, when the diameter of the light-emitting surface of the light-emitting element 603 of the laser 602 is 10 μm, the diameter of the light-sensitive surface 604 can be about 10 mm. The accuracy of the optical power detection result can ensure the accuracy of other detection results such as the aging detection of the laser 602.

[0074] In addition, the present scheme only needs to move the optical power detector so that the light-sensitive surface 604 thereof corresponds to the light-emitting element 603 of the laser 602 to receive the accurate optical signal of the corresponding laser, which improves the efficiency of optical power detection relative to the case that each laser needs to be coupled with an optical assembly in the prior art.

[0075] Figure 6 A schematic diagram of an optical power detection system 700 provided by another embodiment of the present application is shown in the figure. As can be seen from the figure, the detection structure includes four connecting plates 701, 702, 703 and 704, and the four connecting plates are arranged in a manner of one column and four rows to form a connecting plate. The optical power detection system 700 can further include a power supply (not shown in the figure) and a controller 707. Among them, the power supply can include two power supplies 705 and 706 providing different voltages (for example, 5V and 3.3V) to provide different voltages for different lasers, and only the case of using the power supply 705 to supply power to each laser is exemplarily shown in the figure. The controller 707 can include a PC host device, for example, a computer.

[0076] In one embodiment, the above-mentioned power supply can be electrically connected with the above-mentioned one or more power supply lines and be used to supply power to the lasers in the corresponding module through the corresponding power supply line. Figure 7 In the embodiment shown in the figure, the power supply 705 is connected with the lasers on the four connecting plates and provides 5V power supply for them.

[0077] In addition, the above-mentioned controller 707 can be electrically connected with one or more communication lines and be used to transmit control signals to the one or more communication lines. Figure 7In the illustrated embodiment, the controller 707 can be electrically connected to the corresponding communication line via its four communication interfaces (communication interface 1, communication interface 2, communication interface 3, and communication interface 4) to transmit control signals. In one implementation scenario, the controller 707 can broadcast control signals unidirectionally to the laser on the module via a single communication line. The laser only receives and executes the control signals sent by the controller 707 and does not respond with a response signal.

[0078] In one implementation, the communication interface circuit between the controller 707 and the interconnecting board can use the CP2102-GM chip, which can convert the USB 2.0 signals transmitted by the controller 707 into serial port signals. When there are many lasers connected to the communication interface, the voltage of the communication interface can be pulled up (e.g., pulled up to 3.3V) using pull-up resistors.

[0079] The aforementioned control signals may include multiple control sub-signals corresponding to each laser on the four interconnecting boards, and each control sub-signal may correspond to the identifier of a laser for corresponding control.

[0080] For the optical power detection system 700 described in this embodiment, the power supply and controller 707 can be connected to the corresponding power contacts, ground contacts and communication contacts on each connecting board through spring probes to establish corresponding connections.

[0081] Figure 7 This is a schematic flowchart of an optical power detection method 800 provided in an embodiment of the present invention. This optical power detection method 800 can be applied to the aforementioned optical power detection system 700.

[0082] like Figure 8 As shown, the optical power detection method 800 may include, in step S801, receiving test optical signals emitted by corresponding lasers in one or more modules through the photosensitive surface of the optical power detector.

[0083] To facilitate accurate reception of the test light signal emitted by the laser, the diameter of the photosensitive surface can be 1000 to 2000 times the diameter of the laser's light-emitting element. For example, when the diameter of the light-emitting surface of the laser's light-emitting element is 10 μm, the diameter of the photosensitive surface can be approximately 10 mm.

[0084] Upon receiving the test optical signal, in step S802, the optical power detection method 800 detects the optical power of the corresponding laser based on the test optical signal. Specifically, existing methods can be used to detect the optical power of the laser.

[0085] As can be seen from the aforementioned description of the optical power detection system, the optical power detector of this solution can accurately receive the test light signal emitted by the laser, thereby ensuring the accuracy of the optical power detection results. The accuracy of the optical power detection results can ensure the accuracy of detection results such as laser failure detection.

[0086] In addition, this solution only requires moving the optical power detector so that its photosensitive surface corresponds to the light-emitting element of the laser to receive the accurate optical signal of the corresponding laser. Compared with the existing technology where each laser needs to be coupled with an optical component, this improves the efficiency of optical power detection.

[0087] The following is based on Figure 8 Figure 7 The optical power detection system 700 shown is used as an example to further illustrate the optical power detection method. When performing optical power detection, all lasers can be powered on first, and after waiting for a preset time (e.g., 300ms), a data frame for optical power detection is sent to the communication interface of each board. After a further preset time (e.g., 30ms), it is preliminarily determined that all lasers on the board have received the data frame and can emit test optical signals.

[0088] Repeat the above steps of sending data frames to the communication interface of each board until a preset number of times (e.g., 10 times) is reached, and finally it is determined that all lasers have received the above data frames.

[0089] Next, the optical power of each laser is detected one by one using the aforementioned optical power detector until all lasers have been tested.

[0090] It should be understood that the terms "first," "second," "third," and "fourth," etc., in the claims, specification, and drawings of this invention are used to distinguish different objects, rather than to describe a specific order. The terms "comprising" and "including" used in the specification and claims of this invention indicate the presence of the described features, integrals, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components, and / or collections thereof.

[0091] It should also be understood that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the invention. As used in this specification and claims, the singular forms “a,” “an,” and “the” are intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term “and / or” as used in this specification and claims refers to any combination and all possible combinations of one or more of the associated listed items, and includes such combinations.

[0092] As used in the specification and claims, the term “if’ can be interpreted as meaning “when” or “upon” or “in response to a determination” or “in response to a detection” depending on the context. Similarly, the phrase “if determined” or “if detected [described condition or event]” can be interpreted as meaning “upon a determination” or “in response to a determination” or “upon a detection of [described condition or event]” or “in response to a detection of [described condition or event]” depending on the context.

[0093] The above embodiments are only used to illustrate the technical solutions of the embodiments of the present application, but not limit the present application; although the embodiments of the present application are described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: still can modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement to part or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A detection structure for optoelectronic modules, which is applied to one or more optoelectronic modules, and each of the optoelectronic modules comprises one or more lasers; characterized in that, The detection structure comprises: a connecting plate, one or more of the modules are connected to the connecting plate; one or more power supply lines are arranged on the connecting plate and each of the power supply lines is used to supply power to each laser in the corresponding module by an external power supply; one or more communication lines are arranged on the connecting plate and each of the communication lines is used to obtain a corresponding control signal from an external control device; and one or more drive control circuits are arranged on the connecting plate and each of the drive control circuits is electrically connected to the corresponding communication line, the corresponding power supply line and each laser in the corresponding module, for: obtaining the control signal from the corresponding communication line; obtaining power from the corresponding power supply line; and converting the power into a drive current according to the control signal and outputting the drive current to the corresponding laser in the corresponding module to make the laser emit a test optical signal for optical power detection according to the drive current; wherein one or more single plates are arranged on the connecting plate, each of the modules and the corresponding drive control circuit is arranged on the corresponding single plate; a plurality of cutting lines are further arranged on the connecting plate, one cutting line is arranged on at least two sides of each single plate, and the cutting lines are arranged on the surface of the connecting plate to separate the single plate from the connecting plate by the cutting lines.

2. The detection structure of claim 1, wherein The drive control circuit comprises: an MCU electrically connected to the corresponding communication line to obtain the control signal from the communication line; and a driver electrically connected to the MCU, the corresponding power supply line and each laser in the corresponding module, for: obtaining the control signal from the MCU; obtaining power from the corresponding power supply line; and converting the power into a drive current according to the control signal and outputting the drive current to the corresponding laser in the corresponding module to make the laser emit the test optical signal according to the drive current.

3. The detection structure of claim 1, wherein, The connecting plate further comprises: one or more slots, wherein one or more slots are arranged on one or more sides of each single plate to allow the power supply line and the communication line connected to the drive control circuit on the single plate to pass through the slots.

4. The detection structure of claim 3, wherein, The slot is an oval slot.

5. The detection structure of claim 3, wherein, The slot is arranged on the surface or inside of the connecting plate.

6. The detection structure according to any one of claims 3-5, wherein, The distance between the lowest end of the slot and the surface of the connecting plate is greater than the distance between the lowest end of the cutting line and the surface of the connecting plate.

7. The detection structure of claim 6, wherein For the slot and the cutting line arranged on the same side of the single plate, the vertical distance between the center of the slot and the center line of the single plate is greater than the vertical distance between the cutting line and the center line of the single plate, wherein the center of the slot is the center of the slot in the direction perpendicular to the cutting line, and the center line of the single plate is the center line of the single plate in the direction perpendicular to the cutting line.

8. A light power detection system for an optoelectronic module, characterized in that, comprises: one or more detection structures according to any one of claims 1-7; and an optical power detector comprising a light-sensitive surface and being used for: receiving, by the light-sensitive surface, a test light signal emitted by a corresponding laser in one or more modules; and detecting, according to the test light signal, the optical power of the laser.

9. The optical power detection system of claim 8, wherein Further comprising: a power supply electrically connected with the one or more power supply lines and configured to supply power to the laser in a corresponding module through a corresponding power supply line; and a controller electrically connected with the one or more communication lines and configured to transmit a control signal to the one or more communication lines.

10. An optical power detection method applied to the optical power detection system according to claim 8 or 9, characterized in that, The optical power detection method comprises: receiving, by the light-sensitive surface of the optical power detector, a test light signal emitted by a corresponding laser in one or more modules; and detecting, according to the test light signal, the optical power of the laser.

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